Probe with planar unbiased spring element for electronic device contact, method of making the probe and method of using the probe

Abstract

A probe array for contacting an electronic device includes a plurality of probes (3500) for contacting between two electronic circuit elements and a dual array board mounting and retaining configuration. The probe may include: a lower retention feature (3501) protruding from the probe body, the size and configuration of which restricts a longitudinal extent of plate probe holes (3541-C) in which the probe can be inserted into a lower array plate (3450-L); and an upper retention feature (3502) extending laterally from the probe body, which is laterally displaced relative to the upper plate probe hole (3541-O) such that the upper retention feature is no longer able to longitudinally pass through the extension of the upper plate probe hole in the upper array plate (3540-U).

Description

[0001] Related Applications

[0002] This application claims priority to and the benefit of U.S. patent application serial number 18 / 295,712 filed on April 4, 2023 and U.S. provisional patent application serial number 63 / 327,926 filed on April 6, 2022, the entire disclosures of both applications are incorporated herein by reference. Technical Field

[0003] Embodiments of the present invention relate to microprobes (e.g., for wafer-level testing or socket testing of integrated circuits, or for making electrical connections to PCBs or other electronic devices), and more particularly, to pin-shaped microprobes (i.e., microprobes having a vertical or longitudinal height that is greater than its width (e.g., 5 times in some embodiments, 10 times in other embodiments, and 20 times in yet other embodiments)) or button-shaped probes, wherein the spring element has a planar configuration in an unbiased state. In some embodiments, the microprobes are at least partially made by an electrochemical manufacturing method, more particularly, by a multi-layer, multi-material electrochemical manufacturing method, and wherein, in some embodiments, multiple probes are put into use while maintaining an array structure, wherein the array structure includes one or more plates having through holes that engage features of the probes and / or other array holding structures. Background Art

[0004] Probe:

[0005] Many electrical contact probes and pin configurations have been used or proposed commercially, some of which may conform to the prior art, while others do not. For example, examples of such pins, probes, and methods of manufacture are described in patent publications US 2005-0104609, US 2006-0006888, US 2005-0184748, US 2006-0108678, US 2006-0238209, and patents US 7,640,651, US 7,265,565, US 7,412,767, US 7,273,812, US 10,215,775, US 11,262,383.

[0006] Electrochemical Manufacturing:

[0007] Electrochemical fabrication techniques for forming three-dimensional structures from multiple adhered layers have been or are being developed by Van Nuys, California. Inc. (formerly MEMGen Corporation) under the process names EFAB and MICA Carry out commercial development.

[0008] Various electrochemical manufacturing techniques are described in U.S. Patent No. 6,027,630 issued February 22, 2000 to Adam Cohen.

[0009] Another method of forming microstructures using electrochemical fabrication techniques is taught in U.S. Patent No. 5,190,637 to Henry Guckel, entitled "Formation of Microstructures by Multiple Level Deep X-ray Lithography with Sacrificial Metal Layers."

[0010] Electrochemical manufacturing provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable cost and in reasonable time. In fact, electrochemical manufacturing is the enabler for the formation of many structures that have heretofore been impossible to make. Electrochemical manufacturing opens the door to new designs and products in many industrial fields. Although electrochemical manufacturing provides this new capability, and it is understood that electrochemical manufacturing techniques can be combined with known designs and structures in various fields to make new structures, certain uses of electrochemical manufacturing provide designs, structures, capabilities, and / or features that are unknown or not obvious in the prior art.

[0011] There is a need in various fields for microdevices with improved properties, reduced manufacturing time, reduced manufacturing costs, simplified manufacturing processes, greater versatility in device design, improved material selection, improved material properties, more cost-effective and lower risk manufacturing of such devices, and / or greater independence between geometric configuration and selected manufacturing process. Summary of the invention

[0012] An object of some embodiments of the present invention is to provide an improved probe array comprising a probe comprising a flexible element formed by a plurality of flexible modules, the flexible modules comprising a planar but nonlinear (i.e., non-straight) spring structure when unbiased (i.e., the spring structure is not a straight rod without bends or angles, but has a certain two-dimensional structure in the plane of at least one layer providing bends or curves), wherein the plane of the spring is perpendicular to the longitudinal axis of the probe and provides flexibility along the longitudinal axis of the probe, wherein the flexible modules are stacked in series. The probe with a nonlinear spring structure can provide a linear spring rebound force or a nonlinear rebound force when biased.

[0013] In another aspect of the invention, a probe array comprises: (1) a plurality of probes for making contact between two electronic circuit elements, each probe comprising: (a) at least one flexible structure comprising: (i) at least one relatively rigid support having a first end and a second end separated longitudinally; (ii) at least one first flexible element comprising a two-dimensional substantially planar spring when unbiased, wherein the first flexible element provides flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first flexible element is functionally coupled to the at least one support and a second portion of the first flexible element is functionally coupled to a first end arm, the first end arm being capable of flexibly moving relative to the support, wherein the first end arm directly or indirectly holds the first end, and when the first flexible element is not biased, the first end extends longitudinally beyond the first end of the at least one bracket; and (iii) at least one second flexible element, which includes a spring, wherein the second flexible element provides flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second flexible element is functionally connected to the at least one bracket, and a second portion of the second flexible element is functionally connected to a second end arm, and the second end arm is capable of flexibly moving relative to the bracket, wherein the second end arm directly or indirectly holds the second end, and when the second flexible element is not biased, the second end extends longitudinally beyond the first end of the at least one bracket. The invention relates to a second end extending beyond the at least one bracket, wherein the first portion of the first flexible element and the first portion of the second flexible element are longitudinally spaced apart from each other, and wherein, when at least one of the first and second ends is biased toward the other, the second portion of the first flexible element and the second portion of the second flexible element move longitudinally in a manner selected from the group consisting of: (A) moving closer together; and (B) moving further apart; (2) a lower array plate having a plurality of lower plate probe holes; (3) an upper array plate having a plurality of upper probe holes, wherein at least a portion of the upper probe holes includes at least one sidewall feature that provides a function of extending the upper probe holes to a corresponding portion of the lower hole on the lower array plate. wherein the lower array plate is configured to receive the probe from above the lower array plate; wherein the upper array plate is configured to receive the probe from below the upper array plate; wherein at least a portion of the plurality of probes further comprises at least one lower retaining feature and at least one upper retaining feature, wherein the at least one lower retaining feature is configured to at least engage the lower array plate, and the at least one upper retaining feature is configured to at least engage the upper array plate; wherein the at least one lower retaining feature comprises at least one lateral extension feature, the lateral extension feature protruding from the body of the corresponding probe, the size and configuration of which limit the longitudinal range to which the corresponding probe can be inserted into the hole of the lower array plate;wherein the at least one upper retaining feature comprises at least one tab-like feature extending laterally from the body of the probe at a level above the lower retaining feature and spaced longitudinally from the lower retaining feature by a gap greater than the thickness of the longitudinal engagement portion of the upper array plate, and wherein the at least one upper retaining feature has a transverse configuration sized to pass through the extension provided by the sidewall feature when aligned; and wherein, after the upper retaining feature is longitudinally positioned above the extension of the hole in the upper array plate, the retaining feature is laterally displaced relative to the hole such that the at least one upper retaining feature is no longer able to longitudinally pass through the extension of the hole in the upper array plate.;

[0014] There are many variations to the above-described aspects of the present invention, and such variations will be apparent to those skilled in the art after reading the teachings herein.

[0015] Those skilled in the art will understand other aspects of the present invention after reading the teachings herein. Other aspects of the present invention may relate to combinations of the above aspects. These other aspects of the present invention may provide various combinations of the above aspects, and may provide other configurations, structures, functional relationships and processes that are not specifically described above but are described herein, by the overall teachings of this specification, or by the teachings incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] 1A-1F schematically depict the use of adhesion mask plating to form a first layer of a structure, wherein a blanket deposition of a second material covers both openings between deposition locations of the first material and the first material itself.

[0017] FIG. 1G depicts the formation of the first layer completed by planarizing the deposited material to the desired level.

[0018] 1H and 1I depict process states after forming multiple layers of a structure and after releasing the structure from a sacrificial material, respectively.

[0019] Figure 2 Depicted is an isometric view of an exemplary spring module or flexible module having two connected spring elements, a base, and a connecting support or bracket that may be used in or as a probe.

[0020] Figure 3 Depicted is an isometric view of a second exemplary spring module or flex module similar to Figure 2 A module which can be used in or as a probe, except that the two spring elements are thicker and thus provide a greater Figure 2 The element has a larger spring constant.

[0021] Figure 4A to Figure 4D4 Various views are provided of a probe formed from two back-to-back modules sharing a common base which also serves as a stand and has an annular configuration.

[0022] Fig.4E1 Figures 4A to 4B are provided. Figure 4D4 Side view of a probe showing the 17 sample levels from which the probe can be made, where not all layers have a unique configuration.

[0023] Figure 4E2-A to Figure 4E9-B A cross-sectional configuration shown in both a top view (-A) and an isometric view (-B) of the unique configuration of layers L1-L17 is shown, wherein: Fig.4E2-A and FIG. 4E2-B shows a view of layers L1 and L17; Figure 4E3-A and Figure 4E3-B A view of layers L2, L4, L6 and L8 is shown; Figure 4E4-A and Figure 4E4-B A view of layers L3 and L7 is shown; Figure 4E5-A and Figure 4E5-B A view of layer L5 is shown; Fig.4E6-A and Figure 4E6-B A view of layer L9 is shown; Figure 4E7-A and Figure 4E7-B A view of layers L10, L12, L14 and L16 is shown; Figure 4E8-A and Figure 4E8-B A view of layers L11 and L15 is shown; Figure 4E9-A and Figure 4E9-B A view of layer L13 is shown.

[0024] FIG. 5A1 to FIG. 5H An exemplary probe and dual array plate mounting and retention configuration is shown according to an embodiment of the present invention, which uses a lateral sliding lock or tab and a retaining ring in conjunction with two array plates.

[0025] Figure 5A1 and Figure 5A2 Isometric views of an exemplary probe according to an embodiment of the present invention are provided from above and below, respectively, wherein the probe includes a mounting ring or retaining ring for engaging the top edge of a circular through hole in a lower engagement plate, and a sliding clip or tab located on the right side of the probe for engaging the upper right edge of an oblong through hole in an upper array plate.

[0026] Figure 5B1 and Figure 5B2 An isometric view and a top view are provided, respectively, of the lower array plate portion, showing a single circular through hole, Figure 5A1 and Figure 5A2 The lower portion of the probe can be inserted through the through hole.

[0027] Fig.5C1 and Fig.5C2 An isometric view and a top view are provided, respectively, of the upper array plate portion, showing a single oblong through hole, Figure 5A1 and Figure 5A2 The upper portion of the probe can be inserted longitudinally through the through hole and then displaced laterally.

[0028] Figure 5D Provided Figure 5A1 and Figure 5A2 An isometric view of the probe that Figure 5B1 and Figure 5B2 The probe is laterally aligned above the circular opening of the lower array plate portion of the array plate to prepare for relatively longitudinal movement or loading of the probe into the circular opening in the lower array plate by relatively moving the probe in the direction indicated by the arrow.

[0029] Figure 5E Provided Figure 5A1 and Figure 5A2 , Figure 5B1 and Figure 5B and Figure 5D An isometric view of the probe and lower array plate portion after the probe is longitudinally loaded into the circular opening of the lower array plate so that the retaining ring of the probe rests on the upper surface of the lower array plate and so that the lateral alignment of the probe and the lower array plate is maintained by appropriate sizing and tolerance settings of the probe diameter and the diameter of the opening in the lower array plate.

[0030] Fig. 5F Provided Figure 5A1 and Figure 5A2 The probe is located relative to Figure 5B1 and Figure 5B2 Isometric view of the final position of the lower array plate section, with the probes in Fig.5C1 and Fig.5C2 The upper array plate portion is laterally aligned below the oblong opening to prepare for relative longitudinal movement or loading of the probe into the oblong opening by relative movement of the upper array plate in the direction indicated by the arrow, wherein the lateral alignment is such that only longitudinal movement will allow the upper array plate to slide through to a position below and beside the retaining tab.

[0031] Figure 5G Probes, lower array plate and upper array plate portions are provided in their final longitudinal positions. Fig. 5F Isometric view after the motion shown, but not completing the necessary relative lateral movement of the upper array plate relative to the probe and lower array plate as shown by the arrows to complete the interlocking of the edge of the upper array plate between the probe retention ring and the retention tab.

[0032] Figure 5HProbes, lower array plate and upper array plate portions are provided in their final longitudinal and lateral positions. Figure 5G The isometric view after movement is shown so that maintenance of the longitudinal positioning of the plates in their relative positions provides for retention of the probe, the position and alignment of which is determined by the dimensions and tolerance settings of these three components. DETAILED DESCRIPTION

[0033] Electrochemical Manufacturing Overview

[0034] Figures 1A to 1I show side views of various states in an exemplary multi-layer, multi-material electrochemical manufacturing process. Figures 1A to 1G show various stages of single-layer formation of a multi-layer manufacturing process, in which a second metal is deposited on a first metal and in an opening in the first metal so that the first and second metals form part of the layer. In Figure 1A, a side view of a substrate 82 having a surface 88 is shown, on which a patternable photoresist 84 is located as shown in Figure 1B. In Figure 1C, a resist pattern resulting from curing, exposure, and development of the resist is shown. The patterning of the photoresist 84 results in openings or holes 92 (a)-92 (c) extending from the surface 86 of the photoresist through the thickness of the photoresist to the surface 88 of the substrate 82. In Figure 1D, a metal 94 (e.g., nickel) is shown as having been electroplated into the openings 92 (a)-92 (c). In FIG. 1E , the photoresist has been removed from the substrate (i.e., chemically or otherwise stripped) to expose areas on the substrate 82 that are not covered by the first metal 94. In FIG. 1F , a second metal 96 (e.g., silver) is shown as being blanket plated over the entire exposed portion of the substrate 82 (which is conductive) and the first metal 94 (which is also conductive). FIG. 1G depicts the completed first layer of the structure, which is formed by flattening the first and second metals to a height that exposes the first metal and setting a thickness for the first layer. In FIG. 1H , the result of repeating the process steps shown in FIGS. 1B to 1G multiple times to form a multilayer structure is shown, wherein each layer is composed of two materials. For most applications, one of these materials is removed, as shown in FIG. 1I , to produce a desired 3D structure 98 (e.g., a device or apparatus) or multiple such structures.

[0035] Various embodiments of various aspects of the present invention relate to forming three-dimensional structures from materials, some or all of which can be deposited electrolessly or electrolessly (as shown in the examples of Figures 1A to 1I, and as discussed in the various patent applications incorporated herein by reference). Some of these structures can be formed from a single build level formed from one or more deposited materials, while other structures are formed from multiple build layers, each layer including at least two materials (e.g., two or more layers, more preferably five or more layers, most preferably ten or more layers). In some embodiments, the layer thickness can be as small as one micron or as large as fifty microns. In other embodiments, thinner layers can be used, while in other embodiments, thicker layers can be used. In some embodiments, the microscale structure has lateral features positioned with 0.1 to 10 micron-level accuracy, and the minimum feature size is on the order of a few microns to tens of microns. In other embodiments, structures with less precise feature placement and / or larger minimum features can be formed. In yet other embodiments, higher accuracy and smaller minimum feature sizes may be desired. In this application, mesoscale and millimeter scale have the same meaning and refer to devices that may have one or more such dimensions, which may extend to the range of 0.5 to 50 mm or larger, with positioning accuracy of features in the range of microns to 100 microns, and minimum feature size on the order of tens of microns to hundreds of microns.

[0036] Various embodiments, alternatives, and techniques disclosed herein may form a multilayer structure using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the present invention may use conformal contact masks and masking operations (i.e., operations using a mask that contacts but does not adhere to a substrate), proximity masks and masking operations (i.e., operations using a mask that selectively shields a substrate at least partially through its proximity to the substrate even without contact), non-conformal masks and masking operations (i.e., masks whose contact surfaces are not obviously conformal and operations based on such masks), and / or adhesion masks and masking operations (masks that adhere to a substrate and operations using such masks, selective deposition or etching will occur on the substrate, rather than just in contact with the substrate) to perform selective patterning operations. Conformal contact masks, proximity masks, and non-conformal contact masks share the characteristic that they are pre-formed and brought to or near the surface to be processed (i.e., the exposed portion of the surface to be processed). These masks can generally be removed without damaging the mask or the surface to which it contacts or is near to be processed. Adhesion masks are typically formed on the surface to be treated (i.e., the portion of the surface to be masked) and bonded to the surface so that they cannot be separated from the surface unless completely destroyed or damaged beyond any point of repeated use. Adhesion masks can be formed in a variety of ways, including: (1) by applying a photoresist, selectively exposing the photoresist, and then developing the photoresist; (2) selectively transferring a pre-patterned mask material; and / or (3) directly forming the mask by computer-controlled material deposition. In some embodiments, the adhesion mask material can be used as a sacrificial material for a layer, or can be used only as a mask material that is replaced by another material (e.g., a dielectric or conductive material) before completing the formation of the layer, where the replacement material will be considered the sacrificial material of the corresponding layer. The mask material may or may not be planarized before or after depositing the material into the voids or openings included therein.

[0037] Patterning operations can be used to selectively deposit materials and / or can be used for selective etching of materials. The selective etching area can be selectively filled with different desired materials or filled by blanket deposition, etc. In some embodiments, layer-by-layer construction may involve forming multiple layers at the same time. In some embodiments, deposition associated with certain levels may cause deposition to areas associated with other levels (i.e., areas within the top and bottom boundary levels of the geometric structures defining different layers). Smalley describes this use of selective etching and / or interlaced material deposition associated with multiple layers in U.S. Patent Application No. 10 / 434,519 filed on May 7, 2003, which is currently U.S. Patent No. 7,252,861, entitled "Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids". The cited application is incorporated herein by reference.

[0038] The temporary substrate on which the structure may be formed may be sacrificial (i.e., destroyed or damaged to the point of being unusable during separation of the deposited material) or non-sacrificial (i.e., not destroyed or excessively damaged, i.e., not damaged to the point of being unusable, e.g., having a sacrificial or release layer between the substrate and the initial layer of the structure being formed). Non-sacrificial substrates may be considered reusable, requiring little or no rework (e.g., by re-planning one or more selected surfaces or by applying a release layer, etc.), although they may or may not be reused for a variety of reasons.

[0039] Those skilled in the art will appreciate the definitions of various terms and concepts that can be used to understand the various embodiments of the present invention (whether the device itself, certain methods of making the device, or specific methods of using the device). Some such terms and concepts are discussed herein, while other such terms are referred to in various patent applications (e.g., U.S. Patent Application No. 16 / 584,818) to which this application claims priority and / or are incorporated herein by reference.

[0040] "Longitudinal" used herein refers to the long dimension of a probe, the end-to-end dimension of a probe, or the end-to-end dimension of a probe. Longitudinal may refer to a substantially straight line extending from one end of a probe to the other end of the probe, or may refer to a curved or stair-step-shaped path with an inclination or even a change of direction along the probe height. When referring to a probe array or a probe to be loaded into an array configuration, the longitudinal dimension may refer to a specific direction in which the probe in the array points or extends, but may also simply refer to the overall height of the array, which begins with a plane comprising a first end, end or base of a plurality of probes, and extends perpendicularly to the plane to a plane comprising a second end, end or top of the probe. The context of use generally clearly indicates what is particularly meant to a person skilled in the art. The intention is that the interpretation applied to the term herein should be as narrow as possible, as long as the details of the description provided or the context in which the term is used ensures. However, if it is reasonable not to have this narrow interpretation, then the broadest reasonable interpretation range should be applied.

[0041] As used herein, "lateral" is related to the term "longitudinal". In the case of stacking of layers, lateral refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions within the plane of the layer substantially perpendicular to the direction in which the layers are stacked). When referring to an array of probes, lateral generally has a similar meaning, since the lateral dimension is generally a dimension within a plane parallel to the top or bottom plane of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to the probes themselves, the lateral dimension may be a dimension perpendicular to the overall longitudinal axis of the probe, the local longitudinal axis of the probe (i.e., the local lateral dimension), or simply a dimension similar to the dimension of the array or layer. The context of use generally makes clear what is particularly meant to a person skilled in the art. It is intended that the interpretation applied to the terms herein should be as narrow as possible, as long as the details of the description provided or the context in which the term is used warrants. However, if no such narrow interpretation is reasonable, then the broadest range of reasonable interpretation should be applied.

[0042] As used herein, "substantially parallel" means parallel or nearly parallel, i.e., within 15° of parallel, more preferably within 10° of parallel, even more preferably within 5° of parallel, and most preferably within 1° of parallel. If the term is used without clarification, it should be interpreted as within 15° of parallel. When used with a specific clarification, the term should be interpreted in accordance with the specific clarification.

[0043] As used herein, "substantially perpendicular" or "substantially orthogonal" means perpendicular or nearly perpendicular, i.e., within 15° of perpendicular, more preferably within 10° of perpendicular, even more preferably within 5° of perpendicular, and most preferably within 1° of perpendicular. If the term is used without clarification, it should be interpreted as within 15° of perpendicular. When used with a specific clarification, the term should be interpreted in accordance with the specific clarification.

[0044] As used herein, "substantially planar" when referring to a surface refers to a surface that is intended to be planar, although some imperfections may exist as will be appreciated by those skilled in the art (i.e., when referring to millimeter and micrometer devices (which are the primary device embodiments discussed herein), these imperfections may deviate from planarity by as much as 1 to 5 microns, but are typically submicron in nature). If the term is used without clarification, it should be interpreted as having imperfections that deviate from planarity by no more than 5 microns. When used with a specific clarification, the term should be interpreted in accordance with the specific clarification. When referring to a structure, the term does not refer to an infinitely thin structure, but rather to a structure formed by substantially planar top and bottom surfaces, for example, the top surface or bottom surface of each layer or a group of successively formed layers of a structure formed using a multi-material multilayer electrochemical manufacturing method, particularly when each layer undergoes a planarization operation such as grinding, fly cutting, chemical mechanical planarization, spreading by spin, and the like. In some cases, a substantially planar structure may also mean that the structure or an element of the structure is small in height or thickness compared to the size of the structure in two perpendicular dimensions (i.e., the ratio of vertical footprint to thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200). If the term is used with respect to a structure without clarification, it should be interpreted as meeting the substantially planar surface criteria for both the upper and lower surfaces. In some cases, a ratio requirement may also apply, i.e., a ratio of at least 25. When used with a specific clarification with respect to a structure, the term should be interpreted in accordance with the specific clarification.

[0045] As used herein, "relatively rigid" refers to the comparison of rigidity between two structural elements when the two structural elements are subjected to a working load or stress, wherein the relatively rigid structural element should reduce deflection or twisting by at least 2 times, more preferably 5 times, and most preferably 10 times, compared to the other structural element. If the term is used with respect to a structural element without clarification, it should be interpreted as meeting the requirement of a factor of 2. When used with a specific clarification with respect to a structural element, the term should be interpreted in accordance with the specific clarification.

[0046] As used herein, "nonlinear configuration" refers to a configuration that is not a straight rod-like configuration, particularly when applied to a physical structure or element. Nonlinear configurations are essentially two-dimensional or three-dimensional configurations with features that include one or more bends or curves. For example, a planar nonlinear configuration may be a planar helical configuration. When referring to a spring, a nonlinear configuration as used herein does not refer to a force-deflection relationship unless such a relationship is specifically and unambiguously indicated.

[0047] Probes with flat spring modules:

[0048] The planar spring or planar flexible element of the present invention can be formed in a variety of different ways and in a variety of different configurations. Typically, the flexible element includes a planar spring having a portion extending from a support to a terminal or terminal arm in a cantilevered or bridged manner over a gap or open area (e.g., two or more springs starting from different lateral support positions and connected to a common terminal arm, generally referred to herein as one or more cantilevers), into which the spring may deflect during normal operation. These flexible portions typically have a two-dimensional nonlinear configuration in a transverse plane and have a thickness extending perpendicular to the plane (e.g., in a longitudinal direction), wherein the two-dimensional configuration can be in the form of a beam structure having a curved or angled configuration, whose length is much greater than its width, such as at least 5, 10, 20 or even 50 times or more in some variations, wherein the thickness is typically less than the length of the beam, such as at least 5, 10, 20 or even 50 times or more in some variations, or less than the transverse dimension of the spring element, such as 2, 5, 10 or even 20 times or more in some variations. In some embodiments, when the probe or module is formed from multiple adhered layers, the plane of this construction can be parallel to the layer plane (e.g., XY plane). The thickness of the spring (e.g., in the Z direction) can be the thickness of a single layer, or can be the thickness of multiple layers. In some embodiments, the flexible element includes a plurality of spaced-apart planar spring elements.

[0049] In some embodiments, the flexible elements may include planar spring elements that are connected to each other not only at the bracket or end structure, but also at intermediate locations to these end elements. In some such embodiments, the planar spring elements may start at one end (e.g., the bracket or end arm) as one or more thickened springs with a relatively high spring constant, and then provide a reduced spring constant by removing some of the intermediate spring material between the top and bottom of the initial spring structure, thereby transitioning from a small number of initially thicker planar flexible elements (e.g., 1, 2, or 3 elements) to a larger number of thinner planar elements, wherein some of the initial planar elements are divided into 2, 3, 4, 5, or more planar but thinner elements before reaching the other end (e.g., the end arm of the bracket), whereby, for example, spring constants, force requirements, overtravel, stress, strain, current carrying capacity, overall size, and other operating parameters may be tailored to meet the requirements of a given application.

[0050] exist Figures 2 to 5H Many of the drawings include reference numbers where the same numbers are used to represent similar structures or features in different embodiments.

[0051] An exemplary spring module is Figures 2 to 3 shown. Figure 2An isometric view of an exemplary spring module 200 is depicted having two undeflected spring elements 221-1 and 221-2, a base 201 spaced apart from the spring elements, and a connecting support (e.g., a bracket or bridge) 211 bridging a longitudinal module gap MG between the spring elements and the base. Figure 2In the example of , each of the two spring elements is in the form of a planar radially extending spiral extending from a radially displaced bridge 211 via a downwardly extending portion of the end structure to a centrally or axially positioned end element 231. The springs are separated longitudinally by a gap SG. In this example, the bridge 211 connects one end of each spring element together, while the end element 231 connects the other end of the spring element together via an extension of the end structure. The end element 231 is formed with a desired width TW and a desired end height TH extending above the upper spring, each spring element is formed of a desired material and is formed with a desired beam thickness or spring height SH, beam width or spring width SW, spacing between spring turns CS, and a coiled beam length that allows the spring to deflect by a desired amount without exceeding the elastic deflection limit of the structure and the associated materials forming the structure, while providing a desired fixed or variable spring force within its deflection range. In particular, the length of the end can enable a desired compression of the module end toward the base without the base, bridge and spring elements interfering with each other. In some embodiments, for example, the maximum travel distance of the end of each module can be as small as 5 μm (μm = micrometer) or less, or can be as large as 500 μm (e.g., 25 μm, 50 μm, 100 μm, or 200 μm) or more. For example, in some embodiments, the maximum travel distance of each module can be 25 μm to 200 μm, while in other example embodiments. The maximum travel distance of each module can be 50 μm to 150 μm. In some embodiments, the maximum travel distance of the end can be set by a hard stop, such as by contacting the deflection portion of a spring or the end with the base, by a stop structure on the base, or possibly by contacting the upper portion of the bridge with a surface in contact with the end (e.g., the surface of an adjacent module). In other embodiments, the maximum travel distance can be achieved by contacting a flexible spring or an end portion with a soft stop or a flexible reduction structure. The force to achieve the maximum deflection (or stroke) can be as small as 0.1 grams of force to as large as 20 grams of force or more. In some embodiments, a force target of 0.5 grams may be appropriate. In other cases, 1 gram, 2 grams, 4 grams, 8 grams, or more may be suitable. In some embodiments, a module height MH (longitudinal dimension) of 50 μm or less may be targeted, while in other embodiments, a module height of 500 μm or more may be targeted. In some embodiments, the total module radial diameter or width MW may be 100 μm or less, or 400 μm or more (e.g., 150 μm, 200 μm, or 250 μm). One or more spring beam elements of the module may have a spring height SH from 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm), and a beam width or spring width SW from 1 μm or less to 100 μm or more (e.g., 10, 20, 30, or 40 μm).The ends may have uniform or varying geometries (e.g., cylindrical, rectangular, conical, multi-pronged, or other configurations, or combinations of configurations). The ends (where they are joined to the spring beams) will typically have a cross-sectional width TW greater than the width SW of the beam or beams to which they are connected.

[0052] Figure 3 An isometric view of a second exemplary spring module 300 is shown, which is similar to Figure 2 The difference is that the two spring elements are thicker and thus provide a Figure 2 From another perspective, Figure 3 will require a greater force for a given deflection and, therefore, will reach the yield strength of the combined material and structural geometry (e.g., reach the elastic deflection limit) than Figure 2 The example is small.

[0053] In other embodiments, the spring module may be Figure 2 or Figure 3 The different forms shown. For example: (1) the module can have a single spring element or more than two spring elements; (2) each spring element can have variations in one or more of width, thickness, length, or rotational range; (3) the spring elements can vary in the length of the element; (4) the spring elements can have a configuration other than an Euler spiral, such as a rectangular spiral, a rectangular spiral with rounded corners, an S-shaped structure, or a C-shaped structure; (5) each spring element can be connected to multiple bridging joints, such as to bridging connection points located 180 degrees, 120 degrees, or 90 degrees around the module; (6 ) the bridging joints can be located on different bridging members; (7) the radial extent of the base element can be smaller than the spring / bridging joint so that when the modules are stacked, the base of the higher module can extend below the upper extent of the lower adjacent module when the module end is sufficiently compressed; (8) the module base can be replaced with additional springs that allow the module springs to be compressed in two directions when deflected; (9) the probe tip can be not laterally centered relative to the overall lateral construction of the module (i.e., not coincident with or even colinear with the compression axis or the main build axis when formed layer by layer).

[0054] Figure 4A to Figure 4D4Various views of a probe 3400 or portions thereof are provided, wherein the probe is formed of two back-to-back (or base-to-base) modules, wherein the two modules share a common base having an annular configuration, and the probe includes a number of different features: (1) an annular base or frame 3401 that holds an upper coil spring array 3421-UC and a lower coil spring array 3421-LC by their outermost lateral extents to provide a basic stenting function between the upper and lower spring arrays, wherein the base or frame 3401 has a circular exterior with an interior opening, the interior opening being shaped so as to provide a plurality of different features; The lower opening has opposing arcuate sides 3401-A and narrower opposing flat sides 3401-F, wherein the upper and lower surfaces joining the flat sides provide attachment areas for connection with upper and lower supports or brackets 3411-1, 3411-2, 3412-1 and 3412-2, which in turn support the ends of the helical spring element, and the arcuate areas provide gaps over which the outermost cantilevered portions of the spring can be located (before deformation), wherein the thickness of the base acts as a bracket spacer, wherein portions of the helical spring can be located The probe tip deflects toward each other during compression; (2) each of the upper and lower spring arrays begins its inward path from an opposing pair of brackets with two longitudinally separated coplanar coiled helical cantilever pairs 3421-1U and 3421-2U ​​(located above the base) and 3421-1L and 3421-2L (located below the base), each cantilever of each element splitting into two longitudinally spaced cantilevers midway through its inward stroke, such that four upper cantilever elements UC1-UC4 connect each side of the upper end arm 3431-UA, while four lower cantilever elements LC1-LC4 connect the lower end arms 3431-UA and 3431-UA, respectively. On either side of the end arm 3431-LA, the lower end arm supports the contact or coupling ends 3431-U and 3431-L, respectively; (3) the rotational orientation of the spiral spring element connecting the upper contact end has an opposite rotational orientation relative to the spring element connecting the lower contact end; and (4) the brackets 3411-1, 3411-2, 3412-1 and 3412-2 only provide intermediate bracket functions between the multiple beams of the upper spiral array and between the multiple spiral beams of the lower spiral array, but do not provide bracket functions between the two spring groups because this function is directly provided by the base 3401.

[0055] Figure 4A Figure 4B1 and Figure 4B2 A side view, an upper isometric view, and a lower isometric view are provided, respectively, of probe 3400, in which various features of the probe can be seen. Figure 4B1 A view of the uppermost pair of coil springs of the upper spring section of the probe is provided, and Figure 4B2 A view of the lowermost pair of coil springs of the lower spring section of the probe is provided. Figure 4B1 and Figure 4B2Each of the diagrams provides a view of the upper end 3431-U and the lower end 3431-L together with the central base 3401. FIG. 4A, Figure 4B1 and Figure 4B2 Views of upper brackets 3411-1 and 3411-2 and lower brackets 3412-1 and 3412-2 are also provided, as well as views of the outer portions of longitudinally separated upper cantilever elements 3421-1U and 3421-2U ​​and lower cantilever elements 3421-1L and 3421-2L. It can also be seen that the staggered paths of the coplanar cantilever element pairs extend inwardly from their respective brackets to meet at their respective central ends.

[0056] Fig.4C1 and Figure 4C2 Exploded isometric views of the probe 3400 from the upper and lower perspectives are provided, respectively, so that not only the bottom of the lower cantilever element and the top of the upper cantilever element can be seen, but also the top of the lower cantilever element and the bottom of the upper cantilever element can be seen, as well as the interior of the annular base 3401 including the flat and curved sidewalls 3401-F and 3401-A. Fig.4C1 and Figure 4C2 In FIG. 3 , the upper spring section or upper flexible element 3421-UC of the probe is separated from the central frame or base element 3401, which is in turn separated from the lower spring section or lower flexible element 3421-LC of the probe. Fig.4C1 The upper end 3431-U can be seen in FIG, as well as the tops of the upper and lower spring sections and the top of the center frame element. Figure 4C2 3431-L can be seen, as well as the bottom of the upper and lower spring segments 3421-UC and 3421-LC and the bottom of the central frame element 3401. As shown by the dotted line connecting the exploded elements, the central frame element 3401 supports the outermost lateral extents of the upper and lower spring segments, and more particularly, the central frame element supports the brackets 3411-1, 3411-2, 3412-1 and 3412-2 that support the cantilever elements.

[0057] Figures 4D1 to 4D4Four different cross-sectional views of the probe 3400 are provided, with progressively larger portions of the sides of the probe cut away to reveal the internal structure of the probe, making it easier to see and understand the changes in the cantilever. As the helical element rotates inwardly toward the laterally centered end element, the cantilever element undergoes a transition from two longitudinally separated cantilever elements 3421-2U ​​and 3421-1U above the base 3401 and two longitudinally separated cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally separated cantilever elements UC1-UC4 above the base and four longitudinally separated elements LC1-LC4 below the base, where the beam reaches its respective longitudinally movable end arm elements 3431-UA and 3431-LA (as shown in FIG. 1 ). Figure 4D3 As clearly shown), these end arm elements are connected or become ends 3431-U and 3431-L respectively.

[0058] Fig.4E1 A side view of a probe 3400 similar to FIG. 4A is provided, except that 17 sample layer levels L1 to L17 are defined, each layer having a defined thickness along the longitudinal axis of the probe (i.e., the Z axis shown), and the probe can be manufactured from these layers, for example, by a multi-layer manufacturing process, such as a multi-layer multi-material electrochemical manufacturing process using a single or multiple structural materials (together with sacrificial materials) and using a build axis or layer stacking axis corresponding to the longitudinal axis of the probe. In such a formation embodiment, although the probes can be formed one at a time, it is generally preferred to form the probes in batches by forming hundreds or even thousands of probes simultaneously through successive layer-by-layer stacking.

[0059] Figure 4E2-A to Figure 4E9-B The cross-sectional configurations shown in both a top view (-A) and an isometric view (-B) are shown for eight unique configurations of layers L1-L17.

[0060] Fig.4E2-A and Figure 4E2-B shows a view of layers L1 and L17, where the ends can be seen, which are the lower end 3431-L of layer L1 and the upper end 3431-U of layer L17.

[0061] Figure 4E3-A and Figure 4E3-B Views of layers L2, L4, L6 and L8 are shown providing portions of the planar spring spirals 3421-1L, 3421-2L and their innermost regions forming cantilever segments LC1 to LC4 (unlabeled), portions of the lower center end arm 3431-LA, and portions of the lower supports 3412-1 and 3412-2, wherein the double staggered spiral construction can be seen.

[0062] Figure 4E4-A and Figure 4E4-BA view of layers L3 and L7 is shown, in which incomplete helical elements 3421-1L, 3421-2L and stents 3412-1 and 3412-2 (similar to Figure 4E3-A and Figure 4E3-B , but lacks the LC1-LC4 portion). The helical portions reflected in these figures are consistent with Figure 4E3-A and Figure 4E3-B The overlapping and lower layer portions combine to form a thickened spiral section in the outermost lateral portion of the spring, wherein the lower flexible element 3421-LC includes only two thickened cantilever elements as opposed to four thinner cantilever elements LC1-LC4 connecting the end arms at the innermost portion of the spring.

[0063] Figure 4E5-A and Figure 4E5-B A view of layer L5 is shown, which includes a portion of the lower end arm 3431-LA and portions of brackets 3412-1 and 3412-2 that provide a connection between cantilever spring portions 3421-1L and 3421-2L.

[0064] Fig.4E6-A and Figure 4E6-BA view of layer L9 is shown, which includes an annular base 3401 that separates and connects an upper flexible element 3421-UC and a lower flexible element 3421-LC by two portions of the base that serve as a scaffold, wherein some lateral portions of the base align with and engage the springs in the scaffolding regions 3411-1, 3411-2, 3412-1 and 3412-2 of the springs. The actual start of the inward turning spiral of the probe 3400 depends on the intersection of the features of layer L8 with the features of layer L9 and also depends on the intersection of the features of layer L9 with the features of layer L10. In particular, the intersection surface is not perpendicular to the local length of the winding spiral (e.g., to provide an intersection surface of minimum width), but is formed at a certain angle so that the outer portion of the spiral beam that intersects with the base is supported along its length The amount is different from the amount that the inner portion is supported. In some variations, the interface can be provided in a manner such that the interface is perpendicular to the local length of the beam, so that the support provided by the base (or other support area) provides a horizontal vertical or substantially vertical transition between the supported beam area and the unsupported beam area. In particular, in the interface formed by layer L4 and L5, L5 and L6, L12 and L13, and L13 and L14, and in other beam segmentation areas (such as layer L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to L11, L11 to L12, L14 to L15, and L15 to L16), it can be seen that a vertical transition is provided in other beams to the support area, wherein the beam transition extends along a lateral line substantially perpendicular to the instantaneous or local length of the beam. This vertical intersection and non-vertical intersection and its consistent or variable uses can be used to customize probe performance or operating characteristics. In particular, due to the non-perpendicular intersection with the base and due to the intersections provided by and between the other beams of the cantilever, the outer portion of the cantilever is configured as a single thick beam, while the inner portion of the cantilever structure begins as two beams of medium thickness, with the cantilever terminating as four thinner beams at the probe arm. In some variations, the initial cantilever structure (as they laterally exit the base) can begin with a single thick beam or multiple beams across the width. Other transitions along the length of the beam can also be configured to provide a smooth or perpendicular transition, or can be configured to provide a variable or non-perpendicular transition. Figure 4E7-A and Figure 4E7-B A view of layers L10, L12, L14, and L16 is shown, providing: (1) portions of the upper planar spring spirals 3421-1U and 3421-2U ​​and their innermost extensions forming cantilevered portions UC1 to UC4 (not labeled); (2) portions of the upper center end arms 3431-UA and portions of the upper brackets 3411-1 and 3411-2, where the double staggered spiral configuration can be seen. These are Figure 4E3-A and Figure 4E3-BThe lower flexible element features shown correspond to the upper flexible element. Comparison of these figures shows that the rotational orientation of the helices of the upper flexible element and the lower flexible element have opposite rotational orientations. In some cases, this reversal of direction may be considered beneficial, while in other cases it is unnecessary or even harmful. When the spring element is compressed, the end may tend to rotate in a direction opposite to the inward rotation of the spiral element, which may cause a wiping or scraping effect that may help to crack the oxide coating or cause damage to the contacted surface. The reversal of the wiping direction between the lower probe end and the upper probe end may be desired or undesirable, and therefore can be taken into consideration during the initial probe design. Similarly, a reversal of the relative directions of the separated upper spring elements is feasible, and a reversal of the directions of the separated lower spring elements is also feasible.

[0065] Figure 4E8-A and Figure 4E8-B A view of layers L11 and L15 is shown, in which the incomplete helical elements 3421-1U and 3421-2U ​​and the connecting region of the supports 3411-1 and 3411-2, which bridge the Figure 4E7-A and Figure 4E7-B of the spiral to form a thickened spiral section in the outermost lateral portion of the spring, wherein the upper flexible element 3421-UC includes only two thickened elements as opposed to four thinner elements connecting the end arms 3431-UA at the innermost lateral region of the spiral. Figure 4E8-A and Figure 4E8-B Provides Figure 4E4-A and Figure 4E4-B The lower flexible element shown corresponds to the upper flexible element.

[0066] Figure 4E9-A and Figure 4E9-B A view of layer L13 is shown, which includes a portion of upper end arm 3431-UA and portions of brackets 3411-1 and 3411-2U, which provide a connection between cantilever arms 3421-1U and 3421-2U. Figure 4E9-A and Figure 4E9-B Provides Figure 4E5-A and Figure 4E5-B The lower flexible element counterparts found in the images correspond to the portions of the upper flexible element.

[0067] Figure 4A to Figure 4E9-BMany additional variations of the probe are possible and will be apparent to those skilled in the art after reading the teachings herein, and include, for example: (1) variations in materials; (2) variations in configuration, including the number of turns or partial turns contained in each spring element, the number of staggered springs used on each longitudinal stage, the number of longitudinally spaced springs used (e.g., even, odd, etc.), the number and location of longitudinal beam transitions occurring along the length of the spiral, the direction of rotation of successive spirals (e.g., CW-CCW-CW-CCW-CW, CW-CCW-CCW-CW, etc.), the shape of the ends, the width and thickness of the cantilever beam; (3) using brackets to separate one or both of the upper spring module and the lower spring module from the annular frame, (4) using brackets closer to the center portion of the probe rather than the periphery of the probe; (5) using different types of frames or base structures and / or openings in the frames and base structures; (6) using spring structures that are not pairs of coplanar staggered spirals supported by different brackets, but rather a single spiral at a given longitudinal level or more than two staggered spirals at a given longitudinal level; and (7) variations of features and variations thereof taken from other embodiments and aspects described herein.

[0068] FIG. 5A1 to FIG. 5H An exemplary probe 3500 and dual array plate mounting and retention configuration is shown that utilizes a lateral sliding lock or tab 3502 and a retaining ring or annular base 3501 in conjunction with two array plates 3540-L and 3540-U in accordance with an embodiment of the present invention.

[0069] Figure 5A1 and Figure 5A2 An isometric view of an exemplary probe 3500 according to an embodiment of the present invention viewed from above and below is provided, respectively, wherein the probe includes a probe body 3504 (e.g., a portion of the probe that does not include laterally extending peripheral features, such as structures whose primary purpose is mounting or alignment), a mounting ring, retaining ring, or base 3501 (for engaging the top edge perimeter of a circular through hole in a lower engagement plate or lower array plate 3540-L or a lower plate probe hole 3541-C), and a sliding clip or tab 3502 located on the right side of the probe 3500 (for engaging the right upper edge region of an oblong through hole 3541-O in an upper array plate 3540-U). In a dual manner, the sliding clip or tab 3502 can be provided on the left side of the probe 3500 for engaging the left upper edge region of an oblong through hole 3541-O in the upper array plate 3540-U.

[0070] The probe 3500 comprises a flexible structure including a support having a first end and a second end separated longitudinally, a first flexible element 3500-U including a two-dimensional substantially planar spring 3521-U, and a second flexible element 3500-L including a spring 3521-L. Alternatively, both the first flexible element 3500-U and the second flexible element 3500-L comprise respective two-dimensional substantially planar springs.

[0071] More particularly, the first flexible element 3500-U provides flexibility in a direction substantially perpendicular to the planar construction, wherein a first portion of the first flexible element is functionally coupled to at least one bracket, and a second portion of the first flexible element is functionally coupled to a first end arm that is elastically movable relative to at least one bracket, wherein the first end arm directly or indirectly holds a first end 3531-U that extends longitudinally beyond a first end of at least one bracket when the first flexible element is unbiased.

[0072] Moreover, the second flexible element 3500-L provides flexibility in a direction substantially perpendicular to the planar construction, wherein a first portion of the second flexible element is functionally connected to at least one bracket, and a second portion of the second flexible element is functionally connected to a second end arm, which second end arm can be elastically moved relative to at least one bracket, wherein the second end directly or indirectly maintains the second end 3531-L, and when the second flexible element is unbiased, the second end extends longitudinally beyond the second end of at least one bracket.

[0073] Figure 5B1 and Figure 5B2 An isometric view and a top view of a portion of the lower array plate 3540-L are provided, respectively, showing a single lower plate probe hole, specifically a single circular through hole 3541-C, Figure 5A1 and Figure 5A2 The lower portion of the probe 3500 can be inserted through the through hole.

[0074] Fig.5C1 and Fig.5C2 An isometric view and a top view of a portion of the upper array board 3540-U are provided, respectively, showing a single upper board probe hole, specifically a single oblong through hole 3541-O, Figure 5A1 and Figure 5A2 The upper portion of the probe 3500 can be inserted longitudinally through the through hole and then displaced laterally so that the sliding clip or tab 3502 provided on one side of the probe 3500 will engage the upper edge area of ​​the oblong through hole 3541-O.

[0075] Figure 5D Provided Figure 5A1 and Figure 5A2 An isometric view of a probe 3500 of FIG. Figure 5B1 and Figure 5B2 The probe 3500 is laterally aligned above the circular through hole 3541-C of the lower array plate 3540-L portion so as to prepare for the relative longitudinal displacement or loading of the probe 3500 into the circular through hole 3541-C in the lower array plate 3540-L by relatively moving the probe 3500 in the direction indicated by the arrow 3545.

[0076] Figure 5E Provided after probe 3500 is longitudinally loaded into circular through hole or opening 3541-C in lower array plate 3540-L Figure 5A1 and Figure 5A2 , Figure 5B1 and Figure 5B, and Figure 5D 3540-L, so that the retaining ring 3501 of the probe 3500 abuts against the upper surface of the lower array plate 3540-L, and so that the lateral alignment of the probe 3500 and the lower array plate 3540-L is maintained by the appropriate size and tolerance setting of the diameter of the probe and the diameter of the circular through hole 3541-C in the lower array plate 3540-L. In this way, the retaining ring 3501 serves as a lower retaining feature of the probe 3500 configured to engage at least the lower array plate 3540-L.

[0077] Fig. 5F Provided Figure 5A1 and Figure 5A2 An isometric view of the probe 3500 relative to Figure 5B1 and Figure 5B2 The lower array plate 3540-L portion is in the final position and Fig.5C1 and Fig.5C2 3541-O in order to provide for the relative longitudinal displacement or loading of the probe 3500 into the oblong through hole 3541-O by the relative movement of the upper array plate 3540-U in the direction indicated by arrow 3545, wherein the lateral alignment is such that the longitudinal movement alone will allow the upper array plate 3540-U to slide through to a position below and beside the retaining tab 3502, which serves as an upper retaining feature configured to engage at least the upper array plate 3540-U. The retaining tab 3502 is longitudinally spaced from the retaining ring 3501 by a gap 3543 that is greater than the thickness of the longitudinally engaged portion of the upper array plate 3540-U.

[0078] Figure 5G Provided in Fig. 5FIsometric view of the probe 3500, lower array plate 3540-L and upper array plate 3540-U portions in their final longitudinal positions after the movement shown, but without completing the necessary relative lateral movement of the upper array plate 3540-U relative to the probe 3500 and the lower array plate 3540-L as indicated by arrow 3545 to change the gap 3543 from the right side of the probe body 3504 to the left side of the probe body 3504, thereby completing the interlocking of the edge of the upper array plate 3540-U between the probe retaining ring 3501 and the retaining tab 3502.

[0079] Figure 5H Provided in Figure 5G The isometric view of the probe 3500, lower array plate 3540-L and upper array plate 3540-U portions in their final longitudinal and lateral positions after movement shown such that the gap 3543 between the probe body and the edge of the oblong opening 3541-O in the upper array plate 3540-U changes from the right side of the probe body 3504 (between the retaining ring 3501 and the retaining tab 3502) to the left side of the probe body 3504 so that the longitudinal positioning of these plates in their relative positions provides for the retention of the probe 3500 with position and alignment determined by the dimensions and tolerances set for these three components.

[0080] FIG. 5A1 to FIG. 5H Many alternatives to the embodiments of are possible, including, for example: (1) changing the opening shape from one or both of the circular and oblong configurations to other configurations, such as square, rectangular, triangular, or some other simple or complex polygonal or closed curved configuration, which may or may not limit the probe loading to a single rotational orientation of one or both of the top and bottom plates, or even a directional orientation to ensure that the probe and each plate are right-side up during loading, and / or to ensure that the lower and upper plates are properly stacked; (2) changing the shape of the probe body, tabs, and / or retaining rings; (3) the holes or openings in the array plate may not be straight longitudinally extending through holes, but may include steps, protrusions, notches, etc., or countersunk portions, which may provide enhanced mutual engagement or enhanced engagement with the probe itself; and (4) other variations on other embodiments described herein. In most practical embodiments, the array plates will each include multiple through holes in the desired array pattern. In some variations, the array plates may be limited to dielectrics, and the probes may be limited to conductive materials. In other variations, the array plate may include conductive elements (eg, traces) that provide electrical contact to some or all of the probes, while the probes include dielectric elements that provide electrical isolation of different elements within a single probe or between adjacent probes.

[0081] Further comments and conclusions:

[0082] Many embodiments have been proposed above, but without departing from the spirit of the invention, many other embodiments are also feasible. Some of these additional embodiments may be based on the teachings of this article and the combination of various teachings incorporated herein by reference. Some manufacturing embodiments may use a multilayer electrochemical deposition process, while other manufacturing embodiments may not use it. Some embodiments may use a combination of a selective deposition process and a blanket deposition process, while other embodiments may not use both, and some embodiments may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and / or may not use a planarization process when forming successive layers. Some embodiments may use a selective deposition process or a blanket deposition process on some layers that are not electro-deposition processes. For example, some embodiments may use nickel (Ni), nickel phosphorus (Ni-P), nickel cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AlCu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chrome, chromium copper (CrCu), other palladium alloys, copper-silver alloys as structural materials or sacrificial materials, while other embodiments may use different materials. For example, some of the above materials may be preferentially used for their elastic properties, while others may be used for their enhanced electrical conductivity, their wear resistance, their barrier properties, their thermal properties (e.g., yield strength at high temperatures or high thermal conductivity), while some may be selected for their bonding properties, separability from other materials, or even for other properties of interest in the desired application or use. Other embodiments may use different materials or different combinations of materials, including dielectrics (e.g., ceramics, plastics, photoresists, polyimides, glass, ceramics or other polymers), other metals, semiconductors, etc. as structural materials, sacrificial materials or pattern materials. For example, some embodiments may use copper, tin, zinc, solder, photoresists or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or different parts of a single layer. Some embodiments may remove the sacrificial material, while other embodiments may not. Some embodiments may form a probe structure, while other embodiments may use the spring module of the present invention for non-detection purposes (e.g., to bias other operating devices with a desired spring force or flexible joint).

[0083] It should also be understood that probe elements of some aspects of the invention may be formed using processes that are substantially different than those set forth herein, and it is not intended that structural aspects of the invention need be formed only by or by processes that are obvious from those taught herein.

[0084] Although the various sections of this specification are provided with headings, the headings are not meant to limit the teachings in one section of the specification to not be applicable to other sections of the specification. For example, an alternative recognized in connection with one embodiment is intended to be applicable to all embodiments, as long as the features of the different embodiments enable such application and do not contradict or eliminate all advantages of the adopted embodiment.

[0085] It is intended that any aspect of the invention described herein represents an independent invention description that applicants consider to be a comprehensive and complete invention description that applicants consider to be capable of being presented as an independent claim without the need to introduce additional limitations or elements from other embodiments or aspects set forth herein for explanation or clarification, which, once written, need not be explicitly presented in such independent claims. It is also understood that any variation of the aspects set forth herein represents an independent and separate feature that may form a separate independent claim, be added separately to an independent claim, or be added as a dependent claim to further define the invention claimed by such corresponding dependent claims (if written).

[0086] In view of the teachings herein, many other embodiments, designs and alternatives in use of the present invention will be obvious to those skilled in the art. Therefore, the present invention is not intended to be limited to the specific illustrative embodiments, alternatives and uses described above, but is only limited by the claims set forth below.

Claims

1. A probe array, comprising: (1) A plurality of probes (3500) for making contact between two electronic circuit elements, each probe comprising: (a) at least one flexible structure comprising: (i) at least one bracket having a first end and a second end separated longitudinally; (ii) at least one first flexible element (3500-U) comprising a two-dimensional substantially planar spring (3521-U) when unbiased, wherein the first flexible element (3500-U) provides flexibility in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first flexible element is functionally coupled to the at least one stent, and a second portion of the first flexible element is functionally coupled to a first end arm, the first end arm being resiliently movable relative to the at least one stent, wherein the first end arm directly or indirectly retains a first end (3531-U), and when the first flexible element is unbiased, the first end extends longitudinally beyond a first end of the at least one stent; and (iii) at least one second flexible element (3500-L) comprising a spring (3521-L), wherein the second flexible element (3500-L) provides flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second flexible element is functionally coupled to the at least one stent, and a second portion of the second flexible element is functionally coupled to a second end arm, the second end arm being resiliently movable relative to the at least one stent, wherein the second end arm directly or indirectly retains a second end (3531-L), and when the second flexible element is unbiased, the second end extends longitudinally beyond the second end of the at least one stent, wherein the first portion of the first flexible element (3500-U) and the first portion of the second flexible element (3500-L) are longitudinally spaced apart from each other by the at least one bracket, and wherein, when at least one of the first end and the second end is biased toward the other, the second portion of the first flexible element and the second portion of the second flexible element move longitudinally in a manner selected from the group consisting of: (A) moving closer together; and (B) moving further apart; (2) a lower array plate (3540-L) having a plurality of lower plate probe holes (3541-C); (3) an upper array plate (3540-U) having a plurality of upper plate probe holes (3541-O), wherein at least a portion of the upper plate probe holes (3541-O) include at least one sidewall feature, the sidewall feature providing an extension portion that extends each upper plate probe hole (3541-O) on the upper array plate (3540-U) to a width that is wider than a corresponding portion of a corresponding lower plate probe hole (3541-C) on the lower array plate (3540-L), wherein the lower array plate (3540-L) is configured to receive the probe (3500) from above the lower array plate (3540L); wherein the upper array plate (3540-U) is configured to receive a probe from below the upper array plate (3540-U); Wherein, at least a portion of the plurality of probes further comprises at least one lower retaining feature (3501) and at least one upper retaining feature (3502), wherein the at least one lower retaining feature (3501) is configured to at least engage the lower array plate (3540-L), and the at least one upper retaining feature (3502) is configured to at least engage the upper array plate (3540-U); wherein the at least one lower retaining feature (3501) comprises at least one lateral extension feature, the lateral extension feature protruding from the body of the corresponding probe (3500), the size and configuration of which limits the longitudinal range within which the corresponding probe (3500) can be inserted into the lower plate probe hole (3541-C) of the lower array plate (3540-L); wherein the at least one upper retaining feature (3502) comprises at least one tab-like feature, the tab-like feature extending laterally from the body of the corresponding probe (3500) at a horizontal plane above the lower retaining feature (3501) and being longitudinally spaced apart from the lower retaining feature (3501) by a gap (3543), the gap being greater than the thickness of the longitudinal engagement portion of the upper array plate (3540-U), and wherein the at least one upper retaining feature (3502) has a lateral structure, the size of the lateral structure being designed to pass through an extension provided by a side wall feature of the upper plate probe hole (3541-O) on the upper array plate (3540-U) when aligned; and In which, after the upper retaining feature (3502) is longitudinally positioned above the extension portion of the upper board probe hole (3541-O) in the upper array plate (3540-U), the upper retaining feature (3502) is laterally displaced relative to the upper board probe hole (3541-O), so that at least one upper retaining feature (3502) can no longer longitudinally pass through the extension portion of the upper board probe hole (3541-O) in the upper array plate (3540-U).

2. The probe array according to claim 1, wherein The lateral displacement of the upper array plate (3540-U) causes the upper array plate (3540-U) to slide to a position below and beside the upper retaining feature (3502).

3. The probe array according to claim 1, wherein The lateral displacement of the upper retaining feature (3502) relative to the upper plate probe hole (3541-O) in the upper array plate (3540-U) causes the gap (3543) between the body of the corresponding probe (3500) and the edge of the upper plate probe hole (3541-O) in the upper array plate (3540-U) to change from one side of the body to the opposite side of the body, so that the longitudinal positioning of the lower array plate (3540-L) and the upper array plate (3540-U) in their relative positions is maintained to provide a position and alignment for the retention of the probe (3500) determined by the dimensions and tolerances set for the upper retaining feature (3502), the upper plate probe hole (3541-O) and the diameter of the probe (3500).

4. The probe array according to claim 1, wherein The lower plate probe hole (3541-C) of the lower array plate (3540-L) has a shape selected from the group consisting of: (A) circle; (B) oblong; (C) square; (D) rectangle; (E) triangle; (F) simple polygon; (G) complex polygon; and (H) closed curved structure.

5. The probe array according to claim 1, wherein The upper plate probe hole (3541-O) of the upper array plate (3540-U) has a shape selected from the group consisting of: (A) circle; (B) oblong; (C) square; (D) rectangle; (E) triangle; (F) simple polygon; (G) complex polygon; and (H) closed curved structure.

6. The probe array according to claim 1, wherein: The lower plate probe hole (3541-C) of the lower array plate (3540-L) has a shape selected from the group consisting of: (A) a through hole extending straight longitudinally; (B) a hole including a step; (C) a hole including a protrusion; (D) a hole including a recess; (E) a hole including countersunk portions engaged with each other; and (F) a hole including a countersunk portion engaged with a corresponding probe.

7. The probe array according to claim 1, wherein: The upper plate probe hole (3541-O) of the upper array plate (3541-U) has a shape selected from the group consisting of: (A) a through hole extending straight longitudinally; (B) a hole including a step; (C) a hole including a protrusion; (D) a hole including a recess; (E) a hole including countersunk portions that engage with each other; and (F) a hole including a countersunk portion that engages with a corresponding probe.

8. The probe array according to claim 1, wherein The probe (3500) is made of conductive material.

9. The probe array according to claim 1, wherein: The lower array plate (3540-L) and the upper array plate (3540-U) are made of dielectric material.

10. The probe array according to claim 9, wherein: The lower array plate (3540-L) and the upper array plate (3540-U) further include conductive elements to provide electrical contact with at least one probe (3500).

11. The probe array according to claim 10, wherein: The probe (3500) includes a dielectric element that provides electrical isolation of different elements within a single probe or between adjacent probes.

12. The probe array according to claim 1, wherein: The lower retaining feature (3501) has an annular configuration.

13. A probe for making contact between two electronic circuit elements, comprising: (a) at least one flexible structure comprising: (i) at least one bracket having a first end and a second end separated longitudinally; (ii) at least one first flexible element (3500-U) comprising a two-dimensional substantially planar spring (3521-U) when unbiased, wherein the first flexible element (3500-U) provides flexibility in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first flexible element is functionally coupled to the at least one stent, and a second portion of the first flexible element is functionally coupled to a first end arm, the first end arm being resiliently movable relative to the at least one stent, wherein the first end arm directly or indirectly retains a first end (3531-U), and when the first flexible element is unbiased, the first end extends longitudinally beyond a first end of the at least one stent; and (iii) at least one second flexible element (3500-L) comprising a spring (3521-L), wherein the second flexible element (3500-L) provides flexibility in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second flexible element is functionally coupled to the at least one stent, and a second portion of the second flexible element is functionally coupled to a second end arm, the second end arm being resiliently movable relative to the at least one stent, wherein the second end arm directly or indirectly retains a second end (3531-L), and when the second flexible element is unbiased, the second end extends longitudinally beyond the second end of the at least one stent, wherein the first portion of the first flexible element (3500-U) and the first portion of the second flexible element (3500-L) are longitudinally spaced apart from each other by the at least one bracket, and wherein, when at least one of the first end and the second end is biased toward the other, the second portion of the first flexible element and the second portion of the second flexible element move longitudinally in a manner selected from the group consisting of: (A) moving closer together; and (B) moving further apart; wherein at least a portion of the probe further comprises at least one lower retaining feature (3501) and at least one upper retaining feature (3502); wherein the at least one lower retaining feature (3501) comprises at least one laterally extending feature protruding from the body of the probe (3500); Wherein, the at least one upper retaining feature (3502) includes at least one tab-like feature, which extends laterally from the body of the probe (3500) at a horizontal plane above the lower retaining feature (3501) and is longitudinally spaced apart from the lower retaining feature (3501) by a gap (3543).

14. The probe according to claim 13, wherein: The probe (3500) is made of conductive material.

15. The probe according to claim 14, wherein The probe (3500) includes a dielectric element that provides electrical isolation of different elements within a single probe or between adjacent probes.

16. The probe according to claim 13, wherein: The lower retaining feature (3501) has an annular configuration.

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