Millimeter wave rule modular sparse active phased array antenna

Abstract

The application provides a millimeter wave regular modular sparse active phased array antenna, which comprises a comprehensive motherboard, a radio frequency power synthesis / distribution network, a component control network and a component power supply network are arranged on the comprehensive motherboard, a plurality of sparse antenna modules are arranged above the comprehensive motherboard, chip components are arranged below the comprehensive motherboard, a digital and power supply unit is arranged on a side of the chip components away from the comprehensive motherboard, the digital and power supply unit comprises a phased array wave control module and a power supply module, the phased array wave control module is connected with a system main control and the component control network, the power supply module is connected with a system power supply and the power supply network, the sparse antenna modules are vertically stacked with the comprehensive motherboard, vertical interconnection is realized through a plurality of PCBs, and the comprehensive motherboard is vertically connected with the digital and power supply unit through a plug-in low-frequency connector. The application can realize decoupling of the integrated antenna, the sparse antenna modules adopt sparse active feeding, the number of array active channels and the heat flux density can be effectively reduced, and the system cost is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of phased array antennas, in particular to a millimeter wave regular modular sparse active phased array antenna. BACKGROUND

[0002] In recent years, with the rapid rise of 5G millimeter wave communication and low-orbit broadband satellite, millimeter wave active phased array antenna technology is facing unprecedented development. In the field of satellite communication, as the communication frequency band extends to the millimeter wave band, the size of the terminal and the satellite-borne phased array antenna is increasingly compact, and it is developing towards small size, low profile, high density integration and low cost integration.

[0003] The cost and power consumption of traditional phased array antennas are mostly from the transceiver components. The integrated device technology and application based on III-V compound materials such as gallium arsenide and gallium nitride have been very mature, but the cost is high and not suitable for large-scale batch application. Benefiting from the development of silicon-based integrated circuit technology and PCB mixed pressing process, the multi-layer PCB board-level integrated phased array antenna product based on silicon-based chip integration is becoming the focus of research and development in the field of satellite communication. In particular, silicon-based technology has the advantage of single-chip high-density integration, which can integrate radio frequency, control and other hybrid circuits on a single chip, promoting the development of phased array transceiver components from discrete device circuits to monolithic microwave integrated circuits (MMIC), and further promoting the development of active subsystems towards high-density miniaturization. At the same time, by using the multi-layer PCB mixed pressing process, multiple types of signal networks can be integrated into a single board, which can further reduce the profile of the active phased array, and is a low-cost solution for tile integrated phased array.

[0004] However, compared with traditional discrete device active phased array antennas, tile phased array has the disadvantages of calibration difficulty and poor maintainability. In particular, for millimeter wave phased array, the size of the antenna is further reduced, and the density of the radio frequency channel is increased, which faces the following design challenges: 1) high-density integration: due to the short wavelength of millimeter wave frequency band, the contradiction between array element spacing and active component layout space needs to be solved when wide-angle scanning; 2) electromechanical thermal coupling: due to the small physical size of the array, the phase change caused by thermal-induced micro-deformation and vibration deformation is sensitive, which needs to be solved from the system-level electromechanical thermal coupling design; 3) for different application platforms, the array size and installation structure are slightly different, but the design of the antenna radio frequency is similar, and the period and cost required for repeated development are high, which is not conducive to product iteration. SUMMARY

[0005] To solve the technical problems existing in the prior art, the purpose of the present application is to provide a millimeter wave regular modular sparse active phased array antenna, which realizes arbitrary scale array assembly and improves the design flexibility and generalizability of sparse array.

[0006] To achieve the above-mentioned purposes, the application provides a millimeter wave regular modular sparse active phased array antenna, comprising:

[0007] A comprehensive motherboard, wherein a plurality of signal network circuits are arranged on the comprehensive motherboard, and the signal network circuits comprise a radio frequency power synthesis / distribution network, a component control network and a component power supply network;

[0008] A plurality of sparse antenna modules arranged above the comprehensive motherboard;

[0009] A chip component arranged below the comprehensive motherboard;

[0010] A digital and power supply unit arranged on a side of the chip component away from the comprehensive motherboard, comprising a phased array wave control module and a power supply module, wherein the phased array wave control module is connected with a system main control and the component control network, and the power supply module is connected with a system power supply and the power supply network;

[0011] The sparse antenna modules are vertically stacked with the comprehensive motherboard, and vertical interconnection is realized through a plurality of layers of PCBs;

[0012] The comprehensive motherboard and the digital and power supply unit are vertically connected through a plug-in low-frequency connector.

[0013] According to one technical solution of the application, each sparse antenna module comprises an antenna substrate, and further comprises:

[0014] An antenna radiation layer arranged on a top surface of the antenna substrate and comprising a plurality of antenna units;

[0015] A sparse feed conversion layer arranged on a bottom surface of the antenna substrate and electrically connected with the antenna units through feed probes, and used for passive power synthesis or passive power distribution of the antenna units; and a feed interface for connecting with the comprehensive motherboard is arranged on the sparse feed conversion layer;

[0016] A vertical transition connection structure is arranged on the comprehensive motherboard, used for connecting the feed interface and chip pins of the chip component, and the chip component is regularly arranged below the comprehensive motherboard according to the required number of active channels of the sparse channel proportion.

[0017] According to one technical solution of the application, each sparse antenna module comprises 16 antenna units arranged according to an equidistant rectangular grid; and the interval of the antenna units is half a wavelength.

[0018] The 16 antenna units are divided into four groups, and each group of the antenna units is rotated by 90 degrees compared with the previous group of the antenna units in a clockwise order.

[0019] Each chip of the chip assembly comprises four independent amplitude and phase conformal radio frequency channels.

[0020] According to one technical solution of the present application, the chip assembly comprises at least an amplitude and phase weighting conformal chip, a driving amplification chip, a delay chip and a frequency conversion assembly chip.

[0021] According to one technical solution of the present application, the radio frequency power synthesis / distribution network, the assembly control network and the power supply network on the comprehensive motherboard are welded with the sparse antenna module and the chip assembly through a ball grid array or a planar grid array.

[0022] According to one technical solution of the present application, the comprehensive motherboard comprises, from top to bottom, a chip power supply layer, a chip control layer, a radio frequency power synthesis / distribution layer and a chip assembly matching layer; the assembly power supply network, the assembly control network and the radio frequency power synthesis / distribution network are arranged on the chip power supply layer, the chip control layer and the radio frequency power synthesis / distribution layer respectively; different signal network circuits are isolated through a ground layer.

[0023] According to one technical solution of the present application, the digital and power supply unit further comprises a digital processing module and a frequency conversion module.

[0024] According to one technical solution of the present application, the antenna housing is internally provided with a mounting cavity, and the sparse antenna module, the comprehensive motherboard, the chip assembly and the digital and power supply unit are sequentially stacked in the mounting cavity from top to bottom; the antenna housing is provided with a power supply / control connector and a signal connector connected with the digital and power supply unit.

[0025] According to one technical solution of the present application, the antenna housing is internally provided with a mounting cavity, and the sparse antenna module, the comprehensive motherboard, the chip assembly and the digital and power supply unit are sequentially stacked in the mounting cavity from top to bottom; the antenna housing is provided with a power supply / control connector and a signal connector connected with the digital and power supply unit.

[0026] A heat dissipation cold plate is arranged above the digital and power supply unit; a uniform temperature heat exchange loop is embedded in the heat dissipation cold plate; the uniform temperature heat exchange loop is a uniform temperature heat pipe or a liquid cooling loop, and the uniform temperature heat pipe or the liquid cooling loop is connected with a circulating pump for introducing uniform temperature medium or cooling liquid to realize uniform temperature heat conduction or liquid cooling.

[0027] A heat conduction pad is arranged on the heat dissipation cold plate and in contact with the chip assembly.

[0028] An antenna housing heat sink structure is arranged on the outer surface or the inner surface of the antenna housing.

[0029] Compared with the prior art, the present application has the following beneficial effects:

[0030] The application provides a millimeter wave rule modular sparse active phased array antenna, innovatively adopts a modular sparse antenna subarray design, is favorable for realizing assembly of an array of any scale, solves defects of insufficient flexibility and general expandability of the sparse array design, and simultaneously reduces millimeter wave phased array active channel density and heat flow density.

[0031] The antenna radio frequency module is innovatively designed in a layered decoupling mode, the longitudinal circuit integration layers of the tile integrated antenna are reduced, the multi-layer PCB process implementation difficulty and cost are reduced, under the condition of array topology constraint and feed interface determination, the updating and verification of multiple types of antenna units are facilitated, and the product research and development iteration cycle can be accelerated.

[0032] Compared with the prior art, the application has the following beneficial effects:

[0033] The application adopts a modular sparse antenna subarray design, is favorable for realizing assembly of an array of any scale, solves defects of insufficient flexibility and general expandability of the sparse array design, and simultaneously reduces millimeter wave phased array active channel density and heat flow density.

[0034] The application performs layered decoupling design on the antenna radio frequency module, separates the passive antenna from the active network on the comprehensive mother board, reduces the longitudinal circuit layers of a single circuit board of the tile integrated antenna, reduces the multi-layer PCB process implementation difficulty and compression cost, solves problems of reduced whole board reliability due to too many types of board materials and limited compression process during multi-layer PCB mixed compression, reasonably determines the scale of the passive sparse subarray in combination with the sparse array topology requirement, can reduce system complexity while taking into account good array surface radiation performance, is favorable for updating and verifying multiple types of antenna units under the condition of fixed sparse array topology constraint, and can accelerate the product research and development iteration cycle.

[0035] The application introduces a sparse feed switching layer in the sparse antenna module, reduces the number of array active channels without reducing the number of antenna radiation units, avoids the problem of sharp reduction of scanning gain of a large proportion of sparse phased array antennas, facilitates passive synthesis of the antenna units according to the array sparse mode under system constraint, realizes driving of multiple passive antenna units by a single active channel of the component, effectively reduces the array active channel density, releases the wiring space of the rear mother board and reduces the component heat flow density, and is favorable for system heat dissipation.

[0036] The application integrates the radio frequency power synthesis network and the transceiver assembly, is welded and assembled with the passive array module, realizes the decoupling design of the integrated antenna, thereby facilitating the avoidance of the grating lobe generated by the large-angle scanning of the modular sparse array, the size of the passive antenna module used for splicing is pre-calculated by the topology optimization, and then the antenna unit and the feed arrangement are arranged according to the optimized antenna topology, thereby improving the antenna performance. The application can be applied to the integrated antenna design based on the multi-layer printed board mixed pressing process, realizes the hierarchical modular design in the system design, facilitates the array expansion and cutting of different scales, and when applied to the high-frequency phased array system such as millimeter wave, can effectively reduce the radio frequency channel density and the heat flux density of the system, and then effectively reduce the system cost and power consumption. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0038] Figure 1 A structural schematic diagram of a millimeter wave regular modular sparse active phased array antenna provided in an embodiment of the present application is schematically shown;

[0039] Figure 2 A structural schematic diagram of a sparse antenna module provided in an embodiment of the present application is schematically shown;

[0040] Figure 3 A position distribution schematic diagram of an antenna unit and a feed interface provided in an embodiment of the present application is schematically shown;

[0041] Figure 4 A distribution schematic diagram of a 256-element scale antenna unit provided in an embodiment of the present application is schematically shown;

[0042] Figure 5 A position distribution schematic diagram of an antenna unit and a chip assembly provided in an embodiment of the present application is schematically shown;

[0043] Figure 6 A structural schematic diagram of a comprehensive mother board provided in an embodiment of the present application is schematically shown.

[0044] The correspondence between the component names and the reference signs is as follows:

[0045] 1, comprehensive mother board; 2, sparse antenna module; 3, chip assembly; 4, digital and power supply unit; 5, heat dissipation cold plate; 6, antenna shell;

[0046] 11, chip power supply layer; 12, control layer; 13, RF power synthesis / distribution layer; 14, chip assembly matching layer;

[0047] 21, antenna substrate; 22, antenna radiation layer; 23, antenna unit; 24, sparse feeding conversion layer; 25, feeding interface; 26, feeding probe; 27, isolation column;

[0048] 61, power / control connector; 62, signal connector. DETAILED DESCRIPTION

[0049] The description of the embodiments of the present application should be considered in conjunction with the accompanying drawings, which are incorporated in and constitute a part of this specification. In the drawings, the shapes or thicknesses of the embodiments can be exaggerated and simplified for the purpose of convenience or clarity, and parts of structures in the drawings will be described separately, and it should be noted that elements not shown or described in the drawings or by words are in forms known to those skilled in the art.

[0050] The description of the embodiments herein, any reference to direction or position, is only for the convenience of description, and cannot be understood as any limitation on the scope of protection of the present application. The following description of the preferred embodiments will involve combinations of features, which can exist independently or in combination, and the present application is not particularly limited to the preferred embodiments. The scope of the present application is defined by the claims.

[0051] The embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0052] As shown in Figure 1 , the present application provides a millimeter wave regular modular sparse active phased array antenna, which comprises a comprehensive motherboard 1, a plurality of sparse antenna modules 2, chip assemblies 3, and digital and power supply units 4. The comprehensive motherboard 1 is provided with a plurality of signal network circuits, which include RF power synthesis / distribution networks, assembly control networks, and assembly power supply networks. The sparse antenna modules 2 are vertically stacked with the comprehensive motherboard 1 and are vertically interconnected through multi-layer PCBs. The comprehensive motherboard 1 and the digital and power supply units 4 are vertically connected through a plug-in low-frequency connector.

[0053] As shown in Figure 2 and Figure 3As shown, each sparse antenna module 2 includes an antenna substrate 21, an antenna radiation layer 22, and a sparse feeding transition layer 24. The antenna radiation layer 22 is arranged on the top surface of the antenna substrate 21 and includes a plurality of antenna units 23. The sparse feeding transition layer 24 is arranged on the bottom surface of the antenna substrate 21 and is electrically connected to the antenna units 23 through feeding probes 26 for passive power synthesis or passive power distribution of the antenna units 23. The sparse feeding transition layer 24 is provided with a feeding interface 25 for connection with the integrated motherboard 1. The integrated motherboard 1 is provided with a vertical transition connection structure for connecting the feeding interface 25 and the chip pins of the chip assembly 3, and the chip assembly 3 is regularly arranged below the integrated motherboard 1 according to the required number of active channels of the sparse channel ratio.

[0054] Through the sparse feeding transition layer 24, a passive power synthesis or distribution layer can be introduced in the sparse antenna module 2. In this embodiment, the sparse feeding transition layer 24 can adopt a stripline T-junction power divider or a stripline T-junction power synthesizer to realize power synthesis or distribution of multiple units, thereby realizing the sparsity of the antenna unit feeding channel.

[0055] In order to avoid the periodic arrangement of the phase centers of the synthesized subarray causing scanning sidelobes, the subarray topology can be optimized through the sparse array synthesis method, and then the topology structure of the sparse antenna module 2 is adjusted accordingly according to the optimization result. The subarray topology optimization can adopt convex optimization or intelligent optimization algorithm, and the optimization process is not described here. The optimized topology structure of a 256-element array is as shown in Figure 4 As shown, every 16 antenna units form a standard sparse subarray module, which is rotated and translated and expanded in the array area.

[0056] In order to facilitate modular design and processing, the antenna array is arranged in a rectangular grid. In this embodiment, each sparse antenna module 2 includes 16 antenna units 23 arranged in an equidistant rectangular grid; the spacing of the antenna units 23 is half a wavelength.

[0057] Further, for a circularly polarized antenna array, the 16 antenna units 23 in the sparse antenna module 2 are divided into four groups, and each group of antenna units 23 is rotated by 90 degrees compared to the previous group of antenna units 23 in sequence, so that the scanning axial ratio performance can be improved by the sequential rotation of the sparse antenna module 2 subarray.

[0058] As shown in Figure 5As shown, in order to meet the requirements of modular assembly, the positions of the feed interfaces 25 of the sparse antenna are regularly arranged. According to the design of the tile integrated subarray, the chip assembly 3 is regularly arranged on the lower layer of the integrated motherboard 1 according to the required number of active channels in the channel sparse ratio, and the matching interconnection from the antenna feed point to the chip pin is realized by using the strip line and various vertical transition structures in the inner layer of the integrated motherboard 1, wherein the equal-length wiring is performed on each active channel; in the embodiment, each chip contains 8 independent amplitude and phase weighted shaping radio frequency channels, and 16 antenna units can be controlled under the condition of 50% channel sparsity.

[0059] As shown in the accompanying drawings, Figure 3 As shown is a schematic diagram of a standard passive subarray module under the condition of 50% channel sparsity, a strip line T-junction power combiner is introduced in the antenna feed layer, and the non-equal-phase design is performed on the passive power combiner in the modular subarray in combination with the array topology optimization for breaking the regular subarray phase center arrangement.

[0060] The chip assembly 3 at least includes an amplitude and phase weighted shaping chip, a driving and amplifying chip, a delay chip and a frequency conversion assembly chip, and is welded on the bottom layer of the integrated motherboard by using the SMT surface mounting process, and the heat dissipation surface is exposed to facilitate contact with the heat dissipation structure.

[0061] As shown in the accompanying drawings, Figure 6 The integrated motherboard 1 includes a chip power supply layer 11, a chip control layer 12, a radio frequency power synthesis / distribution layer 13 and a chip assembly matching layer 14 arranged in sequence from top to bottom. The assembly power supply network, the assembly control network and the radio frequency power synthesis / distribution network are arranged on the chip power supply layer 11, the chip control layer 12 and the radio frequency power synthesis / distribution layer 13 respectively, and are welded with the sparse antenna module 2 and the chip assembly 3 by using the ball grid array or the planar grid array. The different signal network circuits are isolated by the ground layer.

[0062] The integrated motherboard 1 is realized by using the multi-layer PCB mixed pressure to realize the integrated integration of the integrated motherboard, which is beneficial to realize the low profile contour of the phased array antenna whole machine; and is combined with the antenna radiation array panel by pressure, so as to avoid the mixed pressure reliability risk caused by the unevenness of the dielectric material in the processing. In the longitudinal dimension, the control circuit and the power supply circuit of the chip are distributed on the upper layer of the integrated motherboard, the radio frequency signal power synthesis / distribution and the delay frequency conversion and other switching circuits are integrated in the lower layer of the integrated motherboard, the different signal networks are isolated by the ground layer, and good electromagnetic compatibility performance is realized; the radio frequency signal layer adopts the Wilkinson power synthesizer / distributor, and good radio frequency network port isolation is realized.

[0063] The digital and power supply unit 4 is arranged on the side of the chip assembly 3 away from the integrated motherboard 1, and includes a phased array wave control module and a power supply module; the phased array wave control module is connected with a system master control and an assembly control network through a low-frequency connector, obtains beam pointing information, and sends the amplitude, phase and delay information of the channel to the chip assembly 3 through the control circuit of the integrated motherboard 1. The power supply module is connected with a system power supply through a low-frequency connector, and distributes the voltage signals required by the active devices to various active devices through the power supply network of the integrated motherboard 1 through the voltage conversion circuit. For an analog phased array, the digital and power supply unit 4 only needs the phased array wave control module and the power supply module; for a digital phased array, the digital and power supply unit 4 further includes a digital processing module and a frequency conversion module, the frequency conversion module completes the up-conversion and down-conversion processing of the integrated motherboard combined signal, and the digital signal processing is realized through the digital-to-analog conversion, analog-to-digital conversion and signal processing module in the digital processing module.

[0064] As shown in Figure 1 The present application further includes an antenna shell 6, an installation cavity is arranged in the antenna shell 6, the sparse antenna module 2, the integrated motherboard 1, the chip assembly 3 and the digital and power supply unit 4 are arranged in the installation cavity from top to bottom in sequence, and the antenna shell 6 is provided with a power supply / control connector 61 and a signal connector 62 connected with the digital and power supply unit 4.

[0065] The present application further includes a heat dissipation structure, which includes a heat dissipation cold plate 5, a heat conduction pad and an antenna shell heat sink structure. The heat dissipation cold plate 5 is arranged above the digital and power supply unit 4; a uniform temperature heat exchange circuit is embedded in the heat dissipation cold plate 5; the uniform temperature heat exchange circuit is a uniform temperature heat pipe or a liquid cooling circuit, which is connected with a circulating pump for importing uniform temperature medium or cooling liquid to realize uniform temperature heat conduction or liquid cooling. The heat conduction pad is arranged on the heat dissipation cold plate 5 and is in contact with the chip assembly 3. The antenna shell heat sink structure is arranged on the outer surface or the inner surface of the antenna shell 6.

[0066] For a millimeter wave phased array antenna system, as the working frequency increases, the array physical size is compact, and when the chip density of the chip assembly 3 increases, the heat flux density of the active array is high; according to the heat flux density of the system, the heat dissipation cold plate 5 can embed a heat pipe for uniform temperature heat conduction, or adopt an embedded flow channel liquid cooling circuit to export the heat of the active device to the circulating pump or the structure shell for further heat dissipation.

[0067] It should be noted that the above-mentioned is the preferred embodiment of the present application, it should be pointed out that although the preferred embodiments of the present application have been described, for those skilled in the art, once the basic creative concept of the present application is known, without departing from the principles of the present application, several improvements and refinements can also be made, which should be considered as the protection scope of the present application. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the embodiments of the present application.

Claims

1. A millimeter wave rule modular sparse active phased array antenna, characterized in that, The application relates to a kind of integrated motherboards (1) and sparse antenna modules (2) and chip components (3) and digital and power supply units (4) and vertical transition connection structures. The integrated motherboard (1) is provided with a plurality of signal network circuits, including radio frequency power synthesis / distribution network, component control network and component power supply network. The sparse antenna module (2) is a passive sparse antenna module. The chip component (3) is arranged below the integrated motherboard (1). The digital and power supply unit (4) is arranged on the side of the chip component (3) away from the integrated motherboard (1), including phased array wave control module and power supply module. The sparse antenna module (2) and the integrated motherboard (1) are vertically stacked and connected by multi-layer PCB. The integrated motherboard (1) and the digital and power supply unit (4) are connected by plug-in low-frequency connector. Each sparse antenna module (2) includes an antenna substrate (21) and an antenna radiation layer (22) arranged on the top surface of the antenna substrate (21), including a plurality of antenna units (23). A sparse feed transfer layer (24) is arranged on the bottom surface of the antenna substrate (21) and electrically connected to the antenna unit (23) through a feed probe (26) for passive power synthesis or passive power distribution of the antenna unit (23). The integrated motherboard (1) is provided with a vertical transition connection structure for connecting the feed interface (25) and the chip pin of the chip component (3). Each sparse antenna module (2) includes 16 antenna units (23) arranged in an equidistant rectangular grid; the interval of the antenna unit (23) is half wavelength.

2. The millimeter-wave rule-based modular sparse active phased-array antenna of claim 1, wherein, The 16 antenna units (23) are divided into four groups, and each group of antenna units (23) is rotated 90 degrees compared with the previous group of antenna units (23) in clockwise order.

3. The millimeter-wave regular modular sparse active phased-array antenna according to claim 2, wherein, The chip component (3) includes amplitude-phase weighting conformal chip, driving amplification chip, delay chip and frequency conversion component chip.

4. The millimeter-wave rule-based modular sparse active phased-array antenna of claim 1, wherein, The radio frequency power synthesis / distribution network, the component control network and the component power supply network on the integrated motherboard (1) are welded with the sparse antenna module (2) and the chip component (3) through ball grid array or planar grid array.

5. The millimeter-wave rule modular sparse active phased-array antenna according to claim 1, wherein, ​ 6. The millimeter-wave rule-based modular sparse active phased-array antenna of claim 1, wherein, The integrated motherboard (1) comprises a chip power supply layer (11), a chip control layer (12), a radio frequency power synthesis / distribution layer (13), and a chip component matching layer (14) arranged in sequence from top to bottom; the component power supply network, the component control network, and the radio frequency power synthesis / distribution network are arranged on the chip power supply layer (11), the chip control layer (12), and the radio frequency power synthesis / distribution layer (13) respectively; the different signal network circuits are isolated by a ground layer.

7. The millimeter-wave rule modular sparse active phased-array antenna according to claim 1, wherein, The digital and power supply unit (4) further comprises a digital processing module and a frequency conversion module.

8. The millimeter-wave rule-based modular sparse active phased-array antenna of claim 1, wherein, The antenna shell (6) is further provided with a mounting cavity, and the sparse antenna module (2), the integrated motherboard (1), the chip component (3), and the digital and power supply unit (4) are sequentially stacked in the mounting cavity from top to bottom; the antenna shell (6) is provided with a power supply / control connector (61) and a signal connector (62) connected with the digital and power supply unit (4).

9. The millimeter-wave rule modular sparse active phased-array antenna according to claim 8, wherein, The heat dissipation structure comprises: A heat dissipation cold plate (5) is arranged above the digital and power supply unit (4); a uniform temperature heat exchange circuit is embedded in the heat dissipation cold plate (5); the uniform temperature heat exchange circuit is a uniform temperature heat pipe or a liquid cooling circuit; the uniform temperature heat pipe or the liquid cooling circuit is connected with a circulating pump for introducing uniform temperature medium or cooling liquid to realize uniform temperature heat conduction or liquid cooling; A heat conduction pad is arranged on the heat dissipation cold plate (5) and is in contact with the chip component (3); An antenna shell heat sink structure is arranged on the outer surface or the inner surface of the antenna shell (6).

Images