Sealing device and wafer packaging machine

Abstract

The invention provides a sealing device and a wafer packaging machine. The sealing device comprises a clamping mechanism, a heating structure and a shell structure. The clamping mechanism can clamp and release a to-be-sealed part; the heating structure is arranged on the clamping mechanism and is used for heating the clamped part of the to-be-sealed part so as to realize sealing; the shell structure is arranged around the clamping mechanism and can be opened and closed, and the shell structure is provided with an air inlet and an air outlet; when the shell structure is opened, the part to be sealed can stretch into the clamping mechanism. When the shell structure is closed, the clamping mechanism is sealed in the shell structure, air enters the air inlet so as to purge the clamping mechanism, and air is exhausted through the exhaust port so that airflow and dust can be discharged. By means of the arrangement, a relatively closed space is created around the clamping mechanism, the clamping mechanism is blown through air inlet airflow of the air inlet, dust can be blown up, the dust is mixed in the airflow and can be collected or filtered more easily, and the dust problem in the wafer packaging operation link in the prior art is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a sealing device and a wafer packaging machine. Background Art

[0002] The wafer packaging machine is used to complete the packaging process of wafers, and is usually designed so that the bag opening of the packaging bag is clamped and sealed by a heater to achieve sealed packaging of the wafers.

[0003] The applicant discovered that there is a problem of dust generation in the wafer packaging process, and the FFU (Fan Filter Unit) system commonly used in the wafer packaging process can only filter particulate matter in the air, but it is difficult to completely remove the dust, and even makes the dust easy to accumulate. Such a packaging environment poses a major quality risk to the product.

[0004] Therefore, it is particularly important to solve the dust problem in the wafer packaging operation. Summary of the invention

[0005] In view of this, the present application provides a sealing device and a wafer packaging machine to solve the dust problem in the wafer packaging operation in the prior art.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A sealing device, comprising:

[0008] A clamping mechanism capable of clamping and releasing the piece to be sealed;

[0009] A heating structure, arranged on the clamping mechanism and used to heat the clamped portion of the piece to be sealed to achieve sealing;

[0010] A shell structure, arranged around the clamping mechanism and capable of opening and closing, the shell structure being provided with an air inlet and an air outlet;

[0011] When the shell structure is opened, the sealed part can be extended into the clamping mechanism; when the shell structure is closed, the clamping mechanism is enclosed in the shell structure, and the air inlet takes in air to purge the clamping mechanism, and the exhaust port exhausts air to discharge airflow and dust.

[0012] Optionally, the shell structure comprises:

[0013] A first half cover, arranged to partially surround and semi-enclose the clamping mechanism;

[0014] a second half cover, movably arranged relative to the first half cover, wherein the second half cover has a position including a closed position in which the second half cover cooperates with the first half cover to fully surround the clamping mechanism, and an open position in which the clamping mechanism is partially exposed and the sealing member can be inserted into the clamping mechanism;

[0015] The first power source drives the second half cover to move.

[0016] Optionally, the second half cover is rotatably connected to the first half cover;

[0017] The first half cover and the second half cover both have arc surfaces, and when the second half cover is located at the open position, it overlaps with the first half cover.

[0018] Optionally, the clamping mechanism comprises a first clamp and a second clamp, the first clamp can be close to and away from the second clamp, and at least one of the first clamp and the second clamp is provided with the heating structure;

[0019] The first half cover is located on a side of the first clamping member facing away from the second clamping member.

[0020] Optionally, also include:

[0021] Gas source;

[0022] An air inlet channel, connecting the air source and the air inlet;

[0023] The start-stop switch controls the start and stop of the gas source.

[0024] Optionally, an exhaust passage connected to the exhaust port is included to collect the exhausted airflow and dust.

[0025] Optionally, the air inlet and the air outlet are respectively located on two opposite sides of the clamping mechanism and are staggered.

[0026] Optionally, the air inlet and the air outlet are respectively located on opposite sides of the clamping mechanism in the length direction.

[0027] Optionally, the clamping mechanism comprises a first clamp and a second clamp that can be closed and separated, and at least one of the first clamp and the second clamp is provided with the heating structure;

[0028] A space between the first clamp and the second clamp in a separated state is opposite to the air inlet.

[0029] A wafer packaging machine comprises the sealing device in any one of the above items.

[0030] The sealing device provided in the present application includes a clamping mechanism, a heating structure and a shell structure; the clamping mechanism can clamp and release the piece to be sealed; the heating structure is arranged on the clamping mechanism and is used to heat the clamped part of the piece to be sealed to achieve sealing; the shell structure is arranged around the clamping mechanism and can be opened and closed, and the shell structure is provided with an air inlet and an exhaust port; wherein, when the shell structure is opened, the piece to be sealed can be extended into the clamping mechanism; when the shell structure is closed, the clamping mechanism is enclosed in the shell structure, and the air inlet takes in air to purge the clamping mechanism, and the exhaust port exhausts air to discharge airflow and dust. With such arrangement, the clamping mechanism with the heating structure can complete the sealing when clamping the bag mouth of the packaging bag, and the existence of the shell structure does not affect the sealing of the packaging bag by the clamping mechanism when it is opened. After the sealed packaging bag leaves, the shell structure can be closed, thus creating a relatively closed space around the clamping mechanism, and the clamping mechanism is purged by the intake airflow through the air inlet, so that the dust generated on the clamping mechanism due to the heating and sealing can be blown away. Since it is in a relatively closed small space, the purging and cleaning effect of the airflow is more thorough, and the airflow mixed with dust is discharged from the exhaust port, thus separating the dust from the source of generation, making it easier to collect or filter the dust mixed in the airflow, thereby solving the dust problem in the wafer packaging operation in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0032] Figure 1 A schematic front view of a sealing device provided in an embodiment of the present application;

[0033] Figure 2 A schematic side view of a closed shell structure provided in an embodiment of the present application;

[0034] Figure 3 A schematic side view of the shell structure provided in an embodiment of the present application when opened.

[0035] exist Figure 1-Figure 3 middle:

[0036] 1. First half cover; 2. Second half cover; 3. First clamp; 4. Second clamp; 5. Air source; 6. Air inlet passage; 7. Exhaust passage. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] The applicant found that in the prior art, after the packaging bag is clamped and sealed by the heater, dust will be generated on the heater, which is the main dust-producing factor in the packaging area of ​​the wafer packaging machine. However, since the packaging area needs to meet a variety of other packaging actions, the internal mechanical structure of the area is usually complex and there are many pipeline designs. The unidirectional wind of the FFU (Fan Filter Unit) system will produce random directional airflow in a complex environment, which cannot effectively remove the dust on the heater and may even gradually cause dust accumulation. It is difficult to maintain a high regional cleanliness level. Such an environment poses a great quality risk to the product.

[0039] Based on the above problems, Figure 1-Figure 3 As shown, an embodiment of the present application provides a sealing device, including a clamping mechanism, a heating structure and a shell structure; the clamping mechanism can clamp and release the piece to be sealed; the heating structure is arranged on the clamping mechanism and is used to heat the clamped part of the piece to be sealed to achieve sealing; the shell structure is arranged around the clamping mechanism and can be opened and closed, and the shell structure is provided with an air inlet and an exhaust port; wherein, when the shell structure is opened, the piece to be sealed can be extended into the clamping mechanism; when the shell structure is closed, the clamping mechanism is enclosed in the shell structure, and the air inlet takes in air to purge the clamping mechanism, and the exhaust port exhausts air to discharge airflow and dust.

[0040] In this way, the clamping mechanism with the heating structure can complete the sealing when clamping the bag mouth of the packaging bag, and the existence of the shell structure does not affect the clamping mechanism to seal the packaging bag when it is opened. After the sealed packaging bag leaves, the shell structure can be closed, thus creating a relatively closed space around the clamping mechanism, and the clamping mechanism is purged by the intake airflow through the air inlet, so that the dust generated by the heating and sealing on the clamping mechanism can be blown away. Since it is in a relatively closed small space, the purging and cleaning effect of the airflow is more thorough, and the airflow mixed with dust is discharged from the exhaust port, so that the dust is stripped from the source of generation, so that the dust mixed in the airflow can be more easily collected or filtered, solving the dust problem in the packaging operation of wafers in the prior art. Moreover, the intake airflow quickly cools the clamping mechanism and the heating structure at the same time, so that the temperature can be quickly reduced after the heating is completed, so as to achieve the effect of extending the service life of the components.

[0041] In addition, in the related art, some wafer packaging machines have a design of blowing and cooling heaters. Although it has the effect of blowing away the dust on the heater, on the one hand, the blowing effect is not thorough, and on the other hand, it will cause the dust to scatter in the working environment, which is not conducive to centralized collection or filtration. It is still difficult to achieve a good cleaning effect with the FFU (Fan Filter Unit) system. The sealing device provided in this application can overcome the above defects, and while cooling the clamping mechanism and the heating structure, it can fully blow away the dust on the clamping mechanism, and facilitate the centralized collection or filtration of the airflow mixed with dust.

[0042] In some optional embodiments, the shell structure includes a first half cover 1, a second half cover 2 and a first power source; the first half cover 1 is fixed and partially semi-enclosed around the clamping mechanism; the second half cover 2 is movable relative to the first half cover 1, or the second half cover 2 can move or rotate, and the position of the second half cover 2 includes a closed position in which the clamping mechanism is fully enclosed by the first half cover 1, and an open position in which the clamping mechanism is partially exposed and the sealed part can be inserted into the clamping mechanism; or, when the second half cover 2 is in the closed position, the second half cover 2 is opposite to the first half cover 1 and is in a buckled state, and when the second half cover 2 is in the open position, the clamping mechanism is semi-enclosed by the shell structure; the first power source drives the second half cover 2 to move. It should be noted that the first power source can be set on a rack in the surrounding environment, and the first power source can be selectively set as a cylinder, a motor or a servo according to the movement mode of the second half cover 2, and it is connected to the PLC (Programmable Logic Controller) of the wafer packaging machine.

[0043] With such arrangement, when the shell structure is opened, it should be able to avoid the packaging bag as much as possible so that the packaging bag can be sealed smoothly. Based on this, the shell structure is designed as two half covers, one of which is fixed and the other is movable. This not only takes into account the above requirements, but also helps to control equipment costs and is not easy to interfere with other surrounding mechanisms.

[0044] Of course, in addition to the above-mentioned manner, it is also feasible to set the first half cover 1 and the second half cover 2 to be movable. When the shell structure is opened, the first half cover 1 and the second half cover 2 move or rotate away from each other, and when the shell structure is closed, the first half cover 1 and the second half cover 2 are buckled again. In addition, it is also feasible to design the shell structure as an open box and a cover plate.

[0045] Further, in some preferred embodiments, the second half cover 2 is rotatably connected to the first half cover 1; the first half cover 1 and the second half cover 2 both have an arc surface, which can be hemispherical or semi-cylindrical, and when the second half cover 2 is in the open position, it is stacked with the first half cover 1, and the second half cover 2 can be stacked on the inside or outside of the first half cover 1. The first power source can be a motor or a steering gear.

[0046] With such arrangement, the second half cover 2 is rotated and flipped, which is more conducive to saving space when the shell structure is opened, with high space utilization, and is also conducive to the original arrangement of other mechanisms of the wafer packaging machine where the sealing device is located, thereby reducing equipment modification costs.

[0047] Regarding the specific structure of the clamping mechanism, it can be set that the clamping mechanism includes a first clamp 3 and a second clamp 4 that can be closed and separated, the second clamp 4 is fixed in position, the second power source drives the first clamp 3 to approach and move away from the second clamp 4, and at least one of the first clamp 3 and the second clamp 4 is provided with a heating structure, which can be a heating rod or a heating plate integrated in the first clamp 3 and the second clamp 4. The second power source can be a cylinder, a hydraulic cylinder, etc., and the second power source is connected to a relay, and the relay is connected to the PLC (Programmable Logic Controller) of the wafer packaging machine.

[0048] Based on this, in some other preferred embodiments, the first half cover 1 is located on the side of the first clamp 3 facing away from the second clamp 4. In this way, the first half cover 1 fixed in position does not cover the second clamp 4 fixed in position, so when the shell structure is opened, it is beneficial to ensure that the second clamp 4 is fully exposed and unobstructed around, and the packaging bag can be extended under the second clamp 4 in a straight line, and then the first clamp 3 can move in coordination to clamp the packaging bag.

[0049] Exemplarily, it can be arranged that the first clamping member 3 is located below the second clamping member 4 , and when the shell structure is closed, the first half cover 1 is located below the second half cover 2 .

[0050] In some other optional embodiments, the sealing device provided by the present application further includes an air source 5, an air inlet channel 6 and a start-stop switch; the air inlet channel 6 connects the air source 5 and the air inlet, and the air inlet channel 6 can be in the form of a hose; the start-stop switch controls the start and stop of the air source 5. The start-stop switch can be a relay or an ordinary switch. When the start-stop switch is set to a relay, it is connected to the PLC (Programmable Logic Controller) of the wafer packaging machine. Preferably, the first half cover 1, which is fixed in position, is provided with an air inlet.

[0051] With such arrangement, the sealing device is integrated with the matching air source 5 and the air inlet channel 6, and the air inlet channel 6 can be flexibly arranged in a complex packaging operation area.

[0052] Of course, it is also feasible to use an air gun that is in a separate structural relationship with the sealing device to blow air into the air inlet.

[0053] In some other optional embodiments, the sealing device provided by the present application further comprises an exhaust channel 7 connected to the exhaust port to collect the exhausted airflow and dust, and the exhaust channel 7 may be in the form of a hose. Preferably, the first half cover 1 which is fixed in position is provided with an exhaust port.

[0054] Such an arrangement is conducive to the centralized collection of airflow mixed with dust, and leading it to the outside of the packaging operation area for unified treatment, such as filtering and dust collection, without causing additional dust pollution inside the wafer packaging machine. The exhaust channel 7 is convenient for flexible arrangement in complex packaging operation areas.

[0055] Of course, it is also feasible to provide a negative pressure device connected to the exhaust port, or to exhaust directly from the exhaust port toward the suction side of the negative pressure device, and to use the negative pressure suction effect to extract the airflow mixed with dust.

[0056] In some other preferred embodiments, the air inlet and the air outlet are located on opposite sides of the clamping mechanism and are staggered, which is conducive to sufficient disturbance of the airflow in the space enclosed by the shell structure, and has a better effect of blowing and discharging dust.

[0057] In some other preferred embodiments, the air inlet and the air outlet are respectively located on opposite sides of the clamping mechanism in the length direction, and the length direction of the shell structure is consistent with the length direction of the clamping mechanism. In this way, since the first clamp 3 and the second clamp 4 of the clamping mechanism are usually configured as narrow and long pieces, the airflow blows along the length direction of the first clamp 3 and the second clamp 4, which is conducive to the airflow passing through all parts of the first clamp 3 and the second clamp 4, and the dust is blown more thoroughly.

[0058] Based on the arrangement of the clamping mechanism including the first clamp 3 and the second clamp 4 that can be closed and separated, in some preferred embodiments, the space between the first clamp 3 and the second clamp 4 in the separated state is opposite to the air inlet, and the air inlet is taken in after the first clamp 3 and the second clamp 4 are separated. Since dust is easily generated on the part in contact with the packaging bag, that is, the opposite surface of the first clamp 3 and the second clamp 4, the position of the air inlet is arranged in this way, which is conducive to directional blowing and better dust removal effect.

[0059] Based on the above-mentioned sealing device, the embodiment of the present application further provides a wafer packaging machine, which includes the above-mentioned sealing device. Since the wafer packaging machine has the above-mentioned sealing device, the beneficial effects of the wafer packaging machine brought by the sealing device can be found in the above content, which will not be repeated here.

[0060] In addition, the wafer packaging machine may also include a vacuuming mechanism for evacuating the packaging bag, which cooperates with the sealing device to achieve vacuum-sealed packaging of the wafers.

[0061] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0062] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0063] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0064] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0065] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0066] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A sealing device, characterized in that: include: A clamping mechanism capable of clamping and releasing the piece to be sealed; A heating structure, arranged on the clamping mechanism and used to heat the clamped portion of the piece to be sealed to achieve sealing; A shell structure, arranged around the clamping mechanism and capable of opening and closing, the shell structure being provided with an air inlet and an air outlet; When the shell structure is opened, the sealed part can be extended into the clamping mechanism; when the shell structure is closed, the clamping mechanism is enclosed in the shell structure, and the air inlet takes in air to purge the clamping mechanism, and the exhaust port exhausts air to discharge airflow and dust.

2. The sealing device according to claim 1, characterized in that: The shell structure comprises: A first half cover (1) is arranged to partially surround the clamping mechanism; a second half cover (2) movably arranged relative to the first half cover (1), wherein the second half cover (2) has a position including a closed position in which the second half cover (2) cooperates with the first half cover (1) to fully surround the clamping mechanism, and an open position in which the clamping mechanism is partially exposed and the sealing member can be inserted into the clamping mechanism; A first power source drives the second half cover (2) to move.

3. The sealing device according to claim 2, characterized in that: The second half cover (2) is rotatably connected to the first half cover (1); The first half cover (1) and the second half cover (2) both have curved surfaces, and when the second half cover (2) is located in the open position, it overlaps with the first half cover (1).

4. The sealing device according to claim 2, characterized in that: The clamping mechanism comprises a first clamp (3) and a second clamp (4), the first clamp (3) can approach and move away from the second clamp (4), and at least one of the first clamp (3) and the second clamp (4) is provided with the heating structure; The first half cover (1) is located on a side of the first clamping member (3) facing away from the second clamping member (4).

5. The sealing device according to claim 1, characterized in that: Also includes: Gas source (5); An air inlet channel (6) connecting the air source (5) and the air inlet; A start-stop switch controls the start and stop of the gas source (5).

6. The sealing device according to claim 1, characterized in that: It also includes an exhaust channel (7) connected to the exhaust port to collect the exhausted airflow and dust.

7. The sealing device according to claim 1, characterized in that: The air inlet and the air outlet are respectively located on two opposite sides of the clamping mechanism and are staggered.

8. The sealing device according to claim 1 or 7, characterized in that: The air inlet and the air outlet are respectively located at two opposite sides of the clamping mechanism in the length direction.

9. The sealing device according to claim 1, characterized in that: The clamping mechanism comprises a first clamp (3) and a second clamp (4) which can be closed and separated, and at least one of the first clamp (3) and the second clamp (4) is provided with the heating structure; The space between the first clamp (3) and the second clamp (4) in the separated state is opposite to the air inlet.

10. A wafer packaging machine, characterized in that: Comprising a sealing device as described in any one of claims 1-9.

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