Housing with micromechanical components

Abstract

The invention relates to a semiconductor device, comprising: a micromechanical component (50); an injection-molded body (52) having at least one recess (56) formed on the injection-molded body (52), which recess is surrounded by a side wall region (52a) of the injection-molded body (52) and is at least partially covered by a base region (52b) of the injection-molded body (52) on a first side of the recess (56); and a cover part (54), which is fastened to the side wall region (52a) directly or via at least one intermediate part (58) and covers the recess (56) on a second side of the recess, a through-opening (60) being formed on a bottom region (52b) of the injection-molded body (52), at least one side wall (60a) of the through-opening extends from the recess (56) as far as a bottom outer surface (52c) of the bottom region (52b) facing away from the recess (56), and the micromechanical component (50) is arranged in the through-opening (60) such that the micromechanical component (50) mechanically contacts the at least one side wall (60a) of the through-opening (60).

Description

Technical Field

[0001] The present invention relates to a semiconductor device having a micromechanical component and also to a method for producing a semiconductor device. Background Art

[0002] FIG. 1 shows a schematic diagram of a conventional pressure sensor, which is known to the applicant as an internal prior art.

[0003] 1 has a micromechanical component 10, which is arranged in an interior space 12 of a housing formed by a base plate 14, a side part 16 fixed to the base plate 14, and a cover 18 fixed to the side part 16. The cover 18 has a supply opening 20, so that the pressure p prevailing in the interior space 12 corresponds to the ambient pressure of a conventional pressure sensor, while the reference pressure p0 is contained in the interior volume 22 of the micromechanical component 10.

[0004] The micromechanical component 10 is configured with a flexible membrane 24, on which a first membrane surface 24a is acted by the pressure p in the interior 12, while a second membrane surface 24b of the flexible membrane 24, which faces away from the first membrane surface 24a, adjoins the interior volume 22 in which a reference pressure p0 is present. Depending on the voltage or capacitance applied between the flexible membrane 24 and an associated counter electrode 26, the pressure difference between the pressure p in the interior 12 and the reference pressure p0 should be measurable.

[0005] A dedicated circuit 28 is also arranged in the interior 12, which is electrically attached to the micromechanical component 10 via a first bonding wire connection 30 and to the housing of a conventional pressure sensor via a second bonding wire connection 32. The micromechanical component 10 and the dedicated circuit 28 can be firmly bonded to the base plate 14, for example, by each having an adhesive connection 34. In addition, conventional pressure sensors also have solder balls 36 on the underside of the base plate 14 that points away from the interior 12. Summary of the invention

[0006] The invention provides a semiconductor device having the features of claim 1 and a method for producing a semiconductor device having the features of claim 9 .

[0007] The present invention provides a semiconductor device that can be manufactured cost-effectively by implementing a highly parallelized manufacturing process using standard semiconductor technology. In addition, as is apparent from the following description, for example, the semiconductor device according to the present invention has a relatively robust structure in which the risk of the formation of acoustic leakage paths can be particularly reliably avoided. The present invention thus helps to increase the profitability of the manufacturing process for a large number of semiconductor devices.

[0008] In an advantageous embodiment of the semiconductor device, the micromechanical component has at least one structured or unstructured substrate, which includes at least one semiconductor material, wherein the micromechanical component is arranged in a through-opening so that at least one outer surface of at least one substrate of the micromechanical component mechanically contacts at least one side wall of the through-opening. At least one outer surface of the substrate of the micromechanical component can therefore be used as a contact surface of the injection molded body in a more cost-effective manner. This is advantageous because the molding compound forming the injection molded body can be introduced into a firm mechanical contact with at least one outer surface of at least one substrate in a simple manner by means of injection molding of the micromechanical component, in particular into an air-tight and gas-tight mechanical contact with at least one outer surface of at least one substrate. In addition, the mechanical contact formed in this way of at least one side wall of the through-opening and at least one outer surface of the substrate has a generally relatively long durability / service life.

[0009] Preferably, the cutout is covered on its first side by the bottom region of the injection-molded body and the micromechanical component arranged in the through-opening. Thus, the risk of an acoustic leakage path on the first side of the cutout is also prevented by the mechanical contact of at least one side wall of the through-opening with airtight and gastight design and the micromechanical component.

[0010] Preferably, the cover is fixed to the side wall region in an airtight and gastight manner, directly or via at least one intermediate component, and the mechanical contact of at least one side wall of the through-opening with the micromechanical component is airtight and gastight, whereby the recess is sealed airtight and gastight relative to the outer volume of the semiconductor device by means of the injection-molded body, the cover and the micromechanical component. The total volume of the recess can in this case serve as a reference volume for providing a reference pressure, wherein, due to the relatively large total volume of the recess, pressure detection and sound detection with relatively high sensitivity are possible when using the micromechanical component of the embodiment described here.

[0011] For example, a micromechanical component arranged in a through-opening has at least one bendable diaphragm, a pressure present in the external volume acting on a respective first diaphragm surface of the diaphragm, and a reference pressure contained in the recess acting on a respective second diaphragm surface of the diaphragm pointing away from the first diaphragm surface. Due to the relatively large total volume of the recess, even when the diaphragm is strongly bendable, (almost) no counterpressure is built up to resist the bend, so that pressure detection and sound detection with relatively high sensitivity is possible with the embodiment of the semiconductor device described here.

[0012] As an advantageous development, the micromechanical component arranged in the through-opening has a spacer at its end pointing toward the recess, wherein at least one spacer side of the spacer mechanically contacts at least one side wall of the through-opening. This allows at least one sensitive component of the micromechanical component to be positioned in the bottom region of the injection molding at a distance from the edge of the through-opening adjacent to the recess, thereby significantly reducing the risk of undesired contact of the positioning portion of at least one sensitive component of the micromechanical component with the molding material of the injection molding to be formed. The micromechanical component of the embodiment described here can therefore also have at least one very sensitive diaphragm without having to worry about damage to the diaphragm during the manufacture of the corresponding semiconductor device.

[0013] Alternatively or additionally, the micromechanical component arranged in the through-opening has a dedicated circuit arrangement, wherein at least one side surface of the dedicated circuit arrangement mechanically contacts at least one side wall of the through-opening. The design described here facilitates the integration of the dedicated circuit arrangement in the micromechanical component.

[0014] The semiconductor device may be, for example, a pressure sensor, an acoustic sensor or a microphone. It is pointed out, however, that the embodiments of the semiconductor device listed here should not be interpreted as being decisive.

[0015] The implementation of a corresponding production method for a semiconductor device provides the advantages explained above. It should be noted that the production method can be further developed according to the embodiments of the semiconductor device explained above.

[0016] Preferably, in order to form the injection-molded body, the micromechanical component is injection-molded with the molding compound of the subsequent injection-molded body using a stamping die. The stamping die can ensure that the desired shape of the subsequent injection-molded body is well maintained.

[0017] In particular, before the micromechanical component is encapsulated with the molding compound of the subsequent injection molding, a film can be arranged between the die and the micromechanical component, and after the micromechanical component is encapsulated with the molding compound and the die is removed, the film is removed from the encapsulated micromechanical component. Advantageous tolerance compensation can be achieved by using the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Other features and advantages of the present invention will be described below with reference to the accompanying drawings.

[0019] The accompanying drawings show:

[0020] Figure 1: Schematic diagram of a conventional pressure sensor;

[0021] Figure 2 : A schematic diagram of a first embodiment of a semiconductor device;

[0022] Figure 3 : A schematic diagram of a second embodiment of a semiconductor device;

[0023] Figure 4 : A schematic diagram of a third embodiment of a semiconductor device; and

[0024] Figures 5a to 5f : A schematic diagram of an intermediate product used to illustrate an implementation of a method for manufacturing a semiconductor device. DETAILED DESCRIPTION

[0025] Figure 2 A schematic diagram showing a first embodiment of a semiconductor device.

[0026] exist Figure 2 Schematically shown in the semiconductor device comprises micromechanical component 50, injection molding body 52 and cover 54. At least one opening 56 is constructed on injection molding body 52, which is framed by so-called side wall area 52a of injection molding body 52 and is covered by so-called bottom area 52b of injection molding body 52 at least on a partial area on the first side of opening 56. It is pointed out here that injection molding body 52 is preferably understood as a body solidly constructed by molding compound, and side wall area 52a and bottom area 52b are constructed on this body in one piece. Injection molding body 52 can be formed by molding compound in a single injection molding step. The opening 56 constructed on injection molding body 52 extends at least from its first side until at least one second side of opening 56 pointing away from the first side. Cover 54 is fixed on the second side of opening 56 directly or via at least one intermediate component 58 on the side wall area 52a. The first side of the recess 56 is therefore understood to be the side of the recess 56 pointing away from the cover 54 / the “bottom region side”, while the second side of the recess 56 can be referred to as the “cover side”.

[0027] The cover 54 (preferably completely) covers the cutout 56 on the second side of the cutout. The cover 54 can also be referred to as a cover cap 54 of the semiconductor device or as a cover 54. The at least one intermediate component 58 can be, for example, an adhesive connection or a molded connection 58. Figure 2 In the embodiment of FIG. 5 , the cover 54 is fastened to the side wall region 52 a of the injection-molded body 52 merely by way of example via so-called molded sheet metal connections 58 .

[0028] As in Figure 2 5 , it can be seen that a through-opening 60 is formed on the bottom region 52b of the injection-molded body 52. ​​The through-opening 60 is framed by the bottom region 52b of the injection-molded body 52. ​​At least one side wall 60a of the through-opening 60 extends from the recess 56 to a bottom outer surface 52c of the bottom region 52b pointing away from the recess 56. The micromechanical component 50 is arranged in the through-opening 60 in such a way that the micromechanical component 50 mechanically contacts the at least one side wall 60a of the through-opening 60.

[0029] In the semiconductor device described here, the micromechanical component 50 is therefore at least partially integrated in the bottom region 52b of the injection molding 52. Therefore, the micromechanical component 50 can be arranged in the semiconductor device in a common process step with the formation of the injection molding 52. Therefore, an additional process step for placing the micromechanical component 50 on / in the injection molding 52 after the injection molding 52 is formed, such as conventionally firmly bonding the micromechanical component 50 on / in the injection molding 52, is not necessary for the production of the semiconductor device described here. Figure 2 The semiconductor device can therefore be manufactured at a relatively low cost.

[0030] For the bottom region 52b of the injection molded body 52, a bottom inner surface 52d pointing away from the bottom outer surface 52c of the bottom region can be defined, and the bottom inner surface is adjacent to the recess 56 in a manner spaced apart from the cover 54 at a maximum distance. Similarly, a component surface 50a can be defined for the micromechanical component 50, which is oriented toward the recess 56 and has a minimum distance from the cover 54 in all surfaces of the micromechanical component 50. Preferably, the first distance d1 of the component surface 50a of the micromechanical component 50 and the cover 54 is equal in size to the second distance d2 of the bottom inner surface 52d of the bottom region 52b and the cover 54. In this case, the micromechanical component 50 is fully integrated / sunk in the bottom region 52b of the injection molded body 52. ​​The recess 56 constructed in the injection molded body 52 does not therefore have to be used as a receiving volume for the micromechanical component 50, so that the total volume of the recess 56 can be advantageously used for other purposes.

[0031] The cutout 56 can be (completely) covered on its first side (pointing away from the cover 54) by the bottom region 52b of the injection molded body 52 and the micromechanical component 50 arranged in the through-opening 60. This is advantageous because the mechanical contact of at least one side wall 60a of the through-opening 60 with the micromechanical component 50 can be formed in a simple way in an airtight and gas-tight manner during the injection molding of the injection molded body 52. ​​The cover 54 can also be fixed in a simple way in an airtight and gas-tight manner directly or via at least one intermediate part 58 to the side wall region 52a of the injection molded body 52. ​​Thus, the cutout 56 can be sealed airtightly and gastightly relative to the outer volume of the semiconductor device by means of the injection molded body 52, the cover 54 and the micromechanical component 50 with relatively little work.

[0032] Preferably, the recess 56 is sealed airtightly and gastightly relative to the outer volume of the semiconductor device by means of the injection molded body 52, the cover 54 and the micromechanical component 50. In this case, the injection molded body 52, the cover 54 and the micromechanical component 50 form an airtight and gastight housing for the recess 56, which has a robust structure and in which the risk of acoustic leak paths forming is relatively low. A semiconductor device equipped with the micromechanical component 50 and the airtight and gastight recess 56 can therefore be used in many ways.

[0033] Figure 2 The semiconductor device is designed merely as an example as a pressure sensor / capacitive pressure sensor, a sound sensor (for example, in particular a structure-borne sound sensor) or a microphone. For this purpose, the micromechanical component 50 arranged in the through-opening 60 has at least one bendable diaphragm 62, which can be electrically contacted with at least one counter electrode 64 of the micromechanical component 50 in each case so that a voltage or a capacitance applied between the at least one bendable diaphragm 62 and the at least one counter electrode 64 can be intercepted / ascertained. A first diaphragm surface 62a of the at least one bendable diaphragm 62 is pointed away from the recess 56 in such a way that a pressure p present in the external volume of the semiconductor device acts on the first diaphragm surface 62a. In contrast, a second diaphragm surface 62b pointing away from the first diaphragm surface 62a is oriented toward the recess 56 in such a way that a reference pressure p0 contained in the recess 56 acts on the second diaphragm surface 62b. The recess 56 can thus be formed at Figure 2 56 is used as a reference volume for the reference pressure p0 in the semiconductor device, wherein, due to the relatively large total volume of the recess 56, even if the at least one bendable membrane 62 is strongly bent into the recess 56, hardly any pressure increase occurs in the recess 56. Therefore, a bending of the at least one membrane 62 into the recess 56 does not lead to a counterpressure in the recess 56 that counteracts the bending. Figure 2 It can be seen in FIG. 5 that the total volume of recess 56 is greater than the total volume of micromechanical component 50 by at least a factor of 2. Such a large reference volume for reference pressure p0 contributes to increasing the sensitivity of the semiconductor device used as a pressure sensor, sound sensor or microphone.

[0034] However, it is pointed out that at least one bendable membrane 62 and at least one counter electrode 64 are only examples of possible components of micromechanical device 66 of micromechanical component 50. As an alternative or in addition to components 64 and 66, micromechanical device 66 of micromechanical component 50 can also include at least one seismic mass, at least one actuator electrode and / or at least one stator electrode. At least one side wall of micromechanical device 66 can have mechanical contact with at least one side wall 60a of through-opening 60. However, it is also possible to omit the formation of micromechanical device 66 on micromechanical component 50.

[0035] Advantageously, Figure 2 The micromechanical component 50 of the semiconductor device arranged in the through opening 60 also has a dedicated circuit device 68. In this case, at least one side of the dedicated circuit device 68 mechanically contacts at least one side wall 60a of the through opening 60. Therefore, it is not necessary to place the dedicated circuit constructed separately from the micromechanical component 50 on / in the injection molding 52 after the injection molding 52 is formed, and to electrically attach the micromechanical component 50 to the dedicated circuit constructed separately from the micromechanical component via at least one bonding wire connection, as is conventionally done. In addition, this reduces the work expenditure to be undertaken in order to manufacture the semiconductor device. Moreover, in this case, the total volume left empty is not adversely affected by the dedicated circuit device 68.

[0036] As in Figure 2 As can be seen in FIG. 6 , the dedicated circuit arrangement 68 can also be located on a side of the micromechanical device 66 of the micromechanical component 50 arranged in the through-opening 60, in particular on a side of the at least one bendable membrane 62, which is directed away from the recess 56 / cover 54. By means of at least one inlet opening 70, each extending through the dedicated circuit arrangement 68, the pressure p present in the outer volume of the semiconductor device can still be conducted to the micromechanical device 66 of the micromechanical component 50.

[0037] The micromechanical component 50 can have at least one structured or unstructured substrate 72 and 74, each of which comprises at least one semiconductor material, for example, in particular silicon. Preferably, the micromechanical component 50 is arranged in the through-opening 60 in such a way that at least one outer surface of at least one substrate 72 and 74 of the micromechanical component 50 mechanically contacts at least one side wall 60a of the through-opening 60. This is advantageous because the molding compound sprayed onto at least one outer surface of at least one substrate 72 and 74 usually forms an air-tight and gas-tight mechanical contact with at least one outer surface in contact therewith.

[0038] By way of example only, Figure 2 The micromechanical component 50 of the semiconductor device arranged in the through-opening 60 has a functional layer structure 76 arranged on a first substrate 72 on the side of its micromechanical device 66 oriented toward the recess 56 and the cover 54, wherein, for example, at least one bendable membrane 62 and at least one counter electrode 64 are formed. At least one cavity 72a and / or at least one through-contact 72b that at least partially exposes the functional layer structure 76 can be formed on the first substrate 72. The circuit layer structure 78 formed on the second substrate 74 is located Figure 2The dedicated circuit device 68 of the semiconductor device of the embodiment of the present invention is directed toward the side of the recess 56 and the cover 54. At least one through-contact 74a can also extend through the second substrate 74. The micromechanical device 66 and the dedicated circuit device 68 can be fixed to each other via at least one bonding connection. Optionally, at least one solder ball 80 can also be mounted on the component outer surface 50b of the micromechanical component 50 that is directed away from the recess 56 and the cover 54.

[0039] Figure 3 A schematic diagram showing a second embodiment of a semiconductor device.

[0040] exist Figure 3 In the semiconductor device schematically shown in , the micromechanical component 50 arranged in the through-opening 60 also has a spacer 82 as an advantageous extension relative to the previously described embodiment, which is located at the end of the micromechanical component 50 that is oriented toward the recess 56 and toward the cover 54. At least one spacer side of the spacer 80 can also be mechanically contacted by at least one side wall 60a of the through-opening 60. Possibly, at least one access opening 84 is constructed on the spacer 82, by means of which, for example, the micromechanical device 66 of the micromechanical component 50 is at least partially opened / exposed from the spacer 82. The spacer 82 can be constructed, for example, as an annular spacer 82. The spacer 82 can be formed in particular by a material deposited on the functional layer structure 76.

[0041] The spacer 82 enables the micromechanical device 66 of the micromechanical component 50 to be arranged within the opening 60 so as to be set back compared to the bottom inner surface 52d. As is clear from the production method described below, it is possible in this way to prevent the micromechanical device 66 of the micromechanical component 50, in particular the at least one bendable membrane 62, from coming into contact with the die used for this purpose during the molding process / injection molding of the injection-molded body 52. ​​The semiconductor device described here can therefore also be produced relatively cost-effectively and simply during the process of equipping its micromechanical component 50 with at least one relatively sensitive bendable membrane 62.

[0042] As another optional extension, in Figure 3 A notch 86 is also formed on the end of the side wall region 52a of the injection molded body 52 of the semiconductor device pointing away from the bottom region 52b, and the cover 54 is clamped into the notch. With the configuration of the notch 86, the amount of adhesive required to fix the cover 54 on the injection molded body 52 can be reduced. The notch 86 can also achieve the fixation of the cover 54 on the injection molded body 52 without using adhesive. In addition, the configuration of the notch 86 on the side wall region 52a of the injection molded body 52 improves the stability and robustness of the semiconductor device realized.

[0043] about Figure 3For other characteristics and features of the semiconductor device and its advantages, refer to the above description. Figure 2 implementation method.

[0044] Figure 4 A schematic diagram showing a third embodiment of a semiconductor device is shown.

[0045] As per Figure 4 It can be seen that the spacer 82 can also be structured from at least one substrate 72 and 74 of the micromechanical component 50, in particular from the first substrate 72 of the micromechanical device 66. If necessary, the micromechanical device 66 and the dedicated circuit device 68 can also be fixed to each other via at least one bond connection formed between the functional layer structure 76 and the second substrate 74 of the dedicated circuit device 68.

[0046] If desired, at least one solder ball 80 can also be mounted on the bottom outer surface 52 c of the bottom region 52 b pointing away from the recess 56 .

[0047] about Figure 4 Other characteristics and features of semiconductor devices and their advantages refer to Figure 2 and 3 implementation method.

[0048] All the semiconductor devices described above can be operated with very little current consumption due to their high sensitivity. Only by way of example, the micromechanical component 50 of the semiconductor device described above is configured as a pressure sensor / capacitive pressure sensor, a sound sensor (for example, a structure-borne sound sensor in particular) or a microphone. However, the micromechanical component 50 of this type of semiconductor device may also include an inertial sensor and / or a chemical indicator sensor. It is pointed out again that the manufacture of the semiconductor device described above does not require the corresponding micromechanical component 50 to be expensively and easily glued into the associated injection molding 52. The appearance of acoustic leakage paths is (almost) excluded by the good structural scheme of the corresponding semiconductor device. In addition, each of the semiconductor devices can use its blank 56 as a relatively large reference volume. The increase of the blank 56 used as a reference volume hardly leads to an increase in cost when manufacturing the corresponding semiconductor device. As can be seen from the outside, the dedicated circuit device 62 and the micromechanical device can be constructed independently of the size of the blank 56 used as a reference volume.

[0049] Figures 5a to 5f A schematic diagram showing an intermediate product for explaining an embodiment of a method for manufacturing a semiconductor device is shown.

[0050] With the aid of the production method described further, in particular the above-explained embodiments of the semiconductor device can be produced. However, it is pointed out that the feasibility of the production method is not limited to such a semiconductor device.

[0051] In the production method described here, a respective injection-molded body 52 is formed for at least one micromechanical component 50. Figure 5a It can be seen that the production method can also be carried out at the wafer level in order to form each of the injection-molded bodies 52 for a plurality of micromechanical components 50. By carrying out all production steps of the further described production method for a plurality of micromechanical components 50 simultaneously in parallel / as a whole, semiconductor devices produced in this way can be produced cost-effectively.

[0052] Alternatively, a large number of micromechanical components 50 can also be produced on the wafer level, although this is Figure 5a For example, a large number of micromechanical devices 66 of micromechanical components 50 can be manufactured in a first wafer, and a large number of dedicated circuit devices 68 of micromechanical components 50 can be manufactured in a second wafer. If desired, at least one solder ball 80 can also be mounted on the later component surface 50b of each micromechanical component 50.

[0053] Subsequently, the first wafer can be bonded to the second wafer in such a way that the associated dedicated circuit arrangement 68 and the associated micromechanical arrangement are joined for each micromechanical component 50. The wafer stack obtained in this way can then be separated, wherein any openings / slits formed in the micromechanical components 50 can be covered by a sawing film before the wafer stack is separated, so that no sawdust can penetrate into the separated micromechanical components 50. Thus, a conventional sawing process can also be carried out to separate the micromechanical components 50.

[0054] Micromechanical components 50 separated from the wafer stack are arranged on pads 88, for example Figure 5a 8 is shown schematically in FIG. The pad 88 can be a carrier 88 or a foil 88, which firmly holds the micromechanical component 50 during the later injection molding of the micromechanical component 50 and at the same time covers the openings / slits that may be constructed on the micromechanical component 50 to prevent the intrusion of molding compound. Alternatively, the micromechanical component 50 can also be welded on a thin plate as a pad 88. If necessary, the openings / slits that may be constructed on the micromechanical component 50 can also be so-called bottom filled, that is, protected by a casting compound, which flows only on the component outer surface 50b of each micromechanical component 50 that is contacted by the pad 88 due to capillary forces.

[0055] exist Figure 5bIn the method step schematically shown in , pad 88 with dispersed micromechanical components 50 is placed in a molding press (not shown), wherein a die 90 is pressed against micromechanical components 50 on the side pointing away from pad 88. As an advantageous development, a film (not shown) is arranged between die 90 and at least one micromechanical component 50 before at least one micromechanical component 50 is overmolded with the molding compound of its later injection-molded body 52. ​​By using this film together with pad 88 and die 90, tolerance compensation can be achieved.

[0056] Die 90 is shaped such that free space 92 existing between pad 88 and die 90 pressed against at least one micromechanical component 50 with or without a membrane gives the desired shape of at least one subsequently formed injection-molded body 52 of at least one micromechanical component 50. Figure 5c , a molding method is subsequently carried out to form at least one injection-molded body 52 of at least one micromechanical component 50, in which at least one micromechanical component 50 is injection-molded around with the molding compound of at least one subsequent injection-molded body 52 using die 90. As already explained above, the molding method can be carried out in particular as "film molding" in that tolerance compensation is achieved with the aid of a film between die 90 and at least one micromechanical component 50 and the corresponding surface of at least one micromechanical component 50 is additionally protected.

[0057] In the molding method, based on the shape of the die 90 of at least one subsequent injection-molded body 52, a respective recess 56 is formed, which is framed by the side wall region 52a of the respectively surrounding injection-molded body 52, while on a first side of the respective recess 56, the recess 56 is covered at least partially in area by the bottom region 52b of the subsequent injection-molded body 52. ​​Furthermore, when forming the respective injection-molded body 52 of at least one micromechanical component 50, the respective micromechanical component 50 is surrounded by the molding compound in such a way that a respective through-opening 60 is formed on the bottom region 52b of the respective injection-molded body 52. Since at least one micromechanical component 50 is pressed against pad 88 during the molding method by means of punch 90 with or without a film, through-opening 60 formed in bottom region 52b of injection-molded body 52 of the micromechanical component is molded with at least one side wall 60a, which extends from recess 56 formed in the respective injection-molded body 52 to bottom outer surface 52c of the subsequent bottom region 52b formed in this way and pointing away from recess 56. In addition, during the molding method, at least one micromechanical component 50 is arranged in through-opening 60 of its subsequent injection-molded body 52 in such a way that at least one micromechanical component 50 mechanically contacts at least one side wall 60a of through-opening 60 formed in its injection-molded body 52.

[0058] The molding press can then be opened and the insert 88 with the at least one micromechanical component 50 arranged thereon and with its respectively formed injection-molded body 52 can be removed from the molding press. After the at least one micromechanical component 50 has been injection-molded with the molding compound and after the no longer required die 90 has been removed, the film can now be removed from the at least one injection-molded micromechanical component 50.

[0059] Intermediate products Figure 5d It can be seen that during the injection molding process for forming a plurality of subsequent injection-molded bodies 52 , the shaped injection-molded bodies 52 can also be connected together in an injection-molded body composite 94 .

[0060] Subsequently, at least one cover 54 is fixed to a corresponding side wall region 52a of at least one subsequent injection-molded body 52 on a second side of at least one recess 56 pointing away from the first side of the at least one recess 56, directly or via at least one intermediate component 58, in such a way that at least one cover 54 covers the recess 56 assigned to it on the second side of the recess. At least one cover 54 can be bonded directly or flatly to the injection-molded body 52 assigned to it in a cost-effective manner. Preferably, a plurality of cover 54 is applied as flat plates 96 to an injection-molded body composite structure 94 comprising a plurality of injection-molded bodies 52. Figure 5e The intermediate product obtained in this way is shown in . In a stack consisting of a flat plate 96 with a plurality of covers 54 and of an injection-molded body composite 94 comprising a plurality of injection-molded bodies 52 , the later semiconductor devices are still connected together.

[0061] exist Figure 5f Schematically, the separation of semiconductor devices produced in a wafer assembly is shown. A conventional sawing process can be carried out for separation, during which the micromechanical component 50 and the cutouts 56 of each separate semiconductor device are well protected from undesired penetration of sawdust due to the (co-)separated cover 54 and the (co-)separated injection molding 52 thereof.

Claims

1. A semiconductor device comprising: Micromechanical component (50); An injection-molded body (52) having at least one recess (56) formed on the injection-molded body (52), the recess being framed by a side wall region (52a) of the injection-molded body (52) and being covered on a first side of the recess (56) at least partially by a base region (52b) of the injection-molded body (52); and a cover (54) which is fixed to the side wall region (52a) on a second side of the recess (56) pointing away from the first side of the recess (56) directly or via at least one intermediate part (58) and covers the recess (56) on the second side of the recess; It is characterized in that A through-opening (60) is formed on the bottom region (52b) of the injection-molded body (52), wherein at least one side wall (60a) of the through-opening extends from the recess (56) to a bottom outer surface (52c) of the bottom region (52b) pointing away from the recess (56); and The micromechanical component (50) is arranged in the through-opening (60) such that the micromechanical component (50) is in mechanical contact with at least one side wall (60a) of the through-opening (60).

2. The semiconductor device according to claim 1, wherein The micromechanical component (50) has at least one structured or unstructured substrate (72, 74), the at least one substrate comprising at least one semiconductor material, and wherein the micromechanical component (50) is arranged in the through-opening (60) such that at least one outer surface of at least one substrate (72, 74) of the micromechanical component (50) mechanically contacts at least one side wall (60a) of the through-opening (60).

3. The semiconductor device according to claim 1 or 2, wherein: The recess (56) is covered on a first side of the recess by a base region (52b) of the injection-molded body (52) and a micromechanical component (50) arranged in the through-opening (60).

4. A semiconductor device according to any one of the preceding claims, wherein: The cover (54) is fixed to the side wall region (52a) in an airtight and gastight manner, directly or via the at least one intermediate part (58), and the mechanical contact of at least one side wall (60a) of the through-opening (60) with the micromechanical component (50) is airtight and gastight, whereby the recess (56) is sealed airtight and gastight relative to the external volume of the semiconductor device by means of the injection-molded body (52), the cover (54) and the micromechanical component (50).

5. The semiconductor device according to claim 4, wherein: The micromechanical component arranged in the through-opening (60) has at least one bendable diaphragm (62), a pressure (p) existing in the external volume acts on a corresponding first diaphragm surface (62a) of the diaphragm, and a reference pressure (p0) contained in the recess (56) acts on a corresponding second diaphragm surface (62b) of the diaphragm pointing away from the first diaphragm surface (62a).

6. A semiconductor device according to any one of the preceding claims, wherein: A micromechanical component (50) arranged in the through-opening (60) has a spacer (82) at its end oriented toward the recess (56), wherein at least one spacer side of the spacer (82) is in mechanical contact with at least one side wall (60a) of the through-opening (60).

7. A semiconductor device according to any one of the preceding claims, wherein: A micromechanical component (50) arranged in the through-opening (60) has a dedicated circuit arrangement (68), wherein at least one side surface of the dedicated circuit arrangement (68) is in mechanical contact with at least one side wall (60a) of the through-opening (60).

8. A semiconductor device according to any one of the preceding claims, wherein: The semiconductor device is a pressure sensor, a sound sensor, or a microphone.

9. A method for manufacturing a semiconductor device, comprising the following steps: Forming an injection-molded body (52) for a micromechanical component (50), the injection-molded body having a recess (56) formed on the injection-molded body (52), the recess being framed by side wall regions (52a) of the injection-molded body (52) and being covered on a first side of the recess (56) at least over a partial area by a bottom region (52b) of the injection-molded body (52); and fixing a cover (54) on the side wall region (52a) on a second side of the recess (56) pointing away from the first side of the recess (56) directly or via at least one intermediate part (58) so that the cover (54) covers the recess (56) on the second side of the recess; It is characterized in that When forming the injection-molded body (52), a through-opening (60) is constructed on a bottom region (52b) of the injection-molded body (52), at least one side wall (60a) of the through-opening extending from the recess (56) to a bottom outer surface (52c) of the bottom region (52b) pointing away from the recess (56), and the micromechanical component (50) is arranged in the through-opening (60) so that the micromechanical component (50) mechanically contacts at least one side wall (60a) of the through-opening (60).

10. The manufacturing method according to claim 9, wherein: In order to form the injection-molded body (52), the micromechanical component (50) is injection-molded around with a molding compound of the subsequent injection-molded body (52) using a die (90).

11. The manufacturing method according to claim 10, wherein: Before the micromechanical component (50) is injection-molded with the molding compound of the subsequent injection-molded body (52), a film is arranged between the die (90) and the micromechanical component (50), and after the micromechanical component (50) is injection-molded with the molding compound and the die (90) is removed, the film is removed from the injection-molded micromechanical component (50).

Images