Array element leading structure, acoustic head and ultrasonic probe of ultrasonic probe

Abstract

An array element leading-out structure of an ultrasonic probe, a sound head, and an ultrasonic probe, in which each pair of second leading-out pieces are electrically connected through a connecting portion, and in a reference plane perpendicular to a third direction, a first gap between sub-arrays and a normal projection of the connecting portion on the reference plane at least partially overlap, so that the area (referred to as the conductive switching area) of the sub-electric switching piece for setting the first conductive switching portion accounts for a larger proportion, that is, compared with the existing structure, the electric switching piece shown in the embodiment has a wider conductive switching area under the same width condition, which can avoid cutting the first conductive switching portion of the electric switching piece when cutting the sub-array, and can also enable the electric switching piece to meet the leading-out requirements of a sub-array with a smaller width, and further enable more array elements to be arranged in the same width array element layer.

Description

Technical Field

[0001] This application relates to ultrasonic probes, specifically to the array element lead-out structure, acoustic head, and ultrasonic probe of an ultrasonic probe. Background Technology

[0002] In ultrasonic transducers, the positive electrode lead-out of a single element of the acoustic head requires the use of a flexible printed circuit board (FPC). For example, in a multi-dimensional array transducer, it typically has an element layer (a piezoelectric material layer or wafer layer) and a flexible printed circuit board. The element layer usually has multiple elements arranged in an array, and the flexible printed circuit board has a transition layer (or large gold surface) and a lead-out assembly (or wiring layer). The transition layer has multiple electrical adapters, which correspond one-to-one with the elements. The upper part of the electrical adapter is electrically contacted with the positive electrode of the corresponding subarray, and the lower part is electrically connected to the corresponding lead-out in the lead-out assembly through conductive vias, thereby leading out the positive electrode of the element through the lead-out below the electrical adapter.

[0003] To improve the performance of the ultrasonic transducer, each element can be further divided into at least two subarrays, with a first gap between them. Typically, during subarray fabrication, piezoelectric material is first applied to the transition layer of the flexible circuit board. Then, the piezoelectric material, along with the transition layer, is cut using equipment to form array elements and corresponding electrical transducers. This process is repeated to further cut the array elements and corresponding electrical transducers, thus forming separated subarrays and corresponding sub-electrical transducers.

[0004] With the development of high-resolution transducers, a greater number of array elements are needed within the same element layer, leading to a gradual reduction in the size of individual elements. This is especially true when an element has two subarrays, where the width of a single subarray in the direction perpendicular to the first gap extension is even narrower. This also results in a narrower width for the corresponding electrical transition components, further limiting the width of the conductive transition area on the electrical transition components. Furthermore, due to manufacturing limitations, the diameter of conductive vias cannot be further reduced after reaching its limit. If the width of the conductive transition area on the electrical transition component is smaller than the requirement for the via, it is very easy to cut into the conductive via, causing electrical connection failure. Therefore, once the number of array elements in a multi-dimensional array transducer reaches its limit, it is impossible to further reduce the element width, making it difficult to design a larger number of array elements and thus hindering the advancement of multi-dimensional array transducers.

[0005] Application content

[0006] This application mainly provides an array element lead-out structure, a sound head, and an ultrasonic probe to demonstrate a new array element lead-out structure.

[0007] To achieve the above objectives, one embodiment of this application provides an array element lead-out structure for an ultrasonic probe, comprising:

[0008] The array element layer has multiple array element groups arranged along a first direction, and each array element group has n array elements arranged along a second direction, where n is an odd number greater than or equal to 3; the array elements are divided into at least two subarrays by a first gap; wherein the array elements in each array element group are at least divided into a first array element located in the middle position and at least a pair of second array elements, and each pair of second array elements is arranged opposite to each other on both sides of the first array element in the second direction;

[0009] And a flexible circuit board having a transition layer and lead-out components, wherein the array element layer, the transition layer and the lead-out components are arranged along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other;

[0010] The transition layer has multiple electrical transition component groups arranged along a first direction, and each electrical transition component group has multiple electrical transition components arranged along a second direction. Each electrical transition component group has electrical transition components that are in contact with and electrically connected to the positive electrode of the corresponding array element in the array element group.

[0011] The lead-out assembly has multiple lead-out groups arranged along a first direction. Each lead-out group has multiple leads. Each lead-out includes at least a first lead and at least a pair of second leads. The first lead is electrically connected to a corresponding first array element via a corresponding electrical adapter. Each pair of second leads is electrically connected to a pair of second array elements via a corresponding electrical adapter. The leads are used to be electrically connected to the positive signal circuit of the control unit to input a positive signal to the corresponding array element.

[0012] The electrical adapter is provided with a first conductive adapter portion, and the lead-out portion is provided with a second conductive adapter portion. The first conductive adapter portion and the corresponding second conductive adapter portion are stacked and electrically connected in the stacking direction to electrically connect the electrical adapter portion to the corresponding lead-out portion. Each pair of second leads-out portions are electrically connected through a connecting portion. On a reference plane perpendicular to the third direction, the orthographic projection of the first gap and the orthographic projection of the connecting portion at least partially overlap. The orthographic projections of the second conductive adapter portion on the first lead-out portion and the corresponding first conductive adapter portion on the reference plane are distributed on both sides of the orthographic projection of the connecting portion.

[0013] In one embodiment, at least one other lead is provided between at least one pair of second leads, the other lead including the first lead, the first adapter lead and / or the second adapter lead, the other lead having a second gap, and the connecting portion passing through the corresponding second gap.

[0014] In one embodiment, the orthographic projection of the first gap onto the reference surface in the first direction does not exceed the orthographic projection of the second gap onto the reference surface.

[0015] In one embodiment, the positional difference between each pair of second array elements and the first array element is the same.

[0016] In one embodiment, n equals 3, and the electrical adapter group consists of at least a first electrical adapter and a pair of second electrical adapters disposed on both sides of the first electrical adapter. The first electrical adapter and the second electrical adapter are respectively in contact with and electrically connected to the positive terminals of the corresponding first array element and the second array element. The lead-out group consists of at least a first lead-out and a pair of second lead-outs located on both sides of the first lead-out. The first lead-out and the second lead-out are electrically connected to the corresponding first electrical adapter and the second electrical adapter.

[0017] In one embodiment, the first electrical adapter and the second electrical adapter have conductive contact areas that contact the corresponding subarray; in one group of electrical adapters, at least one of the second electrical adapters has a first extension portion located outside its conductive contact area, the first extension portion being electrically connected to the corresponding conductive contact area; in the second electrical adapter having the first extension portion, its first extension portion is provided with a first conductive adapter portion.

[0018] In one embodiment, the first electrical adapter and the second electrical adapter are divided into a plurality of sub-electrical adapters, each of which corresponds one-to-one with the sub-array, and each sub-electrical adapter has the conductive contact area.

[0019] In one embodiment, the first lead and the second lead are provided with a second conductive transition portion, and the second conductive transition portion is electrically connected to the corresponding first conductive transition portion; wherein, at least one of the second leads has a second extension portion corresponding to the first extension portion; in the second lead with the second extension portion, the second extension portion is provided with the second conductive transition portion.

[0020] In one embodiment, the first epitaxial portion and the second epitaxial portion are bent in a direction away from the array element layer.

[0021] In one embodiment, the second epitaxial portion has an external electrical connection structure for electrical connection with the positive signal circuit.

[0022] In one embodiment, the first lead has at least two first sub-leads with a second gap between them, and the connecting portion passes through the second gap; the first sub-lead has a third extension, and the third extension of each first sub-lead extends from the side of the second lead to the end of the second extension and is electrically connected to each other to form an external electrical connection structure, the external electrical connection structure being used to electrically connect to the positive signal circuit.

[0023] In one embodiment, there are two first sub-leads, and the two first sub-leads are symmetrical about the second gap.

[0024] In one embodiment, in the lead group, at least one lead is a first adapter lead, the first adapter lead is disposed on the side of the first lead opposite to the first electrical adapter and is electrically connected to the first lead, the first adapter lead and the second lead respectively have an external electrical connection structure, the external electrical connection structure is used to be electrically connected to the positive signal circuit.

[0025] In one embodiment, n is greater than or equal to 5, and each electrical adapter group corresponds one-to-one with an array element of an array element group; the leads in the lead group are arranged in at least m layers along the third direction, where m = (n+1) / 2; the lead layer closest to the electrical adapter group is the first layer, and the lead layer furthest from the electrical adapter group is the m-th layer;

[0026] The first layer of the lead-out component has a first lead-out component, which is electrically connected to the corresponding electrical adapter component;

[0027] In layers 1 to (m-1), each lead-out has a pair of second leads, and the second leads of the first layer lead-out are electrically connected to the first conductive connection part of the corresponding electrical adapter; in layers 2 to (m-1), the second leads in each layer are electrically connected to the corresponding electrical adapter through the second adapter lead-out of the previous layer.

[0028] In layers 2 to m, each layer of the lead-out has a first adapter lead-out, which is electrically connected to each first adapter lead-out in the lower layer. At least one second lead-out and at least one first adapter lead-out in each pair of second leads-outs can be electrically connected to the positive signal circuit.

[0029] In one embodiment, in at least one layer of leads, a connection between a pair of second leads passes through a second gap between the first lead and / or the first adapter lead.

[0030] In one embodiment, in at least one lead-out layer, the second lead-out layer has a second extension portion, the outer end of the second extension portion is located outside the array element layer, and the outer end is provided with the electrical external connection structure.

[0031] In one embodiment, in at least one layer of leads, at least one pair of second transition leads are disposed opposite to each other on both sides of a pair of second leads, and the second extension of the second lead passes through the corresponding second transition lead and extends beyond the array element layer.

[0032] In one embodiment, in at least one lead-out layer, the second adapter lead-out layer has a fourth extension portion located outside the array element layer, and the fourth extension portion is provided with the electrical external connection structure.

[0033] In one embodiment, n = 5, and the array element group has one first array element and two pairs of second array elements;

[0034] The m=3, the first layer of the lead-out has a first lead-out, a pair of second leads, and a pair of second transition leads. The pair of second leads are disposed opposite to each other on both sides of the first lead-out, and the second transition leads are disposed opposite to each other on both sides of the pair of second leads. The second lead-out and the second transition leads are respectively electrically connected to a corresponding second array element.

[0035] The second layer lead has a first adapter lead and a pair of second leads, the second leads being electrically connected to the second adapter lead of the first layer, so as to be electrically connected to the corresponding second array element through the second adapter lead;

[0036] The third layer lead has a first adapter lead, which is electrically connected to the first adapter lead of the second layer, and the first adapter lead of the third layer has the aforementioned external electrical connection structure.

[0037] In one embodiment, a first insulating layer is provided between the adapter layer and the lead-out component;

[0038] And / or, a second insulating layer is provided between the lead-out elements of the lead-out assembly.

[0039] In one embodiment, a negative lead-out structure is further included, which is electrically connected to the negative terminal of the array element. The negative lead-out structure is used to electrically connect the negative terminal of the array element to the negative signal circuit of the control unit.

[0040] In one embodiment, in the array element group, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.4 mm, and the width of a single subarray in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm; or, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.33 mm, and the width of a single subarray in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.14 mm.

[0041] To achieve the above objectives, one embodiment of this application provides an ultrasonic probe head, including a backing, a matching layer, a lens, and an array element lead-out structure as shown in any of the above claims. The flexible circuit board is disposed on the backing, the matching layer is located on the array element layer, and the lens is disposed on the matching layer.

[0042] To achieve the above objectives, one embodiment of this application provides an ultrasonic probe, including a sound head, the sound head having an array element lead-out structure as shown above.

[0043] According to the array element lead-out structure of the above embodiment, each pair of second leads is electrically connected by a connecting portion. On a projection plane perpendicular to a third direction, the orthographic projection of the first gap between subarrays at least partially overlaps with the orthographic projection of the connecting portion. Since the area opposite the electrical adapter to the corresponding first gap is usually an area where the first conductive adapter (such as a conductive via) is not provided, by forming a correspondence between the connecting portion and this area at least partially, the area on the sub-electrical adapter used to provide the first conductive adapter (referred to as the conductive adapter area) can account for a larger proportion. That is, compared with the existing structure, under the same width conditions, the electrical adapter shown in this embodiment has a wider conductive adapter area. This can avoid cutting the first conductive adapter of the electrical adapter when cutting and manufacturing the subarray, and also enable the electrical adapter to meet the lead-out requirements of subarrays with smaller widths, thereby setting more array elements in an array element layer of the same width. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the external structure of the sound head in one embodiment of this application;

[0045] Figure 2 This is a cross-sectional schematic diagram of a sound head in one embodiment of this application;

[0046] Figure 3 This is an exploded schematic diagram of the array layer, transition layer and lead-out component in the stacking direction in one embodiment of this application. The figure shows the insulating substrate layer in the flexible circuit board.

[0047] Figure 4This is a schematic diagram of the structure of the array element layer, the transition layer and the lead-out component in one embodiment of this application. In order to facilitate the observation of the correspondence between the transition layer and the lead-out component, the insulating substrate layer is omitted in the figure.

[0048] Figure 5 This is an exploded view of the array element layer and the transition layer in one embodiment of this application, with the insulating substrate layer omitted in the figure;

[0049] Figure 6 This is a schematic diagram showing the distribution of the outgoing components in one embodiment of this application;

[0050] Figure 7 This is a schematic diagram of the structure of the array element layer, the transition layer and the lead-out component in one embodiment of this application. In order to facilitate the observation of the correspondence between the array element layer, the transition layer and the lead-out component, the insulating substrate layer is omitted in the figure.

[0051] Figure 8 This is a side view of the structure of the array layer, the transition layer, and the lead-out component in one embodiment of this application;

[0052] Figure 9 This is an exploded schematic diagram of the array element layer, the transition layer and the lead-out component in the stacking direction in one embodiment of this application. The insulating substrate layer is omitted in the figure.

[0053] Figure 10 A schematic diagram of the structure of the first layer lead-out element in one embodiment is provided.

[0054] Figure 11 A schematic diagram of the structure of the second layer lead-out element in one embodiment is provided.

[0055] Figure 12 A schematic diagram of the structure of the third layer lead-out element in one embodiment is provided.

[0056] Figure 13 and 14 This is a schematic diagram of the structure of an array element negative electrode led out by copper foil in one embodiment of this application, viewed from two different perspectives.

[0057] Figure 15 and 16 This is a schematic diagram of the structure of an array element negative electrode led out by copper foil in one embodiment of this application, viewed from two different perspectives.

[0058] Figure 17 This is a schematic diagram of the structure in one embodiment of this application when the negative electrode of the array element is led out through a conductive layer;

[0059] Figure 18 This is a schematic diagram of one embodiment where the connection between the second leads passes through the side of the first lead;

[0060] Figure 19This is a cross-sectional schematic diagram of the array element layer, transition layer and lead-out component in a cooperative state in one embodiment of this application. Detailed Implementation

[0061] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0062] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0063] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0064] This application provides an ultrasonic probe that can be used in various ultrasonic devices. Please refer to [link / reference]. Figure 1 and 2 In some embodiments, the ultrasonic probe has an acoustic head 1 and a main control unit (not shown in the figure). The acoustic head 1 is mainly used to transmit ultrasonic signals to the subject and receive reflected ultrasonic signals. The main control unit is electrically connected to the acoustic head 1 and is used to control the signal transmission and reception of the acoustic head 1.

[0065] Please refer to Figure 1 and 2In some embodiments, the acoustic probe 1 includes a lens 100, a matching layer 200, an array element layer 300, a flexible circuit board 400, and a backing layer 500, which are stacked together. The array element layer 300 can be used to transmit and receive ultrasonic signals. The matching layer 200 is an acoustic material layer laid on the radiating surface of the array element layer 300 to achieve acoustic impedance matching between the array element layer 300 and the sound transmission medium, allowing sound energy to pass through well. The lens 100 can contact the object being detected and transmit ultrasonic signal waves. The backing layer 500 can absorb unwanted sound waves radiated from the back of the array element layer 300 and also serves as a support structure for other components of the acoustic probe 1. Apart from the improved structure described in this embodiment, other structures of the acoustic probe 1 can refer to various existing ultrasonic probes, and will not be described in further detail here.

[0066] The main control unit needs to be electrically connected to the array elements in the sound head 1 to transmit electrical signals, such as sending excitation signals to the array elements and receiving signals collected by the array elements. The main control unit can employ various main control circuits capable of controlling the sound head 1. These main control circuits can be mounted on one or more control circuit boards, such as PCB boards or FPCB boards. Typically, the main control unit is separate from the sound head 1. The sound head 1 brings out its internal array elements through corresponding array element lead-out structures and electrically connects them to the main control unit. The main control unit has a positive signal circuit and a negative signal circuit. The positive signal circuit is used to electrically connect to the external electrical connection structure in the array element lead-out structure used for positive lead-out, and the negative signal circuit is used to electrically connect to the external electrical connection structure in the array element lead-out structure used for negative lead-out.

[0067] This array element extraction structure is used to extract the positive and negative poles of the array elements. Please refer to [reference needed]. Figure 2-4 as well as Figure 7-9 In some embodiments, the array element lead-out structure includes an array element layer 300 and a flexible circuit board 400.

[0068] Please refer to Figure 3 In some embodiments, the array element layer 300 has a plurality of array element groups 301 arranged along a first direction. Specifically, please refer to... Figure 3 and 7 In some embodiments, array elements located in the same column in the second direction are referred to as a group of array elements 301. The number of array elements 301 can be set according to the actual functions and effects required to be achieved by the sound head 1.

[0069] The array element group 301 has n array elements arranged along the second direction. The number of n varies in the acoustic head 1 of different types of ultrasonic probes. For example, in some embodiments, the acoustic head 1 is a multidimensional ultrasonic probe, where n is an odd number greater than or equal to 3. Please refer to... Figure 3 and 9 In some embodiments, the array elements in the array element group 301 are at least divided into a first array element 310 located in the middle position and at least a pair of second array elements 320. Each pair of second array elements 320 is arranged opposite to each other on both sides of the first array element 310 in a second direction. Typically, the positive terminals of each pair of second array elements 320 are electrically connected together and electrically connected to the main control unit as a whole. Depending on different needs and functions, in the sound head 1 of different embodiments, each array element group 301 may have one or more pairs of second array elements 320, wherein the size, shape, or dimensions of each second array element in each pair of second array elements may be the same or different.

[0070] Please refer to Figure 3 In one embodiment, n equals 3, meaning that the array element group 301 has 3 array elements arranged along the second direction. Each array element group 301 has a pair of second array elements 320, which are located on both sides of the first array element 310 in the second direction.

[0071] In other embodiments, n is greater than or equal to 5, meaning that array element group 301 has 5 or more array elements (such as 310, 320) arranged along the second direction. When each array element group 301 has two or more pairs of second array elements 320, the positional difference between each pair of second array elements 320 and the first array element 310 is the same. This same positional difference between each pair of second array elements 320 and the first array element 310 means that, taking the first array element 310 as the reference position, calculating from the first array element 310 along the second direction to both sides, the two second array elements 320 in the same pair have the same positional distance from the first array element 310. For example, please refer to... Figure 7 and 9 In one embodiment, the array element group 301 has five array elements arranged along the second direction. The array element located in the middle is the first array element 310, and the four array elements located on either side of the first array element 310 are divided into two groups. For details, please refer to... Figure 7 Along the second direction from left to right in the diagram, the array elements of the same array element group 301 are divided into positions 1, 2, 3, 4, and 5. The third array element is the first array element 310. The second and fourth array elements are 1 position away from the first array element 310, and the two of them form a pair of second array elements 320. The first and fifth array elements are 2 position away from the first array element 310, and the two of them form a pair of second array elements 320.

[0072] Of course, in some embodiments, the position difference between the second array element 320 and the first array element 310 in the same group may also be different.

[0073] To improve the performance of the ultrasonic transducer, each array element is divided into at least two subarrays by a first gap 303, which can be cut using corresponding manufacturing equipment. Alternatively, in other embodiments, these subarrays can be fabricated individually and then arranged to form the first gap 303. Please refer to [reference needed]. Figure 3 and 7 In some embodiments, each array element has two subarrays 302. However, in other embodiments, each array element may have three or more subarrays 302.

[0074] To facilitate electrical connection between the positive terminal of each subarray 302 and the main control unit, please refer to... Figure 3 and 9 The flexible circuit board 400 has an adapter layer 410 and a lead-out assembly 420. An insulating substrate layer is disposed between the adapter layer 410 and the lead-out assembly 420. Figure 9 To more easily illustrate the correspondence between the transition layer 410 and the lead-out assembly 420, the insulating substrate layer is omitted. The transition layer 410 and the lead-out assembly 420 can be disposed on the corresponding insulating substrate layer by printing, coating, or other processes. The insulating substrate layer provides support and insulation for the transition layer 410 and the lead-out assembly 420. The insulating substrate layer between the transition layer 410 and the lead-out assembly 420 is the first insulating layer 430. When the lead-out assembly 420 has at least two lead-out layers, each lead-out layer can be disposed on the corresponding insulating substrate layer, and adjacent lead-out layers are insulated and separated by the corresponding insulating substrate layer. The insulating substrate layer between the lead-out layers of the lead-out assembly 420 is the second insulating layer 440.

[0075] Furthermore, the array element layer 300, the transition layer 410, and the lead-out component 420 are arranged along a third direction, as detailed below. Figure 3 , 7 In some embodiments, the first direction, the second direction, and the third direction are mutually perpendicular. Here, the third direction refers only to the stacking direction between the element layer 300, the transition layer 410, and the lead-out component 420, but does not limit the element layer 300, the transition layer 410, and the lead-out component 420 to be arranged perpendicular to the third direction (i.e., the plane formed by the first and second directions). For example, in... Figure 3 In the illustrated embodiment, after the transition layer 410 and the lead-out component 420 extend in a direction perpendicular to the third direction, a portion of them may also be bent along the third direction. Alternatively, in Figure 9 In the illustrated embodiment, after the lead-out component 420 extends in a direction perpendicular to the third direction, a portion of it may also be bent in the third direction.

[0076] Please refer to Figure 3 as well as Figure 9In some embodiments, the transition layer 410 has a plurality of electrical adapter groups 401 arranged along a first direction. One electrical adapter group 401 is disposed opposite to a corresponding array element group 301. Each electrical adapter group 401 has a plurality of electrical adapters (e.g., 411, 412) arranged along a second direction, their arrangement direction being consistent with the array element arrangement direction in the same array element group 301. Each electrical adapter in each electrical adapter group 401 contacts and is electrically connected to the positive electrode of an array element in the corresponding array element group 301. The electrical adapter is made of a conductive material, such as a metal surface printed, coated, or formed on a corresponding insulating substrate layer through other processes. The electrical adapter is directly attached to the corresponding array element to achieve a conductive connection. Of course, other methods in the prior art can also be used to achieve a conductive connection between the electrical adapter and the corresponding array element.

[0077] Please refer to Figure 3 as well as Figure 9 In some embodiments, to correspond to subarray 302, the electrical adapter may have multiple sub-electrical adapters 413. Each sub-electrical adapter 413 corresponds one-to-one with a subarray 302, and each sub-electrical adapter 413 has a conductive contact area, which makes conductive contact with the positive electrode of the corresponding subarray 302. "Multiple" refers to two or more; please refer to [reference needed]. Figure 3 as well as Figure 9 In some embodiments, each electrical adapter has two sub-electrical adapters 413, and adjacent sub-electrical adapters 413 may be separated by a third gap 415, which may or may not penetrate the electrical adapter.

[0078] Please refer to Figure 3-6 as well as Figure 7-12 In some embodiments, the lead-out assembly 420 has multiple lead-out groups 402 arranged along a first direction. Each lead-out group 402 has multiple leads (such as 421, 422, 428, 429, etc.), which can be arranged in one layer or multiple layers. Within the same lead-out group 402, the lead-out is at least divided into a first lead-out 421 and at least one pair of second leads 422. The first lead-out 421 is electrically connected to a corresponding first array element 310 via a corresponding electrical adapter, and each pair of second leads 422 is electrically connected to a pair of second array elements 320 via corresponding electrical adapters. The lead-out is used to electrically connect to the positive signal circuit of the main control unit to input a positive signal to the corresponding array element.

[0079] Please refer to the following: Figure 3-6 as well as Figure 7-12 In some embodiments, the electrical adapter has a first conductive adapter portion 414, and the lead-out portion has a second conductive adapter portion 423. The first conductive adapter portion 414 and the corresponding second conductive adapter portion 423 are stacked and aligned in the stacking direction and electrically connected to connect the electrical adapter to the corresponding lead-out portion. Please refer to... Figure 3 A third conductive transition portion 431 can also be provided on the corresponding insulating substrate layer to realize the electrical connection between the first conductive transition portion 414 and the second conductive transition portion 423, as well as the electrical connection between the second conductive transition portions 423 in different layer lead-out members. Depending on the location of the first conductive transition portion 414 and the second conductive transition portion 423, their stacking direction is also different, for example, in... Figure 9 In the illustrated embodiment, the first conductive transition portion 414 and the second conductive transition portion 423 are stacked along a third direction. Figure 3 In the embodiment shown, a portion of the first conductive adapter 414 and the second conductive adapter 423 are stacked along a third direction, and a portion of the first conductive adapter 414 and the second conductive adapter 423 are stacked along a second direction.

[0080] exist Figure 3 and 9 In the illustrated embodiment, the first conductive adapter 414, the second conductive adapter 423, and the third conductive adapter 431 are conductive vias. These vias are coaxially arranged and conductive connections are achieved by filling them with conductive material. Of course, in other embodiments, the first conductive adapter 414, the second conductive adapter 423, and the third conductive adapter 431 can also employ other structures capable of achieving conductivity between stacked objects. For example, the first conductive adapter 414, the second conductive adapter 423, and the third conductive adapter 431 can be columnar conductive structures.

[0081] To achieve the goal of connecting the positive electrodes of the same pair of second array elements 320 into a single unit, please refer to... Figure 6 and 9 In some embodiments, each pair of second leads 422 is electrically connected via a connecting portion 424. At least one other lead is spaced between at least one pair of second leads 422. Depending on the number of lead layers and the number of leads, this other lead may include a first lead 421, a first adapter lead 428, and / or a second adapter lead 429. For example, please refer to... Figure 6 In this embodiment, a first lead-out 421 is provided between the pair of second leads 422, and the connecting portion 424 between the pair of second leads 422 passes through the first lead-out 421. In other embodiments, other pairs of second leads 422, first adapter leads 428, and / or second adapter leads 429 (the first adapter leads 428 and / or second adapter leads 429 will be described in detail later) may also be provided between the pair of second leads 422, and the connecting portion 424 between the pair of second leads 422 passes through these other leads. For example, please refer to... Figure 9In some embodiments, a first lead-out 421, a first transition lead-out 428, and / or a second transition lead-out 429 may be provided between a pair of second leads 422.

[0082] In this embodiment, the area on the electrical adapter where the first conductive transition portion 414 can be effectively disposed is referred to as the conductive transition area. Please refer to... Figure 3 and Figure 19 In some embodiments, to avoid damaging the first conductive transition portion 414 when cutting the subarray 302, the conductive transition area should avoid the cutting position (i.e., the position directly opposite the first gap 303). Simultaneously, the first conductive transition portion 414 of the electrical adapter and the second conductive transition portion 423 of the corresponding lead-out need to be aligned in the stacking direction. Therefore, the first conductive transition portion 414 on the electrical adapter can only be located in the area completely overlapping with the corresponding lead-out. Thus, the position of the lead-out also affects the position and width of the conductive transition area on the electrical adapter (in this embodiment, width refers to the dimension in the first direction, length refers to the dimension in the second direction, and thickness refers to the dimension in the third direction).

[0083] To ensure reliable electrical connection between the sub-electrical adapter and its corresponding lower lead, each sub-electrical adapter has conductive vias that must avoid the cutting position (i.e., the position directly opposite the first gap) to prevent damage to the conductive vias during cutting, which would affect the electrical connection between the sub-electrical adapter and its corresponding lower lead. Simultaneously, the conductive vias of the sub-electrical adapter and its corresponding lower lead must be aligned in the stacking direction. Therefore, the conductive vias on the sub-electrical adapter can only be located in the area completely overlapping with the corresponding lower lead. In other words, the location of the first gap and the area of ​​the lower lead define the area on the sub-electrical adapter where conductive vias can be located (referred to as the conductive connection area).

[0084] Because some leads in the lead-out assembly need to bypass other leads for electrical connection, these leads are connected by connecting portions. Other leads located along the path of these connecting portions need to allow space for the connecting portions to pass through, causing these other leads to become narrower. Consequently, the conductive transition area on the corresponding sub-electrical adapter also becomes narrower. When the sub-array width is large enough, the width of this conductive transition area is much larger than the requirement for through-holes. Therefore, when cutting the sub-array, the conductive through-holes on the sub-electrical adapter can be avoided by controlling the precision of the processing technology.

[0085] However, with the development of high-resolution transducers, a larger number of array elements are needed in an array element layer of the same area, leading to a gradual reduction in the size of individual array elements. This is especially true when an array element has two subarrays, where the size (i.e., width) of a single subarray in the direction perpendicular to the first gap extension direction becomes even narrower. This also results in a narrower width for the corresponding electrical transition components, further limiting the width of the conductive transition area on the electrical transition component. Furthermore, due to the limitations of manufacturing processes, the aperture of conductive vias cannot be further reduced after reaching its limit. Once the width of the conductive transition area on the electrical transition component is smaller than the requirement for the via, it is very easy to cut into the conductive via on the electrical transition component, causing electrical connection failure. Therefore, once the number of array elements in a multi-dimensional array transducer reaches its limit, it is impossible to further reduce the array element width, making it difficult to design a larger number of array elements, thus hindering the advancement of multi-dimensional array transducers. The following section combines... Figure 18 The above-mentioned technical problems are described in order to facilitate understanding of the creative effort put into solving these technical problems using the technical solutions of this application.

[0086] Please refer to Figure 18 In some embodiments, the connection portion 424 of a pair of second leads 422 bypasses one side of the first lead 421 located in the middle. To avoid this connection portion 424, the first lead 421 is offset to one side in a first direction, causing the conductive transition area on the electrical adapter to also offset to the same side. The conductive transition area on the sub-electrical adapter 413 corresponding to the side where the connection portion 424 is located (e.g., Figure 18 As shown in the dashed box A, the first conductive transition portion 414 can only be placed within this dashed box A. The area outside dashed box A on the sub-electrical transition member 413 cannot accommodate the first conductive transition portion 414, resulting in waste. Due to process limitations, the width of the first conductive transition portion 414 cannot be further reduced after reaching its limit. When the sub-array 302 and its corresponding sub-electrical transition member 413 are sufficiently wide, it is still possible to ensure that the first conductive transition portion 414 has enough space. However, with the development of high-resolution transducers, when a larger number of sub-arrays 302 and sub-electrical transition members 413 need to be placed under the same area of ​​the element layer 300, it is difficult to guarantee that the sub-electrical transition member 413 has enough space to accommodate the first conductive transition portion 414 under the structure shown in this embodiment.

[0087] In response to the above Figure 18 For the problems arising from the illustrated embodiments, please refer to... Figure 19In some embodiments, on a reference plane perpendicular to a third direction, the orthographic projection of the first gap 303 at least partially overlaps with the orthographic projection of the connection portion 424. The areas on the electrical adapter corresponding to the first gap 303 and the areas corresponding to the connection portion 424 are areas where the first conductive connection portion 414 cannot be installed. In this embodiment, by at least partially overlapping the orthographic projection of the first gap 303 and the orthographic projection of the connection portion 424 in the width direction, the areas on the electrical adapter corresponding to the first gap 303 and the areas corresponding to the connection portion 424 at least partially coincide in the width direction. This allows for a larger proportion of the conductive connection area on the sub-electrical adapter 413, i.e., relatively... Figure 18 In the embodiment shown, under the same width conditions, the electrical adapter has a wider conductive transfer area, which can avoid cutting the first conductive transfer portion 414 of the electrical adapter when cutting and manufacturing the subarray 302, and also enable the electrical adapter to meet the lead-out requirements of the subarray 302 with a smaller width, thereby setting more array elements in the array element layer 300 with the same width.

[0088] Furthermore, in some embodiments, after adopting the structure shown in the above embodiments, in the array element group 301, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.4 mm, that is, the value range is [0.2 mm, 0.4 mm], and the width of a single subarray 302 in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm, that is, the value range is [0.07 mm, 0.17 mm]; or, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.33 mm, that is, the value range is [0.2 mm, 0.33 mm], and the width of a single subarray 302 in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.14 mm, that is, the value range is [0.07 mm, 0.14 mm]. In some embodiments, in the electrical adapter assembly 401, the width of the sub-electrical adapter 413 in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm, i.e., the value range is [0.07 mm, 0.17 mm]; or the width of the sub-electrical adapter 413 in the first direction is greater than or equal to 0.107 mm and less than or equal to 0.14 mm, i.e., the value range is [0.107 mm, 0.14 mm].

[0089] Please refer to Figure 3 , 9In some embodiments, such as 19, the orthographic projections of the second conductive transition portion 423 and the corresponding first conductive transition portion 414 on the lead-out portion between each pair of second leads 422 are distributed on both sides of the orthographic projection of the connection portion 424 of the lead-out portion, thereby ensuring a reliable electrical connection between the second conductive transition portion 423 and the corresponding first conductive transition portion 414. Simultaneously, the orthographic projections of the second conductive transition portion 423 and the corresponding first conductive transition portion 414 on the lead-out portion between each pair of second leads 422 are distributed on both sides of the orthographic projection of the first gap 303 on the electrical transition portion corresponding to the lead-out portion, to avoid cutting the corresponding first conductive transition portion 414 when cutting the first gap 303.

[0090] Furthermore, the first gap 303 is typically formed by cutting array elements. Correspondingly, the connecting portion 424 of a pair of second leads 422 usually needs to pass through the middle of other leads located between the pair of second leads 422. Therefore, please refer to... Figure 6 In some embodiments, the other lead-out typically has a second gap 425 through which the connection 424 passes.

[0091] For details, please refer to Figure 3 In some embodiments, the other lead-out is a first lead-out 421 having a second gap 425 through which a connection portion 424 of a pair of second leads 422 passes.

[0092] Please refer to Figure 9 In some embodiments, in the first layer lead-out member 420a, the other lead-out member between a pair of second lead-out members 422 is a first lead-out member 421, which has a second gap 425, and the connecting portion 424 of the pair of second lead-out members 422 passes through the second gap 425 of the first lead-out member 421. In the second layer lead-out member 420b, the other lead-out member between another pair of second lead-out members 422 is a first adapter lead-out member 428, which has a second gap 425, and the connecting portion 424 of the pair of second lead-out members 422 passes through the second gap 425 of the first adapter lead-out member 428.

[0093] Furthermore, in other embodiments, the other leads between a pair of second leads 422 may also be other second leads.

[0094] Further, please refer to Figure 19 In some embodiments, the orthographic projection of the first gap 303 onto the reference plane does not exceed the orthographic projection of the second gap 425 onto the reference plane in the first direction. That is, the first gap 303 falls within the area corresponding to the second gap 425 in the third direction, thereby maximizing the proportion of the conductive transition area on the electrical connection.

[0095] Further, please refer to Figure 3-6 In some embodiments, n equals 3, meaning each array element group 301 has 3 array elements arranged along the second direction. The electrical adapter group 401 is at least divided into a first electrical adapter 411 and a pair of second electrical adapters 412 located on either side of the first electrical adapter 411. The first electrical adapter 411 and the second electrical adapter 412 are respectively in contact with and electrically connected to the positive terminals of the corresponding first array element 310 and second array element 320. This electrical connection can be achieved through direct conductive contact or other electrical connection methods in the prior art. Correspondingly, the lead-out group 402 is at least divided into a first lead-out 421 and a pair of second lead-outs 422 located on either side of the first lead-out 421. The first lead-out 421 and the second lead-out 422 are electrically connected to the corresponding first electrical adapter 411 and second electrical adapter 412. That is, the first lead-out 421 is electrically connected to the first electrical adapter 411, and a second lead-out 422 is electrically connected to a second electrical adapter 412.

[0096] The first electrical adapter 411 and the second electrical adapter 412 have conductive contact areas that contact the corresponding subarray 302. Through these conductive contact areas, the first electrical adapter 411 and the second electrical adapter 412 can be electrically connected to the corresponding subarray 302.

[0097] Further, please refer to Figure 6 In some embodiments, since the second lead-out 422 passes through the middle of the first lead-out 421, the first lead-out 421 has at least two first sub-leads 427, a second gap 425 between the first sub-leads 427, and the connecting portion 424 passes through the second gap 425.

[0098] Further, please refer to Figure 6 In some embodiments, there are two first sub-leads 427, and the two first sub-leads 427 are symmetrical about the second gap 425, so that the width of the conductive transition area on the two first sub-electrical transition pieces 413 corresponding to the first sub-leads 427 is equal or close, thus maximizing the use of each conductive transition area to set the first conductive transition part 414.

[0099] Further, please refer to Figure 6 In some embodiments, in order to bring out the first sub-leads 427 and electrically connect them to the main control unit, the two first sub-leads 427 extend from both sides of a second lead 422. Specifically, the first sub-leads 427 has a third extension 4211, and the third extension 4211 of each first sub-lead 427 extends from the side of the second lead 422.

[0100] The second lead-out 422, located between the two third extension portions 4211, has a narrower width due to the influence of the third extension portions 4211. To ensure better mating of the second lead-out 422 between the two third extension portions 4211 and the corresponding second electrical adapter 412, please refer to... Figure 6 In some embodiments, the second lead-out 422, located between the two third extension portions 4211, has a second extension portion 4221. The second extension portion 4221 and the body of the second lead-out 422 are electrically connected; they can be integrally formed (e.g., printed or coated into an integral structure), or they can be manufactured separately and then electrically connected together. Please refer to... Figure 3 and 6 In some embodiments, in the corresponding electrical adapter group 401, the second electrical adapter 412 corresponding to the second lead-out with the second extension portion 4221 has a first extension portion 4121 located outside its conductive contact area. This first extension portion 4121 corresponds to the second extension portion 4221 of the second adapter. The first extension portion 4121 is electrically connected to the corresponding conductive contact area. The two can be integrally formed (e.g., printed or coated into an integral structure) or manufactured separately and then electrically connected together. The first extension portion 4121 is provided with a first conductive adapter portion 414, and the second extension portion 4221 is provided with a second conductive connection portion 423, thereby realizing the conductive connection between the first extension portion 4121 and the second extension portion 4221. This allows the second lead-out 422 located between the two third extension portions 4211 to meet a smaller width requirement, in order to adapt to a narrower subarray 302 design.

[0101] Please refer to Figure 3-6 In some embodiments, the first extension portion 4121 and the second extension portion 4221 are both bent and extended along a third direction and in a direction away from the array element layer 300, and extend to the periphery of the backing layer 500, making full use of the space around the backing layer 500 without affecting the thickness of the lens 100, the matching layer 200, the array element layer 300, the flexible circuit board 400 and the backing layer 500 in the stacking direction.

[0102] Of course, in other embodiments, at least one second electrical adapter 412 may have a first extension portion 4121 located outside its conductive contact area, and correspondingly at least one second lead-out member 422 may have a second extension portion 4221. For example, in some embodiments, a second lead-out member 422 located opposite to the side of the first lead-out member 421 where the third extension portion 4211 is provided may also have a second extension portion 4221, and the second electrical adapter 412 corresponding to the second lead-out member 422 may also have a first extension portion 4121, through which the second lead-out member 422 and the second electrical adapter 412 are electrically connected.

[0103] Please refer to Figure 3-6 In some embodiments, when the second extension portion 4221 is provided, the second lead-out member 422 without the second extension portion 4221 may be provided with an electrical external structure 4222. The electrical external structure 4222 is used to electrically connect to the positive signal circuit, thereby electrically connecting the subarray 302 of the second array element 320 corresponding to the two second lead-out members 422 to the positive signal circuit.

[0104] Of course, in other embodiments, the electrical external structure for electrically connecting the second lead-out member 422 may also be provided on the second extension portion 4221.

[0105] Please refer to Figure 6 In some embodiments, the third epitaxial portion 4211 may extend beyond the end of the second epitaxial portion 4221 and be electrically connected to each other to form an external electrical connection structure. This external electrical connection structure is used to electrically connect to the positive signal circuit, thereby electrically connecting the subarray 302 of the first array element 310 corresponding to the first lead-out member 421 to the positive signal circuit. Of course, in other embodiments, the two third epitaxial portions 4211 may not be connected together; they may be separated from each other and each may have an external electrical connection structure for electrical connection to the positive signal circuit.

[0106] In addition, in some other embodiments, the first lead-out 421 may not have a third extension 4211, that is, the first lead-out 421 is isolated between a pair of second leads 422 and does not extend from the side of the second lead-out 422 on the same layer. For example, in some embodiments, in the lead-out group 402, at least one lead-out is a first adapter lead-out 428, which is located on the side of the first lead-out 421 opposite to the first electrical adapter 411 and is electrically connected to the first lead-out 421. The first adapter lead-out 428 has an external electrical connection structure for electrical connection with the positive signal circuit. Specifically, at least one additional layer of first adapter leads 428 (similar to) is provided below the first lead-out 421 (below along a third direction). Figure 9 (As shown in the structure), the first adapter lead 428 is electrically connected to the first lead 421 in a third direction via the second conductive adapter 423, and the first adapter lead 428 has a fifth extension 4281, which extends from below the first lead 421 and the second lead 422, for example, to the periphery of the backing layer 500. The fifth extension 4281 has an external electrical connection structure for electrical connection with the positive signal circuit, thereby electrically connecting the subarray 302 of the first array element 310 corresponding to the first lead 421 to the positive signal circuit.

[0107] Further, in some embodiments, n is greater than or equal to 5, meaning each array element group 301 has more than 5 array elements arranged along the second direction. Each electrical adapter group 401 corresponds one-to-one with the array elements of an array element group 301, meaning the number of electrical adapters in each electrical adapter group 401 is equal to the number of array elements in each array element group 301. The leads in the lead-out group 402 are arranged in at least m layers along the third direction, where m = (n+1) / 2. Each layer of leads is disposed on a corresponding insulating substrate layer and is insulated from it by the insulating substrate layer. Along the third direction, the layer of leads closest to the electrical adapter group 401 is the first layer, and the layer furthest from the electrical adapter group is the m-th layer.

[0108] The first layer of the lead-out component includes a first lead-out component 421, which is electrically connected to a corresponding electrical adapter. Specifically, the electrical connection can be made in the manner described in the above embodiments.

[0109] In layers 1 to (m-1), each lead-out has a pair of second leads 422. The second leads 422 of the lead-out in layer 1 are electrically connected to the first conductive transition portion 414 of the corresponding electrical adapter. In layers 2 to (m-1), the second leads 422 in each layer are electrically connected to the corresponding electrical adapter via the second transition lead-out 429 of the previous layer.

[0110] In layers 2 to m, each lead-out has a first transition lead-out 428. The first lead-out 421 is electrically connected to each first transition lead-out 428 in the lower layer. At least one second lead-out 422 and at least one first transition lead-out 428 in each pair of second lead-outs 422 can be electrically connected to the positive signal circuit of the main control unit, thereby realizing the lead-out of the positive terminal of the subarray 302.

[0111] In some embodiments, in at least one lead-out layer, a connection 424 between a pair of second leads 422 passes through a second gap 425 between the first lead-out 421 and / or the first transition lead-out 428.

[0112] In some embodiments, in at least one lead-out layer, the second lead-out 422 has a second extension portion 4221. The outer end of the second extension portion 4221 is located outside the array element layer 300. The outer end is provided with an electrical external connection structure, which can be electrically connected to the positive signal circuit of the main control unit.

[0113] In some embodiments, in at least one layer of leads, at least one pair of second transition leads 429 are disposed opposite to each other on both sides of a pair of second leads 422, and the second extension portion 4221 of the second lead 422 passes through the corresponding second transition lead 429 and extends beyond the array element layer 300.

[0114] In some embodiments, in at least one lead-out layer, the second transition lead-out 429 has a fourth extension portion 4291, which is located outside the array element layer 300. The fourth extension portion 4291 is provided with an electrical external connection structure, which can be electrically connected to the positive signal circuit of the main control unit.

[0115] For details, please refer to Figure 7-12 In some embodiments, n equals 5, meaning each element group 301 has 5 elements arranged along the second direction (e.g., 310, 320). Each electrical adapter group 401 has 5 electrical adapters (e.g., 411, 412), each electrically connected to a corresponding element. The leads in each lead group 402 are arranged in 3 layers along the third direction. To clearly illustrate the correspondence between the lead assembly 420 and the adapter layer 410, and between the lead layers, the insulating substrate layer is omitted in the figure. Along the third direction, the lead layer closest to the electrical adapter group 401 is the first layer, and the lead layer furthest from the electrical adapter group is the third layer.

[0116] Please refer to Figure 9 and 10 In some embodiments, the first-layer lead-out member 420a includes a first lead-out member 421, a pair of second leads-out members 422 located on both sides of the first lead-out member 421, and a pair of second transition leads-out members 429 located on both sides of the pair of second leads-out members 422. The first lead-out member 421, the second lead-out member 422, and the second transition leads-out member 429 are all electrically connected to their respective electrical transition members, and thus electrically connected to their respective subarrays 302. Specific connection methods can be referred to the conductive connection methods shown in the above embodiments.

[0117] Please refer to Figure 9 and 10 In some embodiments, in the first-layer lead-out 420a, the first lead-out 421 is electrically connected to a corresponding electrical adapter, and the connecting portion 424 of the pair of second leads 422 passes through the first lead-out 421 to electrically connect the pair of second leads 422 into a single unit. The pair of second adapter leads 429 are used to electrically connect the corresponding electrical adapter to the second lead-out 422 or the second adapter lead-out 429 of the next layer.

[0118] Please refer to Figure 9 and 10 In some embodiments, in the first layer lead-out member 420a, the pair of second lead-out members 422 are provided with a second extension portion 4221, which is electrically connected to the main control unit.

[0119] In some embodiments, the second extension 4221 may be bent and extended along a third direction and toward the side opposite to the transition layer 410.

[0120] In some embodiments, in the first layer lead-out 420a, the second extension 4221 of the second lead-out 422 passes through the corresponding second transition lead-out 429 and extends beyond the array element layer 300, for example, extending to the peripheral space of the backing layer 500, to facilitate conductive connection with the main control unit.

[0121] Please refer to Figure 9 and 11 In some embodiments, the second-layer lead-out 420b has a first transition lead-out 428 and a pair of second leads-out 422. The first transition lead-out 428 is electrically connected to the first lead-out 421 of the first layer. The pair of second leads-out 422 is electrically connected to a pair of second transition leads-out 429 of the first layer to electrically connect the pair of second leads-out 422 to the corresponding array elements. A connection portion 424 between the pair of second leads-out 422 passes through the first transition lead-out 428. The pair of second leads-out 422 has a second extension portion 4221 that extends beyond the array element layer 300, for example, to the peripheral space of the backing layer 500, to facilitate conductive connection with the main control unit.

[0122] Please refer to Figure 9-11 In some embodiments, the second transition lead 429 of the first layer can be electrically connected to the second lead 422 of the second layer via the second conductive transition portion 423 thereon. In some embodiments, the second transition lead 429 of the first layer may also have a fourth extension portion 4291 that extends beyond the element layer 300, for example, extending into the peripheral space of the backing layer 500, thereby electrically connecting with the second extension portion 4221. The external electrical connection structure for leading out the second lead 422 of the second layer may be disposed on the second extension portion 4221 of the second lead 422, or it may be disposed on the fourth extension portion 4291 of the second transition lead 429 of the first layer.

[0123] Please refer to Figure 9-12 In some embodiments, the second adapter lead-out member 429 of the first layer is divided into two parts by the second extension portion 4221 of the second lead-out member 422. Each of the two parts has a fourth extension portion 4291. The two fourth extension portions 4291 can be connected as one unit or disposed separately. When the fourth extension portion 4291 is present, the second extension portion 4221 of the second lead-out member 422 of the first layer can be led out through the sixth extension portion 4292 disposed on the third layer. The second extension portion 4221 and the sixth extension portion 4292 can be electrically connected through the second conductive adapter portion 423, and then electrically connected to the main control unit through the sixth extension portion 4292.

[0124] Please refer to Figure 9 and 12In some embodiments, the third layer lead-out 420c includes a first adapter lead-out 428, which is electrically connected to the first adapter lead-out 428 of the second layer to ultimately lead out the first lead-out 421.

[0125] Please refer to Figure 9 and 12 In some embodiments, the first adapter lead 428 of the third layer lead has a fifth extension 4281 that extends beyond the array element layer 300, for example, to the peripheral space of the backing layer 500, to facilitate conductive connection with the main control unit.

[0126] The above describes the method of leading out the positive terminal of the array element in the array element lead-out structure. In some embodiments, the array element lead-out structure also includes a negative terminal lead-out structure, which is electrically connected to the negative terminal of the array element. The negative terminal lead-out component is used to electrically connect the negative terminal of the array element to the negative signal circuit of the main control unit. This negative terminal lead-out structure can be implemented using existing technology or some new structures.

[0127] Please refer to Figure 2 , 13 In some embodiments, such as 14, the negative electrode lead-out structure 600 is a conductive sheet 610, such as copper foil, which is conductively connected to the negative electrode signal circuit of the main control unit. The conductive sheet 610 covers the negative electrode side of the array element of the array element layer 300 (the side of the array element facing away from the flexible circuit board 400). The conductive sheet 610 is conductively connected to the negative electrode of the array element and extends to the side of the flexible circuit board 400 where the first epitaxial portion 4121 is not provided, to prevent short circuits caused by conductive contact with the first epitaxial portion 4121.

[0128] Please refer to Figure 15 and 16 In some embodiments, the negative electrode lead-out structure 600 is a conductive sheet 610, such as copper foil, which covers the negative electrode side of the array element of the array element layer 300 (the side of the array element facing away from the flexible circuit board 400). The conductive sheet 610 is electrically connected to the negative electrode of the array element. To prevent the conductive sheet 610 from forming a conductive contact with the first epitaxial portion 4121 and causing a short circuit, an insulating layer 630 is covered on the first epitaxial portion 4121. In this case, the conductive sheet 610 can extend to the side of the flexible circuit board 400 where the first epitaxial portion 4121 is not provided, or it can extend to the side where the insulating layer 630 is provided.

[0129] Please refer to Figure 17In some embodiments, the array element layer 300 may further include an outermost discarded array element 330, which is electrically connected to the negative electrode side of other array elements through a conductive coating 620 (such as a gold plating layer). The negative electrode lead-out structure 600 is electrically connected to the negative electrode signal circuit of the main control unit through the discarded array element 330 and the conductive coating 620.

[0130] This document describes various exemplary embodiments with reference to them. However, those skilled in the art will recognize that changes and modifications can be made to the exemplary embodiments without departing from the scope of this document. For example, various operational steps and components for performing operational steps can be implemented in different ways depending on the specific application or considering any number of cost functions associated with the operation of the system (e.g., one or more steps can be deleted, modified, or combined with other steps).

[0131] While the principles herein have been illustrated in various embodiments, numerous modifications to the structures, arrangements, proportions, elements, materials, and components, particularly suited to specific environments and operational requirements, may be used without departing from the principles and scope of this disclosure. These modifications and other alterations or alterations will be included within the scope of this document.

[0132] The foregoing specific descriptions have been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes can be made without departing from the scope of this disclosure. Therefore, considerations for this disclosure are to be illustrative rather than restrictive, and all such modifications are to be included within its scope. Similarly, advantages, other advantages, and solutions to problems with the various embodiments have been described above. However, benefits, advantages, solutions to problems, and any elements that produce these, or make them more explicit, should not be construed as critical, essential, or necessary. The term “comprising” and any other variations thereof as used herein are non-exclusive inclusion, meaning that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed or not part of the process, method, system, article, or apparatus. Furthermore, the term “coupling” and any other variations thereof as used herein refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections, and / or any other connections.

[0133] Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the basic principles of this application. Therefore, the scope of this application should be determined according to the following claims.

Claims

1. An array element lead-out structure for an ultrasonic probe, characterized in that, include: The array element layer has multiple array element groups arranged along a first direction, and each array element group has n array elements arranged along a second direction, where n is an odd number greater than or equal to 3; the array elements are divided into at least two subarrays by a first gap; wherein the array elements in each array element group are at least divided into a first array element located in the middle position and at least a pair of second array elements, and each pair of second array elements is arranged opposite to each other on both sides of the first array element in the second direction; And a flexible circuit board having a transition layer and lead-out components, wherein the array element layer, the transition layer and the lead-out components are arranged along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; The transition layer has multiple electrical transition component groups arranged along a first direction, and each electrical transition component group has multiple electrical transition components arranged along a second direction. Each electrical transition component group has electrical transition components that are in contact with and electrically connected to the positive electrode of the corresponding array element in the array element group. The lead-out assembly has multiple lead-out groups arranged along a first direction. Each lead-out group has multiple leads. Each lead-out includes at least a first lead and at least a pair of second leads. The first lead is electrically connected to a corresponding first array element via a corresponding electrical adapter. Each pair of second leads is electrically connected to a pair of second array elements via a corresponding electrical adapter. The leads are used to be electrically connected to the positive signal circuit of the control unit to input a positive signal to the corresponding array element. The electrical adapter is provided with a first conductive adapter portion, and the lead-out portion is provided with a second conductive adapter portion. The first conductive adapter portion and the corresponding second conductive adapter portion are stacked and electrically connected in the stacking direction to electrically connect the electrical adapter portion to the corresponding lead-out portion. Each pair of second leads-out portions are electrically connected through a connecting portion. On a reference plane perpendicular to the third direction, the orthographic projection of the first gap and the orthographic projection of the connecting portion at least partially overlap. The orthographic projections of the second conductive adapter portion on the first lead-out portion and the corresponding first conductive adapter portion on the reference plane are distributed on both sides of the orthographic projection of the connecting portion.

2. The array element extraction structure as described in claim 1, characterized in that, At least one other lead is provided between at least one pair of second leads, the other lead including the first lead, the first adapter lead and / or the second adapter lead, the other lead having a second gap, and the connecting portion passing through the corresponding second gap.

3. The array element extraction structure as described in claim 2, characterized in that, The orthographic projection of the first gap onto the reference surface in the first direction does not exceed the orthographic projection of the second gap onto the reference surface.

4. The array element extraction structure as described in claim 1, characterized in that, The positional difference between each second element and the first element in the same pair is the same.

5. The array element extraction structure as described in claim 1, characterized in that, The n equals 3, and the electrical adapter group is at least divided into a first electrical adapter and a pair of second electrical adapters disposed on both sides of the first electrical adapter. The first electrical adapter and the second electrical adapter are respectively in contact with and electrically connected to the positive poles of the corresponding first array element and the second array element. The lead-out assembly consists of at least a first lead-out and a pair of second leads located on both sides of the first lead-out. The first and second leads are electrically connected to the corresponding first and second electrical adapters.

6. The array element extraction structure as described in claim 5, characterized in that, The first electrical adapter and the second electrical adapter have conductive contact areas that contact the corresponding subarray; in one group of electrical adapters, at least one of the second electrical adapters has a first extension portion located outside its conductive contact area, the first extension portion being electrically connected to the corresponding conductive contact area; in the second electrical adapter having the first extension portion, its first extension portion is provided with a first conductive adapter portion.

7. The array element extraction structure as described in claim 6, characterized in that, The first and second electrical adapters are divided into multiple sub-electrical adapters, each corresponding to one of the sub-arrays, and each sub-electrical adapter has the conductive contact area.

8. The array element extraction structure as described in claim 6, characterized in that, The first lead and the second lead are provided with a second conductive transition portion, which is electrically connected to the corresponding first conductive transition portion; wherein, at least one of the second leads has a second extension portion corresponding to the first extension portion; in the second lead with the second extension portion, the second extension portion is provided with the second conductive transition portion.

9. The array element extraction structure as described in claim 8, characterized in that, The first epitaxial portion and the second epitaxial portion are bent in a direction away from the array element layer.

10. The array element extraction structure as described in claim 8, characterized in that, The second epitaxial portion has an external electrical connection structure, which is used to electrically connect to the positive signal circuit.

11. The array element extraction structure as described in claim 8, characterized in that, The first lead has at least two first sub-leads with a second gap between them, and the connecting portion passes through the second gap. The first sub-lead has a third extension, and the third extension of each first sub-lead extends from the side of the second lead to the end of the second extension and is electrically connected to each other to form an external electrical connection structure, which is used to electrically connect to the positive signal circuit.

12. The array element extraction structure as described in claim 11, characterized in that, There are two first sub-leads, and the two first sub-leads are symmetrical about the second gap.

13. The array element extraction structure as described in claim 4, characterized in that, In the lead assembly, at least one lead is a first adapter lead. The first adapter lead is located on the side of the first lead away from the first electrical adapter and is electrically connected to the first lead. The first adapter lead and the second lead each have an external electrical connection structure, which is used to electrically connect to the positive signal circuit.

14. The array element extraction structure as described in claim 1, characterized in that, The n is greater than or equal to 5, and each electrical adapter of the electrical adapter group corresponds one-to-one with the array element of the array element group; the leads in the lead group are arranged in at least m layers along the third direction, where m = (n+1) / 2; the lead layer closest to the electrical adapter group is the first layer, and the lead layer furthest from the electrical adapter group is the m-th layer; The first layer of the lead-out component has a first lead-out component, which is electrically connected to the corresponding electrical adapter component; In layers 1 to (m-1), each lead-out has a pair of second leads, and the second leads of the first layer lead-out are electrically connected to the first conductive connection part of the corresponding electrical adapter; in layers 2 to (m-1), the second leads in each layer are electrically connected to the corresponding electrical adapter through the second adapter lead-out of the previous layer. In layers 2 to m, each layer of the lead-out has a first adapter lead-out, which is electrically connected to each first adapter lead-out in the lower layer. At least one second lead-out and at least one first adapter lead-out in each pair of second leads-outs can be electrically connected to the positive signal circuit.

15. The array element extraction structure as described in claim 14, characterized in that, In at least one lead-out layer, a connection between a pair of second leads passes through a second gap between the first lead-out and / or the first transition lead-out.

16. The array element extraction structure as described in claim 14, characterized in that, In at least one lead-out layer, the second lead-out layer has a second extension portion, the outer end of the second extension portion is located outside the array element layer, and the outer end is provided with an external electrical connection structure.

17. The array element extraction structure as described in claim 16, characterized in that, In at least one layer of leads, at least one pair of second transition leads are disposed opposite each other on both sides of a pair of second leads, and the second extension of the second lead passes through the corresponding second transition lead and extends beyond the array element layer.

18. The array element extraction structure as described in claim 17, characterized in that, In at least one lead-out layer, the second adapter lead-out layer has a fourth extension portion located outside the array element layer, and the fourth extension portion is provided with the electrical external connection structure.

19. The array element extraction structure as described in claim 14, characterized in that, Where n=5, the array element group has one first array element and two pairs of second array elements; The m=3, the first layer of the lead-out has a first lead-out, a pair of second leads, and a pair of second transition leads. The pair of second leads are disposed opposite to each other on both sides of the first lead-out, and the second transition leads are disposed opposite to each other on both sides of the pair of second leads. The second lead-out and the second transition leads are respectively electrically connected to a corresponding second array element. The second layer lead has a first adapter lead and a pair of second leads, the second leads being electrically connected to the second adapter lead of the first layer, so as to be electrically connected to the corresponding second array element through the second adapter lead; The third layer lead has a first adapter lead, which is electrically connected to the first adapter lead of the second layer, and the first adapter lead of the third layer has an external electrical connection structure.

20. The array element extraction structure as described in claim 1, characterized in that, A first insulating layer is provided between the transition layer and the lead-out component; And / or, a second insulating layer is provided between the lead-out elements of the lead-out assembly.

21. The array element extraction structure as described in claim 1, characterized in that, It also includes a negative lead-out structure, which is electrically connected to the negative terminal of the array element. The negative lead-out structure is used to electrically connect the negative terminal of the array element to the negative signal circuit of the control unit.

22. The array element extraction structure as described in any one of claims 1-21, characterized in that, In the array element group, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.4 mm, and the width of a single subarray in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.17 mm; or, the width of a single array element in the first direction is greater than or equal to 0.2 mm and less than or equal to 0.33 mm, and the width of a single subarray in the first direction is greater than or equal to 0.07 mm and less than or equal to 0.14 mm.

23. An ultrasonic probe's acoustic head, characterized in that, The device includes a backing, a matching layer, a lens, and an array element lead-out structure as described in any one of claims 1-22, wherein the flexible circuit board is disposed on the backing, the matching layer is located on the array element layer, and the lens is disposed on the matching layer.

24. An ultrasonic probe, characterized in that, Includes a sound head, the sound head having an array element lead-out structure as described in any one of claims 1-22.

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