An etching device and method for semiconductor chip production

Abstract

The present invention discloses an etching device and method for semiconductor chip production, and relates to the technical field related to chip production. The present invention comprises a base, an etching box is arranged on the top of the base, a photoresist assembly is arranged on the left side of the etching box, and a plurality of obliquely distributed injection holes are opened on the right side of the photoresist assembly, a plurality of limit rods are symmetrically arranged on the outer wall of the etching box, a sealing plate is arranged on the outer wall of the plurality of limit rods, and telescopic rods are arranged at the bottom corners of the inner wall of the etching box. The present invention improves the photolithography resolution during the chip etching process by mixing the photoresist with the etching liquid, thereby improving the etching clarity of the semiconductor chip and thus improving the etching quality. At the same time, during the continuous movement of the U-shaped tube assembly, the upper and lower pressure differences of the etching liquid on the right side of the etching box are effectively changed, thereby shortening the time required for comprehensive etching of the chip and improving the etching efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip production, and in particular to an etching device and method used in semiconductor chip production. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. With the continuous development of high-tech, the demand for semiconductor chips continues to increase. At the same time, during the etching process of semiconductor chips, the semiconductor chips are generally directly placed in the etching device and contacted with the etching liquid to achieve etching.

[0003] The patent with patent announcement number CN117476512B discloses an etching device used for semiconductor chip production, including an etching box body, which is divided into an etching chamber and a filtering chamber by an internally arranged partition, and a liquid level difference flow groove is opened through one side of the partition, the liquid level difference flow groove is used to connect the etching chamber and the filtering chamber, and a filter frame is arranged in the filtering chamber, and a hand-cranked traction component for traction is arranged on the top of the filter frame, and the hand-cranked traction component is fixedly arranged on the outer wall of the filtering chamber; the etching liquid sprayed by the nozzle of the patent will stir the etching liquid in the etching chamber, at this time, the etching liquid pressure at the bottom of the grid plate will be greater than the pressure at the top, and the semiconductor chip on the grid plate will be separated from the grid plate and float under the pressure, so as to avoid the situation where the semiconductor chips are stacked and cannot be completely etched.

[0004] However, the device still has some shortcomings: the device can avoid the stacking of semiconductor chips and thus cannot be completely etched, but photoresist is usually added to the etching solution during the etching process of the chip. With the help of photoresist as a mask material, the circuit pattern can be accurately transferred to the single crystal surface or dielectric layer to improve the chip's lithography resolution. Therefore, during the etching process of the semiconductor chip, the photoresist and the etching solution need to be well mixed before etching. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides an etching device and method for use in semiconductor chip production, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above purpose, the present invention is implemented through the following technical solutions: an etching device used in semiconductor chip production, comprising a base, an etching box is arranged on the top of the base, a photoresist assembly is arranged on the left side of the etching box, and a plurality of obliquely distributed injection holes are opened on the right side of the photoresist assembly, a plurality of limit rods are symmetrically arranged on the outer wall of the etching box, a plurality of the outer walls of the limit rods are provided with sealing plates, telescopic rods are arranged at the bottom corners of the inner wall of the etching box, the top of the telescopic end of the telescopic rod is fixedly installed on the bottom of the sealing plate, a filter hole frame is arranged on the outer wall of the telescopic end of the telescopic rod, a partition plate is arranged inside the etching box, and a liquid level tank is opened inside the partition plate;

[0007] An anti-blurring device is provided on the left side of the etching box, an anti-centering device is provided above the anti-blurring device, and an anti-residue device is provided below the anti-centering device;

[0008] The anti-blurring device includes an electric rotating rod, the bottom of which is rotatably installed on the left side of the bottom of the inner wall of the etching box, a reciprocating spiral groove is opened on the outer wall of the electric rotating rod, and a disturbance flow plate is fixedly installed on the lower part of the outer wall of the electric rotating rod, and a sliding plate is penetrated and movably installed on the outer wall of the reciprocating spiral groove of the electric rotating rod, and two U-shaped pipe assemblies are penetrated and symmetrically fixedly installed inside the sliding plate, and a circulating pump is arranged on the outer wall of the U-shaped pipe assembly, a vertical rod is fixedly installed on the top of the sliding plate, and a filter plate is fixedly installed on the top of the vertical rod, a U-shaped groove is opened on the left side of the filter plate, and a transmission roller is rotatably installed inside the U-shaped groove of the filter plate.

[0009] According to the above technical scheme, a number of the spoilers are equidistantly distributed on the outer wall of the electric rotating rod, the front and back sides of the sliding plate are slidably installed on the inner wall of the etching box, the top of the right ends of the two U-shaped tube assemblies movably penetrate the interior of the etching box, the U-shaped tube assembly is located below the filter hole frame, the outer wall of the transmission roller contacts the left side of the inner wall of the etching box, firstly, the semiconductor chip is placed inside the filter hole frame, and when the telescopic end of the telescopic rod moves downward, the filter hole frame is driven to move synchronously, that is, the chip is driven to move downward, and at the same time, the telescopic end of the telescopic rod pulls the sealing plate to slide downward along the outer wall of the limit rod and seals the right side of the top of the etching box, and then the etching liquid is injected into the left side of the interior of the etching box, that is, the left side of the partition plate, and at the same time, the through hole on the left side of the etching box is matched with the injection hole of the photoresist assembly, and the photoresist enters the interior of the etching box through the straight tube, and the electric rotating rod is started, and the electric rotating rod drives the spoiler to revolve and disturbs the etching liquid on the left side of the partition plate to merge with the photoresist, and at the same time, when the electric rotating rod rotates, the reciprocating spiral groove on its outer wall restricts the built-in block of the sliding plate, so that the sliding plate can The U-shaped tube assembly can slide back and forth along the inner wall of the etching box, and the sliding plate drives the U-shaped tube assembly to move synchronously, and the circulating pump is started. The circulating pump pumps the mixed etching liquid on the left side of the partition plate and injects it into the right side of the partition plate from the bottom. At this time, the etching liquid etches the chip, and at the same time, the right end of the U-shaped tube assembly continuously moves upward and sprays liquid, so that the etching liquid pressure at the bottom of the filter hole frame is stronger than the pressure at the top. Under the action of the pressure difference, the semiconductor chip is forced to leave the filter hole frame and float upward; the sliding plate drives the vertical rod to move upward and reset, the vertical rod drives the filter plate to move synchronously, and the filter plate drives the transmission roller to move synchronously along the left side of the inner wall of the etching box. The transmission roller starts to rotate by the friction when it contacts the left side of the inner wall of the etching box. When the etching is completed, the telescopic rod drives the filter hole frame to move upward to facilitate the staff to take away the semiconductor chip. At the same time, the U-shaped tube assembly continuously injects etching liquid into the right side of the partition plate with the help of the circulating pump. The liquid higher than the liquid level tank of the partition plate carries the impurity particles floating on its top through the liquid level tank and flows into the left side of the partition plate synchronously, and the filter plate receives the liquid.

[0010] According to the above technical scheme, the anti-centering device includes a screw rod, a connecting rod slider, an L-shaped plate, a round rod, a brush plate and a guide plate. Both ends of the screw rod are fixedly installed on the side of the transmission roller close to the axis of the filter plate. The connecting rod slider passes through and is threadedly connected to the outer wall of the screw rod. The bottom of the left end of the L-shaped plate is fixed to the top of the connecting rod slider. A square groove is opened inside the L-shaped plate. Both ends of the round rod are fixedly installed inside the square groove of the L-shaped plate. The brush plate is passed through by a torsion spring and is hinged at the outer wall of the round rod. The top of the guide plate is hinged to the outer wall of the brush plate.

[0011] The U-shaped groove of the filter plate is connected to the bottom of the brush plate and the top of the filter plate is connected to the guide plate. The guide plate is connected to the L-shaped plate. The top of the brush plate is connected to the top of the filter plate. The guide plate is connected to the L-shaped plate. The top of the brush plate is connected to the top of the filter plate. The guide plate is connected to the L-shaped plate. During the movement of the round rod, friction is generated between the bottom of the brush plate and the top of the filter plate. At this time, the hinge shaft between the brush plate and the round rod begins to rotate, and drives the brush plate to deflect and tilt in the opposite direction of the movement of the round rod. With the help of the torsion spring, the bottom of the brush plate is always close to the top of the filter plate for brushing. At the same time, when the brush plate tilts and deflects, it drives the guide plate to slide along the arc surface at the edge of the L-shaped plate. During the sliding process, the guide plate is limited by the edge of the L-shaped plate, causing its own hinge shaft to start rotating and gradually change the tilt amplitude.

[0012] According to the above technical scheme, the anti-centering device also includes a U-shaped plate, a circular vibration plate and an arc block. The top of the U-shaped plate is fixedly installed on the bottom of the connecting rod slider, the bottom of the circular vibration plate is fixedly installed on the bottom of the inner wall of the U-shaped plate, and the top of the arc block is fixedly installed on the bottom of the filter plate. The arc surface of the bottom of the arc block is located on the movement trajectory of the circular vibration plate. When the connecting rod slider slides, it drives the U-shaped plate to move synchronously, and the U-shaped plate drives the circular vibration plate to move synchronously. During the horizontal movement of the circular vibration plate, it contacts the arc surface of the arc block, causing the contacted end of the circular vibration plate to bend and deform. Afterwards, with the help of the arc surface guide between the two, the circular vibration plate is prompted to pass over the arc block in a bent posture, and swing back and forth and generate vibration during the recovery process of the circular vibration plate.

[0013] According to the above technical solution, the anti-residue device includes a transverse plate, a wave plate, a sliding frame, a transmission rod and a friction roller. The top of the transverse plate is fixedly installed on the bottom of the U-shaped plate, the top of the wave plate is fixedly installed on the bottom of the left end of the transverse plate, the bottom of the sliding frame is fixedly installed on the right side of the top of the transverse plate, both ends of the transmission rod are rotatably installed inside the sliding frame, and the friction roller passes through the inside and is fixedly installed on the outer wall of the transmission rod.

[0014] According to the above technical scheme, the wave plate is located above the injection hole of the photoresist assembly, the top of the sliding frame is slidably installed on the bottom of the filter plate, the outer wall of the friction roller is in contact with the bottom of the filter plate, and the U-shaped plate slides horizontally and drives the cross plate to move synchronously during the reciprocating up and down movement. The cross plate drives the wave plate to move horizontally and up and down. During the movement, the wave plate guides and disperses the photoresist injected on the left side of the etching box through its own wave surface. At the same time, the cross plate drives the sliding frame to move synchronously. When the sliding frame drives the transmission rod to move horizontally, the transmission rod drives the friction roller to slide synchronously along the bottom of the filter plate and generate friction. At this time, the friction roller rotates along the outer wall of the transmission rod through friction.

[0015] The cam is then moved back and forth to move along the L-shaped extension plate, and the cam is moved back and forth to move along the L-shaped extension plate, so that the cam can move forward and backward, and the cam can move forward and backward to move along the L-shaped extension plate, so that the cam can move forward and backward to move along the L-shaped extension plate, and ...

[0016] A method for using an etching device for semiconductor chip production comprises the following steps:

[0017] S1: A composite film of plastic film and aluminum foil is used to cover and seal the injection hole on the outer wall of the photoresist component, and a rubber cross valve is provided inside the injection hole of the photoresist component. When the photoresist needs to be used, a straight tube with the same diameter is inserted until the aluminum foil composite film is pierced, and the switch on the barrel cover of the photoresist component is pressed down to make the air pressure inside the barrel the same as that outside the barrel. At this time, the photoresist flows into the left side of the etching box along the straight tube. After use, only the switch of the barrel cover needs to be lifted up, and then the straight tube is pulled out, and the internal rubber cross valve will be closed and blocked to prevent the photoresist from continuing to flow out;

[0018] S2: First, place the semiconductor chip inside the filter frame. When the telescopic end of the telescopic rod moves downward, the filter frame is driven to move synchronously, that is, the chip is driven to move downward. At the same time, the telescopic end of the telescopic rod pulls the sealing plate to slide downward along the outer wall of the limit rod and seals the right side of the top of the etching box. Then, the etching liquid is injected into the left side of the etching box, that is, the left side of the partition plate.

[0019] S3: At the same time, the through hole on the left side of the etching box is matched with the injection hole of the photoresist assembly, and the photoresist enters the etching box through the straight tube, and the electric rotating rod is started. The electric rotating rod drives the spoiler to revolve and disturbs the etching liquid on the left side of the partition plate to merge with the photoresist. At the same time, when the electric rotating rod rotates, the reciprocating spiral groove on its outer wall restricts the built-in block of the sliding plate, so that the sliding plate can slide back and forth along the inner wall of the etching box, and the sliding plate drives the U-shaped tube assembly to move synchronously;

[0020] S4: Start the circulation pump, which pumps the mixed etching liquid on the left side of the partition plate and injects it into the right side of the partition plate from the bottom. At this time, the etching liquid etches the chip. At the same time, the right end of the U-shaped tube assembly continuously moves upward and sprays liquid, so that the etching liquid pressure at the bottom of the filter frame is stronger than the pressure at the top. Under the action of the pressure difference, the semiconductor chip is forced to leave the filter frame and float upward.

[0021] The present invention provides an etching device and method for semiconductor chip production, which has the following beneficial effects:

[0022] (1) The present invention effectively prevents the photoresist from continuing to flow out by setting up an anti-blur device, through the cooperation of a photoresist assembly, a rubber cross valve, an aluminum foil composite film and a straight tube. When used next time, only the straight tube and the aluminum foil composite film need to be replaced, thereby preventing the new pollution source at the exposed injection hole from polluting the photoresist. The material used is simple and the outflow and cutoff of the photoresist can be controlled at all times.

[0023] Through the coordination of electric rotating rod, spoiler, sliding plate, U-shaped tube assembly, circulating pump, vertical rod, filter plate and transmission roller, after the photoresist is mixed with the etching liquid, the photolithography resolution in the chip etching process is improved, thereby improving the etching clarity of the semiconductor chip and thus improving the etching quality. At the same time, in the process of continuous movement of the U-shaped tube assembly, the upper and lower pressure difference of the etching liquid on the right side inside the etching box is effectively changed, shortening the time required for comprehensive etching of the chip and improving the etching efficiency; at the same time, the transmission roller is relied on to increase the smoothness of the sliding of the filter plate, and at the same time, the impurity particles received are effectively dispersed during the reciprocating motion of the filter plate to prevent the impurity particles from accumulating in the center and scouring and crushing each other, and preventing impurities from flowing under the filter plate, preventing the chip surface from being damaged in the later etching process and causing etching blur, and relying on the filter plate to effectively shorten the maintenance time of the equipment after the etching is completed.

[0024] (2) The present invention sets an anti-centering device, and cooperates with a transmission roller, a screw rod, a connecting rod slider, an L-shaped plate, a round rod, a brush plate, a guide plate, a U-shaped plate, a circular vibration plate and an arc block. With the help of the brush plate, the top of the filter plate is tightly attached and brushed back and forth to ensure the cleanliness of the top of the filter plate. At the same time, it prevents the fallen particulate impurities from solidifying on the surface of the filter plate, accelerating the oxidation rate of the filter plate and thus changing the filter hole aperture, increasing the possibility of particulate matter damaging the chip after passing through the filter plate. At the same time, the guide plate with a continuously changing inclination amplitude evenly guides the fallen impurities to prevent impurities from gathering or accumulating in the center on the top of the filter plate to affect the flow of liquid; and the brush plate is prompted to carry vibration force to further enhance the brushing effect on the top of the filter plate. At the same time, the vibration force is used to reduce the blocking tightness of impurities in the filter hole of the filter plate, so that the filter plate can brush the particulate matter out of the filter hole of the filter plate in time to ensure the smoothness of the filter plate and avoid the slowdown of the falling speed of the etching liquid.

[0025] (3) The present invention sets an anti-residue device, and cooperates with a U-shaped plate, a horizontal plate, a wave plate, a sliding frame, a transmission rod, a friction roller, a cam, an L-shaped telescopic plate, a contact plate and a stirring block. The wave plate is used to promote the rapid dispersion of the photoresist when it is injected into the etching box, and the photoresist is quickly and evenly dissolved in the etching liquid under the rotation of the spoiler, thereby shortening the preparation time for the etching work. At the same time, the friction roller rotates to brush away the photoresist attached to the bottom of the filter plate during the reciprocating up and down movement and the beneficial substances precipitated in the etching liquid, thereby promoting the beneficial substances to dissolve in the liquid and preventing the photoresist and the etching liquid from being reduced in use efficiency. At the same time, the stirring block is urged to squeeze the liquid on its top and around the concave surface of the wave plate, and then the relative flow rate of the liquid around the wave plate is accelerated with the help of the wave surface of the wave plate and the arc surface of the stirring block, thereby effectively avoiding the concentration of photoresist around the wave plate and preventing the etching effect of the etching liquid on the chip from being different. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the present invention as a whole;

[0027] Figure 2 It is a cross-sectional schematic diagram of the present invention as a whole;

[0028] Figure 3 It is a schematic diagram of the anti-blur device of the present invention;

[0029] Figure 4 It is a schematic diagram showing the overall structure of the anti-blurring device of the present invention;

[0030] Figure 5 This is a schematic diagram of the anti-centering device of the present invention;

[0031] Figure 6 For the present invention Figure 5 A schematic diagram of the structure enlargement in the middle;

[0032] Figure 7 This is a schematic diagram of the bottom viewing angle of the anti-centering device of the present invention;

[0033] Figure 8 This is a schematic diagram of the anti-residue device of the present invention;

[0034] Fig. 9 This is a schematic diagram of the bottom perspective of the anti-residue device of the present invention.

[0035] In the figure: 1. base; 2. etching box; 21. photoresist assembly; 22. limit rod; 23. sealing plate; 3. telescopic rod; 31. filter hole frame; 32. partition plate; 4. anti-blurring device; 41. electric rotating rod; 42. spoiler; 43. sliding plate; 44. U-shaped tube assembly; 45. circulating pump; 46. vertical rod; 47. filter plate; 48. transmission roller; 5. anti-centering device; 51. screw rod; 52. connecting rod slider; 53. L-shaped plate; 54. round rod; 55. brush plate; 56. guide plate; 57. U-shaped plate; 58. circular vibration plate; 59. arc block; 6. anti-residue device; 61. horizontal plate; 62. wave plate; 63. sliding frame; 64. transmission rod; 65. friction roller; 66. cam; 67. L-shaped telescopic plate; 68. contact plate; 69. pounding block. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0037] See also Figure 1-Figure 9 An embodiment of the present invention is: an etching device used in semiconductor chip production, comprising a base 1, an etching box 2 is arranged on the top of the base 1, a photoresist assembly 21 is arranged on the left side of the etching box 2, and a plurality of obliquely distributed injection holes are opened on the right side of the photoresist assembly 21, a plurality of limit rods 22 are symmetrically arranged on the outer wall of the etching box 2, a sealing plate 23 is arranged on the outer wall of the plurality of limit rods 22, a telescopic rod 3 is arranged at the bottom corner of the inner wall of the etching box 2, the top of the telescopic end of the telescopic rod 3 is fixedly installed at the bottom of the sealing plate 23, a filter hole frame 31 is arranged on the outer wall of the telescopic end of the telescopic rod 3, a partition plate 32 is arranged inside the etching box 2, and a liquid level tank is opened inside the partition plate 32;

[0038] An anti-blur device 4 is provided on the left side of the etching box 2, an anti-centering device 5 is provided above the anti-blur device 4, and an anti-residue device 6 is provided below the anti-centering device 5;

[0039] The anti-blurring device 4 includes an electric rotating rod 41, the bottom of which is rotatably installed on the left side of the bottom of the inner wall of the etching box 2, the outer wall of the electric rotating rod 41 is provided with a reciprocating spiral groove, and a disturbance flow plate 42 is fixedly installed at the lower part of the outer wall of the electric rotating rod 41, and a sliding plate 43 is penetrated and movably installed on the outer wall of the reciprocating spiral groove of the electric rotating rod 41, and two U-shaped pipe assemblies 44 are penetrated and symmetrically fixedly installed inside the sliding plate 43, and a circulating pump 45 is arranged on the outer wall of the U-shaped pipe assembly 44, a vertical rod 46 is fixedly installed on the top of the sliding plate 43, and a filter plate 47 is fixedly installed on the top of the vertical rod 46, a U-shaped groove is opened on the left side of the filter plate 47, and a transmission roller 48 is rotatably installed inside the U-shaped groove of the filter plate 47.

[0040] If the interference flow plates 42 are evenly distributed on the outer wall of the electric rotating rod 41, the front and back of the sliding plate 43 are slidably installed on the inner wall of the etching box 2, the top of the right end of the two U-shaped tube components 44 can move through the inside of the etching box 2, the U-shaped tube component 44 is located below the filter hole frame 31, and the outer wall of the driving roller 48 is in contact with the left side of the inner wall of the etching box 2. Through the above cooperation, with the help of the photoresist and the etching liquid mixed, the photolithography resolution in the chip etching process is improved, thereby improving the etching clarity of the semiconductor chip and thus improving the etching quality. At the same time, the U-shaped tube component 44 is continuously moved. During the movement, the upper and lower pressure differences of the etching liquid on the right side of the etching box 2 are effectively changed, the time required for comprehensive etching of the chip is shortened, and the etching efficiency is improved; through the above cooperation, the transmission roller 48 is relied on to increase the smoothness of the sliding of the filter plate 47, and at the same time, the impurity particles received by the filter plate 47 are effectively dispersed during the reciprocating motion, to prevent the impurity particles from accumulating in the center and scouring and crushing each other, to prevent impurities from flowing under the filter plate 47, to prevent the chip surface from being damaged in the later etching process and causing etching blur, and to rely on the filter plate 47 to effectively shorten the maintenance time of the equipment after the etching is completed.

[0041] When in use, a composite film of a plastic film and an aluminum foil is used to cover and seal the injection hole on the outer wall of the photoresist component 21, and a rubber cross valve is arranged inside the injection hole of the photoresist component 21. When the photoresist is needed, a straight tube with the same aperture size is inserted until the aluminum foil composite film is pierced, and the switch on the barrel cover of the photoresist component 21 is pressed down to make the air pressure inside the barrel the same as that outside the barrel. At this time, the photoresist flows into the left side of the inside of the etching box 2 along the straight tube. After use, only the switch of the barrel cover needs to be lifted up, and then the straight tube is pulled out, and the internal rubber cross valve will be closed and blocked to prevent the photoresist from continuing to flow out. When used next time, only the straight tube and the aluminum foil composite film need to be replaced to prevent the new pollution source at the exposed injection hole from polluting the photoresist. The material is simple and the outflow and cutoff of the photoresist can be controlled at all times.

[0042] First, a semiconductor chip is placed inside the filter hole frame 31. When the telescopic end of the telescopic rod 3 moves downward, the filter hole frame 31 is driven to move synchronously, that is, the chip is driven to move downward. At the same time, the telescopic end of the telescopic rod 3 pulls the sealing plate 23 to slide downward along the outer wall of the limit rod 22 and seals the top right side of the etching box 2. Then, the etching liquid is injected into the left side of the etching box 2, that is, the left side of the partition plate 32. At the same time, the through hole on the left side of the etching box 2 is matched with the injection hole of the photoresist assembly 21, and the photoresist enters the etching box 2 through the straight tube. The electric rotating rod 41 is started, and the electric rotating rod 41 drives the spoiler 42 to revolve and disturbs the etching liquid on the left side of the partition plate 32 to merge with the photoresist. At the same time, the electric rotating rod 41 rotates. The reciprocating spiral groove on its outer wall limits the built-in block of the sliding plate 43, so that the sliding plate 43 can slide back and forth along the inner wall of the etching box 2, and the sliding plate 43 drives the U-shaped tube assembly 44 to move synchronously, and the circulation pump 45 is started. The circulation pump 45 pumps the mixed etching liquid on the left side of the partition plate 32 and injects it from the bottom to the right side of the partition plate 32. At this time, the etching liquid etches the chip, and at the same time, the right end of the U-shaped tube assembly 44 continuously moves upward and sprays liquid, so that the etching liquid pressure at the bottom of the filter hole frame 31 is stronger than the pressure at the top. Under the action of the pressure difference, the semiconductor chip is separated from the filter hole frame 31 and floats upward. Through the above cooperation, with the help of the photoresist and the etching liquid, the etching liquid is raised. The photolithography resolution during chip etching is improved, thereby improving the etching clarity of the semiconductor chip and thus improving the etching quality. At the same time, during the continuous movement of the U-shaped tube assembly 44, the upper and lower pressure differences of the etching liquid on the right side of the etching box 2 are effectively changed, shortening the time required for comprehensive etching of the chip and improving the etching efficiency; the sliding plate 43 drives the vertical rod 46 to move upward and reset, the vertical rod 46 drives the filter plate 47 to move synchronously, the filter plate 47 drives the transmission roller 48 to move synchronously along the left side of the inner wall of the etching box 2, and the transmission roller 48 starts to rotate by the friction force when it contacts the left side of the inner wall of the etching box 2. When the etching is completed, the telescopic rod 3 drives the filter hole frame 31 to move upward to facilitate the staff to take away the semiconductor chip At the same time, the U-shaped tube assembly 44 continuously injects etching liquid into the right side of the partition plate 32 with the help of the circulation pump 45. The liquid above the liquid level tank of the partition plate 32 flows synchronously into the left side of the partition plate 32 through the liquid level tank carrying the impurity particles floating on the top of itself, and the filter plate 47 receives the liquid. Through the above cooperation, the transmission roller 48 is relied on to increase the smoothness of the sliding of the filter plate 47. At the same time, the impurity particles received by the filter plate 47 are effectively dispersed during the reciprocating motion of the filter plate 47 to prevent the impurity particles from accumulating in the center and scouring and crushing each other, and to avoid impurities from flowing under the filter plate 47, so as to prevent the chip surface from being damaged in the later etching process and causing the etching to be blurred, and the maintenance time of the equipment after the etching is effectively shortened by relying on the filter plate 47.

[0043] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes an anti-centering device 5;

[0044] The anti-centering device 5 includes a screw rod 51, a connecting rod slider 52, an L-shaped plate 53, a round rod 54, a brush plate 55 and a guide plate 56. Both ends of the screw rod 51 are fixedly installed on the side of the transmission roller 48 close to the axis of the filter plate 47. The connecting rod slider 52 passes through and is threadedly connected to the outer wall of the screw rod 51. The bottom of the left end of the L-shaped plate 53 is fixed to the top of the connecting rod slider 52. A square groove is opened inside the L-shaped plate 53. Both ends of the round rod 54 are fixedly installed inside the square groove of the L-shaped plate 53. The brush plate 55 passes through a torsion spring and is hinged to the outer wall of the round rod 54. The top of the guide plate 56 is hinged to the outer wall of the brush plate 55.

[0045] The right side of the connecting rod slider 52 is slidably connected to the inner wall of the U-shaped groove of the filter plate 47, the bottom of the brush plate 55 contacts the top of the filter plate 47, and the inclined surface of the guide plate 56 contacts the arc surface of the outer wall of the L-shaped plate 53. Through the above cooperation, the brush plate 55 is closely attached to the top of the filter plate 47 and brushes back and forth to ensure the cleanliness of the top of the filter plate 47, while preventing the fallen particulate impurities from solidifying on the surface of the filter plate 47 to accelerate the oxidation rate of the filter plate 47 and thus change the aperture of the filter holes, increasing the possibility of particulate matter damaging the chip after passing through the filter plate 47. At the same time, the guide plate 56, which continuously changes the inclination amplitude, evenly guides the fallen impurities to prevent the impurities from gathering or accumulating in the center on the top of the filter plate 47 and affecting the liquid circulation.

[0046] The anti-centering device 5 also includes a U-shaped plate 57, a circular vibration plate 58 and a curved block 59. The top of the U-shaped plate 57 is fixedly mounted on the bottom of the connecting rod slider 52, the bottom of the circular vibration plate 58 is fixedly mounted on the bottom of the inner wall of the U-shaped plate 57, and the top of the curved block 59 is fixedly mounted on the bottom of the filter plate 47. The curved surface of the bottom of the curved block 59 is located on the movement trajectory of the circular vibration plate 58. The filter plate 47 is vibrated by force transmission. Through the above cooperation, the brushing plate 55 is caused to carry the vibration force to further enhance the brushing effect on the top of the filter plate 47. At the same time, the vibration force is used to reduce the jamming tightness of impurities in the filter holes of the filter plate 47, so that the filter plate 47 can brush the particles out of the filter holes of the filter plate 47 in time to ensure the smoothness of the filter plate 47 and avoid the slowdown of the falling speed of the etching liquid.

[0047] When in use, the driving roller 48 realizes forward and reverse rotation during the up and down movement. At this time, the driving roller 48 drives the screw rod 51 to realize forward and reverse rotation. When the screw rod 51 rotates forward and reverse, the connecting rod slider 52 connected with the thread drives the spiral groove to slide back and forth along the inner wall of the U-shaped groove of the filter plate 47. The connecting rod slider 52 drives the L-shaped plate 53 to move synchronously. The L-shaped plate 53 drives the round rod 54 to move synchronously. The round rod 54 drives the brush plate 55 to contact the top surface of the filter plate 47. During the movement of the round rod 54, friction is generated between the bottom of the brush plate 55 and the top of the filter plate 47. At this time, the brush plate 55 and the round rod 54 are in contact with each other. The hinge shaft between the two ends of the L-shaped plate 53 begins to rotate, and drives the brush plate 55 to deflect and tilt in the opposite direction of the movement of the round rod 54, and with the help of the torsion spring to limit the brush plate 55, the bottom of the brush plate 55 is always close to the top of the filter plate 47 for brushing. At the same time, when the brush plate 55 is tilted and deflected, it drives the guide plate 56 to slide along the arc surface at the edge of the L-shaped plate 53. During the sliding process, the guide plate 56 is limited by the resistance at the edge of the L-shaped plate 53, causing its own hinge shaft to start rotating and gradually change the inclination amplitude. Through the above cooperation, the brush plate 55 is close to the top of the filter plate 47 and brushes back and forth to ensure The cleanliness of the top of the filter plate 47 is improved, and at the same time, the fallen particulate impurities are prevented from solidifying on the surface of the filter plate 47, accelerating the oxidation speed of the filter plate 47, thereby changing the pore size of the filter hole, and increasing the possibility of particulate matter damaging the chip after passing through the filter plate 47. At the same time, the guide plate 56 with a continuously changing inclination amplitude guides the fallen impurities evenly to prevent the impurities from gathering or accumulating in the center on the top of the filter plate 47 and affecting the liquid circulation; when the connecting rod slider 52 slides, it drives the U-shaped plate 57 to move synchronously, and the U-shaped plate 57 drives the round-shaped vibration plate 58 to move synchronously. During the horizontal movement of the round-shaped vibration plate 58, it contacts the arc surface of the arc surface block 59 to promote The end that is resisted is bent and deformed, and then the arc guide between the two is used to force the circular vibration plate 58 to pass over the arc block 59 in a bent posture. During the recovery process of the circular vibration plate 58, it swings back and forth and vibrates, and the filter plate 47 is vibrated by force transmission. Through the above cooperation, the brushing plate 55 is prompted to carry the vibration force to further enhance the brushing effect on the top of the filter plate 47. At the same time, the vibration force is used to reduce the blocking tightness of impurities in the filter holes of the filter plate 47, so that the filter plate 47 can brush the particles out of the filter holes of the filter plate 47 in time to ensure the smoothness of the filter plate 47 and avoid the slowdown of the falling speed of the etching liquid.

[0048] See also Figure 1-Figure 9 , based on the above embodiment, another embodiment of the present invention further includes an anti-residue device 6;

[0049] The anti-residue device 6 includes a transverse plate 61, a wave plate 62, a sliding frame 63, a transmission rod 64 and a friction roller 65. The top of the transverse plate 61 is fixedly installed on the bottom of the U-shaped plate 57, the top of the wave plate 62 is fixedly installed on the bottom of the left end of the transverse plate 61, the bottom of the sliding frame 63 is fixedly installed on the right side of the top of the transverse plate 61, both ends of the transmission rod 64 are rotatably installed inside the sliding frame 63, and the friction roller 65 passes through the inside and is fixedly installed on the outer wall of the transmission rod 64.

[0050] The wave plate 62 is located above the injection hole of the photoresist assembly 21, the top of the sliding frame 63 is slidably installed on the bottom of the filter plate 47, and the outer wall of the friction roller 65 is in contact with the bottom of the filter plate 47. Through the above cooperation, the wave plate 62 is relied on to promote the rapid dispersion of the photoresist when it is injected into the etching box 2, and it is quickly and evenly dissolved in the etching liquid under the rotation of the spoiler 42, thereby shortening the preparation time for the etching work. At the same time, the friction roller 65 rotates to brush off the photoresist attached to the bottom of the filter plate 47 during the reciprocating up and down motion and the beneficial substances precipitated in the etching liquid, promote the dissolution of the beneficial substances in the liquid, and prevent the photoresist and the etching liquid from being reduced in effectiveness.

[0051] The anti-residue device 6 also includes a cam 66, an L-shaped telescopic plate 67, a contact plate 68, and a stirring block 69. The cam 66 penetrates through and is fixedly installed on the outer wall of the middle end of the transmission rod 64. The top of the telescopic end of the L-shaped telescopic plate 67 is fixedly installed on the bottom of the right end of the horizontal plate 61. The bottom of the contact plate 68 is fixedly installed on the bottom of the inner wall of the L-shaped telescopic plate 67. The arc surface of the contact plate 68 contacts the outer wall of the cam 66. The bottom of the stirring block 69 is fixedly installed on the top of the left end of the L-shaped telescopic plate 67. The stirring block 69 is located below the wave plate 62. Through the above cooperation, the stirring block 69 is prompted to squeeze the liquid on its own top and around the concave surface of the wave plate 62. Then, with the help of the wave surface of the wave plate 62 and the arc surface guidance of the stirring block 69, the relative flow rate of the liquid around the wave plate 62 is accelerated, thereby effectively avoiding the aggregation concentration of the photoresist around the wave plate 62 and preventing the overall etching effect of the etching solution on the chip from being different.

[0052] When in use, the U-shaped plate 57 slides horizontally and drives the cross plate 61 to move synchronously during the reciprocating up and down movement. The cross plate 61 drives the wave plate 62 to move horizontally and up and down. During the movement, the wave plate 62 guides and disperses the photoresist injected on the left side of the etching box 2 through its own wave surface. At the same time, the cross plate 61 drives the sliding frame 63 to move synchronously. When the sliding frame 63 drives the transmission rod 64 to move horizontally, the transmission rod 64 drives the friction roller 65 to slide synchronously along the bottom of the filter plate 47 and generate friction. At this time, the friction roller 65 rotates along the outer wall of the transmission rod 64 through the friction. Through the above cooperation, the wave plate 62 is used to enable the photoresist to be quickly dispersed when it is injected into the etching box 2. It is quickly and evenly dissolved in the etching solution when the spoiler 42 rotates, thereby shortening the preparation time for the etching work. At the same time, the friction roller 65 rotates to brush off the photoresist attached to the bottom of the filter plate 47 during the reciprocating up and down movement and the beneficial substances precipitated by the etching solution, promoting the beneficial substances When the transmission rod 64 rotates, it drives the cam 66 to rotate. When the cam 66 rotates, the resistance and suppression on the contact plate 68 are released. At this time, the built-in spring force of the L-shaped telescopic plate 67 pulls the telescopic end of the L-shaped telescopic plate 67 to move upward, and drives the contact plate 68 to move synchronously. When the contact plate 68 contacts the convex surface of the cam 66 again, the L-shaped telescopic plate 67 is reset. The reciprocating movement of the L-shaped telescopic plate 67 drives the stirring block 69 to move upward and reset, that is, the stirring block 69 will move toward the concave surface of the wave plate 62 and reset. Through the above cooperation, the stirring block 69 is forced to squeeze the liquid on its top and around the concave surface of the wave plate 62, and then with the help of the wave surface of the wave plate 62 and the arc surface guidance of the stirring block 69, the relative flow rate of the liquid around the wave plate 62 is accelerated, the concentration of photoresist around the wave plate 62 is effectively avoided, and the etching effect of the etching solution on the chip is prevented from being different.

[0053] A method for using an etching device for semiconductor chip production comprises the following steps:

[0054] S1: A composite film of a plastic film and an aluminum foil is used to cover and seal the injection hole on the outer wall of the photoresist component 21, and a rubber cross valve is provided inside the injection hole of the photoresist component 21. When the photoresist needs to be used, a straight tube with the same hole diameter is only needed to be inserted until the aluminum foil composite film is pierced, and the switch on the barrel cover of the photoresist component 21 is pressed down to make the air pressure inside the barrel the same as that outside the barrel. At this time, the photoresist flows into the left side of the etching box 2 along the straight tube. After use, only the switch of the barrel cover needs to be lifted up, and then the straight tube is pulled out, and the internal rubber cross valve will be closed and blocked to prevent the photoresist from continuing to flow out;

[0055] S2: First, place the semiconductor chip inside the filter frame 31. When the telescopic end of the telescopic rod 3 moves downward, the filter frame 31 is driven to move synchronously, that is, the chip is driven to move downward. At the same time, the telescopic end of the telescopic rod 3 pulls the sealing plate 23 to slide downward along the outer wall of the limit rod 22 and seals the right side of the top of the etching box 2. Then, the etching liquid is injected into the left side of the inside of the etching box 2, that is, the left side of the partition plate 32.

[0056] S3: At the same time, the through hole on the left side of the etching box 2 is matched with the injection hole of the photoresist assembly 21, and the photoresist enters the etching box 2 through the straight tube, and the electric rotating rod 41 is started. The electric rotating rod 41 drives the spoiler 42 to revolve and disturbs the etching liquid on the left side of the partition plate 32 to merge with the photoresist. At the same time, when the electric rotating rod 41 rotates, the reciprocating spiral groove on its outer wall restricts the built-in block of the sliding plate 43, so that the sliding plate 43 can slide back and forth along the inner wall of the etching box 2, and the sliding plate 43 drives the U-shaped tube assembly 44 to move synchronously;

[0057] S4: Start the circulation pump 45, which pumps the mixed etching liquid on the left side of the partition plate 32 and injects it from the bottom to the right side of the partition plate 32. At this time, the etching liquid etches the chip. At the same time, the right end of the U-shaped tube assembly 44 continuously moves upward and sprays liquid, so that the etching liquid pressure at the bottom of the filter hole frame 31 is stronger than the pressure at the top. Under the action of the pressure difference, the semiconductor chip is forced to separate from the filter hole frame 31 and float upward.

Claims

1. An etching device for use in semiconductor chip production, comprising a base (1), characterized in that: An etching box (2) is arranged on the top of the base (1), a photoresist assembly (21) is arranged on the left side of the etching box (2), and a plurality of obliquely distributed injection holes are provided on the right side of the photoresist assembly (21), a plurality of limit rods (22) are symmetrically arranged on the outer wall of the etching box (2), and a sealing plate (23) is provided on the outer walls of the plurality of limit rods (22), telescopic rods (3) are arranged at the bottom corners of the inner wall of the etching box (2), the top of the telescopic end of the telescopic rod (3) is fixedly mounted on the bottom of the sealing plate (23), and a filter hole frame (31) is provided on the outer wall of the telescopic end of the telescopic rod (3), and a partition plate (32) is arranged inside the etching box (2), and a liquid level tank is provided inside the partition plate (32); An anti-blurring device (4) is arranged on the left side inside the etching box (2), an anti-centering device (5) is arranged above the anti-blurring device (4), and an anti-residue device (6) is arranged below the anti-centering device (5); The anti-blurring device (4) comprises an electric rotating rod (41), the bottom of the electric rotating rod (41) is rotatably mounted on the left side of the bottom of the inner wall of the etching box (2), the outer wall of the electric rotating rod (41) is provided with a reciprocating spiral groove, and a plurality of interfering flow plates (42) are fixedly mounted on the lower part of the outer wall of the electric rotating rod (41), a sliding plate (43) is penetrated through and movably mounted on the outer wall of the reciprocating spiral groove of the electric rotating rod (41), two U-shaped pipe assemblies (44) are penetrated and symmetrically fixedly mounted inside the sliding plate (43), a circulating pump (45) is arranged on the outer wall of the U-shaped pipe assembly (44), a vertical rod (46) is fixedly mounted on the top of the sliding plate (43), a filter plate (47) is fixedly mounted on the top of the vertical rod (46), a U-shaped groove is formed on the left side of the filter plate (47), and a transmission roller (48) is rotatably mounted inside the U-shaped groove of the filter plate (47); The anti-centering device (5) comprises a screw rod (51), a connecting rod slider (52), an L-shaped plate (53), a round rod (54), a brush plate (55) and a guide plate (56); both ends of the screw rod (51) are fixedly mounted on the side of the transmission roller (48) close to the axis of the filter plate (47); the connecting rod slider (52) penetrates inside and is threadedly connected to the outer wall of the screw rod (51); the bottom of the left end of the L-shaped plate (53) is fixed to the top of the connecting rod slider (52); a square groove is formed inside the L-shaped plate (53); both ends of the round rod (54) are fixedly mounted inside the square groove of the L-shaped plate (53); a torsion spring penetrates inside the brush plate (55) and is hinged to the outer wall of the round rod (54); and the top of the guide plate (56) is hinged to the outer wall of the brush plate (55); The anti-residue device (6) comprises a transverse plate (61), a wave plate (62), a sliding frame (63), a transmission rod (64) and a friction roller (65); the top of the transverse plate (61) is fixedly mounted on the bottom of the U-shaped plate (57); the top of the wave plate (62) is fixedly mounted on the bottom of the left end of the transverse plate (61); the bottom of the sliding frame (63) is fixedly mounted on the right side of the top of the transverse plate (61); both ends of the transmission rod (64) are rotatably mounted inside the sliding frame (63); and the friction roller (65) penetrates inside and is fixedly mounted on the outer wall of the transmission rod (64).

2. The etching device used in semiconductor chip production according to claim 1, characterized in that: A plurality of spoilers (42) are equidistantly distributed on the outer wall of the electric rotating rod (41); the front and back sides of the sliding plate (43) are slidably mounted on the inner wall of the etching box (2); the tops of the right ends of the two U-shaped tube assemblies (44) movably penetrate the interior of the etching box (2); the U-shaped tube assemblies (44) are located below the filter hole frame (31); and the outer wall of the driving roller (48) contacts the left side of the inner wall of the etching box (2).

3. The etching device used in semiconductor chip production according to claim 2, characterized in that: The right side of the connecting rod slider (52) is slidably connected to the inner wall of the U-shaped groove of the filter plate (47), the bottom of the brush plate (55) contacts the top of the filter plate (47), and the inclined surface of the guide plate (56) contacts the arc surface of the outer wall of the L-shaped plate (53).

4. The etching device used in semiconductor chip production according to claim 3, characterized in that: The anti-centering device (5) further comprises a U-shaped plate (57), a circular vibration plate (58) and a curved surface block (59); the top of the U-shaped plate (57) is fixedly mounted on the bottom of the connecting rod slider (52); the bottom of the circular vibration plate (58) is fixedly mounted on the bottom of the inner wall of the U-shaped plate (57); the top of the curved surface block (59) is fixedly mounted on the bottom of the filter plate (47); and the curved surface of the bottom of the curved surface block (59) is located on the motion trajectory of the circular vibration plate (58).

5. The etching device used in semiconductor chip production according to claim 4, characterized in that: The wave plate (62) is located above the injection hole of the photoresist assembly (21), the top of the sliding frame (63) is slidably mounted on the bottom of the filter plate (47), and the outer wall of the friction roller (65) is in contact with the bottom of the filter plate (47).

6. The etching device used in semiconductor chip production according to claim 5, characterized in that: The anti-residue device (6) further comprises a cam (66), an L-shaped telescopic plate (67), a contact plate (68), and a stirring block (69); the cam (66) penetrates the inside and is fixedly mounted on the outer wall of the middle end of the transmission rod (64); the top of the telescopic end of the L-shaped telescopic plate (67) is fixedly mounted on the bottom of the right end of the horizontal plate (61); the bottom of the contact plate (68) is fixedly mounted on the bottom of the inner wall of the L-shaped telescopic plate (67); the arc surface of the contact plate (68) contacts the outer wall of the cam (66); the bottom of the stirring block (69) is fixedly mounted on the top of the left end of the L-shaped telescopic plate (67); and the stirring block (69) is located below the wave plate (62).

7. A method for using an etching device for semiconductor chip production, using the etching device for semiconductor chip production according to claim 6, characterized in that: The following steps are involved: S1: The injection hole on the outer wall of the photoresist component (21) is covered and sealed with a composite film of a plastic film and an aluminum foil, and a rubber cross valve is provided inside the injection hole of the photoresist component (21). When the photoresist is to be used, a straight tube having the same diameter as the hole is inserted until the aluminum foil composite film is pierced, and the switch on the barrel cover of the photoresist component (21) is pressed downward to make the air pressure inside the barrel the same as that outside the barrel. At this time, the photoresist flows along the straight tube into the left side of the inside of the etching box (2). After use, the switch of the barrel cover is lifted upward, and the straight tube is pulled out. The rubber cross valve inside will close and seal to prevent the photoresist from continuing to flow out; S2: firstly, a semiconductor chip is placed inside the filter hole frame (31), and when the telescopic end of the telescopic rod (3) moves downward, the filter hole frame (31) is driven to move synchronously, that is, the chip is driven to move downward, and at the same time, the telescopic end of the telescopic rod (3) pulls the sealing plate (23) to slide downward along the outer wall of the limit rod (22) and seals the top right side of the etching box (2), and then the etching liquid is injected into the left side of the inside of the etching box (2), that is, the left side of the partition plate (32); S3: At the same time, the through hole on the left side of the etching box (2) is matched with the injection hole of the photoresist assembly (21), and the photoresist enters the etching box (2) through the straight tube, and the electric rotating rod (41) is started. The electric rotating rod (41) drives the spoiler (42) to revolve and disturbs the etching liquid on the left side of the partition plate (32) to merge with the photoresist. At the same time, when the electric rotating rod (41) rotates, the reciprocating spiral groove on its outer wall restricts the built-in block of the sliding plate (43), so that the sliding plate (43) can slide back and forth along the inner wall of the etching box (2), and the sliding plate (43) drives the U-shaped tube assembly (44) to move synchronously; S4: The circulation pump (45) is started. The circulation pump (45) pumps the mixed etching liquid on the left side of the partition plate (32) and injects it from the bottom to the right side of the partition plate (32). At this time, the etching liquid etches the chip. At the same time, the right end of the U-shaped tube assembly (44) continuously moves upward and sprays liquid, so that the etching liquid pressure at the bottom of the filter hole frame (31) is stronger than the pressure at the top. Under the action of the pressure difference, the semiconductor chip is separated from the filter hole frame (31) and floats upward.

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