A method and system for making a high-pressure resistant microscopic seepage model
By optimizing the production process of the microscopic seepage model and using appropriate cementing methods of glass and glue, the problems of long production time, low success rate and easy blockage of the microscopic seepage model in the existing technology are solved, and efficient and accurate production of microscopic seepage model is achieved to meet the needs of high-pressure experiments.
Patent Information
- Application Number
- CN202411301792.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2044-09-18
AI Technical Summary
The existing microscopic seepage model production methods cannot meet the needs of high-pressure experiments, and there are problems such as long production time, low success rate and easy blockage of the holes.
By optimizing the model material, type of glue, cementing method and curing, microscopic models are created using different types of glue cementing methods, including designing channels, selecting glass and glue with appropriate compressive strength, and setting dispensing machine parameters to ensure the appropriate thickness of the glue layer and avoiding channel clogging.
The rapid and simple production of the microscopic seepage model is achieved, the success rate is improved, the smoothness of the pores is ensured, and the high-pressure experimental needs can be met.
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Figure CN119294284B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of microfluidic experimental research, and in particular to a method and system for making a high-pressure resistant microscopic seepage model. Background Art
[0002] Microscopic seepage physical simulation experimental technology is used to dynamically analyze different multiphase flow systems at the pore level. High-pressure environmental factors need to be considered in some microscopic seepage experiments.
[0003] The prior art method for making a microscopic seepage model includes:
[0004] 1. The microscopic seepage model made by using polymer materials such as resin can be completed by simply bonding the PDMS substrate with replicated microchannels and the PDMS cover sheet to complete the sealing of the chip, which can meet the basic requirements of microscopic seepage physical simulation experimental technology. The model manufactured by this method is mainly unable to meet the experimental requirements of high pressure and the channels are usually relatively simple.
[0005] 2. Etching, bonding and sintering glass materials through the high-pressure micro-model manufacturing method. The model manufactured by this method can meet the high-pressure experimental requirements, but there are problems such as high cost, long production time and low success rate.
[0006] 3. Use phase change sacrificial layer combined with UV glue to bond glass microfluidic chips at room temperature. This method uses paraffin as the sacrificial layer material to fill the open microchannels, which simply and quickly achieves low-temperature bonding of glass chips, but it will cause paraffin to remain in the channels, which is easy to block the small channels. Summary of the invention
[0007] In order to solve the problems in the above-mentioned prior art, the present invention provides a method and system for making a high-pressure resistant microscopic seepage model. The invention optimizes and analyzes the model material, the type of glue, the bonding method and the curing aspects, and uses the bonding methods of different types of glue to make the microscopic model, so that the production of the microscopic seepage model is simpler and faster, and it is not easy to block the pores, thus solving the problems of long production time, low success rate and easy clogging of the pores of the microscopic seepage model. To achieve the above-mentioned purpose, the technical scheme is as follows:
[0008] In one aspect, the present invention provides a method for preparing a high-pressure resistant microscopic seepage model, the method comprising:
[0009] S1. According to the experimental requirements and experimental environment, design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements;
[0010] S2. Obtain the bonding area of the model according to the experimental requirements and the glue that meets the requirements;
[0011] S3, according to the glue that meets the requirements, set the parameters of the glue dispensing machine to obtain the thickness of the glue layer;
[0012] S4, calculating the diameter of the pore according to the bonding area of the model and the parameters of the glue dispenser;
[0013] S5, if the thickness of the glue layer is not less than the diameter of the hole, execute S6; if the thickness of the glue layer is less than the diameter of the hole, return to execute S4 and reset the parameters of the glue dispenser;
[0014] S6. Determine the shape and size of the glass that meets the requirements according to the bonding area and the channel inside the model, and obtain a three-dimensional model of the upper glass sheet and a three-dimensional model of the lower glass sheet;
[0015] S7, determining the positions of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the channel inside the model, determining the sizes of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and drilling holes into the three-dimensional model of the upper glass sheet according to the positions and sizes of the injection hole and the output hole to obtain the upper glass sheet required by the model;
[0016] S8, determining the shape, size and height of the metal gasket according to the channel inside the model and the diameter of the hole, and obtaining the metal gasket required by the model;
[0017] S9, obtaining the glue coating area of the model according to the channels and the bonding area inside the model;
[0018] S10, according to the glue coating area of the model, the glue dispensing machine evenly applies glue that meets the requirements to the glue coating area of the three-dimensional model of the lower glass sheet to obtain the lower glass sheet required by the model;
[0019] S11. Overlap and bond the lower glass sheet required by the model, the metal gasket required by the model, and the upper glass sheet required by the model from bottom to top to obtain a high-pressure resistant microscopic seepage model.
[0020] Optionally, the parameters of the glass that meet the requirements include: the compressive strength limit of the glass is 15MPa to 45MPa.
[0021] Optionally, the selection requirements of the glue that meets the requirements include:
[0022] Requirement 1: The molecular weight of the glue is 70-100;
[0023] Requirement 2: The concentration of glue is 8% to 15%;
[0024] Requirement 3: The contact angle between the adhesive and the glass meeting the requirements is not less than 60°. The calculation formula of the contact angle is as shown in formula (1):
[0025]
[0026] In the formula, γ SV To meet the required surface tension between glass and air, γ SL is the surface tension between the glue and the glass that meets the requirements, γ LV is the surface tension between the glue and the air, and θ is the contact angle formed when the glue contacts the glass that meets the requirements.
[0027] Optionally, the calculation method of the bonding area in S2 includes:
[0028] S=F / σ (2)
[0029] Where F is the bearing pressure required by the experiment, S is the bonding area, and σ is the compressive strength of the glue.
[0030] Optionally, the method for calculating the thickness of the adhesive layer in S3 includes:
[0031]
[0032] In the formula, h is the thickness of the glue layer, Q is the flow rate of the glue set by the glue dispensing machine, v is the dispensing speed set by the glue dispensing machine, and W is the coating width set by the glue dispensing machine.
[0033] Optionally, the S3 dispensing machine includes a programmable automatic dispensing machine.
[0034] Optionally, the calculation method of the diameter of the hole in S4 includes:
[0035] S*d=πa 2 *v*t (4)
[0036] In the formula, d is the diameter of the channel, a is the outlet radius of the dispensing machine, and t is the dispensing time.
[0037] Optionally, in S11, a lower glass sheet required by the model, a metal gasket required by the model, and an upper glass sheet required by the model are sequentially overlapped and bonded from bottom to top to obtain a microscopic seepage model resistant to high pressure, including:
[0038] S111, manufacturing an auxiliary curing clamp according to the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model, wherein the auxiliary curing clamp comprises an upper clamping device and a lower clamping device;
[0039] S112, fixing the lower clamping device horizontally, placing the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top, and then covering the upper clamping device to obtain a microscopic seepage model with a clamp;
[0040] S113, placing the microscopic seepage model with the clamp in a rapid curing environment, and after the glue is cured, removing the auxiliary curing clamp to obtain a high-pressure resistant microscopic seepage model.
[0041] Optionally, the rapid curing environment in S113 includes an ultraviolet light irradiation environment.
[0042] On the other hand, the present invention provides a high-pressure resistant microscopic seepage model manufacturing system, which is applied to a high-pressure resistant microscopic seepage model manufacturing method, and the system comprises:
[0043] The first acquisition module is used to design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements according to the experimental requirements and the experimental environment;
[0044] The first calculation module is used to obtain the bonding area of the model according to the experimental requirements and the glue that meets the requirements;
[0045] The second calculation module is used to set the parameters of the glue dispensing machine according to the glue that meets the requirements and obtain the thickness of the glue layer;
[0046] The third calculation module is used to calculate the diameter of the channel according to the bonding area of the model and the parameters of the dispensing machine;
[0047] The judgment module is used to judge that if the thickness of the glue layer is not less than the diameter of the hole, the next step is carried out; if the thickness of the glue layer is less than the diameter of the hole, the previous step is returned to reset the parameters of the glue dispenser;
[0048] The first production module is used to determine the shape and size of the glass that meets the requirements according to the bonding area and the channels inside the model, and obtain the three-dimensional model of the upper glass sheet and the three-dimensional model of the lower glass sheet;
[0049] The second manufacturing module is used to determine the positions of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the channel inside the model, determine the sizes of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and punch holes into the three-dimensional model of the upper glass sheet according to the positions and sizes of the injection hole and the output hole to obtain the upper glass sheet required by the model;
[0050] The third production module is used to determine the shape, size and height of the metal gasket according to the diameter of the channels and holes inside the model, so as to obtain the metal gasket required by the model;
[0051] The second acquisition module is used to obtain the glue coating area of the model according to the channel and the bonding area inside the model;
[0052] The fourth production module is used to evenly apply glue that meets the requirements to the glue-coated area of the three-dimensional model of the lower glass sheet through a glue dispenser according to the glue-coated area of the model, so as to obtain the lower glass sheet required by the model;
[0053] The model making module is used to overlap and bond the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top to obtain a microscopic seepage model resistant to high pressure.
[0054] Compared with the prior art, the technical solution of the present invention has at least the following beneficial effects:
[0055] On the one hand, the above scheme optimizes the model material, glue type, bonding method and curing aspects, and utilizes the bonding methods of different types of glue to manufacture the micro model, thereby making the production of the micro seepage model simpler and faster, and solves the problems of long production time and low success rate of the micro seepage model. On the other hand, the micro model is manufactured by utilizing the bonding methods of different types of glue, which has high precision and is not easy to clog the channels, thus avoiding the problem of clogging the channels. BRIEF DESCRIPTION OF THE DRAWINGS
[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0057] Figure 1 is a flow chart provided by an embodiment of the present invention;
[0058] Figure 2 It is a flow chart of microscopic seepage model bonding provided by an embodiment of the present invention;
[0059] Figure 3 is a three-dimensional schematic diagram of a microscopic seepage model provided in Example 1 of the present invention;
[0060] Figure 4 is a three-dimensional schematic diagram of the auxiliary curing clamp provided in Example 1 of the present invention;
[0061] Figure 5 is a schematic diagram of a channel inside a high-quality microscopic core model provided in Example 2 of the present invention;
[0062] Figure 6 It is a system block diagram provided by an embodiment of the present invention.
[0063] Explanation of the reference numerals in the figure: injection hole 31, upper glass sheet 32 required by the model, output hole 33, metal gasket 34 required by the model, lower glass sheet 35 required by the model, instant adhesive 36, upper clamping device 41 and lower clamping device 42. DETAILED DESCRIPTION
[0064] The technical solution of the present invention is described below in conjunction with the accompanying drawings.
[0065] In the embodiments of the present invention, words such as "exemplarily" and "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "example" in the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "example" is intended to present the concept in a specific way. In addition, in the embodiments of the present invention, the meaning expressed by "and / or" can be both, or it can be either of the two.
[0066] In order to make the technical problems, technical solutions and advantages to be solved by the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.
[0067] Embodiment 1:
[0068] In this embodiment 1, a microscopic seepage model of a "T"-shaped channel is manufactured, which can withstand a high-pressure environment of 10 MPa to meet subsequent experimental requirements.
[0069] like Figure 1 The flowchart provided in this embodiment is shown. The present invention provides a method for making a high-pressure resistant microscopic seepage model. The method is implemented by a high-pressure resistant microscopic seepage model making system. The method includes:
[0070] S1. According to the experimental requirements and experimental environment, design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements;
[0071] Specifically, in this embodiment 1, glass with a compressive strength limit of 15 MPa to 45 MPa is selected, and according to Table 1, the glue that meets the requirements is selected as instant glue 36 with a concentration of 10%.
[0072] Table 1-Technical parameters and introduction of glue
[0073]
[0074] According to the parameters of the instant adhesive 36, it is calculated that the contact angle between the instant adhesive 36 and the glass meeting the requirements is greater than 60°. The calculation formula of the contact angle is as shown in formula (1):
[0075]
[0076] In the formula, γ SV To meet the required surface tension between glass and air, γ SL is the surface tension between the glue and the glass that meets the requirements, γ LV is the surface tension between the glue and the air, and θ is the contact angle formed when the glue contacts the glass that meets the requirements.
[0077] S2. Obtain the bonding area of the model according to the experimental requirements and the glue that meets the requirements;
[0078] Specifically, by calculating the bonding area, as shown in formula (2), the bonding area is 1390 mm 2 .
[0079] S=F / σ (2)
[0080] Where F is the bearing pressure required by the experiment, S is the bonding area, and σ is the compressive strength of the glue.
[0081] S3, according to the glue that meets the requirements, set the parameters of the glue dispensing machine to obtain the thickness of the glue layer;
[0082] Specifically, the calculation method of the glue layer thickness is as shown in formula (3), and the glue dispensing speed of the programmable automatic glue dispensing machine is set to 400 mm / s, and the glue flow rate of the programmable automatic glue dispensing machine is set to 500 mm / s. 3 / s and the coating width of the programmable automatic dispensing machine is 4mm, the thickness of the glue layer is slightly greater than 0.3mm.
[0083]
[0084] In the formula, h is the thickness of the glue layer, Q is the flow rate of the glue set by the glue dispensing machine, v is the dispensing speed set by the glue dispensing machine, and W is the coating width set by the glue dispensing machine.
[0085] S4, calculating the diameter of the pore according to the bonding area of the model and the parameters of the glue dispenser;
[0086] Specifically, the calculation method of the diameter of the pore in S4 is as shown in formula (4), and the diameter of the pore is obtained to be 0.3 mm.
[0087] S*d=πa 2 *v*t (4)
[0088] In the formula, d is the diameter of the channel, a is the outlet radius of the dispensing machine, and t is the dispensing time.
[0089] S5, the thickness of the adhesive layer is not less than the diameter of the pore, and the next step is performed;
[0090] S6. Determine the shape and size of the glass that meets the requirements according to the bonding area and the channel inside the model, and obtain a three-dimensional model of the upper glass sheet and a three-dimensional model of the lower glass sheet;
[0091] Specifically, according to the bonding area and the channel inside the model, the three-dimensional model of the upper glass sheet and the three-dimensional model of the lower glass sheet have the same size, which is a square of 60 mm×60 mm.
[0092] S7, according to the channel inside the model, determine the position of the injection hole 31 and the output hole 33 of the three-dimensional model of the upper glass sheet, determine the size of the injection hole 31 and the output hole 33 of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and according to the position and size of the injection hole 31 and the output hole 33, punch holes into the three-dimensional model of the upper glass sheet to obtain the upper glass sheet 32 required by the model;
[0093] S8, determining the shape, size and height of the metal gasket according to the channel inside the model and the diameter of the hole, and obtaining the metal gasket 34 required by the model;
[0094] S9, obtaining the glue coating area of the model according to the channel inside the model and the bonding area;
[0095] S10, according to the glue coating area of the model, the programmable automatic glue dispensing machine evenly applies the instant glue 36 to the glue coating area of the lower glass sheet to obtain the lower glass sheet 35 required by the model;
[0096] S11, such as Figure 3 The three-dimensional schematic diagram of the microscopic seepage model provided in Example 1 shown in the figure, wherein the lower glass sheet 35 required by the model, the metal gasket 34 required by the model and the upper glass sheet 32 required by the model are overlapped and bonded from bottom to top in sequence to obtain a microscopic seepage model resistant to high pressure.
[0097] Specifically, Figure 2 The flowchart of the microscopic seepage model bonding provided in this embodiment is shown,
[0098] S111, such as Figure 4 The three-dimensional schematic diagram of the auxiliary curing clamp provided in the present embodiment 1 is shown. According to the lower glass sheet 35 required by the model, the metal gasket 34 required by the model and the upper glass sheet 32 required by the model, the auxiliary curing clamp is manufactured, and the auxiliary curing clamp includes an upper clamping device 41 and a lower clamping device 42;
[0099] S112, the lower clamping device 42 is fixed horizontally, and the lower glass sheet 35 required by the model, the metal gasket 34 required by the model, and the upper glass sheet 32 required by the model are placed in sequence from bottom to top, and then the upper clamping device 41 is covered to obtain a microscopic seepage model with a clamp;
[0100] S113, placing the microscopic seepage model with the clamp under ultraviolet light irradiation for 30 minutes, and after the instant adhesive 36 is cured, removing the auxiliary curing clamp to obtain a high-pressure resistant microscopic seepage model.
[0101] Embodiment 2:
[0102] This embodiment 2 manufactures a high-quality microscopic rock core model, such as Figure 5 The schematic diagram of the channels inside the high-quality micro-core model shown is required to withstand a high pressure of 10MPa.
[0103] like Figure 1 The flowchart provided in this embodiment is shown. The present invention provides a method for making a high-pressure resistant microscopic seepage model. The method is implemented by a high-pressure resistant microscopic seepage model making system. The method includes:
[0104] S1. According to the experimental requirements and experimental environment, design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements;
[0105] Specifically, in this embodiment 2, glass with a compressive strength limit of 15 MPa to 45 MPa is selected, and according to Table 1, a glue that meets the requirements is selected as a structural glue with a concentration of 10%.
[0106] According to the parameters of the structural adhesive, the contact angle between the structural adhesive and the glass meeting the requirements is calculated to be greater than 60°. The calculation formula of the contact angle is as shown in formula (1):
[0107]
[0108] In the formula, γ SV To meet the required surface tension between glass and air, γ SL is the surface tension between the glue and the glass that meets the requirements, γ LV is the surface tension between the glue and the air, and θ is the contact angle formed when the glue contacts the glass that meets the requirements.
[0109] S2. Obtain the bonding area of the model according to the experimental requirements and the glue that meets the requirements;
[0110] Specifically, by calculating the bonding area, as shown in formula (2), the bonding area is 1390 mm 2 .
[0111] S=F / σ (2)
[0112] Where F is the bearing pressure required by the experiment, S is the bonding area, and σ is the compressive strength of the glue.
[0113] S3. According to the glue that meets the requirements, set the parameters of the glue dispensing machine to obtain the thickness of the glue layer;
[0114] Specifically, the calculation method of the glue layer thickness is as shown in formula (3), and the glue dispensing speed of the programmable automatic glue dispensing machine is set to 400 mm / s, and the glue flow rate of the programmable automatic glue dispensing machine is set to 500 mm / s. 3 / s and the coating width of the programmable automatic dispensing machine is 4mm, the thickness of the glue layer is slightly greater than 0.3mm.
[0115]
[0116] In the formula, h is the thickness of the glue layer, Q is the flow rate of the glue set by the glue dispensing machine, v is the dispensing speed set by the glue dispensing machine, and W is the coating width set by the glue dispensing machine.
[0117] S4, calculating the diameter of the pore according to the bonding area of the model and the parameters of the glue dispenser;
[0118] Specifically, the calculation method of the diameter of the pore in S4 is as shown in formula (4), and the diameter of the pore is obtained to be 0.3 mm.
[0119] S*d=πa 2 *v*t (4)
[0120] In the formula, d is the diameter of the channel, a is the outlet radius of the dispensing machine, and t is the dispensing time.
[0121] S5, the thickness of the adhesive layer is not less than the diameter of the pore, and the next step is performed;
[0122] S6. Determine the shape and size of the glass that meets the requirements according to the bonding area and the channel inside the model, and obtain a three-dimensional model of the upper glass sheet and a three-dimensional model of the lower glass sheet;
[0123] Specifically, according to the bonding area and the channel inside the model, the three-dimensional model of the upper glass sheet and the three-dimensional model of the lower glass sheet have the same size, which is a square of 60 mm×60 mm.
[0124] S7, determining the positions of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the channel inside the model, determining the sizes of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and drilling holes into the three-dimensional model of the upper glass sheet according to the positions and sizes of the injection hole and the output hole to obtain the upper glass sheet required by the model;
[0125] S8, determining the shape, size and height of the metal gasket according to the channel inside the model and the diameter of the hole, and obtaining the metal gasket required by the model;
[0126] S9, obtaining the glue coating area of the model according to the channel inside the model and the bonding area;
[0127] S10, according to the glue coating area of the model, the structural glue is evenly coated on the glue coating area of the lower glass sheet by the programmable automatic glue dispensing machine to obtain the lower glass sheet required by the model;
[0128] S11, overlapping and bonding the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top to obtain a microscopic seepage model resistant to high pressure.
[0129] Specifically, Figure 2 The flowchart of the microscopic seepage model bonding provided in this embodiment is shown,
[0130] S111, manufacturing an auxiliary curing clamp according to the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model, wherein the auxiliary curing clamp comprises an upper clamping device and a lower clamping device;
[0131] S112, the lower clamping device is fixed horizontally, and a lower glass sheet required by the model, a metal gasket required by the model, and an upper glass sheet required by the model are placed sequentially from bottom to top, and then the upper clamping device 41 is covered to obtain a microscopic seepage model with a clamp;
[0132] S113, placing the microscopic seepage model with the clamp in an ultraviolet lamp irradiation environment for 30 minutes, and after the structural adhesive is cured, removing the auxiliary curing clamp to obtain a high-pressure resistant microscopic seepage model.
[0133] like Figure 6 The system block diagram of the embodiment of the present invention shown in the figure, the present invention provides a high-pressure resistant microscopic seepage model making system, the system is applied to a high-pressure resistant microscopic seepage model making method, the system includes a first acquisition module, a first calculation module, a second calculation module, a third calculation module, a judgment module, a first making module, a second making module, a third making module, a second acquisition module, a fourth making module and a model making module, specifically,
[0134] The first acquisition module is used to design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements according to the experimental requirements and the experimental environment;
[0135] The first calculation module is used to obtain the bonding area of the model according to the experimental requirements and the glue that meets the requirements;
[0136] The second calculation module is used to set the parameters of the glue dispensing machine according to the glue that meets the requirements and obtain the thickness of the glue layer;
[0137] The third calculation module is used to calculate the diameter of the channel according to the bonding area of the model and the parameters of the dispensing machine;
[0138] The judgment module is used to judge that if the thickness of the glue layer is not less than the diameter of the hole, the next step is carried out; if the thickness of the glue layer is less than the diameter of the hole, the previous step is returned to reset the parameters of the glue dispenser;
[0139] The first production module is used to determine the shape and size of the glass that meets the requirements according to the bonding area and the channels inside the model, and obtain the three-dimensional model of the upper glass sheet and the three-dimensional model of the lower glass sheet;
[0140] The second manufacturing module is used to determine the positions of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the channel inside the model, determine the sizes of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and punch holes into the three-dimensional model of the upper glass sheet according to the positions and sizes of the injection hole and the output hole to obtain the upper glass sheet required by the model;
[0141] The third production module is used to determine the shape, size and height of the metal gasket according to the diameter of the channels and holes inside the model, so as to obtain the metal gasket required by the model;
[0142] The second acquisition module is used to obtain the glue coating area of the model according to the channel and the bonding area inside the model;
[0143] The fourth production module is used to evenly apply glue that meets the requirements to the glue-coated area of the three-dimensional model of the lower glass sheet through a glue dispenser according to the glue-coated area of the model, so as to obtain the lower glass sheet required by the model;
[0144] The model making module is used to overlap and bond the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top to obtain a microscopic seepage model resistant to high pressure.
[0145] The present invention provides a method and system for making a high-pressure resistant microscopic seepage model. The present invention optimizes and analyzes the model material, the type of glue, the bonding method and the curing aspect, and utilizes the bonding methods of different types of glue to manufacture the microscopic model, thereby making the microscopic seepage model simpler and faster, and solves the problems of long production time and low success rate of the microscopic seepage model. At the same time, the microscopic model manufactured by utilizing the bonding methods of different types of glue has high precision and is not easy to clog the channels, thus avoiding the problem of clogged channels.
[0146] It is to be understood that the present invention is described by the above embodiments and should not be construed as limiting the embodiments of the present invention and the scope of the present invention. It is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.
Claims
1. A method for making a high-pressure resistant microscopic seepage model, characterized in that: The method comprises: S1. According to the experimental requirements and experimental environment, design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements; S2. Obtaining the bonding area of the model according to the experimental requirements and the glue that meets the requirements; S3. According to the glue that meets the requirements, set the parameters of the glue dispensing machine to obtain the thickness of the glue layer; S4. Calculate the diameter of the pores according to the bonding area of the model and the parameters of the glue dispenser; S5, if the thickness of the glue layer is not less than the diameter of the hole, execute S6; if the thickness of the glue layer is less than the diameter of the hole, return to execute S4 and reset the parameters of the glue dispenser; S6, determining the shape and size of the glass that meets the requirements according to the bonding area and the channel inside the model, and obtaining a three-dimensional model of the upper glass sheet and a three-dimensional model of the lower glass sheet; S7, determining the positions of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the channel inside the model, determining the sizes of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and drilling holes into the three-dimensional model of the upper glass sheet according to the positions and sizes of the injection hole and the output hole to obtain the upper glass sheet required by the model; S8, determining the shape, size and height of the metal gasket according to the channel inside the model and the diameter of the hole, and obtaining the metal gasket required by the model; S9, obtaining the glue coating area of the model according to the channel inside the model and the bonding area; S10, according to the glue coating area of the model, the glue that meets the requirements is evenly applied to the glue coating area of the three-dimensional model of the lower glass sheet by the glue dispensing machine to obtain the lower glass sheet required by the model; S11, overlapping and bonding the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top to obtain a microscopic seepage model resistant to high pressure.
2. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: The parameters of the glass that meet the requirements include: the compressive strength limit of the glass is 15MPa to 45Mpa.
3. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: The selection requirements of the glue that meets the requirements include: Requirement 1: The molecular weight of the glue is 70-100; Requirement 2: The concentration of glue is 8% to 15%; Requirement 3: The contact angle between the adhesive and the glass meeting the requirements is not less than 60°. The calculation formula of the contact angle is as shown in formula (1): In the formula, γ SV To meet the required surface tension between glass and air, γ SL is the surface tension between the glue and the glass that meets the requirements, γ LV is the surface tension between the glue and the air, and θ is the contact angle formed when the glue contacts the glass that meets the requirements.
4. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: The calculation method of the bonding area in S2 includes: S=F / σ (2) Where F is the bearing pressure required by the experiment, S is the bonding area, and σ is the compressive strength of the glue.
5. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: The method for calculating the thickness of the adhesive layer in S3 includes: In the formula, h is the thickness of the glue layer, Q is the flow rate of the glue set by the glue dispensing machine, v is the dispensing speed set by the glue dispensing machine, and W is the coating width set by the glue dispensing machine.
6. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: The S3 glue dispensing machine includes a programmable automatic glue dispensing machine.
7. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: The method for calculating the diameter of the hole in S4 includes: S*d=πa 2 *v*t (4) In the formula, d is the diameter of the channel, a is the outlet radius of the dispensing machine, and t is the dispensing time.
8. The method for making a high pressure resistant microscopic seepage model according to claim 1, characterized in that: In S11, the lower glass sheet required by the model, the metal gasket required by the model, and the upper glass sheet required by the model are sequentially overlapped and bonded from bottom to top to obtain a microscopic seepage model resistant to high pressure, including: S111, manufacturing an auxiliary curing clamp according to the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model, wherein the auxiliary curing clamp comprises an upper clamping device and a lower clamping device; S112, fixing the lower clamping device horizontally, placing the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top, and then covering the upper clamping device to obtain a microscopic seepage model with a clamp; S113, placing the microscopic seepage model with the clamp in a rapid curing environment, and after the glue is cured, removing the auxiliary curing clamp to obtain a high-pressure resistant microscopic seepage model.
9. The method for making a high pressure resistant microscopic seepage model according to claim 8, characterized in that: The rapid curing environment in S113 includes an ultraviolet light irradiation environment.
10. A high pressure resistant microscopic seepage model making system, characterized in that: The system comprises: The first acquisition module is used to design and obtain the channel inside the model, the glass that meets the requirements, and the glue that meets the requirements according to the experimental requirements and the experimental environment; A first calculation module, used for obtaining the bonding area of the model according to the experimental requirements and the glue that meets the requirements; A second calculation module is used to set the parameters of the glue dispensing machine according to the glue that meets the requirements to obtain the thickness of the glue layer; A third calculation module is used to calculate the diameter of the channel according to the bonding area of the model and the parameters of the dispensing machine; A judgment module, used for judging, if the thickness of the glue layer is not less than the diameter of the hole, then proceeding to the next step; if the thickness of the glue layer is less than the diameter of the hole, then returning to the previous step and resetting the parameters of the glue dispenser; A first production module is used to determine the shape and size of the glass that meets the requirements according to the bonding area and the channel inside the model, and obtain a three-dimensional model of the upper glass sheet and a three-dimensional model of the lower glass sheet; The second manufacturing module is used to determine the positions of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the channel inside the model, determine the sizes of the injection hole and the output hole of the three-dimensional model of the upper glass sheet according to the diameter of the channel, and punch holes into the three-dimensional model of the upper glass sheet according to the positions and sizes of the injection hole and the output hole to obtain the upper glass sheet required by the model; The third manufacturing module is used to determine the shape, size and height of the metal gasket according to the channel inside the model and the diameter of the hole, so as to obtain the metal gasket required by the model; A second acquisition module is used to obtain the glue coating area of the model according to the channel inside the model and the bonding area; The fourth production module is used to apply the glue that meets the requirements evenly to the glue-coated area of the three-dimensional model of the lower glass sheet through the glue dispensing machine according to the glue-coated area of the model, so as to obtain the lower glass sheet required by the model; The model making module is used to overlap and bond the lower glass sheet required by the model, the metal gasket required by the model and the upper glass sheet required by the model in sequence from bottom to top to obtain a microscopic seepage model resistant to high pressure.
Citation Information
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