Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device.The display panel comprises a display area and a non-display area and further comprises a substrate and an inorganic layer located on one side of the substrate; the dam is located in the non-display area and arranged on the side, away from the substrate, of the inorganic layer; the first groove is located in the non-display area and arranged on the side, close to the display area, of the dam, and at least part of the first groove is located in the inorganic layer; the second groove is located in the non-display area and arranged on the side, away from the display area, of the dam, and at least part of the second groove is located in the inorganic layer; the packaging layer is located in the display area and the non-display area, and at least part of the packaging layer covers the inorganic layer, the dam, the first groove and the second groove. According to the display panel, the overflow risk of the organic material in the packaging layer can be reduced, and the packaging reliability is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light Emitting Display (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current display devices needs to be improved. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a display panel that is conducive to achieving a narrow frame and ensuring a packaging effect.

[0005] Based on the above purpose, the present application provides a display panel, which includes a display area and a non-display area, and the display panel also includes:

[0006] substrate;

[0007] an inorganic layer located on one side of the substrate;

[0008] A dam, located in the non-display area and disposed on a side of the inorganic layer away from the substrate;

[0009] A first groove is located in the non-display area and is disposed on a side of the dam close to the display area, and is at least partially located in the inorganic layer;

[0010] A second groove is located in the non-display area and is disposed on a side of the dam away from the display area, and is at least partially located in the inorganic layer;

[0011] An encapsulation layer is located in the display area and the non-display area, and at least a portion of the encapsulation layer covers the inorganic layer, the dam, the first groove, and the second groove.

[0012] In one embodiment, the first groove penetrates the inorganic layer and is partially located in the substrate; and / or

[0013] The second groove penetrates the inorganic layer and is partially located in the substrate.

[0014] In one embodiment, the inorganic layer includes a plurality of insulating layers, and the plurality of insulating layers include a first buffer layer, a first gate dielectric layer, a capacitor dielectric layer, and an interlayer dielectric layer which are sequentially arranged away from the substrate;

[0015] The first groove penetrates the first gate dielectric layer and the capacitor dielectric layer, and the second groove penetrates the first gate dielectric layer and the capacitor dielectric layer;

[0016] Preferably, the multiple insulating layers also include a second buffer layer and a second gate dielectric layer which are arranged in sequence away from the substrate, and the second buffer layer and the second gate dielectric layer are located between the capacitor dielectric layer and the interlayer dielectric layer, the first groove penetrates the second buffer layer and the second gate dielectric layer, and the second groove penetrates the second buffer layer and the second gate dielectric layer.

[0017] Preferably, the substrate comprises a first flexible substrate, a second flexible substrate, and a first barrier layer located between the first flexible substrate and the second flexible substrate;

[0018] Preferably, the inorganic layer further includes a second barrier layer located between the first buffer layer and the substrate.

[0019] In one embodiment, the dam comprises a plurality of stacked organic layers;

[0020] Preferably, along the direction from the display area to the non-display area, the number of the dam is one.

[0021] In one embodiment, the encapsulation layer includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer, the first encapsulation layer covers the inorganic layer, the dam, the first groove and the second groove, the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate and the second encapsulation layer fills the first groove, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate;

[0022] Preferably, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials.

[0023] In one embodiment, the first encapsulation layer covers the sidewalls and the bottom wall of the first groove, and the first encapsulation layer covers the sidewalls and the bottom wall of the second groove.

[0024] In one embodiment, the dam comprises:

[0025] A planarization layer, located on a side of the inorganic layer away from the substrate;

[0026] A pixel definition layer, located on a side of the planarization layer away from the substrate;

[0027] Preferably, the dam further comprises:

[0028] a spacer, located on a side of the pixel definition layer away from the substrate;

[0029] Preferably, the planarization layer comprises a first planarization layer and a second planarization layer, the first planarization layer is located on a side of the inorganic layer away from the substrate, and the second planarization layer is located on a side of the first planarization layer away from the substrate.

[0030] In one embodiment, the display panel further includes a first metal line, and the first groove is formed by a surface of the first metal line away from the substrate and a side wall of a portion of the inorganic layer facing the first groove;

[0031] The display panel further includes a second metal line, the second metal line is located at a side of the first metal line away from the substrate, a portion of the second metal line is located in the first groove, and overlaps with the first metal line at the position of the first groove;

[0032] The first metal wire and the second metal wire are used to transmit a power signal.

[0033] Based on the same inventive concept, the present application also discloses a method for preparing a display panel, wherein the display panel includes a display area and a non-display area, and the method includes:

[0034] forming an inorganic layer on one side of the substrate;

[0035] Forming a first groove and a second groove in the non-display area; wherein the first groove and the second groove are at least partially located in the inorganic layer, and the first groove is located between the second groove and the display area;

[0036] A dam is formed on a side of the inorganic layer away from the substrate; wherein the dam is located between the first groove and the second groove;

[0037] An encapsulation layer is formed on one side of the substrate, the encapsulation layer is located in the display area and the non-display area, and the encapsulation layer covers the inorganic layer, the dam, the first groove and the second groove.

[0038] Based on the same inventive concept, the present application also discloses a display device, which includes the above-mentioned display panel.

[0039] Compared with the prior art, the display panel provided in the present application can effectively reduce the number of dams and thus achieve a narrow frame by setting a first groove on the side of the dam close to the display area, setting a second groove on the side of the dam away from the display area, and covering it with an encapsulation layer; at the same time, the first groove can reduce the risk of overflow of organic materials in the encapsulation layer, while the second groove can store the overflowed organic material and encapsulate the overflowed organic material in the second groove, thereby improving the encapsulation reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 is a schematic diagram of a frame structure of a related display panel;

[0042] Figure 2 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in one embodiment of the present application;

[0043] Figure 3 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0044] Figure 4 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0045] Figure 5 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0046] Figure 6 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0047] Figure 7 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0048] Figure 8 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0049] Fig. 9 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0050] Fig.10 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0051] Fig.11 A flow chart of a method for preparing a display panel provided in another embodiment of the present application;

[0052] Fig.12 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0053] Fig.13 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application;

[0054] Fig.14 A schematic diagram of the layer structure of a non-display area of ​​a display panel provided in another embodiment of the present application.

[0055] Marking Description:

[0056] 100, display panel; 101, display area; 102, non-display area;

[0057] 11. substrate; 111. first flexible substrate; 112. first barrier layer; 113. second flexible substrate; 12. inorganic layer; 121. first buffer layer; 122. first gate dielectric layer; 123. capacitor dielectric layer; 124. interlayer dielectric layer; 125. second buffer layer; 126. second gate dielectric layer; 127. second barrier layer; 1281. second metal wire; 1282. third metal wire; 1283. fourth metal wire; 13. first metal wire;

[0058] 2. dam; 21. planarization layer; 211. first planarization layer; 212. second planarization layer; 22. pixel definition layer; 23. spacer;

[0059] 3. The first groove;

[0060] 4. The second groove;

[0061] 5. Encapsulation layer; 51. First encapsulation layer; 52. Second encapsulation layer; 53. Third encapsulation layer. DETAILED DESCRIPTION

[0062] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0063] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0064] Reference Figure 1 As shown, for flexible AMOLED products, the encapsulation layer 5 is usually encapsulated by TFE (Thin Film Encapsulation), and the encapsulation layer 5 usually includes organic materials. In order to prevent the organic materials from overflowing, a dam 2 is usually designed on the frame.

[0065] After long-term research by the inventor, it is found that in order to ensure the encapsulation effect, the number of dams 2 of current AMOLED products is usually not less than two, wherein the outer dam 2 is usually higher than the inner dam 2, and the organic material is mainly blocked by the inner dam 2. If the inner dam 2 overflows, the overflowing organic material will also be isolated between the inner dam 2 and the outer dam 2. However, the multiple dam 2 structure will occupy a large space, which is not conducive to achieving a narrow frame. Based on this, the present application provides a panel solution, see the following embodiments for details.

[0066] Reference Figure 2 and 3 As shown, an embodiment of the present application discloses a display panel 100, the display panel 100 includes a display area 101 and a non-display area 102, referring to Figure 3As shown, the display panel 100 in this embodiment further includes: a substrate 11, an inorganic layer 12, a dam 2, a first groove 3, a second groove 4 and an encapsulation layer 5. The inorganic layer 12 is located on one side of the substrate 11; the dam 2 is located in the non-display area 102 and is arranged on the side of the inorganic layer 12 away from the substrate 11; the first groove 3 is located in the non-display area 102 and is arranged on the side of the dam 2 close to the display area 101, and is at least partially located in the inorganic layer 12; the second groove 4 is located in the non-display area 102 and is arranged on the side of the dam 2 away from the display area 101, and is at least partially located in the inorganic layer 12; the encapsulation layer 5 is located in the display area 101 and the non-display area 102, and at least part of the encapsulation layer 5 covers the inorganic layer 12, the dam 2, the first groove 3 and the second groove 4.

[0067] The display panel 100 provided in the embodiment of the present application can effectively reduce the number of dams 2 and thus achieve a narrow frame by setting a first groove 3 on the side of the dam 2 close to the display area 101, setting a second groove 4 on the side of the dam 2 away from the display area 101, and covering it with an encapsulation layer 5; at the same time, the first groove 3 can reduce the risk of overflow of organic materials in the encapsulation layer 5, and the second groove 4 can store the overflowed organic material, and encapsulate the overflowed organic material in the second groove 4, thereby improving the encapsulation reliability.

[0068] Specifically, the display panel 100 in this embodiment only needs one dam 2 to achieve effective packaging. Compared with multiple dams in the frame in the related art, the frame width can be effectively reduced. At the same time, the two grooves inside and outside the dam 2 can effectively ensure the packaging reliability and avoid overflow of organic materials.

[0069] Please continue to refer to Figure 3 As shown, in one embodiment, the encapsulation layer 5 includes a first encapsulation layer 51, a second encapsulation layer 52 and a third encapsulation layer 53, the first encapsulation layer 51 covers the inorganic layer 12, the dam 2, the first groove 3 and the second groove 4, the second encapsulation layer 52 is located on the side of the first encapsulation layer 51 away from the substrate 11 and the second encapsulation layer 52 fills the first groove 3, and the third encapsulation layer 53 is located on the side of the second encapsulation layer 52 away from the substrate 11. The dam 2 is used to block the second encapsulation layer 52 on the side close to the display area 101, and three-layer encapsulation is achieved, which is conducive to improving the encapsulation effect.

[0070] Preferably, the first encapsulation layer 51 and the third encapsulation layer 53 include inorganic materials, and the second encapsulation layer 52 includes organic materials. Inorganic-organic-inorganic three-layer encapsulation is achieved to ensure the encapsulation effect. Among them, the inorganic encapsulation can be prepared by chemical vapor deposition, which is conducive to improving the density and encapsulation effect of the encapsulation layer, and the organic encapsulation can be prepared by inkjet printing.

[0071] In one of the embodiments, the first encapsulation layer 51 covers the side walls and bottom wall of the first groove 3, and the first encapsulation layer 51 covers the side walls and bottom wall of the second groove 4, ensuring full coverage of the first groove 3 and the second groove 4, which is beneficial to improving the encapsulation effect and avoiding overflow of organic materials leading to encapsulation failure.

[0072] Reference Figure 4 As shown, in one embodiment, the first groove 3 penetrates the inorganic layer 12 and is partially located at the substrate 11 or the second groove 4 penetrates the inorganic layer 12 and is partially located at the substrate 11, which can effectively ensure the depth of the first groove 3 or the second groove 4, thereby ensuring the encapsulation effect and avoiding overflow of organic materials. In another embodiment, the first groove 3 penetrates the inorganic layer 12 and is partially located at the substrate 11 and the second groove 4 penetrates the inorganic layer 12 and is partially located at the substrate 11, while ensuring the depth of the first groove 3 and the second groove 4, further ensuring the encapsulation effect and avoiding overflow of organic materials.

[0073] Reference Figure 5 As shown, in one embodiment, the inorganic layer 12 includes a plurality of insulating layers, and the plurality of insulating layers include a first buffer layer 121, a first gate dielectric layer 122, a capacitor dielectric layer 123, and an interlayer dielectric layer 124 which are sequentially arranged away from the substrate 11; the first groove 3 penetrates the first gate dielectric layer 122 and the capacitor dielectric layer 123, and the second groove 4 penetrates the first gate dielectric layer 122 and the capacitor dielectric layer 123. Among them, the first groove 3 and the second groove 4 both penetrate the first gate dielectric layer 122 and the capacitor dielectric layer 123, thereby ensuring the depth of the first groove 3 and the second groove 4, which is conducive to improving the packaging effect.

[0074] Preferably, at least part of the first groove 3 is formed by etching the first gate dielectric layer 122 and the capacitor dielectric layer 123 through the interlayer dielectric layer 124; at least part of the second groove 4 is formed by etching the first gate dielectric layer 122 and the capacitor dielectric layer 123 through the interlayer dielectric layer 124. Specifically, the etching depth of the interlayer dielectric layer 124 can reach the first gate dielectric layer 122 and the capacitor dielectric layer 123.

[0075] Reference Figure 6 As shown, in another embodiment, the plurality of insulating layers further include a second buffer layer 125 and a second gate dielectric layer 126 which are sequentially arranged away from the substrate 11, and the second buffer layer 125 and the second gate dielectric layer 126 are located between the capacitor dielectric layer 123 and the interlayer dielectric layer 124, the first groove 3 penetrates the second buffer layer 125 and the second gate dielectric layer 126, and the second groove 4 penetrates the second buffer layer 125 and the second gate dielectric layer 126. Specifically, the second buffer layer 125 and the second gate dielectric layer 126 can be etched through the interlayer dielectric layer 124, and the first gate dielectric layer 122 and the capacitor dielectric layer 123 can be etched at the same time to form the first groove 3 and the second groove 4.

[0076] Reference Figure 7 As shown, in one embodiment, the substrate 11 includes a first flexible substrate 111, a second flexible substrate 113, and a first barrier layer 112 located between the first flexible substrate 111 and the second flexible substrate 113. The double-layer flexible substrate can enhance the bending and folding performance, and isolate water vapor through the barrier layer to avoid mutual influence between the double-layer flexible substrates.

[0077] Preferably, the inorganic layer 12 further includes a second barrier layer 127 located between the first buffer layer 121 and the substrate 11. The second barrier layer 127 can function as a barrier against water and oxygen.

[0078] In one embodiment, part of the first groove 3 is formed by etching the first buffer layer 121 and the substrate 11, and part of the second groove 4 is formed by etching the first buffer layer 121 and the substrate 11, that is, the first groove 3 and the second groove 4 are etched to the first buffer layer 121 and the substrate 11, and the depth of the first groove 3 and the second groove 4 is ensured, so as to further ensure the packaging effect and avoid overflow of organic materials. Among them, since the etching depth through the interlayer dielectric layer 124 is limited, the first buffer layer 121 and the substrate 11 cannot be etched through the interlayer dielectric layer 124, so other methods need to be used for etching, for example, etching using IGZO connection holes, wherein the IGZO connection holes are holes connecting the IGZO (Indium Gallium Zinc Oxide) layer and the TFT (ThinFilm Transistor).

[0079] In one embodiment, the dam 2 includes a plurality of stacked organic layers, wherein the organic dam can cooperate with the inorganic encapsulation layer to block the intrusion of external factors such as water vapor and oxygen, thereby improving the stability and life of the display panel.

[0080] Preferably, along the direction from the display area 101 to the non-display area 102 , the number of the dam 2 is one, and a smaller number of dams 2 is conducive to achieving a narrow frame.

[0081] Reference Figure 8 As shown, in one embodiment, the dam 2 includes a planarization layer 21 and a pixel definition layer 22, the planarization layer 21 is located on the side of the inorganic layer 12 away from the substrate 11, and the pixel definition layer 22 is located on the side of the planarization layer 21 away from the substrate 11, wherein the planarization layer 21 and the pixel definition layer 22 are stacked to form the dam 2, which is beneficial to accurately divide the position and boundary of each pixel, thereby ensuring the clarity and accuracy of the displayed image.

[0082] Preferably, the dam 2 further includes a spacer 23, and the spacer 23 is located on a side of the pixel definition layer 22 away from the substrate 11. The spacer 23 is used to support the evaporation mask.

[0083] Reference Fig. 9 As shown, in one embodiment, the planarization layer 21 includes a first planarization layer 211 and a second planarization layer 212. The first planarization layer 211 is located on the side of the inorganic layer 12 away from the substrate 11, and the second planarization layer 212 is located on the side of the first planarization layer 211 away from the substrate 11, which is conducive to forming slopes on both sides of the dam 2 and ensuring flatness.

[0084] Reference Fig.10 As shown, in one embodiment, the display panel 100 also includes a first metal wire 13, and the first groove 3 is formed by the surface of the first metal wire 13 away from the substrate 11 and the side wall of part of the inorganic layer 12 facing the first groove 3. The display panel 100 also includes a second metal wire 1281, the second metal wire 1281 is located on the side of the first metal wire 13 away from the substrate 11, the second metal wire 1281 is partially located in the first groove 3, and overlaps with the first metal wire 13 at the position of the first groove 3; the first metal wire 13 and the second metal wire 1281 are used to transmit the first power signal. Among them, the first metal wire 13 is a shielding structure, and the first metal wire 13 is used to carry the first power signal, which can effectively avoid the problem of the first power line being too narrow after the frame is narrowed. Preferably, the first power signal is an ELVSS signal.

[0085] The display panel 100 further includes a third metal line 1282 and a fourth metal line 1283. Different metal lines may be located in different metal layers. Preferably, the third metal line 1282 and the fourth metal line 1283 are partially located in the first groove 3 and overlap with the first metal line 13 and the second metal line 1281 at the position of the first groove 3.

[0086] Reference Fig.11 As shown, another embodiment of the present application discloses a method for manufacturing a display panel 100, wherein the display panel 100 includes a display area 101 and a non-display area 102, and the method includes the following steps:

[0087] Step S10, forming an inorganic layer 12 on one side of the substrate 11; Fig.12 shown.

[0088] Step S20, forming a first groove 3 and a second groove 4 in the non-display area 102; wherein the first groove 3 and the second groove 4 are at least partially located in the inorganic layer 12, and the first groove 3 is located between the second groove 4 and the display area 101; Fig.13 shown.

[0089] Step S30, forming a dam 2 on the side of the inorganic layer 12 away from the substrate 11; wherein the dam 2 is located between the first groove 3 and the second groove 4; Fig.14 shown.

[0090] Step S40, forming an encapsulation layer 5 on one side of the substrate 11, the encapsulation layer 5 is located in the display area 101 and the non-display area 102, and the encapsulation layer 5 covers the inorganic layer 12, the dam 2, the first groove 3 and the second groove 4; Figure 3 shown.

[0091] The method for preparing the display panel 100 provided in the embodiment of the present application can effectively reduce the number of dams 2 and thus achieve a narrow frame by setting a first groove 3 on the side of the dam 2 close to the display area 101, setting a second groove 4 on the side of the dam 2 away from the display area 101, and covering them with an encapsulation layer 5; at the same time, the first groove 3 can reduce the risk of overflow of organic materials in the encapsulation layer 5, and the second groove 4 can store the overflowed organic material, and encapsulate the overflowed organic material in the second groove 4, thereby improving the encapsulation reliability.

[0092] Please continue to refer to Figure 4 As shown, in one embodiment, in step S20, the first groove 3 penetrates the inorganic layer 12 and is partially located at the substrate 11 or the second groove 4 penetrates the inorganic layer 12 and is partially located at the substrate 11, which can effectively ensure the depth of the first groove 3 or the second groove 4, thereby ensuring the encapsulation effect and avoiding overflow of organic materials. In another embodiment, the first groove 3 penetrates the inorganic layer 12 and is partially located at the substrate 11 and the second groove 4 penetrates the inorganic layer 12 and is partially located at the substrate 11, while ensuring the depth of the first groove 3 and the second groove 4, further ensuring the encapsulation effect and avoiding overflow of organic materials.

[0093] Please continue to refer to Figure 8 As shown, in one embodiment, in step S30, the dam 2 includes a planarization layer 21 and a pixel definition layer 22, the planarization layer 21 is located on the side of the inorganic layer 12 away from the substrate 11, and the pixel definition layer 22 is located on the side of the planarization layer 21 away from the substrate 11, wherein the planarization layer 21 and the pixel definition layer 22 are stacked to form the dam 2, which is beneficial to accurately divide the position and boundary of each pixel, thereby ensuring the clarity and accuracy of the displayed image.

[0094] Preferably, the dam 2 further includes a spacer 23, and the spacer 23 is located on a side of the pixel definition layer 22 away from the substrate 11. The spacer 23 is used to support the evaporation mask.

[0095] Please continue to refer to Fig.10 As shown, in one embodiment, step S10 includes:

[0096] Step S11, forming a first metal line 13 on one side of the substrate 11;

[0097] Step S12 , forming an inorganic layer 12 on a side of the first metal wire 13 away from the substrate 11 and on a region of the substrate 11 not covered by the first metal wire 13 .

[0098] The first groove 3 is formed by the surface of the first metal wire 13 away from the substrate 11 and the side wall of part of the inorganic layer 12 facing the first groove 3; the display panel 100 also includes a second metal wire 1281, the second metal wire 1281 is located on the side of the first metal wire 13 away from the substrate 11, the second metal wire 1281 is partially located in the first groove 3, and is electrically connected to the first metal wire 13, and the first metal wire 13 and the second metal wire 1281 are used to transmit the first power signal. The first metal wire 13 is a shielding structure, and the first metal wire 13 is used to carry the first power signal, which can effectively avoid the problem of the first power line being too narrow after the frame is narrowed. Preferably, the first power signal is a negative power signal, that is, an ELVSS signal.

[0099] Another embodiment of the present application discloses a display device, which includes the display panel in the above embodiment. The display device can be on a smart device (such as a mobile phone, VR device, computer, TV, car display, etc.).

[0100] The display device provided in this embodiment, in which the display panel 100, can effectively reduce the number of dams 2 and thus achieve a narrow frame by setting a first groove 3 on the side of the dam 2 close to the display area 101, setting a second groove 4 on the side of the dam 2 away from the display area 101, and covering it with an encapsulation layer 5; at the same time, the first groove 3 can reduce the risk of overflow of organic materials in the encapsulation layer 5, and the second groove 4 can store the overflowed organic material, and encapsulate the overflowed organic material in the second groove 4, thereby improving the encapsulation reliability and improving the performance of the display device.

[0101] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0102] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area, and further includes: substrate; an inorganic layer located on one side of the substrate; A dam, located in the non-display area and disposed on a side of the inorganic layer away from the substrate; A first groove is located in the non-display area and is disposed on a side of the dam close to the display area, and at least a portion of the first groove is located in the inorganic layer; A second groove is located in the non-display area and is disposed on a side of the dam away from the display area, and at least a portion of the second groove is located in the inorganic layer; An encapsulation layer is located in the display area and the non-display area, and at least a portion of the encapsulation layer covers the inorganic layer, the dam, the first groove, and the second groove.

2. The display panel according to claim 1, wherein: The first groove penetrates the inorganic layer and is partially located in the substrate; and / or The second groove penetrates the inorganic layer and is partially located in the substrate.

3. The display panel according to claim 1, wherein: The inorganic layer includes a plurality of insulating layers, wherein the plurality of insulating layers include a first buffer layer, a first gate dielectric layer, a capacitor dielectric layer and an interlayer dielectric layer which are sequentially arranged away from the substrate; The first groove penetrates the first gate dielectric layer and the capacitor dielectric layer, and the second groove penetrates the first gate dielectric layer and the capacitor dielectric layer; Preferably, the plurality of insulating layers further include a second buffer layer and a second gate dielectric layer sequentially arranged away from the substrate, and the second buffer layer and the second gate dielectric layer are located between the capacitor dielectric layer and the interlayer dielectric layer, the first groove penetrates the second buffer layer and the second gate dielectric layer, and the second groove penetrates the second buffer layer and the second gate dielectric layer; Preferably, the substrate comprises a first flexible substrate, a second flexible substrate, and a first barrier layer located between the first flexible substrate and the second flexible substrate; Preferably, the inorganic layer further includes a second barrier layer located between the first buffer layer and the substrate.

4. The display panel according to claim 1, wherein: The dam comprises a plurality of organic layers arranged in a stacked manner; Preferably, along the direction from the display area to the non-display area, the number of the dam is one.

5. The display panel according to claim 1, wherein: The encapsulation layer comprises a first encapsulation layer, a second encapsulation layer and a third encapsulation layer, the first encapsulation layer covers the inorganic layer, the dam, the first groove and the second groove, the second encapsulation layer is located on a side of the first encapsulation layer away from the substrate and the second encapsulation layer fills the first groove, and the third encapsulation layer is located on a side of the second encapsulation layer away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials.

6. The display panel according to claim 5, wherein: The first encapsulation layer covers the sidewalls and the bottom wall of the first groove, and the first encapsulation layer covers the sidewalls and the bottom wall of the second groove.

7. The display panel according to claim 1, wherein: The dam comprises: A planarization layer, located on a side of the inorganic layer away from the substrate; A pixel definition layer, located on a side of the planarization layer away from the substrate; Preferably, the dam further comprises: a spacer, located on a side of the pixel definition layer away from the substrate; Preferably, the planarization layer comprises a first planarization layer and a second planarization layer, the first planarization layer is located on a side of the inorganic layer away from the substrate, and the second planarization layer is located on a side of the first planarization layer away from the substrate.

8. The display panel according to claim 1, wherein: The display panel further includes a first metal line, wherein the first groove is formed by a surface of the first metal line away from the substrate and a side wall of a portion of the inorganic layer facing the first groove; The display panel further includes a second metal line, the second metal line is located at a side of the first metal line away from the substrate, a portion of the second metal line is located in the first groove, and overlaps with the first metal line at the first groove; The first metal wire and the second metal wire are used to transmit a power signal.

9. A method for preparing a display panel, the display panel comprising a display area and a non-display area, characterized in that: The method comprises: forming an inorganic layer on one side of the substrate; Forming a first groove and a second groove in the non-display area; wherein the first groove and the second groove are at least partially located in the inorganic layer, and the first groove is located between the second groove and the display area; A dam is formed on a side of the inorganic layer away from the substrate; wherein the dam is located between the first groove and the second groove; An encapsulation layer is formed on one side of the substrate, the encapsulation layer is located in the display area and the non-display area, and the encapsulation layer covers the inorganic layer, the dam, the first groove and the second groove.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 8.

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