A semiconductor wafer showerhead type megasonic wave cleaning device and method

Abstract

The present invention relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wafer nozzle type megasonic wave cleaning equipment and method, comprising a rectangular box, a through groove penetrating to both sides of the rectangular box is opened in the middle of the rectangular box, a placement plate is slidably arranged in the through groove, a placement unit for placing wafers is arranged on the placement plate, and a circular groove penetrating to the interior is opened at the upper end of the rectangular box, a megasonic wave unit for performing megasonic wave cleaning on the wafers on the placement plate is installed on the circular groove, a plurality of placement units in the present invention are arranged in a circle and can drive the wafers to rotate, and the synchronous megasonic wave units can also rotate along the arrangement path of the circular groove, therefore, a plurality of wafers can be synchronously cleaned by only one megasonic wave device, the efficiency is high, and the applicability of the present invention is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wafer nozzle-type megasonic wave cleaning device and method. Background Art

[0002] Semiconductor wafers are the basic materials for semiconductor device manufacturing, usually made of silicon, gallium arsenide, or other semiconductor materials. Wafers are round sheets with diameters ranging from a few millimeters to tens of centimeters. On the wafer, a series of complex process steps such as photolithography, etching, doping, and deposition are used to form tiny circuit patterns. During the manufacturing process, any tiny particles on the surface of the wafer may affect the accuracy of the circuit pattern, causing device performance degradation or failure. Megasonic cleaning can achieve extremely high cleaning accuracy and effectively remove these tiny particles.

[0003] Megasonic is a technology that uses high-frequency sound waves for cleaning. This technology creates tiny bubbles in the cleaning liquid. When these bubbles grow and collapse rapidly under the action of sound waves, powerful shock waves and microjets are generated, thereby removing pollutants such as particles, dirt and organic matter from the surface of the object. When the existing megasonic wave is used to clean the wafer, it is necessary to manually place the wafer in the cleaning equipment, and then clean the wafer. After cleaning, the wafer is taken out. The process is relatively cumbersome, and during this process, the surface of the wafer may come into contact with the outside world, causing dust to fall on the surface of the wafer, resulting in ineffective cleaning.

[0004] In order to make a more accurate comparison, for example, Chinese patent publication number CN115090596B discloses a wafer cleaning device and a cleaning method based on megasonic wave technology.

[0005] It includes a workbench, a carrier, a spray device, a cavitation detection device and a control unit. The spray device includes a bracket and a spray body. The bracket is relatively movable on the workbench. The spray body includes a nozzle and a megasonic wave component. The cavitation detection device includes a cavitation sensor. The control unit is electrically connected or signal-connected with the cavitation sensor and the spray device respectively.

[0006] However, when the above-mentioned prior art is used to clean wafers with megasonic waves, the following problems still exist:

[0007] 1. There is only one megasonic jet device inside the above-mentioned wafer cleaning device, that is, only one wafer can be cleaned at a time, and the cleaning efficiency is low. In addition, in a single cleaning process, only one side of the wafer can be cleaned, such as the front and back sides of the wafer. That is, the above-mentioned device can only take out the wafer after completing one cleaning, turn it over and perform a second cleaning, which further reduces its cleaning efficiency.

[0008] 2. Some wafers can only be cleaned on one side, and a metal layer is attached to the back side during the manufacturing process. If it comes into contact with water, the metal layer may oxidize and cause damage to the wafer. The above-mentioned device does not have a specific device for protecting and sealing the back side of the wafer during the cleaning process, and the outer side of the wafer is also protected and sealed by the sealing device. Therefore, the liquid may flow along the outside of the wafer to the back side of the wafer, causing damage to the wafer.

[0009] Therefore, based on the above-stated viewpoint, there is still room for optimization in the existing technology of megasonic cleaning of wafers. Summary of the invention

[0010] In order to solve the above problems, the present invention provides a semiconductor wafer nozzle type megasonic wave cleaning equipment, including a rectangular box, a through groove penetrating to both sides of the rectangular box is opened in the middle of the rectangular box, a placement plate is slidably arranged in the through groove, a placement unit for placing wafers is arranged on the placement plate, and a circular groove penetrating to the interior of the rectangular box is opened at the upper end of the rectangular box, and a megasonic wave unit for performing megasonic wave cleaning on the wafers on the placement plate is installed on the circular groove.

[0011] The placement unit includes two arc grooves symmetrically opened on the placement plate, a rectangular plate is rotatably arranged on the inner wall of one side of the arc groove, a circular groove is opened on the rectangular plate, and the circular grooves on the rectangular plates on both sides are evenly arranged along the axis of the circular groove.

[0012] Preferably, an annular groove is provided on the inner side wall of the circular groove, and the annular grooves on adjacent sides are connected to each other. A rotating circle is rotatably arranged in the annular groove, an arc-shaped membrane is arranged on the inner side wall of the rotating circle, and several push spring rods located in the arc-shaped membrane are also arranged on the inner wall of the rotating circle, and the push spring rods are evenly distributed along the axis of the circular groove, and the telescopic end of the push spring rod is provided with an arc-shaped plate attached to the inner side of the arc-shaped membrane.

[0013] Preferably, the megasonic unit includes a driving cylinder rotatably arranged in a circular groove, the cylinder shaft of the driving cylinder is located inside a rectangular box, the cylinder shaft sleeve of the driving cylinder is provided with a swing plate, a megasonic nozzle is provided at one end of the swing plate away from the cylinder shaft of the driving cylinder, and the movement trajectory of the megasonic nozzle is consistent with the arrangement line of the circular groove.

[0014] Preferably, a connecting pipe is provided through the outer side of the megasonic nozzle, a receiving groove is provided inside the driving cylinder, and the other side of the connecting pipe is located in the receiving groove.

[0015] Preferably, a driving unit for driving the rotating circle to rotate is provided in the placement plate, and the driving unit includes an outer gear ring arranged on the outside of the rotating circle, and the outer gear ring is located in the annular groove, so that two adjacent outer gear rings are meshed, and a strip groove is commonly provided in the middle of the placement plate and the rectangular plate, and one end of the strip groove on the two placement plates is connected to a corresponding annular groove.

[0016] Preferably, a driving shaft is symmetrically rotatably arranged on the inner wall of the strip groove, a driving gear meshing with the corresponding outer gear ring is arranged on the outer side of the driving shaft, an input shaft is also rotatably arranged on the inner wall of the strip groove, the input shaft is connected to the driving shafts on both sides by belt transmission, a dual-axis motor is arranged on the placement plate through the motor seat, and one side of the motor shaft of the dual-axis motor passes through the strip groove and is connected to the input shaft.

[0017] A driving plate is symmetrically arranged at the lower end of the cylinder shaft of the driving cylinder, and a driving key slidably inserted between the driving plates is arranged on the motor shaft on the other side of the double-axis motor.

[0018] Preferably, a drying unit for blowing off water on the surface of the wafer is also provided in the rectangular box, and the drying unit includes two air guide hoods symmetrically arranged on the inner wall of the rectangular box, the air guide hoods correspond one-to-one to the two rectangular plates, and the opposite sides of the two air guide hoods are arc-shaped surfaces, and the arc-shaped surfaces correspond to the swinging trajectories of the corresponding rectangular plates, and the arc-shaped surfaces are provided with several air outlet grooves evenly distributed along the trajectories, and external connecting pipes are also penetrated on both sides of the rectangular box, and the external connecting pipes on both sides are respectively connected with the corresponding air guide hoods.

[0019] Preferably, a rotating shaft is rotatably provided on the inner walls of both sides of the air outlet groove through a torsion spring, and an arc-shaped plate corresponding to the outer side of the arc-shaped surface is sleeved on the outer side of the rotating shaft.

[0020] Preferably, a ring is rotatably provided on the outer side of the cylinder shaft of the driving cylinder, and sliding grooves are provided on both sides of the rectangular box. A limiting component for limiting the placement plate is provided between the ring and the sliding groove. The limiting component includes strips symmetrically arranged on the outer side of the ring, and one side of the strips is respectively located in the corresponding sliding grooves. A spring push rod is provided at one end of the strip located in the sliding groove, and the telescopic end of the spring push rod is in conflict with the placement plate.

[0021] In addition, the present invention also provides a semiconductor wafer showerhead type megasonic wave cleaning method, comprising the following steps:

[0022] S1. Installation preparation: Place the wafer in the placement unit, limit the wafer through the placement unit, and then insert the placement plate into the through groove on the rectangular box to complete the preliminary installation of the placement plate.

[0023] S2. Megasonic wave test: After the placement plate is installed, the wafers on the placement unit are cleaned by the megasonic wave unit. During the cleaning process, the wafers can be driven by the placement unit to rotate, and the megasonic wave unit will rotate around multiple wafers for cleaning.

[0024] S3. Wafer flipping: After one side of the wafer is cleaned, the megasonic wave unit stops running, and then the rectangular plate is driven by external force to flip, so that the water side of the wafer flips 180 degrees, allowing the water to flow out under the influence of gravity.

[0025] S4. Wafer removal: Pull the placement plate out of the through slot, and then remove the wafer from the placement unit.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. The present invention can synchronously place and limit multiple wafers at one time through the placement units in multiple circular grooves, that is, it can synchronously clean multiple wafers, thereby improving the efficiency of wafer cleaning.

[0028] 2. The multiple placement units in the present invention are arranged in a circle and can drive the wafer to rotate. The synchronized megasonic wave unit can also rotate along the arrangement path of the circular groove. Therefore, multiple wafers can be cleaned synchronously by only one megasonic wave device, which is highly efficient and further improves the applicability of the present invention.

[0029] 3. The present invention arranges the drying unit at the lower end of the placement plate so that the drying unit can correspond to the placement unit. After the wafer on the placement unit is cleaned, the rectangular plate drives the wafer to flip 180 degrees so that the water on the wafer can flow down, and then the water remaining on the surface of the wafer is dried by the drying unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0031] Figure 1 It is a schematic diagram of the main body structure of the present invention.

[0032] Figure 2 It is a schematic diagram of the cross-sectional structure of the rectangular box of the present invention.

[0033] Figure 3 It is a plan cross-sectional view of the placement unit of the present invention.

[0034] Figure 4 The present invention Figure 3 A partial enlarged view of point A in the middle.

[0035] Figure 5 It is a schematic structural diagram of the megasonic wave unit and the limiting assembly of the present invention.

[0036] Figure 6 It is a plan cross-sectional view of the structure of the driving unit part of the present invention.

[0037] Figure 7It is a plan cross-sectional view of the driving unit of the present invention.

[0038] Figure 8 It is a matching diagram of the driving plate and the driving key of the present invention.

[0039] Fig. 9 It is a plan cross-sectional view of the drying unit of the present invention.

[0040] Fig.10 It is a schematic diagram of the structure of the drive assembly of the present invention.

[0041] In the figure, 1, rectangular box; 10, placement plate; 2, placement unit; 20, arc groove; 21, rectangular plate; 22, circular groove; 23, annular groove; 24, rotating circle; 25, arc membrane; 26, push spring rod; 27, arc plate; 3, megasonic unit; 30, driving cylinder; 31, swing plate; 32, megasonic nozzle; 33, connecting pipe; 4, driving unit; 40, outer gear ring; 41, strip groove; 42, driving shaft; 43. Driving gear; 44. Input shaft; 45. Dual-axis motor; 46. Driving plate; 47. Driving key; 5. Drying unit; 50. Air guide hood; 51. External connecting pipe; 52. Rotating shaft; 53. Arc plate; 54. Drain groove; 55. Guide plate; 6. Limiting assembly; 60. Ring; 61. Sliding groove; 62. Strip plate; 63. Spring push rod; 7. Driving assembly; 70. Rectangular groove; 71. Driving shaft; 72. Reversing shaft. DETAILED DESCRIPTION

[0042] The following combination Figures 1 to 10 Embodiments of the present invention are described in detail.

[0043] The embodiment of the present application discloses a semiconductor wafer nozzle-type megasonic cleaning device and method, which explains that the present invention is mainly used in the process of megasonic cleaning of wafers. In terms of technical effect, multiple wafers can be placed by setting up multiple groups of placement units, so that multiple wafers can be cleaned together in a single cleaning process, thereby increasing the efficiency of wafer cleaning; further, the present invention can also clean both sides of the wafer by turning the wafer over, thereby further improving the applicability of the present invention, and after the wafer is cleaned, the present invention can also dry the water attached to the surface of the wafer by drying, ensuring that the surface of the wafer is in a dry state after being taken out, which is more conducive to the subsequent storage and use of the wafer and ensures that it will not be affected by water.

[0044] Example 1: Reference Figure 1 and Figure 2 As shown, it includes a rectangular box 1, a placement plate 10, a placement unit 2 and a megasonic wave unit 3. A through groove is opened in the middle of the rectangular box 1 and penetrates to both sides thereof. The placement plate 10 is slidably arranged in the through groove, and the placement plate 10 can reciprocate in the through groove.

[0045] A placement unit 2 for placing wafers is provided on the placement plate 10. The wafer is installed on the placement unit 2, and then the placement plate 10 is slid and inserted into the through groove; and a circular groove penetrating into the interior is opened at the upper end of the rectangular box 1, and a megasonic unit 3 for performing megasonic wave cleaning on the wafer on the placement plate 10 is installed on the circular groove, that is, after the placement plate 10 is installed in the through groove, the megasonic unit 3 can rotate in the circular groove, and then the megasonic unit 3 cleans the wafer placed in the placement unit 2 by megasonic wave cleaning.

[0046] Continue to refer to Figure 2 , Figure 3 and Figure 4 As shown, a placement unit 2 for placing wafers is provided on the placement plate 10; specifically, the placement unit 2 includes an arc groove 20, a rectangular plate 21, a circular groove 22, an annular groove 23, a rotating circle 24, an arc membrane 25, a push spring rod 26 and an arc plate 27, two arc grooves 20 are symmetrically opened on the placement plate 10, and a rectangular plate 21 is rotatably provided on the inner wall of one side of the arc groove 20, that is, the rectangular plate 21 can rotate in the arc groove 20.

[0047] A circular groove 22 is provided on the rectangular plate 21, and the circular grooves 22 on the rectangular plates 21 on both sides are evenly arranged along the axis of the circular groove. An annular groove 23 is also provided on the inner wall of the circular groove 22 to penetrate it, and the annular grooves 23 on the adjacent two sides are mutually penetrated. A rotating circle 24 is rotatably provided in the annular groove 23, and the rotating circle 24 can rotate along its axis under the limit of the annular groove 23 when driven by external force.

[0048] An arc-shaped membrane 25 is arranged on the inner wall of the rotating circle 24, and the arc-shaped membrane 25 is made of a flexible and retractable rubber material; and a plurality of push spring rods 26 located inside the arc-shaped membrane 25 are also arranged on the inner wall of the rotating circle 24, and the push spring rods 26 are evenly distributed along the axis of the circular groove 22, and the retractable ends of the push spring rods 26 are provided with arc-shaped plates 27 attached to the inner side of the arc-shaped membrane 25.

[0049] In the initial situation, the push spring rod 26 contacts the arc membrane 25 through the arc plate 27, so that the inner wall of the arc membrane 25 is pressed toward the axis of the circular groove 22. When installing the wafer, the wafer is first placed on the arc membrane 25. The thrust of the push spring rod 26 used in this implementation process is relatively small. Therefore, the wafer is pressed later, which can drive the push spring rod 26 in the corresponding arc membrane 25 and the arc plate 27 at its end to move in the direction away from the axis of the circular groove 22, and finally make the wafer enter the arc membrane 25. After that, no more pressing is performed, and the wafer is pressed and limited by the cooperation of the push spring rod 26 and the arc membrane 25. Since the arc membrane 25 is made of flexible material, its inner wall will not make hard contact with the outer wall of the wafer when it connects with the outer side of the wafer, causing the wafer to break.

[0050] That is, the arc-shaped film 25 can seal the outer wall of the wafer, so that when the wafer is cleaned, the liquid on the surface of the wafer will not flow along the outer wall of the wafer to the other side of the wafer, causing damage to the wafer.

[0051] Reference Figure 5 As shown, a megasonic unit 3 for performing megasonic cleaning on the wafer on the placement plate 10 is installed on the circular groove; specifically, the megasonic unit 3 includes a driving cylinder 30, a swing plate 31, a megasonic nozzle 32 and a connecting pipe 33, the driving cylinder 30 is rotatably arranged in the circular groove, the cylinder shaft of the driving cylinder 30 is located inside the rectangular box 1, the cylinder sleeve of the driving cylinder 30 is provided with a swing plate 31, and the megasonic nozzle 32 is arranged at one end of the swing plate 31 away from the cylinder shaft of the driving cylinder 30, and the movement trajectory of the megasonic nozzle 32 is consistent with the arrangement line of the circular groove 22, when the driving cylinder 30 is driven by an external force, it can rotate along its axis under the limit of the circular groove, and the driving cylinder 30 can also drive the swing plate 31 to swing synchronously in the rectangular box 1 when rotating, and the cylinder shaft of the driving cylinder 30 can drive the swing plate 31 to move in the up and down directions, and the swing plate 31 can drive the megasonic nozzle 32 to rotate and move up and down.

[0052] The megasonic nozzle 32 can clean the surface of the wafer by jetting megasonic water. The swing plate 31 drives the megasonic nozzle 32 to swing along the axis of the circular groove, so that multiple wafers can be cleaned. The wafer itself can also rotate under the indirect drive of the rotating circle 24, so that the megasonic nozzle 32 can flush all angles of its end face.

[0053] A connecting pipe 33 is provided on the outer side of the megasonic nozzle 32, a receiving groove is provided inside the driving cylinder 30, and the other side of the connecting pipe 33 is located in the receiving groove. The connecting pipe 33 is used to connect to an external water supply device, and the external water supply device supplies water to the megasonic nozzle 32 through the connecting pipe 33.

[0054] Reference Figure 6 , Figure 7 and Figure 8 As shown, a driving unit 4 for driving the rotating circle 24 to rotate is provided in the placement plate 10; specifically, the driving unit 4 includes an outer gear ring 40, a strip groove 41, a driving shaft 42, a driving gear 43, an input shaft 44, a dual-axis motor 45, a driving plate 46 and a driving key 47, and the outer gear ring 40 is provided on the outside of the rotating circle 24, and the outer gear ring 40 is located in the annular groove 23, so that two adjacent outer gear rings 40 are meshed with each other, and the outer gear ring 40 can drive the corresponding rotating circle 24 to rotate in the annular groove 23, and when an outer gear ring 40 is driven to rotate by an external force, the rotating circles 24 on the same rectangular plate 21 can be driven to rotate through the outer gear rings 40 meshing with it on both sides.

[0055] A strip groove 41 is commonly provided in the middle of the placement plate 10 and the rectangular plate 21, and one end of the strip groove 41 on the two placement plates 10 is connected with a corresponding annular groove 23. A driving shaft 42 is symmetrically arranged on the inner wall of the strip groove 41, and a driving gear 43 meshing with the corresponding outer gear ring 40 is arranged on the outer side of the driving shaft 42. When driven by an external force, the driving shaft 42 can drive the driving gear 43 on its outer side to rotate, and when the driving gear 43 rotates, it can drive the corresponding outer gear ring 40 to rotate.

[0056] An input shaft 44 is also rotatably arranged on the inner wall of the strip groove 41, and the input shaft 44 is connected to the driving shafts 42 on both sides by belt transmission. A dual-axis motor 45 is arranged on the placement plate 10 through a motor seat, and one side of the motor shaft of the dual-axis motor 45 passes through the strip groove 41 and is connected to the input shaft 44. The motor shaft of the dual-axis motor 45 can drive the input shaft 44 to rotate, so that the input shaft 44 can drive the driving shafts 42 on both sides to rotate synchronously by belt transmission.

[0057] A driving plate 46 is symmetrically arranged at the lower end of the cylinder shaft of the driving cylinder 30, and a driving key 47 slidably inserted between the driving plates 46 is arranged on the motor shaft on the other side of the dual-axis motor 45. When the dual-axis motor 45 indirectly drives the rotating circle 24 to rotate, it can also drive the driving cylinder 30 to rotate synchronously through the cooperation between the driving key 47 and the driving plate 46.

[0058] Reference Fig. 9As shown, a drying unit 5 for blowing off water on the surface of the wafer is also provided in the rectangular box 1; specifically, the drying unit 5 includes an air guide hood 50, an external connecting pipe 51, a rotating shaft 52, an arc plate 53, a drainage groove 54 and a guide plate 55, two symmetrically distributed air guide hoods 50 are provided on the inner wall of the rectangular box 1, the air guide hoods 50 correspond to the two rectangular plates 21 one by one, and the opposite sides of the two air guide hoods 50 are arc-shaped surfaces, and the arc-shaped surfaces are opposite to the swinging tracks of the corresponding rectangular plates 21. In response, a number of air outlet grooves evenly distributed along the trajectory are opened on the arc surface, and external connecting pipes 51 are also penetrated on both sides of the rectangular box 1, and the external connecting pipes 51 on both sides are respectively connected with the corresponding air guide hoods 50. After one side of the wafer is cleaned, it is connected to the external air supply equipment through the external connecting pipe 51, and then the external air supply equipment discharges the gas into the air guide hood 50 through the external connecting pipe 51, and the gas can be discharged from the air guide hood 50 through the air outlet groove and blown onto the surface of the wafer.

[0059] A rotating shaft 52 is provided on the inner walls on both sides of the air outlet groove for rotation through a torsion spring, and an arc-shaped plate 53 corresponding to the outer side of the arc-shaped surface is sleeved on the outer side of the rotating shaft 52, and a drainage groove 54 is also provided at the bottom of the rectangular box 1, and guide plates 55 connected to the air guide cover 50 are also provided on both sides of the drainage groove 54. In the initial situation, the rotating shaft 52 is driven by the torsion spring to drive the arc-shaped plate 53 to seal the air outlet groove, so that after the wafer is flipped, water on the surface of the wafer will drip onto the air guide cover 50, and flow along the sides of the air guide cover 50 and the arc-shaped plate 53 to the guide plate 55, and will not flow into the air guide cover 50 through the air outlet groove.

[0060] Finally, the water is discharged from the rectangular box 1 through the drainage groove 54, and then the external gas supply equipment supplies gas again. The gas pushes the arc plate 53 to make the rotating shaft 52 rotate. At this time, the arc plate 53 no longer blocks the gas outlet groove, and the gas can be blown onto the surface of the wafer through the gas outlet groove. After the drying is completed, the gas is no longer discharged. At this time, the rotating shaft 52 is driven by the torsion spring to drive the arc plate 53 to block the gas outlet groove again.

[0061] Continue to refer to Figure 5As shown, a collar 60 is rotatably sleeved on the outer side of the cylinder shaft of the driving cylinder 30, and sliding grooves 61 are also provided on both sides of the rectangular box 1. A limiting assembly 6 for limiting the placement plate 10 to prevent the placement plate 10 from accidentally escaping from the through groove is provided between the collar 60 and the sliding groove 61; specifically, the limiting assembly 6 includes a collar 60, a sliding groove 61, a strip plate 62 and a spring push rod 63, the strip plate 62 is symmetrically arranged on the outer side of the collar 60, and one side of the strip plate 62 is respectively located in the corresponding sliding groove 61, and the strip plate 62 is located at one side of the sliding groove 61. A spring push rod 63 is provided at the end, and the telescopic end of the spring push rod 63 conflicts with the placement plate 10. After the placement plate 10 is inserted into the through groove, the cylinder axis of the driving cylinder 30 moves downward, which can push the ring 60, the strip plate 62 and the spring push rod 63 to move downward. The spring push rod 63 can interfere with and limit the placement plate 10. Even if the driving cylinder 30 rotates, since the ring 60 is rotatably connected to it and the strip plate 62 is also limited by the sliding groove 61, the rotation range of the driving cylinder 30 will not be interfered with.

[0062] When cleaning is completed, that is, at this time, the cylinder shaft of the driving cylinder 30 will indirectly drive the megasonic nozzle 32 to move upward. At this time, the spring push rod 63 is indirectly driven by the ring 60 to move upward indirectly, and the placement plate 10 is no longer limited, so that the placement plate 10 can be pulled out of the through groove by personnel.

[0063] Example 2: Reference Fig.10 As shown, on the basis of the first embodiment, in order to be able to drive the two rectangular plates 21 to rotate, a driving assembly 7 is provided on the placement plate 10; specifically, the driving assembly 7 includes a rectangular groove 70, a driving shaft 71 and a reversing shaft 72, the rectangular groove 70 is opened on the placement plate 10 and is connected with the two arc grooves 20, and a driving shaft 71 located in the through groove is provided on one side of the rectangular plate 21, that is, the driving shaft 71 can drive the rectangular plate 21 to rotate in the arc groove 20 when driven by an external force.

[0064] Two symmetrically distributed reversing shafts 72 are rotatably arranged on the inner wall of the rectangular groove 70. The two reversing shafts 72 are respectively connected to the corresponding driving shafts 71 by belt transmission, and the two reversing shafts 72 are connected to each other by gear transmission. The reversing shaft 72 on one side passes through the outer wall of the placement plate 10 for connection with an external motor, and the external motor can drive the reversing shaft 72 on one side to rotate. The rotation of the reversing shaft 72 on one side can drive the reversing shaft 72 on the other side to rotate in the opposite direction by gear transmission. That is, at this time, the two reversing shafts 72 can drive the corresponding driving shaft 71 to rotate by belt transmission. The rotation directions of the two rectangular plates 21 are opposite, and both rotate toward the inner wall of one side of the rectangular plate 21, rotating one hundred and eighty degrees, so that the water on the surface of the wafer can drip downward.

[0065] If the other side of the wafer needs to be cleaned, the megasonic wave unit 3 is started to clean the wafer again, and then the rectangular plate 21 is driven to rotate again.

[0066] In addition, the present invention also provides a semiconductor wafer showerhead type megasonic wave cleaning method, comprising the following steps:

[0067] S1. Installation preparation: Place the wafer in the placement unit 2, limit the wafer through the placement unit 2, and then insert the placement plate 10 into the through groove on the rectangular box 1 to complete the preliminary installation of the placement plate 10.

[0068] S2. Megasonic wave test: After the placement plate 10 is installed, the wafers on the placement unit 2 are cleaned by the megasonic wave unit 3. During the cleaning process, the wafers can be driven by the placement unit 2 to rotate, and the megasonic wave unit 3 will rotate around multiple wafers for cleaning. When the megasonic wave unit 3 is running, the limit assembly 6 can synchronously limit the placement plate 10 to prevent the placement plate 10 from being accidentally pulled out of the through groove when the wafer is being cleaned.

[0069] S3, wafer flipping: After one side of the wafer is cleaned, the megasonic wave unit 3 stops running, and then the rectangular plate 21 is driven by external force to flip, so that the water side of the wafer flips 180 degrees, allowing the water to flow out under the influence of gravity. At this time, the drying unit 5 is started to dry the residual water on the surface of the wafer.

[0070] S4, wafer removal: After the megasonic wave unit 3 stops cleaning the wafer, the limiting assembly 6 no longer limits the placement plate 10, and then the placement plate 10 is pulled out of the through groove, and then the wafer is removed from the placement unit 2.

[0071] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered as exemplary and non-restrictive in all respects.

[0072] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor wafer showerhead megasonic cleaning device, comprising a rectangular box (1), characterized in that: The rectangular box (1) is provided with a through groove in the middle thereof extending to both sides thereof, a placement plate (10) is slidably arranged in the through groove, a placement unit (2) for placing wafers is arranged on the placement plate (10), and a circular groove extending to the interior thereof is provided at the upper end of the rectangular box (1), a megasonic wave unit (3) for performing megasonic wave cleaning on the wafers on the placement plate (10) is installed on the circular groove; The placement unit (2) comprises two arc-shaped grooves (20) symmetrically arranged on the placement plate (10), a rectangular plate (21) is rotatably arranged on the inner wall of one side of the arc-shaped groove (20), a circular groove (22) is arranged on the rectangular plate (21), and the circular grooves (22) on the rectangular plates (21) on both sides are evenly arranged along the axis of the circular grooves; The inner wall of the circular groove (22) is also provided with an annular groove (23) which penetrates the circular groove (22), and the annular grooves (23) on the adjacent two sides are mutually penetrated, a rotating circle (24) is rotatably arranged in the annular groove (23), an arc-shaped membrane (25) is arranged on the inner wall of the rotating circle (24), and a plurality of push spring rods (26) located in the arc-shaped membrane (25) are also arranged on the inner wall of the rotating circle (24), and the push spring rods (26) are evenly distributed along the axis of the circular groove (22), and an arc-shaped sticking plate (27) attached to the inner side of the arc-shaped membrane (25) is arranged at the telescopic end of the push spring rod (26); The placement plate (10) is provided with a driving assembly (7) for driving the two rectangular plates (21) to rotate. The driving assembly (7) includes a rectangular groove (70) opened on the placement plate (10) and intersecting with the two arc grooves (20). A driving shaft (71) located in the through groove is provided on one side of the rectangular plate (21). Two symmetrically distributed reversing shafts (72) are also rotatably provided on the inner wall of the rectangular groove (70). The two reversing shafts (72) are respectively connected to the corresponding driving shafts (71) by means of belt transmission. The two reversing shafts (72) are connected to each other by means of gear transmission. The reversing shaft (72) on one side passes through the outer wall of the placement plate (10) for connection with an external motor.

2. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 1, characterized in that: The megasonic wave unit (3) comprises a driving cylinder (30) rotatably arranged in a circular groove, the cylinder shaft of the driving cylinder (30) is located inside the rectangular box (1), the cylinder shaft sleeve of the driving cylinder (30) is provided with a swing plate (31), and a megasonic wave nozzle (32) is provided at one end of the swing plate (31) away from the cylinder shaft of the driving cylinder (30), and the movement trajectory of the megasonic wave nozzle (32) is consistent with the arrangement line of the circular groove (22).

3. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 2, characterized in that: A connecting pipe (33) is provided through the outer side of the megasonic nozzle (32), a receiving groove is provided inside the driving cylinder (30), and the other side of the connecting pipe (33) is located in the receiving groove.

4. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 1, characterized in that: The placement plate (10) is provided with a driving unit (4) for driving the rotating circle (24) to rotate. The driving unit (4) includes an outer gear ring (40) arranged outside the rotating circle (24), and the outer gear ring (40) is located in the annular groove (23), so that two adjacent outer gear rings (40) are meshed with each other. The placement plate (10) and the rectangular plate (21) are provided with a strip groove (41) in the middle, and one end of the strip groove (41) on the two placement plates (10) is connected to a corresponding annular groove (23).

5. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 4, characterized in that: A driving shaft (42) is symmetrically rotatably arranged on the inner wall of the strip groove (41), a driving gear (43) meshing with the corresponding outer gear ring (40) is arranged on the outer side of the driving shaft (42), an input shaft (44) is also rotatably arranged on the inner wall of the strip groove (41), the input shaft (44) is connected to the driving shafts (42) on both sides by belt transmission, a double-axis motor (45) is arranged on the placement plate (10) through a motor seat, and one side of the motor shaft of the double-axis motor (45) passes through the strip groove (41) and is connected to the input shaft (44); A driving plate (46) is symmetrically arranged at the lower end of the cylinder shaft of the driving cylinder (30), and a driving key (47) is slidably inserted between the driving plates (46) and arranged on the motor shaft on the other side of the double-shaft motor (45).

6. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 1, characterized in that: The rectangular box (1) is also provided with a drying unit (5) for blowing off water on the surface of the wafer. The drying unit (5) comprises two air guide covers (50) symmetrically arranged on the inner wall of the rectangular box (1). The air guide covers (50) correspond to the two rectangular plates (21) one by one, and the opposite sides of the two air guide covers (50) are arc-shaped surfaces, and the arc-shaped surfaces correspond to the swinging trajectories of the corresponding rectangular plates (21). The arc-shaped surfaces are provided with a plurality of air outlet grooves evenly distributed along the trajectories, and external connecting pipes (51) are also provided through the two sides of the rectangular box (1), and the external connecting pipes (51) on the two sides are respectively connected to the corresponding air guide covers (50).

7. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 6, characterized in that: A rotating shaft (52) is rotatably provided on the inner walls of both sides of the air outlet groove via a torsion spring, and an arc-shaped plate (53) corresponding to the arc-shaped surface is sleeved on the outer side of the rotating shaft (52).

8. The semiconductor wafer showerhead megasonic cleaning equipment according to claim 5, characterized in that: A collar (60) is rotatably sleeved on the outer side of the cylinder shaft of the driving cylinder (30), and sliding grooves (61) are also provided on both sides of the rectangular box (1). A limiting assembly (6) for limiting the placement plate (10) is provided between the collar (60) and the sliding groove (61). The limiting assembly (6) includes strips (62) symmetrically arranged on the outer side of the collar (60), and one side of the strips (62) is respectively located in the corresponding sliding grooves (61). A spring push rod (63) is provided at one end of the strip (62) located in the sliding groove (61), and the telescopic end of the spring push rod (63) is in contact with the placement plate (10).

9. A semiconductor wafer showerhead megasonic cleaning method, using a semiconductor wafer showerhead megasonic cleaning device as claimed in any one of claims 1 to 8, characterized in that: The cleaning method comprises the following steps: S1, installation preparation: placing a wafer in the placement unit (2), limiting the position of the wafer by the placement unit (2), and then inserting the placement plate (10) into the through groove on the rectangular box (1), completing the preliminary installation of the placement plate (10); S2, megasonic wave test: after the placement plate (10) is installed, the wafers on the placement unit (2) are cleaned by megasonic wave cleaning through the megasonic wave unit (3), and during the cleaning process, the wafers are driven by the placement unit (2) to rotate, and the megasonic wave unit (3) rotates around the multiple wafers to clean; S3, wafer flipping: after one side of the wafer is cleaned, the megasonic wave unit (3) stops running, and then the rectangular plate (21) is driven by an external force to flip, so that the side of the wafer with water flips 180 degrees, so that the water flows out under the influence of gravity; S4, wafer removal: pull the placement plate (10) out of the through groove, and then remove the wafer from the placement unit (2).

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