Emission reduction system for treating exhaust gases of vacuum treatment system

Abstract

An abatement system (104) for treating an exhaust gas of a vacuum treatment system (100), the abatement system (104) comprising: an inlet manifold (200) comprising: a single fluid inlet (224) for receiving an exhaust gas flow from the vacuum treatment system (102); and a plurality of fluid outlets (226) coupled to the fluid inlets (224); and a plurality of abatement devices (202) arranged, in use, to receive an exhaust stream from the inlet manifold (200); wherein each abatement device (202) of the plurality of abatement devices (202) is coupled to a respective fluid outlet (226) of the inlet manifold (200).

Description

Technical Field

[0001] The present invention relates to an abatement system and method for treating exhaust gas of a vacuum processing system. Background Art

[0002] Vacuum pumping and abatement systems are used in various and diverse technical fields, such as semiconductor manufacturing. Typically, in such systems, vacuum pumping equipment is used to pump gases (e.g., gases from an industrial process) out of a particular location, and abatement equipment is used to abate (e.g., destroy or dispose of) the undesirable substances that have been produced.

[0003] Abatement devices generally include a burner configured to receive a process gas and remove undesirable species therefrom by combusting the process gas in a fuel and oxygen mixture. Summary of the invention

[0004] In one aspect, an abatement system for treating exhaust of a vacuum processing system is provided. The abatement system comprises: an inlet manifold, the inlet manifold comprising: a single fluid inlet (e.g., only a single fluid inlet) for receiving an exhaust flow from the vacuum processing system; and a plurality of fluid outlets coupled to the fluid inlet; and a plurality of abatement devices arranged to receive the exhaust flow from the inlet manifold in use. Each of the plurality of abatement devices is coupled to a respective fluid outlet of the inlet manifold. Each of the plurality of abatement devices comprises a plasma abatement device for generating a plasma to decompose components of the exhaust flow.

[0005] The abatement devices in the plurality of abatement devices may be substantially identical to one another.

[0006] Each abatement device of the plurality of abatement devices may be configured to convert a component of the exhaust gas flow into a liquid soluble component at a sub-atmospheric pressure.

[0007] The inlet manifold may include a central inlet tube defining a single fluid inlet of the inlet manifold. The inlet manifold may include a plurality of outlet tubes extending radially from the central inlet tube, each outlet tube defining a respective one of the fluid outlets of the inlet manifold. The plurality of outlet tubes may extend radially from the central inlet tube at respective positions around a circumference of the central inlet tube and at substantially the same axial position along the central inlet tube. The outlet tubes of the inlet manifold may be substantially identical to one another.

[0008] The inlet manifold may have a rotational symmetry of order greater than or equal to 2.

[0009] The abatement system may also include a plurality of filter devices, each filter device of the plurality of filter devices coupled to an outlet of a corresponding one of the plurality of abatement devices.

[0010] The abatement system may also include a plurality of first flexible tube sections, each first flexible tube section of the plurality of first flexible tube sections coupled between a corresponding fluid outlet of the inlet manifold and an abatement device coupled thereto.

[0011] The abatement system may also include an outlet manifold arranged to receive a gas flow output from the plurality of abatement devices in use. The outlet manifold may include a single fluid outlet for exhausting gas from the abatement system and a plurality of fluid inlets coupled to the single fluid outlet. Each of the plurality of abatement devices may be coupled to a corresponding fluid inlet of the outlet manifold. The abatement system may also include a canister filter included in the single fluid outlet. The abatement system may also include a plurality of second flexible tube portions, each of the plurality of second flexible tube portions being coupled between a corresponding fluid inlet of the outlet manifold and an abatement device coupled thereto. The outlet manifold may include: a central outlet pipe defining a single fluid outlet of the outlet manifold; and a plurality of inlet pipes extending radially from the central outlet pipe, each inlet pipe defining a corresponding one of the fluid inlets of the outlet manifold. The plurality of inlet pipes may extend radially from the central outlet pipe at corresponding positions around the perimeter of the central outlet pipe and at substantially the same axial position along the central outlet pipe. The inlet pipes of the outlet manifold may be substantially identical to each other. The outlet manifold may have a rotational symmetry of order greater than or equal to 2.

[0012] The abatement system may further include a plurality of gate valve pairs. Each gate valve pair may include a first gate valve located upstream of one of the plurality of abatement devices and a second gate valve located downstream of the corresponding abatement device. The abatement system may further include a plurality of flushing gas inlet ports for receiving a flushing gas. The abatement system may further include a plurality of flushing gas outlet ports for outputting a flushing gas. Each flushing gas inlet port may be arranged between the gate valves of the corresponding gate valve pair. Each flushing gas outlet port may be arranged between the gate valves of the corresponding gate valve pair. The flushing gas outlet port may be downstream of the flushing gas inlet port.

[0013] In another aspect, a method for treating exhaust of a vacuum processing system is provided. The method includes: receiving an exhaust flow from the vacuum processing system at a single fluid inlet of an inlet manifold; outputting a respective portion of the exhaust flow at each of a plurality of fluid outlets of the inlet manifold; receiving a respective portion of the exhaust flow from a respective fluid outlet of the inlet manifold at each of a plurality of abatement devices; and treating the received respective portion of the exhaust flow by each of the plurality of abatement devices. Each of the plurality of abatement devices includes a plasma abatement device, and the treating includes generating a plasma to decompose components of the exhaust flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of a vacuum processing system (not drawn to scale);

[0015] Figure 2a is a schematic diagram (not drawn to scale) showing a perspective view of an abatement system;

[0016] Figure 2b is a schematic diagram (not drawn to scale) showing a perspective view of an abatement system coupled to inlet and outlet pipes;

[0017] Figure 3 is a schematic diagram (not drawn to scale) showing a top-down view of an abatement system; and

[0018] Figure 4 is a process flow diagram illustrating certain steps of a method for treating exhaust gas in a vacuum processing system. DETAILED DESCRIPTION

[0019] Figure 1 is a schematic diagram (not drawn to scale) of a vacuum processing system 100. In this embodiment, the vacuum processing system is a semiconductor manufacturing facility.

[0020] The vacuum processing system 100 includes a semiconductor processing tool 102 , an abatement system 104 , and a vacuum pump 106 .

[0021] The semiconductor processing tool 102 includes a plurality of process chambers 108 in which semiconductor wafers undergo corresponding processes. Examples of such processes include, but are not limited to, chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography processes.

[0022] The semiconductor processing tool 102 is coupled to the abatement system 104 via a foreline system 110. The foreline system 110 is a system of pipes used to transport fluids from the plurality of process chambers 108 to the abatement system 104.

[0023] The vacuum pump 106 is configured to pump fluid (ie, process gas) out of the process chamber 108 of the semiconductor processing tool 102 and to the abatement system 104 via the foreline system 110. The vacuum pump 106 is also configured to pump fluid out of the abatement system 104 via the outlet line 112.

[0024] The abatement system 104 is configured to abate undesirable species present in a fluid received from a process chamber 108 of the semiconductor processing tool 102 .

[0025] Figure 2a is a schematic diagram (not drawn to scale) illustrating a perspective view of abatement system 104 .

[0026] Figure 2bis a schematic diagram (not drawn to scale) showing a perspective view of an abatement system coupled to an inlet pipe (ie, foreline 110 ) and an outlet pipe (ie, outlet line 112 ).

[0027] Figure 3 is a schematic diagram (not drawn to scale) illustrating a top-down view of abatement system 104 .

[0028] In this embodiment, the abatement system 104 includes an inlet manifold 200, a plurality of abatement devices 202, a plurality of filter devices 204, a plurality of flexible pipe sections 206a-b (including a plurality of first flexible pipe sections 206a and a plurality of second flexible pipe sections 206b), a plurality of gate valves 208a-b (including a plurality of first gate valves 208a and a plurality of second gate valves 208b), a plurality of isolation valves 210, a plurality of flushing gas ports 212, and an outlet manifold 214.

[0029] The inlet manifold 200 includes a central inlet tube 220 and a plurality of outlet tubes 222. In this embodiment, there are four outlet tubes 222.

[0030] The central inlet tube 220 defines a fluid inlet 224 of the inlet manifold 200. In particular, the central inlet tube 220 is open at one of its ends, the open end defining the fluid inlet 224 of the inlet manifold 200. The central inlet tube 220 is closed at the end opposite to the open end. The fluid inlet 224 of the inlet manifold 200 is arranged to receive an exhaust gas flow from the semiconductor processing tool 102. Figure 2a and Figure 2b The receipt of the process gas is illustrated in FIG. 1 by solid arrows and reference numeral 221. In particular, in this embodiment, a fluid inlet 224 is attached to the outlet of the foreline system 110.

[0031] Each of the outlet tubes 222 extends radially from the central inlet tube 220. Each of the outlet tubes 222 extends radially from the central inlet tube 220 in a respective direction perpendicular to the central axis 225 of the central inlet tube 220. Each outlet tube 222 defines a respective fluid outlet 226 of the inlet manifold 200. In particular, each outlet tube 222 includes a first end connected to the central inlet tube 220 and a second end opposite to the first end. Each outlet tube 222 includes a first opening at its first end and a second opening at its second end. The second opening of the outlet tube is the fluid outlet 226 of the inlet manifold 200.

[0032] Each outlet tube 222 extends from the central inlet tube 220 at a corresponding position around the circumference of the central inlet tube 200. The outlet tubes 222 extend from the central inlet tube 220 at substantially the same axial position along the length of the central inlet tube 220. In other words, the axial positions of the first ends of the outlet tubes 222 along the length of the central inlet tube 220 are substantially the same as one another, while their circumferential positions around the circumference of the central inlet tube 220 vary.

[0033] In this embodiment, approximately Figure 2a and Figure 2b In the preferred orientation of operation shown in FIG. 2 , the central inlet tube 220 of the inlet manifold 200 is approximately vertical. The central inlet tube 220 is arranged to receive a flow of process gas traveling in an approximately vertical downward direction 221. In addition, outlet tubes 222 also extend radially outward from the central inlet tube 220 in a substantially horizontal direction. The outlet tubes 222 are bent downwardly near their second ends (i.e., such that they are oriented approximately vertically downward).

[0034] In this embodiment, the outlet tubes 222 of the inlet manifold 200 are substantially identical to each other. The outlet tubes 222 have substantially identical diameters to each other. The outlet tubes 222 have substantially identical lengths to each other. Thus, Figure 3 As schematically illustrated in FIG. 2 , the fluid outlets 226 at the second end of the outlet tube 222 are positioned about a circle 300 centered about the central axis 225 of the central inlet tube 220 when viewed from above.

[0035] In this embodiment, the inlet manifold has a rotational symmetry of order 2 about the central axis 225 of the central inlet tube 220 .

[0036] The abatement devices 202 are arranged to receive the exhaust gas flow from the inlet manifold 200 in use. Each abatement device 200 is coupled to a corresponding fluid outlet 226 of the inlet manifold 200, i.e., each abatement device 202 is coupled to the second end of the corresponding outlet pipe 222. More specifically, in this embodiment, each abatement device 202 is coupled to the corresponding fluid outlet 226 via a corresponding one of the first flexible pipe sections 206a and a corresponding one of the first gate valves 208a. Each first flexible pipe section 206a is coupled between the corresponding first gate valve 208a and the corresponding abatement device 202. The first flexible pipe section 206a includes a bellows or a bellows-like pipe section. Each first gate valve 208a is coupled between the corresponding fluid outlet 226 and the corresponding first flexible pipe section 206a. Therefore, the first gate valve 208a is located upstream of the corresponding abatement device 202.

[0037] Each of the first gate valves 208a is configured to control the flow of a fluid (e.g., a gas) therethrough. For example, the first gate valve 208a may be fully closed to prevent or block air flow therethrough. Similarly, the first gate valve 208a may be fully open so as not to restrict air flow therethrough.

[0038] Preferably, the abatement devices 202 are substantially identical to one another. The abatement devices 202 are configured to abatement, i.e., perform an abatement process, on the received exhaust stream. For example, the abatement devices 202 may be configured to convert components of the received exhaust stream into liquid soluble components at sub-atmospheric pressure. Each abatement device 202 is a plasma abatement device that is configured to generate plasma to decompose components of the exhaust stream. For example, the abatement devices 202 may be Litmas TM Remote Plasma Source (RPS) Device The abatement device 202 may be configured to decompose fluorine compounds within the exhaust stream.

[0039] The filter devices 204 are arranged to receive, in use, a decomposed gas stream from the emission abatement device 202. Each filter device 204 is coupled to an outlet of a respective emission abatement device 202. The filter devices 204 are configured to filter particulate matter from the decomposed gas stream received from the emission abatement device 202.

[0040] The filter devices 204 are arranged to, in use, output a filtered gas flow to an outlet manifold 214. Preferably, the filter devices 204 are substantially identical to each other.

[0041] The outlet manifold 214 includes a central outlet tube 230 and a plurality of inlet tubes 232. In this embodiment, there are four inlet tubes 232.

[0042] The central outlet tube 230 defines a fluid outlet 234 of the outlet manifold 214. In particular, the central outlet tube 230 is open at one of its ends, and the open end defines the fluid outlet 234 of the outlet manifold 214. In this embodiment, the fluid outlet 234 of the outlet manifold 214 is the top or uppermost end of the central outlet tube 230. The central outlet tube 230 is closed at the end opposite to the open end. The central outlet tube 230 of the outlet manifold 214 is arranged to receive a gas flow from the plurality of inlet tubes 232 and output the gas flow to the vacuum pump 106. In particular, in this embodiment, the fluid outlet 234 is attached to the inlet of the outlet pipeline 112. Figure 2b The output of this gas is illustrated in FIG. 1 by solid arrows and reference numeral 231 .

[0043] Each of the inlet tubes 232 extends radially from the central outlet tube 230. Each of the inlet tubes 232 extends radially from the central outlet tube 230 in a respective direction perpendicular to the central axis 235 of the central outlet tube 230. Each inlet tube 232 defines a respective fluid inlet 236 of the outlet manifold 214. In particular, each inlet tube 232 includes a first end connected to the central outlet tube 230 and a second end opposite the first end. Each inlet tube 232 includes a first opening at its first end and a second opening at its second end. The second opening of the inlet tube 232 is the fluid inlet 236 of the outlet manifold 214.

[0044] Each inlet tube 232 extends from the central outlet tube 230 at a corresponding position around the circumference of the central outlet tube 230. The inlet tubes 232 extend from the central outlet tube 230 at substantially the same axial position along the length of the central outlet tube 230. In other words, the axial positions of the first ends of the inlet tubes 232 along the length of the central outlet tube 230 are substantially the same as each other, while their circumferential positions around the circumference of the central outlet tube 230 vary.

[0045] In this embodiment, approximately Figure 2a and Figure 2b In the preferred orientation of operation shown in , the central outlet tube 230 of the outlet manifold 214 is approximately vertical. The central outlet tube 230 is arranged to output the gas flow in an approximately vertical upward direction. In addition, the inlet tubes 232 also extend radially from the central outlet tube 230 in a substantially horizontal direction. The inlet tubes 232 are bent upward near their second ends (i.e., so that they are oriented approximately vertically upward).

[0046] In this embodiment, the inlet tubes 232 of the outlet manifold 214 are substantially identical to one another. The inlet tubes 232 have substantially identical diameters to one another. The inlet tubes 232 have substantially identical lengths to one another.

[0047] In this embodiment, the outlet manifold 214 has a rotational symmetry of order 2 about the central axis 235 of the central outlet tube 230 .

[0048] The outlet manifold 214 may be substantially identical in shape and size to the inlet manifold 200 .

[0049] Advantageously, a central outlet tube 230 arranged to output a gas flow in an approximately vertically upward direction tends to create a catchpot filter at the bottom (closed) end of the central outlet tube 230. However, in other embodiments, the central outlet tube 230 may be arranged to output a gas flow in a different direction, such as in an approximately vertically downward direction (e.g., the lower end of the central outlet tube 230 may be open while the upper end of the central outlet tube 230 is closed).

[0050] The filter device 204 is arranged to output the filtered airflow to the outlet manifold 214 in use. Each filter device 204 is coupled to the corresponding fluid inlet 236 of the outlet manifold 214, that is, each filter device 204 is coupled to the second end of the corresponding inlet pipe 232. More specifically, in this embodiment, each filter device 204 is coupled to the corresponding fluid inlet 236 via a corresponding one of the second flexible pipe parts 206b and a corresponding one of the second gate valves 208b. Each second flexible pipe part 206b is coupled between the corresponding filter device 204 and the corresponding second gate valve 208b. The first flexible pipe part 206a includes a bellows or a bellows-like pipe part. Each second gate valve 208b is coupled between the corresponding second flexible pipe part 206b and the second end of the corresponding inlet pipe 232. Therefore, the second gate valve 208b is located downstream of the corresponding emission reduction device 202.

[0051] Each of the second gate valves 208b is configured to control the flow of a fluid (e.g., a gas) therethrough. For example, the second gate valve 208b may be fully closed to prevent or block air flow therethrough. Similarly, the second gate valve 208b may be fully open so as not to restrict air flow therethrough.

[0052] Each of the isolation valves 210 is configured to control the flow of a fluid (e.g., a gas) therethrough. For example, the isolation valve 210 may be fully closed to prevent or block gas flow therethrough. Similarly, the isolation valve 210 may be fully open so as not to restrict gas flow therethrough. Each of the isolation valves 210 is disposed along a corresponding inlet pipe 232 of the outlet manifold 214.

[0053] The flushing gas ports 212 are configured to receive a supply of flushing gas. The flushing gas may be any suitable flushing gas, such as but not limited to nitrogen. Each flushing gas port 212 is disposed between a corresponding first gate valve 208a and a first flexible pipe portion 206a coupled downstream thereof.

[0054] Figure 4 is a process flow diagram illustrating certain steps of a method 400 for handling exhaust of a process chamber 108 of a semiconductor processing tool 102 .

[0055] It should be noted that Figure 4 Certain process steps depicted in the flowchart and described below may be omitted, or these process steps may be performed in a manner different from that presented below and described below. Figure 4 In addition, although all process steps have been depicted as discrete time-series steps for convenience and ease of understanding, some process steps may actually be performed simultaneously or at least overlap in time to some extent.

[0056] At step s402 , the vacuum pump 106 pumps the process gas out of the process chamber 108 to the abatement system 104 via the foreline system 110 .

[0057] At step s404, the fluid inlet 224 of the central inlet pipe 220 of the inlet manifold 200 receives the pumped process gas, i.e., the gas flow, from the foreline system 110, such as Figure 2a and Figure 2b As shown by arrow 221 in FIG.

[0058] At step s406 , the inlet manifold 200 splits the received airflow, and a respective portion of the exhaust gas flow is delivered along each outlet pipe 222 of the inlet manifold 200 .

[0059] Advantageously, the gas flow along the outlet tubes 222 is substantially the same, at least in part because the outlet tubes 222 are substantially identical and disposed at the same axial position along the central inlet tube 220. For example, for each outlet tube 222, the gas flow rate and volume along the outlet tube 222 are approximately the same.

[0060] At step s408 , the inlet manifold 200 outputs a corresponding exhaust gas flow at each of the plurality of fluid outlets 226 .

[0061] At step s410 , the respective exhaust gas flow travels sequentially through the respective first gate valve 208 a and the respective first flexible pipe portion 206 a to the inlet of the respective abatement device 202 .

[0062] At step s412 , each of the emission abatement devices 202 processes, ie, abates, the respective exhaust gas flow received thereby.

[0063] The abatement device 202 generates plasma and uses the generated plasma to decompose the exhaust flow into different components. In other words, the exhaust flow can be combusted using the plasma.

[0064] In some embodiments, abatement device 202 receives a reagent material with which the exhaust gas stream is mixed. The reagent material tends to prevent or inhibit the recombining of components into which the exhaust gas stream has been decomposed. Any suitable type of reagent material may be used.

[0065] At step s414 , the abatement device 202 outputs the decomposed gas flow to the filter device 204 .

[0066] At step s416 , the filter device 204 filters particulate matter from the received decomposed airflow.

[0067] At step s418, the filter device 204 outputs the corresponding filtered airflow.

[0068] At step s420 , the respective filtered gas streams travel sequentially through the respective second flexible tube portions 206 b and the respective second gate valves 208 b to the fluid inlet 236 of the respective inlet tubes 232 of the outlet manifold 214 .

[0069] At step s422 , the corresponding filtered airflow is delivered along each inlet tube 232 to the inlet central outlet tube 230 .

[0070] At step s424, the filtered gas streams are combined in the central outlet duct 230 of the outlet manifold 200 to thereby provide a combined gas stream.

[0071] At step s426, the combined gas flow may be filtered through another filter, which may be included in the central outlet duct 230, to thereby remove some or all remaining particulate matter therefrom.

[0072] At step s428, the vacuum pump 106 pumps the combined gas stream out of the outlet manifold 214 via the fluid outlet 234. The combined gas stream is pumped out of the abatement system 104 via the outlet line 112.

[0073] Thus, a method 400 is provided.

[0074] Advantageously, the above-described abatement system enables multiple abatement devices (eg, sub-atmospheric RPS) to be connected to a single vacuum pump inlet. The parallel arrangement of abatement devices along parallel vertically oriented arms tends to minimize or at least reduce the footprint of the abatement system, eg, in a horizontal plane.

[0075] The use of a sub-atmospheric RPS tends to enable a wide selection of post-vacuum pump gas scrubbing technologies. RPS technology tends to be effective in decomposing fluorine compounds, but conventionally tends to be limited in the amount of gas that can be processed at any one time, such as in conventional equipment that only includes a single RPS device mounted above a single vacuum process pump. The above-described abatement system enables multiple sub-atmospheric RPSs to be connected to a single vacuum pump to handle higher gas flows. This ability to handle higher gas flows tends to facilitate the connection of a single vacuum pump to multiple process chambers, as described above.

[0076] The above-described emission reduction systems tend to provide, for example, reductions in utility cost, system footprint, serviceability, and / or performance.

[0077] The above-described abatement system advantageously provides a single inlet manifold with only a single fluid inlet. The inlet manifold is multiplied into identical distribution tubes, which tend to provide identical gas flows to each RPS unit. Identical flows across each RPS unit tend to ensure that each RPS unit does not exceed its maximum flow threshold. For example, each RPS unit may be able to handle a maximum 3 slm process flow. Therefore, assuming each RPS unit handles 3 slm (max), the above-described system tends to be able to handle a 12 slm (max) process flow. Different flows through the system may cause some RPS units to exceed the 3 slm limit and other units to be underutilized. RPS units that exceed the 3 slm limit may not react to all of the gas presented, resulting in a potential reduction in downstream DRE. Identical flows across each RPS unit tend to address this issue.

[0078] Each RPS pipe leg may advantageously include upstream and downstream gate valves (e.g., pneumatic gate valves). Each pipe leg may advantageously include an (e.g., manual) isolation valve. Each pipe leg may advantageously include a flushing facility (e.g., a nitrogen flushing facility). The gate valves and / or flushing facilities tend to provide safe and separate isolation and maintenance for the abatement devices even while other abatement devices continue to process process gases. For example, first and second gate valves upstream and downstream of a given abatement unit, respectively, may be closed. Thus, process gases may be prevented from traveling through a given abatement unit in both upstream and downstream directions. A flushing gas, such as nitrogen, may then be flushed through the given abatement unit to thereby remove potentially hazardous process gases therefrom. The given abatement unit (and any devices coupled thereto, such as associated filter devices) may then be separated or removed from the abatement system. Advantageously, this may be performed while the remaining abatement units are still in operation. Maintenance, service, repair or replacement may then be performed on the given abatement unit and the unit may subsequently be reinstalled into the abatement system.The first and second gate valves may then be reopened and the replaced abatement unit restarted.

[0079] Maintenance of abatement devices and filters may utilize a nitrogen flushing function. Nitrogen may be introduced at an inlet flushing port located slightly below / downstream of valve 208A and output at an outlet flushing port located slightly above / upstream of valve 208B. The ability to pre-drain the repaired unit through a port above / upstream of valve 208B tends to enable leak testing functions to be performed on abatement devices and filters. The ability to pre-drain the repaired unit through a port above / upstream of valve 208B also tends to allow the repaired abatement device and filter to be brought back online while process vacuum continues to be maintained by other online abatement devices.

[0080] In some cases, particles may be generated downstream of the RPS unit and may extend to or reside outside the downstream filter. A (eg, manual) isolation valve advantageously supports a downstream automatic valve to prevent any particles from causing the downstream valve to leak.

[0081] The flexible pipe section, which may be a bellows-like structure, advantageously tends to provide vibration isolation upstream and / or downstream of the emission abatement device. The flexible pipe section may also provide or facilitate particle filtration. Furthermore, the flexible pipe section advantageously tends to facilitate removal and reinstallation of the emission abatement device, for example, for maintenance, service, repair or replacement.

[0082] The outlet manifold then brings all of the pipe branches back into a single outlet and tends to enable large (eg, catch tank) filters and a single outlet connection to a process pump.

[0083] Having the inlets of the abatement devices equally spaced from the central inlet tube of the inlet manifold tends to ensure equal flow distribution through each abatement device.

[0084] The above-described abatement system advantageously tends to provide maintenance access for multiple abatement devices. An abatement device can be replaced while other units remain online. The above-described abatement system advantageously tends to enable or facilitate the use of downstream wet scrubber technology, thereby enabling future gas recovery strategies.

[0085] The above-described abatement system advantageously utilizes a plasma unit that is operable to split very stable bonds (such as CF4) and, using a reagent gas, reconstitute the split compounds into different compounds that can be more easily handled after a vacuum pump (e.g., CF4 decomposed using a hydrogen reagent can produce HF). Advantageously, by using a plasma unit, it tends to be able to be a gas abatement unit with a water scrubber (i.e., a wet scrubber), which tends to eliminate the need to burn methane.

[0086] In the above-described embodiments, the vacuum processing system includes a single semiconductor processing tool. However, in other embodiments, the vacuum processing system includes a different number of semiconductor processing tools and / or other processing tools.

[0087] In the above-described embodiment, the semiconductor processing tool includes four process chambers. However, in other embodiments, the processing tool may include a different number of process chambers than four.

[0088] In the above described embodiments, the vacuum processing system includes a single abatement system. However, in other embodiments, the vacuum processing system includes multiple abatement systems.

[0089] In the above-described embodiments, the vacuum processing system includes a single vacuum pump. However, in other embodiments, the vacuum processing system includes multiple vacuum pumps.

[0090] In the above-described embodiment, the inlet manifold of the abatement system includes four outlet pipes. The abatement system also includes four abatement devices, each of which is coupled to a corresponding outlet pipe of the inlet manifold. However, in other embodiments, the inlet manifold includes a different number of outlet pipes (e.g., 2, 3, 5, 6, 7, or 8 outlet pipes), each of which can be coupled to a corresponding abatement device. Thus, the abatement system can include a different number of abatement devices other than four.

[0091] In the above-described embodiments, the abatement system includes a plurality of (specifically, four) filter devices. However, in other embodiments, the abatement system includes a different number of filter devices than four. In some embodiments, one or more (eg, all) filter devices may be omitted.

[0092] In the above-described embodiments, the outlet manifold of the abatement system includes four inlet tubes. However, in other embodiments, the outlet manifold includes a different number of inlet tubes (e.g., 2, 3, 5, 6, 7, or 8 inlet tubes). Each inlet tube can be coupled to a corresponding abatement device.

[0093] In the above-described embodiments, the abatement system includes a corresponding pair of gate valves on each abatement leg. However, in other embodiments, the abatement system includes a different number of gate valves than described above, and / or one or more of the gate valves may occupy a different position along the piping structure of the system than described above. In some embodiments, the gate valves may be omitted.

[0094] In the above-described embodiments, the abatement system includes a flexible pipe section on each abatement branch. However, in other embodiments, the abatement system includes a different number of flexible pipe sections than described above, and / or one or more of the flexible pipe sections may occupy a different position along the piping structure of the system than described above. In some embodiments, the flexible pipe section may be omitted.

[0095] In the above-described embodiments, the abatement system includes an isolation valve on each abatement branch. However, in other embodiments, the abatement system includes a different number of isolation valves than described above, and / or one or more of the isolation valves may occupy a different location along the piping structure of the system than described above. In some embodiments, the isolation valve may be omitted.

[0096] In the above described embodiments, the inlet manifold has a rotational symmetry of order 2 about the central axis of the central inlet tube. However, in other embodiments, the inlet manifold has a rotational symmetry of order greater than 2 about the central axis of the central inlet tube. In some embodiments, the inlet manifold has no rotational symmetry.

[0097] In the above embodiments, the outlet manifold has a rotational symmetry of order 2 about the central axis of the central outlet tube. However, in other embodiments, the outlet manifold has a rotational symmetry of order greater than 2 about the central axis of the central outlet tube. In some embodiments, the outlet manifold has no rotational symmetry.

[0098] In some embodiments, thermal insulation and / or cooling (eg, water cooling) may be provided around one or more (eg, all) abatement devices and / or one or more (eg, all) filters.

[0099] Reference numerals list

[0100] 100-Vacuum treatment system

[0101] 102-Semiconductor Processing Tools

[0102] 104-Emission reduction system

[0103] 106-Vacuum Pump

[0104] 108-Processing Chamber

[0105] 110-Pre-stage pipeline system

[0106] 112-Export pipeline

[0107] 200-Inlet Manifold

[0108] 202-Emission reduction device

[0109] 204-Filter device

[0110] 206a-First flexible pipe section

[0111] 206b - Second flexible pipe section

[0112] 208a-First gate valve

[0113] 208b-Second gate valve

[0114] 210-Isolation valve

[0115] 212-Flush Gas Port

[0116] 214-Outlet manifold

[0117] 220-Center inlet pipe

[0118] 221-Process gas input flow direction

[0119] 222-Export pipe

[0120] 224-Fluid inlet

[0121] 225-Central axis

[0122] 226-Fluid outlet

[0123] 230-Center outlet pipe

[0124] 231-Process gas output flow direction

[0125] 232-Inlet pipe

[0126] 234-Fluid outlet

[0127] 235-Central axis

[0128] 236-Fluid inlet

[0129] 300-round

[0130] 400-Method

[0131] s402-s428-Methods and Steps

Claims

1. An abatement system for treating exhaust gas of a vacuum processing system, the abatement system comprising: an inlet manifold, the inlet manifold comprising: a single fluid inlet for receiving an exhaust flow from the vacuum processing system; and a plurality of fluid outlets coupled to the fluid inlet; and a plurality of emission reduction devices arranged, in use, to receive exhaust gas flow from said inlet manifold; wherein Each abatement device of the plurality of abatement devices is coupled to a respective fluid outlet of the inlet manifold; and Each of the plurality of abatement devices includes a plasma abatement device for generating a plasma to decompose components of the exhaust gas flow.

2. The emission reduction system according to claim 1, wherein: The abatement devices of the plurality of abatement devices are substantially identical to one another.

3. The emission reduction system according to claim 1 or 2, wherein: Each abatement device of the plurality of abatement devices is configured to convert a component of the exhaust gas flow into a liquid soluble component at a sub-atmospheric pressure.

4. The emission reduction system according to any one of claims 1 to 3, wherein: The inlet manifold comprises: a central inlet tube defining the single fluid inlet of the inlet manifold; and A plurality of outlet tubes extend radially from the central inlet tube, each outlet tube defining a respective one of the fluid outlets of the inlet manifold.

5. The emission reduction system according to claim 4, wherein: The plurality of outlet tubes radially extend from the central inlet tube at respective locations around a circumference of the central inlet tube and at substantially the same axial location along the central inlet tube.

6. The emission reduction system according to claim 4 or 5, wherein: The outlet tubes of the inlet manifold are substantially identical to one another.

7. The emission reduction system according to any one of claims 1 to 6, wherein: The inlet manifold has a rotational symmetry of order greater than or equal to 2.

8. The abatement system of any one of claims 1 to 7, further comprising a plurality of filter devices, each filter device of the plurality of filter devices being coupled to an outlet of a corresponding one of the plurality of abatement devices.

9. The abatement system of any one of claims 1 to 8, further comprising a plurality of first flexible pipe sections, each of the plurality of first flexible pipe sections being coupled between a corresponding fluid outlet of the inlet manifold and an abatement device coupled thereto.

10. The abatement system according to any one of claims 1 to 9, wherein: The abatement system further comprises an outlet manifold arranged, in use, to receive a gas flow output from the plurality of abatement devices; The outlet manifold comprises: a single fluid outlet for exhausting gas from the abatement system; and a plurality of fluid inlets coupled to the single fluid outlet; and Each abatement device of the plurality of abatement devices is coupled to a respective fluid inlet of the outlet manifold.

11. The abatement system of claim 10, further comprising a canister filter included in the single fluid outlet.

12. The abatement system of claim 10 or 11, further comprising a plurality of second flexible pipe sections, each of the plurality of second flexible pipe sections being coupled between a respective fluid inlet of the outlet manifold and an abatement device coupled thereto.

13. The abatement system according to any one of claims 1 to 12, wherein: The abatement system further comprises a plurality of gate valve pairs; and Each gate valve pair includes: a first gate valve located upstream of one of the plurality of abatement devices; and A second gate valve is located downstream of the corresponding emission reduction device.

14. The emission reduction system of claim 13, wherein: The abatement system further includes a plurality of flushing gas ports for receiving a flushing gas; and Each flushing gas port is arranged between the gate valves of a corresponding gate valve pair.

15. A method for treating exhaust gas of a vacuum processing system, the method comprising: receiving an exhaust gas flow from the vacuum processing system at a single fluid inlet of an inlet manifold; outputting a respective portion of the exhaust gas flow at each of a plurality of fluid outlets of the inlet manifold; receiving a respective portion of the exhaust gas flow from a respective fluid outlet of the inlet manifold at each of a plurality of emission reduction devices; as well as processing said received respective portion of said exhaust gas stream by each of said plurality of abatement devices; Wherein each of the plurality of abatement devices comprises a plasma abatement device and the processing comprises generating a plasma to decompose components of the exhaust gas flow.

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