Semiconductor package mold

Abstract

The application relates to a semiconductor packaging mold and belongs to the technical field of semiconductor packaging molds. The semiconductor packaging mold comprises a first mold and a second mold, the second mold is slidably arranged on one side of the first mold, the first mold and the second mold are internally provided with a plurality of mold cavities, and the top of the second mold is fixedly provided with an injection port; a packaging demolding mechanism is arranged, the packaging demolding mechanism comprises a contact plate arranged in the plurality of mold cavities, a contact assembly and a circulating assembly; when packaging, the contact plate is withdrawn to the inner wall of the mold cavity, at this time, the cooling liquid continuously passes through the inside of the contact plate, the contact plate continuously keeps low temperature, the epoxy resin continuously contacts the low-temperature contact plate during packaging, rapid cooling and solidification are realized, the packaging time is reduced, and the adhesion phenomenon with the inner wall of the mold cavity is reduced; when the first mold and the second mold are separated, the contact plate is synchronously away from the inner wall of the mold cavity, and auxiliary demolding is realized on the packaged semiconductor.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging molds, and in particular to a semiconductor packaging mold. Background Art

[0002] Semiconductor packaging molds are specialized mold equipment used in semiconductor device packaging processes. Their main function is to encapsulate core components such as chips, lead frames, and substrates in materials such as epoxy resin or ceramics to protect the chips from the external environment and to connect the chips to external circuits.

[0003] As shown in the reference case "A Semiconductor Packaging Mold" announcement number "CN110556303B", it can meet the needs of rapid fixation of semiconductor chips of different sizes; it is beneficial to the heat dissipation of semiconductor chips, improves the service life of semiconductor chips, and also plays an all-round protection role for semiconductor chips.

[0004] During the encapsulation process, epoxy resin is injected into the mold cavity and directly contacts the inner wall of the mold cavity, and is cooled by the inner wall of the mold cavity. However, since the encapsulation process is carried out continuously, the temperature of the inner wall of the mold cavity will gradually increase with the continuous injection of epoxy resin, causing the cooling effect of the mold cavity to gradually decrease, resulting in the subsequent injection of epoxy resin. The cooling effect is reduced when it contacts the inner wall of the mold cavity. Due to insufficient cooling, the epoxy resin is more likely to adhere to the inner wall of the mold cavity, increasing the difficulty of demolding and affecting the encapsulation efficiency. Summary of the Invention

[0005] Based on this, it is necessary to address the problem that during the epoxy resin injection and encapsulation process, the epoxy resin needs to be completely cooled and solidified before demolding. Since the encapsulation process is continuous, the temperature of the inner wall of the mold cavity will gradually increase with the continuous injection of epoxy resin, causing the cooling effect of the mold cavity to gradually decrease. As a result, the cooling effect of the subsequently injected epoxy resin is reduced when it contacts the inner wall of the mold cavity. Due to insufficient cooling, the epoxy resin is more likely to adhere to the inner wall of the mold cavity, increasing the difficulty of demolding and affecting the encapsulation efficiency. Therefore, a semiconductor encapsulation mold is provided.

[0006] A semiconductor packaging mold comprises: a first mold and a second mold, the second mold is slidably mounted on one side of the first mold, a plurality of mold cavities are arranged inside the first mold and the second mold, and an injection port is fixedly mounted on the top of the second mold; a packaging demolding mechanism, the packaging demolding mechanism comprises a contact plate, a contact assembly and a circulation assembly arranged inside the plurality of mold cavities, the contact assembly is arranged on one side of the contact plate, and the circulation assembly is arranged inside the first mold and the second mold; wherein, the contact assembly comprises a plurality of fixed tubes fixedly mounted on the bottom of the mold cavity, a plurality of guide rods are fixedly mounted on the bottom of the contact plate, a plurality of the guide rods are respectively slidably connected to a plurality of fixed tubes, and a plurality of cooling plates are fixedly mounted on the bottom of the contact plate.

[0007] The contact assembly also includes a spring fixedly installed at one end of the guide rod, the other end of the spring is fixedly connected to the inner wall of the fixed tube, and a plurality of contact blocks are fixedly installed on the surface of the contact plate. The plurality of contact blocks are all slidably connected to the inner walls of adjacent mold cavities, and the multiple mold cavities of the first mold and the second mold are aligned with each other.

[0008] A movable cavity is provided inside the first mold and the second mold, and the same driving plate is provided at the bottom of the two adjacent mold cavities. The driving plate is slidably installed inside the movable cavity. The driving plate is located between multiple fixed tubes. A collision block is provided on one side of the multiple fixed tubes, and the multiple collision blocks are fixedly connected to the adjacent driving plates.

[0009] A motor is fixedly installed on one side of the first mold and the second mold, and the output end of the motor extends to the inside of the corresponding active cavity and is fixedly connected to a driving rod. A plurality of reciprocating screws are fixedly installed on the surface of the driving rod. The plurality of reciprocating screws respectively pass through a plurality of driving plates inside the active cavity, and the reciprocating screws are slidably connected to the corresponding driving plates.

[0010] The inner bottom wall of the mold cavity is configured to be an isosceles trapezoidal shape, the bottom of the contact plate is adapted to the shape of the inner bottom wall of the mold cavity, and a sealing ring is fixedly mounted on the outer side of the contact plate.

[0011] One side of the plurality of cooling plates extends into the interior of the active cavity, and the plurality of cooling plates are located on one side of the driving plate.

[0012] A guide tube is fixedly installed inside the cooling plate, and multiple connecting tubes are fixedly installed on both sides of the guide tube. The other ends of the multiple connecting tubes extend out of the cooling plate, and one side of the guide tube is located inside the contact plate.

[0013] The circulation component includes a circulation pump fixedly installed on one side of the first mold and the second mold. A plurality of flow grooves are opened on the surface of the driving plate, and the edges of the plurality of flow grooves are all set to a rounded shape.

[0014] An output pipe is fixedly installed at the output end of the circulation pump, one end of which extends into the interior of the active cavity; an input pipe is fixedly installed at the input end of the circulation pump, the other end of which is in communication with the interior of the active cavity.

[0015] The plurality of cooling plates are respectively located in adjacent flow grooves, and the cooling plates and the flow grooves are arranged in a cross shape.

[0016] The above-mentioned semiconductor packaging mold, through the packaging demolding mechanism, can efficiently cool and assist in demolding during semiconductor packaging. Specifically, during packaging, the contact plate is retracted to the inner wall of the mold cavity. At this time, the coolant continuously passes through the inside of the contact plate, so that the contact plate continues to maintain a low temperature, allowing the epoxy resin to continuously contact the low-temperature contact plate during packaging, and quickly cool down and solidify, reducing the packaging time and reducing the adhesion to the inner wall of the mold cavity. When the first mold and the second mold are separated, the contact plate synchronously moves away from the inner wall of the mold cavity to assist in demolding the packaged semiconductor.

[0017] When the contact plate contacts the mold cavity, the starting motor drives the drive rod to rotate, which can make the reciprocating screw drive the corresponding drive plate to move back and forth, continuously bringing the collision block into contact and collision with the adjacent fixed tube. The impact vibration is transmitted to the contact plate through the internal guide rod, which can reduce the adhesion of epoxy resin on the inner wall of the mold cavity and the generation of bubbles, thereby improving the packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0020] Figure 2 It is a schematic structural diagram of the packaging and demoulding mechanism of the present invention;

[0021] Figure 3 Schematic diagram of the structure of the active cavity and the driving plate of the present invention;

[0022] Figure 4 Schematic diagram of the mold cavity and fixed tube structure of the present invention;

[0023] Figure 5 This is a schematic diagram of the guide rod and fixed tube structure of the present invention;

[0024] Figure 6 This is a schematic diagram of the cooling plate and guide tube structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the collision block and fixed tube structure of the present invention;

[0026] Figure 8 Schematic diagram of the structure of the first mold and the driving plate of the present invention;

[0027] Figure 9 It is a schematic structural diagram of the circulation pump and the first mold of the present invention.

[0028] Reference numerals:

[0029] 1100, first mold; 110, mold cavity; 120, movable cavity; 200, second mold; 210, injection port; 300, package demolding mechanism; 310, contact plate; 320, contact assembly; 321, fixed tube; 322, guide rod; 323, contact block; 324, spring; 325, drive plate; 326, collision block; 327, motor; 328, drive rod; 329, reciprocating screw; 3210, sealing ring; 3211, cooling plate; 3212, guide tube; 3213, connecting tube; 330, circulation assembly; 331, circulation pump; 332, flow trough; 333, output pipe; 334, input pipe. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0031] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0033] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] Unless otherwise defined, all technical and scientific terms used in the present description have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used in this description are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used in this description includes any and all combinations of one or more of the associated listed items.

[0035] The following combination Figures 1-9 A semiconductor packaging die of the present invention is described.

[0036] like Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 8 As shown, in one embodiment, a semiconductor packaging mold includes: a first mold 100 and a second mold 200, the second mold 200 is slidably installed on one side of the first mold 100, a plurality of mold cavities 110 are provided inside the first mold 100 and the second mold 200, and an injection port 210 is fixedly installed on the top of the second mold 200; a packaging demolding mechanism 300, the packaging demolding mechanism 300 includes a contact plate 310, a contact component 320 and a circulation component 330 arranged inside the plurality of mold cavities 110, the contact component 320 is arranged on one side of the contact plate 310, and the circulation component 330 is arranged inside the first mold 100 and the second mold 200; wherein, the contact component 320 includes a plurality of fixed tubes 321 fixedly installed at the bottom of the mold cavity 110, a plurality of guide rods 322 are fixedly installed at the bottom of the contact plate 310, the plurality of guide rods 322 are respectively slidably connected to the plurality of fixed tubes 321, and a plurality of cooling plates 3211 are fixedly installed at the bottom of the contact plate 310.

[0037] In this embodiment, when in use, the semiconductor to be encapsulated is placed in the corresponding mold cavity 110, and then the first mold 100 and the second mold 200 are closed, and epoxy resin is injected for encapsulation. The encapsulation demolding mechanism 300 can efficiently cool the injected epoxy resin and assist in demolding. Specifically, the contact component 320 enables the contact plate 310 to be retracted to the inner wall of the mold cavity 110 during encapsulation and contact the epoxy resin, so that the contact plate 310 is quickly cooled by the cooling plate 3211, which helps the epoxy resin to solidify quickly, reduces the encapsulation time, reduces the adhesion of the encapsulation material to the inner wall of the mold cavity 110, and improves the demolding efficiency. When the first mold 100 and the second mold 200 are separated, the contact plate 310 is synchronously moved away from the inner wall of the mold cavity 110 to assist in demolding. When the contact plate 310 is in use, the circulation component 330 can circulate and guide the coolant in the first mold 100 and the second mold 200, so that the coolant can better cool the mold cavity 110 and the contact plate 310.

[0038] like Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 7 As shown, the contact assembly 320 also includes a spring 324 fixedly mounted on one end of the guide rod 322, the other end of the spring 324 is fixedly connected to the inner wall of the fixed tube 321, and a plurality of contact blocks 323 are fixedly mounted on the surface of the contact plate 310, and the plurality of contact blocks 323 are all slidably connected to the inner walls of adjacent mold cavities 110, and the plurality of mold cavities 110 of the first mold 100 and the second mold 200 are aligned with each other.

[0039] Both the first mold 100 and the second mold 200 are provided with an active cavity 120, and the same driving plate 325 is provided at the bottom of the two adjacent mold cavities 110. The driving plate 325 is slidably installed inside the active cavity 120. The driving plate 325 is located between multiple fixed tubes 321. A collision block 326 is provided on one side of the multiple fixed tubes 321, and the multiple collision blocks 326 are fixedly connected to the adjacent driving plates 325.

[0040] A motor 327 is fixedly installed on one side of the first mold 100 and the second mold 200. The output end of the motor 327 extends to the interior of the corresponding active cavity 120 and is fixedly connected to a drive rod 328. A plurality of reciprocating screws 329 are fixedly installed on the surface of the drive rod 328. The plurality of reciprocating screws 329 respectively pass through the plurality of drive plates 325 inside the active cavity 120, and the reciprocating screws 329 are slidably connected to the corresponding drive plates 325.

[0041] The inner bottom wall of the mold cavity 110 is configured to be an isosceles trapezoidal shape. The bottom of the contact plate 310 matches the shape of the inner bottom wall of the mold cavity 110 . A sealing ring 3210 is fixedly mounted on the outer side of the contact plate 310 .

[0042] The side of the plurality of cooling plates 3211 extends to the inside of the movable cavity 120, and the plurality of cooling plates 3211 is located on one side of the driving plate 325.

[0043] The inside of the cooling plate 3211 is fixedly installed with a guide pipe 3212, both sides of the guide pipe 3212 are fixedly installed with a plurality of communication pipes 3213, the other end of the plurality of communication pipes 3213 extends out of the cooling plate 3211, and one side of the guide pipe 3212 is located in the inside of the contact plate 310.

[0044] In this embodiment, the plurality of mold cavities 110 of the same horizontal line are communicated with each other, the movable cavity 120 is filled with cooling liquid, when the first mold 100 and the second mold 200 are close, the plurality of mold cavities 110 on the upper and lower sides are synchronously close, so that the contact blocks 323 located on the same vertical line are in contact with each other, the synchronous compression spring 324 moves the corresponding contact plate 310 to the inside of the adjacent mold cavity 110, when the contact plate 310 contacts with the mold cavity 110, the plurality of cooling plates 3211 and the guide rod 322 are synchronously moved to the inside of the movable cavity 120, the contact area with the cooling liquid is increased, at this time, the motor 327 is started to drive the driving rod 328 to rotate, the driving rod 328 drives the reciprocating screw 329 to rotate, so that the reciprocating screw 329 drives the corresponding driving plate 325 to reciprocate, the impact block 326 is in contact with the adjacent fixed pipe 321, the impact vibration is transmitted to the contact plate 310 through the inside guide rod 322, the adhesion of the epoxy resin on the inner wall of the mold cavity 110 is reduced, and the generation of bubbles is reduced, the cooling liquid circulates in the movable cavity 120 through the circulating assembly 330, when the cooling liquid flows, the cooling liquid flows into the inside of the guide pipe 3212 through the communication pipe 3213 from the inside of the contact plate 310, the temperature of the contact plate 310 is kept low, and the cooling effect of the contact plate 310 on the epoxy resin is further improved, when the first mold 100 and the second mold 200 are separated, the spring 324 pushes the contact plate 310 away from the inner wall of the mold cavity 110, and assists in demolding, the inner bottom wall of the mold cavity 110 is isosceles trapezoidal, which matches the shape of the bottom of the contact plate 310, so that the contact plate 310 can tightly fit the bottom wall of the mold cavity 110, and the sealing ring 3210 on the outside of the contact plate 310 further enhances the sealing performance, preventing the cooling liquid or the epoxy resin from leaking.

[0045] As shown in Figure 2 , Figure 4 , Figure 8 and Figure 9 , the circulating assembly 330 includes a circulating pump 331 fixedly installed on one side of the first mold 100 and the second mold 200, and a plurality of flow grooves 332 are formed on the surface of the driving plate 325, and the edges of the plurality of flow grooves 332 are circularly shaped.

[0046] An output pipe 333 is fixedly installed at the output end of the circulation pump 331 , one end of which extends into the interior of the active chamber 120 ; an input pipe 334 is fixedly installed at the input end of the circulation pump 331 , the other end of which is connected to the interior of the active chamber 120 .

[0047] Multiple cooling plates 3211 are respectively located in adjacent flow grooves 332, and the cooling plates 3211 and the flow grooves 332 are arranged in a cross shape.

[0048] In this embodiment, multiple flow grooves 332 are located on one side of multiple mold cavities 110, and multiple cooling plates 3211 and connecting pipes 3213 on one side of the mold cavity 110 are also located inside the flow grooves 332. The circulation pump 331 can allow the coolant to circulate between the multiple flow grooves 332. The rounded corners of the flow grooves 332 ensure that the coolant passes through the flow grooves 332 more smoothly during the flow process. At the same time, the cross-shaped arrangement of the cooling plates 3211 and the flow grooves 332 increases the contact area between the coolant and the flow grooves 332, thereby improving the cooling effect of the coolant on the cooling plates 3211. The circulation pump 331 outputs the coolant through the output pipe 333, and then recovers the coolant through the input pipe 334, allowing the coolant to continue to flow inside the active cavity 120, thereby achieving uniform temperature distribution in the first mold 100 and the second mold 200, and improving the cooling efficiency.

[0049] Working principle: when the first mold 100 and the second mold 200 are close to each other, the multiple mold cavities 110 on the upper and lower sides are synchronously close to each other, so that the contact blocks 323 located on the same vertical line contact each other, and the synchronous extrusion spring 324 moves the corresponding contact plate 310 to the inside of the adjacent mold cavity 110. When the contact plate 310 contacts the mold cavity 110, the multiple cooling plates 3211 and the guide rod 322 are synchronously moved to the inside of the active cavity 120 to increase the contact area with the coolant. At this time, the start motor 327 drives the drive rod 328 to rotate, and the drive rod 328 drives the reciprocating screw 329 to rotate, so that the reciprocating screw 329 drives the corresponding drive plate 325 to move back and forth, continuously. The collision block 326 contacts and collides with the adjacent fixed tube 321. The impact vibration is transmitted to the contact plate 310 through the internal guide rod 322, which can reduce the adhesion of epoxy resin to the inner wall of the mold cavity 110 and reduce the generation of bubbles. The coolant circulates inside the active cavity 120 through the circulation component 330. When the coolant flows, it enters the guide tube 3212 through the connecting pipe 3213 and flows from the inside of the contact plate 310, maintaining the low temperature of the contact plate 310 and further improving the cooling effect of the contact plate 310 on the epoxy resin. When the first mold 100 and the second mold 200 are separated, the spring 324 pushes the contact plate 310 away from the inner wall of the mold cavity 110 to assist in demoulding.

[0050] The circulation pump 331 outputs the coolant through the output pipe 333, and then recovers the coolant through the input pipe 334, allowing the coolant to continue to flow inside the active cavity 120, thereby achieving uniform temperature distribution in the first mold 100 and the second mold 200 and improving the cooling efficiency. The rounded corners of the flow groove 332 ensure that the coolant passes through the flow groove 332 more smoothly during the flow process. At the same time, the cross-shaped arrangement of the cooling plate 3211 and the flow groove 332 increases the contact area between the coolant and the flow groove 332, thereby improving the cooling effect of the coolant on the cooling plate 3211.

[0051] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments merely illustrate several embodiments of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of the present invention. Therefore, the scope of the present invention shall be determined by the appended claims.

Claims

1. A semiconductor packaging mold, characterized in that: include: A first mold (100) and a second mold (200), wherein the second mold (200) is slidably mounted on one side of the first mold (100), a plurality of mold cavities (110) are provided inside the first mold (100) and the second mold (200), and an injection port (210) is fixedly mounted on the top of the second mold (200); A packaging demoulding mechanism (300), comprising a contact plate (310), a contact assembly (320), and a circulation assembly (330) disposed inside a plurality of mold cavities (110), wherein the contact assembly (320) is disposed on one side of the contact plate (310), and the circulation assembly (330) is disposed inside the first mold (100) and the second mold (200); The contact assembly (320) comprises a plurality of fixed tubes (321) fixedly mounted on the bottom of the mold cavity (110); a plurality of guide rods (322) are fixedly mounted on the bottom of the contact plate (310); the plurality of guide rods (322) are respectively slidably connected to the plurality of fixed tubes (321); and a plurality of cooling plates (3211) are fixedly mounted on the bottom of the contact plate (310); The contact assembly (320) further includes a spring (324) fixedly mounted on one end of the guide rod (322), the other end of the spring (324) being fixedly connected to the inner wall of the fixed tube (321), a plurality of contact blocks (323) being fixedly mounted on the surface of the contact plate (310), the plurality of contact blocks (323) being slidably connected to the inner walls of adjacent mold cavities (110), and the plurality of mold cavities (110) of the first mold (100) and the second mold (200) being aligned with each other; Both the first mold (100) and the second mold (200) are provided with an active cavity (120), the active cavity (120) is filled with cooling liquid, and the bottom of two adjacent mold cavities (110) is provided with a same driving plate (325), the driving plate (325) is slidably installed inside the active cavity (120), the driving plate (325) is located between a plurality of fixed tubes (321), and a collision block (326) is provided on one side of the plurality of fixed tubes (321), and the plurality of collision blocks (326) are fixedly connected to the adjacent driving plates (325).

2. The semiconductor packaging mold according to claim 1, wherein: A motor (327) is fixedly mounted on one side of each of the first mold (100) and the second mold (200). An output end of the motor (327) extends into the interior of the corresponding active cavity (120) and is fixedly connected to a drive rod (328). A plurality of reciprocating screws (329) are fixedly mounted on the surface of the drive rod (328). The plurality of reciprocating screws (329) respectively penetrate a plurality of drive plates (325) inside the active cavity (120), and the reciprocating screws (329) are slidably connected to the corresponding drive plates (325).

3. The semiconductor packaging mold according to claim 1, wherein: The inner bottom wall of the mold cavity (110) is configured in an isosceles trapezoidal shape, the bottom of the contact plate (310) is adapted to the shape of the inner bottom wall of the mold cavity (110), and a sealing ring (3210) is fixedly mounted on the outer side of the contact plate (310).

4. The semiconductor packaging mold according to claim 2, wherein: One side of the plurality of cooling plates (3211) extends to the interior of the active cavity (120), and the plurality of cooling plates (3211) are located on one side of the driving plate (325).

5. The semiconductor packaging mold according to claim 1, wherein: A guide tube (3212) is fixedly installed inside the cooling plate (3211), and a plurality of connecting tubes (3213) are fixedly installed on both sides of the guide tube (3212). The other ends of the plurality of connecting tubes (3213) extend out of the cooling plate (3211), and one side of the guide tube (3212) is located inside the contact plate (310).

6. The semiconductor packaging mold according to claim 2, wherein: The circulation assembly (330) includes a circulation pump (331) fixedly mounted on one side of the first mold (100) and the second mold (200). A plurality of flow grooves (332) are provided on the surface of the driving plate (325), and the edges of the plurality of flow grooves (332) are all configured to be rounded.

7. The semiconductor packaging mold according to claim 6, wherein: An output pipe (333) is fixedly mounted on the output end of the circulation pump (331), one end of the output pipe (333) extends into the interior of the active chamber (120), and an input pipe (334) is fixedly mounted on the input end of the circulation pump (331), the other end of the input pipe (334) being in communication with the interior of the active chamber (120).

8. The semiconductor packaging mold according to claim 6, wherein: The plurality of cooling plates (3211) are respectively located in adjacent flow grooves (332), and the cooling plates (3211) and the flow grooves (332) are arranged in a cross shape.

Images