A non-contact GIS equipment internal conductor temperature monitoring method and system

Abstract

This application relates to the technical field of power equipment monitoring, and specifically discloses a non-contact internal conductor temperature monitoring method and system for GIS equipment. The method includes obtaining parameter information of the GIS equipment, establishing a thermal simulation mathematical model based on the parameter information, inputting into the thermal simulation mathematical model at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor, and outputting the temperature field distribution data inside the equipment; determining the first temperature data of the contact conductor of the equipment and the second temperature data of the gas in some gas chambers inside the equipment monitoring point according to the temperature field distribution data; establishing a monitoring mathematical model based on multiple linear fitting according to the first temperature data and the second temperature data; collecting the actual temperature data of some SF6 gas corresponding to the equipment monitoring point, and determining the actual temperature of the internal conductor of the equipment based on the actual temperature data and the monitoring mathematical model, so as to accurately monitor the temperature of the internal conductor of the non-contact GIS equipment.

Description

Technical Field

[0001] The present application relates to the technical field of power equipment monitoring, and in particular to a method and system for monitoring the temperature of internal conductors of non-contact GIS equipment. Background Art

[0002] Gas insulated switchgear (GIS) devices have been widely used in power systems due to their excellent technical performance, strong current capacity, and compact structure. However, as GIS equipment has been in operation for many years, various defects have gradually been exposed. Among them, heating defects are mainly caused by problems such as excessive current density of the internal conductor of the equipment, poor conductor contact, and increased contact resistance, which lead to internal conductor overheating, aging of insulation parts, and decreased current capacity of GIS equipment during operation, resulting in reduced insulation performance and causing power grid accidents such as short circuits.

[0003] At present, the relevant technologies mainly measure the temperature of the internal conductor of GIS through three methods: thermocouple temperature measurement, infrared sensor temperature measurement and fiber Bragg grating temperature measurement. The installation of thermocouples is complicated and requires regular calibration, while infrared sensor temperature measurement is greatly affected by the environment and the measurement results are not accurate enough. The cost of fiber Bragg grating temperature measurement is high and it is difficult to achieve large-scale application. In addition, the three methods are mainly used when serious faults occur in GIS equipment. It is difficult to achieve real-time monitoring of the internal conductor temperature of GIS equipment and does not meet the safety requirements of GIS equipment. Of course, there are also a small number of related technologies that monitor the internal conductor temperature of GIS equipment through simulation, but they do not comprehensively consider multiple influencing factors, resulting in the need to improve the prediction accuracy. Therefore, there is an urgent need for a method that can effectively monitor the internal conductor temperature of GIS equipment. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the present application proposes a non-contact GIS equipment internal conductor temperature monitoring method and system to solve the problem that GIS equipment cannot effectively and accurately monitor the internal conductor temperature in real time.

[0005] In order to achieve the above objectives, in a first aspect, the present application provides a non-contact GIS equipment internal conductor temperature monitoring method, comprising:

[0006] Acquire parameter information of the GIS device, and establish a thermal simulation mathematical model according to the parameter information, wherein the parameter information at least includes attribute parameters of an outer shell of the GIS device, gas in the air chamber, a contact conductor and a busbar conductor, operating parameters of the GIS device, and environmental parameters;

[0007] Inputting at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model, and outputting the temperature field distribution data inside the GIS device;

[0008] Determine, according to the temperature field distribution data, first temperature data of the contact conductor of the GIS device and second temperature data of part of the gas chamber gas within the monitoring point of the GIS device;

[0009] Establishing a monitoring mathematical model based on multivariate linear fitting according to the first temperature data and the second temperature data;

[0010] Collect the corresponding part of the GIS equipment monitoring point The actual temperature data of the gas is used to determine the actual temperature of the internal conductor of the GIS device based on the actual temperature data and the monitoring mathematical model.

[0011] In some embodiments, the parameter information of the GIS device is obtained, and a thermal simulation mathematical model is established according to the parameter information, wherein the parameter information at least includes property parameters of an outer shell of the GIS device, gas in the air chamber, a contact conductor and a busbar conductor, operating parameters of the GIS device, and environmental parameters, including:

[0012] According to the parameter information, a physical model of the GIS device is established, and a heat transfer path of the GIS device is determined, wherein the heat transfer path includes a heat conduction mode, a heat radiation mode, and a convection cooling mode;

[0013] Based on the heat transfer path and the parameter information, a corresponding heat transfer mathematical model is established, wherein the heat transfer mathematical model includes a heat conduction mathematical model, a convection cooling mathematical model and a heat radiation mathematical model;

[0014] The thermal simulation mathematical model is established based on the heat transfer mathematical model and the physical model.

[0015] In some embodiments, based on the heat transfer path and the parameter information, a corresponding heat transfer mathematical model is established, and the heat transfer mathematical model includes a heat conduction mathematical model, a convection cooling mathematical model, and a thermal radiation mathematical model, including:

[0016] According to the contact area between the contact conductor and the bus conductor and the temperature gradient, a heat conduction mathematical model corresponding to the GIS device is established, wherein the heat conduction mathematical model expression is: ,

[0017] In the formula, Q is the energy of heat conduction, λ is the thermal conductivity, A is the contact area between conductors, T is the temperature of the contact surface between conductors, is the distance in the length direction;

[0018] The convection cooling mathematical model and the thermal radiation mathematical model corresponding to the GIS device are established according to the attribute parameters, operation parameters and environmental parameters of the GIS device.

[0019] In some implementations, establishing the convection cooling mathematical model and the thermal radiation mathematical model corresponding to the GIS device according to the attribute parameters, the operating parameters and the environmental parameters of the GIS device includes:

[0020] The convection cooling mathematical model specifically includes the conservation of mass, conservation of momentum, conservation of energy in the gas domain, and conservation of energy in the solid domain corresponding to the GIS equipment, wherein:

[0021] The mass conservation expression is: ,

[0022] The momentum conservation expression is: ,

[0023] The energy conservation expression of the gas domain is: ,

[0024] The solid domain energy conservation expression is: ,

[0025] In the formula, i and j are 1, 2, and 3 respectively. i or j =1, In the coordinate system x direction; when i or j =2, In the coordinate system y direction; when i or j =3, In the coordinate system z direction; and The fluid in x , y , z The velocity component in the direction, p is the static pressure, is the dynamic viscosity coefficient of the fluid, and are the fluid and solid temperatures, is the density of the fluid, is the specific heat capacity of the fluid, and are the thermal conductivities of solid and fluid, respectively.

[0026] In some implementations, establishing the convection cooling mathematical model and the thermal radiation mathematical model corresponding to the GIS device according to the attribute parameters, the operating parameters and the environmental parameters of the GIS device includes:

[0027] The thermal radiation mathematical model expression is: ,

[0028] In the formula, E is the energy radiated per unit time, ε is the emissivity, σ is the Stepan-Boltzmann constant, A is the surface area of ​​the radiating body, T and T 0 are the radiator temperature and the ambient temperature respectively.

[0029] In some embodiments, determining the first temperature data of the contact conductor of the GIS device and the second temperature data of part of the gas chamber gas in the monitoring point of the GIS device according to the temperature field distribution data includes:

[0030] Get the partial SF corresponding to the monitoring point of the GIS equipment under the same conditions 6 The actual temperature of the gas;

[0031] Determining a collection location of the gas temperature of the gas chamber in the temperature field distribution cloud map according to the temperature value and the temperature field distribution data;

[0032] Based on the acquisition site, the second temperature data is determined.

[0033] In some embodiments, establishing a monitoring mathematical model based on multivariate linear fitting according to the first temperature data and the second temperature data includes:

[0034] According to multiple sets of the first temperature data and the second temperature data obtained by multiple simulations, a monitoring mathematical model is established based on multivariate linear fitting, wherein the monitoring mathematical model expression is: ,

[0035] Where Y is the predicted temperature output by the model, X is the actual temperature collected at the monitoring point, and a, b, and c are coefficients respectively.

[0036] Compared with the prior art, the technical solution provided by the embodiment of the present application includes at least the following beneficial effects or advantages:

[0037] 1) Through the established GIS equipment thermal simulation mathematical model, the thermal simulation mathematical model combines the comprehensive effects of various factors such as the size of contact resistance, the ambient temperature of the equipment, the current intensity and solar radiation, and establishes heat transfer pathways including heat conduction mode, heat radiation mode and convection cooling mode. In the actual simulation process, the accuracy of the internal conductor temperature in the GIS equipment thermal simulation model is guaranteed. At the same time, the temperature data corresponding to the contact conductor and part of the air chamber gas in the monitoring point are obtained by combining the temperature field distribution data output by the thermal simulation. Finally, according to the temperature data corresponding to multiple groups of contact conductors and part of the air chamber gas in the monitoring point determined by the simulation, a monitoring mathematical model is established based on multivariate linear fitting. Based on the monitoring mathematical model, accurate monitoring of the internal conductor temperature of non-contact GIS equipment is realized. In practical applications, the reading of the density relay can also be used to determine whether the internal conductor is over-temperature, thereby ensuring the safe operation of the GIS equipment.

[0038] 2) When determining the temperature data corresponding to the gas in some gas chambers within the monitoring point after simulation, the method of this application fully considers the SF 6 When the gas is heated, the kinetic energy of the gas molecules increases and the density decreases. Under the action of gravity, the SF with high temperature and low density 6 The gas floats to the top, while the rest of the SF 6 The gas is deposited at the bottom, forming a temperature gradient where the gas temperature at the top is high and the gas temperature at the bottom is low. For the temperature data corresponding to the gas in the air chamber, combined with the actual collected SF corresponding to the GIS equipment monitoring point 6 The actual temperature value of the gas is used to determine the collection location of the gas chamber gas temperature of the temperature field distribution cloud diagram based on the temperature value. The simulated output gas chamber gas temperature data is obtained based on the collection location, thereby reducing the error between the actual measured temperature and the simulated temperature.

[0039] In a second aspect, the present application provides a non-contact GIS equipment internal conductor temperature monitoring system, comprising:

[0040] An acquisition module is configured to acquire parameter information of a GIS device, wherein the parameter information includes at least attribute parameters of an outer shell, gas in an air chamber, a contact conductor and a busbar conductor of the GIS device, operating parameters of the GIS device, and environmental parameters;

[0041] A simulation module is configured to establish a thermal simulation mathematical model according to the parameter information, input at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model, and output the temperature field distribution data inside the GIS device;

[0042] a temperature determination module configured to determine first temperature data of the contact conductor of the GIS device and second temperature data of a portion of the gas chamber gas within a monitoring point of the GIS device according to the temperature field distribution data;

[0043] A model building module is configured to establish a monitoring mathematical model based on multivariate linear fitting according to the first temperature data and the second temperature data;

[0044] The data processing module is configured to collect the corresponding part of the GIS equipment monitoring point The actual temperature data of the gas is used to determine the actual temperature of the internal conductor of the GIS device based on the actual temperature data and the monitoring mathematical model.

[0045] In a third aspect, the present application further provides an electronic device, including:

[0046] at least one processor; and

[0047] a memory communicatively connected to the at least one processor; wherein,

[0048] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the steps of the method for monitoring the temperature of internal conductors of non-contact GIS equipment provided in the first aspect above.

[0049] In a fourth aspect, the present application further provides a computer-readable storage medium having computer program instructions stored thereon, and when the computer program instructions are executed by a processor, the steps of the method for monitoring the temperature of an internal conductor of a non-contact GIS device provided in the first aspect are implemented.

[0050] It can be understood that the beneficial effects of the technical solutions provided in the second, third and fourth aspects can be found in the relevant description of the first aspect, and will not be repeated here.

[0051] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0053] Figure 1It is a flow chart of a method for monitoring the temperature of an internal conductor of a non-contact GIS device according to an embodiment of the present application;

[0054] Figure 2 is a structural schematic diagram of a GIS device according to an embodiment of the present application;

[0055] Figure 3 is a cross-sectional view of a GIS device along an axial direction according to an embodiment of the present application;

[0056] Figure 4 is a schematic diagram of heat transfer when the GIS equipment is working according to an embodiment of the present application;

[0057] Figure 5 is a temperature field distribution cloud diagram of the simulation output shown in the embodiment of the present application;

[0058] Figure 6 is a graph showing the contact resistance and the temperature coordinates of various structures in the GIS device according to an embodiment of the present application;

[0059] Figure 7 is a cross-sectional view of a GIS device in a vertical axis direction according to an embodiment of the present application;

[0060] Figure 8 is a coordinate curve diagram of the monitoring point temperature and the contact conductor temperature according to an embodiment of the present application;

[0061] Fig. 9 It is a block diagram of a non-contact GIS equipment internal conductor temperature monitoring system according to an embodiment of the present application;

[0062] Fig.10 It is a structural block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0063] The embodiments of the present application are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0064] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific implementations and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0065] See also Figures 1 to 8 , Figure 1The flowchart of the non-contact GIS equipment internal conductor temperature monitoring method provided in this embodiment is shown. Figure 2 The structure diagram of the GIS device provided in this embodiment is shown. Figure 3 FIG. 4 shows a cross-sectional view of the GIS device provided in this embodiment along the axial direction. Figure 4 The figure shows a schematic diagram of heat transfer when the GIS device provided in this embodiment is working. Figure 5 The temperature field distribution cloud diagram of the simulation output provided in this embodiment is shown. Figure 6 The contact resistance provided in this embodiment and the temperature coordinate curve of each structure in the GIS device are shown. Figure 7 A cross-sectional view of the GIS device provided in this embodiment in the vertical axis direction is shown. Figure 8 The coordinate curve diagram of the monitoring point temperature and the contact conductor temperature provided by this embodiment is shown.

[0066] like Figures 1 to 8 As shown, this embodiment provides a non-contact GIS equipment internal conductor temperature monitoring method, the method comprising:

[0067] Step S100: Acquire parameter information of the GIS device, and establish a thermal simulation mathematical model according to the parameter information, wherein the parameter information at least includes attribute parameters of an outer shell of the GIS device, gas in the air chamber, a contact conductor and a busbar conductor, operating parameters of the GIS device, and environmental parameters;

[0068] In this step, we first introduce the specific structure of the GIS equipment in this implementation, and then Figure 2 and Figure 3 Gas insulated switchgear (GIS) is a high-voltage switchgear used in power systems. GIS equipment mainly includes a cylindrical outer shell, a busbar conductor arranged in the outer shell, and a contact conductor arranged at the connection between the busbar conductor and the busbar conductor. The outer shell is surrounded by a closed gas chamber filled with sulfur hexafluoride gas (SF 6 Gas) as insulating medium, SF 6 Gas has extremely high electrical insulation strength and can withstand higher voltages. It also has good arc extinguishing ability, which enables it to effectively extinguish arcs when disconnecting high-voltage currents, preventing arc damage to equipment. It is understandable that GIS equipment is an existing equipment structure, and other components on GIS equipment will not be elaborated here.

[0069] Optionally, in order to create a thermal simulation mathematical model, first obtain the structural parameter data of each component of the GIS equipment, such as size, and the attribute parameter data of each component, such as the material properties of each component. Of course, thermal parameters, etc., and establish a corresponding physical model based on the parameters of these GIS equipment. It should be noted that the physical model can be created using existing three-dimensional simulation software, and the specific creation process will not be elaborated here. At the same time, the parameters required for the creation process of the physical model can be selectively adjusted according to actual needs, and there is no limitation here.

[0070] Optionally, after establishing the basic physical model, according to the contact condition of the conductors inside the GIS equipment, the Joule heat generated when the current passes through the conductor and the Joule heat of the contact resistance generated by poor conductor contact are used as heat sources to determine the appropriate heat source settings to determine the input parameters of the thermal simulation mathematical model simulation process. In order to improve the accuracy of the thermal simulation mathematical model simulation results, the heat transfer of the GIS equipment is analyzed, combined with Figure 4 As shown in the figure, various factors such as contact resistance, ambient temperature of the equipment, current intensity and solar radiation in different scenarios are considered to determine the heat transfer paths including heat conduction mode, heat radiation mode and convection cooling mode, thereby ensuring the accuracy of the internal conductor temperature in the thermal simulation model of GIS equipment.

[0071] Specifically, after determining the heat transfer path of the GIS equipment, a corresponding heat transfer mathematical model is established according to the heat transfer path and parameter information. The heat transfer mathematical model includes a heat conduction mathematical model, a convection cooling mathematical model and a heat radiation mathematical model. Based on the heat transfer mathematical model and the physical model, a thermal simulation mathematical model is established. However, in the related art, various factors such as load current, ambient temperature of the equipment, current intensity and solar radiation are not used as the basis for building the simulation model, resulting in errors in the simulation results. In order to determine the heat conduction process between the contact conductor and the bus conductor, a heat conduction mathematical model corresponding to the GIS equipment is established according to the contact area and temperature gradient between the contact conductor and the bus conductor. The heat conduction mathematical model expression is: ,

[0072] Where Q is the energy of heat conduction, in W; λ is the thermal conductivity, in W / (m·K); A is the contact area between conductors, in m 2 ; T is the temperature of the contact surface between conductors, in K; is the distance in the length direction; it should be noted that when current passes through, the heat generated by the bus conductor is significantly less than that of the contact conductor, that is, the contact conductor is the main heat source, and its heat conduction process mainly occurs at the connection between the bus conductor and the contact conductor.

[0073] Optionally, according to the attribute parameters, operation parameters and environmental parameters of the GIS equipment, a convection cooling mathematical model and a thermal radiation mathematical model corresponding to the GIS equipment are established, wherein the convection heat transfer satisfies the three equations of mass conservation equation, momentum conservation equation and energy conservation equation. In order to improve the accuracy of the simulation results of the simulation model, the energy conservation process fully considers the gas domain and the gas domain energy conservation. Specifically, the convection cooling mathematical model includes the mass conservation equation, the momentum conservation equation, the gas domain energy conservation equation and the solid domain energy conservation equation;

[0074] The mass conservation equation is: ,

[0075] The momentum conservation equation is: ,

[0076] The energy conservation equation in the gas domain is: ,

[0077] The energy conservation equation for the solid domain is: ,

[0078] In the formula, and ( i, j =1, 2, 3) are respectively expressed as x , y , z Direction, specific, when i or j =1, In the coordinate system x direction, when i or j =2, In the coordinate system y direction, when i or j =3, In the coordinate system z direction, and ( i, j =1, 2, 3) represent the fluid x , y , z The velocity component in the direction is in m / s. Specifically, u 1. u 2 and u 3 are x , y , z The velocity component in the direction; p is the static pressure, in Pa; is the dynamic viscosity coefficient of the fluid, in kg / (m·s), and are the fluid and solid temperatures respectively, in K, is the density of the fluid, in kg / m3, is the specific heat capacity of the fluid, in J / (kg· K); and are the thermal conductivity of solid and fluid respectively, with the unit of W / (m·K).

[0079] Optionally, the mathematical model expression for thermal radiation in the mathematical model for heat transfer is: , where E is the energy radiated per unit time, ε is the emissivity, σ is the Stepan-Boltzmann constant, about 5.67×10^-8W / (m 2 ·k 4 ), A is the surface area of ​​the radiating body, T and T 0 are the radiator temperature and the ambient temperature respectively, in K.

[0080] It should be noted that the surface area of ​​the radiator is the circumferential surface area of ​​the conductor in the GIS equipment, and the temperature of the radiator is the temperature of the conductor in the GIS equipment. The heating defects in the GIS equipment are mainly caused by the increase of contact resistance at the contact position of the conductor, and the heat transfer between the conductors is rapid and short. Based on this, the temperature of the contact conductor and the bus conductor is almost the same. When performing thermal radiation calculations, the contact conductor and the bus conductor can be analyzed as a whole.

[0081] Step S200: inputting at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model, and outputting the temperature field distribution data inside the GIS device;

[0082] In this step, after the thermal simulation mathematical model is established, the temperature field distribution data inside the GIS equipment is output by inputting at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model. Specifically, Figure 5 As shown, Figure 5 This is an example of temperature field distribution data output by the thermal simulation mathematical model in this step. The temperature field distribution data consists of a temperature field distribution cloud map with different colors representing different temperatures. From the temperature field distribution cloud map, the temperature distribution of each area in the GIS device can be intuitively obtained. For example, in the temperature field distribution cloud map, the temperature of the inner conductor is 35 degrees Celsius, and for the SF in the air chamber 6 The temperature distribution of the gas is uneven. For the outer shell, the temperature is 22 degrees Celsius. It can be understood that Figure 5It only shows the temperature field distribution cloud diagram of a certain longitudinal section of the GIS equipment in the simulation results, but in the actual simulation, the results can show the temperature distribution of the entire GIS equipment, that is, through simulation, the temperature distribution of the contact conductor, busbar conductor and SF 6 Temperature change of the gas.

[0083] It should be noted that in order to obtain multiple sets of temperature field distribution data, multiple simulations can be performed by changing the input parameters. For example, the contact resistance between the contact conductor and the busbar conductor can be changed for multiple tests to obtain the contact conductor, busbar conductor and SF after the contact resistance changes. 6 The temperature change of the gas, combined with Figure 6 As shown in one example, the contact resistance of the contact conductor, busbar conductor and SF is simulated at 10, 20, 30, 40, 50 and 60 microohms respectively. 6 The temperature change of the gas can be seen from the figure. The temperature of the contact conductor is the highest and the amplitude of the change is the largest. Through this curve, we can also get the temperature change of the contact conductor and SF under the same contact resistance. 6 The temperature variation of the gas.

[0084] Step S300: determining first temperature data of the contact conductor of the GIS equipment and second temperature data of gas in a part of the gas chamber within the monitoring point of the GIS equipment according to the temperature field distribution data;

[0085] In this step, the first temperature data of the contact conductor of the GIS equipment and the second temperature data of the gas in the gas chamber of the monitoring point of the GIS equipment are determined by the temperature field distribution data obtained by simulation. It should be noted that in some GIS equipment, the monitoring point has been determined during the production process, and the monitoring point is often located near the bottom of the GIS equipment. A density relay is installed at the monitoring point, which can monitor the SF near the monitoring point in the GIS equipment. 6 However, in the simulated temperature field distribution cloud map, due to the SF near the conductor 6 The gas is heated first, in this part SF 6 After the gas is heated, the kinetic energy of the gas molecules increases and the density decreases. Due to the effect of gravity, this part of SF 6 The gas floats to the top, while the remaining cooler SF 6 The gas is deposited at the bottom, forming a temperature gradient with high gas temperature at the top and low gas temperature at the bottom, such as Figure 5 As shown in Figure 2, if the actual GIS equipment monitoring point location is used as the simulation SF 6The location of gas temperature collection results in a large error between the second temperature data obtained by simulation and the actual temperature data actually collected by the density relay, which reduces the accuracy of temperature monitoring of the subsequent monitoring mathematical model.

[0086] Therefore, in order to improve the accuracy of temperature monitoring of the subsequent monitoring mathematical model, the density relay is used to collect part of the SF corresponding to the GIS equipment monitoring point under the same conditions. 6 The actual temperature value of the gas may be the same as the contact resistance, ambient temperature and current parameters flowing through the conductor under the same conditions. The collection point of the gas temperature in the air chamber in the temperature field distribution cloud map is determined according to the actual temperature value and the temperature field distribution data, and then the second temperature data is determined based on the collection point. After the collection point is determined, the temperature data at the corresponding position of the temperature field distribution cloud map simulated output under different contact resistances is read each time as the second temperature data.

[0087] At the same time, since the temperature change of the corresponding acquisition point may have a slight error with the actual temperature increase of the monitoring point, in order to further improve the accuracy of temperature monitoring of the monitoring mathematical model, two monitoring points can be selected near the bottom of the GIS device by analyzing the temperature field distribution cloud map and the actual temperature value. Figure 7 and Figure 8 As shown, monitoring point one and monitoring point two are selected in the GIS equipment, and then through multiple simulation analyses, multiple groups of data with the contact conductor temperature and the temperature data corresponding to monitoring point one and monitoring point two are obtained. By comparing the two groups of data, data with smaller errors can be selected, thus further improving the accuracy of the monitoring mathematical model.

[0088] Step S400: establishing a monitoring mathematical model based on multivariate linear fitting according to the first temperature data and the second temperature data;

[0089] In this step, after multiple simulations to obtain the first temperature data of the contact conductor and the second temperature data of the gas in the gas chamber of the GIS equipment monitoring point, combined with Figure 8 As shown, the range of the monitoring point temperature can be selected according to the maximum and minimum values ​​of the monitoring point temperature. Similarly, the range of the contact conductor temperature can be selected according to the maximum and minimum values ​​of the contact conductor temperature. Then, a monitoring mathematical model is established based on multivariate linear fitting. The expression of the monitoring mathematical model is: , where Y is the predicted temperature output by the model, X is the actual temperature collected at the monitoring point, a, b, and c are coefficients, and Figure 8 In the above example, through actual multivariate linear fitting, the fitting equation of monitoring point 1 can be obtained as follows: , the fitting equation of monitoring point 2 is .

[0090] It should be noted that multivariate linear fitting is a statistical method for modeling and predicting the linear relationship between multiple independent variables and a dependent variable. In this step, multiple sets of first temperature data and second temperature data can be obtained by calculation through existing electronic devices. The specific fitting process is not described here. For example, the multivariate linear fitting process can be implemented in Python:

[0091] #Suppose there is a dataset containing two columns of features and target values

[0092] data = pd.DataFrame({

[0093] 'Temperature1':[22,24,23,26,27],

[0094] 'Temperature2':[30,32,31,29,28],

[0095] 'Target':[60,62,61,65,66]

[0096] }); #Temperature1 and Temperature2 are independent variables (features) used for prediction, and Target is the dependent variable (target), that is, the predicted value;

[0097] #Extract independent and dependent variables

[0098] X=data[['Temperature1','Temperature2']]

[0099] y = data['Target'];

[0100] # Split the data into training and test sets

[0101] X_train,X_test,y_train,y_test=train_test_split(X,y,test_size=0.2,random_state=42), #train_test_split function randomly splits data, usually used to evaluate the generalization ability of the model, X and y are input data and target values, test_size=0.2 means that 20% of the data is used as a test set and the remaining 80% is used as a training set, random_state=42 is to set the random seed to ensure that the data division is consistent each time it is run.

[0102] #Create a regression model and fit it

[0103] model=LinearRegression()#Linear regression model

[0104] model.fit(X_train,y_train); #Train linear regression model

[0105] #predict

[0106] y_pred=model.predict(X_test); #The trained model predicts the test set X_test;

[0107] # Output regression coefficients and intercept

[0108] print(f"Regression coefficient:{model.coef_}")

[0109] print(f"Intercept:{model.intercept_}");

[0110] #Evaluate the model

[0111] print(f"Mean Squared Error (MSE):{mean_squared_error(y_test,y_pred)}") #Calculate the mean squared error between the true value y_test and the predicted value y_pred

[0112] print(f"Determination coefficient (R^2):{r2_score(y_test,y_pred)}"); #r2_score function measures the fitting effect of the model.

[0113] Through the above-mentioned multivariate linear fitting program model, multiple groups of first temperature data and second temperature data points can be fitted into a high-precision linear relationship. Of course, it can be understood that the above is only an exemplary implementation method of multivariate linear fitting, and it can also be performed according to other methods. The specific selection is based on actual needs.

[0114] Step S500: Collect the corresponding part of the GIS equipment monitoring point The actual temperature data of the gas is used to determine the actual temperature of the internal conductor of the GIS equipment based on the actual temperature data and the monitoring mathematical model.

[0115] In this step, after completing the monitoring mathematical model, the temperature sensor in the density relay collects part of the SF in the corresponding monitoring point of the GIS equipment. 6The actual temperature data of the gas is input into the monitoring mathematical model to obtain the actual temperature of the internal conductor of the GIS equipment. It should be noted that by establishing a monitoring mathematical model and continuously collecting part of the SF in the monitoring point through the density relay 6 The actual temperature data of the gas can realize continuous monitoring of the temperature of the internal conductor of the GIS equipment. At the same time, a high temperature alarm threshold can also be set. That is, when the monitored temperature is greater than the high temperature alarm threshold, it will be fed back to the alarm device to remind the staff. Of course, the device required for the specific implementation of the alarm function can be selected according to actual needs, which will not be elaborated here.

[0116] In the above method steps, a thermal simulation mathematical model of GIS equipment is established. The thermal simulation mathematical model takes into account the comprehensive effects of various factors such as the size of the contact resistance, the ambient temperature of the equipment, the current intensity and the solar radiation, and establishes a heat transfer path including a heat conduction mode, a heat radiation mode and a convection cooling mode. In the actual simulation process, the accuracy of the internal conductor temperature in the thermal simulation model of the GIS equipment is guaranteed. At the same time, the temperature data corresponding to the contact conductor and part of the air chamber gas in the monitoring point are obtained by combining the temperature field distribution data output by the thermal simulation. Finally, according to the temperature data corresponding to multiple groups of contact conductors and part of the air chamber gas in the monitoring point determined by the simulation, a monitoring mathematical model is established based on multivariate linear fitting. Through this monitoring mathematical model, accurate monitoring of the internal conductor temperature of the non-contact GIS equipment is achieved.

[0117] Also, when determining the temperature data corresponding to the gas in the part of the gas chamber within the monitoring point after simulation, full consideration should be given to the SF 6 When the gas is heated, the kinetic energy of the gas molecules increases and the density decreases. Under the action of gravity, the SF with high temperature and low density 6 The gas floats to the top, while the rest of the SF 6 The gas is deposited at the bottom, forming a temperature gradient where the gas temperature at the top is high and the gas temperature at the bottom is low. For the temperature data corresponding to the gas in the air chamber, combined with the actual collected SF corresponding to the GIS equipment monitoring point 6 The actual temperature value of the gas is used to determine the collection location of the gas chamber gas temperature of the temperature field distribution cloud diagram based on the temperature value. The simulated output gas chamber gas temperature data is obtained based on the collection location, thereby reducing the error between the actual measured temperature and the simulated temperature.

[0118] See also Fig. 9 , Fig. 9 The block diagram of a non-contact GIS equipment internal conductor temperature monitoring system provided by the present embodiment is shown. The non-contact GIS equipment internal conductor temperature monitoring system 200 includes:

[0119] The acquisition module 210 is configured to acquire parameter information of the GIS device, wherein the parameter information at least includes attribute parameters of an outer shell, gas in the air chamber, contact conductors and busbar conductors of the GIS device, operating parameters of the GIS device, and environmental parameters;

[0120] The simulation module 220 is configured to establish a thermal simulation mathematical model according to the parameter information, input at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model, and output the temperature field distribution data inside the GIS device;

[0121] The temperature determination module 230 is configured to determine the first temperature data of the contact conductor of the GIS device and the second temperature data of the gas in the gas chamber of the monitoring point of the GIS device according to the temperature field distribution data;

[0122] A model building module 240 is configured to establish a monitoring mathematical model based on multivariate linear fitting according to the first temperature data and the second temperature data;

[0123] The data processing module 250 is configured to collect the corresponding part of the GIS equipment monitoring point The actual temperature data of the gas is used to determine the actual temperature of the internal conductor of the GIS device based on the actual temperature data and the monitoring mathematical model.

[0124] It is understandable that, in the implementation of the non-contact GIS equipment internal conductor temperature monitoring system 200 in this embodiment, each module runs the above Figures 1 to 8 The steps of a non-contact GIS equipment internal conductor temperature monitoring method in the corresponding embodiment, and the technical effects that can be achieved can refer to the above Figures 1 to 8 The description of the technical effects achieved in the corresponding embodiments will not be repeated here.

[0125] See also Fig.10 , Fig.10 5 is a block diagram of a structure of an electronic device provided in an embodiment of the present application. The server 500 of the electronic device includes: a processor 501, a memory 502, and a computer program 503 stored in the memory 502 and executable on the processor 501, such as a program of a method for monitoring the temperature of an internal conductor of a non-contact GIS device. When the processor 501 executes the computer program 503, the steps of the method for monitoring the temperature of an internal conductor of a non-contact GIS device in the above-mentioned embodiments are implemented, such as Figure 1 Alternatively, the processor 501 executes the computer program 503 to implement the above Fig. 9 The functions of each module in the corresponding embodiment are, for example, Fig. 9For details on the functions of the modules (eg, acquisition module 210), please refer to Fig. 9 The relevant descriptions in the corresponding embodiments are not repeated here.

[0126] Exemplarily, the computer program 503 may be divided into one or more units, one or more units are stored in the memory 502, and are executed by the processor 501 to complete the technical solution provided in the above embodiment. One or more units may be a series of computer program instruction segments that can complete specific functions, and the instruction segments are used to describe the execution process of the computer program 503 in the server 500.

[0127] The electronic device may include, but is not limited to, a processor 501 and a memory 502. Those skilled in the art will appreciate that Fig.10 It is only an example of the server 500 in the electronic device and does not constitute a limitation of the server 500. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the turntable terminal device may also include an input and output terminal device, a network access terminal device, a bus, etc.

[0128] The processor 501 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0129] The memory 502 may be an internal storage unit of the server 500, such as a hard disk or memory of the server 500. The memory 502 may also be an external storage terminal device of the server 500, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the server 500. Further, the memory 502 may also include both an internal storage unit of the server 500 and an external storage terminal device. The memory 502 is used to store computer programs and other programs and data required by the turntable terminal device. The memory 502 may also be used to temporarily store data that has been output or is to be output.

[0130] In some embodiments, a computer-readable storage medium is also provided, which stores a computer program. When the computer program is executed by a processor, the steps of the method for monitoring the temperature of an internal conductor of a non-contact GIS device as described in the above embodiment are implemented.

[0131] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0132] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Among them, the computer-readable storage medium can be non-volatile or volatile. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable storage medium may include: any entity or device capable of carrying computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium, etc.

[0133] The terms "first", "second", "third", etc. in the specification and claims of the present application and the drawings are used to distinguish different objects rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a series of steps or units are included, or optionally, steps or units not listed are included, or optionally, other steps or units inherent to these processes, methods, products or devices are included.

[0134] Only the part relevant to the present application is shown in the accompanying drawings, but not all of the content. Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processing or methods depicted as flow charts. Although the flow chart describes each operation (or step) as a sequential process, many of the operations therein can be implemented in parallel, concurrently or simultaneously. In addition, the order of each operation can be rearranged. When its operation is completed, the process can be terminated, but it can also have additional steps not included in the accompanying drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0135] The terms "component", "module", "system", "unit", etc. used in this specification are used to represent computer-related entities, hardware, firmware, a combination of hardware and software, software, or software in execution. For example, a unit can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or distributed between two or more computers. In addition, these units can be executed from various computer-readable media having various data structures stored thereon. Units can communicate through local and / or remote processes, for example, based on signals having one or more data packets (e.g., data from a second unit interacting with another unit in a local system, a distributed system, and / or a network. For example, the Internet interacts with other systems via signals).

[0136] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0137] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Mentioning "embodiment" in this article means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present embodiment application. The appearance of this phrase in various positions in the specification is not necessarily the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0138] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

[0139] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

Claims

1. A non-contact GIS equipment internal conductor temperature monitoring method, characterized in that: include: Acquire parameter information of the GIS device, and establish a thermal simulation mathematical model according to the parameter information, wherein the parameter information at least includes attribute parameters of an outer shell of the GIS device, gas in the air chamber, a contact conductor and a busbar conductor, operating parameters of the GIS device, and environmental parameters; Inputting at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model, and outputting the temperature field distribution data inside the GIS device; Determine the first temperature data of the contact conductor of the GIS device and the second temperature data of part of the gas chamber in the monitoring point of the GIS device according to the temperature field distribution data, including obtaining the actual temperature value of part of the SF6 gas corresponding to the monitoring point of the GIS device under the same conditions, determine the collection position of the gas chamber temperature in the temperature field distribution cloud map according to the temperature value and the temperature field distribution data, and determine the temperature data at the corresponding position of the temperature field distribution cloud map simulated output under different contact resistances based on the collection position as the second temperature data; According to the first temperature data and the second temperature data, a monitoring mathematical model is established based on multivariate linear fitting, and according to multiple groups of the first temperature data and the second temperature data obtained by multiple simulations, a monitoring mathematical model is established based on multivariate linear fitting, wherein the monitoring mathematical model expression is: , where Y is the predicted conductor temperature output by the model, X is the actual temperature collected at the monitoring point, and a, b, and c are coefficients respectively; Collect the corresponding part of the GIS equipment monitoring point The actual temperature data of the gas is used to determine the actual temperature of the internal conductor of the GIS device based on the actual temperature data and the monitoring mathematical model.

2. A non-contact GIS equipment internal conductor temperature monitoring method according to claim 1, characterized in that: The step of obtaining parameter information of the GIS device and establishing a thermal simulation mathematical model according to the parameter information, wherein the parameter information at least includes property parameters of an outer shell, gas in the air chamber, a contact conductor and a busbar conductor of the GIS device, operating parameters of the GIS device and environmental parameters, includes: According to the parameter information, a physical model of the GIS device is established, and a heat transfer path of the GIS device is determined, wherein the heat transfer path includes a heat conduction mode, a heat radiation mode, and a convection cooling mode; Based on the heat transfer path and the parameter information, a corresponding heat transfer mathematical model is established, wherein the heat transfer mathematical model includes a heat conduction mathematical model, a convection cooling mathematical model and a heat radiation mathematical model; The thermal simulation mathematical model is established based on the heat transfer mathematical model and the physical model.

3. A non-contact GIS equipment internal conductor temperature monitoring method according to claim 2, characterized in that: Based on the heat transfer path and the parameter information, a corresponding heat transfer mathematical model is established, and the heat transfer mathematical model includes a heat conduction mathematical model, a convection cooling mathematical model and a heat radiation mathematical model, including: According to the contact area between the contact conductor and the bus conductor and the temperature gradient, a heat conduction mathematical model corresponding to the GIS device is established, wherein the heat conduction mathematical model expression is: , In the formula, Q is the energy of heat conduction, λ is the thermal conductivity, A is the contact area between conductors, T is the temperature of the contact surface between conductors, is the distance in the length direction; The convection cooling mathematical model and the thermal radiation mathematical model corresponding to the GIS device are established according to the attribute parameters, operation parameters and environmental parameters of the GIS device.

4. A non-contact GIS equipment internal conductor temperature monitoring method according to claim 3, characterized in that: The step of establishing the convection cooling mathematical model and the heat radiation mathematical model corresponding to the GIS device according to the attribute parameters, the operation parameters and the environmental parameters of the GIS device includes: The convection cooling mathematical model specifically includes the conservation of mass, conservation of momentum, conservation of energy in the gas domain, and conservation of energy in the solid domain corresponding to the GIS equipment, wherein: The mass conservation expression is: , The momentum conservation expression is: , The energy conservation expression of the gas domain is: , The solid domain energy conservation expression is: , In the formula, i and j are 1, 2, and 3 respectively. i or j =1, In the coordinate system x direction; when i or j =2, In the coordinate system y direction; when i or j =3, In the coordinate system z direction; and The fluid in x , y , z The velocity component in the direction, p is the static pressure, is the dynamic viscosity coefficient of the fluid, and are the fluid and solid temperatures, is the density of the fluid, is the specific heat capacity of the fluid, and are the thermal conductivities of solid and fluid, respectively.

5. The method for monitoring the internal conductor temperature of a non-contact GIS device according to claim 3, characterized in that: The step of establishing the convection cooling mathematical model and the heat radiation mathematical model corresponding to the GIS device according to the attribute parameters, the operation parameters and the environmental parameters of the GIS device includes: The thermal radiation mathematical model expression is: , In the formula, E is the energy radiated per unit time, ε is the emissivity, σ is the Stepan-Boltzmann constant, A is the surface area of ​​the radiating body, T and T 0 are the radiator temperature and the ambient temperature respectively.

6. A non-contact GIS equipment internal conductor temperature monitoring system, characterized in that: include: An acquisition module is configured to acquire parameter information of a GIS device, wherein the parameter information includes at least attribute parameters of an outer shell, gas in an air chamber, a contact conductor and a busbar conductor of the GIS device, operating parameters of the GIS device, and environmental parameters; A simulation module is configured to establish a thermal simulation mathematical model according to the parameter information, input at least the contact resistance between the contact conductor and the bus conductor and the current data passing through the conductor into the thermal simulation mathematical model, and output the temperature field distribution data inside the GIS device; A temperature determination module is configured to determine, according to the temperature field distribution data, first temperature data of the contact conductor of the GIS device and second temperature data of part of the gas chamber gas within the monitoring point of the GIS device, including obtaining the actual temperature value of part of the SF6 gas corresponding to the monitoring point of the GIS device under the same conditions, determining the collection position of the gas chamber temperature in the temperature field distribution cloud map according to the temperature value and the temperature field distribution data, and determining, based on the collection position, the temperature data at the corresponding position of the temperature field distribution cloud map simulated output under different contact resistances as the second temperature data; The model building module is configured to establish a monitoring mathematical model based on multivariate linear fitting according to the first temperature data and the second temperature data, wherein the monitoring mathematical model expression is: , where Y is the predicted conductor temperature output by the model, X is the actual temperature collected at the monitoring point, and a, b, and c are coefficients respectively; The data processing module is configured to collect the corresponding part of the GIS equipment monitoring point The actual temperature data of the gas is used to determine the actual temperature of the internal conductor of the GIS device based on the actual temperature data and the monitoring mathematical model.

7. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the steps of a method for monitoring the temperature of an internal conductor of a non-contact GIS device as described in any one of claims 1-5.

8. A computer-readable storage medium having computer program instructions stored thereon, characterized in that: When the computer program instructions are executed by the processor, the steps of a method for monitoring the temperature of an internal conductor of a non-contact GIS device as described in any one of claims 1-5 are implemented.

Images