Packaging frame processing device

Abstract

The present invention belongs to the technical field of semiconductor chip packaging frames, and specifically relates to a packaging frame processing device for manufacturing an easily disassembled semiconductor chip packaging frame, wherein the easily disassembled semiconductor chip packaging frame comprises a semiconductor chip board and a packaging frame board, wherein a plurality of chips are mounted on the surface of the semiconductor chip board, and three bosses are evenly distributed on the front and rear sides of the bottom of the semiconductor chip board, and three insertion holes are evenly distributed on the front and rear sides of the top of the packaging frame board, wherein the bosses of the semiconductor chip board are inserted into the insertion holes of the packaging frame board; slide rails are integrally formed on the front and rear sides of the top of the packaging frame board, and a fixing plate is slidably connected to the surface of the slide rails. The device solves the problem that the current semiconductor chip packaging frame is not conducive to disassembly and assembly, and the processing of the semiconductor chip packaging frame is relatively inconvenient, and the semiconductor chip packaging frame needs to be manually clamped, resulting in a greatly reduced production efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor chip packaging frames, and in particular relates to a packaging frame processing device. Background Art

[0002] The semiconductor chip packaging frame is a main structural material of semiconductor packaging, which is used to connect the contact points of the internal chip of the semiconductor integrated block and the external wires. It acts as a bridge to connect with the external wires, and its main functions include circuit connection, heat dissipation, mechanical support, etc. However, the semiconductor chip packaging frames currently on the market are all integrated. When a semiconductor chip is damaged, it needs to be replaced and maintained inside the electronic device. The semiconductor chip cannot be smoothly removed from the electronic device, which makes disassembly and assembly inconvenient. In addition, it is inconvenient to process the semiconductor chip packaging frame, especially for drilling the holes above. A specific clamp is required, and the current clamps all require manual locking of the semiconductor chip packaging frame, resulting in reduced productivity. This phenomenon has become a problem that needs to be solved urgently by people in this field. Summary of the invention

[0003] The object of the present invention is to provide a packaging frame processing device to solve the problems raised in the above background technology.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a packaging frame processing device, comprising a semiconductor chip board, a packaging frame board and a packaging frame processing device, wherein a plurality of chips are mounted on the surface of the semiconductor chip board, three bosses are evenly distributed on the front and rear sides of the bottom of the semiconductor chip board, and three sockets are evenly distributed on the front and rear sides of the top of the packaging frame board, and the bosses of the semiconductor chip board are inserted into the sockets of the packaging frame board; the front and rear sides of the top of the packaging frame board are integrally formed with slide rails, and the surface of the slide rails is slidably connected with a fixing plate, and the sockets of the packaging frame board are formed by processing of the packaging frame processing device, which includes drilling and boring, and the packaging frame processing device includes a clamp, and the clamp includes a base and two clamping blocks, the two clamping blocks are fixedly installed on the left and right sides of the top of the base, and the inner sides are provided with slide grooves, and the left and right sides of the packaging frame plate are inserted into the clamping blocks through the slide grooves.

[0005] The present invention further illustrates that a rotating shaft is installed on the inner bearing of the left clamping block, a guide wheel is fixed on the right end of the rotating shaft, and the guide wheel is located below the slide groove, and when the packaging frame plate is inserted into the clamping block, its bottom contacts the surface of the guide wheel; a toothed disc is fixed on the right side of the guide wheel, a notch is provided above the base, a gear is installed on the right bearing of the inner wall of the base, the gear is located in the notch and meshes with the bottom of the toothed disc, a telescopic joint is fixed on the left side of the gear, a threaded rod is fixed on the left end of the telescopic joint, a hydraulic chamber is fixed on the left side of the inner wall of the base, a hydraulic plate is slidably connected to the inner wall of the hydraulic chamber, a threaded hole is provided on the right side of the hydraulic chamber, and the threaded rod is threadedly connected to the threaded hole, and the left end of the threaded rod is connected to the right bearing of the hydraulic plate.

[0006] The present invention further illustrates that holes are provided inside the two clamping blocks, and the holes are located in the slide groove, the inner wall of the hole is slidably connected with a slider, a push rod is fixed above the slider, the left side of the hydraulic chamber is connected to the bottom pipeline of the hole, and an electric control valve is provided in the pipeline, the left side of the hydraulic chamber is connected to the external hydraulic oil pipeline, and a one-way valve is provided in the pipeline, and the bottom of the hole is connected to the external pressure relief valve pipeline.

[0007] The present invention further illustrates that a plurality of through holes are opened around the guide wheel, and the inner walls of the through holes are fixed with limit blocks, a silicone rod is slidably connected in the middle of the limit block, a fixed block is fixed on the outer side of the silicone rod, and the fixed block and the limit block are spring-connected, and a sphere is fixed at the inner end of the silicone rod; a telescopic rod is fixed to the inner side of the clamping block on the right side, the left end of the telescopic rod is spherical, and contacts with the sphere after moving, the interior of the rotating shaft is hollow, and the sphere is located inside the rotating shaft, the toothed disc is connected in the middle of the guide wheel, and the telescopic rod is located between the toothed disc and the guide wheel, and the right side of the hydraulic chamber is connected to the telescopic rod pipeline; a magnetic block is arranged on the right side of the gear, and the interior of the sphere is arranged with magnetorheological fluid, and the sphere itself is elastic.

[0008] The present invention further describes that a push block is slidably connected to the inner wall of the rotating shaft, and the left side of the push block is spring-connected to the left side of the inner wall of the rotating shaft; the left end of the telescopic rod squeezes the right side of the push block, and the upper and lower sides of the rotating shaft are respectively connected to the inside of the through hole with a conduit, and the left end of the conduit is located on the left side of the push block.

[0009] The present invention further illustrates that the processing method of the semiconductor chip packaging frame includes: step S1, installing the clamp on the packaging frame processing device, and then inserting the semiconductor chip packaging frame into the clamp block, and its bottom surface contacts the surface of the guide wheel; step S2, after the semiconductor chip packaging frame is completely inserted into the clamp block, the electric control valve is opened, and the push rod supports the lower surface of the semiconductor chip packaging frame to fix it; step S3, after the semiconductor chip packaging frame is fixed, the packaging frame processing device is operated to drill and bore the sockets of the semiconductor chip packaging frame. After the processing is completed, the external pressure relief valve is opened, and the electric control valve is closed at the same time, and the operator takes out the processed semiconductor chip packaging frame.

[0010] The present invention further describes that in step S2 and step S3, after the semiconductor chip packaging frame is fully inserted into the clamp, the electric control valve is opened, at which time the external pressure relief valve is in a closed state; when the processed semiconductor chip packaging frame is taken out, the electric control valve is closed, at which time the external pressure relief valve is opened.

[0011] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: the present invention connects the semiconductor chip board with the packaging frame board by inserting the boss at the bottom of the semiconductor chip board into the insertion hole, and at the same time presses the front and rear surfaces of the semiconductor chip board through the inner end of the fixing sheet, thereby fully fixing the semiconductor chip, with high fixing strength, and facilitating replacement when the semiconductor chip is damaged, and the overall disassembly and assembly is convenient and efficient;

[0012] As for the processing of the packaging frame plate, each time the semiconductor chip packaging frame is installed, the semiconductor chip packaging frame can be automatically clamped and fixed, so as to facilitate drilling and boring, ensure its fixing strength, avoid the loosening of the semiconductor chip packaging frame during drilling and boring, and affect the quality of drilling and boring. It is convenient to install and take out the semiconductor chip packaging frame, further improving the processing efficiency, and when inserting the semiconductor chip packaging frame, its bottom surface can contact and rub with the silicone rod of the guide wheel to reduce the friction surface and ensure the rotation of the guide wheel, thereby avoiding the silicone rod from grinding the semiconductor chip packaging frame and causing damage to the surface quality; and by setting the magnetorheological fluid, the silicone rod can shake slightly up and down, avoiding continuous and strong squeezing of the bottom surface of the semiconductor chip packaging frame to cause its deformation, thereby ensuring the overall quality of the semiconductor chip packaging frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 It is a schematic diagram of the structure of the semiconductor chip board of the present invention;

[0016] Figure 3 It is a schematic diagram of the packaging frame plate structure of the present invention;

[0017] Figure 4 It is a schematic diagram of the fixture structure of the present invention;

[0018] Figure 5 It is a plane schematic diagram of the clamp of the present invention;

[0019] Figure 6 It is a schematic diagram of the internal structure of the base and the internal structure of the clamping block of the present invention;

[0020] Figure 7 It is a schematic diagram of the internal structure of the guide wheel and the rotating shaft of the present invention;

[0021] Figure 8 It is a schematic diagram of the pipe connection between the hydraulic chamber, the hole and the telescopic rod of the present invention;

[0022] In the figure: 1, semiconductor chip board; 11, boss; 2, package frame board; 21, jack; 22, slide rail; 23, fixing plate; 3, base; 31, notch; 32, gear; 321, telescopic joint; 322, threaded rod; 323, magnet; 33, hydraulic chamber; 331, hydraulic plate; 4, clamping block; 41, slide groove; 42, guide wheel; 421, through hole; 422, limit block; 423, silicone rod; 424, sphere; 43, toothed disc; 44, rotating shaft; 441, push block; 442, catheter; 45, hole; 451, slider; 452, push rod; 46, telescopic rod. DETAILED DESCRIPTION

[0023] The following is a further non-limiting detailed description of the technical solution of the present invention in conjunction with the preferred embodiments and the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1-8 The present invention provides a technical solution: a packaging frame processing device, comprising a semiconductor chip board 1, a packaging frame board 2 and a packaging frame processing device, a plurality of chips are mounted on the surface of the semiconductor chip board 1, three bosses 11 are evenly distributed on the front and rear sides of the bottom of the semiconductor chip board 1, three plug holes 21 are evenly distributed on the front and rear sides of the top of the packaging frame board 2, and the bosses 11 of the semiconductor chip board 1 are inserted into the plug holes 21 of the packaging frame board 2;

[0025] The upper front and rear sides of the packaging frame plate 2 are integrally formed with slide rails 22, and the surface of the slide rails 22 is slidably connected with a fixing plate 23. The plug hole 21 of the packaging frame plate 2 is formed by processing of a packaging frame processing device, including drilling and boring. The packaging frame processing device includes a clamp, and the clamp includes a base 3 and two clamping blocks 4. The two clamping blocks 4 are respectively fixedly installed on the upper left and right sides of the base 3, and the inner sides are provided with slide grooves 41. The left and right sides of the packaging frame plate 2 are inserted into the clamping blocks 4 through the slide grooves 41.

[0026] When installing the semiconductor chip, the semiconductor chip is uniformly installed on the semiconductor chip board 1, and then the boss 11 at the bottom is inserted into the plug hole 21, so that the semiconductor chip board 1 is connected to the packaging frame board 2. After that, when the boss 11 of the semiconductor chip board 1 is inserted into place, the fixing plate 23 is pushed to slide through the slide rail 22, and the inner end of the fixing plate 23 presses the front and rear surfaces of the semiconductor chip board 1, so that the semiconductor chip is fully fixed, the fixing strength is high, and when the semiconductor chip is damaged, it is easy to replace, and the overall disassembly and assembly are convenient and efficient;

[0027] As for the processing of the packaging frame plate 2, the clamp is installed on the packaging frame processing device, and the packaging frame plate 2 is inserted into the slide groove 41 of the clamp 4. During processing, the installation of the semiconductor chip packaging frame is more convenient, and the processing process has a high degree of continuity, thereby improving the processing efficiency.

[0028] The inner bearing of the left clamp block 4 is provided with a rotating shaft 44, and a guide wheel 42 is fixed to the right end of the rotating shaft 44, and the guide wheel 42 is located below the slide slot 41. When the packaging frame plate 2 is inserted into the clamp block 4, its bottom contacts the surface of the guide wheel 42.

[0029] A toothed disc 43 is fixed to the right side of the guide wheel 42, a notch 31 is provided above the base 3, a gear 32 is installed on the right side bearing of the inner wall of the base 3, the gear 32 is located in the notch 31 and meshes with the bottom of the toothed disc 43, a telescopic joint 321 is fixed on the left side of the gear 32, a threaded rod 322 is fixed on the left end of the telescopic joint 321, a hydraulic chamber 33 is fixed on the left side of the inner wall of the base 3, a hydraulic plate 331 is slidably connected to the inner wall of the hydraulic chamber 33, a threaded hole is provided on the right side of the hydraulic chamber 33, and the threaded rod 322 is threadedly connected in the threaded hole, and the left end of the threaded rod 322 is connected to the right side bearing of the hydraulic plate 331.

[0030] Holes 45 are provided inside the two clamping blocks 4, and the holes 45 are located in the slide groove 41. A slider 451 is slidably connected to the inner wall of the hole 45, and a push rod 452 is fixed above the slider 451. The left side of the hydraulic chamber 33 is connected to the bottom pipeline of the hole 45, and an electric control valve is provided in the pipeline. The left side of the hydraulic chamber 33 is connected to the external hydraulic oil pipeline, and a one-way valve is provided in the pipeline. The bottom of the hole 45 is connected to the external pressure relief valve pipeline.

[0031] When the semiconductor chip packaging frame is inserted, the bottom surface of the packaging frame plate 2 contacts the surface of the guide wheel 42, thereby driving the guide wheel 42 to rotate through friction, and the guide wheel 42 drives the toothed disc 43 to rotate, and the toothed disc 43 drives the gear 32 to rotate through meshing, and the gear 32 drives the threaded rod 322 to rotate through the telescopic joint 321, which rotates and moves through the threaded hole, and the telescopic joint 321 is stretched. At the same time, the left end of the threaded rod 322 pushes the hydraulic plate 331 to slide to the left along the inner wall of the hydraulic cavity 33 through the bearing, and the hydraulic oil on its left side is squeezed to generate pressure. When the semiconductor chip packaging frame is fully inserted into the slide groove 41, the electric control valve is opened, and the hydraulic oil enters the hole 45 through the pipeline, pushing the slider 451 to slide upward along the inner wall of the hole 45, thereby driving the push rod 452 to move upward. The upper end of the push rod 452 is pressed against the bottom surface of the semiconductor chip packaging frame to fix it. After the semiconductor chip packaging frame is processed, the external pressure relief valve is opened and the electric control valve is closed at the same time. The pressure under the slider 451 is released, and the operator takes out the semiconductor chip packaging frame. Its bottom surface rubs against the guide wheel 42, causing the guide wheel 42 to rotate in the opposite direction. The hydraulic chamber 33 draws hydraulic oil from the outside through the pipeline. Each time the semiconductor chip packaging frame is installed, the semiconductor chip packaging frame can be automatically clamped and fixed, so as to facilitate drilling and boring, ensure its fixing strength, avoid loosening of the semiconductor chip packaging frame during drilling and boring, and affect the drilling and boring quality. It is convenient to install and take out the semiconductor chip packaging frame, and further improve the processing efficiency.

[0032] A plurality of through holes 421 are formed around the guide wheel 42, and the inner walls of the through holes 421 are fixed with limit blocks 422, the middle of the limit blocks 422 is slidably connected with a silicone rod 423, a fixed block is fixed to the outer side of the silicone rod 423, and the fixed block and the limit block 422 are connected by a spring, and a ball 424 is fixed to the inner end of the silicone rod 423;

[0033] A telescopic rod 46 is fixed to the inner side of the right clamping block 4. The left end of the telescopic rod 46 is spherical and contacts the ball 424 after moving. The interior of the rotating shaft 44 is hollow and the ball 424 is located inside the rotating shaft 44. The toothed disc 43 is connected to the guide wheel 42, and the telescopic rod 46 is located between the toothed disc 43 and the guide wheel 42. The right side of the hydraulic chamber 33 is connected to the telescopic rod 46 pipeline.

[0034] A magnetic block 323 is arranged on the right side of the gear 32, and a magnetorheological fluid is arranged inside the sphere 424, which is elastic.

[0035] When the hydraulic plate 331 slides along the inner wall of the hydraulic chamber 33, the right side of the hydraulic plate 331 extracts the gas in the telescopic rod 46 through the pipeline, so that the telescopic rod 46 is shortened, and the spherical part at the left end of the telescopic rod 46 moves to the right and contacts the sphere 424, squeezing the sphere 424 so that it drives the silicone rod 423 to extend out of the through hole 421, and the spring is deformed by force, so that when the semiconductor chip packaging frame is inserted, its bottom surface can contact and rub with the silicone rod 423 of the guide wheel 42, reducing the friction surface and ensuring the rotation of the guide wheel 42, thereby preventing the silicone rod 423 from grinding the semiconductor chip packaging frame and causing damage to the surface quality;

[0036] When the gear 32 rotates, it drives the magnet 323 to rotate around its center. When the magnet 323 rotates upward, its magnetic force acts on the magnetorheological fluid, thereby making the magnetorheological fluid in the sphere 424 become viscous, thereby increasing the supporting force between the sphere 424 and the telescopic rod 46. When the magnet 323 rotates downward, the magnetorheological fluid is not affected by the magnetic force and its fluidity increases, thereby reducing the supporting force, allowing the silicone rod 423 to vibrate slightly up and down, avoiding continuous large-scale squeezing of the bottom surface of the semiconductor chip packaging frame to cause its deformation, thereby ensuring the overall quality of the semiconductor chip packaging frame.

[0037] The inner wall of the rotating shaft 44 is slidably connected with a push block 441, and the left side of the push block 441 is spring-connected to the left side of the inner wall of the rotating shaft 44;

[0038] The left end of the telescopic rod 46 squeezes the right side of the push block 441, and the upper and lower sides of the rotating shaft 44 are respectively connected to the inside of the through hole 421 with a conduit 442, and the left end of the conduit 442 is located on the left side of the push block 441;

[0039] In the initial state, the left end of the telescopic rod 46 squeezes the push block 441, and the spring is deformed by force. When the telescopic rod 46 moves to the right, the push block 441 loses the squeezing force, and the spring on its left side generates a reaction force to reset the push block 441. After the processing is completed, the semiconductor chip packaging frame is taken out, and the telescopic rod 46 is reset at this time, thereby squeezing the push block 441 again, and the left side of the telescopic rod 46 blows air into the through hole 421 through the conduit 442 to clean the debris generated inside due to processing, thereby ensuring the smoothness of the up and down movement of the silicone rod 423.

[0040] The processing method of the semiconductor chip packaging frame includes:

[0041] Step S1, installing the clamp on the packaging frame processing device, and then inserting the semiconductor chip packaging frame into the clamp block 4, and its bottom surface contacts the surface of the guide wheel 42;

[0042] Step S2, after the semiconductor chip packaging frame is completely inserted into the clamp block 4, the electric control valve is opened, and the push rod 452 presses against the lower surface of the semiconductor chip packaging frame to fix it;

[0043] Step S3, after the semiconductor chip packaging frame is fixed, the packaging frame processing device is operated to drill and bore the socket 21 of the semiconductor chip packaging frame. After the processing is completed, the external pressure relief valve is opened and the electric control valve is closed, and the operator takes out the processed semiconductor chip packaging frame.

[0044] In step S2 and step S3, after the semiconductor chip packaging frame is completely inserted into the clamp block 4, the electric control valve is opened, and at this time, the external pressure relief valve is in a closed state;

[0045] When taking out the processed semiconductor chip packaging frame, the electric control valve is closed, and at this time, the external pressure relief valve is opened;

[0046] In order to fix the semiconductor chip packaging frame after it is placed, it can be avoided that when the semiconductor chip packaging frame is inserted into the fixture, the friction between its bottom surface and the upper end of the push rod 452 may cause damage to the bottom surface quality of the semiconductor chip packaging frame. Similarly, when taking out the processed semiconductor chip packaging frame, the push rod 452 is used to loosen the semiconductor chip packaging frame first, which plays a role in protecting the surface quality of the semiconductor chip packaging frame and preventing it from being worn and affecting its appearance.

[0047] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0048] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A packaging frame processing device, used for manufacturing an easily detachable semiconductor chip packaging frame, the easily detachable semiconductor chip packaging frame comprising a semiconductor chip board (1) and a packaging frame board (2), characterized in that: A plurality of chips are mounted on the surface of the semiconductor chip board (1); three bosses (11) are evenly distributed on the front and rear sides of the bottom of the semiconductor chip board (1); three plug holes (21) are evenly distributed on the front and rear sides of the top of the packaging frame board (2); and the bosses (11) of the semiconductor chip board (1) are inserted into the plug holes (21) of the packaging frame board (2); The front and rear sides of the upper part of the packaging frame plate (2) are integrally formed with slide rails (22), and the surface of the slide rails (22) is slidably connected with a fixing plate (23). The insertion hole (21) of the packaging frame plate (2) is formed by processing with a packaging frame processing device, which includes drilling and boring. The packaging frame processing device includes a clamp, and the clamp includes a base (3) and two clamping blocks (4). The two clamping blocks (4) are respectively fixedly installed on the upper left and right sides of the base (3), and the inner sides are provided with a slide groove (41). The left and right sides of the packaging frame plate (2) are inserted into the clamping blocks (4) through the slide groove (41). The inner side bearing of the left clamping block (4) is installed with a rotating shaft (44). The right end of the rotating shaft (44) is fixed with a guide wheel (42), and the guide wheel (42) is located below the slide groove (41). When the packaging frame plate (2) is inserted into the clamping block (4), its bottom contacts the surface of the guide wheel (42). A toothed disc (43) is fixed on the right side of the guide wheel (42); a notch (31) is provided above the base (3); a gear (32) is installed on the right side bearing of the inner wall of the base (3); the gear (32) is located in the notch (31) and meshes with the bottom of the toothed disc (43); a telescopic joint (321) is fixed on the left side of the gear (32); a threaded rod (322) is fixed on the left end of the telescopic joint (321); a hydraulic chamber (33) is fixed on the left side of the inner wall of the base (3); a hydraulic plate (331) is slidably connected to the inner wall of the hydraulic chamber (33); a threaded hole is provided on the right side of the hydraulic chamber (33); the threaded rod (322) is threadedly connected to the threaded hole; the left end of the threaded rod (322) is connected to the right side bearing of the hydraulic plate (331); holes (45) are provided inside the two clamping blocks (4); and the holes (45) are provided inside the two clamping blocks (4). (45) is located in the slide groove (41), the inner wall of the hole (45) is slidably connected to a slider (451), a push rod (452) is fixed above the slider (451), the left side of the hydraulic chamber (33) is connected to the bottom pipeline of the hole (45), and an electric control valve is arranged in the pipeline, the left side of the hydraulic chamber (33) is connected to the external hydraulic oil pipeline, and a one-way valve is arranged in the pipeline, the bottom of the hole (45) is connected to the external pressure relief valve pipeline, a plurality of through holes (421) are opened around the guide wheel (42), and the inner wall of the through hole (421) is fixed with a limit block (422), the middle of the limit block (422) is slidably connected to a silicone rod (423), a fixed block is fixed to the outer side of the silicone rod (423), and the fixed block and the limit block (422) are connected by a spring, and a ball (424) is fixed at the inner end of the silicone rod (423); A telescopic rod (46) is fixed to the inner side of the clamping block (4) on the right side, the left end of the telescopic rod (46) is spherical and contacts the sphere (424) after movement, the interior of the rotating shaft (44) is hollow, and the sphere (424) is located inside the rotating shaft (44), the toothed disc (43) and the guide wheel (42) are connected in the middle, and the telescopic rod (46) is located in the middle of the toothed disc (43) and the guide wheel (42), and the right side of the hydraulic chamber (33) is connected to the telescopic rod (46) pipeline; A magnetic block (323) is arranged on the right side of the gear (32), a magnetorheological fluid is arranged inside the sphere (424), and the sphere itself is elastic, a push block (441) is slidably connected to the inner wall of the rotating shaft (44), and the left side of the push block (441) is spring-connected to the left side of the inner wall of the rotating shaft (44); The left end of the telescopic rod (46) presses the right side of the push block (441), and the upper and lower sides of the rotating shaft (44) are respectively connected to the inside of the through hole (421) with a conduit (442), and the left end of the conduit (442) is located on the left side of the push block (441).

2. A method for processing an easily detachable semiconductor chip packaging frame, using the packaging frame processing device according to claim 1, characterized in that: The processing method of the semiconductor chip packaging frame comprises: Step S1, installing the clamp on the packaging frame processing device, and then inserting the semiconductor chip packaging frame into the clamp block (4), with its bottom surface in contact with the surface of the guide wheel (42); Step S2, after the semiconductor chip packaging frame is completely inserted into the clamping block (4), the electric control valve is opened, and the push rod (452) presses against the lower surface of the semiconductor chip packaging frame to fix it; Step S3: After the semiconductor chip packaging frame is fixed, the packaging frame processing device is operated to perform drilling and boring work on the insertion hole (21) of the semiconductor chip packaging frame. After the processing is completed, the external pressure relief valve is opened and the electric control valve is closed, and the operator takes out the processed semiconductor chip packaging frame.

3. The method for processing an easily detachable semiconductor chip packaging frame according to claim 2, characterized in that: In the steps S2 and S3, after the semiconductor chip packaging frame is completely inserted into the clamping block (4), the electric control valve is opened, and at this time, the external pressure relief valve is in a closed state; When the processed semiconductor chip packaging frame is taken out, the electric control valve is closed, and at this time, the external pressure relief valve is opened.

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