Semiconductor device processing equipment, control method and storage medium

Abstract

The invention provides processing equipment of a semiconductor device, a control method of the processing equipment and a storage medium. The processing equipment of the semiconductor device comprises a process chamber used for carrying out a processing process on the semiconductor device; the rotating mechanism is used for rotating at least one piece to be rotated in the machining equipment, the rotating mechanism comprises a motor and a transmission belt, one end of the transmission belt is connected with a rotating shaft of the motor through a bearing, and the other end of the transmission belt is connected with the piece to be rotated; the pressure sensor is used for collecting pressure borne by the bearing; the controller is configured to obtain the pressure borne by the bearing through the pressure sensor; and starting and stopping of the machining process are controlled according to the pressure borne by the bearing.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a processing device for a semiconductor device, a control method for the processing device for a semiconductor device, and a computer-readable storage medium. Background Art

[0002] A high-intensity UV device is fixed above the cavity of the UV curing device. The UV curing device rotates via a belt. If the belt breaks, the rotating mechanism stops rotating, and the high-intensity radiation will continue to irradiate the same position of the wafer, causing a greater adverse effect. Therefore, it is necessary to detect the belt status.

[0003] In the prior art, external sensors are usually used for detection. There are two types of external sensors: one is a through-beam sensor, which needs to be fixed externally and can only detect whether the belt is broken or not. The other is a pressure sensor. Although this type of sensor is small in size and sensitive, it has a short service life and needs to be replaced regularly. Especially when the sensor sensitivity is weakened, it is impossible to judge the belt status.

[0004] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of a semiconductor device processing technology for more accurately obtaining the belt status to control the start and stop of the process chamber, thereby meeting the miniaturization requirements of the processing equipment and improving the product yield. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor device processing equipment, a control method for semiconductor device processing equipment, and a computer-readable storage medium, which are used to more accurately obtain the belt status to control the start and stop of the process chamber, thereby meeting the miniaturization requirements of the processing equipment and improving the product yield.

[0007] Specifically, the processing equipment of the semiconductor device provided according to the first aspect of the present invention includes: a process chamber for performing a processing process on the semiconductor device; a rotating mechanism for rotating at least one part to be rotated in the processing equipment, wherein the rotating mechanism includes a motor and a transmission belt, one end of the transmission belt is connected to the rotating shaft of the motor via a bearing, and the other end thereof is connected to the part to be rotated; a pressure sensor for collecting the pressure on the bearing; and a controller, which is configured to: obtain the pressure on the bearing via the pressure sensor; and control the start and stop of the processing process according to the pressure on the bearing.

[0008] Further, in some embodiments of the present invention, the step of controlling the start and stop of the processing process according to the pressure applied to the bearing includes: in response to the pressure being less than or equal to a preset first pressure threshold, controlling the process chamber to stop the current processing process, wherein the first pressure threshold indicates that the motor shaft is in a no-load state; and in response to the pressure being greater than a preset second pressure threshold, controlling the process chamber to stop the current processing process, wherein the second pressure threshold indicates that the motor shaft is in a stuck state.

[0009] Further, in some embodiments of the present invention, the step of controlling the start and stop of the processing process according to the pressure exerted on the bearing includes: in response to the pressure being between the first pressure threshold and the preset third pressure threshold, controlling the process chamber to stop the subsequent processing process after completing the current processing process, wherein the third pressure threshold indicates that the motor shaft is in the lowest speed operation state; in response to the pressure being between the preset fourth pressure threshold and the second pressure threshold, controlling the process chamber to stop the subsequent processing process after completing the current processing process, wherein the fourth pressure threshold indicates that the motor shaft is in the highest speed operation state; and in response to the pressure being between the third pressure threshold and the fourth pressure threshold, controlling the process chamber to continue performing the processing process on the semiconductor device.

[0010] Further, in some embodiments of the present invention, the controller is also configured to: in response to the pressure being less than or equal to the first pressure threshold, or greater than the second pressure threshold, determine that the rotating mechanism is in a fault state; and in response to the pressure being between the first pressure threshold and the third pressure threshold, or between the fourth pressure threshold and the second pressure threshold, determine that the rotating mechanism is in an abnormal state.

[0011] Further, in some embodiments of the present invention, the step of controlling the process chamber to stop subsequent processing after completing the current processing includes: counting the number of times the rotating mechanism is in an abnormal state; in response to the number of times the rotating mechanism is in the abnormal state not reaching a preset number threshold, controlling the process chamber to continue performing the processing on the semiconductor device; and in response to the number of times the rotating mechanism is in the abnormal state reaching the number threshold, controlling the process chamber to stop subsequent processing after completing the current processing.

[0012] Further, in some embodiments of the present invention, the controller is also configured to: in response to a judgment result that the rotating mechanism is in a fault state, output a fault alarm signal and require manual reset; in response to a judgment result that the process chamber is in an abnormal state but the number of times does not reach the number threshold, output an abnormal prompt signal; in response to a judgment result that the process chamber is in an abnormal state and the number of times reaches the number threshold, output a fault warning signal and require manual reset; and in response to a manual reset operation, stop outputting the fault alarm signal or the fault warning signal, and allow the process chamber to continue to perform the processing technology on the semiconductor device.

[0013] Furthermore, in some embodiments of the present invention, the controller is connected to a serial port server via serial port communication, and then connected to a host computer via an Ethernet TCPIP protocol, and is configured to: upload the acquired pressure value to the host computer via the serial port server, so as to display the pressure change value in real time on its motor status page.

[0014] Furthermore, in some embodiments of the present invention, the process chamber is a UV curing chamber, and the part to be rotated includes a UV light source disposed on at least one side of the UV curing chamber.

[0015] In addition, according to the control method provided in the second aspect of the present invention, by executing the steps configured in the controller of the semiconductor device processing equipment as described in any one of the first aspect of the present invention, the start and stop of the processing process of the semiconductor device in its process chamber is controlled.

[0016] In addition, according to the third aspect of the present invention, the computer readable storage medium stores computer instructions, which, when executed by a processor, implement the control method for semiconductor device processing equipment according to the second aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of semiconductor device processing equipment provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A control method of semiconductor device processing equipment according to some embodiments of the present invention is shown.

[0020] Figure 3 A schematic diagram of a belt state of no-load operation provided in accordance with some embodiments of the present invention is shown.

[0021] Figure 4 A schematic diagram of a belt state of not completely unloading operation provided in accordance with some embodiments of the present invention is shown.

[0022] Figure 5 A schematic diagram of a belt state of overload operation provided according to some embodiments of the present invention is shown.

[0023] Figure 6 A schematic diagram of a belt state during normal operation provided according to some embodiments of the present invention is shown.

[0024] Reference numerals:

[0025] 10 Rotating mechanism

[0026] 20 transmission belt DETAILED DESCRIPTION

[0027] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0030] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0031] A high-intensity UV device is fixed above the cavity of the UV curing device. The UV curing device rotates via a belt. If the belt breaks, the rotating mechanism stops rotating, and the high-intensity radiation will continue to irradiate the same position of the wafer, causing a greater adverse effect. Therefore, it is necessary to detect the belt status.

[0032] In the prior art, external sensors are usually used for detection. There are two types of external sensors: one is a through-beam sensor, which needs to be fixed externally and can only detect whether the belt is broken or not. The other is a pressure sensor. Although this type of sensor is small in size and sensitive, it has a short service life and needs to be replaced regularly. Especially when the sensor sensitivity is weakened, it is impossible to judge the belt status.

[0033] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor device processing equipment, a control method for semiconductor device processing equipment, and a computer-readable storage medium, which are used to more accurately obtain the belt status to control the start and stop of the process chamber, thereby meeting the miniaturization requirements of the processing equipment and improving the product yield.

[0034] In some non-limiting embodiments, the control method of the semiconductor device processing equipment provided in the second aspect of the present invention can be implemented based on the semiconductor device processing equipment provided in the first aspect of the present invention. The control method of the semiconductor device processing equipment controls the start and stop of the processing process of the semiconductor device in its process chamber by executing the steps configured in the controller of the semiconductor device processing equipment provided in the first aspect of the present invention. Specifically, the semiconductor device processing equipment is configured with a memory and a processor. The memory includes but is not limited to the above-mentioned computer-readable storage medium provided in the third aspect of the present invention, on which computer instructions are stored. The processor is connected to the memory and is configured to execute the computer instructions stored on the memory to implement the control method of the semiconductor device processing equipment provided in the second aspect of the present invention.

[0035] Please refer to Figure 1 , Figure 1 A schematic structural diagram of semiconductor device processing equipment provided according to some embodiments of the present invention is shown.

[0036] like Figure 1 As shown, the processing equipment of semiconductor devices includes a process chamber and a rotating mechanism 10. The process chamber is used to perform a processing process on the semiconductor device. The rotating mechanism 10 is used to rotate at least one member to be rotated in the processing equipment. The rotating mechanism 10 includes a motor and a transmission belt 20, one end of the transmission belt 20 is connected to the rotating shaft of the motor via a bearing, and the other end thereof is connected to the member to be rotated.

[0037] Furthermore, the device also includes a pressure sensor and a controller. The pressure sensor is used to collect the pressure on the bearing. The controller is configured to obtain the pressure on the bearing via the pressure sensor, and control the start and stop of the processing technology according to the pressure on the bearing. Therefore, the technical solution of the application can characterize the belt state by the bearing pressure, and then control the start and stop of the process chamber according to the belt state, thereby meeting the miniaturization requirements of the processing equipment and improving the product yield.

[0038] Optionally, in some embodiments, the process chamber may be a UV curing chamber, and the rotated part may include a UV light source disposed on at least one side (eg, at least one of top, bottom, left, right, front, and rear) of the UV curing chamber.

[0039] Optionally, in some embodiments, the process chamber may also be a thin film deposition chamber, and the part to be rotated may include at least one of a shower head, a heating plate, and a wafer supporting mechanism.

[0040] The following will describe the working principle of the processing equipment of the above-mentioned semiconductor device in conjunction with some embodiments of the control method of the processing equipment of the semiconductor device. Those skilled in the art will understand that the embodiments of the control method of the processing equipment of these semiconductor devices are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the processing equipment of the semiconductor device. Similarly, the processing equipment of the semiconductor device is also only some non-limiting implementation methods provided by the present invention, and does not constitute a limitation on the execution subject or execution order of each step in the control method of the processing equipment of these semiconductor devices.

[0041] Please refer to Figure 2 , Figure 2 A control method of semiconductor device processing equipment according to some embodiments of the present invention is shown.

[0042] like Figure 2 As shown, the semiconductor device processing equipment can first collect the current pressure F N Here, since the motor itself has two movement trends, forward and reverse, the pressure parameters used for judgment are all absolute value data.

[0043] In some embodiments, when the motor is fully loaded, the rotation speed is set to the maximum configurable speed for rotation, and the absolute value of the pressure value is recorded as the second pressure threshold F2 (for example, 1200N), and the rotation speed is set to the minimum configurable speed for rotation, and the absolute value of the pressure value is recorded as the first pressure threshold F1 (for example, 20N). At this time, the pressure during normal rotation is greater than or equal to the first pressure threshold F1, and less than or equal to the second pressure threshold F2.

[0044] Please refer to Figure 3 to Figure 6 , Figure 3 A schematic diagram of a belt state of no-load operation provided in accordance with some embodiments of the present invention is shown. Figure 4 A schematic diagram of a belt state of not completely unloading operation provided in accordance with some embodiments of the present invention is shown. Figure 5 A schematic diagram of a belt state of overload operation provided according to some embodiments of the present invention is shown. Figure 6 A schematic diagram of a belt state during normal operation provided according to some embodiments of the present invention is shown.

[0045] like Figure 3 As shown, in response to the pressure F N is less than or equal to the preset first pressure threshold F1, the process chamber is controlled to stop the current processing process. Here, the first pressure threshold F1 indicates that the motor shaft is in an unloaded state. NIf the pressure is greater than the preset second pressure threshold F2, the process chamber is controlled to stop the current processing process. Here, the second pressure threshold F2 indicates that the motor shaft is in a stuck state. At this time, the semiconductor device processing equipment will turn off the UV lamp in the UV curing chamber to prevent the UV from irradiating the same position of the wafer for a long time, causing adverse effects.

[0046] like Figure 4 As shown, in response to the pressure F N Between the first pressure threshold F1 and a preset third pressure threshold F3 (eg, 50N), the process chamber is controlled to stop subsequent processing after completing the current processing, wherein the third pressure threshold F3 indicates that the motor shaft is in the lowest speed operation state.

[0047] like Figure 5 As shown, in response to the pressure being between a preset fourth pressure threshold F4 (for example, 900N) and the second pressure threshold F2, the process chamber is controlled to stop subsequent processing after completing the current processing, wherein the fourth pressure threshold F4 indicates that the motor shaft is in the highest speed operating state.

[0048] like Figure 6 As shown, in response to the pressure being between the third pressure threshold F3 and the fourth pressure threshold F4, the process chamber is controlled to continue processing the semiconductor device.

[0049] In addition, in some embodiments, the controller may also respond to the pressure F N If the pressure F is less than or equal to the first pressure threshold F1, or greater than the second pressure threshold F2, it is determined that the rotating mechanism 10 is in a fault state. N If the pressure is between the first pressure threshold F1 and the third pressure threshold F3 or between the fourth pressure threshold F4 and the second pressure threshold F2 , it is determined that the rotating mechanism 10 is in an abnormal state.

[0050] Further, in some embodiments, the processing equipment of the semiconductor device may first count the number of times the rotating mechanism 10 is in an abnormal state. Then, in response to the number of times the rotating mechanism 10 is in an abnormal state not reaching a preset number threshold X (e.g., 100 times), the process chamber is controlled to continue processing the semiconductor device. Accordingly, in response to the number of times the rotating mechanism 10 is in an abnormal state reaching the number threshold X, the process chamber is controlled to stop the subsequent processing after completing the current processing.

[0051] Here, the number threshold X can be obtained by performing limit tests multiple times, and then the machine settings can be used for early warning. Thus, through health management, the belt life can be predicted and replaced in advance, avoiding interruptions during the process and preventing belt breakage during the process from affecting production capacity, thereby improving process efficiency.

[0052] In addition, in some embodiments, the controller may also output a fault alarm signal and require manual reset in response to the determination result that the rotating mechanism 10 is in a fault state.

[0053] In some embodiments, the controller may further output an abnormal prompt signal in response to a judgment result that the process chamber is in an abnormal state but the number of times does not reach the number threshold X. Accordingly, in response to a judgment result that the process chamber is in an abnormal state and the number of times reaches the number threshold X, a fault warning signal is output and a manual reset is required.

[0054] Furthermore, in response to the manual reset operation, the controller stops outputting the fault alarm signal or fault warning signal, and allows the process chamber to continue processing the semiconductor device. Thus, an alarm can be given when the belt breaks, and the wafers in the thin film deposition chamber can be prevented from being exposed to ultraviolet rays for a long time. At the same time, the device can also improve the reliability of the device through manual reset operation.

[0055] Further, in some embodiments of the fault state, the semiconductor device processing equipment responds to the pressure F N When the pressure is greater than the second pressure threshold F2, a fault alarm signal is output and a manual reset is required. N The accumulated value is greater than 120000N, and the process chamber is controlled to stop subsequent processing after completing the current processing.

[0056] Please refer to Table 1, which shows the alarm conditions under different belt conditions.

[0057] state Belt breakage abnormal normal abnormal Stuck parameter A B C B D Pressure range <![CDATA[F N <20]]> <![CDATA[20≤F N ≤50]]> <![CDATA[50<F N <900]]> <![CDATA[900≤F N ≤1200]]> <![CDATA[1200<F N ]]> Alarm level Fault alarm Abnormal prompt normal Abnormal prompt Fault alarm

[0058] As shown in Table 1, classified alarms are given according to different actual situations. N ∈A, the system gives an alarm; F N ∈D and∑F N ≥12000, the system will alarm; if F N ∈B, an abnormal prompt is given and the number of occurrences is recorded. When the number of occurrences is greater than the preset threshold value X, an early warning signal is issued to prompt the belt to be replaced to avoid belt breakage.

[0059] In addition, in some embodiments of the present invention, the controller is connected to a serial port server via serial port communication, and then connected to a host computer via Ethernet TCPIP protocol, so that the acquired pressure value is uploaded to the host computer via the serial port server, so as to display the pressure change value in real time on its motor status page.

[0060] In summary, the semiconductor device processing equipment, the control method of the semiconductor device processing equipment, and a computer-readable storage medium provided by the present invention are used to more accurately obtain the belt status to control the start and stop of the process chamber, thereby meeting the miniaturization requirements of the processing equipment and improving the product yield.

[0061] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0062] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor device processing equipment, characterized in that: include: A process chamber is used to perform processing on semiconductor devices; A rotating mechanism, used to rotate at least one workpiece to be rotated in the processing equipment, wherein the rotating mechanism comprises a motor and a transmission belt, one end of the transmission belt is connected to the rotating shaft of the motor via a bearing, and the other end of the transmission belt is connected to the workpiece to be rotated; A pressure sensor, used to collect the pressure on the bearing; as well as The controller is configured to: obtain the pressure exerted on the bearing via the pressure sensor; and control the start and stop of the processing technology according to the pressure exerted on the bearing.

2. The processing equipment according to claim 1, characterized in that The step of controlling the start and stop of the processing process according to the pressure on the bearing comprises: In response to the pressure being less than or equal to a preset first pressure threshold, controlling the process chamber to stop the current processing process, wherein the first pressure threshold indicates that the rotating shaft of the motor is in an unloaded state; and In response to the pressure being greater than a preset second pressure threshold, the process chamber is controlled to stop a current processing process, wherein the second pressure threshold indicates that the rotating shaft of the motor is in a stuck state.

3. The processing equipment according to claim 2, characterized in that The step of controlling the start and stop of the processing process according to the pressure on the bearing comprises: In response to the pressure being between the first pressure threshold and a preset third pressure threshold, controlling the process chamber to stop a subsequent process after completing the current process, wherein the third pressure threshold indicates that the motor shaft is in a lowest speed operation state; In response to the pressure being between a preset fourth pressure threshold and the second pressure threshold, controlling the process chamber to stop a subsequent process after completing the current process, wherein the fourth pressure threshold indicates that the shaft of the motor is in a highest speed operation state; and In response to the pressure being between the third pressure threshold and the fourth pressure threshold, the process chamber is controlled to continue performing the machining process on the semiconductor device.

4. The processing equipment according to claim 3, characterized in that The controller is also configured to: In response to the pressure being less than or equal to the first pressure threshold, or being greater than the second pressure threshold, determining that the rotating mechanism is in a fault state; as well as In response to the pressure being between the first pressure threshold and the third pressure threshold, or between the fourth pressure threshold and the second pressure threshold, it is determined that the rotating mechanism is in an abnormal state.

5. The processing equipment according to claim 4, characterized in that The step of controlling the process chamber to stop the subsequent process after completing the current process comprises: Counting the number of times the rotating mechanism is in an abnormal state; In response to the number of times that the rotating mechanism is in an abnormal state not reaching a preset number threshold, controlling the process chamber to continue to perform the processing process on the semiconductor device; and In response to the number of times that the rotating mechanism is in an abnormal state reaching the number threshold, the process chamber is controlled to stop a subsequent process after completing the current process.

6. The processing equipment according to claim 5, characterized in that The controller is also configured to: In response to the judgment result that the rotating mechanism is in a fault state, a fault alarm signal is output and a manual reset is required; In response to a judgment result that the process chamber is in an abnormal state but the number of times does not reach the number threshold, outputting an abnormality prompt signal; In response to a judgment result that the process chamber is in an abnormal state and the number of times reaches the number threshold, a fault warning signal is output and a manual reset is required; as well as In response to the manual reset operation, the output of the fault alarm signal or the fault early warning signal is stopped, and the process chamber is allowed to continue to perform the processing on the semiconductor device.

7. The processing equipment according to claim 6, characterized in that The controller is connected to the serial port server via serial communication, and then connected to the host computer via Ethernet TCPIP protocol, and is configured as follows: The obtained pressure value is uploaded to the host computer via the serial port server, so that the pressure change value can be displayed in real time on the motor status page.

8. The processing equipment according to claim 1, characterized in that The process chamber is a UV curing chamber, and the component to be rotated includes a UV light source disposed on at least one side of the UV curing chamber.

9. A method for controlling a semiconductor device processing device, characterized in that: The control method controls the start and stop of the processing process of the semiconductor device in the process chamber thereof by executing the steps configured in the controller of the semiconductor device processing equipment according to any one of claims 1 to 8.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the control method of semiconductor device processing equipment according to claim 9 is implemented.

Images