A PCB component detection method, system, storage medium and computer device

Abstract

The present invention relates to the technical field of PCBs, and specifically discloses a method, a system, a storage medium, and a computer device for detecting PCB components. The present invention first obtains the appearance feature information and the internal feature information of the solder joints between the individual pins of the PCB component and the PCB, then respectively obtains the corresponding external connection feature index and the internal connection feature index according to the appearance feature information and the internal feature information of the solder joints, calculates the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index, and determines whether there is at least one solder joint connection index corresponding to a pin that exceeds a preset value. If so, it is determined that the detection result of the PCB component is unqualified; if not, it is determined that the detection result of the PCB component is qualified. Such a clear quality division facilitates quality control and product screening during the production process, and at the same time can accurately judge the quality standard of the connection between the PCB component and the PCB.

Description

Technical Field

[0001] The present invention relates to the technical field of PCBs, and in particular to a method, system, storage medium and computer device for detecting PCB components. Background Technique

[0002] PCB, whose full name is Printed Circuit Board, that is, printed circuit board, also known as printed wiring board, is an important electronic component. PCB is an indispensable basic component in electronic devices. It provides a platform for connecting electronic components together through circuits, so as to realize various functions of the device. PCB components refer to various electronic components and devices installed on a printed circuit board (PCB). These components play different functional roles in the circuit and jointly constitute a complete electronic system.

[0003] Usually, the single pin of a PCB component is fixed to the PCB by welding. Among them, welding is to correspond the single pin of the PCB component to a preset installation on the PCB and then connect them by soldering. After the single pin of the PCB component is connected to the PCB, it is necessary to detect the welding of the connection between the single pin of the PCB component and the PCB. Usually, the detection needs to be carried out by taking pictures with a CCD camera for comparison and judgment. However, although the above judgment method can judge whether it is different from the standard requirements, it cannot standardize the welding quality of PCB components. Therefore, a method, system, storage medium and computer device for detecting PCB components are needed to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a method, system, storage medium and computer device for detecting PCB components to solve the technical problems mentioned in the above background technique.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A method for detecting PCB components, including:

[0007] Obtain the welding feature information of each pin of the PCB component and the PCB, where the welding feature information includes the appearance feature information of the solder joint and the internal feature information of the solder joint;

[0008] Obtain the surface connection information of the solder joint and the installation position information of the PCB component according to the appearance feature information of the solder joint, and obtain the wetting angle of the solder joint and the coverage information of the solder joint according to the surface connection information of the solder joint;

[0009] Obtain the external connection feature index according to the wetting angle of the solder joint, the installation position information of the PCB component and the coverage information of the solder joint;

[0010] Obtain the internal crack length of the solder joint based on the internal feature information of the solder joint, and obtain the internal connection feature index according to the internal crack length of the solder joint;

[0011] Calculate the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index;

[0012] Determine whether there is at least one solder joint connection index corresponding to a pin exceeding a preset value;

[0013] If there is, it is determined that the detection result of the PCB component is unqualified;

[0014] If not, it is determined that the detection result of the PCB component is qualified.

[0015] Preferably, the step of obtaining the solder joint surface connection information and the PCB component installation position information according to the solder joint appearance feature information, and obtaining the solder joint wetting angle and the solder joint coverage information according to the solder joint surface connection information includes:

[0016] Obtain the solder joint part image information according to the solder joint appearance feature information, where the solder joint part image information includes the solder joint area, the PCB component pin area, and the PCB installation area;

[0017] Obtain the solder joint contour area of the solder joint area based on Canny edge detection;

[0018] Obtain the coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area, and use the coverage area information as the solder joint surface connection information;

[0019] Perform edge detection and analysis on the PCB component pin area and the PCB installation area based on the edge detection algorithm to obtain the PCB component pin edge information and the PCB installation edge information, and use the area corresponding to the PCB installation edge information as the PCB component installation position information;

[0020] Obtain the side edge contour of the solder joint area based on Canny edge detection;

[0021] Obtain the lower surface position coordinates and the side tangent point coordinates of the solder joint according to the side edge contour, and extend the lower surface position coordinates to one end to obtain an extension line;

[0022] Connect the extension line and the side tangent point coordinates to obtain a tangent point connection line;

[0023] Obtain the angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as the solder joint wetting angle;

[0024] Obtain the first area of the solder joint area;

[0025] Obtain the second area of the PCB installation area, and obtain the solder joint occupancy ratio according to the ratio of the first area and the second area, and use the numerical information corresponding to the solder joint occupancy ratio as the solder joint coverage information.

[0026] Preferably, the step of obtaining the external connection feature index according to the solder joint wetting angle, the PCB component installation position information and the solder joint coverage information includes:

[0027] Obtain the standard solder joint wetting angle;

[0028] Calculate the solder joint wetting angle index according to the standard solder joint wetting angle and the solder joint wetting angle, where the calculation formula is:

[0029] ;

[0030] Among them, R(Z) represents the solder joint wetting angle index, R(J) represents the solder joint wetting angle, R(J) max represents the standard solder joint wetting angle, and σ represents the error coefficient of the solder joint wetting angle;

[0031] Obtain the corresponding first solder joint occupancy ratio according to the solder joint coverage information, and use the first solder joint occupancy ratio as the solder joint coverage index;

[0032] Obtain the PCB component installation position image according to the PCB component installation position information;

[0033] Obtain a plurality of pixel points according to the PCB component installation position image, where the PCB installation image is a set composed of a plurality of pixel points;

[0034] Obtain the plurality of plane positioning coordinates of the plurality of pixel points in the PCB component installation position image;

[0035] Obtain the total number of pixel points in the PCB component installation position image according to the plurality of pixel points;

[0036] Calculate the central plane position coordinates of the PCB component installation position image according to the plurality of pixel points, the plurality of plane positioning coordinates and the total number of pixel points, where the calculation formula is:

[0037] ;

[0038] Among them, Z(x, y) represents the central plane position coordinates, Xi represents the coordinate value of the i-th pixel point on the X-axis, yi represents the coordinate value of the i-th pixel point on the y-axis of the pixel point, n represents the total number of pixel points in the PCB component installation position image, where i is the number of the plurality of pixel points, i = 1, 2, 3... n;

[0039] Obtain the first central coordinate of the PCB installation area, and use the first central coordinate as the origin coordinate, and calculate the offset distance according to the origin coordinate and the central plane position coordinate;

[0040] Obtain the maximum allowable offset distance, and calculate the offset index according to the maximum allowable offset distance and the offset distance. The calculation formula is:

[0041] ;

[0042] where, P(Y) represents the offset index, J(L) represents the solder joint wetting angle, and J(L) max represents the maximum allowable offset distance;

[0043] Perform weighted calculation on the solder joint wetting angle index, solder joint coverage index and offset index to obtain the solder joint comprehensive installation index, and use the solder joint comprehensive installation index as the external connection feature index.

[0044] Preferably, the step of obtaining the internal crack length of the solder joint according to the internal feature information of the solder joint and obtaining the internal connection feature index according to the internal crack length of the solder joint includes:

[0045] Obtain the area of the solder joint in the top view state according to the internal feature information of the solder joint;

[0046] Based on ultrasonic detection, obtain the number of bubbles and the bubble area inside the solder joint;

[0047] Calculate the solder joint bubble influence coefficient according to the area of the solder joint in the top view state, the number of bubbles and the bubble area. The calculation formula is:

[0048] ;

[0049] where, K(z) represents the solder joint bubble influence coefficient, G(D) o represents the bubble area, and z(m) o represents the area of the o-th solder joint in the top view state, and o represents the numbering of the number of bubbles, where o = 1, 2, 3... k;

[0050] Based on ultrasonic detection, obtain the internal crack information of the solder joint within the area of the solder joint in the top view state, where the internal crack information of the solder joint includes the number of internal cracks of the solder joint and the lengths of multiple internal cracks of the solder joint;

[0051] Calculate the solder joint internal crack influence coefficient according to the area of the solder joint in the top view state and the lengths of multiple internal cracks of the solder joint. The calculation formula is:

[0052] ;

[0053] Among them, N(B) represents the influence coefficient of internal cracks in solder joints, and L(W) h represents the length of the internal crack of the h-th solder joint, and z(m) h represents the area of the h-th solder joint in the top view state. h represents the serial number of the internal crack length of the solder joint and the area of the solder joint in the top view state. Among them, h = 1, 2, 3... t;

[0054] Perform weighted calculation on the solder joint bubble influence coefficient and the solder joint internal crack influence coefficient to obtain the solder joint comprehensive crack index, and use the solder joint comprehensive crack index as the internal connection characteristic index.

[0055] Preferably, the step of calculating the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index includes:

[0056] Obtain the first weight value of the external connection characteristic index;

[0057] Calculate the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index. The calculation formula is:

[0058] ;

[0059] Among them, L(j) represents the solder joint connection quality index, W(B) represents the external connection characteristic index, N(B) represents the internal connection characteristic index, and A represents the first weight value.

[0060] Preferably, after the step of determining that the detection result of the PCB component is qualified if it does not exist, it includes:

[0061] Calculate the average solder joint connection quality index according to the multiple solder joint connection quality indexes;

[0062] Judge whether the average solder joint connection quality index meets the preset threshold range;

[0063] When the average solder joint connection quality index does not meet the preset threshold range and is less than the minimum value of the preset threshold range, it is determined that the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a defective product;

[0064] When the average solder joint connection quality index meets the preset threshold range, it is determined that the connection quality between the single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a standard product;

[0065] When the average solder joint connection quality index does not meet the preset threshold range and is greater than the maximum value of the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a high-quality product.

[0066] The present application also provides a PCB component detection system, including:

[0067] A first acquisition module, configured to acquire welding feature information of each pin of the PCB component and the PCB, where the welding feature information includes solder joint appearance feature information and solder joint internal feature information;

[0068] A second acquisition module, configured to acquire solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information, and acquire a solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information;

[0069] A third acquisition module, configured to acquire an external connection feature index according to the solder joint wetting angle, PCB component installation position information, and solder joint coverage information;

[0070] A fourth acquisition module, configured to acquire the length of internal cracks in the solder joint according to the solder joint internal feature information, and acquire an internal connection feature index according to the length of internal cracks in the solder joint;

[0071] A first calculation module, configured to calculate a solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index;

[0072] A first judgment module, configured to judge whether there is at least one solder joint connection index corresponding to a pin exceeding a preset value;

[0073] If so, it is determined that the detection result of the PCB component is unqualified;

[0074] If not, it is determined that the detection result of the PCB component is qualified.

[0075] Preferably, the second acquisition module includes:

[0076] A first acquisition unit, configured to acquire solder joint part image information according to the solder joint appearance feature information, where the solder joint part image information includes a solder joint area, a PCB component pin area, and a PCB installation area;

[0077] A second acquisition unit, configured to acquire the solder joint contour area of the solder joint area based on Canny edge detection;

[0078] A third acquisition unit, configured to acquire coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area, and use the coverage area information as solder joint surface connection information;

[0079] A second parsing unit, configured to perform edge detection and parsing on the PCB component pin region and the PCB mounting region based on an edge detection algorithm, obtain PCB component pin edge information and PCB mounting edge information, and use the region corresponding to the PCB mounting edge information as PCB component mounting position information;

[0080] A fourth acquisition unit, configured to obtain a side edge profile of the solder joint region based on Canny edge detection;

[0081] A fifth acquisition unit, configured to obtain the lower surface position coordinates and side tangent point coordinates of the solder joint according to the side edge profile, and extend the lower surface position coordinates towards one end to obtain an extension line;

[0082] A second connection unit, configured to connect the extension line and the side tangent point coordinates to obtain a tangent point connection line;

[0083] A sixth acquisition unit, configured to obtain the angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as the solder joint wetting angle;

[0084] A seventh acquisition unit, configured to obtain a first area of the solder joint region;

[0085] An eighth acquisition unit, configured to obtain a second area of the PCB mounting region, and obtain a solder joint occupancy ratio according to the ratio of the first area to the second area, and use the numerical information corresponding to the solder joint occupancy ratio as solder joint coverage information.

[0086] The present application further provides a computer device, including a memory and a processor, where the memory stores a computer program, and when the processor executes the computer program, the steps of the above method are implemented.

[0087] The present application further provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above method are implemented.

[0088] The beneficial effects of this application are as follows: First, according to the solder joint appearance feature information, the surface connection information of the solder joint and the installation position information of the PCB component are obtained. Then, based on the surface connection information of the solder joint, the wetting angle and the coverage information of the solder joint are obtained. Next, according to the wetting angle of the solder joint, the installation position information of the PCB component, and the coverage information of the solder joint, the external connection feature index is obtained. Then, according to the internal feature information of the solder joint, the internal crack length of the solder joint is obtained, and the internal connection feature index is obtained based on the internal crack length of the solder joint. At the same time, according to the external connection feature index and the internal connection feature index, the solder joint connection quality index of each pin is calculated, and it is determined whether there is at least one solder joint connection index corresponding to a pin exceeding the preset value. If so, it is determined that the detection result of the PCB component is unqualified; if not, it is determined that the detection result of the PCB component is qualified. In this way, the welding quality of the PCB component and the PCB is divided according to the solder joint connection quality index, such as defective products, standard products, and high-quality products. This clear quality division facilitates quality control and product screening during the production process, ensuring that unqualified products are promptly processed or improved, qualified products are used normally, and high-quality products can represent high-quality products, improving production efficiency and the stability of product quality. At the same time, it also helps to meet the diverse needs of different customers for product quality. Furthermore, through the above division, the quality standard of the connection between the PCB component and the PCB can be accurately judged. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] Figure 1 It is a schematic flowchart of the method according to an embodiment of this application.

[0090] Figure 2 It is a schematic structural diagram of the system according to an embodiment of this application.

[0091] Figure 3 It is a schematic internal structure diagram of a computer device according to an embodiment of this application.

[0092] Figure 4 It is a schematic structural diagram of the offset distance of the PCB component according to an embodiment of this application.

[0093] Figure 5 It is a schematic internal structure diagram of the solder joint according to an embodiment of this application.

[0094] The realization, functional features, and advantages of the purpose of this application will be further described in conjunction with the embodiments with reference to the drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0095] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0096] As Figures 1 - 3 shown, this application provides a method for detecting a PCB component, including:

[0097] S1. Obtain the welding feature information of each pin of the PCB component and the PCB, where the welding feature information includes the solder joint appearance feature information and the solder joint internal feature information;

[0098] S2. Obtain the solder joint surface connection information and the PCB component installation position information according to the solder joint appearance feature information, and obtain the solder joint wetting angle and the solder joint coverage information according to the solder joint surface connection information;

[0099] S3. Obtain the external connection feature index according to the solder joint wetting angle, the PCB component installation position information and the solder joint coverage information;

[0100] S4. Obtain the internal crack length of the solder joint according to the solder joint internal feature information, and obtain the internal connection feature index according to the internal crack length of the solder joint;

[0101] S5. Calculate the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index;

[0102] S6. Determine whether there is at least one solder joint connection index corresponding to a pin exceeding a preset value;

[0103] If there is, it is determined that the detection result of the PCB component is unqualified;

[0104] If not, it is determined that the detection result of the PCB component is qualified.

[0105] As described in the above steps S1 - S6, after a single pin of a PCB component is connected to the PCB, it is necessary to detect the connection between the single pin of the PCB component and the PCB. Usually, the detection needs to be carried out by comparing and judging through the method of taking pictures with a CCD camera. However, although the above judgment method can determine whether it is different from the standard requirements, it cannot standardize the welding quality of the PCB component. Therefore, the present invention first obtains the welding characteristic information of each pin of the PCB component and the PCB. Among them, the welding characteristic information includes the appearance characteristic information of the solder joint and the internal characteristic information of the solder joint. In this way, through the appearance characteristic information and the internal characteristic information of the solder joint, the connection state between a single pin of the PCB component and the PCB can be comprehensively judged. Since an accurate installation position can ensure the normal layout and signal transmission of the circuit, therefore, according to the appearance characteristic information of the solder joint, the surface connection information of the solder joint and the installation position information of the PCB component are obtained. In this way, the surface connection information of the solder joint and the installation position information of the PCB component can be used to judge the welding quality of the solder joint on the PCB, and provide a basic basis for obtaining the wetting angle and solder joint coverage information of the subsequent solder joint. And according to the surface connection information of the solder joint, the wetting angle and solder joint coverage information of the solder joint are obtained. The wetting angle of the solder joint refers to the contact angle between the solder joint formed by the solder on the PCB and the surface of the PCB. This angle can be used to evaluate the wettability of the solder, and then judge the quality of the solder joint. The solder joint coverage information refers to the ratio of the solder joint formed by the solder on the PCB in the preset installation position. Then, according to the wetting angle of the solder joint, the installation position information of the PCB component and the solder joint coverage information, the external connection characteristic index is obtained. Since the external connection characteristic index synthesizes multiple key appearance factors, it can comprehensively and objectively quantify the appearance connection quality of the solder joint, and provide effective data support for subsequent quality judgment. Since the bubble area and crack length will reduce the mechanical strength of the solder joint and increase the resistance of the electrical connection, therefore, it is necessary to obtain the internal crack length of the solder joint according to the internal characteristic information of the solder joint. The acquisition method is based on ultrasonic detection, and according to the internal crack length of the solder joint, the internal connection characteristic index is obtained. Through the internal connection characteristic index, the quality status of the internal connection of the solder joint can be quantified, and at the same time, the influence degree of internal defects on the overall quality of the solder joint can be effectively evaluated. Immediately afterwards, according to the external connection characteristic index and the internal connection characteristic index, the solder joint connection quality index of each pin is calculated. In this way, through the combination of internal and external parameters, the connection quality of the solder joint can be comprehensively and fully reflected, and a comprehensive and balanced quantification index is provided for accurately judging the connection quality of the solder joint. Then, it is judged whether there is at least one solder joint connection index corresponding to a pin exceeding the preset value. If so, it is determined that the detection result of the PCB component is unqualified. If not, it is determined that the detection result of the PCB component is qualified. Therefore, the welding quality of the PCB component can be divided according to the average solder joint connection quality index. In this way, the welding quality of the PCB component and the PCB is divided according to the solder joint connection quality index.For example, they are divided into defective products, standard products, high-quality products, etc. This clear quality division facilitates quality control and product screening during the production process, ensuring that unqualified products are promptly processed or improved, qualified products are used normally, and high-quality products can represent high-quality products, improving production efficiency and the stability of product quality. At the same time, it also helps to meet the diverse quality requirements of different customers. Furthermore, through the above division, the quality standard of the connection between PCB components and the PCB can be accurately judged.

[0106] In one embodiment, step S2 of obtaining solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information and obtaining the solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information includes:

[0107] S201. Obtain solder joint part image information according to the solder joint appearance feature information, where the solder joint part image information includes the solder joint area, the PCB component pin area, and the PCB installation area, and the acquisition method is based on collection by a camera, magnifying glass, microscope, etc.;

[0108] S202. Perform grayscale and binarization processing on the solder joint part image information to obtain a black image and a white image, where the black image is the solder joint area, and the white image includes the PCB component pin area and the PCB installation area;

[0109] S203. Obtain the solder joint contour area of the solder joint area based on Canny edge detection;

[0110] S204. Obtain the coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area, and use the coverage area information as the solder joint surface connection information;

[0111] S205. Perform edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as the PCB component installation position information;

[0112] S206. Obtain the side edge contour of the solder joint area based on Canny edge detection;

[0113] S207. Obtain the lower surface position coordinates and side tangent point coordinates of the solder joint according to the side edge contour, and extend the lower surface position coordinates to one end to obtain an extension line;

[0114] S208. Connect the extension line and the side tangent point coordinates to obtain a tangent point connection line;

[0115] S209. Obtain the angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as the solder joint wetting angle;

[0116] S2010. Obtain the first area of the solder joint area;

[0117] S2011. Obtain the second area of the PCB installation area, obtain the solder joint occupancy ratio according to the ratio of the first area to the second area, and use the numerical information corresponding to the solder joint occupancy ratio as the solder joint coverage information.

[0118] As described in the above steps S201 - S2011, the present invention first obtains the image information of the solder joint part according to the appearance feature information of the solder joint. Among them, the image information of the solder joint part includes the solder joint area, the PCB component pin area, and the PCB installation area. The acquisition method is based on collection by cameras, magnifying glasses, microscopes, etc. By collecting the image information of the solder joint part based on a camera, it can provide data support for the subsequent analysis of the solder joint connection situation and the installation position of the PCB component. In this way, the image information of the solder joint part can be quickly analyzed, and the contours and boundaries of these areas are easier to identify and analyze, providing convenient conditions for subsequent operations based on algorithms such as edge detection. Then, based on Canny edge detection, the solder joint contour area of the solder joint area is obtained. The solder joint contour area can provide a basis for obtaining the subsequent solder joint surface connection information. On this basis, the coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area can be obtained, and the coverage area information is used as the solder joint surface connection information. In this way, through the solder joint surface connection information, the connection degree between the solder joint and the pin and the installation area can be intuitively displayed. A good coverage area means that the solder is reasonably distributed on the pin and the installation area, which helps to ensure the reliability of the electrical connection and the mechanical stability, and at the same time provides a key basis for further analyzing the integrity of the solder joint connection. Then, based on the edge detection algorithm, edge detection and analysis are performed on the PCB component pin area and the PCB installation area to obtain the PCB component pin edge information and the PCB installation edge information, and the area corresponding to the PCB installation edge information is used as the PCB component installation position information. Accurate installation position information is crucial for ensuring the correct installation of the PCB component on the PCB. It is related to the overall layout rationality of the circuit, the signal transmission path, and the mutual cooperation between components. At the same time, it can also judge whether there are problems such as component installation offset or misalignment. Then, based on Canny edge detection, the side edge contour of the solder joint area is obtained. Among them, the side edge contour refers to the perspective contour of the solder joint viewed from the side. The side edge contour of the solder joint area can provide the necessary geometric shape information for calculating the solder joint wetting angle. Then, according to the side edge contour, the lower surface position coordinates and the side tangent point coordinates of the solder joint are obtained, and the lower surface position coordinates are extended to one end to obtain an extension line. Then, the extension line and the side tangent point coordinates are connected to obtain a tangent point connection line. Then, according to the connection line and the tangent point connection line, the angle between the connection line and the tangent point connection line is obtained, and the angle between the connection line and the tangent point connection line is used as the solder joint wetting angle. The solder joint wetting angle calculated in this way is an important indicator for measuring the spreading degree of the solder on the solder joint surface and the wettability with the welded surface. A suitable wetting angle indicates that the solder can adhere well to the solder joint surface, form a reliable intermetallic compound, and ensure the electrical connection performance and mechanical strength of the solder joint. An abnormal wetting angle may indicate problems in the welding process.For example, improper soldering temperature, solder quality problems, or poor surface treatment, etc., which affect the quality of solder joints. Therefore, this step is crucial for evaluating the quality of solder joints. Since appropriate solder joint coverage can ensure the stability of electrical connections of solder joints, preventing problems such as open circuit risks caused by insufficient coverage or short - circuit hazards caused by excessive coverage. Therefore, obtain the first area of the solder joint area, then obtain the second area of the PCB installation area, and obtain the solder joint occupancy ratio according to the ratio of the first area and the second area. Use the numerical information corresponding to the solder joint occupancy ratio as the solder joint coverage information. In this way, the solder joint occupancy ratio can quantify the coverage degree of the solder on the installation area and can also evaluate one of the important appearance indicators of the solder joint connection quality.

[0119] In one embodiment, the step S3 of obtaining the external connection characteristic index according to the solder joint wetting angle, PCB component installation position information, and solder joint coverage information includes:

[0120] S301. Obtain the standard wetting angle of the solder joint;

[0121] S302. Calculate the solder joint wetting angle index according to the standard wetting angle of the solder joint and the solder joint wetting angle, where the calculation formula is:

[0122] ;

[0123] Among them, R(Z) represents the solder joint wetting angle index, R(J) represents the solder joint wetting angle, R(J) max represents the standard wetting angle of the solder joint, and σ represents the error coefficient of the solder joint wetting angle;

[0124] S303. Obtain the corresponding first solder joint occupancy ratio according to the solder joint coverage information and use the first solder joint occupancy ratio as the solder joint coverage index;

[0125] S304. Obtain the PCB component installation position image according to the PCB component installation position information;

[0126] S305. Obtain a plurality of pixel points according to the PCB component installation position image, where the PCB installation image is a set composed of a plurality of pixel points;

[0127] S306. Obtain a plurality of planar positioning coordinates of the plurality of pixel points in the PCB component installation position image;

[0128] S307. Obtain the total number of pixel points in the PCB component installation position image according to the plurality of pixel points;

[0129] S308. Calculate the central plane position coordinates of the PCB component installation position image according to the plurality of pixel points, the plurality of planar positioning coordinates, and the total number of pixel points, where the calculation formula is:

[0130] ;

[0131] Among them, Z(x, y) represents the coordinate of the central plane position, Xi represents the coordinate value of the i-th pixel point on the X-axis, yi represents the coordinate value of the i-th pixel point on the y-axis of the pixel point, n represents the total number of pixel points in the PCB component installation position image, where i is the number of multiple pixel points, and i = 1, 2, 3... n;

[0132] S309. Obtain the first central coordinate of the PCB installation area, and use the first central coordinate as the origin coordinate, and calculate the offset distance according to the origin coordinate and the central plane position coordinate;

[0133] S3010. Obtain the maximum allowable offset distance, and calculate the offset index according to the maximum allowable offset distance and the offset distance. The calculation formula is:

[0134] ;

[0135] Among them, P(Y) represents the offset index, J(L) represents the solder joint wetting angle, and J(L) max represents the maximum allowable offset distance;

[0136] S3011. Perform weighted calculation on the solder joint wetting angle index, the solder joint coverage index and the offset index to obtain the solder joint comprehensive installation index, and use the solder joint comprehensive installation index as the external connection feature index.

[0137] As described in the above steps S301 - S3011, the present invention first obtains the standard wetting angle of the solder joint, and then calculates the solder joint wetting angle index according to the standard wetting angle of the solder joint and the wetting angle of the solder joint. The solder joint wetting angle index can quantify the deviation degree between the wetting angle of the solder joint and the standard wetting angle. The error coefficient in the formula can be adjusted according to actual production requirements and process characteristics to more accurately reflect the influence of the wetting angle deviation on the solder joint quality in different situations. Through the solder joint wetting angle index, the quality of the solder joint wetting can be intuitively understood. For example, the closer the index is to 1, the closer the wetting angle is to the standard, and the more reliable the solder joint quality is in this factor. The smaller the index, the greater the deviation of the wetting angle from the standard, and there may be soldering problems. Since the quality of soldering can be judged by the area of the solder joint covering the PCB installation area (soldering hole), and it needs to reach a preset covering area. For example: for solder joints covering general electronic products, the solder should cover at least 75% of the pad; for solder joints covering high - performance electronic products, the solder should cover at least 95% of the pad. Therefore, it is necessary to obtain the corresponding first solder joint occupancy ratio according to the solder joint covering information, and use the first solder joint occupancy ratio as the solder joint covering index. The solder joint covering index clearly defines the relative size of the solder joint covering area in numerical form and clearly reflects the covering degree of the solder on the solder joint. Among them, the closer the first solder joint occupancy ratio is to 1, the better the solder joint covering is, and the risk of poor electrical connection caused by insufficient covering can be effectively reduced, which is also one of the criteria for evaluating quality. On the contrary, a smaller covering index indicates that there may be a problem of insufficient covering, affecting the reliability of the solder joint. Since the sum of the X - axis and Y - axis coordinates of all pixel points can be obtained respectively, and then the sum of the coordinate values of all pixel points is obtained. Dividing the sum by the total number of pixel points, the obtained value is the average value of these coordinate values, and the average value is the coordinate of the centroid. The centroid represents the geometric center (the central position on the plane) of these pixel points, that is, the average position of the coordinates of all pixel points. On this basis, the PCB component installation position image can be obtained according to the PCB component installation position information, and then multiple pixel points can be obtained according to the PCB component installation position image. Among them, the PCB installation image is a set composed of multiple pixel points. Immediately afterwards, obtain the multiple plane positioning coordinates of the multiple pixel points in the PCB component installation position image, then obtain the total number of pixel points in the PCB component installation position image according to the multiple pixel points, and then calculate the central plane position coordinates of the PCB component installation position image according to the multiple pixel points, multiple plane positioning coordinates and total pixel points. In this way, the PCB component installation position image is obtained according to the PCB component installation position information, and then multiple pixel points in the image, their plane positioning coordinates and the total number of pixel points are obtained, providing a data basis for subsequent calculation of the central plane position coordinates. And the central plane position coordinates can accurately represent the central position of the component installation position on the plane. Since the component is composed of a component body and pins, after determining the central position of the component body on the plane, its main body position is located.The pins only need to be rotationally corresponded to the PCB mounting area. Therefore, the central position on the plane is crucial for judging whether the component is accurately mounted. Then, the first central coordinate of the PCB mounting area is obtained, and the first central coordinate is used as the origin coordinate. The offset distance is calculated according to the origin coordinate and the central plane position coordinate (as shown in Figure 4 ). In this way, the offset distance intuitively reflects the deviation degree of the actual mounting position of the PCB component relative to the ideal position (origin coordinate). The larger the offset distance, the greater the possible mounting error and the greater the impact on the solder joint connection quality and circuit performance. Since the maximum allowable offset distance of electronic components is a key parameter to ensure the welding quality and electrical connection reliability. For example, for general resistors and capacitors, the maximum allowable offset distance is 10% to 20% of the pad width. If the pad width is 1 mm, the maximum allowable offset distance is 0.1 mm to 0.2 mm. For small IC chips (such as SOP, SOIC), the maximum allowable offset distance is 10% of the pad width. If the pad width is 0.5 mm, the maximum allowable offset distance is 0.05 mm. For large IC chips (such as QFP, BGA), the maximum allowable offset distance is 5% to 10% of the pad width. If the pad width is 1 mm, the maximum allowable offset distance is 0.05 mm to 0.1 mm. Therefore, it is necessary to obtain the maximum allowable offset distance, and calculate the offset index according to the maximum allowable offset distance and the offset distance. The offset index compares the offset distance with the allowable maximum offset range and represents the severity of the offset degree in numerical form. The closer the offset index is to 1, the smaller the offset and the higher the mounting quality. The smaller the offset index, the greater the degree that the offset exceeds the allowable range, which may cause problems such as uneven stress on the solder joints and unstable electrical connections, thus affecting the performance and reliability of the entire PCB assembly. Finally, the solder joint wetting angle index, solder joint coverage index, and offset index are weighted and calculated to obtain the solder joint comprehensive mounting index, and the solder joint comprehensive mounting index is used as the external connection feature index. In this way, through the external connection feature index, the appearance connection quality of the solder joints can be comprehensively and objectively quantified, providing an important component for calculating the solder joint connection quality index in combination with the internal connection feature index later, so as to realize a more comprehensive and accurate evaluation of the solder joint connection quality.

[0138] In one embodiment, the step S4 of obtaining the internal crack length of the solder joint according to the internal feature information of the solder joint and obtaining the internal connection feature index includes:

[0139] S401. Obtain the area of the solder joint in the top view state according to the internal feature information of the solder joint;

[0140] S402. Based on ultrasonic detection, obtain the number and area of air bubbles inside the solder joint;

[0141] S403. Calculate the solder joint bubble influence coefficient based on the area, number of bubbles, and bubble area of the solder joint in the top view state. The calculation formula is as follows:

[0142] ;

[0143] where K(z) represents the solder joint bubble influence coefficient, and G(D) o represents the bubble area, and z(m) o represents the area of the o-th solder joint in the top view state. o represents the serial number of the number of bubbles, where o = 1, 2, 3... k;

[0144] S404. Based on ultrasonic detection, obtain the internal crack information of the solder joint within the area of the solder joint in the top view state. The internal crack information of the solder joint includes the number of internal cracks of the solder joint and the lengths of multiple internal cracks of the solder joint;

[0145] S405. Calculate the internal crack influence coefficient of the solder joint based on the area of the solder joint in the top view state and the lengths of multiple internal cracks of the solder joint. The calculation formula is as follows:

[0146] ;

[0147] where N(B) represents the internal crack influence coefficient of the solder joint, and L(W) h represents the length of the h-th internal crack of the solder joint, and z(m) h represents the area of the h-th solder joint in the top view state. h represents the serial number of the length of the internal crack of the solder joint and the area of the solder joint in the top view state, where h = 1, 2, 3... t;

[0148] Perform weighted calculation on the solder joint bubble influence coefficient and the internal crack influence coefficient of the solder joint to obtain the solder joint comprehensive crack index, and use the solder joint comprehensive crack index as the internal connection characteristic index.

[0149] As described in the above steps S401 - S405, since ultrasonic flaw detection is a non - destructive testing method that uses the acoustic wave propagation characteristics of ultrasonic waves to detect internal defects in materials. The basic principle of ultrasonic flaw detection is to use ultrasonic waves generated by a transmitter. When it encounters an interface of substances with different densities and sound velocities, reflection and refraction will occur, and the detector can receive these reflection and refraction signals. By analyzing the waveform and sound velocity of these signals, the position and size of internal defects in the material can be known. Weld bubbles, as a common welding defect, will have an obvious impact on the mechanical properties and sealing performance of the weld. When detecting the weld, the ultrasonic detector will emit a series of ultrasonic signals. When the signals encounter bubbles in the weld, reflection or refraction will occur, and the probe can receive these signals. By analyzing parameters such as the amplitude, frequency, phase, and time delay of the reflection and refraction signals, the position, size, and distribution of bubbles inside the weld can be determined. Therefore, the present invention can first obtain the area of the solder joint in the top - down state with the assistance of ultrasonic waves according to the internal characteristic information of the solder joint. Among them, the area of the solder joint in the top - down state is the cross - sectional contour area at the top - down view angle. Then, based on ultrasonic detection, the number and area of bubbles inside the solder joint are obtained, and the solder joint bubble influence coefficient is calculated according to the area of the solder joint in the top - down state, the number of bubbles, and the bubble area. Among them, the bubble area refers to the space area inside the solder joint that is not filled with solder. These bubbles are usually formed because the gas cannot completely escape during the welding process and usually exist in series in the solder joint (as shown in Figure 5 ), so that the solder joint bubble influence coefficient can intuitively reflect the overall influence degree of bubbles in the solder joint in numerical form. The larger the solder joint bubble influence coefficient, the larger the proportion of bubbles inside the solder joint, and the more serious the negative impact on the quality of the solder joint. At the same time, through the solder joint bubble influence coefficient, the influence degree on the overall structural integrity and performance of the solder joint can be evaluated. Then, based on ultrasonic detection, the internal crack information of the solder joint inside the area of the solder joint in the top - down state is obtained. Among them, the internal crack information of the solder joint includes the number of internal cracks of the solder joint and the lengths of multiple internal cracks of the solder joint. Then, the solder joint internal crack influence coefficient is calculated according to the area of the solder joint in the top - down state and the lengths of multiple internal cracks of the solder joint. In this way, the influence of internal cracks on the quality of the solder joint can be quantified through the solder joint internal crack influence coefficient, and the severity of cracks inside the solder joint can be intuitively understood. Finally, the solder joint bubble influence coefficient and the solder joint internal crack influence coefficient are weighted and calculated to obtain the solder joint comprehensive crack index, and the solder joint comprehensive crack index is used as the internal connection characteristic index. Through the internal connection characteristic index, the connection status between the PCB component and the inside of the PCB can be comprehensively reflected, providing an effective basis for the quality judgment of the subsequent connection between the PCB component and the PCB.

[0150] In one embodiment, step S5 of calculating the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index includes:

[0151] S501. Obtain the first weight value of the external connection feature index;

[0152] S502. Calculate the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index, where the calculation formula is:

[0153] ;

[0154] where L(j) represents the solder joint connection quality index, W(B) represents the external connection feature index, N(B) represents the internal connection feature index, and A represents the first weight value.

[0155] As described in the above steps S501 - S502, the present invention first obtains the first weight value of the external connection feature index, and then calculates the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index. In this way, the solder joint connection quality index can comprehensively and integrally reflect the overall quality status of the solder joint connection, avoiding the one-sidedness of evaluating the solder joint quality only relying on a single feature or some features. Through the solder joint connection quality index, the quality of different solder joints can be intuitively compared and sorted, providing accurate data support for subsequent classifying the soldering quality of PCB components and PCBs according to the quality index, thereby realizing the effective hierarchical management of the solder joint connection quality, helping to screen out products of different quality grades during the production process, ensuring the consistency and stability of product quality, and improving production efficiency and product reliability.

[0156] In one embodiment, after step S6 of determining that the detection result of the PCB component is qualified if it does not exist, it includes:

[0157] S7. Calculate the average solder joint connection quality index according to the multiple solder joint connection quality indexes;

[0158] S8. Determine whether the average solder joint connection quality index meets the preset threshold range;

[0159] When the average solder joint connection quality index does not meet the preset threshold range and is less than the minimum value of the preset threshold range, it is determined that the connection quality of a single pin of the PCB component corresponding to the solder joint connection quality index with the PCB is a defective product;

[0160] When the average solder joint connection quality index meets the preset threshold range, it is determined that the connection quality of a single pin of the PCB component corresponding to the solder joint connection quality index with the PCB is a standard product;

[0161] When the average solder joint connection quality index does not meet the preset threshold range and is greater than the maximum value of the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a high-quality product.

[0162] As described in the above steps S7 - S8, the present invention first calculates the average solder joint connection quality index based on multiple solder joint connection quality indexes, and determines whether the average solder joint connection quality index meets the preset threshold range. When the average solder joint connection quality index does not meet the preset threshold range and is less than the minimum value of the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a defective product. When the average solder joint connection quality index meets the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a standard product. When the average solder joint connection quality index does not meet the preset threshold range and is greater than the maximum value of the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a high-quality product. Such a clear quality division facilitates quality control and product screening during the production process, ensures that unqualified products are promptly processed or improved, qualified products are used normally, and high-quality products can be used as representatives of high-quality products, improving production efficiency and the stability of product quality. At the same time, it also helps to meet the diverse needs of different customers for product quality. Furthermore, through the above division, the quality standard of the connection between a single pin of the PCB component and the PCB can be accurately judged.

[0163] This application also provides a PCB component detection system, including:

[0164] A first acquisition module 1, configured to acquire welding feature information of each pin of the PCB component and the PCB, where the welding feature information includes solder joint appearance feature information and solder joint internal feature information;

[0165] A second acquisition module 2, configured to acquire solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information, and acquire a solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information;

[0166] A third acquisition module 3, configured to acquire an external connection feature index according to the solder joint wetting angle, PCB component installation position information, and solder joint coverage information;

[0167] A fourth acquisition module 4, configured to acquire the length of internal cracks in the solder joint according to the solder joint internal feature information, and acquire an internal connection feature index according to the length of internal cracks in the solder joint;

[0168] The first calculation module 5 is configured to calculate the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index;

[0169] The first judgment module 6 is configured to judge whether there is at least one solder joint connection index corresponding to a pin exceeding a preset value;

[0170] If so, it is determined that the detection result of the PCB component is unqualified;

[0171] If not, it is determined that the detection result of the PCB component is qualified.

[0172] In one embodiment, the second acquisition module includes:

[0173] The first acquisition unit is configured to acquire the solder joint part image information according to the solder joint appearance feature information, wherein the solder joint part image information includes the solder joint area, the PCB component pin area, and the PCB installation area;

[0174] The second acquisition unit is configured to acquire the solder joint contour area of the solder joint area based on Canny edge detection;

[0175] The third acquisition unit is configured to acquire the coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area, and use the coverage area information as the solder joint surface connection information;

[0176] The second analysis unit is configured to perform edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain the PCB component pin edge information and the PCB installation edge information, and use the area corresponding to the PCB installation edge information as the PCB component installation position information;

[0177] The fourth acquisition unit is configured to acquire the side edge contour of the solder joint area based on Canny edge detection;

[0178] The fifth acquisition unit is configured to obtain the lower surface position coordinates and the side tangent point coordinates of the solder joint according to the side edge contour, and extend the lower surface position coordinates to one end to obtain an extension line;

[0179] The second connection unit is configured to connect the extension line and the side tangent point coordinates to obtain a tangent point connection line;

[0180] The sixth acquisition unit is configured to obtain the angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as the solder joint wetting angle;

[0181] The seventh acquisition unit is configured to acquire the first area of the solder joint area;

[0182] An eighth acquisition unit, configured to acquire a second area of the PCB installation area, and obtain a solder joint occupancy ratio according to a ratio of the first area to the second area, and use numerical information corresponding to the solder joint occupancy ratio as solder joint coverage information.

[0183] The present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method for PCB component detection are implemented.

[0184] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the above method embodiments. Among them, any reference to a memory, storage, database, or other medium provided in the present application and used in the embodiments can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0185] It should be noted that in this article, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, apparatus, article, or method including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, apparatus, article, or method. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, apparatus, article, or method including that element.

[0186] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A PCB component detection method, characterized in that, Including: Obtain the welding feature information of each pin of the PCB component and the PCB, where the welding feature information includes solder joint appearance feature information and solder joint internal feature information; Obtain the solder joint surface connection information and the PCB component installation position information according to the solder joint appearance feature information, and obtain the solder joint wetting angle and the solder joint coverage information according to the solder joint surface connection information; Obtain the external connection feature index according to the solder joint wetting angle, the PCB component installation position information and the solder joint coverage information; Obtain the standard solder joint wetting angle; Calculate the solder joint wetting angle index according to the standard solder joint wetting angle and the solder joint wetting angle, where the calculation formula is: ； Among them, R(Z) represents the solder joint wetting angle index, R(J) represents the solder joint wetting angle, and R(J) max represents the standard wetting angle of the solder joint, and σ represents the error coefficient of the solder joint wetting angle; Obtain the corresponding first solder joint occupancy ratio according to the solder joint coverage information, and use the first solder joint occupancy ratio as the solder joint coverage index; Obtain the PCB component installation position image according to the PCB component installation position information; Obtain a plurality of pixel points according to the PCB component installation position image, where the PCB installation image is a set composed of a plurality of pixel points; Obtain the multiple plane positioning coordinates of the multiple pixel points in the PCB component installation position image; Obtain the total number of pixel points in the PCB component installation position image according to the multiple pixel points; Calculate the central plane position coordinates of the PCB component installation position image according to the multiple pixel points, the multiple plane positioning coordinates and the total number of pixel points, where the calculation formula is: ； Where, Z(x, y) represents the central plane position coordinates, Xi represents the coordinate value of the i-th pixel point on the X-axis, yi represents the coordinate value of the i-th pixel point on the y-axis of the pixel points, n represents the total number of pixel points in the PCB component installation position image, where i is the number of the multiple pixel points, i = 1, 2, 3...n; Obtain the first central coordinates of the PCB installation area, and use the first central coordinates as the origin coordinates, and calculate the offset distance according to the origin coordinates and the central plane position coordinates; Obtain the maximum allowable offset distance, and calculate the offset index according to the maximum allowable offset distance and the offset distance, and the calculation formula is: ； Among them, P(Y) represents the offset exponent, and J(L) represents the offset distance. J(L) max represents the maximum allowable offset distance; Perform weighted calculation on the solder joint wetting angle index, the solder joint coverage index and the offset index to obtain the solder joint comprehensive installation index, and use the solder joint comprehensive installation index as the external connection feature index; Obtain the internal crack length of the solder joint according to the solder joint internal feature information, and obtain the internal connection feature index according to the internal crack length of the solder joint; Obtain the area of the solder joint in the top view state according to the solder joint internal feature information; Obtain the number of bubbles and the bubble area inside the solder joint based on ultrasonic detection; Calculate the solder joint bubble influence coefficient according to the area of the solder joint in the top view state, the number of bubbles and the bubble area, where the calculation formula is: ； Among them, K(z) represents the influence coefficient of solder joint bubbles, and G(D) o represents the bubble area, and z (m) o represents the area of the o-th solder joint in the top view state, where o represents the serial number of the number of bubbles, and o = 1, 2, 3... k; Obtain the solder joint internal crack information inside the area of the solder joint in the top view state based on ultrasonic detection, where the solder joint internal crack information includes the number of solder joint internal cracks and the lengths of multiple solder joint internal cracks; Calculate the solder joint internal crack influence coefficient according to the area of the solder joint in the top view state and the lengths of the multiple solder joint internal cracks, where the calculation formula is: ； Among them, N(B) represents the influence coefficient of internal cracks in solder joints, and L(W) h represents the internal crack length of the h-th solder joint, and z(m) h represents the area of the h-th solder joint in the top view state. h represents the number of the internal crack length of the solder joint and the area of the solder joint in the top view state, where h = 1, 2, 3... t; Perform weighted calculation on the solder joint bubble influence coefficient and the solder joint internal crack influence coefficient to obtain a solder joint comprehensive crack index, and use the solder joint comprehensive crack index as the internal connection characteristic index; Calculate the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index; Obtain the first weight value of the external connection characteristic index; Calculate the solder joint connection quality index of each pin according to the external connection characteristic index and the internal connection characteristic index, where the calculation formula is: ； Wherein, L(j) represents the solder joint connection quality index, W(B) represents the external connection characteristic index, N(b) represents the internal connection characteristic index, and A represents the first weight value; Judge whether there is at least one solder joint connection index corresponding to a pin exceeding a preset value; If so, determine that the detection result of the PCB component is unqualified; If not, determine that the detection result of the PCB component is qualified.

2. The PCB component detection method according to claim 1, wherein The step of obtaining the solder joint surface connection information and the PCB component installation position information according to the solder joint appearance characteristic information, and obtaining the solder joint wetting angle and the solder joint coverage information according to the solder joint surface connection information includes: Obtain the solder joint part image information according to the solder joint appearance characteristic information, where the solder joint part image information includes the solder joint area, the PCB component pin area, and the PCB installation area; Obtain the solder joint contour area of the solder joint area based on Canny edge detection; Obtain the coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area, and use the coverage area information as the solder joint surface connection information; Perform edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain the PCB component pin edge information and the PCB installation edge information, and use the area corresponding to the PCB installation edge information as the PCB component installation position information; Obtain the side edge contour of the solder joint area based on Canny edge detection; Obtain the lower surface position coordinates and the side tangent point coordinates of the solder joint according to the side edge contour, and extend the lower surface position coordinates to one end to obtain an extension line; Connect the extension line and the side tangent point coordinates to obtain a tangent point connection line; Obtain the angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as the solder joint wetting angle; Obtain the first area of the solder joint area; Obtain the second area of the PCB installation area, and obtain the solder joint occupancy ratio according to the ratio of the first area to the second area, and use the numerical information corresponding to the solder joint occupancy ratio as the solder joint coverage information.

3. The PCB component detection method according to claim 1, characterized in that, After the step of if not, determine that the detection result of the PCB component is qualified, includes: Calculate the average solder joint connection quality index according to multiple solder joint connection quality indexes; Judge whether the average solder joint connection quality index meets the preset threshold range; When the average solder joint connection quality index does not meet the preset threshold range and is less than the minimum value of the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a defective product; When the average solder joint connection quality index meets the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a standard product; When the average solder joint connection quality index does not meet the preset threshold range and is greater than the maximum value of the preset threshold range, it is determined that the connection quality between a single pin of the PCB component corresponding to the solder joint connection quality index and the PCB is a high-quality product.

4. A PCB component detection system for performing the PCB component detection method according to any one of claims 1-3, characterized in that, Including: A first acquisition module, configured to acquire welding feature information of each pin of the PCB component and the PCB, where the welding feature information includes solder joint appearance feature information and solder joint internal feature information; A second acquisition module, configured to acquire solder joint surface connection information and PCB component installation position information according to the solder joint appearance feature information, and acquire a solder joint wetting angle and solder joint coverage information according to the solder joint surface connection information; A third acquisition module, configured to acquire an external connection feature index according to the solder joint wetting angle, PCB component installation position information, and solder joint coverage information; A fourth acquisition module, configured to acquire the length of internal cracks in the solder joint according to the solder joint internal feature information, and acquire an internal connection feature index according to the length of internal cracks in the solder joint; A first calculation module, configured to calculate the solder joint connection quality index of each pin according to the external connection feature index and the internal connection feature index; A first judgment module, configured to judge whether there is at least one solder joint connection index corresponding to a pin exceeding a preset value; If so, it is determined that the detection result of the PCB component is unqualified; If not, it is determined that the detection result of the PCB component is qualified.

5. The PCB component detection system according to claim 4, characterized in that, The second acquisition module includes: A first acquisition unit, configured to acquire solder joint part image information according to the solder joint appearance feature information, where the solder joint part image information includes a solder joint area, a PCB component pin area, and a PCB installation area; A second acquisition unit, configured to acquire the solder joint contour area of the solder joint area based on Canny edge detection; A third acquisition unit, configured to acquire coverage area information of the solder joint contour area covering the PCB component pin area and the PCB installation area, and use the coverage area information as the solder joint surface connection information; A second analysis unit, configured to perform edge detection and analysis on the PCB component pin area and the PCB installation area based on an edge detection algorithm to obtain PCB component pin edge information and PCB installation edge information, and use the area corresponding to the PCB installation edge information as the PCB component installation position information; A fourth acquisition unit, configured to acquire a side edge contour of the solder joint area based on Canny edge detection; A fifth acquisition unit, configured to acquire the lower surface position coordinates and side tangent point coordinates of the solder joint according to the side edge contour, and extend the lower surface position coordinates to one end to obtain an extension line; A second connection unit, configured to connect the extension line and the side tangent point coordinates to obtain a tangent point connection line; A sixth acquisition unit, configured to obtain an angle between the connection line and the tangent point connection line according to the connection line and the tangent point connection line, and use the angle between the connection line and the tangent point connection line as a solder joint wetting angle; A seventh acquisition unit, configured to acquire a first area of the solder joint area; An eighth acquisition unit, configured to acquire a second area of the PCB installation area, and obtain a solder joint occupation ratio according to a ratio of the first area to the second area, and use numerical information corresponding to the solder joint occupation ratio as solder joint coverage information.

6. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the method according to any one of claims 1 to 3 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 3 are implemented.

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