Printed circuit board flip welding control method and system

Abstract

The present invention relates to the field of electronic manufacturing technology, and in particular to a printed circuit board flip soldering control method and system. First, welding target information is collected and solder paste spraying parameters are set; by setting the flip parameters of the electronic components, the flip docking position of the printed circuit board and the electronic components is determined, and the solder paste is positioned according to the set flip parameters and spraying parameters; reflow soldering is performed on the welding target, and preheating parameters of the temperature profile are set; by predicting the solder paste state and corresponding to the temperature control timing nodes, a thermal precision control adaptation model is constructed to adaptively adjust the temperature profile, and thermal control adjustment parameters are output corresponding to the temperature control timing nodes. Through the present invention, the inflexible characteristics when processing different types of printed circuit boards and components are effectively solved, the adaptability of printed circuit board production is improved, the welding temperature and solder paste amount are accurately controlled, thereby reducing solder joint defects and greatly improving the quality of welding.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic manufacturing, and in particular to a printed circuit board flip welding control method and system. Background Art

[0002] In the field of electronics manufacturing, welding of printed circuit boards and electronic components is a key step in the production process. To achieve precise installation and electrical connection of electronic components, the industry generally adopts advanced welding technology to ensure connection quality and equipment performance. The core of the welding process includes the correct application of solder paste and precise heat treatment control. Solder paste is usually composed of metal powder and flux. The application accuracy of solder paste on the printed circuit board directly affects the quality and stability of the solder joints.

[0003] However, despite significant progress in soldering technology, it still faces some challenges. Existing soldering methods mostly rely on preset soldering parameters, which may not be flexible enough when processing different types of printed circuit boards and components, and sometimes have difficulty adapting to changing production needs. In addition, existing technologies often lack sufficient adaptability in terms of quantitative control of solder paste and setting heat treatment parameters, which may lead to inconsistent soldering results and affect the overall reliability of the product. Therefore, the adaptability of solder paste status monitoring and temperature control during the soldering process has become the key to improving soldering quality.

[0004] The information disclosed in this background technology section is only intended to deepen the understanding of the overall background technology of the present disclosure and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art known to those skilled in the art. Summary of the Invention

[0005] The present invention provides a printed circuit board flip welding control method and system, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A printed circuit board flip welding control method, the method comprising:

[0008] Obtaining soldering target information, the soldering target information including printed circuit board parameters and electronic component parameters, and setting solder paste spraying parameters according to the soldering target information;

[0009] Setting flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters;

[0010] Performing reflow soldering on the printed circuit board and electronic components, and setting preheating parameters in a temperature profile according to the soldering target information, wherein the reflow soldering process is performed according to the temperature profile, and the temperature profile is a profile of soldering temperature changes at temperature control timing nodes;

[0011] Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node;

[0012] A thermal precision control adaptation model is constructed, wherein the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

[0013] Furthermore, the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node. The method includes:

[0014] Selecting a plurality of the temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control timing nodes where the thermal control time points are located;

[0015] Controlling the reflow soldering temperature in response to the thermal control time point, and adaptively adjusting the soldering temperature corresponding to each thermal control time point;

[0016] Setting a temperature control trend for each thermal control time point based on the time position, wherein the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and subsequently extended according to the temperature control timing node;

[0017] The welding temperature corresponding to each thermal control time point and the temperature control trend are collected and integrated to generate the thermal control adjustment parameter.

[0018] Furthermore, the temperature control timing node is selected according to the time position and set as a temperature control transition node, and the method includes:

[0019] Obtaining the interval time of each of the thermal control time points according to the time position, and setting the node threshold value according to the operation time of performing the reflow soldering;

[0020] Determine whether the interval time exceeds the node threshold, and if so, set a temperature control transition node between the two thermal control time points corresponding to the interval time;

[0021] The thermal control adjustment parameters are optimized and set through the temperature control transition node.

[0022] Furthermore, the solder paste state is predicted based on the solder paste spraying parameters and the preheating parameters, and the method includes:

[0023] Establishing a temperature control database, the temperature control database including historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters;

[0024] Retrieving the historical temperature control information and the historical solder type information in the temperature control database as data for constructing a solder paste state prediction model, and training and evaluating the solder paste prediction model;

[0025] According to the solder paste prediction model, deep learning is performed on the temperature control database to obtain a mapping relationship between the solder type and the historical temperature, and based on the mapping relationship and the real-time temperature information, a real-time solder paste status prediction result is obtained.

[0026] Furthermore, a temperature control database is established, and the method includes:

[0027] Collecting the historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters;

[0028] Constructing a solder type label index to reflect the mapping relationship between the solder type and the historical temperature control value, and the historical temperature control and the solder type relationship are one-to-one corresponding;

[0029] The printed circuit board and electronic component information and material parameters are integrated, and historical information tracking and classification management are performed on the welding target information for the temperature control database to call.

[0030] Furthermore, preheating parameters in the temperature profile are set according to the welding target information, and the reflow process is performed according to the temperature profile. The method includes:

[0031] Traversing the temperature control database, extracting the solder type and the welding target information from the temperature control database, and setting welding requirements according to the solder type and the welding target information;

[0032] Divide the temperature profile into temperature control stages, wherein the temperature control stages include a preheating stage, a constant temperature stage, a reflow stage, and a cooling stage, and set a target temperature and heating time for each temperature control stage according to the temperature control stages and the welding requirements;

[0033] According to the temperature profile and the welding target information, the parameters required to be set in each temperature control stage of the temperature profile are set.

[0034] Furthermore, the flipping parameters of the electronic component are set, and the flipping docking position of the printed circuit board and the electronic component is determined, and the printed circuit board and the electronic component are positioned with solder paste according to the flipping docking position and the solder paste spraying parameters. The method includes:

[0035] Collecting the degree of freedom node information of the flip mechanism, and generating a plurality of degree of freedom spaces according to the degree of freedom node information, wherein the plurality of spatial degrees of freedom correspond one-to-one to the degree of freedom node information;

[0036] Setting a control trajectory according to the spatial degrees of freedom and flip docking requirements, and sending the control trajectory to the flip mechanism control terminal;

[0037] Determine the starting position coordinates and target position coordinates of the flip mechanism;

[0038] Analyze the control trajectory, identify key points of the control trajectory based on the analysis results, and output flip nodes and alignment nodes;

[0039] Based on the flip nodes and the alignment nodes, the control trajectory is segmented to obtain an initial trajectory, a flip trajectory, and an alignment trajectory;

[0040] Outputting x initial trajectory control parameters of the initial trajectory, y flip trajectory control parameters of the flip trajectory, and z alignment trajectory control parameters of the alignment trajectory according to the starting position coordinates and the target position coordinates;

[0041] The flipping mechanism is flipped and aligned based on the x initial trajectory control parameters, the y flipping trajectory control parameters, and the z alignment trajectory control parameters.

[0042] Furthermore, based on the spatial degrees of freedom and the flip docking requirements, a control trajectory is set, and the method includes:

[0043] Establishing a spatial degree of freedom model according to the multiple spatial degrees of freedom, and converting the spatial degree of freedom model into discrete point data required for the control trajectory;

[0044] Performing trajectory interpolation and connection on the discrete point data to generate a control continuous trajectory;

[0045] A fitting algorithm is selected to smooth the control continuous trajectory, and the smoothed control continuous trajectory is converted into a control trajectory format that can be recognized by the control terminal.

[0046] A printed circuit board flip welding control system, the system comprising:

[0047] Acquire a setting spraying module, obtain welding target information, the welding target information including printed circuit board parameters and electronic component parameters, and set solder paste spraying parameters according to the welding target information;

[0048] Setting the positioning docking module, setting the flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters;

[0049] A temperature reflow cooling module is provided to perform reflow soldering on the printed circuit board and electronic components, and preheating parameters in a temperature profile are set according to the soldering target information. The reflow soldering process is performed according to the temperature profile. The temperature profile is a profile of changes in soldering temperature at a temperature control timing node.

[0050] A prediction corresponding result module predicts the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node;

[0051] An adaptive adjustment module is constructed, and a thermal precision control adaptation model is constructed. The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

[0052] Furthermore, the constructing of the adaptive adjustment module includes:

[0053] Selecting a control time point unit, selecting a number of the temperature control time sequence nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control time sequence node where the thermal control time point is located;

[0054] Controlling the adaptive temperature adjustment unit to control the temperature of the reflow soldering according to the thermal adjustment time point, and adaptively adjusting the soldering temperature corresponding to each thermal adjustment time point;

[0055] a temperature control trend setting unit, which sets a temperature control trend for each of the thermal control time points based on the time position, wherein the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and subsequently extended according to the temperature control timing node;

[0056] The parameter generation unit collects and integrates the welding temperature corresponding to each thermal control time point and the temperature control trend to generate the thermal control adjustment parameter.

[0057] The technical solution of the present invention can achieve the following technical effects:

[0058] It effectively solves the inflexibility in processing different types of printed circuit boards and components, improves the adaptability of printed circuit board production, accurately controls soldering temperature and solder paste volume, thereby reducing solder joint defects and greatly improving soldering quality.

[0059] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0061] Figure 1 The figure is a flow chart of a printed circuit board flip welding control method;

[0062] Figure 2 Schematic diagram of the output process of thermal control adjustment parameters for temperature control timing nodes;

[0063] Figure 3 This is a schematic diagram of the solder paste state prediction process;

[0064] Figure 4 Create a flow chart for the temperature control database;

[0065] Figure 5 This is a schematic diagram of the structure of the printed circuit board flip welding control system. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0068] Example 1

[0069] like Figure 1As shown, the present application provides a printed circuit board flip welding control method, the method comprising:

[0070] S100: Obtaining welding target information, the welding target information including printed circuit board parameters and electronic component parameters, and setting solder paste spraying parameters according to the welding target information;

[0071] S200: setting flip parameters of the electronic component, determining a flip docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flip docking position and solder paste spraying parameters;

[0072] S300: Perform reflow soldering on the printed circuit board and electronic components, and set preheating parameters in the temperature profile according to the soldering target information. The reflow soldering process is performed according to the temperature profile. The temperature profile is the change profile of the soldering temperature at the temperature control timing node.

[0073] S400: Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, which corresponds to a temperature control timing node;

[0074] S500: Constructing a thermal precision control adaptation model. The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result, and outputs thermal control adjustment parameters corresponding to the temperature control timing node.

[0075] Specifically, first, before setting the spraying parameters, collect the relevant parameters of the printed circuit board and electronic components, such as size and material type, to ensure the quality and stability of the solder joints; set the solder paste spraying amount. It should be noted that when setting the solder paste spraying amount, the size, density and layout of the solder joints should be considered; then the flipping parameters of the electronic components can be set using the machine vision system, and the solder paste spraying position and amount can be controlled according to the flipping docking position and the set solder paste spraying parameters to ensure that the flipping of the electronic components and the docking of the printed circuit board are accurate; then, the temperature profile including the temperature of the preheating, insulation and cooling stages can be set through the welding target information. The reflow soldering equipment heats and cools according to the temperature profile, ensuring that the solder paste melts at the correct temperature and forms a solid solder joint after cooling. Deep learning can be used to analyze the state of the solder paste at different temperature control timing nodes, and the predicted results can be matched with the actual temperature control timing nodes to ensure that the solder paste can reach the ideal melting and solidification state at each temperature control timing node, thereby improving the uniformity and structural integrity of the solder joint. A thermal precision control adaptation model is then established that can analyze the predicted data of the solder paste state in real time. According to the output of the model, the parameters in the temperature profile are automatically adjusted to ensure that the welding temperature matches the solder paste state.

[0076] The technical solution of the present invention effectively solves the problem of inflexibility in processing different types of printed circuit boards and components, improves the adaptability of printed circuit board production, accurately controls the welding temperature and solder paste amount, thereby reducing solder joint defects and greatly improving the quality of welding.

[0077] Furthermore, if Figure 2 As shown in the figure, the thermal precision control adaptive model adaptively adjusts the temperature profile according to the solder paste state prediction results and outputs thermal control adjustment parameters corresponding to the temperature control timing nodes, including:

[0078] S510: Selecting several temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control timing nodes where the thermal control time points are located;

[0079] S520: Controlling the reflow temperature in response to the thermal control time point, and adaptively adjusting the soldering temperature corresponding to each thermal control time point;

[0080] S530: Setting a temperature control trend for each thermal control time point based on the time position, wherein the temperature control trend is set according to the thermal control time point postponed according to the temperature control timing node corresponding to the thermal control time point;

[0081] S540: The welding temperature and temperature control trend corresponding to each thermal control time point are collected and integrated to generate thermal control adjustment parameters.

[0082] As a preferred embodiment of the above embodiment, a solder paste state prediction model is used to determine key behavior moments of the solder paste during the reflow process, such as temperature change points. These moments are selected as thermal control time points, and the specific time position of each thermal control time point is determined to accurately adjust the temperature profile of the reflow process. Then, temperature control is implemented at each thermal control time point, and the temperature setting is adjusted according to the solder paste state prediction results. It should be noted that it is necessary to ensure that the solder paste can melt and solidify under optimal conditions. At the same time, the soldering temperature is adjusted in real time using temperature sensors and control algorithms to match the solder paste behavior prediction. Then, based on the time position of each thermal control time point, a temperature trend and a stable stage are set to ensure that the temperature control trend setting matches the sequence and time of the entire temperature control timing nodes, forming a coherent temperature control strategy to ensure the continuity and efficiency of the temperature load soldering process. At the same time, the temperature settings and temperature control trends of all thermal control time points are collected, and the temperature parameters and temperature control trends of each thermal control time point are integrated to generate a comprehensive temperature control profile. This temperature profile is used to guide the reflow soldering equipment to perform precise temperature adjustment to ensure the quality and efficiency of the soldering process.

[0083] Furthermore, the temperature control timing node is selected according to the time position and set as the temperature control transition node, including:

[0084] Obtain the interval time of each thermal control point according to the time position, and set the node threshold by executing the reflow operation time;

[0085] Determine whether the interval time exceeds the node threshold. If so, set a temperature control transition node between the two thermal control time points corresponding to the interval time.

[0086] Optimize the thermal control adjustment parameters through the temperature control transition node.

[0087] Based on the above embodiment, first, the interval time between each time point is collected according to the time position of the thermal control time point, and a node threshold is set based on past experience data, simulation test results or optimization feedback in actual operation in combination with the total operation time of reflow soldering. This threshold is used to determine whether a transition node needs to be set; check whether the interval time between each thermal control time point exceeds the node threshold. If the interval time exceeds the threshold, this indicates that one or more transition nodes are required between the two thermal control time points to ensure a smooth transition of temperature control. It should be noted that the setting of the transition node should ensure that the temperature change is not too rapid to avoid damage to the solder paste and electronic components; then, the thermal control adjustment parameters are optimized through the set temperature control transition nodes, such as adjusting the slope and duration of the temperature profile, to ensure that the setting of each temperature control transition node reflects the characteristics of the solder paste and the sensitivity of the electronic components, thereby improving the welding quality. At the same time, it should be noted that during the actual welding process, the parameters of the transition node are adjusted according to real-time monitoring data to cope with changes in actual welding conditions.

[0088] Furthermore, if Figure 3 As shown in the figure, the solder paste state is predicted based on the solder paste spraying parameters and preheating parameters, including:

[0089] S410: Establishing a temperature control database, the temperature control database includes historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters;

[0090] S420: Retrieving historical temperature control information and historical solder type information from a temperature control database as data for building a solder paste state prediction model, and training and evaluating the solder paste prediction model;

[0091] S430: Based on the solder paste prediction model, deep learning is performed on the temperature control database to obtain a mapping relationship between solder type and historical temperature, and based on the mapping relationship and real-time temperature information, a real-time solder paste status prediction result is obtained.

[0092] Specifically, first, a database containing historical temperature control information, historical solder type information, real-time temperature information, and material parameters of printed circuit boards and electronic components is constructed to improve the accuracy and efficiency of decision-making; historical temperature control information and historical solder type information are retrieved from the temperature control database, and these data are used to build a machine learning model to predict the solder paste state. The model is trained based on these data to achieve the ability to identify solder paste behavior under different solder types and temperature conditions; deep learning technology is applied to further analyze the temperature control database, and the complex mapping relationship between different solder types and historical temperatures is learned. Deep learning models are used to mine deeper data patterns and associations to improve the accuracy of prediction results. At the same time, the mapping relationship and real-time temperature information obtained from deep learning are combined to predict the real-time solder paste state. It should be noted that the prediction results should be fed back to the production line in real time, and the temperature control parameters should be adjusted based on actual conditions to ensure the optimization of the welding process.

[0093] Furthermore, if Figure 4 As shown, a temperature control database is established, including:

[0094] S411: Collect historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters;

[0095] S412: Constructing a solder type label index to reflect the mapping relationship between solder type and historical temperature control value, and the historical temperature control and solder type relationship have a one-to-one correspondence;

[0096] S413: Integrate printed circuit board and electronic component information material parameters, track and classify welding target information, and provide it for temperature control database to call.

[0097] As a preferred embodiment of the above, historical temperature control information, historical solder type information, real-time temperature information, and material parameters of printed circuit boards and electronic components are collected, and a data acquisition system is used to monitor and record temperature changes during the welding process in real time to ensure that the collected data is accurate, and the accuracy and completeness of the data are regularly verified to ensure the reliability of the information in the database; a label index system is created to mark the relationship between different solder types and the corresponding historical temperature control values, ensuring that there is a clear one-to-one correspondence between the historical temperature control values ​​of each solder type and the solder type, which facilitates subsequent query and analysis. It should also be noted that when designing the database structure, query efficiency and data update convenience should be taken into consideration to support rapid access and processing of large amounts of data; then, the material parameters of the printed circuit boards and electronic components and the welding target information are integrated into a unified database management system, and all welding-related information is historically tracked, including the solder type, the temperature control parameters used, and the specific material properties of the printed circuit boards and components. A classification management strategy is adopted to organize and manage data according to factors such as welding materials, product types, and production dates, making data retrieval more efficient.

[0098] Furthermore, the preheating parameters in the temperature profile are set according to the welding target information, and the reflow process is performed according to the temperature profile for reflow and cooling, including:

[0099] Traversing the temperature control database, extracting solder type and welding target information from the temperature control database, and setting welding requirements according to the solder type and welding target information;

[0100] The temperature profile is divided into temperature control stages, which include preheating stage, constant temperature stage, reflow stage and cooling stage. According to the temperature control stage and welding requirements, the target temperature and heating time are set for each temperature control stage.

[0101] According to the temperature profile and welding target information, set the parameters required for each temperature control stage of the temperature profile.

[0102] Based on the above embodiment, data related to specific solder types and welding target information is extracted from the temperature control database, and the requirements of the welding process, such as the maximum and minimum limits of the welding temperature, are determined based on the extracted solder type and welding target information; then the temperature profile is divided into several key stages: preheating section, constant temperature section, reflow section and cooling section. The preheating section slowly heats up to avoid thermal shock and prepare for solder melting; the constant temperature section maintains a certain temperature to thoroughly dry the solder and prepare it for melting; the reflow section: quickly heats up to above the melting point of the solder to ensure that the solder is completely melted to form a good solder joint; the cooling section: controls the cooling rate to ensure the quality of the solder joint formation and prevent cracks in the solder joint; then the temperature and time settings of each stage are optimized using historical data and simulation results, and the temperature control parameters are adjusted according to real-time monitoring data to adapt to any changes that may occur in production.

[0103] Furthermore, the flipping parameters of the electronic component are set, and the flipping and docking position of the printed circuit board and the electronic component is determined. The printed circuit board and the electronic component are positioned for soldering according to the flipping and docking position and the soldering paste spraying parameters, including:

[0104] Collecting the degree of freedom node information of the flip mechanism, and generating multiple degree of freedom spaces according to the degree of freedom node information, wherein the multiple spatial degrees of freedom correspond one-to-one to the degree of freedom node information;

[0105] According to the spatial freedom and flip docking requirements, the control trajectory is set and sent to the flip mechanism control terminal;

[0106] Determine the starting position coordinates and target position coordinates of the flip mechanism;

[0107] Analyze the control trajectory, identify key points of the control trajectory based on the analysis results, and output flip nodes and alignment nodes;

[0108] Based on the flip nodes and alignment nodes, the control trajectory is segmented to obtain the initial trajectory, flip trajectory and alignment trajectory;

[0109] According to the starting position coordinates and the target position coordinates, output the x initial trajectory control parameters of the initial trajectory, the y flip trajectory control parameters of the flip trajectory, and the z alignment trajectory control parameters of the alignment trajectory;

[0110] The flipping mechanism is flipped and aligned based on x initial trajectory control parameters, y flipping trajectory control parameters and z alignment trajectory control parameters.

[0111] Specifically, the degree of freedom node information is the active point of the flip mechanism, such as the arm of the flip mechanism. Based on these degree of freedom node information, multiple degree of freedom spaces in the simulation environment are constructed. The degree of freedom space is the motion range of the flip mechanism. Multiple spatial degrees of freedom correspond one-to-one to multiple degree of freedom nodes, and each degree of freedom node has corresponding spatial degrees of freedom; according to the specific needs of flip docking, such as the docking accuracy requirements of electronic components and printed circuit boards, a control trajectory is designed, and the designed control trajectory is sent to the control terminal of the flip mechanism to ensure that the mechanism can move according to the predetermined trajectory; the starting position coordinates of the flip mechanism and the target position coordinates of the electronic components to be docked to the printed circuit board are measured and determined; among them, the degree of freedom control data of multiple degree of freedom nodes are collected respectively and output as a control sample data set. The control sample data set includes the control parameters of each node, and the algorithm is applied. For example, machine learning algorithms analyze the collected motion data and identify key turning points in the motion trajectory. These points may be mutation points of speed or acceleration, or key positions of flipping angles. Flipping nodes and alignment nodes are extracted from the analysis results. Flipping nodes refer to the positions where the flipping mechanism starts or completes the flipping action, and alignment nodes refer to the moment before the electronic component and the printed circuit board are docked. According to the positions of the key nodes, the efficiency and safety of the entire control trajectory are evaluated. The control trajectory is then divided into initial trajectory, flipping trajectory and alignment trajectory. Each part is targeted at a specific operation stage, and control parameters are calculated for each trajectory segment, including speed, acceleration, and position coordinates. According to the calculated control parameters, precise flipping and alignment operations are performed through the control system of the flipping mechanism, and real-time data during the flipping process is monitored to ensure that each step is strictly executed in accordance with the set parameters.

[0112] Furthermore, based on the spatial degrees of freedom and flip docking requirements, the control trajectory is set, including:

[0113] According to multiple spatial degrees of freedom, a spatial degree of freedom model is established, and the spatial degree of freedom model is converted into discrete point data required for control trajectory;

[0114] Perform trajectory interpolation and connection on discrete point data to generate a continuous control trajectory;

[0115] A fitting algorithm is selected to smooth the control continuous trajectory, and the smoothed control continuous trajectory is converted into a control trajectory format that can be recognized by the control terminal.

[0116] As a preferred embodiment of the above, the model is discretized by dividing the degree of freedom model into multiple small geometric elements, such as triangular facets. The discrete data points generated above are connected through interpolation techniques such as spline interpolation to generate a continuous control trajectory. An appropriate trajectory smoothing algorithm, such as Gaussian filtering, moving average, or spline curve fitting, is selected to eliminate sudden changes and oscillations in the trajectory and improve the smoothness of the motion. The continuous trajectory is smoothed to ensure accuracy and stability during the flipping and docking process. This step not only reduces mechanical stress but also improves the accuracy of docking. The smoothed trajectory is then converted into a format that can be recognized by the control terminal, such as G-code, and the converted trajectory is sent to the control terminal of the flipping mechanism. Ensure that the control system is correctly configured and can interpret and execute the given trajectory instructions.

[0117] Example 2

[0118] Based on the same inventive concept as the printed circuit board flip welding control method in the aforementioned embodiment, the present invention also provides a printed circuit board flip welding control system, such as Figure 5 The system comprises:

[0119] Acquire a setting spraying module, obtain welding target information, the welding target information includes printed circuit board parameters and electronic component parameters, and set solder paste spraying parameters according to the welding target information;

[0120] Set the positioning docking module, set the flip parameters of the electronic components, and determine the flip docking position of the printed circuit board and the electronic components, and perform solder paste positioning on the printed circuit board and the electronic components according to the flip docking position and solder paste spraying parameters;

[0121] Set up a temperature reflow cooling module to perform reflow soldering on printed circuit boards and electronic components, and set the preheating parameters in the temperature profile according to the soldering target information. The reflow soldering process is carried out according to the temperature profile. The temperature profile is the change profile of the soldering temperature at the temperature control timing node.

[0122] The prediction corresponding result module predicts the solder paste state according to the solder paste spraying parameters and preheating parameters, and obtains the solder paste prediction result. The solder paste prediction result corresponds to the temperature control timing node;

[0123] Construct an adaptive adjustment module and a thermal precision control adaptation model. The thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction results and outputs thermal control adjustment parameters corresponding to the temperature control timing nodes.

[0124] The above-mentioned adjustment system in the present invention can effectively implement the printed circuit board flip welding control method, and the technical effects that can be achieved are as described in the above-mentioned embodiments, which will not be repeated here.

[0125] Similarly, the above-mentioned optimization schemes for the system can also respectively achieve the corresponding optimization effects of the method in Example 1, which will not be repeated here.

[0126] Specifically, building an adaptive adjustment module includes:

[0127] Select a control time point unit, select several temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determine the time position of the temperature control timing node where the thermal control time point is located;

[0128] Control the adaptive temperature control unit to control the reflow temperature according to the thermal control time point, and adapt to adjust the welding temperature corresponding to each thermal control time point;

[0129] Setting the temperature control trend unit, setting the temperature control trend for each thermal control time point based on the time position, and setting the temperature control trend according to the thermal control time point postponed according to the temperature control timing node corresponding to the thermal control time point;

[0130] The integrated parameter generation unit collects and integrates the welding temperature and temperature control trend corresponding to each thermal control time point to generate thermal control adjustment parameters.

[0131] Although the present application has been described with reference to specific features and embodiments thereof, it is apparent that various modifications and combinations may be made thereto without departing from the spirit and scope of the present application. Accordingly, this specification and drawings are merely illustrative of the present application as defined herein and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, those skilled in the art may make various modifications and variations to the present application without departing from the scope of the present application. Thus, the present application is intended to include such modifications and variations as fall within the scope of the present application and its equivalents.

Claims

1. A printed circuit board flip welding control method, characterized in that: The method comprises: Obtaining soldering target information, the soldering target information including printed circuit board parameters and electronic component parameters, and setting solder paste spraying parameters according to the soldering target information; Setting flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters; Performing reflow soldering on the printed circuit board and electronic components, and setting preheating parameters in a temperature profile according to the soldering target information, wherein the reflow soldering process is performed according to the temperature profile, and the temperature profile is a profile of soldering temperature changes at temperature control timing nodes; Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node; Constructing a thermal precision control adaptation model, wherein the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result and outputs thermal control adjustment parameters corresponding to the temperature control timing node; The thermal control adjustment parameter output method is as follows: Selecting a plurality of the temperature control timing nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control timing nodes where the thermal control time points are located; Controlling the reflow temperature in response to the thermal control time point, adjusting the temperature setting according to the solder paste state prediction result, and adaptively adjusting the soldering temperature corresponding to each thermal control time point; Based on the time position, a temperature control trend is set for each of the thermal control time points, the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and subsequently extended according to the temperature control timing node, and the setting of the temperature control trend matches the order and time of the entire temperature control timing node; The welding temperature corresponding to each thermal control time point and the temperature control trend are collected and integrated to generate the thermal control adjustment parameter.

2. The printed circuit board flip welding control method according to claim 1, characterized in that: Selecting the temperature control timing node according to the time position and setting it as a temperature control transition node includes: Obtaining the interval time of each of the thermal control time points according to the time position, and setting the node threshold value according to the operation time of performing the reflow soldering; Determine whether the interval time exceeds the node threshold, and if so, set a temperature control transition node between the two thermal control time points corresponding to the interval time; The thermal control adjustment parameters are optimized and set through the temperature control transition node.

3. The printed circuit board flip welding control method according to claim 1, characterized in that: Predicting the solder paste state according to the solder paste spraying parameters and the preheating parameters includes: Establishing a temperature control database, the temperature control database including historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; Retrieving the historical temperature control information and the historical solder type information in the temperature control database as data for constructing a solder paste state prediction model, and training and evaluating the solder paste prediction model; According to the solder paste prediction model, deep learning is performed on the temperature control database to obtain a mapping relationship between the solder type and the historical temperature, and based on the mapping relationship and the real-time temperature information, a real-time solder paste status prediction result is obtained.

4. The printed circuit board flip welding control method according to claim 3, characterized in that: Establish a temperature control database, including: Collecting the historical temperature control information, historical solder type information, real-time temperature information, printed circuit board and electronic component information material parameters; Constructing a solder type label index to reflect the mapping relationship between the solder type and the historical temperature control value, and the historical temperature control and the solder type relationship are one-to-one corresponding; The printed circuit board and electronic component information and material parameters are integrated, and historical information tracking and classification management are performed on the welding target information for the temperature control database to call.

5. The printed circuit board flip welding control method according to claim 4, characterized in that: The preheating parameters in the temperature profile are set according to the welding target information, and the reflow process is performed according to the temperature profile. The reflow and cooling process includes: Traversing the temperature control database, extracting the solder type and the welding target information from the temperature control database, and setting welding requirements according to the solder type and the welding target information; Divide the temperature profile into temperature control stages, wherein the temperature control stages include a preheating stage, a constant temperature stage, a reflow stage, and a cooling stage, and set a target temperature and heating time for each temperature control stage according to the temperature control stages and the welding requirements; According to the temperature profile and the welding target information, the parameters required to be set in each temperature control stage of the temperature profile are set.

6. The printed circuit board flip soldering control method according to claim 1, wherein the flip parameters of the electronic component are set, and the flip docking position of the printed circuit board and the electronic component is determined, and the printed circuit board and the electronic component are positioned for soldering according to the flip docking position and solder paste spraying parameters, comprising: Collecting the degree of freedom node information of the flip mechanism, and generating a plurality of degree of freedom spaces according to the degree of freedom node information, wherein the plurality of spatial degrees of freedom correspond one-to-one to the degree of freedom node information; Setting a control trajectory according to the spatial degrees of freedom and flip docking requirements, and sending the control trajectory to the flip mechanism control terminal; Determine the starting position coordinates and target position coordinates of the flip mechanism; Analyze the control trajectory, identify key points of the control trajectory based on the analysis results, and output flip nodes and alignment nodes; Based on the flip nodes and the alignment nodes, the control trajectory is segmented to obtain an initial trajectory, a flip trajectory, and an alignment trajectory; Outputting x initial trajectory control parameters of the initial trajectory, y flip trajectory control parameters of the flip trajectory, and z alignment trajectory control parameters of the alignment trajectory according to the starting position coordinates and the target position coordinates; The flipping mechanism is flipped and aligned based on the x initial trajectory control parameters, the y flipping trajectory control parameters, and the z alignment trajectory control parameters.

7. The printed circuit board flip welding control method according to claim 6, characterized in that: Based on the spatial degrees of freedom and flip docking requirements, set the control trajectory, including: Establishing a spatial degree of freedom model according to the multiple spatial degrees of freedom, and converting the spatial degree of freedom model into discrete point data required for the control trajectory; Performing trajectory interpolation and connection on the discrete point data to generate a control continuous trajectory; A fitting algorithm is selected to smooth the control continuous trajectory, and the smoothed control continuous trajectory is converted into a control trajectory format that can be recognized by the control terminal.

8. Printed circuit board flip welding control system, characterized in that, Using the printed circuit board flip welding control method according to claim 1, the system includes: Acquire a setting spraying module, obtain welding target information, the welding target information including printed circuit board parameters and electronic component parameters, and set solder paste spraying parameters according to the welding target information; Setting the positioning docking module, setting the flipping parameters of the electronic component, and determining the flipping docking position of the printed circuit board and the electronic component, and positioning the printed circuit board and the electronic component with solder paste according to the flipping docking position and solder paste spraying parameters; A temperature reflow cooling module is provided to perform reflow soldering on the printed circuit board and electronic components, and preheating parameters in a temperature profile are set according to the soldering target information. The reflow soldering process is performed according to the temperature profile. The temperature profile is a profile of changes in soldering temperature at a temperature control timing node. A prediction corresponding result module predicts the solder paste state according to the solder paste spraying parameters and the preheating parameters to obtain a solder paste prediction result, wherein the solder paste prediction result corresponds to the temperature control timing node; Constructing an adaptive adjustment module and a thermal precision control adaptation model, wherein the thermal precision control adaptation model adaptively adjusts the temperature profile according to the solder paste state prediction result and outputs thermal control adjustment parameters corresponding to the temperature control timing node; The method for constructing the adaptive adjustment module is as follows: Selecting a control time point unit, selecting a number of the temperature control time sequence nodes as thermal control time points according to the solder paste state prediction result, and determining the time position of the temperature control time sequence node where the thermal control time point is located; Controlling the adaptive temperature adjustment unit to control the temperature of the reflow soldering according to the thermal adjustment time point, and adaptively adjusting the soldering temperature corresponding to each thermal adjustment time point; a temperature control trend setting unit, which sets a temperature control trend for each of the thermal control time points based on the time position, wherein the temperature control trend is set according to the thermal control time point corresponding to the thermal control time point and subsequently extended according to the temperature control timing node; The parameter generation unit collects and integrates the welding temperature corresponding to each thermal control time point and the temperature control trend to generate the thermal control adjustment parameter.

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