Pressure maintaining device

Abstract

The application discloses a pressure maintaining device and relates to the technical field of circuit board film pasting. The pressure maintaining device comprises a base, a transmission mechanism, a first pressure maintaining mechanism and a second pressure maintaining mechanism. The transmission mechanism is arranged on the base and forms a transmission flow channel in a first direction, and is used for conveying a circuit board. The first pressure maintaining mechanism is used for tightly pressing a protective film in a central area. The second pressure maintaining mechanism is provided with a groove matched with the central area of the circuit board. In the pressure maintaining process, the central area enters the groove, and the edge area of the protective film is tightly pressed, so that the protective film is tightly pasted on the circuit board through a double pressure maintaining mechanism. The pressure maintaining device is used for solving the problem of that the edge of the protective film is not tightly pasted, and improves the production qualified rate and reduces the cost.

Description

Technical Field

[0001] This invention relates to the field of circuit board film bonding technology, and in particular to a pressure holding device. Background Technology

[0002] In the manufacturing process of electronic products, circuit boards, as core components, often require surface coating to protect them from environmental factors such as dust and moisture, while also improving their insulation performance and durability. After the coating process is completed, a pressure holding process is required to ensure a tight bond between the protective film and the circuit board without any air bubbles. This involves maintaining a certain pressure for a period of time to allow the protective film to fully contact and cure with the circuit board surface.

[0003] Currently, the existing technical solution involves using automated equipment to apply pressure after the protective film is applied, physically bonding the film tightly to the circuit board surface. This pressure application is usually performed immediately after film application, using pressure to expel air from the protective film and initially fix its position.

[0004] However, this pressure-holding technique proves inadequate when dealing with edge treatment of the protective film. Because the force is more dispersed at the edges, and tiny gaps can easily form due to the elastic recoil of the protective film, the adhesion at the edges may be weak, leading to problems such as lifting and detachment. This not only affects the overall protective effect of the circuit board but also directly reduces the production yield and increases the cost of rework and repair later on. Summary of the Invention

[0005] The main objective of this invention is to provide a pressure-holding device and processing system that aims to solve the problem of poor edge adhesion of the protective film, thereby improving the production qualification rate and reducing costs.

[0006] To achieve the above objectives, the present invention proposes a pressure-holding device for pressing a protective film onto a circuit board, the circuit board having an edge region and a central region protruding from the circuit board, both the edge region and the central region being covered with the protective film, the pressure-holding device comprising:

[0007] abutment;

[0008] A transmission mechanism is disposed on the base, and the transmission mechanism forms a transmission channel extending along a first direction. The transmission channel is used to transport the circuit board, and the transmission channel has a first pressure holding position and a second pressure holding position arranged along the first direction.

[0009] A first pressure-holding mechanism is disposed on the base and corresponds to the first pressure-holding position. The first pressure-holding mechanism has a first pressure-holding area, and the first pressure-holding mechanism holds pressure on the central area through the first pressure-holding area so that the first pressure-holding area fits into the central area; and

[0010] The second pressure holding mechanism is disposed on the base and corresponds to the second pressure holding position. The second pressure holding mechanism has a second pressure holding area and a groove formed in the second pressure holding area. The second pressure holding mechanism holds pressure on the edge area through the second pressure holding area so that the second pressure holding area fits with the edge area and the center area enters the groove.

[0011] In one embodiment, the first pressure-holding mechanism includes:

[0012] A first base is disposed on the base platform and corresponds to the first pressure holding position;

[0013] A first drive module, wherein the first drive module is disposed on the first base; and

[0014] A first pressure holding plate is disposed at the output end of the first drive module. The side of the first pressure holding plate facing the transmission channel is a pressure holding surface, and the pressure holding surface forms the first pressure holding area.

[0015] The first driving module drives the first pressure-holding plate to move closer to or away from the transmission channel, so that the pressure-holding surface fits the central region.

[0016] In one embodiment, the first base includes a first pillar and a first support plate, the first pillar is disposed on the base, the first support plate is movably connected to the first pillar, and the first drive module is disposed on the first support plate;

[0017] The first pressure-holding mechanism further includes a first adjustment module, which is disposed on the first support column and connected to the first support plate;

[0018] The first adjustment module drives the first support plate to move along the extension direction of the first pillar to adjust the distance between the first pressure plate and the transmission channel.

[0019] In one embodiment, the central region is provided with an element, and the pressure-holding surface is also provided with a clearance groove. The clearance groove cooperates with the element in the central region so that when the pressure-holding surface is in contact with the central region, the element enters the clearance groove.

[0020] In one embodiment, the second pressure-holding mechanism includes:

[0021] The second base is disposed on the base platform and corresponds to the second pressure holding position;

[0022] A second drive module, the second drive module being disposed on the second base; and

[0023] The second pressure plate is disposed at the output end of the second drive module. The edge of the second pressure plate near the circuit board is provided with a pressure block, which forms the second pressure holding area and surrounds the groove.

[0024] The second drive module drives the second pressure plate so that the pressure block fits against the edge region and the center region enters the groove.

[0025] In one embodiment, the second base includes a second pillar and a second support plate, the second pillar is disposed on the base, the second support plate is movably connected to the second pillar, and the second drive module is disposed on the second support plate;

[0026] The second pressure-holding mechanism further includes a second adjustment module, which is disposed on the second support column and connected to the second support plate;

[0027] The second adjustment module drives the second support plate to move along the extension direction of the second pillar to adjust the distance between the second pressure plate and the transmission channel.

[0028] In one embodiment, the transmission mechanism includes:

[0029] A rack, which is mounted on the base and has the transmission channel provided thereon;

[0030] Two lifting components are spaced apart on the base and correspond to the first pressure holding position and the second pressure holding position, respectively. Each lifting component has a lifting surface located within the transmission channel.

[0031] A limiting member is provided on the base and spaced apart from the lifting component. There are two limiting members, which correspond to the first pressure holding position and the second pressure holding position, respectively. The limiting member is provided with a limiting plate that moves relative to the transmission channel.

[0032] The limiting member drives the limiting plate to extend into the transmission channel to prevent the circuit board from moving, and the lifting assembly drives the lifting surface to approach the transmission channel so that the circuit board is disengaged from the transmission channel.

[0033] In one embodiment, the lifting assembly includes:

[0034] A lifting drive component, wherein the lifting drive component is disposed on the base and corresponds to the first pressure holding position or the second pressure holding position; and

[0035] A lifting seat is provided at the output end of the lifting drive member, and the lifting surface is provided on the side of the lifting seat facing the transmission channel;

[0036] The lifting drive unit drives the lifting seat to move the circuit board in the vertical direction.

[0037] In one embodiment, the transmission mechanism is provided with two transmission channels, both of which extend along the first direction, and each transmission channel is provided with a first pressure holding position and a second pressure holding position;

[0038] The pressure holding device includes two first pressure holding mechanisms and two second pressure holding mechanisms, each first pressure holding mechanism corresponding to a first pressure holding position, and each second pressure holding mechanism corresponding to a second pressure holding position.

[0039] In one embodiment, the pressure holding device further includes a feeding mechanism movably disposed on the base, the feeding mechanism having a feeding space, the feeding mechanism being located at one end of the transmission channel and moving along a second direction so that the feeding space is correspondingly connected to any of the transmission channels;

[0040] And / or, the pressure holding device further includes a feeding mechanism movably disposed on the base, the feeding mechanism having a feeding space, the feeding mechanism being located at the other end of the transmission channel and moving along a second direction so that the feeding space is correspondingly connected to any of the transmission channels.

[0041] The technical solution of this invention utilizes a dual pressure-holding mechanism—a first pressure-holding mechanism and a second pressure-holding mechanism—to respectively press the central and edge areas of the circuit board. The first pressure-holding mechanism ensures a tight fit between the protective film in the central area and the circuit board, while the second pressure-holding mechanism, with its grooved second pressure-holding area, allows the central area to be placed within the groove during the pressure-holding process, avoiding pressure, while applying targeted pressure to the edge areas. This effectively solves the problem of poor adhesion at the edges, significantly improves the production yield, and reduces costs. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of a structure of an embodiment of the pressure-holding device provided by the present invention;

[0044] Figure 2 for Figure 1 A schematic diagram of the first pressure-holding mechanism in the process;

[0045] Figure 3 for Figure 2 A schematic diagram of part of the first pressure-holding mechanism in the diagram;

[0046] Figure 4 for Figure 1 A schematic diagram of the second pressure-holding mechanism in the middle;

[0047] Figure 5 for Figure 4 A schematic diagram of part of the second pressure-holding mechanism in the diagram;

[0048] Figure 6 for Figure 1 A schematic diagram of the transmission mechanism in the diagram;

[0049] Figure 7 for Figure 6 A schematic diagram of the rack structure in the diagram;

[0050] Figure 8 for Figure 6 A schematic diagram of the limiting component in the middle;

[0051] Figure 9 for Figure 6 A schematic diagram of the lifting component in the middle;

[0052] Figure 10 for Figure 1 A schematic diagram of the feeding mechanism.

[0053] Explanation of icon numbers:

[0054] 100. Pressure holding device; 1. Base; 11. Adjustable foot; 2. Transmission mechanism; 21. Frame; 211. Transmission channel; 212. Support; 2121. Detection sensor; 213. Transmission belt; 214. Transmission drive component; 22. Lifting assembly; 221. Lifting seat; 2211. Limit block; 222. Lifting drive component; 23. Limiting component; 231. Limiting plate; 232. Limiting drive component; 3. First pressure holding mechanism; 31. First base; 311. First support column; 312. First support plate; 32. First drive module; 33. First 331. Pressure holding plate; 332. Pressure holding surface; 333. Clearance groove; 34. First adjustment module; 341. Connector; 35. First pressure holding area; 4. Second pressure holding mechanism; 41. Second base; 411. Second support column; 412. Second support plate; 42. Second drive module; 43. Second pressure holding plate; 431. Pressure holding block; 432. Groove; 44. Second adjustment module; 45. Second pressure holding area; 5. Feeding mechanism; 51. Slide rail; 52. Slide seat; 53. Transmission belt; 54. Feeding drive component; 55. Position sensor; 6. Unloading mechanism.

[0055] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0057] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0058] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0059] In the manufacturing process of electronic products, circuit boards, as core components, often require surface coating to protect them from environmental factors such as dust and moisture, while also improving their insulation performance and durability. After the coating process is completed, a pressure holding process is required to ensure a tight bond between the protective film and the circuit board without any air bubbles. This involves maintaining a certain pressure for a period of time to allow the protective film to fully contact and cure with the circuit board surface.

[0060] Currently, the existing technical solution involves a one-time pressure-holding operation using automated equipment after the protective film is applied, physically bonding the film tightly to the circuit board surface. This pressure-holding is usually performed immediately after film application, using pressure to expel air from the protective film and initially fix its position.

[0061] However, this single-pressure-holding technique proves inadequate when dealing with edge treatment of the protective film. Because the stress is more dispersed at the edges, and the protective film is prone to creating tiny gaps due to elastic recoil, the edges may not adhere properly, leading to problems such as lifting and detachment. This not only affects the overall protective effect of the circuit board but also directly reduces the production yield and increases the cost of rework and repair later on.

[0062] This invention proposes a pressure-holding device 100, which aims to solve the problem of loose edge adhesion of the protective film, thereby improving the production qualification rate and reducing costs.

[0063] Please see Figures 1 to 10In one embodiment of the present invention, a pressure-holding device 100 is used to press a protective film onto a circuit board. The circuit board has an edge region and a central region protruding from the circuit board. A protective film is attached to both the edge region and the central region. The pressure-holding device 100 includes a base 1, a transmission mechanism 2, a first pressure-holding mechanism 3, and a second pressure-holding mechanism 4. The transmission mechanism 2 is disposed on the base 1 and forms a transmission channel 211 extending along a first direction. The transmission channel 211 is used to transport the circuit board and has a first pressure-holding position and a second pressure-holding position arranged along the first direction. The first pressure-holding mechanism 3 is disposed on the base 1 and corresponds to the first pressure-holding position. The first pressure-holding mechanism 3 has a first pressure-holding area 35. The first pressure-holding mechanism 3 applies pressure to the central region through the first pressure-holding area 35, so that the first pressure-holding area 35 adheres to the central region. The second pressure holding mechanism 4 is provided on the base 1 and corresponds to the second pressure holding position. The second pressure holding mechanism 4 is provided with a second pressure holding area 45 and a groove 432 opened in the second pressure holding area 45. The second pressure holding mechanism 4 holds pressure on the edge area through the second pressure holding area 45 so that the second pressure holding area 45 fits with the edge area and the center area enters the groove 432.

[0064] In this embodiment, the pressure-holding device 100, through a dual pressure-holding mechanism of a first pressure-holding mechanism 3 and a second pressure-holding mechanism 4, can respectively press the central area and the edge area of ​​the circuit board. The first pressure-holding mechanism 3 ensures that the protective film in the central area is tightly adhered to the circuit board, while the second pressure-holding mechanism 4, utilizing a second pressure-holding area 45 with a groove 432, allows the central area of ​​the second pressure-holding mechanism 4 to enter the groove 432 during the pressure-holding process, avoiding pressure, while applying targeted pressure to the edge area. This effectively solves the problem of poor adhesion at the edge, significantly improves the production qualification rate, and reduces costs.

[0065] In one embodiment, the first pressure-holding mechanism 3 includes a first base 31, a first drive module 32, and a first pressure-holding plate 33. The first base 31 is disposed on the base 1 and corresponds to the first pressure-holding position. The first drive module 32 is disposed on the first base 31. The first pressure-holding plate 33 is disposed at the output end of the first drive module 32, and the side of the first pressure-holding plate 33 facing the transmission channel 211 is a pressure-holding surface 331, which forms a first pressure-holding region 35. The first drive module 32 drives the first pressure-holding plate 33 to move closer to or further away from the transmission channel 211 so that the pressure-holding surface 331 fits against the central region.

[0066] This is understandable; please refer to [link / reference]. Figure 2 and Figure 3 The first drive module 32 drives the first pressure plate 33 to move so that the pressure surface 331 abuts against the circuit board, thereby pressing the protective film in the central area onto the circuit board.

[0067] In this embodiment, the circuit boards are loaded in trays and transported to various locations via transport trays. Each tray holds two circuit boards. To ensure the protective film on each circuit board is firmly pressed during the pressure-holding process, four sets of first drive modules 32 are arranged in parallel. Two adjacent first drive modules 32 drive two corresponding first pressure-holding plates 33 to press down on a circuit board. Of course, the number of circuit boards loaded on each tray can vary, and different numbers of first drive modules 32 and first pressure-holding plates 33 can be used accordingly; this is not limited here.

[0068] In one embodiment, the first base 31 includes a first pillar 311 and a first support plate 312. The first pillar 311 is disposed on the base 1, and the first support plate 312 is movably connected to the first pillar 311. A first drive module 32 is disposed on the first support plate 312. The first pressure holding mechanism 3 further includes a first adjustment module 34, which is disposed on the first pillar 311 and connected to the first support plate 312. The first adjustment module 34 drives the first support plate 312 to move vertically to adjust the distance between the first pressure holding plate 33 and the circuit board.

[0069] This is understandable; please refer to [link / reference]. Figure 2 and Figure 3 The output end of the first adjustment module 34 is connected to the first support plate 312 via a connector 341. The first adjustment module 34 can drive the first support plate 312 to move vertically, thereby causing the first drive module 32 and the first pressure holding plate 33 to move closer to or further away from the circuit board, changing the distance between the first pressure holding plate 33 and the circuit board. This makes the pressure holding device 100 suitable for circuit boards of different thicknesses, improving the versatility and flexibility of the pressure holding device 100.

[0070] In one embodiment, the central region is provided with an element, and the pressure-holding surface 331 is also provided with a relief groove 332. The relief groove 332 cooperates with the element in the central region so that when the pressure-holding surface 331 is in contact with the central region, the element enters the relief groove 332.

[0071] In this embodiment, please refer to Figure 3 The central area of ​​the circuit board also contains some components. These components are either not covered with a protective film or are too fragile to be pressed. Therefore, a relief groove 332 is provided on the pressure-holding surface 331 so that the components can enter the relief groove 332 during the pressure-holding process, thereby avoiding being pressed.

[0072] In one embodiment, the second pressure-holding mechanism 4 includes a second base 41, a second drive module 42, and a second pressure-holding plate 43. The second base 41 is disposed on the base 1 and corresponds to the second pressure-holding position. The second drive module 42 is disposed on the second base 41. The second pressure-holding plate 43 is disposed at the output end of the second drive module 42. A pressure-holding block 431 is provided on the edge of the side of the second pressure-holding plate 43 near the circuit board. The pressure-holding block 431 forms a second pressure-holding area 45 and surrounds a groove 432. The second drive module 42 drives the second pressure-holding plate 43 so that the pressure-holding block 431 fits against the edge area and the central area enters the groove 432.

[0073] In this embodiment, please refer to Figure 4 and Figure 5 The second pressure holding mechanism 4 has a similar structure to the first pressure holding mechanism 3, and will not be described in detail here. However, it should be noted that the edge of the second pressure holding plate 43 near the circuit board is provided with a pressure holding block 431. The pressure holding block 431 is used to hold pressure on the edge area. The pressure holding block 431 is surrounded by a groove 432. When the second drive module 42 drives the second pressure holding plate 43 to approach the circuit board, the central area enters the groove 432 to avoid being pressured, thereby applying pressure to the edge area in a targeted manner.

[0074] In one embodiment, the second base 41 includes a second pillar 411 and a second support plate 412. The second pillar 411 is disposed on the base 1, and the second support plate 412 is movably connected to the second pillar 411. A second drive module 42 is disposed on the second support plate 412. The second pressure holding mechanism 4 further includes a second adjustment module 44, which is disposed on the second pillar 411 and connected to the second support plate 412. The second adjustment module 44 drives the second support plate 412 to move vertically to adjust the distance between the second pressure holding plate 43 and the circuit board.

[0075] This is understandable; please refer to [link / reference]. Figure 4 and Figure 5 The second pressure holding mechanism 4 includes a second adjustment module 44. Since the second adjustment module 44 has the same structure as the first adjustment module 34, and the second adjustment module 44 can also change the distance between the circuit board and the second pressure holding plate 43 to adapt to circuit boards of different thicknesses, the two have the same effect. Therefore, the structure of the second adjustment module 44 will not be described in detail.

[0076] In one embodiment, the transmission mechanism 2 includes a frame 21, a lifting assembly 22, and a limiting member 23. The frame 21 is disposed on a base 1 and has a transmission channel 211. Two lifting assemblies 22 are spaced apart on the base 1 and correspond to a first pressure holding position and a second pressure holding position, respectively. Each lifting assembly has a lifting surface located within the transmission channel 211. The limiting member 23 is disposed on the base 1 and spaced apart from the lifting assembly 22. There are two limiting members 23, each corresponding to a first pressure holding position and a second pressure holding position, respectively. The limiting member 23 has a limiting plate 231 that moves relative to the transmission channel 211. Specifically, the limiting member 23 drives the limiting plate 231 to extend into the transmission channel 211 to prevent the circuit board from moving, and the lifting assembly 22 drives the lifting surface to approach the transmission channel 211 so that the circuit board is disengaged from the transmission channel 211.

[0077] In this embodiment, please refer to Figure 6 and Figure 7 The frame 21 includes a support 212, a transmission belt 213, and a transmission drive 214. There are two sets of supports 212, which are positioned opposite each other on the base 1, with the extension direction of the supports 212 being a first direction. The transmission belt 213 is positioned along the first direction on each set of supports 212, forming a transmission channel 211 between the transmission belt 213 and the supports 212. The transmission drive 214 is located on the base 1 and adjacent to the supports 212, with the transmission belt 213 located at the output end of the transmission drive 214. The transmission drive 214 drives the transmission belt 213 to move the material tray along the first direction.

[0078] Optionally, along the first direction, detection sensors 2121 are provided on both sides of the bracket 212. The detection sensors 2121 are used to detect the loading and unloading of the material tray. When a material tray is loaded, the detection sensor 2121 can quickly capture this information and start the corresponding operation process of the pressure holding device 100. Similarly, when the material tray completes all pressure holding processes, the detection sensor 2121 will also respond in time to ensure that the next mechanism can receive the circuit board that has completed pressure holding in time, thereby ensuring the continuity and stability of the entire production process and making the pressure holding device 100 more intelligent.

[0079] This is understandable; please refer to [link / reference]. Figure 6 and Figure 8 The limiting member 23 and the lifting assembly 22 are spaced apart along the first direction, with each lifting assembly 22 corresponding to one limiting member 23. The limiting member 23 is used to prevent the material tray from moving along the first direction, so that the lifting assembly 22 can lift the material tray. The limiting member 23 includes a limiting drive member 232 and a limiting plate 231. The limiting drive member 232 is located on the base 1 and corresponds to the first pressure holding position or the second pressure holding position. The limiting plate 231 is located at the output end of the limiting drive member 232. The limiting drive member 232 drives the limiting plate 231 to move in the vertical direction.

[0080] In one embodiment, the lifting assembly 22 includes a lifting drive 222 and a lifting seat 221. The lifting drive 222 is disposed on the base 1 and corresponds to either the first pressure holding position or the second pressure holding position. The lifting seat 221 is disposed at the output end of the lifting drive 222, and the side of the lifting seat 221 facing the transmission channel 211 has a lifting surface. The lifting drive 222 drives the lifting seat 221 to move the circuit board vertically.

[0081] In this embodiment, please refer to Figure 6 and Figure 9 The lifting drive component 222 drives the lifting seat 221 to move vertically, causing the material tray to contact or disengage from the transmission belt 213. When the first pressure holding mechanism 3 needs to hold pressure, the lifting seat 221 rises, causing the material tray to disengage from the transmission belt 213 and stop moving in the first direction, ensuring stability during the pressure holding process. After the first pressure holding mechanism 3 finishes holding pressure, the lifting seat 221 descends, causing the material tray to re-contact the transmission belt 213, and the transmission belt 213 drives the material tray to continue moving in the first direction.

[0082] Optionally, the lifting seat 221 is also provided with a limiting block 2211, which cooperates with the material tray to ensure the stability of the material tray during movement. By cooperating with the bottom surface of the material tray, the limiting block 2211 ensures that the material tray remains stable during vertical movement, reduces shaking, and improves the accuracy of pressure holding operation.

[0083] In one embodiment, the transmission mechanism 2 has two transmission channels 211, both of which extend along a first direction. Each transmission channel 211 has a first pressure holding position and a second pressure holding position. The pressure holding device 100 includes two first pressure holding mechanisms 3 and two second pressure holding mechanisms 4. Each first pressure holding mechanism 3 corresponds to a first pressure holding position, and each second pressure holding mechanism 4 corresponds to a second pressure holding position.

[0084] In this embodiment, please refer to Figure 1 To improve production efficiency, two transmission channels 211 are provided. Through parallel processing, the pressure holding operation of the circuit board can be completed faster. Of course, multiple transmission channels 211 can also be provided for pressure holding operations. There is no limit to the number of transmission channels 211, but it must be ensured that each transmission channel 211 has a first pressure holding position and a second pressure holding position. Each first pressure holding position corresponds to a first pressure holding mechanism 3, and each second pressure holding position corresponds to a second pressure holding mechanism 4.

[0085] In one embodiment, the pressure holding device 100 further includes a feeding mechanism 5 movably mounted on the base 1. The feeding mechanism 5 has a feeding space and is located at one end of the transmission channel 211, moving along a second direction to connect the feeding space with any transmission channel 211. Alternatively, the pressure holding device 100 further includes a discharging mechanism 6 movably mounted on the base 1. The discharging mechanism 6 has a discharging space and is located at the other end of the transmission channel 211, moving along a second direction to connect the discharging space with any transmission channel 211.

[0086] In this embodiment, please refer to Figure 1 and Figure 10 The feeding mechanism 5 includes a slide rail 51, a slide block 52, a transmission belt 53, and a feeding drive component 54. The slide rail 51 is mounted on the base 1. The slide block 52 is slidably mounted on the slide rail 51 and can move along the extension direction of the slide rail 51, i.e., the second direction, to form a first position and a second position. The first position and the second position correspond to two transmission channels 211, respectively. When the slide block 52 moves to the corresponding position, it can feed the corresponding transmission channel 211. The transmission belt 53 is mounted on the slide block 52, and the feeding drive component 54 is mounted on the slide block 52. The transmission belt 53 is located at the output end of the feeding drive component 54. The feeding drive component 54 drives the transmission belt 53 to rotate, thereby transporting the material tray to the transmission channel 211. The surface of the transmission belt 53 forms the feeding space. When the feeding space is connected to the corresponding transmission channel 211, the transmission belt 53 and the transmission belt 213 are exactly aligned, so that the material tray can be transported from the surface of the transmission belt 53 to the surface of the transmission belt 213. It should be noted that, in this embodiment, the second direction is perpendicular to the first direction in the horizontal plane.

[0087] Alternatively, the feeding structure can also be fed by a robotic arm, which corresponds to any transmission channel 211 to clamp and transport the material tray to the transmission belt 213.

[0088] Optionally, the feeding mechanism 5 is also provided with a position sensor 55, which is located on the base 1. The position sensor 55 is used to detect the position of the slide 52 to ensure that the slide 52 is exactly in the first position or the second position, thereby reducing the error during feeding.

[0089] The feeding mechanism 5 and the unloading mechanism 6 have similar structures. The structure of the above embodiment is also applicable to the unloading mechanism 6. Therefore, the structure of the unloading mechanism 6 will not be described in detail.

[0090] In one embodiment, the base 1 is further provided with an adjustment foot 11, which is used to adjust the levelness of the base 1.

[0091] In this embodiment, please refer to Figure 1The base 1 is also equipped with an adjustment foot 11 at the bottom. By adjusting the adjustment foot 11, the surface of the base 1 can be kept in a horizontal state, thereby reducing the problem of uneven pressing that may occur during the pressing process and improving the pressing effect.

[0092] In an embodiment of the invention, the feeding mechanism 5 transports the tray onto the transmission belt 213. Driven by the transmission belt 213, the tray moves, and the first limiting member 23 corresponding to the first pressure holding position rises, blocking the tray at the first pressure holding position. Simultaneously, the first lifting component 22 corresponding to the first pressure holding position rises, causing the tray to disengage from the transmission belt 213. The first pressure holding mechanism 3 moves closer to the lifting component 22, thereby pressing the protective film in the center area of ​​the circuit board. The first pressure holding mechanism 3 returns to its original position, and the first lifting component 22 descends, causing the tray to re-contact the transmission belt 213. The first limiting member 23 descends, and the tray continues to move. Simultaneously, the second limiting member 23 corresponding to the second pressure holding position rises, blocking the tray at the second pressure holding position. The second lifting component 22 corresponding to the second pressure holding position rises, causing the tray to disengage from the transmission belt 213. The second pressure holding mechanism 4 moves closer to the second lifting component 22, thereby pressing the protective film in the edge area of ​​the circuit board. The second pressure holding mechanism 4 returns to its original position, the second lifting component 22 descends, causing the material tray to re-contact the transmission belt 213, the second limiting component 23 descends, the material tray continues to move, leaves the transmission belt 213, and moves to the unloading mechanism 6.

[0093] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A pressure-holding device for pressing a protective film onto a circuit board, the circuit board having an edge region and a central region protruding from the circuit board, wherein the protective film is attached to both the edge region and the central region, characterized in that, The pressure-holding device includes: abutment; A transmission mechanism is disposed on the base, and the transmission mechanism forms a transmission channel extending along a first direction. The transmission channel is used to transport the circuit board, and the transmission channel has a first pressure holding position and a second pressure holding position arranged along the first direction. A first pressure-holding mechanism is disposed on the base and corresponds to the first pressure-holding position. The first pressure-holding mechanism has a first pressure-holding area, and the first pressure-holding mechanism holds pressure on the central area through the first pressure-holding area so that the first pressure-holding area fits into the central area; and The second pressure holding mechanism is disposed on the base and corresponds to the second pressure holding position. The second pressure holding mechanism has a second pressure holding area and a groove formed in the second pressure holding area. The second pressure holding mechanism presses the edge area through the second pressure holding area so that the second pressure holding area fits with the edge area and the center area enters the groove. The first pressure holding mechanism includes a first base, a first drive module, and a first pressure holding plate. The first base is disposed on the base platform and corresponds to the first pressure holding position. The first drive module is disposed on the first base. The first pressure holding plate is disposed at the output end of the first drive module. The side of the first pressure holding plate facing the transmission channel is a pressure holding surface, which forms the first pressure holding area. The first drive module drives the first pressure holding plate to move closer to or away from the transmission channel so that the pressure holding surface fits the central area. The central region is provided with an element, and the pressure-holding surface is also provided with a clearance groove. The clearance groove cooperates with the element so that when the pressure-holding surface is in contact with the central region, the element enters the clearance groove.

2. The pressure-holding device as described in claim 1, characterized in that, The first base includes a first pillar and a first support plate. The first pillar is disposed on the base platform, the first support plate is movably connected to the first pillar, and the first drive module is disposed on the first support plate. The first pressure-holding mechanism further includes a first adjustment module, which is disposed on the first support column and connected to the first support plate; The first adjustment module drives the first support plate to move along the extension direction of the first pillar to adjust the distance between the first pressure plate and the transmission channel.

3. The pressure-holding device as described in claim 1, characterized in that, The second pressure-holding mechanism includes: The second base is disposed on the base platform and corresponds to the second pressure holding position; A second drive module, the second drive module being disposed on the second base; and The second pressure plate is disposed at the output end of the second drive module. The edge of the second pressure plate near the circuit board is provided with a pressure block, which forms the second pressure holding area and surrounds the groove. The second drive module drives the second pressure plate so that the pressure block fits against the edge region and the center region enters the groove.

4. The pressure-holding device as described in claim 3, characterized in that, The second base includes a second pillar and a second support plate. The second pillar is disposed on the base platform, the second support plate is movably connected to the second pillar, and the second drive module is disposed on the second support plate. The second pressure-holding mechanism further includes a second adjustment module, which is disposed on the second support column and connected to the second support plate; The second adjustment module drives the second support plate to move along the extension direction of the second pillar to adjust the distance between the second pressure plate and the transmission channel.

5. The pressure-holding device as described in claim 1, characterized in that, The transmission mechanism includes: A rack, which is mounted on the base and has the transmission channel provided thereon; Two lifting components are spaced apart on the base and correspond to the first pressure holding position and the second pressure holding position, respectively. Each lifting component has a lifting surface located within the transmission channel. A limiting member is provided on the base and spaced apart from the lifting component. There are two limiting members, which correspond to the first pressure holding position and the second pressure holding position, respectively. The limiting member is provided with a limiting plate that moves relative to the transmission channel. The limiting member drives the limiting plate to extend into the transmission channel to prevent the circuit board from moving, and the lifting assembly drives the lifting surface to approach the transmission channel so that the circuit board is disengaged from the transmission channel.

6. The pressure-holding device as described in claim 5, characterized in that, The lifting assembly includes: A lifting drive component, wherein the lifting drive component is disposed on the base and corresponds to the first pressure holding position or the second pressure holding position; and A lifting seat is provided at the output end of the lifting drive member, and the lifting surface is provided on the side of the lifting seat facing the transmission channel; The lifting drive unit drives the lifting seat to move the circuit board in the vertical direction.

7. The pressure-holding device according to any one of claims 1 to 6, characterized in that, The transmission mechanism is provided with two transmission channels, both of which extend along the first direction. Each transmission channel is provided with a first pressure holding position and a second pressure holding position. The pressure holding device includes two first pressure holding mechanisms and two second pressure holding mechanisms, each first pressure holding mechanism corresponding to a first pressure holding position, and each second pressure holding mechanism corresponding to a second pressure holding position.

8. The pressure-holding device as described in claim 7, characterized in that, The pressure holding device further includes a feeding mechanism and a discharging mechanism movably disposed on the base. The feeding mechanism is provided with a feeding space. The feeding mechanism is located at one end of the transmission channel and moves along the second direction so that the feeding space is connected to any of the transmission channels. The feeding mechanism is provided with a feeding space. The feeding mechanism is located at the other end of the transmission channel and moves along the second direction so that the feeding space is connected to any of the transmission channels.

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