Filtering device and electronic equipment

Abstract

A filter device (10) and an electronic apparatus, a first filter layer (101) is provided on the outer side of the outer surface of a housing, a second filter layer (102) is provided between the outer surface and the first filter layer (101), the first filter layer (101) and the second filter layer (102) both cover functional holes (203) on the housing, the first filter layer (101) and the second filter layer (102) can filter water entering the functional holes (203), and the first filter layer (101) and the second filter layer (102) can filter water entering the functional holes (203). And impurities such as particulate matters in water are prevented from entering the functional holes (203).

Description

Filter devices and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on May 31, 2022, with application number 202210611368.6 and application name “Filtering device and electronic equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of terminal equipment, and specifically to a filtering device and an electronic device. Background Art

[0003] Electronic devices (such as smartwatches and mobile phones) are often equipped with microphones to collect external sound waves. Specifically, the electronic device also includes a housing and a waterproof membrane. The housing is provided with a functional hole extending therethrough. The microphone is disposed on the housing, facing the functional hole, and the waterproof membrane is provided to block the functional hole. During operation, sound waves pass through the functional hole and the waterproof membrane to be received by the microphone. The waterproof membrane prevents external water from entering through the functional hole, thereby sealing the housing.

[0004] However, in deep water environments, the water pressure is relatively high. At this time, particles in the water can easily damage the waterproof membrane and cause the shell seal to fail.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a filtering device and an electronic device, which aim to solve the problem that particulate matter in water can easily damage the waterproof membrane, causing the shell sealing to fail.

[0007] On the one hand, an embodiment of the present application provides a filtering device for being arranged on an electronic device.

[0008] The electronic device comprises:

[0009] a shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell being provided with a functional hole penetrating the inner surface and the outer surface;

[0010] The filtering device comprises:

[0011] a first filter layer, the first filter layer being located outside the outer surface and covering the functional holes, and having a plurality of first mesh holes spaced apart;

[0012] a second filter layer, the second filter layer being located between the outer surface and the first filter layer, the second filter layer covering the functional holes, and the second filter layer being provided with a plurality of second meshes at intervals;

[0013] In a cross section parallel to the first filter layer, a cross-sectional area of ​​the first mesh is greater than a cross-sectional area of ​​the second mesh.

[0014] In some embodiments that may include the above embodiments, there are multiple second filter layers, and the multiple second filter layers are stacked; along the direction away from the outer surface, in the cross-section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

[0015] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0016] The first bonding layer is provided between the first filter layer and the second filter layer adjacent thereto, and between adjacent second filter layers. The first bonding layer is provided with a first through hole communicating with the functional hole.

[0017] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0018] The first supporting layer is provided between the second filter layer and the outer surface, and the first supporting layer is in contact with the outer surface; the first supporting layer is provided with a second through hole communicating with the functional hole.

[0019] In some embodiments, which may include the above embodiments, the first filter layer is a rigid filter layer.

[0020] In some embodiments that may include the above embodiments, there are two second filter layers, and the two second filter layers are stacked, the first filter layer is located between the two second filter layers, and in the direction away from the outer surface, in the cross-section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

[0021] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0022] The first bonding layer is provided between the first filter layer and the second filter layer, and a first through hole communicating with the functional hole is provided on the first bonding layer.

[0023] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0024] a cover plate, the cover plate covering the outer surface, the first filter layer and the second filter layer being located between the cover plate and the outer surface, and a third through hole communicating with the functional hole being provided on the cover plate;

[0025] The cover plate is connected to the housing.

[0026] In some embodiments that may include the above embodiments, the filtering device further comprises:

[0027] The second bonding layer is provided between the cover plate and the first filter layer, and a fourth through hole communicating with the functional hole is provided on the second bonding layer.

[0028] In some embodiments that may include the above embodiments, a first groove is provided on a surface of the cover plate facing the housing, and at least a portion of the first filter layer is accommodated in the first groove.

[0029] In some embodiments that may include the above embodiments, a second groove is provided on the outer surface, and at least a portion of the second filter layer is accommodated in the second groove.

[0030] In some embodiments that may include the above embodiments, the electronic device further includes a sound module, the sound module is disposed on the inner surface, and the sound module is disposed in the functional hole.

[0031] On the other hand, an embodiment of the present application further provides an electronic device, including:

[0032] a shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell being provided with a functional hole penetrating the inner surface and the outer surface;

[0033] A waterproof component is provided on the functional hole and is used to prevent liquid from passing through the functional hole;

[0034] and, a filtering device as described above.

[0035] In some embodiments that may include the above embodiments, the waterproof component is disposed on the inner surface, and the waterproof component includes:

[0036] A waterproof membrane, a third adhesive layer, a second supporting layer, and a fourth adhesive layer are stacked in a direction away from the inner surface, the third adhesive layer is provided with a fifth through hole, the fourth adhesive layer is provided with a sixth through hole, and the fifth through hole and the sixth through hole are both connected to the functional hole;

[0037] A plurality of first holes are arranged at intervals in an area of ​​the second supporting layer facing the functional hole.

[0038] In some embodiments that may include the above embodiments, the waterproof component further includes a buffer layer, which is arranged on a side of the fourth adhesive layer away from the inner surface, and a seventh through hole connected to the functional hole is provided on the buffer layer.

[0039] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0040] A fifth bonding layer is provided between the waterproof membrane and the inner surface, and an eighth through hole communicating with the functional hole is provided on the fifth bonding layer.

[0041] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0042] a third supporting layer, the third supporting layer being disposed on the inner surface and having an accommodating channel communicating with the functional hole;

[0043] The waterproof membrane is accommodated in the accommodating channel, and the edge of the waterproof membrane is in contact with the side wall of the accommodating channel; a gap is provided between the waterproof membrane and the inner surface.

[0044] In some embodiments, which may include the above embodiments, the second supporting layer is in contact with a surface of the third supporting layer facing away from the inner surface.

[0045] In some embodiments, which may include the above embodiments, the third support layer includes a silicone layer.

[0046] In some embodiments, which may include the above embodiments, the second supporting layer and the third supporting layer are an integral structure.

[0047] In some embodiments that may include the above embodiments, a sealing ring is provided between the third supporting layer and the shell, and the sealing ring is provided around the functional hole.

[0048] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0049] An auxiliary supporting layer is provided between the third supporting layer and the inner surface, and a plurality of second holes are provided at intervals in the area of ​​the auxiliary supporting layer facing the functional hole; the gap is located between the waterproof membrane and the auxiliary supporting layer.

[0050] In some embodiments that may include the above embodiments, the auxiliary supporting layer and the third supporting layer are an integral structure.

[0051] In some embodiments that may include the above embodiments, a sixth bonding layer is provided between the third supporting layer and the second supporting layer, a ninth through hole is provided on the sixth bonding layer, the third bonding layer is located in the ninth through hole, and the third bonding layer is bonded to the hole wall of the ninth through hole.

[0052] In some embodiments that may include the above embodiments, the waterproof assembly further includes:

[0053] A protective layer is provided on the surface of the waterproof membrane facing the inner surface, and a via hole communicating with the functional hole is provided on the protective layer.

[0054] In some embodiments that may include the above embodiments, a first accommodating groove is provided on the inner surface, and the waterproof component is provided in the first accommodating groove.

[0055] In some embodiments that may include the above embodiments, the waterproof component is disposed on the outer surface, and the waterproof component includes:

[0056] A third adhesive layer, a waterproof membrane and a protective layer are stacked in a direction away from the outer surface, the third adhesive layer is provided with a fifth through hole connected to the functional hole, and the protective layer is provided with a via hole facing the functional hole.

[0057] In some embodiments that may include the above embodiments, the waterproof component further includes a second supporting layer, which is arranged between the third adhesive layer and the outer surface, and a plurality of first holes are spaced apart in an area of ​​the second supporting layer facing the functional hole.

[0058] In some embodiments that may include the above embodiments, a second accommodating groove is provided on the outer surface, and the waterproof component is provided in the second accommodating groove.

[0059] In some embodiments that may include the above embodiments, the electronic device further includes a sound module, the sound module is disposed on the inner surface, and the sound module is disposed in the functional hole.

[0060] In the filtering device and electronic device provided in the embodiments of the present application, a first filter layer is arranged outside the outer surface of the housing, and a plurality of first mesh holes are arranged at intervals on the first filter layer. A second filter layer is arranged between the outer surface and the first filter layer, and a plurality of second mesh holes are arranged at intervals on the second filter layer. The first filter layer and the second filter layer both cover the functional holes on the housing. With such an arrangement, the first filter layer and the second filter layer can filter water entering the functional holes to prevent impurities such as particles in the water from entering the functional holes; in deep water environments, impurities such as particles can be prevented from damaging the waterproof membrane, thereby improving the waterproof performance of the electronic device in deep water environments, that is, improving the ability of the electronic device to withstand water pressure and increasing the water depth at which the electronic device can be used. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 is a back view of the smartwatch;

[0062] FIG2 is a schematic structural diagram of a waterproof component in the related art;

[0063] FIG3 is a first structural diagram of an electronic device provided in an embodiment of the present application;

[0064] FIG4 is a first schematic diagram of the connection between the first filter layer and the cover plate in the filter device provided in an embodiment of the present application;

[0065] FIG5 is a partial enlarged view of point A in FIG4 ;

[0066] FIG6 is an exploded view of the first filter layer and the second filter layer in FIG4 ;

[0067] FIG7 is a second structural diagram of an electronic device provided in an embodiment of the present application;

[0068] FIG8 is a second schematic diagram of the connection between the first filter layer and the cover plate in the filter device provided in an embodiment of the present application;

[0069] FIG9 is a partial enlarged view of point B in FIG8 ;

[0070] FIG10 is an exploded view of the first filter layer and the second filter layer in FIG8 ;

[0071] FIG11 is a partial enlarged view of point C in FIG8 ;

[0072] FIG12 is a schematic structural diagram of a housing in an electronic device provided in an embodiment of the present application;

[0073] FIG13 is a schematic structural diagram of a filter device provided in an embodiment of the present application in which a first filter layer is disposed between two second filter layers;

[0074] FIG14 is a third structural diagram of an electronic device provided in an embodiment of the present application;

[0075] FIG15 is a fourth structural diagram of an electronic device provided in an embodiment of the present application;

[0076] FIG16 is a fifth structural diagram of an electronic device provided in an embodiment of the present application;

[0077] FIG17 is a sixth structural diagram of an electronic device provided in an embodiment of the present application;

[0078] FIG18 is a seventh structural diagram of an electronic device provided in an embodiment of the present application;

[0079] FIG19 is a structural schematic diagram eight of the electronic device provided in an embodiment of the present application.

[0080] DESCRIPTION OF REFERENCE NUMERALS 10: Filter device; 101: First filter layer; 102: Second filter layer; 103: First adhesive layer; 104: Second adhesive layer; 105: First support layer; 106: Cover plate; 1011: First mesh hole; 1021: Second mesh hole; 1031: First through hole; 1041: Fourth through hole; 1051: Second through hole; 1061: Third through hole; 1062: First groove; 20: Housing; 201: Inner surface; 202: Outer surface; 203: Functional hole; 204: Glue container; 205: First container; 206: Second groove; 207: Second container; 2011: First housing wall; 2021: Second housing wall; 2051: First tank bottom; 2071: Second tank bottom; 30: Waterproof assembly; 301: Waterproof membrane; 302: Third adhesive layer; 303: Second supporting layer; 304: Fourth adhesive layer; 305: Buffer layer; 306: Fifth adhesive layer; 307: Third supporting layer; 308: Protective layer; 3021: Fifth through hole; 3023: Sixth adhesive layer; 3024: Ninth through hole; 3031: First hole; 3032: Auxiliary supporting layer; 3033: Second hole; 3034: Seventh adhesive layer; 3035: Tenth through hole; 3041: Sixth through hole; 3051: Seventh through hole; 3061: Eighth through hole; 3071: Accommodating channel; 3072: Gap; 3073: Sealing ring; 3074: Annular groove; 3081: Via hole; 40: Sound module; 401: Microphone; 402: Speaker. DETAILED DESCRIPTION

[0081] With the gradual development of terminal device technology, electronic devices such as mobile phones and smart watches have become widely used. To improve the performance of electronic devices, they often require waterproofing. As shown in Figure 1, in related art, a smart watch includes a housing 20, a microphone, and a waterproof component. The housing 20 is provided with a functional hole 203, in which the microphone is located. The waterproof component is used to block the functional hole, thereby allowing sound waves to pass through while preventing water from passing through, thereby achieving a sealed functional hole 203.

[0082] Referring to Figure 2 , the waterproof assembly 30 comprises a stacked waterproof membrane 301, a steel sheet 310, and foam 320. Adhesive layers 330 are provided between the waterproof membrane 301 and the housing 20, between the waterproof membrane 301 and the steel sheet 310, and between the steel sheet 310 and the foam 320 to secure the membrane layers. The steel sheet 310 is provided with multiple holes. Because the waterproof membrane 301 has a microporous structure, sound waves from the outside world can pass through this microporous structure and, in turn, through the holes and functional holes, to be received by the microphone. However, water has a certain surface tension, making it difficult to pass through the microporous structure, thus achieving a seal between the housing 20 and the outside world. When an electronic device is placed in water, the water pressure gradually increases with increasing depth. Impurities such as particulate matter in the water can damage the microporous structure, allowing water to pass through the waterproof membrane 301 and into the housing, causing the housing 20 seal to fail and rendering the electronic device waterproof in deep water.

[0083] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0084] Referring to Figures 1 and 3 , an embodiment of the present application provides a filtering device 10 for use in an electronic device. The filtering device 10 is configured to be mounted on the electronic device. Exemplary electronic devices may include: mobile phones, smart watches (as shown in Figure 1 ), PCs, tablets, VR, AR, headphones, and other terminal devices. This embodiment does not limit the electronic devices.

[0085] The electronic device may include a housing 20, which may be an outer shell of the electronic device. The housing 20 is configured to form a cavity for accommodating devices such as a battery (not shown) and a circuit board (not shown) in the electronic device. The housing 20 has an inner surface 201 and an outer surface 202 that are arranged opposite to each other. It can be understood that the inner surface 201 may be a surface facing the interior of the electronic device (such as the cavity wall of the cavity), and correspondingly, the outer surface 202 is the surface of the housing 20 exposed to the outside. The housing 20 is provided with a functional hole 203 that passes through the inner surface 201 and the outer surface 202. The functional hole 203 may be a balancing hole (such as the functional hole 203 on the left side of Figure 3). The balancing hole can balance the air pressure inside and outside the housing so that the speaker and microphone can work normally.

[0086] Of course, the functional hole 203 can also be a hole for sound waves to pass through (such as the functional hole 203 on the right side of Figure 3). The electronic device also includes a sound module 40, which is arranged on the inner surface 201, that is, the sound module 40 is located in the cavity, and the sound module 40 is arranged in the functional hole 203. Exemplarily, the sound module 40 may include a speaker, and accordingly, the sound module 40 may emit sound waves to the outside of the shell 20 through the functional hole 203; of course, the sound module 40 may also include a microphone, and accordingly, the sound module 40 receives sound waves outside the shell 20 through the functional hole 203 to obtain external sound signals. This embodiment does not limit the sound module 40.

[0087] 3 and 4 , the filter device 10 provided in this embodiment includes a first filter layer 101, which is disposed outside of an outer surface 202 (above in the orientation shown in FIG3 ). The first filter layer 101 has a plurality of first mesh holes (not shown) spaced apart. The first filter layer 101 covers the functional holes 203. In other words, the functional holes 203 are located within the projection of the first filter layer 101 on the outer surface 202. This allows the first filter layer 101 and the first mesh holes therein to filter water entering the functional holes 203, thereby preventing impurities such as particulate matter in the water from entering the functional holes 203.

[0088] 4 and 5 , the filter device 10 further includes a second filter layer 102, which is positioned between the outer surface 202 and the first filter layer 101. The second filter layer 102 has a plurality of second meshes (not shown) spaced apart. The second filter layer 102 covers the functional holes 203. That is, the functional holes 203 are positioned within the projection of the second filter layer 102 on the outer surface 202. This allows the second filter layer 102 and the second meshes thereon to filter water entering the functional holes 203, further preventing impurities such as particles in the water from entering the functional holes 203. Both the first filter layer 101 and the second filter layer 102 can filter water entering the functional holes 203, further preventing impurities such as particles in the water from entering the functional holes 203.

[0089] Referring to Figure 6 , in the above implementation, the cross-sectional area of ​​the first mesh 1011 in a cross section parallel to the first filter layer 101 is larger than the cross-sectional area of ​​the second mesh 1021. In other words, the projected area of ​​the first mesh 1011 on the outer surface 202 is larger than the projected area of ​​the second mesh 1021 on the outer surface 202. With this arrangement, the first filter layer 101 can prevent the passage of larger impurities, while the second filter layer 102 can prevent the passage of smaller impurities. Compared to providing only one filter layer, this can prevent the accumulation of large impurities, thereby preventing clogging of the first and second filter layers 101, 102.

[0090] For example, the cross-sections of the first mesh 1011 and the second mesh 1021 can be regular shapes such as rectangular or circular. Of course, the cross-sections of the first mesh 1011 and the second mesh 1021 can also be irregular shapes. In the embodiment in which the cross-sections of the first mesh 1011 and the second mesh 1021 are circular, the aperture of the first mesh 1011 can be 0.1-0.5 mm, and the thickness of the first filter layer 101 can be 0.1-0.3 mm. Correspondingly, the aperture of the second mesh can be 0.5 μm-100 μm, and the thickness of the second filter layer 102 can be 0.05-0.1 mm. In this way, while ensuring a good filtering effect, the loss of sound waves passing through the first filter layer 101 and the second filter layer 102 is small. In addition, the small thickness of the first filter layer 101 and the second filter layer 102 can improve the structural compactness of the electronic device.

[0091] In this embodiment, the first filter layer 101 can be a rigid filter layer, that is, the first filter layer 101 can be composed of a material with a certain degree of rigidity, such as a steel mesh, a perforated steel sheet, or a perforated plastic plate. Since the first filter layer 101 is the outermost filter layer, such a configuration allows the first filter layer 101 to filter relatively hard and sharp impurities (such as sand, gravel, metal particles, etc.), thereby preventing particulate matter and other impurities from damaging the first filter layer 101. In addition, since the first filter layer 101 has a certain degree of rigidity, it can provide a certain degree of support for the second filter layer 102 and other membrane layers, thereby preventing the second filter layer 102 and other membrane layers from wrinkling. Accordingly, the second filter layer 102 can be a filter layer with a certain degree of flexibility. For example, the second filter layer 102 can include a dustproof net, and the material of the dustproof net can include polyethylene terephthalate (PET), polyetheretherketone (PEEK), etc.

[0092] Continuing with FIG3 , it can be seen from the above that in this embodiment, the electronic device further includes a waterproof component 30 , which is disposed on the housing 20 and blocks the functional hole 203 to achieve sealing of the functional hole 203 . The waterproof component 30 can be disposed on the inner surface 201 of the housing 20 and positioned between the sound module 40 and the inner surface 201 . The waterproof component 30 allows sound waves to pass through while simultaneously preventing water from passing through. Alternatively, the waterproof component 30 can be positioned inside the balancing hole (such as the functional hole 203 on the left side of FIG3 ), in which case the waterproof component 30 allows air to pass through while preventing water from passing through. For example, the waterproof component 30 can include a waterproof breathable membrane having a microporous structure. Air can partially pass through the microporous structure, while water has difficulty passing through the microporous structure due to its own surface tension. This allows the waterproof component 30 to allow sound waves and air to pass through while preventing water from passing through, thereby achieving a seal. The waterproof breathable membrane can be made of expanded polytetrafluoroethylene (e-PTFE), for example. The pore size of the microporous structure in the waterproof breathable membrane can range from 0.05 to 10 μm, for example, 0.085 μm, 0.1 μm, etc. This configuration can enhance the waterproof performance of the waterproof breathable membrane, thereby increasing the water depth at which electronic devices can be used. Of course, the waterproof breathable membrane can also transmit sound waves from one side of the waterproof breathable membrane to the other through its own vibration.

[0093] Referring to Figure 7 , the housing 20 may be provided with two functional holes 203. The corresponding sound module 40 may include a speaker 402 and a microphone 401. The speaker 402 is positioned toward one functional hole 203, and the microphone 401 is positioned toward the other functional hole 203. In other words, the speaker 402 emits sound waves to the outside of the housing 20 through its corresponding functional hole 203, and the microphone 401 receives external sound waves through its corresponding functional hole 203. Accordingly, a waterproof assembly 30 is provided between the speaker 402 and the inner surface 201, and between the microphone 401 and the inner surface 201, to seal the two functional holes 203.

[0094] It can be understood that in the above implementation, the filter device 10 can cover the two functional holes 203, that is, the two functional holes 203 are both located within the projections of the first filter layer 101 and the second filter layer 102 on the outer surface 202. In this way, the water entering the two functional holes 203 can be filtered through the first filter layer 101 and the second filter layer 102.

[0095] Of course, in some implementations, there may be two filter devices 10, one of which is configured to correspond to one functional hole 203, and the other filter device 10 is configured to correspond to another functional hole 203. That is, the first filter layer 101 and the second filter layer 102 in one filter device 10 cover one functional hole 203, and the functional hole 203 is located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202; the first filter layer 101 and the second filter layer 102 in the other filter device 10 cover another functional hole 203, and the functional hole 203 is located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202. In this way, each filter device 10 can filter water that enters its corresponding functional hole 203.

[0096] In the filter device 10 provided in this embodiment, a first filter layer 101 is disposed outside the outer surface 202 of the housing 20. A plurality of first mesh holes 1011 are spaced apart on the first filter layer 101. A second filter layer 102 is disposed between the outer surface 202 and the first filter layer 101. A plurality of second mesh holes 1021 are spaced apart on the second filter layer 102. Both the first filter layer 101 and the second filter layer 102 cover the functional holes 203 in the housing 20. With this arrangement, when the electronic device enters water, the first filter layer 101 and the second filter layer 102 can filter the water entering the functional holes 203, thereby preventing impurities such as particles in the water from entering the functional holes 203. This can prevent impurities such as particles from damaging the waterproof membrane 301, particularly in deep water environments. This improves the waterproof performance of the electronic device in deep water environments, thereby increasing the electronic device's ability to withstand water pressure and extending its usable depth.

[0097] On the other hand, the cross-sectional area of ​​the first mesh 1011 is larger than the cross-sectional area of ​​the second mesh 1021. With this arrangement, the first filter layer 101 can prevent impurities with larger particle sizes from passing through, and the second filter layer 102 can prevent impurities with smaller particle sizes from passing through. Compared with setting up only one filter layer, the accumulation of large particle size impurities can be avoided, thereby avoiding blockage of the filter layer.

[0098] Referring to Figures 8 and 9 , in some embodiments, there may be multiple second filter layers 102, with multiple second filter layers 102 stacked and disposed between the first filter layer 101 and the outer surface 202. In this manner, multiple second filter layers 102 can further enhance the filtering effect on impurities such as particulate matter, thereby further improving the waterproof performance of electronic devices in deep water environments and increasing the depth at which they can be used.

[0099] Referring to Figures 9 and 10, in some implementations, in a cross section parallel to the first filter layer 101 and in a direction away from the outer surface 202 (upward in Figure 10), the cross-sectional area of ​​the second mesh 1021 on each second filter layer 102 gradually increases. In other words, the cross-sectional area of ​​the second mesh 1021 on the second filter layer 102 close to the first filter layer 101 is larger than the cross-sectional area of ​​the second mesh 1021 on the second filter layer 102 away from the first filter layer 101. With this arrangement, larger impurities are retained on the second filter layer 102 close to the first filter layer 101, while smaller impurities are retained on the second filter layer 102 away from the first filter layer 101. This prevents impurities from accumulating on each second filter layer 102, thereby preventing clogging of the second filter layer 102.

[0100] In other implementations, the cross-sectional areas of the second meshes 1021 on each second filter layer 102 may also be the same.

[0101] In this embodiment, the number of second filter layers 102 can be 2, 3, 4, etc., and this embodiment does not impose any restrictions on the number of second filter layers 102. As shown in Figure 9, the number of second filter layers 102 is 2. The second mesh 1021 on the second filter layer 102 closest to the first filter layer 101 can have a pore size of 50 μm, and the corresponding second mesh 1021 on the second filter layer 102 farther from the first filter layer 101 can have a pore size of 25 μm. This ensures a high filtering effect while reducing the loss of sound waves when passing through the filter device 10, thereby improving the acoustic performance of the electronic device. Compared to not having a filter device 10, the electronic device can withstand water pressures up to 1.25 MPa (approximately 12.5 atm), meaning that the electronic device can be used in water depths up to 125 meters.

[0102] 9 , in an implementation in which the filter device 10 includes a plurality of second filter layers 102 stacked, the filter device 10 further includes a first bonding layer 103, which is disposed between the first filter layer 101 and the second filter layer 102 adjacent thereto, as well as between adjacent second filter layers 102. With this arrangement, the first bonding layer 103 can achieve bonding between the first filter layer 101 and the second filter layer 102 adjacent thereto, as well as between adjacent second filter layers 102. Furthermore, the first filter layer 101 can be connected to the second filter layer 102 adjacent thereto, as well as to the adjacent second filter layers 102, via the first bonding layer 103 to form a filter layer assembly, thereby achieving pre-assembly of the filter device 10. The filter layer assembly can then be mounted on the housing 20, facilitating assembly of the electronic device.

[0103] A first through hole 1031 is provided on the first adhesive layer 103, and the first through hole 1031 is used to connect to the functional hole 203; that is, the projection of the first through hole 1031 on the outer surface 202 at least covers a portion of the functional hole 203; so that the first filter layer 101 and the second filter layer 102 corresponding to the first through hole 1031 can filter the water entering the functional hole 203, and the sound waves and the filtered water can enter the functional hole 203 through the first through hole 1031.

[0104] It is understood that the center lines of the first through holes 1031 and the center lines of the functional holes 203 are collinear, and the projections of the first through holes 1031 on the outer surface 202 can completely overlap. In this case, the projections of the first through holes 1031 on the outer surface 202 can partially or completely overlap with the functional holes 203. Of course, the functional holes 203 can also be located within the projections of the first through holes 1031 on the outer surface 202, thereby reducing the loss of sound waves when passing through the filter device 10.

[0105] 8 and 9 , the filter device 10 provided in this embodiment further includes a first support layer 105, which is disposed between the second filter layer 102 and the outer surface 202 (as shown in FIG7 ). The first support layer 105 is in contact with the outer surface 202, and the first support layer 105 is provided with a second through hole 1051 for communicating with the functional hole 203. With this arrangement, the second filter layer 102 near the outer surface 202 can be supported on the outer surface 202 by the first support layer 105, thereby preventing the second filter layer 102 from directly contacting the outer surface 202, thereby preventing the outer surface from squeezing the second filter layer 102 and damaging the second filter layer 102.

[0106] For example, the centerline of the second through hole 1051 can be collinear with the centerline of the first through hole 1031, and the projection of the second through hole 1051 on the outer surface 202 can completely overlap with the projection of the first through hole 1031 on the outer surface 202, or the projection of the second through hole 1051 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202. The first support layer 105 can be a silicone layer, a waterproof adhesive layer, or the first support layer 105 can include a waterproof adhesive layer and a steel sheet stacked in a direction away from the outer surface 202. Accordingly, both the waterproof adhesive layer and the steel sheet have openings connected to the functional holes 203, so as to achieve a seal between the second filter layer 102 and the outer surface while ensuring that the first support layer 105 has a certain support effect.

[0107] Continuing with reference to Figures 7 and 8, in some embodiments, the filter device 10 further includes a cover plate 106, which covers the outer surface 202 of the shell 20, and the first filter layer 101 and the second filter layer 102 are sandwiched between the cover plate 106 and the outer surface 202; that is, the first filter layer 101 and the second filter layer 102 are located between the cover plate 106 and the outer surface 202, and the first filter layer 101 and the second filter layer 102 can be fixed to the shell 20 through the cover plate 106.

[0108] Exemplarily, the cover plate 106 can be bonded to the outer surface 202 of the housing 20 by adhesive, thereby achieving fixation of the cover plate 106. The adhesive can be adhesive, etc., to facilitate the installation of the cover plate 106. Accordingly, an adhesive groove 204 can be provided on the outer surface 202. The adhesive groove 204 can accommodate adhesive to avoid that the distance between the cover plate 106 and the outer surface 202 is too large. Of course, the cover plate 106 can also be connected to the housing 20 in a detachable manner such as a snap connection or a bolt connection, so that the filter device 10 can be removed from the housing 20 during maintenance. In some implementations, while the cover plate 106 is connected to the housing 20 by a bolt connection or a snap connection, an adhesive is also provided between the cover plate 106 and the housing 20 to further improve the sealing performance.

[0109] The cover plate 106 is provided with a third through-hole 1061 for communicating with the functional hole 203. Specifically, the centerline of the third through-hole 1061 can be collinear with the centerline of the functional hole 203, and the functional hole 203 can be located within the projection of the third through-hole 1061 on the outer surface 202. This allows external sound waves and water to pass through the third through-hole 1061 and then into the housing 20 through the functional hole 203, where they can be received by the sound module 40. Alternatively, sound waves emitted by the sound module 40 can pass through the functional hole 203 and then propagate out of the housing 20 through the third through-hole 1061.

[0110] 9 , a second adhesive layer 104 may be disposed between the cover plate 106 and the first filter layer 101. The second adhesive layer 104 may be provided with a fourth through hole 1041 for communicating with the functional hole 203. With this arrangement, the second adhesive layer 104 can secure the filter device 10 to the cover plate 106, thereby pre-installing the filter device 10. Subsequently, the cover plate 106 with the first filter layer 101 and the second filter layer 102 may be mounted on the housing 20 to complete the installation of the filter device 10, simplifying the installation process.

[0111] Exemplarily, the center line of the fourth through hole 1041 can be colinear with the center line of the first through hole 1031, and the projection of the fourth through hole 1041 on the outer surface 202 can completely coincide with the projection of the first through hole 1031 on the outer surface 202; or the projection of the fourth through hole 1041 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202.

[0112] Referring to Figure 11 , in the above implementation, the cover plate 106 may be provided with a first groove 1062 on the surface facing the outer surface 202, and correspondingly, at least a portion of the first filter layer 101 is accommodated in the first groove 1062. This configuration avoids a large distance between the cover plate 106 and the outer surface 202 caused by the first and second filter layers 101 and 102 being sandwiched between the cover plate 106 and the outer surface 202, thereby improving the compactness of the electronic device and reducing its size.

[0113] Illustratively, the first filter layer 101 may be entirely accommodated in the first groove 1062 ; of course, at least a portion of the second filter layer 102 may also be accommodated in the first groove 1062 , to further improve the compactness of the electronic device and reduce the volume of the electronic device.

[0114] Referring to Figure 12 , in this embodiment, a second groove 206 is provided on the outer surface 202, and correspondingly, at least a portion of the second filter layer 102 is accommodated in the second groove 206. This arrangement avoids a large distance between the cover plate 106 and the outer surface 202 caused by the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, thereby improving the compactness of the electronic device and reducing its size.

[0115] For example, when the cover plate 106 covers the outer surface 202, the first filter layer 101 and the second filter layer 102 can both be accommodated within the second groove 206, thereby further improving the compactness of the electronic device and reducing its size. Of course, in an implementation where the first groove 1062 is provided on the surface of the cover plate 106 facing the outer surface 202, a portion of the first filter layer 101 is accommodated within the first groove 1062, and correspondingly, the remaining portion of the first filter layer 101 and the second filter layer 102 are both accommodated within the second groove 206. With this arrangement, the first groove 1062 and the second groove 206 jointly accommodate the filter device 10, thereby preventing the first groove 1062 and the second groove 206 from being too deep.

[0116] Referring to Figure 13 , in an implementation where the first filter layer 101 is a rigid layer and the second filter layer 102 is a dust screen, there are two second filter layers 102, and the two second filter layers 102 are stacked. The first filter layer 101 is positioned between the two second filter layers 102. In a cross-section parallel to the first filter layer 101, the cross-sectional area of ​​the second mesh on each second filter layer 102 gradually increases as it moves away from the outer surface. This arrangement allows the first filter layer 101 to be sandwiched between the two second filter layers 102, thereby preventing exposure of the first filter layer 101 and enhancing the decorative effect of the electronic device. In this case, the cross-sectional area of ​​the first mesh on the first filter layer 101 can be larger than the cross-sectional area of ​​the second mesh on each second filter layer 102.

[0117] 13 , the filter device 10 further includes a first adhesive layer 103 disposed between the first filter layer 101 and the second filter layer 102. The first adhesive layer 103 is provided with a first through hole 1031 communicating with the functional hole 203. The first adhesive layer 103 can connect the first filter layer 101 and each of the second filter layers 102, and can also achieve a seal between the first filter layer 101 and each of the second filter layers 102.

[0118] An embodiment of the present application also provides an electronic device, which may include a mobile phone, a smart watch (as shown in Figure 1), a PC, a tablet computer, VR, AR, headphones, etc. This embodiment does not limit the electronic device.

[0119] As shown in Figure 3, the electronic device includes a housing 20, which can be the outer shell of the electronic device. The housing 20 is arranged to form a cavity for accommodating devices such as batteries and circuit boards in the electronic device. The housing 20 has an inner surface 201 and an outer surface 202 that are arranged relative to each other. It can be understood that the inner surface 201 can be a surface facing the interior of the electronic device (such as the cavity wall of the cavity), and correspondingly, the outer surface 202 is the surface of the housing 20 exposed to the outside. The housing 20 is provided with a functional hole 203 that passes through the inner surface 201 and the outer surface 202. The functional hole 203 can be a balancing hole (such as the functional hole 203 on the left side of Figure 3). The balancing hole can balance the air pressure inside and outside the housing so that the speaker and microphone can work normally. Of course, the functional hole 203 can also be a hole for sound waves to pass through (such as the functional hole 203 on the right side of Figure 3).

[0120] The filter device 10 provided in any of the above embodiments is disposed on the outer surface 202 of the housing 20 to filter water flowing into the functional hole 203 , thereby preventing impurities such as particles from entering the functional hole 203 .

[0121] The electronic device further includes a sound module 40 , which can be a device that emits sound waves, such as a speaker. Of course, the sound module 40 can also be a device that receives sound waves, such as a microphone. This embodiment does not limit the sound module 40 .

[0122] The sound module 40 is disposed on the inner surface 201 and is disposed toward the functional hole 203 so that the sound module 40 can emit sound waves outward through the functional hole 203 or receive sound waves from outside the housing 20 via the functional hole 203 .

[0123] As shown in Figure 3, the electronic device also includes a waterproof component 30, which is arranged on the shell 20. The waterproof component 30 can be arranged corresponding to the sound module 40 to allow sound waves to pass through, while the waterproof component 30 prevents water from passing through; of course, the waterproof component 30 can also be located on the inner side of the balance hole (such as the functional hole 203 on the left side of Figure 3). At this time, the waterproof component 30 allows air to pass through while preventing water from passing through, thereby achieving sealing of the functional hole 203.

[0124] In this embodiment, the waterproof component 30 can be set in a variety of positions and structures, as long as it can allow gas to pass through while preventing water from passing through. The following will introduce the structure and setting position of the waterproof component 30 in different scenarios:

[0125] Scene 1

[0126] As shown in Figure 14, in this scenario, the waterproof component 30 can be provided on the inner surface 201. The corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40. Alternatively, the waterproof component 30 is provided corresponding to the balancing hole to achieve sealing of the functional hole 203. Accordingly, the waterproof component 30 may include: a waterproof membrane 301, a third adhesive layer 302, a second support layer 303, and a fourth adhesive layer 304, which are stacked in a direction away from the inner surface 201. The third adhesive layer 302 is provided with a fifth through hole 3021, and the fourth adhesive layer 304 is provided with a sixth through hole 3041. The fifth through hole 3021 and the sixth through hole 3041 are both provided for connecting to the functional hole 203. That is, the center lines of the fifth through hole 3021 and the sixth through hole 3041 can be collinear with the center line of the functional hole 203, the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201 can completely overlap, and the functional hole 203 can be located within the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201, or the functional hole 203 can completely overlap with the projections of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201. This prevents the third adhesive layer 302 and the fourth adhesive layer 304 from obstructing the propagation of sound waves.

[0127] The waterproof assembly 30 further includes a buffer layer 305, which is disposed on a side of the fourth adhesive layer 304 away from the inner surface 201 and has a seventh through hole 3051 connected to the functional hole 203. The buffer layer 305 supports the entire waterproof assembly 30.

[0128] The waterproof membrane 301 has a microporous structure, which allows some air to pass through, while water, due to its surface tension, is difficult to penetrate. This allows the waterproof component 30 to allow sound waves to pass through while blocking water, thereby achieving a seal. In this case, the corresponding waterproof component 30 is disposed in the balancing hole or in the corresponding sound module 40. The waterproof membrane 301 may be made of expanded polytetrafluoroethylene (ePTFE). The pore size of the microporous structure in the waterproof membrane 301 may range from 0.05 to 10 μm, such as 0.085 μm or 0.1 μm. This allows the waterproof membrane 301 to withstand a water pressure of up to 1.25 MPa and a water depth of up to 125 meters. It also has a certain air permeability and a sound barrier of no more than 5 dB at a sound frequency of 100-10,000 Hz. In the related art, the waterproof component includes a polymer film that has been hydrophobically modified. The film is a dense film, that is, the film does not allow gas to pass through, and the transmission of sound waves on both sides of the film is achieved through its own vibration; the elastic modulus of the film is 2000-8000MPa, and the sound blocking amount is 1.5-6dB at an audio frequency of 100-10000Hz. The surface energy of the film is less than 50mN / m, which enables electronic equipment using the film to withstand water pressures above 1MPa and a water depth of up to 100 meters.

[0129] However, since the film does not allow gas to pass through, when the external air pressure changes, under the action of the internal and external air pressures, it is easy to cause the film to deform (such as bulging or sinking), thereby affecting the transmission of sound waves. In contrast, the waterproof component 30 adopts the waterproof membrane 301 in this embodiment. Since the waterproof membrane 301 has a microporous structure, it can ensure that it can withstand a large water pressure (such as 1.25MPa) while not affecting the transmission of sound waves due to changes in external air pressure. It can be understood that in the implementation of the waterproof component 30 corresponding to the speaker setting, a breathable membrane such as a waterproof membrane 301 with a microporous structure can be used. In the implementation of the waterproof component 30 corresponding to the microphone setting, a waterproof membrane 301 with a microporous structure or a dense membrane can be used. When the waterproof component 30 is used to seal the balance hole, the corresponding waterproof membrane 301 needs to be a breathable membrane such as a waterproof membrane 301 with a microporous structure.

[0130] A plurality of first holes 3031 are spaced apart in the area of ​​the second supporting layer 303 facing the functional hole 203. In other words, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 completely overlaps with the projection of the area on the inner surface 201. During use, air can pass through the second supporting layer 303 through the first holes 3031.

[0131] As shown in Figure 14, the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is set, and the functional hole 203 is located within the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201.

[0132] In the above implementation, the second supporting layer 303 may have a certain rigidity. For example, the material of the second supporting layer 303 may include stainless steel, copper, etc., so that the second supporting layer 303 can better support the waterproof membrane 301.

[0133] Continuing with Figure 14 , the housing 20 is provided with a first receiving groove 205, within which the waterproof assembly 30 is housed. This arrangement improves the compactness of the electronic device, thereby reducing its size. It will be appreciated that the inner surface 201 of the housing 20 comprises a first groove bottom 2051 of the first receiving groove 205 and a portion of the first housing wall 2011 outside the first receiving groove 205.

[0134] Continuing with FIG14 , the waterproof assembly 30 further includes a fifth adhesive layer 306 disposed between the waterproof membrane 301 and the inner surface 201 (i.e., between the waterproof membrane 301 and the first groove bottom 2051). The fifth adhesive layer 306 is provided with an eighth through hole 3061 that communicates with the functional hole 203. The fifth adhesive layer 306 connects the waterproof membrane 301 to the housing 20 and also provides a seal therebetween.

[0135] Exemplarily, the center line of the eighth through hole 3061 can be arranged colinearly with the center line of the fifth through hole 3021, and the projection of the eighth through hole 3061 on the inner surface 201 can completely coincide with the projection of the fifth through hole 3021 on the inner surface 201, so that sound waves can be transmitted to the waterproof membrane 301 after passing through the eighth through hole 3061.

[0136] Continuing with Figure 14 , in this scenario, the buffer layer 305 can be made of materials such as polyurethane foam, silicone, and polyethylene foam adhesive, allowing it to be compressed to a certain degree. During the installation of the waterproof assembly 30, by appropriately compressing the buffer layer 305 (e.g., by approximately 60%), a certain preload can be applied between the membrane layers, improving the sealing between adjacent membrane layers and also the sealing between the waterproof assembly 30 and the housing 20. This, in turn, improves the waterproof performance of the electronic device in deep water environments, namely, its ability to withstand water pressure and increase the depth at which it can be used. For example, if the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are all annular with an outer diameter of 4 mm and an inner diameter of 1.75 mm, when the buffer layer 305 is compressed by 50%, the preload achieved can meet the sealing requirements for a water depth of 50 meters. For a buffer layer 305 made of the same material to meet the sealing requirements for a water depth of 125 meters or more, the buffer layer 305 needs to be compressed by at least 80% to achieve sufficient preload.

[0137] It is understood that excessive pre-stress can easily cause wrinkles in the waterproof membrane 301, affecting acoustic performance; while insufficient pre-stress can easily lead to weak bonding between the adhesive layers, resulting in insufficient sealing. Accordingly, a buffer layer 305 with a relatively flat stress-strain curve can be used to ensure that slight changes in thickness do not lead to significant changes in pre-stress.

[0138] In some implementations, the elastic modulus of the buffer layer 305 can be appropriately increased to reduce the deformation of the buffer layer 305 (eg, compress it by 50%) while obtaining the same preload, so that the deformation of the buffer layer 305 is within the usable range.

[0139] In this scenario, the projected area of ​​the waterproof membrane 301 on the inner surface 201 can be appropriately increased, thereby increasing the projected areas of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201, so as to improve the sealing performance of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306, and thus reduce the pre-pressure on the buffer layer 305 during assembly to avoid damage to the buffer layer 305; in addition, it can also prevent the waterproof membrane 301 from being wrinkled due to excessive force, thereby affecting the transmission of sound waves.

[0140] It is understandable that the waterproof membrane 301 can be in a regular shape, such as a circle, a rectangle, etc.

[0141] Of course, since the shell 20 is generally provided with bolts and other structures, the waterproof membrane 301 can also be an irregular shape to avoid the bolts and other structures; this embodiment does not limit the shape of the waterproof membrane 301. Accordingly, the outer edges of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are flush with the outer edges of the waterproof membrane 301, that is, the projections of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 completely overlap; the projection area of ​​the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 on the inner surface 201 can be 10-40mm 2 (eg: 10mm 2 , 14mm 2 , 20mm 2 , 40mm 2 The bonding width of the third bonding layer 302 (the width between the outer edge of the third bonding layer 302 and the wall of the fifth through hole 3021) must be 1.2-3 mm (e.g., 1.2 mm, 2 mm, 3 mm, etc.). This ensures sufficient bonding strength between the bonding layers to ensure adequate sealing while reducing preload to prevent damage to the buffer layer 305. Furthermore, it prevents the waterproof membrane 301 from wrinkling due to excessive stress, which could affect the transmission of sound waves.

[0142] In this scenario, during assembly, the fifth adhesive layer 306, the waterproof membrane 301, the third adhesive layer 302, the second support layer 303, the fourth adhesive layer 304, and the buffer layer 305 can be sequentially attached to the housing 20 to complete the assembly of the waterproof component 30. Of course, the fourth adhesive layer 304, the second support layer 303, the third adhesive layer 302, the waterproof membrane 301, and the fifth adhesive layer 306 can also be sequentially attached to the buffer layer 305 to form a pre-assembled assembly, and then the entire assembly can be assembled to the housing 20 to complete the assembly of the waterproof component 30, thereby simplifying the assembly of the electronic device.

[0143] Scene 2

[0144] Referring to Figure 15 , in this scenario, the waterproof component 30 can be disposed on the inner surface 201. Accordingly, the waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 can be disposed corresponding to the balancing hole to seal the functional hole 203. Accordingly, the waterproof component 30 may include: a waterproof membrane 301, a third adhesive layer 302, a second support layer 303, a fourth adhesive layer 304, and a buffer layer 305, stacked in a direction away from the inner surface 201. The third adhesive layer 302 is provided with a fifth through hole 3021, the fourth adhesive layer 304 is provided with a sixth through hole 3041, and the buffer layer 305 is provided with a seventh through hole 3051. The fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 are all used to connect to the functional hole 203. That is, the center lines of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 can be collinear with the center line of the functional hole 203, the projections of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 on the inner surface 201 can completely overlap, and the functional hole 203 can be located within the projections of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 on the inner surface 201, or the functional hole 203 can completely overlap with the projections of the fifth through hole 3021, the sixth through hole 3041, and the seventh through hole 3051 on the inner surface 201. This prevents the third adhesive layer 302, the fourth adhesive layer 304, and the buffer layer 305 from obstructing the propagation of sound waves.

[0145] The waterproof membrane 301 may have a microporous structure, through which some air can pass, while water, due to its surface tension, has difficulty passing. This allows the waterproof assembly 30 to allow sound waves to pass while preventing water from passing through, thereby achieving a seal. The waterproof membrane 301 may be made of expanded polytetrafluoroethylene.

[0146] A plurality of first holes 3031 are spaced apart in the area of ​​the second supporting layer 303 facing the functional hole 203. In other words, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 completely overlaps with the projection of the area on the inner surface 201. During use, air can pass through the second supporting layer 303 through the first holes 3031.

[0147] As shown in Figure 15, the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is set, and the functional hole 203 is located within the projections of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201.

[0148] In the above implementation, the second supporting layer 303 may have a certain rigidity. For example, the material of the second supporting layer 303 may include stainless steel, copper, etc., so that the second supporting layer 303 can better support the waterproof membrane 301.

[0149] Referring to Figure 15 , the housing 20 is provided with a first receiving groove 205, within which the waterproof assembly 30 is housed. This arrangement improves the compactness of the electronic device, thereby reducing its size. It will be appreciated that the inner surface 201 of the housing 20 comprises a first bottom 2051 of the first receiving groove 205 and a portion of the first wall 2011 outside the first receiving groove 205.

[0150] Continuing with reference to FIG15 , the waterproof component 30 also includes a third supporting layer 307, which is disposed on the inner surface 201 (i.e., the first groove bottom 2051), and is provided with an accommodating channel 3071 communicating with the functional hole 203; the waterproof membrane 301 is accommodated in the accommodating channel 3071, and the waterproof membrane 301 is in contact with the side wall of the accommodating channel 3071, and a gap 3072 is provided between the waterproof membrane 301 and the inner surface 201 (i.e., the first groove bottom 2051) (constituting a U-shaped cavity structure). In this arrangement, the third supporting layer 307 is supported between the second supporting layer 303 and the shell 20, and there is a gap 3072 between the waterproof membrane 301 and the inner surface (i.e., the first groove bottom 2051). When pre-pressure is applied to the shell 20 through the buffer layer 305 during installation, the pre-pressure acts on the third supporting layer 307, preventing the waterproof membrane 301 from wrinkling due to the pre-pressure, thereby preventing the acoustic performance from being affected by the wrinkles.

[0151] In the above implementation, the second support layer 303 may be in contact with the surface of the third support layer 307 facing away from the inner surface 201. In other words, the second support layer 303 contacts the surface of the third support layer 307 facing away from the first groove bottom 2051. Accordingly, the third support layer 307 may include a silicone layer. This configuration ensures a certain degree of support while also achieving a seal between the second support layer 303 and the housing 20. The electronic device can withstand water pressures up to 1 MPa (approximately 10 atm), meaning it can be used in water depths up to 100 meters. Of course, the third support layer 307 may also be another rubber layer.

[0152] 15 , during assembly, the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302, the waterproof membrane 301, and the fifth adhesive layer 306 can be sequentially attached to the buffer layer 305, and then the third supporting layer 307 can be attached to the second supporting layer 303 to form a pre-assembled assembly. The assembly can then be assembled onto the housing 20 to complete the assembly of the waterproof assembly 30, thereby simplifying the assembly of the electronic device. Of course, the fourth adhesive layer 304, the second supporting layer 303, the third adhesive layer 302, and the third supporting layer 307 can also be sequentially attached to the buffer layer 305, and then the waterproof membrane 301 and the fifth adhesive layer 306 can be sequentially attached to the second supporting layer 303 to form a pre-assembled assembly, and then the assembly can be assembled onto the housing 20.

[0153] Continuing with reference to FIG15 , the third adhesive layer 302 can be a waterproof adhesive backing. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051 , during assembly, only the third adhesive layer 302 needs to be activated. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second support layer 303.

[0154] Please refer to Figure 16. In other implementations, the third support layer 307 and the second support layer 303 can be an integrated structure. In this way, the integrated structure formed by stamping, injection molding and other processes simplifies the structure of the waterproof component 30 and facilitates the assembly of the waterproof component 30.

[0155] Continuing with FIG16 , a sealing ring (O-ring) 3073 is provided between the third supporting layer 307 and the housing 20. The sealing ring 3073 is provided around the functional hole 203, that is, the sealing ring 3073 surrounds the outside of the functional hole 203. This arrangement can improve the sealing between the third supporting layer 307 and the housing 20, thereby improving the waterproof performance of the electronic device in deep water environments, that is, improving the electronic device's ability to withstand water pressure and increasing the water depth at which the electronic device can be used. For example, using the waterproof assembly 30 shown in FIG16 , the electronic device can withstand a water pressure of up to 1 MPa (approximately 10 atm), that is, the electronic device can be used in water at a depth of up to 100 meters.

[0156] It is understood that an annular groove 3074 may be provided on the inner surface 201 (i.e., the first groove bottom 2051), the sealing ring 3073 may be disposed within the annular groove 3074, and a portion of the sealing ring 3073 may extend outside the annular groove 3074, so that the end of the third supporting layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051) contacts the sealing ring 3073 located outside the annular groove 3074. Of course, annular grooves 3074 may also be provided on both the inner surface 201 and the end of the third supporting layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051), and accordingly, a portion of the sealing ring 3073 may be located within the annular groove 3074 on the inner surface 201 (i.e., the first groove bottom 2051), while the remaining portion of the sealing ring 3073 may be located within the annular groove 3074 on the third supporting layer 307.

[0157] Continuing with reference to FIG16 , during assembly, the fourth adhesive layer 304 and the second supporting layer 303 can be attached to the buffer layer 305 in sequence, and then the third adhesive layer 302 and the waterproof membrane 301 can be attached to the second supporting layer 303 in sequence to form a pre-installed component. The component is then assembled as a whole to the housing 20, simplifying the difficulty of assembling the electronic device.

[0158] Continuing with reference to FIG16 , the third adhesive layer 302 can be a waterproof adhesive backing. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051 , during assembly, only the third adhesive layer 302 needs to be activated. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second support layer 303.

[0159] Referring to Figure 17 , the waterproof assembly 30 in this scenario may also include an auxiliary support layer 3032, disposed between the third support layer 307 and the housing 20 (i.e., the first groove bottom 2051). The auxiliary support layer 3032 is provided with a plurality of second holes 3033 spaced apart in the area facing the functional hole 203, allowing sound waves to pass through the auxiliary support layer 3032 via the second holes 3033. This arrangement sandwiches the waterproof membrane 301 between the second support layer 303 and the auxiliary support layer 3032, thereby enhancing support for the waterproof membrane 301.

[0160] Accordingly, the gap 3072 is located between the waterproof membrane 301 and the auxiliary supporting layer 3032 to prevent the waterproof membrane 301 from contacting the auxiliary supporting layer 3032 , thereby preventing the waterproof membrane 301 from being wrinkled due to stress.

[0161] It can be understood that the functional hole 203 can be located within the projection of the area where the second hole 3033 is set on the shell 20, or the functional hole 203 completely overlaps with the projection of the area where the second hole 3033 is set on the shell 20, so that the area where the second hole 3033 is set faces the functional hole 203.

[0162] In the above implementation, the auxiliary support layer 3032 can be an integral structure with the third support layer 307 , and the integral structure is formed by stamping or injection molding, which can simplify the structure of the waterproof component 30 and facilitate the installation of the waterproof component 30 .

[0163] Continuing with Figure 17 , a seventh adhesive layer 3034 can be disposed between the auxiliary support layer 3032 and the inner surface 201 (i.e., the first groove bottom 2051). Accordingly, the seventh adhesive layer 3034 is provided with a tenth through-hole 3035 that communicates with the functional hole 203. It is understood that the functional hole 203 can be located within the projection of the tenth through-hole 3035 on the inner surface 201, or the projections of the functional hole 203 and the tenth through-hole 3035 on the inner surface 201 can completely overlap. This arrangement allows the auxiliary support layer 3032 to be secured to the housing 20 via the seventh adhesive layer 3034, thereby securing the waterproof assembly 30. It also ensures a seal between the auxiliary support layer 3032 and the housing 20.

[0164] Continuing with reference to Figure 17, a sixth bonding layer 3023 is provided between the third supporting layer 307 and the second supporting layer 303, a ninth through hole 3024 is provided on the sixth bonding layer 3023, the waterproof membrane 301 can be flush with the surface of the third supporting layer 307 facing away from the inner surface 201, the third bonding layer 302 is located in the ninth through hole 3024, and the third bonding layer 302 is bonded to the hole wall of the ninth through hole 3024. With such arrangement, the connection between the third supporting layer 307 and the second supporting layer 303 can be achieved through the sixth adhesive layer 3023, and when pre-pressure is applied through the buffer layer 305, the sixth adhesive layer 3023 located between the second supporting layer 303 and the third supporting layer 307 is subjected to force, while the third adhesive layer 302 is not subjected to force, thereby avoiding the third adhesive layer 302 and the waterproof membrane 301 on the third adhesive layer 302 from being subjected to force and wrinkling; at the same time, the third adhesive layer 302 is bonded with the sixth adhesive layer 3023, which can improve the sealing between the third supporting layer 307 and the second supporting layer 303.

[0165] Of course, in other implementations, the waterproof membrane 301 may also partially protrude outside the accommodating channel 3071, and this embodiment does not limit this.

[0166] Continuing with FIG17 , during assembly, the fourth adhesive layer 304, the second supporting layer 303, the sixth adhesive layer 3023, the third adhesive layer 302, the waterproof membrane 301, the third supporting layer 307, and the seventh adhesive layer 3034 can be sequentially attached to the buffer layer 305 to form a pre-assembled assembly. This assembly can then be assembled onto the housing 20, simplifying the assembly of the electronic device. Furthermore, the pre-assembled assembly can also be transported separately to achieve modularization of the electronic device.

[0167] For example, by using the waterproof assembly 30 shown in FIG17 , the electronic device can withstand a water pressure of up to 1 MPa (about 10 atm), that is, the electronic device can be used in water at a depth of up to 100 meters.

[0168] Continuing with reference to FIG17 , the third adhesive layer 302 can be a waterproof adhesive backing. Since there is a gap 3072 between the waterproof membrane 301 and the auxiliary support layer 3032, during assembly, only the third adhesive layer 302 needs to be activated. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, and automatically achieving bonding between the waterproof membrane 301 and the second support layer 303.

[0169] Continuing with Figures 15-17 , in this scenario, the waterproof assembly 30 further includes a protective layer 308, which is disposed on the surface of the waterproof membrane 301 facing the inner surface 201 (i.e., the first groove bottom 2051). The protective layer 308 is provided with a through hole 3081 that communicates with the functional hole 203. It is understood that the functional hole 203 can be located within the projection of the through hole 3081 on the inner surface 201, or the functional hole 203 and the projection of the through hole 3081 on the inner surface 201 can completely overlap.

[0170] Accordingly, gap 3072 is located between protective layer 308 and inner surface 201 (i.e., first groove bottom 2051). This arrangement allows protective layer 308 to evenly distribute force across waterproof membrane 301 under water pressure, preventing wrinkles. Furthermore, protective layer 308 provides support to prevent the edges of waterproof membrane 301 from warping. For example, protective layer 308 can be made of polyethylene terephthalate (PET).

[0171] Scenario 3

[0172] Please refer to Figure 18. The difference between this scenario and scenario one and scenario two is that the setting position of the waterproof component 30 is different. The waterproof component 30 can be set on the outer surface 202. The corresponding waterproof component 30 needs to be located between the shell 20 and the filter device 10 to prevent impurities such as particulate matter in the water from contacting the waterproof component 30.

[0173] Continuing with FIG18 , the housing 20 is provided with a second receiving groove 207. A second groove bottom 2071 of the second receiving groove 207 and a second shell wall 2021 outside the receiving groove 205 form the outer surface 202. The waterproof assembly 30 can be disposed within the receiving groove 205 to improve the structural compactness of the electronic device and reduce its size.

[0174] The waterproof assembly 30 comprises a third adhesive layer 302, a waterproof membrane 301, and a protective layer 308, stacked in a direction away from the outer surface 202 (i.e., the second groove bottom 2071). The third adhesive layer 302 is provided with a fifth through-hole 3021 that communicates with the functional hole 203, and the protective layer 308 is provided with a via 3081 that communicates with the functional hole 203. This arrangement secures the waterproof membrane 301 to the housing 20 via the third adhesive layer 302, and achieves a seal between the waterproof membrane 301 and the housing 20. Furthermore, during use, water pressure acting on the protective layer 308, and thus on the third adhesive layer 302, further enhances the seal between the waterproof membrane 301 and the housing 20. Therefore, during assembly, the waterproof membrane 301 can be installed without applying pre-stress, or with minimal pre-stress, thereby preventing excessive stress on the waterproof membrane 301 and wrinkling.

[0175] In the above implementation, the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles caused by uneven force. In addition, the protective layer 308 can play a certain supporting role to prevent the edge of the waterproof membrane 301 from warping.

[0176] It can be understood that the center lines of the via hole 3081 and the fifth through hole 3021 can be arranged colinearly with the center line of the functional hole 203, and the functional hole 203 can be located within the projection of the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071, or the functional hole 203 completely overlaps with the projection of the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071.

[0177] Referring to Figure 19 , the waterproof assembly 30 further includes a second supporting layer 303 disposed between the third adhesive layer 302 and the outer surface 202. A plurality of first holes 3031 are spaced apart in the area of ​​the second supporting layer 303 facing the functional hole 203. The second supporting layer 303 supports the waterproof membrane 30. It will be appreciated that an adhesive layer (not shown) may be disposed between the second supporting layer 303 and the outer surface 202 to secure the second supporting layer 303 and provide a seal between the second supporting layer 303 and the outer surface 202.

[0178] In the electronic device provided in this embodiment, the first filter layer 101 in the filter device 10 is disposed outside the outer surface 202 of the housing 20. The first filter layer 101 is provided with a plurality of first mesh holes at intervals. The second filter layer 102 is disposed between the outer surface 202 and the first filter layer 101. The second filter layer 102 is provided with a plurality of second mesh holes at intervals. Both the first filter layer 101 and the second filter layer 102 cover the functional holes 203 in the housing 20. With this arrangement, when the electronic device enters water, the first filter layer 101 and the second filter layer 102 can filter the water entering the functional holes 203, thereby preventing particles and other impurities in the liquid from entering the functional holes 203. This prevents impurities and other particles from damaging the waterproof membrane 301 of the waterproof assembly 30, particularly in deep water environments. This improves the waterproof performance of the electronic device in deep water environments, thereby increasing the electronic device's ability to withstand water pressure and extending its usable depth.

[0179] It should be noted that, in the description of the embodiments of the present application, unless otherwise clearly specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or an integral connection; it can also be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a communication between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0180] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A filtering device for being installed on an electronic device, characterized in that: The electronic device comprises: a shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell being provided with a functional hole penetrating the inner surface and the outer surface; The filtering device comprises: a first filter layer, the first filter layer being located outside the outer surface and covering the functional holes, and having a plurality of first mesh holes spaced apart; a second filter layer, the second filter layer being located between the outer surface and the first filter layer, the second filter layer covering the functional holes, and the second filter layer being provided with a plurality of second meshes at intervals; In a cross section parallel to the first filter layer, a cross-sectional area of ​​the first mesh is greater than a cross-sectional area of ​​the second mesh.

2. The filtering device according to claim 1, characterized in that There are multiple second filter layers, and the multiple second filter layers are stacked; along the direction away from the outer surface, in the cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

3. The filtering device according to claim 2, characterized in that The filtering device further comprises: The first bonding layer is provided between the first filter layer and the second filter layer adjacent thereto, and between adjacent second filter layers. The first bonding layer is provided with a first through hole communicating with the functional hole.

4. The filtering device according to claim 1, characterized in that The filtering device further comprises: The first supporting layer is provided between the second filter layer and the outer surface, and the first supporting layer is in contact with the outer surface; the first supporting layer is provided with a second through hole communicating with the functional hole.

5. The filtering device according to claim 1, characterized in that The first filter layer is a rigid filter layer.

6. The filtering device according to claim 5, characterized in that There are two second filter layers, which are stacked together. The first filter layer is located between the two second filter layers. In the direction away from the outer surface, in the cross section parallel to the first filter layer, the cross-sectional area of ​​the second mesh on each second filter layer gradually increases.

7. The filtering device according to claim 6, characterized in that The filtering device further comprises: The first bonding layer is provided between the first filter layer and the second filter layer, and a first through hole communicating with the functional hole is provided on the first bonding layer.

8. The filtering device according to claim 1, characterized in that The filtering device further comprises: a cover plate, the cover plate covering the outer surface, the first filter layer and the second filter layer being located between the cover plate and the outer surface, and a third through hole communicating with the functional hole being provided on the cover plate; The cover plate is connected to the housing.

9. The filtering device according to claim 8, characterized in that The filtering device further comprises: The second bonding layer is provided between the cover plate and the first filter layer, and a fourth through hole communicating with the functional hole is provided on the second bonding layer.

10. The filtering device according to claim 8, characterized in that A first groove is provided on the surface of the cover plate facing the housing, and at least a portion of the first filter layer is accommodated in the first groove.

11. The filtering device according to claim 8, characterized in that A second groove is provided on the outer surface, and at least a portion of the second filter layer is accommodated in the second groove.

12. The filtering device according to any one of claims 1 to 10, characterized in that: The electronic device further includes a sound module, which is arranged on the inner surface and in the functional hole.

13. An electronic device, characterized in that: include: a shell, the shell having an inner surface and an outer surface opposite to the inner surface, and the shell being provided with a functional hole penetrating the inner surface and the outer surface; A waterproof component is provided on the functional hole and is used to prevent liquid from passing through the functional hole; And, the filtering device according to any one of claims 1 to 12.

14. The electronic device according to claim 13, wherein: The waterproof component is arranged on the inner surface, and the waterproof component includes: A waterproof membrane, a third adhesive layer, a second supporting layer, and a fourth adhesive layer are stacked in a direction away from the inner surface, the third adhesive layer is provided with a fifth through hole, the fourth adhesive layer is provided with a sixth through hole, and the fifth through hole and the sixth through hole are both connected to the functional hole; A plurality of first holes are arranged at intervals in an area of ​​the second supporting layer facing the functional hole.

15. The electronic device according to claim 14, characterized in that The waterproof component further includes a buffer layer, which is arranged on a side of the fourth adhesive layer away from the inner surface, and a seventh through hole communicating with the functional hole is provided on the buffer layer.

16. The electronic device according to claim 14, characterized in that The waterproof component also includes: A fifth bonding layer is provided between the waterproof membrane and the inner surface, and an eighth through hole communicating with the functional hole is provided on the fifth bonding layer.

17. The electronic device according to claim 14, wherein: The waterproof component also includes: a third supporting layer, the third supporting layer being disposed on the inner surface and having an accommodating channel communicating with the functional hole; The waterproof membrane is accommodated in the accommodating channel, and the edge of the waterproof membrane is in contact with the side wall of the accommodating channel; a gap is provided between the waterproof membrane and the inner surface.

18. The electronic device according to claim 17, wherein: The second supporting layer contacts a surface of the third supporting layer facing away from the inner surface.

19. The electronic device according to claim 18, wherein: The third supporting layer includes a silica gel layer.

20. The electronic device according to claim 18, wherein The second supporting layer and the third supporting layer are an integral structure.

21. The electronic device according to claim 20, characterized in that A sealing ring is provided between the third supporting layer and the shell, and the sealing ring is provided around the functional hole.

22. The electronic device according to claim 17, wherein: The waterproof component also includes: An auxiliary supporting layer is provided between the third supporting layer and the inner surface, and a plurality of second holes are provided at intervals in the area of ​​the auxiliary supporting layer facing the functional hole; the gap is located between the waterproof membrane and the auxiliary supporting layer.

23. The electronic device according to claim 22, wherein: The auxiliary supporting layer and the third supporting layer are an integral structure.

24. The electronic device according to claim 22, wherein: A sixth bonding layer is provided between the third supporting layer and the second supporting layer. A ninth through hole is provided on the sixth bonding layer. The third bonding layer is located in the ninth through hole and is bonded to the hole wall of the ninth through hole.

25. The electronic device according to claim 14, wherein The waterproof component also includes: A protective layer is provided on the surface of the waterproof membrane facing the inner surface, and a via hole communicating with the functional hole is provided on the protective layer.

26. The electronic device according to claim 13, wherein: A first accommodating groove is provided on the inner surface, and the waterproof component is provided in the first accommodating groove.

27. The electronic device according to claim 13, wherein: The waterproof component is arranged on the outer surface, and the waterproof component includes: A third adhesive layer, a waterproof membrane and a protective layer are stacked in a direction away from the outer surface, the third adhesive layer is provided with a fifth through hole connected to the functional hole, and the protective layer is provided with a via hole facing the functional hole.

28. The electronic device according to claim 27, wherein: The waterproof component further includes a second supporting layer, which is arranged between the third adhesive layer and the outer surface. A plurality of first holes are arranged at intervals in an area of ​​the second supporting layer facing the functional hole.

29. The electronic device according to claim 27, wherein: A second accommodating groove is provided on the outer surface, and the waterproof component is arranged in the second accommodating groove.

30. The electronic device according to claim 13, wherein The electronic device further includes a sound module, which is arranged on the inner surface and in the functional hole.

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