Light-emitting substrate and display panel

Abstract

The invention provides a light-emitting substrate and a display panel, a driving backboard of the light-emitting substrate is covered with a whole heat dissipation conductive layer, the heat dissipation conductive layer comprises a main body part and an extension part, the main body part is provided with an opening at a position corresponding to a light-emitting device, and the extension part extends into the opening from the main body part and covers at least part of a first electrode. The heat dissipation conductive layer is arranged on the light-emitting device, so that heat generated when the light-emitting device works can be dissipated through the heat dissipation conductive layer, the heat dissipation conductive layer covers the whole surface, the heat dissipation area can be increased, heat dissipation is more uniform, the heat dissipation performance is improved, and the problem that the service life of an existing Micro LED displayer is seriously affected due to the fact that the temperature is high when the existing Micro LED displayer works is solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting substrate and a display panel. Background Art

[0002] With the continuous development of Micro LED (micro light emitting diode) technology, Micro LED is increasingly being used in display devices. Micro LED displays have incomparable advantages over thin-film transistor liquid crystal displays in terms of both image quality and performance. In the design and application of Micro LED displays, due to the low voltage, constant current drive, thermal sensitivity and other characteristics of Micro LED chips, many new problems need to be solved in the driving, heat dissipation and structural design of Micro LED displays. In particular, the current Micro LED displays have high working temperatures, which seriously affects the life of Micro LED displays. Summary of the invention

[0003] The present application provides a light-emitting substrate and a display panel to alleviate the technical problem that the existing Micro LED display has a high operating temperature, which seriously affects the life of the Micro LED display.

[0004] To solve the above problems, the technical solutions provided by this application are as follows:

[0005] The embodiment of the present application provides a light-emitting substrate, which includes:

[0006] A driving backplane, the driving backplane comprising at least one electrode pair, each of the electrode pairs comprising a first electrode and a second electrode insulated from each other;

[0007] A light emitting device, wherein the light emitting device is bound to the driving backplane through the corresponding electrode pair, and the light emitting device comprises an insulated cathode and an anode, wherein the cathode is electrically connected to the first electrode, and the anode is electrically connected to the second electrode;

[0008] A heat dissipation conductive layer, the heat dissipation conductive layer covers the driving backplane, the heat dissipation conductive layer includes a main body and an extension part, the main body is provided with an opening at a position corresponding to the light-emitting device, the extension part extends from the main body into the opening and covers at least a portion of the first electrode.

[0009] In the light-emitting substrate provided in the embodiment of the present application, the first electrode includes a protruding portion extending beyond the cathode, and the extending portion covers at least a portion of the protruding portion.

[0010] In the light-emitting substrate provided in the embodiment of the present application, the extension portion is also located between the first electrode and the cathode, and the cathode is electrically connected to the first electrode through the extension portion.

[0011] In the light-emitting substrate provided in the embodiment of the present application, the orthographic projection of the cathode on the driving backplane overlaps with the orthographic projection of the first electrode on the driving backplane, the extension portion is located between the first electrode and the cathode, and the cathode is electrically connected to the first electrode through the extension portion.

[0012] In the light-emitting substrate provided in the embodiment of the present application, the orthographic projection of each of the openings on the driving backplane covers the orthographic projection of at least one of the light-emitting devices on the driving backplane.

[0013] In the light-emitting substrate provided in the embodiment of the present application, the shape of the opening is at least one of a circle, a triangle, or a polygon.

[0014] In the light-emitting substrate provided in the embodiment of the present application, the material of the heat dissipating conductive layer includes graphene.

[0015] In the light-emitting substrate provided in the embodiment of the present application, there is a first interval between the main body and the second electrode, there is a second interval between the first electrode and the second electrode, the preset safety distance is equal to the second interval, and the first interval is greater than or equal to the preset safety distance.

[0016] In the light-emitting substrate provided in the embodiment of the present application, the light-emitting substrate further includes an encapsulation layer, the encapsulation layer covers the light-emitting device, the heat dissipation conductive layer and the driving backplane, the encapsulation layer is provided with a plurality of first through holes penetrating the encapsulation layer, and the first through holes expose a portion of the heat dissipation conductive layer;

[0017] The light emitting substrate further includes a plurality of first heat dissipation parts, which are filled in the first through holes and contact the heat dissipation conductive layer.

[0018] In the light-emitting substrate provided in the embodiment of the present application, the first through hole is located on a side of the main body close to the extension portion.

[0019] In the light-emitting substrate provided in the embodiment of the present application, the driving backplane includes a plurality of second through holes penetrating the driving backplane, and the second through holes expose a portion of the heat dissipation conductive layer; the light-emitting substrate also includes a second heat dissipation portion, and the second heat dissipation portion is filled in the second through holes and in contact with the heat dissipation conductive layer.

[0020] In the light-emitting substrate provided in the embodiment of the present application, the second through hole is arranged corresponding to the first through hole, or the second through hole is arranged alternately with the first through hole.

[0021] In the light-emitting substrate provided in the embodiment of the present application, the material of the first heat dissipation portion is the same as the material of the heat dissipation conductive layer, and the material of the second heat dissipation portion is also the same as the material of the heat dissipation conductive layer.

[0022] An embodiment of the present application further provides a display panel, which includes the light-emitting substrate of one of the aforementioned embodiments.

[0023] The beneficial effects of the present application are as follows: in the light-emitting substrate and display panel provided by the present application, a whole heat-dissipating conductive layer is covered on the driving backplane of the light-emitting substrate, and the heat-dissipating conductive layer includes a main body and an extension part, and the main body is provided with an opening at a position corresponding to the light-emitting device, and the extension part extends from the main body into the opening and covers at least a portion of the first electrode, so that the heat generated when the light-emitting device is working can be dissipated through the heat-dissipating conductive layer, and the heat-dissipating conductive layer is covered on the entire surface, which can increase the heat dissipation area, make the heat dissipation more uniform, and improve the heat dissipation performance, thereby solving the problem that the existing Micro LED display has a high temperature during operation, which seriously affects the life of the Micro LED display; at the same time, because the heat-dissipating conductive layer also has a conductive function, the heat-dissipating conductive layer can connect the cathodes of multiple light-emitting devices together, thereby reducing the voltage drop (IR Drop) of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of a first top view structure of a light-emitting substrate provided in an embodiment of the present application.

[0026] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the A-A' line.

[0027] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure along the B-B' line.

[0028] Figure 4 for Figure 1 Schematic diagram of the cross-sectional structure along C-C'.

[0029] Figure 5 for Figure 1 Schematic diagram of heat dissipation of the heat dissipation conductive layer in the horizontal direction.

[0030] Figure 6 for Figure 1 Schematic diagram of heat dissipation of the heat dissipation conductive layer in the vertical direction.

[0031] Figure 7 A second top view structural schematic diagram of the light-emitting substrate provided in an embodiment of the present application.

[0032] Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure along the A-A' line.

[0033] Fig. 9 for Figure 7 Schematic diagram of the cross-sectional structure along the B-B' line.

[0034] Fig.10 for Figure 7 Schematic diagram of the cross-sectional structure along C-C'.

[0035] Fig.11 for Figure 7 Schematic diagram of heat dissipation of the heat dissipation conductive layer in the horizontal direction.

[0036] Fig.12 for Figure 7 Schematic diagram of heat dissipation of the heat dissipation conductive layer in the vertical direction.

[0037] Fig.13 This is a schematic diagram of a third top view structure of the light-emitting substrate provided in an embodiment of the present application.

[0038] Fig.14 for Fig.13 Schematic diagram of the cross-sectional structure along the A-A' line.

[0039] Fig.15 for Fig.13 Schematic diagram of the cross-sectional structure along C-C'.

[0040] Fig.16 This is a schematic diagram of a fourth top view structure of the light-emitting substrate provided in an embodiment of the present application.

[0041] Fig.17 for Fig.16 Schematic diagram of a cross-sectional structure along the middle edge D-D'.

[0042] Fig.18 for Fig.16 Schematic diagram of another cross-sectional structure along the middle line D-D'.

[0043] Fig.19 A fifth top view structural schematic diagram of the light-emitting substrate provided in an embodiment of the present application.

[0044] Fig. 20 for Fig.19Schematic diagram of a cross-sectional structure along E-E'.

[0045] Fig.21 A sixth top view structural schematic diagram of the light-emitting substrate provided in an embodiment of the present application.

[0046] Notes on the attached drawings:

[0047] 100 / 101 / 102 / 103 / 104 / 105, luminous substrate;

[0048] 10. driving back plate; 11. first electrode; 12. second electrode; 111. protrusion;

[0049] 20. Light-emitting device; 21. Cathode; 22. Anode;

[0050] 30. heat dissipation conductive layer; 31. main body; 32. extension portion; 310. opening;

[0051] 40. Encapsulation layer;

[0052] 50, first heat dissipation portion; H1, first through hole;

[0053] 60. Second heat dissipation portion; H2. Second through hole. DETAILED DESCRIPTION

[0054] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be implemented in. The directional terms mentioned in the present application, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, rather than to limit the present application. In the figures, units with similar structures are represented by the same reference numerals. In the accompanying drawings, the thickness of some layers and regions is exaggerated for clear understanding and ease of description. That is, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited to this.

[0055] In response to the problem that the current Micro LED displays have high operating temperatures, which seriously affects the lifespan of the Micro LED displays, the inventors of this application found in their research that this is mainly because the location of the Micro LED chip generates a lot of heat, and this location only dissipates heat through fine metal traces and packaging layers, without a special heat dissipation structure. The heat dissipation performance is poor, so that the heat cannot be dissipated quickly, resulting in a high temperature near the Micro LED chip, and the high temperature seriously affects the lifespan of the Micro LED display.

[0056] In order to solve the above problems, the present application proposes a light-emitting substrate and a display panel.

[0057] Please refer to Figures 1 to 6 , Figure 1 This is a schematic diagram of the top view of the light-emitting substrate provided in the first embodiment of the present application. Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the middle line A-A', Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure along the middle line B-B', Figure 4 for Figure 1 Schematic diagram of the cross-sectional structure along C-C'. Figure 5 for Figure 1 Schematic diagram of heat dissipation of the heat dissipation conductive layer in the horizontal direction. Figure 6 for Figure 1 Schematic diagram of heat dissipation of the heat dissipation conductive layer in the vertical direction.

[0058] Reference Figure 1 The light-emitting substrate 100 includes a driving backplane 10, a light-emitting device 20 and a heat-dissipating conductive layer 30 arranged on the driving backplane 10. The driving backplane 10 includes at least one electrode pair, each of which includes a first electrode 11 and a second electrode 12 that are insulated. The light-emitting device 20 is bound to the driving backplane 10 through the corresponding electrode pair. The heat-dissipating conductive layer 30 is covered on the driving backplane 10, and the heat-dissipating conductive layer 30 includes a main body 31 and an extension 32. The main body 31 is provided with an opening 310 at a position corresponding to the light-emitting device 20, and the extension 32 extends from the main body 31 to the opening 310 and covers at least a portion of the first electrode 11.

[0059] Reference Figure 2 The light emitting device 20 includes an insulated cathode 21 and an anode 22, wherein the cathode 21 is electrically connected to the first electrode 11, and the anode 22 is electrically connected to the second electrode 12, so as to realize the electrical connection between the light emitting device 20 and the driving backplane 10. The driving backplane 10 is used to provide a driving signal to the light emitting device 20 so that the light emitting device 20 emits light. Optionally, the light emitting device 20 includes a Micro LED chip, a Mini LED chip, or an LED chip.

[0060] In this embodiment, a heat dissipation conductive layer 30 is provided, and the heat dissipation conductive layer 30 also covers at least a portion of the first electrode 11, so that the heat generated by the light-emitting device 20 during operation can be dissipated through the heat dissipation conductive layer 30, and the heat dissipation conductive layer 30 covers the area of ​​the driving backplane 10 except the light-emitting device 20, which can increase the heat dissipation area, make the heat dissipation more uniform, and improve the heat dissipation performance, thereby solving the problem that the temperature of the existing Micro LED display is high during operation, which seriously affects the life of the Micro LED display; at the same time, since the heat dissipation conductive layer 30 also has a conductive function, the heat dissipation conductive layer 30 can electrically connect the cathodes 21 of multiple light-emitting devices 20, thereby reducing the voltage drop of the display panel.

[0061] The structure of the heat dissipation conductive layer 30 will be described in detail below.

[0062] Reference Figure 1 The heat dissipation conductive layer 30 covers the driving backplane 10, and the opening 310 is set at the position corresponding to the light-emitting device 20, and there is no overlapping part between the orthographic projection of the light-emitting device 20 on the driving backplane 10 and the orthographic projection of the conductive heat dissipation layer on the driving backplane 10.

[0063] Optionally, the orthographic projection of each opening 310 on the driving backplane 10 covers the orthographic projection of at least one of the light-emitting devices 20 on the driving backplane 10, that is, each opening 310 corresponds to at least one of the light-emitting devices 20. For example, each of the openings 310 may correspond to three of the light-emitting devices 20. When each of the light-emitting devices 20 serves as a display sub-pixel, every three adjacent light-emitting devices 20 may form a display pixel. At this time, each of the openings 310 corresponds to a display pixel.

[0064] In addition, it should be noted that Figure 1 Nine light-emitting devices 20 are shown as an example, but this does not mean that the light-emitting substrate 100 of the present application includes nine light-emitting devices 20. More or fewer light-emitting devices 20 can be arranged on the light-emitting substrate 100 of the present application. For example, the number of the light-emitting devices 20 can be 4, 6, 20 or hundreds or thousands, and the present application is not limited to this.

[0065] Reference Figure 2Each of the light-emitting devices 20 includes a cathode 21 and an anode 22. The cathode 21 and the anode 22 serve as binding electrodes of the light-emitting device 20 and are respectively bound to the first electrode 11 and the second electrode 12 on the driving backplane 10, so that the light-emitting device 20 is bonded to the driving backplane 10. The driving backplane 10 includes a substrate and a driving circuit disposed on the substrate. The driving circuit is electrically connected to the second electrode 12 to provide a driving signal to the light-emitting device 20. The switch of each of the light-emitting devices 20 can be controlled by the driving circuit.

[0066] Reference Figure 3 The main body 31 and the extension 32 of the heat dissipation conductive layer 30 are formed in the same process, and the extension 32 extends from the main body 31 to the opening 310 and covers the first electrode 11, and the first electrode 11 is electrically connected to the cathode 21, so that the cathodes 21 of the plurality of light-emitting devices 20 can be electrically connected, and then the heat dissipation conductive layer 30 can provide an electrical signal to the cathode 21 of each light-emitting device 20, so that there is no need to additionally set a common electrode layer for providing the same electrical signal to each light-emitting device 20. Alternatively, when a common electrode layer for providing the same electrical signal to each light-emitting device 20 is provided on the light-emitting substrate 100, the heat dissipation conductive layer 30 electrically connects the cathodes 21 of each light-emitting device 20, and the heat dissipation conductive layer 30 is connected in parallel with the common electrode layer, so that the voltage drop can be reduced, and the light output of the light-emitting substrate 100 can be more uniform.

[0067] It should be noted that, since the heat dissipation conductive layer 30 has a conductive function and can also electrically connect the cathode 21 of the light emitting device 20, in order to avoid the heat dissipation conductive layer 30 from contacting the anode 22 and causing a short circuit, the heat dissipation conductive layer 30 needs to maintain a certain safety distance from the anode 22. Figure 2 and Figure 3 There is a second interval L2 between the first electrode 11 and the second electrode 12, and the preset safety distance is equal to the second interval L2. There is L1 between the main body 31 and the second electrode 12, and the first interval L1 is greater than or equal to the preset safety distance.

[0068] Reference Figure 1 and Figure 4In order to reduce the difficulty of alignment when the light-emitting device 20 is bound to the driving backplane 10, the size of the first electrode 11 on the driving backplane 10 may be larger than the size of the cathode 21, and the size of the second electrode 12 may be larger than the size of the anode 22, that is, the orthographic projection of the cathode 21 on the driving backplane 10 falls within the range of the orthographic projection of the first electrode 11 on the driving backplane 10, and the orthographic projection area of ​​the cathode 21 is smaller than the orthographic projection area of ​​the conductive first electrode 11, and accordingly, the orthographic projection area of ​​the anode 22 is smaller than the orthographic projection area of ​​the second electrode 12.

[0069] At this time, the first electrode 11 includes a protrusion 111 extending beyond the cathode 21, and the extension portion 32 covers at least a portion of the protrusion 111. Of course, the larger the area covered by the extension portion 32 on the protrusion 111, the larger the contact area between the extension portion 32 and the protrusion 111. In this way, the contact impedance between the extension portion 32 and the protrusion 111 is smaller, and the heat dissipation area is increased, and the heat dissipation effect is better.

[0070] Optionally, the material of the heat dissipation conductive layer 30 includes conductive and thermal conductive materials such as metals such as copper and aluminum, graphene or non-metals. Preferably, the material of the heat dissipation conductive layer 30 is graphene, which has better electrical and thermal conductivity than metals such as copper and aluminum, and its thermal conductivity efficiency on the horizontal axis is as high as 1900W / (m*K). Moreover, graphene can smoothly adhere to any flat and curved surface, with a minimum thickness of 0.01mm, and is a colorless and transparent film. Therefore, the use of graphene can make the thickness of the heat dissipation conductive layer 30 flat and feasible.

[0071] Reference Figure 5 The light emitting device 20 generates a large amount of heat when working. The generated heat can be transferred to the first electrode 11 through the cathode 21 of the light emitting device 20, and then transferred to the extension part 32 of the heat dissipation conductive layer 30 through the first electrode 11. Then, the heat is transferred to the main body 31 through the extension part 32, and is transferred on the main body 31, and the heat is diffused to the entire horizontal plane through the main body 31. Figure 5 The dashed line with an arrow in the middle indicates the direction of heat transfer.

[0072] Further, refer to Figure 6 The light emitting device 20 further includes an encapsulation layer 40, which covers the light emitting device 20, the heat dissipation conductive layer 30 and the driving backplane 10. The encapsulation layer 40 can protect the light emitting device 20 to isolate water and oxygen. When the heat diffuses to the entire horizontal plane, it will be vertically dissipated through the driving backplane 10 or the encapsulation layer 40. Figure 6 The dashed line with an arrow in the middle indicates the direction of heat transfer. In this way, the heat is diffused to the entire horizontal plane through the main body 31, and the heat is vertically dissipated through the driving backplane 10 or the packaging layer 40, which increases the heat dissipation area, makes the heat dissipation more uniform, improves the heat dissipation performance, and avoids the heat near the light emitting device 20 not being able to dissipate quickly, resulting in high temperature, which seriously affects the life of the Micro LED display.

[0073] In one embodiment, see Figures 1 to 12 , Figure 7 This is a schematic diagram of a top view of the light-emitting substrate provided in the second embodiment of the present application. Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure along the middle line A-A', Fig. 9 for Figure 7 Schematic diagram of the cross-sectional structure along the middle line B-B', Fig.10 for Figure 7 Schematic diagram of the cross-sectional structure along C-C'. Fig.11 for Figure 7 Schematic diagram of heat dissipation of the heat dissipation conductive layer 30 in the horizontal direction, Fig.12 for Figure 7 Schematic diagram of heat dissipation of the heat dissipation conductive layer 30 in the vertical direction. Different from the first embodiment, in the light emitting substrate 101 of this embodiment, the extension portion 32 is also located between the first electrode 11 and the cathode 21 , and the cathode 21 is electrically connected to the first electrode 11 through the extension portion 32 .

[0074] Specifically, refer to Figure 7 and Figure 8 The extension portion 32 extends from the main body portion 31 to the opening 310 and covers the first electrode 11. The cathode 21 of the light emitting device 20 is disposed on a portion of the extension portion 32, so that the extension portion 32 is directly in contact with the cathode 21 and the first electrode 11, and the cathode 21 is electrically connected to the first electrode 11 through the extension portion 32. Since the cathode 21 is in direct contact with the extension portion 32, the heat generated by the light emitting device 20 during operation can be directly transferred from the cathode 21 to the extension portion 32, and the heat dissipation effect is better.

[0075] Further, refer to Fig. 9 and Fig.10, the extension portion 32 also covers the protruding portion 111 of the first electrode 11 beyond the cathode 21, that is, the extension portion 32 covers the entire first electrode 11, and the orthographic projection of the portion of the extension portion 32 covering the first electrode 11 on the driving backplane 10 overlaps with the orthographic projection of the first electrode 11 on the driving backplane 10. In this way, the heat dissipation area can be larger and the heat dissipation effect can be better.

[0076] Reference Fig.11 and Fig.12 The light emitting device 20 generates a large amount of heat when working. The generated heat can be transferred to the extension part 32 and the first electrode 11 through the cathode 21 of the light emitting device 20, so that the heat on the cathode 21 can be diffused more quickly. The heat on the first electrode 11 is also transferred to the extension part 32. Then the heat is transferred to the main body 31 through the extension part 32, and is transferred on the main body 31, and the heat is diffused to the entire horizontal plane through the main body 31. Fig.11 The dashed line with an arrow in the middle indicates the direction of heat transfer. Meanwhile, in the process of heat diffusion to the entire horizontal plane, the heat will be vertically dissipated through the driving backplane 10 or the packaging layer 40, such as Fig.12 The dashed line with an arrow in the middle indicates the direction of heat transfer. In this way, the heat is diffused to the entire horizontal plane through the main body 31, and the heat is vertically dissipated through the driving backplane 10 or the packaging layer 40, which greatly increases the heat dissipation area, makes the heat dissipation more uniform, and improves the heat dissipation performance. For other explanations, please refer to the above embodiment, which will not be repeated here.

[0077] In one embodiment, referring to Figures 1 to 15 , Fig.13 This is a schematic diagram of a top view of the light-emitting substrate provided in the third embodiment of the present application. Fig.14 for Fig.13 Schematic diagram of the cross-sectional structure along the middle line A-A', Fig.15 for Fig.13 Different from the above-mentioned embodiment, in the light-emitting substrate 102 of this embodiment, the positive projection of the cathode 21 on the driving backplane 10 overlaps with the positive projection of the first electrode 11 on the driving backplane 10, the extension portion 32 is located between the first electrode 11 and the cathode 21, and the cathode 21 is electrically connected to the first electrode 11 through the extension portion 32.

[0078] Specifically, refer to Fig.13 and Fig.14The extension portion 32 extends from the main body portion 31 into the opening 310 and covers the first electrode 11. The cathode 21 of the light-emitting device 20 is arranged on part of the extension portion 32, so that the extension portion 32 is directly in contact with the cathode 21 and the first electrode 11, and the cathode 21 is electrically connected to the first electrode 11 through the extension portion 32.

[0079] Further, refer to Fig.15 , the size of the cathode 21 is comparable to that of the first electrode 11, and the positive projection of the cathode 21 on the driving backplane 10 overlaps with the positive projection of the first electrode 11 on the driving backplane 10. The extension portion 32 is located between the cathode 21 and the first electrode 11, so that the extension portion 32 is in direct contact with the entire cathode 21 and the entire first electrode 11, so that the heat generated by the light-emitting device 20 during operation can be directly transferred from the cathode 21 to the extension portion 32, and the heat dissipation effect is better. Please refer to the above embodiment for other descriptions, which will not be repeated here.

[0080] In one embodiment, referring to Figures 1 to 17 , Fig.16 This is a schematic diagram of a top view of the light-emitting substrate provided in the fourth embodiment of the present application. Fig.17 for Fig.16 A schematic diagram of a cross-sectional structure along the line D-D' in the figure. Different from the first embodiment, in the light-emitting substrate 103 of this embodiment, the light-emitting substrate 103 further includes a packaging layer 40, the packaging layer 40 covers the light-emitting device 20, the heat-dissipating conductive layer 30 and the driving backplane 10, and the packaging layer 40 is provided with a plurality of first through holes H1 penetrating the packaging layer 40, and the first through holes H1 expose a portion of the heat-dissipating conductive layer 30. The light-emitting substrate 100 further includes a plurality of first heat-dissipating portions 50, the first heat-dissipating portions 50 are filled in the first through holes H1 and are in contact with the heat-dissipating conductive layer 30.

[0081] Specifically, refer to Fig.16 and Fig.17 The light-emitting substrate 100 includes a plurality of first heat dissipation parts 50. Optionally, each of the light-emitting devices 20 corresponds to a first heat dissipation part 50, but the present application is not limited thereto. The specific number of the first heat dissipation parts 50 of the present application can be set according to actual heat dissipation requirements. For example, a plurality of the light-emitting devices 20 correspond to one first heat dissipation part 50.

[0082] Each of the first heat dissipation parts 50 is disposed in the encapsulation layer 40 and is in contact with the heat dissipation conductive layer 30. Specifically, the encapsulation layer 40 may be perforated to form a plurality of first through holes H1 penetrating the encapsulation layer 40, and a portion of the heat dissipation conductive layer 30 is exposed by the first through holes H1, and then the heat dissipation material is filled in the first through holes H1 to form the first heat dissipation part 50, and the first heat dissipation part 50 is in contact with the heat dissipation conductive layer 30. Optionally, the material of the encapsulation layer 40 includes a material with high transparency such as epoxy resin, polyurethane, and silicone.

[0083] When the light emitting device 20 generates a large amount of heat during operation, the generated heat can be transferred to the extension portion 32 through the cathode 21 of the light emitting device 20, and then the heat is transferred to the main body 31 through the extension portion 32, and then transferred on the main body 31, and the heat is diffused to the entire horizontal plane through the main body 31. At the same time, in the process of diffusing the heat to the entire horizontal plane, the heat is vertically dissipated through the first heat dissipation portion 50, and the heat dissipation performance of the first heat dissipation portion 50 is better than that of the encapsulation layer 40, thereby improving the heat dissipation performance in the vertical direction.

[0084] Furthermore, since the heat generated by the light-emitting device 20 is first transferred to the main body 31 through the extension portion 32 and then diffused to the entire horizontal plane, the heat near the extension portion 32 is relatively large. Therefore, the first heat dissipation portion 50 can be arranged on the side of the main body 31 close to the extension portion 32, that is, when the encapsulation layer 40 is opened, the first through hole H1 can be arranged on the side of the main body 31 close to the extension portion 32. In this way, the heat near the extension portion 32 can be quickly dissipated, further improving the heat dissipation performance.

[0085] Optionally, the material of the first heat dissipation portion 50 is the same as that of the heat dissipation conductive layer 30, for example, both may be graphene. However, the present application is not limited thereto, and the first heat dissipation portion 50 of the present application may also be a non-conductive heat dissipation material. For other descriptions, please refer to the above embodiment, which will not be repeated here.

[0086] In another embodiment, referring to Fig.18 , Fig.18 for Fig.16 Another cross-sectional structural diagram along the middle line D-D'. Different from the fourth embodiment, the driving backplane includes a plurality of second through holes H2 penetrating the driving backplane, and the second through holes H2 expose a portion of the heat dissipation conductive layer 30; the light-emitting substrate 100 also includes a second heat dissipation portion 60, and the second heat dissipation portion 60 is filled in the second through holes H2 and contacts the heat dissipation conductive layer 30. The second through holes H2 are arranged corresponding to the first through holes H1.

[0087] Specifically, refer to Fig.18 , the second heat dissipation part 60 is arranged in the driving backplane 10 and contacts the heat dissipation conductive layer 30. Specifically, the driving backplane 10 can be perforated to form a plurality of second through holes H2 penetrating the driving backplane 10, and part of the heat dissipation conductive layer 30 is exposed by the second through holes H2, and then the heat dissipation material is filled in the second through holes H2 to form the second heat dissipation part 60, so that the second heat dissipation part 60 is arranged in the driving backplane 10 and contacts the heat dissipation conductive layer 30. Of course, when perforating the driving backplane 10, it is necessary to avoid functional components such as the driving circuit on the driving backplane 10. Optionally, the substrate material of the driving backplane 10 includes a hard substrate material with good surface flatness such as a glass substrate.

[0088] When the light emitting device 20 generates a large amount of heat during operation, the generated heat can be transferred to the extension portion 32 through the cathode 21 of the light emitting device 20, and then the heat is transferred to the main body 31 through the extension portion 32, and then transferred on the main body 31, and the heat is diffused to the entire horizontal plane through the main body 31. At the same time, in the process of diffusing the heat to the entire horizontal plane, the heat is vertically dissipated through the first heat dissipation portion 50 and the second heat dissipation portion 60, and the heat dissipation performance of the second heat dissipation portion 60 is better than that of the driving backplane 10, thereby further improving the heat dissipation performance in the vertical direction.

[0089] Optionally, the material of the second heat dissipation portion 60 is the same as that of the first heat dissipation portion 50, for example, the material of the first heat dissipation portion 50 is the same as that of the heat dissipation conductive layer 30, and the material of the second heat dissipation portion 60 is also the same as that of the heat dissipation conductive layer 30. However, the present application is not limited thereto, and the second heat dissipation portion 60 of the present application may also be a non-conductive heat dissipation material. For other descriptions, please refer to the above embodiments, which will not be repeated here.

[0090] It is understandable that, in one embodiment, in order to reduce the difficulty of opening the driving backplane 10, the material of the substrate of the driving backplane 10 includes a flexible substrate material such as polyimide (PI). In addition, since flexible materials such as polyimide have very good bending resistance, when the light-emitting substrate 103 is applied to a display panel, the use of a flexible substrate material can achieve the flexibility of the display panel, such as a flexible display panel with folding or curling. In order to better realize a display panel with folding or bending performance, other film layers on the light-emitting substrate 103 can also be replaced by flexible materials, such as the encapsulation layer 40 can also be formed of transparent polyimide.

[0091] In one embodiment, referring to Figures 1 to 20 , Fig.19 This is a schematic diagram of the top view of the light-emitting substrate provided in the fifth embodiment of the present application. Fig. 20 for Fig.19 A schematic diagram of a cross-sectional structure along the line EE'. Different from the above embodiment, in the light emitting substrate 104 of this embodiment, the second through hole H2 is located on a side of the main body 31 close to the extension portion 32, and the second through hole H2 is staggered with the first through hole H1.

[0092] Specifically, refer to Fig.19 and Fig. 20 , the first heat dissipation portion 50 and the second heat dissipation portion 60 are both arranged on one side of the main body portion 31 close to the extension portion 32. The first heat dissipation portion 50 is located near a part of the light-emitting devices 20, and the second heat dissipation portion 60 is located near another part of the light-emitting devices 20, and among the two adjacent light-emitting devices 20, one light-emitting device 20 corresponds to the first heat dissipation portion 50, and the other light-emitting device 20 corresponds to the second heat dissipation portion 60, so that the first heat dissipation portion 50 and the second heat dissipation portion 60 are staggered. In this way, while achieving uniform heat dissipation in the vertical direction, it is also possible to reduce the number of excessive first through holes H1 set in the encapsulation layer 40, and reduce the number of excessive second through holes H2 set in the driving backplane 10, thereby reducing the difficulty of the hole opening process. For other descriptions, please refer to the above embodiments, which will not be repeated here.

[0093] In one embodiment, referring to Figures 1 to 21 , Fig.21 A schematic diagram of the top structure of the light-emitting substrate provided for the sixth embodiment of the present application. Different from the above-mentioned embodiments, in the light-emitting substrate 105 of the present embodiment, the shape of the opening 310 is circular. Of course, the present application is not limited to this, and the shape of the opening 310 of the present application may also include at least one of other polygons such as a triangle or a rhombus, a square, a rectangle, a pentagon, a hexagon, etc. The shape of the opening 310 needs to match the shape of the light-emitting device 20 to avoid the heat dissipation conductive layer 30 from affecting the light output of the light-emitting device 20, and the opening 310 also needs to meet the requirement that a certain safety distance is maintained between the heat dissipation conductive layer 30 and the anode 22 of the light-emitting device 20 to avoid short circuits. Please refer to the above-mentioned embodiments for other instructions, which will not be repeated here.

[0094] Based on the same inventive concept, the embodiment of the present application further provides a display panel, which includes the light-emitting substrate of one of the above embodiments. Taking the light-emitting substrate 100 as an example, the display panel may also include a cover plate and a touch structure arranged in the light-emitting direction of the light-emitting substrate 100.

[0095] Optionally, the display panel includes a light-emitting diode (LED) display panel, a micro light-emitting diode (Micro-LED) display panel, or a sub-millimeter light-emitting diode (Mini-LED) display panel.

[0096] Exemplarily, the display panel is applied to a display device, which may be a television, a mobile phone, a tablet computer, a computer monitor, a gaming device, a digital camera, a car navigation system, an electronic billboard, an ATM, a wearable device, or other electronic device with a display function, wherein the wearable device may be a display device such as a smart bracelet, smart glasses, a smart watch, or smart decoration.

[0097] According to the above embodiments, it can be seen that:

[0098] The present application provides a light-emitting substrate and a display panel, in which a driving backplane of the light-emitting substrate is covered with a whole heat-dissipating conductive layer, the heat-dissipating conductive layer includes a main body and an extension part, the main body is provided with an opening at a position corresponding to the light-emitting device, the extension part extends from the main body into the opening, and covers at least a portion of a first electrode, so that the heat generated when the light-emitting device is working can be dissipated through the heat-dissipating conductive layer, and the heat-dissipating conductive layer is covered on the entire surface, which can increase the heat dissipation area, make the heat dissipation more uniform, and improve the heat dissipation performance, thereby solving the problem that the existing Micro LED display has a high temperature during operation, which seriously affects the life of the Micro LED display; at the same time, because the heat-dissipating conductive layer also has a conductive function, the heat-dissipating conductive layer can connect the cathodes of multiple light-emitting devices together, thereby reducing the voltage drop of the display panel.

[0099] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0100] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light-emitting substrate, characterized in that: include: A driving backplane, the driving backplane comprising at least one electrode pair, each of the electrode pairs comprising a first electrode and a second electrode insulated from each other; A light emitting device, wherein the light emitting device is bound to the driving backplane through the corresponding electrode pair, and the light emitting device comprises an insulated cathode and an anode, wherein the cathode is electrically connected to the first electrode, and the anode is electrically connected to the second electrode; as well as A heat dissipation conductive layer, the heat dissipation conductive layer covers the driving backplane, the heat dissipation conductive layer includes a main body and an extension part, the main body is provided with an opening at a position corresponding to the light-emitting device, the extension part extends from the main body into the opening and covers at least a portion of the first electrode.

2. The light-emitting substrate according to claim 1, characterized in that: The first electrode includes a protruding portion extending beyond the cathode, and the extending portion covers at least a portion of the protruding portion.

3. The light-emitting substrate according to claim 2, characterized in that: The extension portion is also located between the first electrode and the cathode, and the cathode is electrically connected to the first electrode through the extension portion.

4. The light-emitting substrate according to claim 1, characterized in that: The orthographic projection of the cathode on the driving backplane overlaps with the orthographic projection of the first electrode on the driving backplane, the extending portion is located between the first electrode and the cathode, and the cathode is electrically connected to the first electrode through the extending portion.

5. The light-emitting substrate according to claim 1, characterized in that: The orthographic projection of each opening on the driving backplane covers the orthographic projection of at least one of the light-emitting devices on the driving backplane.

6. The light-emitting substrate according to claim 1, characterized in that: The shape of the opening is at least one of a circle, a triangle, or a polygon.

7. The light-emitting substrate according to claim 1, characterized in that: The material of the heat dissipation conductive layer includes graphene.

8. The light-emitting substrate according to any one of claims 1 to 7, characterized in that: There is a first interval between the main body and the second electrode, there is a second interval between the first electrode and the second electrode, the preset safety distance is equal to the second interval, and the first interval is greater than or equal to the preset safety distance.

9. The light-emitting substrate according to claim 1, characterized in that: The light-emitting substrate further comprises a packaging layer, the packaging layer covers the light-emitting device, the heat dissipation conductive layer and the driving backplane, the packaging layer is provided with a plurality of first through holes penetrating the packaging layer, and the first through holes expose a portion of the heat dissipation conductive layer; The light emitting substrate further includes a plurality of first heat dissipation parts, which are filled in the first through holes and contact the heat dissipation conductive layer.

10. The light emitting substrate according to claim 9, characterized in that: The first through hole is located at a side of the main body close to the extension portion.

11. The light emitting substrate according to claim 9, characterized in that: The driving backplane also includes a plurality of second through holes penetrating the driving backplane, wherein the second through holes expose a portion of the heat dissipation conductive layer; the light-emitting substrate also includes a second heat dissipation portion, which is filled in the second through holes and contacts the heat dissipation conductive layer.

12. The light emitting substrate according to claim 11, characterized in that: The second through hole is arranged corresponding to the first through hole, or the second through hole is arranged alternately with the first through hole.

13. The light emitting substrate according to claim 11, characterized in that: The material of the first heat dissipation portion is the same as that of the heat dissipation conductive layer, and the material of the second heat dissipation portion is also the same as that of the heat dissipation conductive layer.

14. A display panel, characterized in that: It comprises the light emitting substrate as claimed in any one of claims 1 to 13.

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