A chip testing system

Abstract

The present application discloses a chip testing system, which includes a control device, a signal output device, a chip carrier device, a signal transmission device, and a signal receiving and processing device. The control device can control the chip carrier device to move the target chip to a first target position, and send a second control information to the signal output device to output an initial electrical signal, so that the target chip emits light. The signal output device collects the target optical signal output by the target chip and transmits it to the signal receiving and processing device to process the target optical signal to obtain a target electrical signal, and compare the target electrical signal with the initial electrical signal to obtain the test result of the target chip. The chip testing system provided by the present application can fully automatically test the performance of the target chip, without manual participation throughout the process, and the work of each device is accurately controlled by control instructions, which can not only improve the efficiency of the test, but also improve the accuracy of the test.

Description

Technical Field

[0001] The present disclosure generally relates to the field of chip testing technology, and in particular to a chip testing system. Background Art

[0002] With the deepening of research on Vertical-Cavity Surface-Emitting Laser (VCSEL) and the expansion of application needs, VCSEL is playing an increasingly important role in communication fields such as large data centers and supercomputers, especially in short-distance transmission links.

[0003] In the field of optical communications, the performance of semiconductor lasers is very important. In the process of scientific research and production, it is found that the performance of different chips often has huge differences. At present, the performance of each chip is mainly tested by manual and semi-automatic test systems, and its test speed and test accuracy are difficult to guarantee. Summary of the invention

[0004] In view of the above defects or deficiencies in the prior art, it is desired to provide a new chip testing system.

[0005] The present application provides a chip testing system, which includes a control device, a signal output device, a chip carrying device, a signal transmission device, and a signal receiving and processing device.

[0006] The control device sends a first control signal to the chip carrier device, wherein the first control signal carries the coordinates of the target chip;

[0007] The chip-carrying device moves the target chip to a first target position based on the coordinates of the target chip, and sends a feedback signal to the control device;

[0008] The control device sends a second control signal to the signal output device in response to the feedback signal;

[0009] The signal output device outputs an initial electrical signal to the target chip in response to the second control signal, and when the target chip emits light based on the initial electrical signal, collects a target optical signal output by the target chip, and transmits the target optical signal to the signal receiving and processing device;

[0010] The signal receiving and processing device performs photoelectric conversion processing on the target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal, and determines the test result of the target chip according to the comparison result.

[0011] In an optional embodiment, the control device receives a test requirement, obtains the identification of the target chip according to the test requirement, and matches the identification of the target chip with a coordinate information table to obtain the coordinates of the target chip, wherein the coordinate information table includes the identifications of all chips placed on the chip carrier and the coordinates corresponding to the identification of each chip.

[0012] In an optional embodiment, the chip carrying device analyzes the first control signal to obtain the coordinates of the target chip;

[0013] The chip carrying device moves the target chip horizontally and in a direction close to the output end of the signal output device to the first target position based on the coordinates of the target chip and the position of the output end of the signal output device.

[0014] In an optional embodiment, the control device sends a third control signal to the signal transmission device;

[0015] The signal transmission device moves on the optical path of the light emitted by the target chip based on the initial electrical signal in response to the third control signal to collect a plurality of different optical signals, and transmits the plurality of optical signals to the control device;

[0016] The control device determines the position corresponding to the optical signal with the largest intensity among the multiple optical signals as the second target position, and sends a fourth control signal to the signal transmission device;

[0017] The signal transmission device moves to the second target position in response to the fourth control signal to collect the target optical signal output by the target chip.

[0018] In an optional embodiment, the control device is communicatively connected to the signal output device, the chip carrying device, the signal transmission device, and the signal receiving and processing device respectively;

[0019] The input end of the signal transmission device is arranged on the optical path of the target chip emitting light based on the initial electrical signal, and the output end of the signal transmission device is connected to the signal receiving and processing device.

[0020] In an optional embodiment, the signal output device includes a signal transmitter, a probe and a fixing device, the signal transmitter is connected to the probe via a connecting line, and the fixing device fixes the probe at a position corresponding to the first target position.

[0021] In an optional embodiment, the chip carrier device includes a chip carrier and a first position adjustment device, a plurality of chips are placed on a first surface of the chip carrier, and the first position adjustment device is installed on a second surface of the chip carrier opposite to the first surface;

[0022] The first position adjustment device moves the target chip placed on the first surface of the chip carrier to a first target position based on the coordinates of the target chip in response to the first control signal, and sends a feedback signal to the control device.

[0023] In an optional embodiment, the first position adjustment device moves the target chip horizontally and in a direction close to the output end of the signal output device to the first target position in response to the first control signal based on the coordinates of the target chip and the position of the output end of the signal output device.

[0024] In an optional embodiment, the signal transmission device includes an optical fiber, an optical power device and a second position adjustment device, the optical power device and the position adjustment device are respectively connected to the control device for communication, the input end of the optical fiber is connected to the second position adjustment device, and the output end of the optical fiber is connected to the optical power device through the signal receiving and processing device;

[0025] The second position adjustment device moves the input end of the optical fiber to an optical path of light emitted by the target chip based on the initial electrical signal in response to the fifth control signal of the control device.

[0026] In an optional embodiment, the second position adjustment device moves the input end of the optical fiber on the optical path of the light emitted by the target chip based on the initial electrical signal in response to the third control signal;

[0027] The input end of the optical fiber collects a plurality of different optical signals during the movement, and transmits the plurality of optical signals to the control device through the first output end and the optical power device.

[0028] In an optional embodiment, the second position adjustment device moves the input end of the optical fiber to the second target position in response to the fourth control signal;

[0029] After the input end of the optical fiber moves to the second target position, the target optical signal output by the target chip is collected.

[0030] In an optional embodiment, the signal receiving and processing device includes a switching sub-device and a plurality of test sub-devices, the output end of the signal transmission device is connected to the switching sub-device, and the plurality of test sub-devices are respectively connected to different interfaces of the switching sub-device.

[0031] The control device determines a target test sub-device from the plurality of test sub-devices according to the test requirement, and sends a sixth control signal to the switching sub-device;

[0032] The switching sub-device switches on the interface connected to the target test sub-device in response to the sixth control signal, so as to form a path between the signal transmission device and the target test sub-device.

[0033] The chip test system provided by the present application considers that the current test of chip performance remains in the manual or semi-automatic test stage, resulting in that the test speed and test accuracy are difficult to guarantee. The present application provides a chip test system, which includes a control device, a signal output device, a chip carrier device, a signal transmission device, and a signal receiving and processing device. The control device can send a first control signal to the chip carrier device, so that the chip carrier device moves the target chip to a first target position based on the coordinates of the target chip carried in the first control signal. After the target chip is moved to the first target position, the chip carrier device sends a feedback signal to the control device. The control device sends a second control information to the signal output device in response to the feedback signal, so that the signal output device outputs an initial electrical signal to the target chip under the control of the second control signal. The target chip emits light based on the initial electrical signal. The signal output device collects the target optical signal output by the target chip and transmits the target optical signal to the signal receiving and processing device. The signal receiving and processing device performs photoelectric conversion processing on the received target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal. The test result of the target chip can be determined according to the comparison result. The chip testing system provided in the present application can fully automatically test the performance of the target chip without the need for human intervention throughout the process, and the operation of each device is precisely controlled through control instructions, which can not only improve the efficiency of the test, but also improve the accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0035] Figure 1 A schematic diagram of the structure of a chip testing system provided in this application;

[0036] Figure 2 A flowchart of the steps of a chip testing method provided in this application;

[0037] Figure 3 A schematic diagram of the structure of a chip carrier device provided in this application;

[0038] Figure 4 A schematic diagram of the structure of a signal output device provided in this application;

[0039] Figure 5 A schematic diagram of the structure of a signal transmission device provided in this application;

[0040] Figure 6 A flowchart of another chip testing method provided in this application;

[0041] Figure 7 A schematic diagram of the structure of a signal receiving and processing device provided by the present application;

[0042] Figure 8 A schematic diagram of the structure of a computer system for a control device provided in this application.

[0043] Description of reference numerals:

[0044] 1000. Test system;

[0045] 10. Control device; 20. Signal output device; 30. Chip carrying device; 40. Signal transmission device; 50. Signal receiving and processing device; 60. Target chip;

[0046] 201, signal transmitter; 202, probe; 203, fixing device;

[0047] 301, chip carrier plate; 302, first position adjustment device;

[0048] 401, optical fiber; 402, optical power device; 403, second position adjustment device;

[0049] 501, switch sub-device; 502, test sub-device;

[0050] 800. Computer system; 801. Central processing unit (CPU); 802. Read-only memory (ROM); 803. Random access memory (RAM); 804. Bus; 805. Input / output (I / O) interface; 806. Input part; 807. Output part; 808. Storage part; 809. Communication part; 810. Drive; 811. Removable media. DETAILED DESCRIPTION

[0051] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0052] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0053] With the deepening of research on Vertical-Cavity Surface-Emitting Laser (VCSEL) and the expansion of application needs, VCSEL is playing an increasingly important role in communication fields such as large data centers and supercomputers, especially in short-distance transmission links.

[0054] In the field of optical communications, the performance of semiconductor lasers is very important. In the process of scientific research and production, it is found that the performance of different chips often has huge differences. At present, the performance of each chip is mainly tested by manual and semi-automatic test systems, and its test speed and test accuracy are difficult to guarantee. Therefore, a new test system is urgently needed to test the performance of the chip.

[0055] Please refer to Figure 1 , Figure 1 The present application provides a chip testing system 1000 , which includes a control device 10 , a signal output device 20 , a chip carrier device 30 , a signal transmission device 40 and a signal receiving and processing device 50 .

[0056] The control device 10 may be a device having functional modules such as a CPU module, an input module, an output module, and a communication module.

[0057] The CPU module of the control device 10 is the core module of the control device 10, which is mainly responsible for processing input signals, executing program instructions, controlling output signals, and providing monitoring and diagnostic functions. The CPU module generally includes a central processing unit, a memory, and a communication interface.

[0058] The input module of the control device 10 is used to collect external signals, such as sensor signals, button signals, switch signals, etc.

[0059] The output module of the control device 10 is used to control external devices. The communication module of the control device 10 is used to realize data communication between the control device 10 and other devices. The control device 10 establishes communication connection with the signal output device 20, the chip carrier device 30, the signal transmission device 40 and the signal receiving and processing device 50 through the communication module.

[0060] The control device 10 can send control instructions to other devices based on the functional modules configured above, and can receive signals, data, etc. sent by other devices. The control device 10 is, for example, a host computer, a computer device, a server, a controller, etc.

[0061] The control device 10 may also include, for example, a display module, a storage module, a power module, a bus module, etc., which will not be elaborated here.

[0062] The signal output device 20 is used to output an electrical signal to the chip so that the chip emits light under the action of the electrical signal. The signal output device 20 is, for example, a combination of a signal transmitter and a signal line, a combination of a fixing device 203 and a probe 202, and the like.

[0063] The chip carrier 30 is used to carry chips, that is, each chip that needs to be tested for performance can be placed on the chip carrier 30. In addition, the chip carrier 30 can also move up and down, left and right according to corresponding control signals. The chip carrier 30 includes, for example, a loading tray, a multi-axis drive motor, and a movable slide rail.

[0064] The signal transmission device 40 is used to collect the optical signal emitted by the chip based on the electrical signal, and transmit it to the signal receiving and processing device 50. The signal transmission device 40 includes, for example, an optical fiber 401 and a second position adjustment device 403.

[0065] The signal receiving and processing device 50 is used to perform photoelectric conversion on the received optical signal to obtain an electrical signal. The signal receiving and processing device 50 includes, for example, a photoelectric converter and a signal analyzer, wherein the signal analyzer can be at least one of a vector network analyzer, a bit error analyzer, a spectrometer, etc. according to different functions.

[0066] Based on the above introduction to the structure of the test system 1000, the process of performing chip testing by the test system 1000 is described below. Figure 2 As shown, the following steps are included:

[0067] Step S201, the control device 10 sends a first control signal to the chip carrier device 30, where the first control signal carries the coordinates of the target chip 60;

[0068] Among them, the control device 10 may send a first control signal to the chip carrier device 30 through the above-mentioned communication module. The first control signal is used to instruct the chip carrier device 30 to move the target chip 60 to a specified position. Since the chip carrier device 30 carries multiple chips, the first control signal carries the coordinates of the target chip 60, so that after receiving the first control signal sent by the control device 10, the chip carrier device 30 parses the first control signal to obtain the coordinates of the target chip 60, determines the target chip 60 from the multiple chips according to the coordinates of the target chip 60, and moves the target chip 60 to the specified position.

[0069] The target chip 60 is any one of the multiple chips placed on the chip carrier device 30 that needs to be tested. The target chip 60 can be a chip specified by the tester. When the tester determines that the target chip 60 needs to be tested, the corresponding test requirement can be input to the control device 10 through the input module of the control device 10. The test requirement carries the unique mark, number, coordinates, etc. of the target chip 60. When the control device 10 receives the test requirement, it parses the test requirement, and can directly or indirectly obtain the coordinates of the target chip 60, and generates a corresponding first control signal based on the coordinates of the target chip 60 and sends it to the chip carrier device 30.

[0070] It should be noted that the first control signal may also carry a unique identifier of the chip carrier device 30 , so that the control device 10 can accurately send the first control signal to the corresponding chip carrier device 30 .

[0071] Exemplarily, the coordinates of the target chip 60 may be three-dimensional coordinates or two-dimensional coordinates, which is not limited in the present application.

[0072] Step S202 , the chip carrier device 30 moves the target chip 60 to a first target position based on the coordinates of the target chip 60 , and sends a feedback signal to the control device 10 ;

[0073] Among them, the chip carrier device 30 may include multiple chip carrier devices 30, and the multiple chip carrier devices 30 may be connected to the control device 10 for communication to accept the control of the control device 10. Each chip carrier device 30 has a unique identifier corresponding to itself, which is convenient for the control device 10 to identify and communicate. When the chip carrier device 30 carrying the target chip 60 receives the first control signal sent by the control device 10 through the receiver or communication module thereon, the first control signal may be parsed to obtain the coordinates of the target chip 60.

[0074] Since the test system 1000 provided in the present application is used to test the performance of the chip, when the chip carrier device 30 obtains the coordinates of the target chip 60, it can be determined that the performance test of the target chip 60 is currently required. Then, the target chip 60 needs to be moved to a position where it can receive the initial electrical signal output by the signal output device 20. For the sake of ease of description, this position is referred to as the first target position.

[0075] After the chip carrier device 30 moves the target chip 60 to the first target position, a corresponding feedback signal may be generated to send the feedback signal to the control device 10, so that the control device 10 determines that the target chip 60 has moved to the first target position through the feedback signal. That is, the target chip 60 has moved to a position in contact with the signal output device 20, and the two are in a connected state.

[0076] In an optional embodiment, if Figure 3 As shown, the chip carrier device 30 includes a chip carrier plate 301 and a first position adjustment device 302. A plurality of chips are placed on a first surface of the chip carrier plate 301, and the first position adjustment device 302 is installed on a second surface of the chip carrier plate 301 opposite to the first surface;

[0077] The first position adjustment device 302 moves the target chip 60 placed on the first surface of the chip carrier 301 to a first target position based on the coordinates of the target chip 60 in response to the first control signal, and sends a feedback signal to the control device 10 .

[0078] The structure of the chip carrier 301 is, for example, circular, square, rectangular, etc. In order to avoid interference when testing the chips carried thereon, the chip carrier 301 is made of metal in most cases.

[0079] The first position adjustment device 302 is used to move the target chip 60 to the first target position according to the first control signal. Then the first position adjustment device 302 may include a communication module, which can communicate with the communication module of the control device 10 and receive the first control signal sent by the control device 10. Based on the first control signal, the first position adjustment device 302 controls, for example, a manipulator, a mechanical arm, a lifting device, a movable slide rail, etc. to move the target chip 60 on the chip carrier 301 to the first target position.

[0080] In an optional embodiment, the chip carrier device 30 may perform the following operations to move the target chip 60 to the first target position:

[0081] First, after receiving the first control signal sent by the control device 10, the chip carrier device 30 analyzes the first control signal to obtain the coordinates of the target chip 60; illustratively, the first position adjustment device 302 in the chip carrier device 30 receives the first control signal and analyzes the first control signal;

[0082] Second, the chip carrier device 30 moves the target chip 60 horizontally and in a direction close to the output end of the signal output device 20 to a first target position according to the coordinates of the target chip 60 and the position of the output end of the signal output device 20 .

[0083] Exemplarily, the first position adjustment device 302 may first determine the horizontal distance between the target chip 60 and the horizontal coordinate of the output device of the signal output device 20 according to the horizontal coordinate of the target chip 60 and the horizontal coordinate of the output device of the signal output device 20, and determine the horizontal movement strategy for the target chip 60 (move to the left or move to the right); then determine the vertical distance between the target chip 60 and the vertical coordinate of the output device of the signal output device 20 according to the vertical coordinate of the target chip 60 and the vertical coordinate of the output device of the signal output device 20, and determine the vertical movement strategy for the target chip 60 (move up or move down). After determining the horizontal movement strategy and the vertical movement strategy, the target chip 60 may be first moved horizontally and then moved vertically; or, the target chip 60 may be first moved vertically and then moved horizontally, and finally the target chip 60 is moved to the first target position. This application is not limited to this.

[0084] It can be understood that after the first position adjustment device 302 moves the target chip 60 to the first target position, it may send a corresponding feedback signal to the control device 10 so that the control device 10 performs the following operations based on the feedback signal.

[0085] Step S203, the control device 10 sends a second control signal to the signal output device 20 in response to the feedback signal;

[0086] The second control signal is used to control the signal output device 20 to output the initial electrical signal to the target chip 60. It is understandable that the second control signal may carry the unique identifier of the signal output device 20, so that the control device 10 accurately sends the second control signal to the signal output device 20. Exemplarily, the signal output device 20 includes, for example, a signal transmitter 201, and the communication module of the control device 10 may be communicatively connected with the communication module of the signal transmitter 201, so that the communication module of the signal transmitter 201 receives the second control signal sent by the control device 10.

[0087] Step S204, the signal output device 20 outputs an initial electrical signal to the target chip 60 in response to the second control signal;

[0088] Among them, when the chip carrier device 30 moves the target chip 60 to the first target position, the output end of the signal output device 20 contacts the target chip 60, and the two are in an on state. At this time, the signal output device 20 outputs the initial electrical signal according to the second control signal sent by the control device 10, and the initial electrical signal can be transmitted to the target chip 60, so that the target chip 60 can emit light under the action of the initial electrical signal.

[0089] In an optional embodiment, if Figure 4As shown, the signal output device 20 includes a signal transmitter 201, a probe 202 and a fixing device 203. The signal transmitter 201 is connected to the probe 202 via a connecting line, and the fixing device 203 fixes the probe 202 at a position corresponding to the first target position.

[0090] Among them, the signal transmitter 201 is used to generate an electrical signal, and transmit the electrical signal to the probe 202 through a connecting line, and the probe 202 transmits it to the target chip 60. The probe 202 includes a needle tip and a probe arm; the needle tip is, for example, one of a DC test needle, a coaxial DC test needle, an active needle, and a microwave needle. The needle tip needs to be inserted into the probe arm to fix it, so the probe arm needs to match the needle tip. The size and material of the tip of the needle tip depend on the size of the chip and the type of measurement required. The needle tip can directly contact the target chip 60. The fixing device 203 is connected to the probe arm to fix the probe 202 in a predetermined position, so that the chip carrier device 30 can adjust the position of the target chip 60 to make the probe 202 contact with the target chip 60 or stay away from the target chip 60.

[0091] It should be noted here that the signal transmitter 201 can be connected to the control device 10 for communication, and under the control of the control signal sent by the control device 10, the parameters of the initial electrical signal output to the target chip 60 can be changed by changing the voltage, current and other data to meet different types of tests on the target chip 60.

[0092] In step S205 , when the target chip 60 emits light based on the initial electrical signal, the signal transmission device 40 collects the target optical signal output by the target chip 60 , and transmits the target optical signal to the signal receiving and processing device 50 .

[0093] The signal transmission device 40 may be arranged on the optical path of the target chip 60 emitting light based on the initial electrical signal, so as to collect the target optical signal emitted by the target chip 60 and transmit the target optical signal to the signal receiving and processing device 50 .

[0094] In an optional embodiment, if Figure 5 As shown, the signal transmission device 40 includes an optical fiber 401, an optical power device 402, and a second position adjustment device 403. The optical power device 402 and the position adjustment device are respectively connected to the control device 10 for communication. The input end of the optical fiber 401 is connected to the second position adjustment device 403. The first output end of the optical fiber 401 is connected to the optical power device 402. The second output end of the optical fiber 401 is connected to the input end of the signal receiving and processing device 50.

[0095] The second position adjustment device 403 moves the input end of the optical fiber 401 to the optical path of the target chip 60 lasing light based on the initial electrical signal in response to the fifth control signal of the control device 10 .

[0096] The optical fiber 401 is used to collect and transmit optical signals. The optical power meter 402 is used to measure the power of the optical signal in the optical fiber 401. The second position adjustment device 403 is used to adjust the position of the input end of the optical fiber 401 so as to receive the optical signal with the maximum power through the optical fiber 401. The second position adjustment device 403 may include a communication module, which is communicatively connected to the communication module in the control device 10.

[0097] Since the target chip 60 is determined according to the test requirements before the test, the test object can be different for different tests. Therefore, when the target chip 60 needs to be tested, the position of the input end of the optical fiber 401 is not necessarily on the optical path of the target chip 60 based on the initial electrical signal. Therefore, the second position adjustment device 403 can be based on the fifth control signal sent by the control device 10 to move the input end of the optical fiber 401 to the optical path of the target chip 60 based on the initial electrical signal, so that the optical fiber 401 can collect the optical signal.

[0098] Exemplarily, the second position adjustment device 403 may be a device having the same structure as the first position adjustment device 302 , or may be only a motor.

[0099] The input end of the optical fiber 401 in the signal transmission device 40 can be set on the optical path of the target chip 60 based on the initial electrical signal, so that the optical signal can be collected and transmitted to the input end of the signal receiving and processing device 50 through the second output end of the optical fiber 401.

[0100] It should be noted here that, since the light emitted by the target chip 60 is divergent and the size of the optical fiber 401 is limited, the position of the optical fiber 401 may not necessarily be able to collect the optical signal with the highest power. At this time, it is necessary to perform the following steps to find the optical signal with the highest power from the optical signal emitted by the target chip 60 for output to improve the accuracy of the test, such as Figure 6 As shown:

[0101] Step S601, the control device 10 sends a third control signal to the signal transmission device 40;

[0102] This step may be performed before transmitting the target signal to the signal receiving and processing device 50. When the target chip 60 emits light based on the initial electrical signal, the control device 10 may send a third control signal to the signal transmission device 40 based on the feedback signal of the signal output device 20, and the third control signal may also carry the motion trajectory of the signal output device 20. The motion trajectory of the signal output device 20 may be calculated by the control device based on a hill climbing algorithm, a local optimization algorithm, or the like.

[0103] Optionally, the control device 10 may send a third control signal to the second position adjustment device 403 in the signal transmission device 40 , and the third control signal may also carry a motion trajectory of the second position adjustment device 403 .

[0104] Step S602, the signal transmission device 40 moves on the optical path of the target chip 60 based on the initial electrical signal to collect multiple different optical signals in response to the third control signal, and transmits the multiple optical signals to the control device 10;

[0105] Among them, when the signal transmission device 40 receives the third control signal, it parses the third control signal to obtain multiple position coordinates, and moves to the positions pointed to by the multiple position coordinates in sequence, and collects the optical signal once when moving to a pointed position to obtain multiple different optical signals, and transmits the multiple different optical signals to the control device 10.

[0106] Optionally, the second position adjustment device 403 in the signal transmission device 40 may receive the third control signal, analyze the third control signal to obtain the motion trajectory of the second position adjustment device 403, and move to the first position, the second position, the third position, the fourth position, ... in sequence according to the motion trajectory.

[0107] The second position adjustment device 403 is connected to the input end of the optical fiber 401 in the signal transmission device 40, so when the second position adjustment device 403 moves, it will drive the input end of the optical fiber 401 to move to the first position, the second position, the third position, the fourth position, ... in sequence. When the optical fiber 401 moves to the first position, the second position, the third position, the fourth position, ... in sequence, an optical signal is collected once at the first position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end; an optical signal is collected once at the second position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end; an optical signal is collected once at the third position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end; an optical signal is collected once at the fourth position and transmitted to the optical power device 402 in the signal transmission device 40 through the first output end.

[0108] Step S603, the control device 10 determines the position corresponding to the optical signal with the largest power among the multiple optical signals as the second target position, and sends a fourth control signal to the signal transmission device 40;

[0109] Among them, after collecting multiple optical signals, the signal transmission device 40 can directly transmit them to the control device 10, and the control device 10 determines the optical signal with the largest power among the multiple optical signals; or it can obtain the power values ​​corresponding to the multiple optical signals by means of measurement, calculation, etc., and transmit the multiple power values ​​to the control device 10, and the control device 10 determines the optical signal with the largest power value, and further determines the position corresponding to the optical signal with the largest power value, which is called the second target position. After the second target position is determined, the signal transmission device 40 needs to move to the second target position again to collect the optical signal, so as to obtain the target optical signal, so the control device 10 generates a fourth control signal and sends the fourth control signal to the signal transmission device 40, so that the signal transmission device 40 moves to the second target position based on the fourth control signal to collect the target optical signal.

[0110] Optionally, the optical power device 402 in the signal transmission device 40 may obtain multiple power values ​​through measurement and send them to the control device 10, and the control device 10 may determine the optical signal with the largest power, and further determine the position to which the optical signal is collected by the optical fiber 401 when the second position adjustment device 403 moves, and determine the position as the second target position. After the second target position is determined, the optical fiber 401 needs to be moved to the second target position again to collect the optical signal, so as to obtain the target optical signal. Therefore, the control device 10 generates a fourth control signal and sends the fourth control signal to the second position adjustment device 403 in the signal transmission device 40.

[0111] Step S604 : the signal transmission device 40 moves to the second target position in response to the fourth control signal to collect the target optical signal output by the target chip 60 .

[0112] The signal transmission device 40 may analyze the fourth control signal to obtain the second target position after receiving the fourth control signal sent by the control device 10, and move to the second target position to collect the optical signal to obtain the target optical signal.

[0113] Optionally, the fourth control signal sent by the control device 10 can be received by the second position adjustment device 403, which then analyzes the fourth control signal to obtain a second target position, and drives the input end of the optical fiber 401 to move to the second target position, and the optical fiber 401 collects the optical signal at the second target position to obtain the target optical signal.

[0114] In step S206 , the signal receiving and processing device 50 performs photoelectric conversion processing on the target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal, and determines the test result of the target chip 60 according to the comparison result.

[0115] The signal receiving and processing device 50 is used to perform photoelectric conversion processing on the received optical signal to obtain a corresponding electrical signal, and to analyze the electrical signal to obtain a test result of the target chip 60 .

[0116] In an optional embodiment, if Figure 7 As shown, the signal receiving and processing device 50 includes a switching sub-device 501 and a plurality of test sub-devices 502. The output end of the signal transmission device 40 is connected to the switching sub-device 501, and the plurality of test sub-devices 502 are respectively connected to different interfaces of the switching sub-device 501.

[0117] The control device 10 determines a target test sub-device from the multiple test sub-devices 502 according to the test requirements, and sends a sixth control signal to the switching sub-device 501;

[0118] The switching sub-device 501 switches on the interface connected to the target test sub-device in response to the sixth control signal, so as to form a path between the signal transmission device 40 and the target test sub-device.

[0119] The switching sub-device 501 is, for example, an adjustable switch, and the multiple test sub-devices 502 are, for example, a vector network analyzer, a bit error analyzer, a spectrometer, etc. The vector network analyzer is used to perform an S21 test on the target chip 60, the bit error analyzer is used to perform a bit error rate test on the target chip 60, and the spectrometer is used to perform a spectrum test on the target chip 60. Therefore, when it is necessary to perform any type of test on the target chip 60, the switching sub-device 501 is controlled to switch to the interface with the target test sub-device to connect the signal transmission device 40 and the target test sub-device, that is, to form a path between the signal transmission device 40 and the target test sub-device, so that the optical signal collected by the signal transmission device 40 will be received by the target test sub-device, so that the target test sub-device can perform corresponding analysis according to the display result of the received target optical signal.

[0120] In an optional embodiment, the control device 10 may store a coordinate information table, which includes the identification of all chips on the chip carrier device 30 and the coordinates corresponding to the identification of each chip. The control device 10 of the present application may parse the test requirements based on the test requirements sent by the tester, obtain the identification of the target chip 60, and match the identification of the target chip 60 with the stored coordinate information table to obtain the coordinates of the target chip 60.

[0121] Furthermore, after the control device 10 obtains the coordinates of the target chip 60 in the above manner, it can generate a first control signal based on the coordinates of the target chip 60 , where the first control signal carries the coordinates of the target chip 60 and sends it to the chip carrier device 30 .

[0122] Below, a complete test process for the target chip 60 is provided as an example:

[0123] First, the tester sends a test requirement to the control device 10 , and the test requirement carries the identifier of the target chip 60 ;

[0124] Second, after receiving the test requirement, the control device 10 parses the test requirement to obtain the identification of the target chip 60, reads the coordinate information table stored in the memory address, matches the identification of the target chip 60 with the coordinate information table, obtains the coordinates of the target chip 60, generates a corresponding first control signal based on the coordinates of the target chip 60, and sends the first control signal to the chip carrier device 30;

[0125] Third, the chip carrier device 30 receives the first control signal, analyzes the first control signal to obtain the coordinates of the target chip 60, moves the target chip 60 to the first target position according to the coordinates of the target chip 60, and sends a feedback signal to the control device 10;

[0126] Fourth, after receiving the feedback signal, the control device 10 generates a second control signal and sends the second control signal to the signal output device 20;

[0127] Fifth, after receiving the second control signal, the signal output device 20 outputs an initial electrical signal to the target chip 60 and sends a feedback signal to the control device 10;

[0128] Sixth, after receiving the feedback signal, the control device 10 generates a third control signal and sends the third control signal to the signal transmission device 40;

[0129] Seventh, the signal transmission device 40 moves on the optical path of the target chip 60 based on the initial electrical signal to collect multiple different optical signals according to the third control signal, and transmits the multiple optical signals to the control device 10;

[0130] Eighth, the control device 10 determines the position corresponding to the optical signal with the largest power among the multiple optical signals as the second target position, generates a fourth control signal, and sends the fourth control signal to the signal transmission device 40;

[0131] Ninth, the signal transmission device 40 moves to the second target position in response to the fourth control signal to collect the target optical signal output by the target chip 60, and transmits the target optical signal to the signal receiving and processing device 50;

[0132] Tenth, the signal receiving and processing device 50 performs photoelectric conversion processing on the target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal, and determines the test result of the target chip 60 according to the comparison result.

[0133] The chip test system provided by the present application considers that the current test of chip performance remains in the manual or semi-automatic test stage, resulting in that the test speed and test accuracy are difficult to guarantee. The present application provides a chip test system, which includes a control device, a signal output device, a chip carrier device, a signal transmission device, and a signal receiving and processing device. The control device can send a first control signal to the chip carrier device, so that the chip carrier device moves the target chip to a first target position based on the coordinates of the target chip carried in the first control signal. After the target chip is moved to the first target position, the chip carrier device sends a feedback signal to the control device. The control device sends a second control information to the signal output device in response to the feedback signal, so that the signal output device outputs an initial electrical signal to the target chip under the control of the second control signal. The target chip emits light based on the initial electrical signal. The signal output device collects the target optical signal output by the target chip and transmits the target optical signal to the signal receiving and processing device. The signal receiving and processing device performs photoelectric conversion processing on the received target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal. The test result of the target chip can be determined according to the comparison result. The chip testing system provided in the present application can fully automatically test the performance of the target chip without the need for human intervention throughout the process, and the operation of each device is precisely controlled through control instructions, which can not only improve the efficiency of the test, but also improve the accuracy of the test.

[0134] Reference below Figure 8 , which shows a schematic diagram of the structure of a computer system 800 suitable for implementing a control device of an embodiment of the present application.

[0135] like Figure 8 As shown, the computer system 800 includes a central processing unit (CPU) 801, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 802 or a program loaded from a storage part 808 to a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the computer system 800 are also stored. The CPU 801, the ROM 802, and the RAM 803 are connected to each other through a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0136] The following components are connected to the I / O interface 805: an input section 806 including a keyboard, a mouse, etc.; an output section 807 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 808 including a hard disk, etc.; and a communication section 809 including a network interface card such as a LAN card, a modem, etc. The communication section 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to the I / O interface 805 as needed. A removable medium 811, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 810 as needed, so that a computer program read therefrom is installed into the storage section 808 as needed.

[0137] In particular, according to the embodiments of the present disclosure, the above reference Figure 2 , Figure 6 The described processes may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program tangibly embodied on a machine-readable medium, the computer program comprising a computer program for executing Figure 2 , Figure 6 In such an embodiment, the computer program may be downloaded and installed from a network via the communication section 809 and / or installed from the removable medium 811.

[0138] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present invention. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the square box can also occur in a different order from the order marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0139] The units or modules involved in the embodiments described in the present application may be implemented by software or hardware. The units or modules described may also be arranged in a processor, for example, may be described as: a processor includes an XX unit, a YY unit, and a ZZ unit. The names of these units or modules do not, in some cases, constitute a limitation on the unit or module itself, for example, the XX unit may also be described as a "unit for XX".

[0140] As another aspect, the present application further provides a computer-readable storage medium, which may be a computer-readable storage medium included in the device described in the above embodiment; or a computer-readable storage medium that exists independently and is not assembled into the device. The computer-readable storage medium stores one or more programs, and the programs are used by one or more processors to execute the formula input method described in the present application.

[0141] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. A chip testing system, characterized in that: The test system includes a control device, a signal output device, a chip carrying device, a signal transmission device and a signal receiving and processing device. The control device sends a first control signal to the chip carrier device, wherein the first control signal carries the coordinates of the target chip; The chip-carrying device moves the target chip to a first target position based on the coordinates of the target chip, and sends a feedback signal to the control device; The control device sends a second control signal to the signal output device in response to the feedback signal; The signal output device outputs an initial electrical signal to the target chip in response to the second control signal; The signal transmission device collects a target optical signal output by the target chip when the target chip emits light based on the initial electrical signal, and transmits the target optical signal to the signal receiving and processing device; The signal receiving and processing device performs photoelectric conversion processing on the target optical signal to obtain a target electrical signal, and compares the target electrical signal with the initial electrical signal, and determines the test result of the target chip according to the comparison result; The first target position is a position where the target chip can receive the initial electrical signal output by the signal output device; The control device sends a third control signal to the signal transmission device; The signal transmission device moves on the optical path of the light emitted by the target chip based on the initial electrical signal in response to the third control signal to collect a plurality of different optical signals, and transmits the plurality of optical signals to the control device; The control device determines the position corresponding to the optical signal with the largest power among the multiple optical signals as the second target position, and sends a fourth control signal to the signal transmission device; The signal transmission device moves to the second target position in response to the fourth control signal to collect the target optical signal output by the target chip.

2. The test system according to claim 1, characterized in that: The control device receives a test requirement, obtains the identification of the target chip according to the test requirement, and matches the identification of the target chip with a coordinate information table to obtain the coordinates of the target chip, wherein the coordinate information table includes the identifications of all chips placed on the chip carrier and the coordinates corresponding to the identification of each chip.

3. The test system according to claim 1, characterized in that: The chip carrying device analyzes the first control signal to obtain the coordinates of the target chip; The chip carrying device moves the target chip horizontally and in a direction close to the output end of the signal output device to the first target position based on the coordinates of the target chip and the position of the output end of the signal output device.

4. The test system according to claim 1, characterized in that: The control device is respectively connected to the signal output device, the chip carrying device, the signal transmission device and the signal receiving and processing device for communication; The input end of the signal transmission device is arranged on the optical path of the target chip emitting light based on the initial electrical signal, and the output end of the signal transmission device is connected to the signal receiving and processing device.

5. The test system according to claim 4, characterized in that: The signal output device includes a signal transmitter, a probe and a fixing device. The signal transmitter is connected to the probe via a connecting line, and the fixing device fixes the probe at a position corresponding to the first target position.

6. The test system according to claim 4, characterized in that: The chip carrier device comprises a chip carrier and a first position adjustment device, a plurality of chips are placed on a first surface of the chip carrier, and the first position adjustment device is installed on a second surface of the chip carrier opposite to the first surface; The first position adjustment device moves the target chip placed on the first surface of the chip carrier to a first target position based on the coordinates of the target chip in response to the first control signal, and sends a feedback signal to the control device.

7. The test system according to claim 6, characterized in that: The first position adjustment device moves the target chip horizontally and in a direction close to the output end of the signal output device to the first target position based on the coordinates of the target chip and the position of the output end of the signal output device in response to the first control signal.

8. The test system according to claim 1, characterized in that: The signal transmission device comprises an optical fiber, an optical power device and a second position adjustment device, wherein the optical power device and the position adjustment device are respectively connected to the control device for communication, the input end of the optical fiber is connected to the second position adjustment device, the first output end of the optical fiber is connected to the optical power device, and the second output end of the optical fiber is connected to the input end of the signal receiving and processing device; The second position adjustment device moves the input end of the optical fiber to an optical path of light emitted by the target chip based on the initial electrical signal in response to the fifth control signal of the control device.

9. The test system according to claim 8, characterized in that: The second position adjustment device moves the input end of the optical fiber on the optical path of the light emitted by the target chip based on the initial electrical signal in response to the third control signal; The input end of the optical fiber collects a plurality of different optical signals during the movement, and transmits the plurality of optical signals to the control device through the first output end and the optical power device.

10. The test system according to claim 8, characterized in that: The second position adjustment device moves the input end of the optical fiber to the second target position in response to the fourth control signal; After the input end of the optical fiber moves to the second target position, the target optical signal output by the target chip is collected.

11. The test system according to claim 2, characterized in that: The signal receiving and processing device comprises a switching sub-device and a plurality of testing sub-devices, the output end of the signal transmission device is connected to the switching sub-device, and the plurality of testing sub-devices are respectively connected to different interfaces of the switching sub-device. The control device determines a target test sub-device from the plurality of test sub-devices according to the test requirement, and sends a sixth control signal to the switching sub-device; The switching sub-device switches on the interface connected to the target test sub-device in response to the sixth control signal, so as to form a path between the signal transmission device and the target test sub-device.

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