A wafer expansion and correction mechanism

By setting up a meshing transmission of active gears and driven gears, combined with a correction motor and clutch module, the problem of grain skew after wafer expansion is solved, and the yield rate and transmission efficiency of wafer processing are improved.

CN119297123BActive Publication Date: 2025-09-23WUXI CHANGDING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411765541.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-09-23
Estimated Expiration
2044-12-04

AI Technical Summary

Technical Problem

The existing wafer expansion mechanism is unable to correct the problem of grain skew, resulting in defective products when removing and loading the wafers after expansion.

Method used

A device is designed, including a base, an inner ring 2, an outer ring 3, a driving module 4, a lifting module 5, a correction module 6, and a clutch module 7. The driving gear and the driven gear are meshed and driven, and a correction motor is provided to provide driving force. The clutch module separates the driving gear and the driven gear when needed to avoid misoperation.

Benefits of technology

The correction of grain distribution after wafer expansion is achieved, the yield rate of wafer retrieval and product loading is improved, the transmission is more stable, and the correction load is reduced.

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Abstract

The present invention relates to the field of wafer processing technology, and specifically provides a wafer expansion and correction mechanism, including a base, wherein the base is provided with an inner ring and an outer ring, the outer ring is distributed on the outside of the inner ring, the wafer is placed on the outer ring, and the inner ring is in contact with the lower end of the thin film area of ​​the wafer; the base is provided with a driving module, a lifting module, a correction module, and a clutch module; the present invention sets an active gear and a driven gear of meshing transmission in the driving module for coordinated transmission, which can ensure a constant power transmission ratio, so that the transmission is more stable, the transmission efficiency is high, and the operation is reliable; the present invention also provides a correction module, which can correct the distribution position of the grains on the wafer in the expanded state, facilitate the removal of the crystals and the installation on the product, and improve the yield rate of the installed crystal products; the setting of the clutch module can separate the active gear and the driven gear of the driving module when the position of the grains needs to be corrected after the wafer is expanded, thereby improving the correction effect.
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Citation Information

Patent Citations

  • Wafer film expanding mechanism

    CN116190300A

  • Wafer disc electric film expanding device

    CN218447843U