A semiconductor substrate cleaning device and its cleaning method

Abstract

The present invention discloses a semiconductor substrate cleaning device and a cleaning method thereof, including a control cabinet body, an ultrasonic cleaning tank is installed on the control cabinet body, three fixing rods are connected to the ultrasonic cleaning tank, the other ends of the fixing rods are fixedly connected with connecting cylinders, and an air pipe is penetrated and connected to the connecting cylinders. In the present invention, an ultrasonic cleaning tank, a carrying frame, an air suction frame, an air outlet channel, rotating beads and a guiding groove are adopted to blow and clean the dust and particulate debris adhered to the surface of the semiconductor substrate before the semiconductor substrate enters the cleaning agent in the ultrasonic cleaning tank, and the multi-angle blowing comprehensively covers the surface of the semiconductor substrate and its gaps. The dust and particulate debris are sucked and processed by the air suction frame along with the gas, avoiding the influence of the dust and particulate debris on the cleaning agent, separately treating the organic substances, particulate debris and dust, and ensuring the service life of the cleaning agent and the cleaning effect at the gaps inside the semiconductor substrate.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor cleaning, and particularly relates to a semiconductor substrate cleaning device and a cleaning method thereof. Background Art

[0002] In the technical field of semiconductor substrate cleaning, ultrasonic cleaning technology has been widely adopted. Its working principle is to use high-frequency alternating current to excite a piezoelectric resonator crystal, thereby generating high-frequency sound waves. These sound waves form a thin acoustic boundary layer on the substrate surface and produce tiny pressure fluctuations in the cleaning solution. The action of this sound wave energy, combined with the synergistic effect of chemical cleaning agents, effectively deep-cleans the semiconductor substrate and removes contaminants on the surface and in tiny gaps.

[0003] However, the existing ultrasonic cleaning technology has certain limitations in practical applications. Specifically, when stubborn dust, particulate debris, and organic substances adhere to the surface of the semiconductor substrate, traditional cleaning methods often struggle to completely remove these impurities. During the cleaning process, the dust and particles adhering to the substrate are likely to fall off and mix into the cleaning agent, which not only causes contamination of the cleaning agent, reduces its cleaning efficiency, but may also shorten the service life of the cleaning agent. In addition, the dust and particulate debris in the tiny gaps and grooves on the substrate surface are difficult to be completely washed away by the cleaning agent due to physical obstruction, thus affecting the final cleaning effect and the surface cleanliness of the semiconductor substrate. Therefore, in view of these technical defects, the optimization and innovation of semiconductor substrate cleaning devices are particularly important.

[0004] Based on this, the present invention designs a semiconductor substrate cleaning device and a cleaning method thereof to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to propose a semiconductor substrate cleaning device and a cleaning method thereof to solve the problems of contamination of the cleaning agent, reduction of its cleaning efficiency, possible shortening of the service life of the cleaning agent, and difficulty in being completely washed away by the cleaning agent, thus affecting the final cleaning effect and the surface cleanliness of the semiconductor substrate.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A semiconductor substrate cleaning device includes a control cabinet body. An ultrasonic cleaning tank is installed on the control cabinet body. Three fixing rods are connected to the ultrasonic cleaning tank. The other ends of the fixing rods are fixedly connected to a connecting cylinder. A trachea penetrates through the connecting cylinder. The bottom end of the trachea is communicated with a rotating air outlet device. A guiding groove is formed in the connecting cylinder. The rotating air outlet device is slidably connected in the guiding groove. The rotating air outlet device is connected with an activity adjusting device penetrating through the connecting cylinder. The back of the activity adjusting device is communicated with an intermediate pipe. The other end of the intermediate pipe is communicated with a squeezing and adjusting device fixedly connected to the inner wall of the ultrasonic cleaning tank. Three sliding support devices are fixedly connected to the inner wall of the ultrasonic cleaning tank. A bearing frame is fixedly connected to the sliding support device. A placing groove is formed in the bearing frame. Activity limiting devices penetrating through both sides of the bearing frame and located in the placing groove are provided. A vertical plate is connected to the inner wall of the ultrasonic cleaning tank at the position corresponding to the bearing frame at the rear side. An extrusion block is fixedly connected to the front surface of the vertical plate. An extension rod is connected to the inner wall of the ultrasonic cleaning tank at the lower side corresponding to the activity limiting device. The top end of the extension rod is fixedly connected to an extrusion plate.

[0008] As a further description of the above technical solution:

[0009] The width of the extrusion plate is greater than the width of the extrusion block. Two cabinet doors are hinged to the front surface of the control cabinet body. The bottom end of the trachea is communicated with a fan assembly. The fan assembly is fixedly connected to the side surface of the control cabinet body. An air suction frame is fixedly connected to the bearing frame. A connecting pipe is communicated with the side surface of the air suction frame.

[0010] As a further description of the above technical solution:

[0011] The rotating air outlet device includes a connecting cover and a rotating seat communicated with the bottom end of the trachea. A sealing bearing is sleeved outside the rotating seat. The sealing bearing is rotatably connected to the inner wall of the connecting cover. Rotating beads are fixedly connected to the outer arc surface of the rotating seat. The rotating beads are slidably connected in the guiding groove.

[0012] As a further description of the above technical solution:

[0013] Four circles of air outlet channels penetrate through the lower part of the rotating seat. Each circle of air outlet channels is arranged at equal circumferential intervals under the rotating seat. The axes of the four circles of circumferentially arranged air outlet channels coincide. The inclination angles of the four circles of air outlet channels are different. The connecting cover is slidably connected in the connecting cylinder.

[0014] As a further description of the above technical solution:

[0015] The movable adjustment device includes an upper piston cylinder connected through the connecting cylinder. A first piston plate is slidably connected in the upper piston cylinder. A regulating rod is connected under the first piston plate, and the bottom end of the regulating rod is fixedly connected to the connecting cover. The air storage cavity above the first piston plate in the upper piston cylinder is communicated with the intermediate pipe.

[0016] As a further description of the above technical solution:

[0017] A first sealing connection sleeve is slidably connected outside the regulating rod and is connected through the lower part of the upper piston cylinder. A first elastic component is sleeved outside the regulating rod, and both ends of the first elastic component are fixedly connected to the first piston plate and the inner wall of the upper piston cylinder respectively.

[0018] As a further description of the above technical solution:

[0019] The extrusion adjustment device includes a lower piston cylinder fixedly connected to the inner wall of the ultrasonic cleaning tank. A second piston plate is slidably connected in the lower piston cylinder. The air storage cavity below the second piston plate in the lower piston cylinder is communicated with the intermediate pipe. An elastic telescopic rod is fixedly connected to the second piston plate, and the top end of the elastic telescopic rod is fixedly connected to a top block. The top block is hemispherical. A second sealing connection sleeve is sleeved outside the elastic telescopic rod, and the second sealing connection sleeve is connected through the lower piston cylinder. A second elastic component arranged in the lower piston cylinder is fixedly connected under the second piston plate.

[0020] As a further description of the above technical solution:

[0021] The sliding support device includes an electro-hydraulic rod fixedly connected in the ultrasonic cleaning tank. The top end of the electro-hydraulic rod is fixedly connected to an intermediate seat. A sliding groove is formed in the intermediate seat. A sliding block fixedly connected to the carrying frame is slidably connected in the sliding groove. The sliding block is T-shaped, and a third elastic component arranged in the sliding groove is fixedly connected to the back surface of the sliding block.

[0022] As a further description of the above technical solution:

[0023] The movable limit device includes a linear bearing connected through the side wall of the carrying frame. A movable rod is sleeved in the linear bearing. A contact ball is fixedly connected to one end of the movable rod outside the placement groove, and a limit plate is fixedly connected to one end of the movable rod inside the placement groove. A fourth elastic component fixedly connected to the linear bearing and the contact ball is sleeved outside the movable rod.

[0024] A cleaning method for a semiconductor substrate cleaning device, the cleaning method includes the following steps:

[0025] Place the semiconductor substrate to be cleaned directly in the placement groove, and then control the electric hydraulic rod, the fan assembly, and the ultrasonic cleaning tank to work. The electric hydraulic rod drives the middle seat to move downward. At this time, the contact ball contacts the extrusion plate, and the inclined part of the extrusion plate pushes the contact ball and the movable rod to move. While the movable rod moves, the semiconductor substrate is clamped by the limiting plate. When the contact ball contacts the vertical section of the extrusion plate, the limiting plate remains stable. While the middle seat moves downward, the sliding block is used to pull the bearing frame downward. While the bearing frame moves downward, it is pushed forward by the inclined surface part of the extrusion block;

[0026] When the bearing frame passes over the extrusion block, the third elastic component controls the sliding block and the bearing frame to move backward quickly, realizing vibration of the bearing frame and the semiconductor substrate therein. The vibration makes the dust and particulate debris on the surface of the semiconductor substrate easier to separate from the semiconductor substrate. While the bearing frame moves downward, the extrusion top block and the elastic telescopic rod move downward. While the elastic telescopic rod moves, the gas in the lower piston cylinder is squeezed by the second piston plate and transferred to the upper piston cylinder through the middle pipe. The increased air pressure in the upper piston cylinder controls the first piston plate and the adjusting rod to move downward. The adjusting rod controls the connecting cover to move downward in the connecting cylinder. At the same time, the rotating bead moves downward along the guide groove, which will control the rotating seat to rotate when it moves downward. The fan assembly sprays the gas downward on the semiconductor substrate through the connecting cover and the air outlet channel through the air pipe. And because the gas volume of the lower piston cylinder is larger than that of the upper piston cylinder, the downward movement speed of the adjusting rod is greater than the downward movement speed of the bearing frame, making the air outlet channel move relatively quickly with respect to the semiconductor substrate;

[0027] The gas is sprayed downward through the air outlet channels with different inclination angles. The gas sprayed by the rotating air outlet channel can evenly cover the semiconductor substrate. And the semiconductor substrate moves downward relative to the air outlet channel, causing the angle of the gas sprayed on the semiconductor substrate to change, more fully and thoroughly blowing and cleaning the sundries and dust adhering in the gaps on the surface of the semiconductor substrate. And the gas carries the dust and particulate debris and flows upward along the side wall of the inclined placement groove. The gas and sundries flowing upward in the placement groove are sucked through the connecting pipe and the suction frame until the semiconductor substrate moves downward with the bearing frame into the liquid in the ultrasonic cleaning tank, and then ultrasonic cleaning is carried out.

[0028] In summary, due to the adoption of the above technical solutions, the beneficial effects of the present invention are:

[0029] 1. In the present invention, an ultrasonic cleaning tank, a carrier frame, an air suction frame, an air outlet channel, rotating beads and a guide groove are adopted. During the downward movement of the carrier frame, the connecting cover is controlled to move downward in the connecting cylinder, and at the same time, the rotating beads move downward along the guide groove, which will control the rotating seat to rotate when moving downward. The downward movement speed of the adjusting rod is greater than that of the carrier frame, so that the air outlet channel moves rapidly relative to the semiconductor substrate. The gas is ejected downward through the air outlet channels with different inclination angles. The gas ejected from the rotating air outlet channel can evenly cover the semiconductor substrate, and the semiconductor substrate moves downward relative to the air outlet channel, causing the angle of the gas sprayed on the semiconductor substrate to change, and more fully and thoroughly blowing and cleaning the sundries and dust adhering in the gaps on the surface of the semiconductor substrate. Before the semiconductor substrate enters the cleaning agent in the ultrasonic cleaning tank, the dust and particulate sundries adhering to its surface are blown and cleaned, and the multi-angle blowing comprehensively covers the surface of the semiconductor substrate and its gaps. The dust and particulate sundries are sucked and processed by the air suction frame along with the gas, avoiding the influence of the dust and particulate sundries on the cleaning agent, separately treating the organic substances, particulate sundries and dust, and ensuring the service life of the cleaning agent and the cleaning effect at the gaps inside the semiconductor substrate.

[0030] 2. In the present invention, a sliding block, a sliding groove, a third elastic component and an extrusion block are adopted. While the carrier frame moves downward, it is pushed forward by the inclined surface part of the extrusion block. When the carrier frame passes over the extrusion block, the third elastic component controls the sliding block and the carrier frame to move backward rapidly, realizing vibration of the carrier frame and the semiconductor substrate therein. The vibration makes the dust and particulate sundries on the surface of the semiconductor substrate more easily separated from the semiconductor substrate, enabling the dust and particulate sundries on the surface of the semiconductor substrate to be fully impacted and shed by the airflow, and the organic substances on the surface of the semiconductor substrate can be smoothly separated in the cleaning agent, ensuring better cleaning effect of the semiconductor substrate.

[0031] 3. In the present invention, an extrusion block, a contact ball, a movable rod and a limiting plate are adopted. When the carrier frame and the semiconductor substrate move downward, the contact ball will contact the extrusion plate before the carrier frame contacts the extrusion block and the top block. The inclined surface position of the extrusion plate controls the movement of the contact ball, the movable rod and the limiting plate, and the limiting plate automatically completes the extrusion and positioning of the semiconductor substrate, making the positioning of the semiconductor substrate related to the process of taking and placing the semiconductor substrate from the ultrasonic cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a three-dimensional structural schematic diagram of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0033] Figure 2 is a three-dimensional structural schematic diagram of a fixed rod of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0034] Figure 3Schematic diagram of the three-dimensional structure of the carrier frame of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0035] Figure 4 Schematic diagram of the side three-dimensional sectional structure of the sliding support device of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0036] Figure 5 Schematic diagram of the three-dimensional sectional structure of the extrusion adjustment device of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0037] Figure 6 Schematic diagram of the three-dimensional sectional structure of the connecting cylinder of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0038] Figure 7 Schematic diagram of the three-dimensional exploded structure of the rotating air outlet device of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0039] Figure 8 Schematic diagram of the bottom three-dimensional structure of the rotating air outlet device of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0040] Figure 9 Schematic diagram of the three-dimensional sectional structure of the movable adjustment device of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention;

[0041] Figure 10 Schematic diagram of the three-dimensional structure of the movable limit device of a semiconductor substrate cleaning device and its cleaning method proposed by the present invention.

[0042] Legend:

[0043] 1. Control cabinet body; 2. Cabinet door; 3. Ultrasonic cleaning tank; 4. Fixed rod; 5. Connecting cylinder; 6. Air pipe; 7. Fan assembly; 8. Rotary air outlet device; 81. Connecting cover; 82. Rotary seat; 83. Sealing bearing; 84. Rotary bead; 85. Air outlet channel; 9. Guide groove; 10. Movable adjustment device; 101. Upper piston cylinder; 102. First piston plate; 103. Adjusting rod; 104. First sealing connection sleeve; 105. First elastic component; 11. Intermediate pipe; 12. Extrusion adjustment device; 121. Lower piston cylinder; 122. Second piston plate; 123. Elastic telescopic rod; 124. Second sealing connection sleeve; 125. Top block; 126. Second elastic component; 13. Sliding support device; 131. Electric hydraulic rod; 132. Intermediate seat; 133. Sliding groove; 134. Sliding block; 135. Third elastic component; 14. Carrying frame; 15. Placing groove; 16. Suction frame; 17. Connecting pipe; 18. Vertical plate; 19. Extrusion block; 20. Movable limit device; 201. Linear bearing; 202. Movable rod; 203. Contact ball; 204. Fourth elastic component; 205. Limit plate; 21. Extrusion plate; 22. Extension rod. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] Please refer to the attached Figure 1 - attached Figure 10, the present invention provides a technical solution: a semiconductor substrate cleaning device, including a control cabinet 1, an ultrasonic cleaning tank 3 is installed on the control cabinet 1, three fixing rods 4 are connected to the ultrasonic cleaning tank 3, the other ends of the fixing rods 4 are fixedly connected to a connecting cylinder 5, a trachea 6 is penetratingly connected to the connecting cylinder 5, the bottom end of the trachea 6 is communicated with a rotary air outlet device 8, a guiding groove 9 is formed in the connecting cylinder 5, the rotary air outlet device 8 is slidably connected in the guiding groove 9, a movable adjustment device 10 penetratingly arranged on the connecting cylinder 5 is connected to the rotary air outlet device 8, an intermediate pipe 11 is communicated with the back surface of the movable adjustment device 10, the other end of the intermediate pipe 11 is communicated with a squeezing adjustment device 12 fixedly connected to the inner wall of the ultrasonic cleaning tank 3, three sliding support devices 13 are fixedly connected to the inner wall of the ultrasonic cleaning tank 3, a bearing frame 14 is fixedly connected to the sliding support device 13, a placing groove 15 is formed in the bearing frame 14, movable limiting devices 20 located in the placing groove 15 are penetratingly connected to both sides of the bearing frame 14, a vertical plate 18 is connected to the position of the bearing frame 14 on the rear side of the inner wall of the ultrasonic cleaning tank 3, a squeezing block 19 is fixedly connected to the front surface of the vertical plate 18, an extension rod 22 is connected to the position of the movable limiting device 20 on the lower side of the inner wall of the ultrasonic cleaning tank 3, and a squeezing plate 21 is fixedly connected to the top end of the extension rod 22.

[0046] The ultrasonic cleaning tank 3 cooperates with the cleaning agent inside it, and uses ultrasonic waves to act on the cleaning agent and the semiconductor substrate to realize the cleaning treatment of the surface of the semiconductor substrate;

[0047] Specifically, as Figure 1-2 shown, the width of the squeezing plate 21 is greater than the width of the squeezing block 19, two cabinet doors 2 are hinged to the front surface of the control cabinet 1, the bottom end of the trachea 6 is communicated with a fan assembly 7, the fan assembly 7 is fixedly connected to the side surface of the control cabinet 1, an air suction frame 16 is fixedly connected to the bearing frame 14, and a connecting pipe 17 is communicated with the side surface of the air suction frame 16.

[0048] The fan assembly 7 is used for sucking gas, and can control the gas to smoothly pass through the trachea 6 and the connecting cover 81. The air suction frame 16 is used for sucking the gas flowing upward in the placing groove 15 to realize the suction treatment of the gas mixed with dust and particulate impurities;

[0049] Specifically, as Figure 2 and Figures 6-8 shown, the rotary air outlet device 8 includes a connecting cover 81 communicated with the bottom end of the trachea 6 and a rotary seat 82. A sealing bearing 83 is sleeved outside the rotary seat 82, the sealing bearing 83 is rotatably connected to the inner wall of the connecting cover 81, a rotary bead 84 is fixedly connected to the outer arc surface of the rotary seat 82, and the rotary bead 84 is slidably connected in the guiding groove 9.

[0050] Four circles of air outlet channels 85 are connected through the lower part of the rotating seat 82. Each circle of air outlet channels 85 is arranged at equal circumferential intervals under the rotating seat 82. The axes of the four circles of air outlet channels 85 arranged in a circle coincide, and the inclination angles of the four circles of air outlet channels 85 are different. The connecting cover 81 is slidably connected in the connecting cylinder 5.

[0051] The sealing bearing 83 is used to connect between the rotating seat 82 and the connecting cover 81 and ensure the sealing effect. The rotating beads 84 cooperate with the guide groove 9. The spiral guide groove 9 guides the downward moving rotating beads 84 to control the rotation of the rotating seat 82. The gas is ejected downward through the air outlet channels 85 with different inclination angles. The gas ejected from the rotating air outlet channels 85 can evenly cover the semiconductor substrate. The rotating seat 82 sprays the gas at various angles on the semiconductor substrate;

[0052] Specifically, as Figure 2 and Figure 9 shown, the movable adjustment device 10 includes an upper piston cylinder 101 connected through the connecting cylinder 5. A first piston plate 102 is slidably connected in the upper piston cylinder 101. A regulating rod 103 is connected under the first piston plate 102. The bottom end of the regulating rod 103 is fixedly connected to the connecting cover 81. The air storage cavity above the first piston plate 102 in the upper piston cylinder 101 is communicated with the intermediate pipe 11.

[0053] A first sealing connection sleeve 104 is slidably connected outside the regulating rod 103 and is connected through the lower part of the upper piston cylinder 101. A first elastic component 105 is sleeved outside the regulating rod 103. The two ends of the first elastic component 105 are respectively fixedly connected to the first piston plate 102 and the inner wall of the upper piston cylinder 101.

[0054] The acting force of the first elastic component 105 on the first piston plate 102 can prevent the first piston plate 102 and the connecting cover 81 from shaking randomly, and when the air pressure in the upper piston cylinder 101 returns to normal, it controls the connecting cover 81 to move upward and reset. The increased air pressure in the upper piston cylinder 101 controls the first piston plate 102 and the regulating rod 103 to move downward. The regulating rod 103 controls the connecting cover 81 to move downward in the connecting cylinder 5. Since the gas capacity of the lower piston cylinder 121 is larger than that of the upper piston cylinder 101, the downward movement speed of the regulating rod 103 is greater than the downward movement speed of the carrying frame 14, so that the air outlet channels 85 move relatively quickly with respect to the semiconductor substrate, and the carrying frame 14 moves downward relatively slowly with respect to the rotating seat 82. The gas ejected from the air outlet channels 85 changes the angle as the two approach each other. The variable jet angles can fully act on the gaps on the surface of the semiconductor substrate;

[0055] Specifically, as Figure 1-2 and Figure 5As shown in the figure, the extrusion adjustment device 12 includes a lower piston cylinder 121 fixedly connected to the inner wall of the ultrasonic cleaning tank 3. A second piston plate 122 is slidably connected in the lower piston cylinder 121. The air storage cavity located below the second piston plate 122 in the lower piston cylinder 121 is communicated with the intermediate pipe 11. An elastic telescopic rod 123 is fixedly connected to the second piston plate 122. The top end of the elastic telescopic rod 123 is fixedly connected with a top block 125. The top block 125 is hemispherical. A second sealing connection sleeve 124 is sleeved outside the elastic telescopic rod 123. The second sealing connection sleeve 124 is connected through the lower piston cylinder 121. A second elastic component 126 arranged in the lower piston cylinder 121 is fixedly connected below the second piston plate 122.

[0056] The force required for the elastic telescopic rod 123 to be squeezed and deformed is greater than the force required for the second elastic component 126 to be deformed. Therefore, when the bearing frame 14 squeezes the elastic telescopic rod 123, the second elastic component 126 is first squeezed and deformed, and then the elastic telescopic rod 123 will be squeezed and shortened. The second elastic component 126 supports the second piston plate 122 and the elastic telescopic rod 123 upward, or controls the reset of the second piston plate 122 subsequently. While the bearing frame 14 moves downward, it squeezes the top block 125 and the elastic telescopic rod 123 to move downward. While the elastic telescopic rod 123 moves, it squeezes the gas in the lower piston cylinder 121 through the second piston plate 122 and transfers it to the upper piston cylinder 101 through the intermediate pipe 11;

[0057] Specifically, as Figures 1-4 shown, the sliding support device 13 includes an electro-hydraulic rod 131 fixedly connected in the ultrasonic cleaning tank 3. The top end of the electro-hydraulic rod 131 is fixedly connected with an intermediate seat 132. A sliding groove 133 is opened on the intermediate seat 132. A sliding block 134 fixedly connected to the bearing frame 14 is slidably connected in the sliding groove 133. The sliding block 134 is T-shaped. A third elastic component 135 arranged in the sliding groove 133 is fixedly connected to the back surface of the sliding block 134.

[0058] The sliding groove 133 and the sliding block 134 connect and support the bearing frame 14, enabling the electro-hydraulic rod 131 to control the bearing frame 14 to move in the vertical direction, while the bearing frame 14 can slide in the front-back direction. The third elastic component 135 applies an elastic force to the sliding block 134 and the bearing frame 14 to prevent the bearing frame 14 from shaking when not externally squeezed. When the bearing frame 14 is pushed by the inclined surface of the extrusion block 19, the bearing frame 14 can move forward. After the bearing frame 14 passes over the extrusion block 19, the third elastic component 135 controls the sliding block 134 to reset, realizing the vibration of the bearing frame 14;

[0059] Specifically, as Figures 2-3 and Figure 10As shown in the figure, the movable limiting device 20 includes a linear bearing 201 penetrating and connected to the side wall of the bearing frame 14. A movable rod 202 is sleeved inside the linear bearing 201. One end of the movable rod 202 located outside the placement groove 15 is fixedly connected with a contact ball 203. One end of the movable rod 202 located inside the placement groove 15 is fixedly connected with a limiting plate 205. A fourth elastic component 204 fixedly connected to the linear bearing 201 and the contact ball 203 is sleeved outside the movable rod 202.

[0060] The contact ball 203 cooperates with the pressing plate 21. The inclined section of the pressing plate 21 controls the contact ball 203 and the movable rod 202 to move towards the bearing frame 14, automatically realizing the control of the limiting plate 205 to clamp the semiconductor substrate. When the contact ball 203 is not in contact with the pressing plate 21, the fourth elastic component 204 controls the limiting plate 205 to maintain a stable state of separation from the semiconductor substrate;

[0061] A cleaning method for a semiconductor substrate cleaning device, the cleaning method includes the following steps:

[0062] Directly place the semiconductor substrate to be cleaned in the placement groove 15, and then control the electric hydraulic rod 131, the fan assembly 7 and the ultrasonic cleaning tank 3 to work. The electric hydraulic rod 131 drives the intermediate seat 132 to move downward. At this time, the contact ball 203 is in contact with the pressing plate 21. The inclined part of the pressing plate 21 pushes the contact ball 203 and the movable rod 202 to move. While the movable rod 202 moves, the semiconductor substrate is clamped by the limiting plate 205. When the contact ball 203 is in contact with the vertical section of the pressing plate 21, the limiting plate 205 remains stable. While the intermediate seat 132 moves downward, it pulls the bearing frame 14 to move downward through the sliding block 134. While the bearing frame 14 moves downward, it is pushed forward by the inclined surface part of the pressing block 19;

[0063] When the carrying frame 14 passes over the extrusion block 19, the third elastic component 135 controls the slider 134 and the carrying frame 14 to move backward quickly, so as to vibrate the carrying frame 14 and the semiconductor substrate therein. The vibration makes the dust and particulate debris on the surface of the semiconductor substrate easier to separate from the semiconductor substrate. While the carrying frame 14 moves downward, the extrusion top block 125 and the elastic telescopic rod 123 move downward. While the elastic telescopic rod 123 moves, the gas in the lower piston cylinder 121 is extruded by the second piston plate 122 and transferred to the upper piston cylinder 101 through the middle pipe 11. The increased air pressure in the upper piston cylinder 101 controls the first piston plate 102 and the adjusting rod 103 to move downward. The adjusting rod 103 controls the connecting cover 81 to move downward in the connecting cylinder 5. At the same time, the rotating beads 84 move downward along the guiding groove 9, which will control the rotating seat 82 to rotate when moving downward. The fan assembly 7 sprays the gas downward on the semiconductor substrate through the air pipe 6, the connecting cover 81 and the air outlet channel 85. And because the gas capacity of the lower piston cylinder 121 is larger than that of the upper piston cylinder 101, the downward movement speed of the adjusting rod 103 is greater than the downward movement speed of the carrying frame 14, so that the air outlet channel 85 moves relatively quickly with respect to the semiconductor substrate;

[0064] The gas is sprayed downward through the air outlet channels 85 with different inclination angles. The gas sprayed by the rotating air outlet channels 85 can evenly cover the semiconductor substrate. And the semiconductor substrate moves downward relative to the air outlet channels 85, so that the angle of the gas sprayed on the semiconductor substrate changes, and the debris and dust adhering in the gaps on the surface of the semiconductor substrate can be blown and cleaned more fully and thoroughly. And the gas carries the dust and particulate debris and flows upward along the side wall of the inclined placement groove 15, and the gas and debris flowing upward in the placement groove 15 are sucked through the connecting pipe 17 and the suction frame 16 until the semiconductor substrate moves downward with the carrying frame 14 into the liquid in the ultrasonic cleaning tank 3, and at this time, ultrasonic cleaning is carried out.

[0065] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

Claims

1. A semiconductor substrate cleaning device, comprising a control cabinet (1), characterized in that: An ultrasonic cleaning box (3) is installed on the control cabinet (1), and three fixing rods (4) are connected to the ultrasonic cleaning box (3). The other end of the fixing rod (4) is fixedly connected to a connecting tube (5), and an air pipe (6) is connected to the connecting tube (5). The bottom end of the air pipe (6) is connected to a rotating air outlet device (8). A guide groove (9) is provided in the connecting tube (5), and the rotating air outlet device (8) is slidably connected in the guide groove (9). The rotating air outlet device (8) is connected to a movable adjustment device (10) which is arranged on the connecting tube (5). The back of the movable adjustment device (10) is connected to an intermediate tube (11), and the other end of the intermediate tube (11) is connected to an extrusion tube (11) which is fixedly connected to the inner wall of the ultrasonic cleaning box (3). The ultrasonic cleaning box (3) comprises a pressure regulating device (12), three sliding support devices (13) are fixedly connected to the inner wall of the ultrasonic cleaning box (3), a bearing frame (14) is fixedly connected to the sliding support device (13), a placement groove (15) is provided on the bearing frame (14), both sides of the bearing frame (14) are penetrated and connected with movable limiting devices (20) located in the placement groove (15), a vertical plate (18) is connected to the rear side of the inner wall of the ultrasonic cleaning box (3) at a position corresponding to the bearing frame (14), an extrusion block (19) is fixedly connected to the front side of the vertical plate (18), an extension rod (22) is connected to the lower side of the inner wall of the ultrasonic cleaning box (3) at a position corresponding to the movable limiting device (20), and the top end of the extension rod (22) is fixedly connected to an extrusion plate (21); The sliding support device (13) comprises an electric hydraulic rod (131) fixedly connected in the ultrasonic cleaning box (3); the top end of the electric hydraulic rod (131) is fixedly connected to an intermediate seat (132); a sliding groove (133) is provided on the intermediate seat (132); a sliding block (134) fixedly connected to the bearing frame (14) is slidably connected in the sliding groove (133); the sliding block (134) is T-shaped; the back of the sliding block (134) is fixedly connected to a third elastic component (135) provided in the sliding groove (133); The movable limiting device (20) comprises a linear bearing (201) penetrating and connected to the side wall of the supporting frame (14); a movable rod (202) is sleeved inside the linear bearing (201); one end of the movable rod (202) located outside the placement groove (15) is fixedly connected to a contact ball (203); one end of the movable rod (202) located inside the placement groove (15) is fixedly connected to a limiting plate (205); and a fourth elastic component (204) is sleeved outside the movable rod (202) and is fixedly connected to the linear bearing (201) and the contact ball (203).

2. A semiconductor substrate cleaning device according to claim 1, characterized in that: The width of the extrusion plate (21) is greater than the width of the extrusion block (19); the front of the control cabinet (1) is hinged with two cabinet doors (2); the bottom end of the air pipe (6) is connected to a fan assembly (7); the fan assembly (7) is fixedly connected to the side of the control cabinet (1); the support frame (14) is fixedly connected to an air suction frame (16); and the side of the air suction frame (16) is connected to a connecting pipe (17).

3. The semiconductor substrate cleaning device according to claim 1, characterized in that: The rotary air outlet device (8) comprises a connection cover (81) connected to the bottom end of the air pipe (6) and a rotary seat (82); the rotary seat (82) is provided with a sealing bearing (83) on its outer sleeve; the sealing bearing (83) is rotatably connected to the inner wall of the connection cover (81); the outer arc surface of the rotary seat (82) is fixedly connected to a rotary bead (84); and the rotary bead (84) is slidably connected in the guide groove (9).

4. A semiconductor substrate cleaning device according to claim 3, characterized in that: Four circles of air outlet channels (85) are connected and penetrated under the rotating seat (82), and each circle of air outlet channels (85) is arranged under the rotating seat (82) at equal intervals in a circle. The axes of the four circles of air outlet channels (85) are coincident, and the inclination angles of the four circles of air outlet channels (85) are different. The connecting cover (81) is slidably connected in the connecting tube (5).

5. The semiconductor substrate cleaning device according to claim 1, characterized in that: The movable adjustment device (10) comprises an upper piston cylinder (101) which is connected to the connecting cylinder (5) through a first piston plate (102) which is slidably connected inside the upper piston cylinder (101), an adjusting rod (103) being connected below the first piston plate (102), a bottom end of the adjusting rod (103) being fixedly connected to the connecting cover (81), and an air storage chamber located on the upper side of the first piston plate (102) in the upper piston cylinder (101) being connected to the intermediate tube (11).

6. The semiconductor substrate cleaning device according to claim 5, characterized in that: The adjusting rod (103) is slidably connected to the outside with a first sealing connection sleeve (104) penetrating and connected to the lower part of the upper piston cylinder (101); the adjusting rod (103) is provided with a first elastic component (105) on its outer sleeve; the two ends of the first elastic component (105) are respectively fixedly connected to the first piston plate (102) and the inner wall of the upper piston cylinder (101).

7. The semiconductor substrate cleaning device according to claim 1, characterized in that: The squeezing adjustment device (12) comprises a lower piston cylinder (121) fixedly connected to the inner wall of the ultrasonic cleaning box (3), a second piston plate (122) being slidably connected inside the lower piston cylinder (121), an air storage chamber located below the second piston plate (122) in the lower piston cylinder (121) being communicated with the intermediate tube (11), an elastic telescopic rod (123) being fixedly connected to the second piston plate (122), a top block (125) being fixedly connected to the top of the elastic telescopic rod (123), the top block (125) being set in a hemispherical shape, a second sealing connection sleeve (124) being provided on the outer sleeve of the elastic telescopic rod (123), the second sealing connection sleeve (124) being connected through the lower piston cylinder (121), and a second elastic component (126) arranged in the lower piston cylinder (121) being fixedly connected below the second piston plate (122).

8. A cleaning method for a semiconductor substrate cleaning device, according to any one of claims 1 to 7, characterized in that: The cleaning method comprises the following steps: The semiconductor substrate to be cleaned is directly placed in the placement groove (15), and then the electric hydraulic rod (131), the fan assembly (7) and the ultrasonic cleaning box (3) are controlled to work. The electric hydraulic rod (131) drives the middle seat (132) to move downward. At this time, the contact ball (203) contacts the extrusion plate (21), and the inclined part of the extrusion plate (21) pushes the contact ball (203) and the movable rod (202) to move. When the movable rod (202) moves, the semiconductor substrate is clamped by the limit plate (205). When the contact ball (203) contacts the vertical section of the extrusion plate (21), the limit plate (205) remains stable. When the middle seat (132) moves downward, the bearing frame (14) is pulled downward by the sliding block (134). When the bearing frame (14) moves downward, it is pushed forward by the inclined part of the extrusion block (19); When the carrying frame (14) passes over the squeezing block (19), the third elastic component (135) controls the sliding block (134) and the carrying frame (14) to move backward quickly, thereby vibrating the carrying frame (14) and the semiconductor substrate therein. The vibration makes it easier for dust and particulate debris on the surface of the semiconductor substrate to separate from the semiconductor substrate. When the carrying frame (14) moves downward, the top block (125) and the elastic telescopic rod (123) are squeezed downward. When the elastic telescopic rod (123) moves, the gas in the lower piston cylinder (121) is squeezed through the second piston plate (122) and transferred to the upper piston cylinder (101) through the intermediate tube (11). The enlarged gas in the upper piston cylinder (101) The air pressure controls the first piston plate (102) and the adjusting rod (103) to move downward, and the adjusting rod (103) controls the connecting cover (81) to move downward in the connecting cylinder (5). At the same time, the rotating ball (84) moves downward along the guide groove (9), which controls the rotating seat (82) to rotate when moving downward. The fan assembly (7) sprays the gas downward onto the semiconductor substrate through the connecting cover (81) and the air outlet channel (85) via the air pipe (6). Since the gas capacity of the lower piston cylinder (121) is larger than that of the upper piston cylinder (101), the downward movement speed of the adjusting rod (103) is greater than the downward movement speed of the supporting frame (14), so that the air outlet channel (85) moves quickly relative to the semiconductor substrate. The gas is ejected downward through the gas outlet channels (85) with different inclination angles. The gas ejected from the rotating gas outlet channels (85) can evenly cover the semiconductor substrate. The semiconductor substrate moves downward relative to the gas outlet channels (85), so that the angle of the gas ejected onto the semiconductor substrate changes, so that the debris and dust adhering to the gaps on the surface of the semiconductor substrate can be blown and cleaned more thoroughly. The gas carries the dust and particulate debris and flows upward along the side wall of the inclined placement groove (15). The gas and debris flowing upward in the placement groove (15) are sucked through the connecting pipe (17) and the suction frame (16) until the semiconductor substrate moves downward along the carrier frame (14) into the liquid in the ultrasonic cleaning box (3), and ultrasonic cleaning is then performed.

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