Semi-hardware dynamic simulation platform for thermal load of low-temperature system and data interaction method of semi-hardware dynamic simulation platform

Abstract

The invention relates to the field of system simulation, in particular to a semi-hardware dynamic simulation platform of a thermal load of a low-temperature system and a data interaction method of the semi-hardware dynamic simulation platform, which comprise a simulation model of the thermal load of the low-temperature system, a control system model of the thermal load of the low-temperature system and a method for carrying out data interaction on the simulation model and the control system model. According to the semi-hardware dynamic simulation platform for the thermal load of the low-temperature system, the thermodynamic performance of the thermal load of the low-temperature system can be known in advance, the dynamic thermal load of the thermal load of the low-temperature system is simulated, control program pre-verification is carried out, main control logic of the thermal load of the low-temperature system is debugged, and performance estimation of the thermal load of the low-temperature system in different working modes is carried out.

Description

Technical Field

[0001] The present invention relates to the field of system simulation, and in particular to a semi-hardware dynamic simulation platform for thermal load of a cryogenic system and a data interaction method thereof. Background Art

[0002] With the advancement of science and technology, large-scale cryogenic systems have been widely used in cutting-edge fields such as nuclear fusion, high-energy physics, and superconducting systems. Examples include the Large Hadron Collider (LHC) at CERN, the International Thermonuclear Experimental Reactor (ITER), and the National Advanced Experimental Superconducting Tokamak (EAST). Currently, over half of my country's major scientific facilities require cryogenic technology, and eight systems under construction or in pre-research stages require large-scale superfluid helium cryogenic systems.

[0003] In a helium refrigerator, the load is located downstream of the refrigerator. The dynamic heat load of the load will cause a certain thermal shock to the refrigerator. In order to reduce the thermal shock of the heat load on the refrigerator, it is necessary to perform dynamic simulation of the heat load of the cryogenic system.

[0004] For small helium refrigerators, the cooling capacity required by users is mainly in the liquid helium temperature range, and the cooling capacity is relatively small. Therefore, it is only necessary to place a heater model with a cooling capacity equivalent to the set cooling capacity in the liquid helium dewar, or to place a heater model at the end of the refrigerator to simulate the heat load of the low-temperature system.

[0005] However, for large-scale superfluid helium cryogenic systems, users require a wide range of operating temperature ranges, generally including heat loads in the 2K / 4K temperature range, the 4.5-75K temperature range, and the 50-75K temperature range. Generally speaking, the 2K / 4K temperature range heat load primarily refers to the pre-cooling, operating, quenching, and other non-steady-state conditions of components such as superconducting cavities, superconducting magnets, and superconducting solenoids within the refrigerator load. The 4.5-75K temperature range heat load primarily refers to the pre-cooling, operating, quenching, and other non-steady-state conditions of components such as couplers within the refrigerator load within the corresponding temperature range. The 50-75K temperature range heat load primarily refers to the various operating conditions of components such as cold shields and current leads within the refrigerator load.

[0006] Dynamic simulation of the cryogenic system's thermal load can simulate dynamic thermal loads under different operating modes and varying conditions, reducing thermal shock to the refrigerator and providing key guidance for the design of the refrigerator and cryogenic distribution system. To accurately simulate the cryogenic system's thermal load under actual operating conditions, dynamic simulation of the cryogenic system's thermal load requires both separate and simultaneous loading of each temperature zone to ensure the versatility of the cryogenic system's thermal load simulation model.

[0007] The OTS (Operation Training System) combines dynamic simulation and measurement and control system development technologies to develop a front-end user operation interface, which facilitates understanding of the characteristics of the entire system and operation training for staff before the system is put into operation.

[0008] Developing and utilizing an operator training system to train operators can prevent actual equipment from being put in dangerous situations. The operator training system can be run under certain special operating conditions without fear of serious consequences. Operators cannot distinguish whether they are facing a real system or a simulated one when viewing the HMI. Summary of the Invention

[0009] The embodiment of the present invention provides a semi-hardware dynamic simulation platform for cryogenic system thermal load and a data interaction method thereof, so as to at least solve the technical problem that the existing cryogenic system thermal load simulation has poor effect on the real signal environment on site.

[0010] According to one embodiment of the present invention, a semi-hardware dynamic simulation platform for thermal load of a cryogenic system is provided, comprising a simulation model and a control system model; wherein:

[0011] The simulation model is used to understand the thermodynamic performance of the cryogenic system heat load in advance, simulate the dynamic heat load of the cryogenic system heat load, and pre-verify the control program;

[0012] The control system model is the main body of the control logic;

[0013] The semi-hardware dynamic simulation platform is used to debug the main control logic of the cryogenic system thermal load and to estimate the performance of the cryogenic system thermal load under different working modes.

[0014] Furthermore, the semi-hardware dynamic simulation platform is also used to provide a reference for the actual operation adjustment of the low-temperature system heat load and to train operators.

[0015] Furthermore, when establishing a simulation model of the low-temperature system heat load, a component model of the low-temperature system heat load is developed as needed; and a current lead model is user-defined and developed.

[0016] Furthermore, a simulation model of the low-temperature system heat load is established based on the dynamic simulation software EcosimPro and compiled.

[0017] Furthermore, when establishing a simulation model of the thermal load of the low-temperature system, the internal variables simulation time time and error information error are respectively encapsulated into usable components; the internal variable simulation time time is encapsulated into a simulation time component; the internal variable error information error is encapsulated into an error information component; the simulation time component outputs the system's simulation time value, the variable type is real, and the analog output; the error information component outputs the system's error information value, the variable type is real, and the analog output.

[0018] Furthermore, the simulation time component and the error information component are placed in the same screen as the main loop model of the low-temperature system heat load simulation model.

[0019] Furthermore, after the simulation model is compiled, a partition is generated. After the partition is successfully validated, a special experiment needs to be established, and the EL language code needs to be written into the experiment; the experiment is compiled and run.

[0020] Furthermore, a deck platform is generated based on the EL experiment code: first, the input and output variables are defined. The input variables are the variables controlled by the third-party software, and the output variables are the various process values ​​calculated by the simulation model; among them:

[0021] The input variables are: the start signal of each heat load, the heating power of each heat load, the PID automatic start of each heat load, the high-pressure side inflow temperature, high-pressure side inflow pressure, high-pressure side inflow flow, low-pressure side return flow temperature, low-pressure side return flow pressure, low-pressure side return flow, heat load regulating valve signal, heat load switch valve signal; the high-pressure side inflow temperature, high-pressure side inflow pressure, and high-pressure side inflow flow are two out of three, and the low-pressure side return flow temperature, low-pressure side return pressure, and low-pressure side return flow are two out of three;

[0022] The output variables are: simulation time time, error information error, temperature before and after each heat load, pressure before and after each heat load, flow before and after each heat load, heating power of each heat load, opening of heat load regulating valve, inlet and outlet temperature of regulating valve, inlet and outlet pressure of regulating valve, inlet and outlet flow of regulating valve, opening of heat load switch valve, inlet and outlet temperature of switch valve, inlet and outlet pressure of switch valve, inlet and outlet flow of switch valve; among them, error information error is an optional variable and is optional when it exists.

[0023] According to another embodiment of the present invention, a data interaction method using the semi-hardware dynamic simulation platform of the cryogenic system thermal load is provided, comprising:

[0024] Use the deck platform to encapsulate the simulation model into an fmu file and select the fmu file type that interacts with third-party software;

[0025] After the simulation model is packaged into an fmu file, it is placed in the NI simulator. The generated fmu file is deployed using third-party laboratory management software. After successful deployment, standard electrical signals are generated and input and output through the NI hardware board.

[0026] The standard electrical signals include but are not limited to: 0-20mA current signal, 4-20mA current signal, 0-10V voltage signal, -10V-+10V voltage signal, 0-5V voltage signal, 1-5V voltage signal;

[0027] The control system based on the actual PLC uses direct I / O connection and hard wiring to connect to the NI hardware board to collect the standard electrical signals output by the NI hardware board. At the same time, by setting the input parameter values ​​on the human-machine interface of the control system host computer, various commands and parameters are output to the simulation model.

[0028] The simulation model packaged as an fmu file runs on the NI simulator. At the same time, third-party laboratory management software is used on the NI simulator to monitor the running status of the dynamic simulation model. On the Veristand workspace interface, the control variable Model Command is used to control the start, pause, and stop of the simulation model.

[0029] In a control system based on an actual PLC, the human-machine interface runs on a host workstation / PC. Through the human-machine interface on the host computer, commands are sent to control the simulation model, and various process parameters of the simulation model are monitored at the same time. The actual PLC collects standard electrical signals, and the control program written based on the actual PLC has the same hardware addresses of the input and output variables as those in the control program of the control system under the real field signal environment, simulating the real field signal environment to the greatest extent.

[0030] According to another embodiment of the present invention, a data interaction method using the semi-hardware dynamic simulation platform of the cryogenic system thermal load is provided, comprising:

[0031] Using the deck platform, the simulation model is encapsulated into an FMU file that runs under the Linux operating system, and the FMU file type that interacts with third-party software is selected;

[0032] After the simulation model is packaged into an fmu file running under the Linux operating system, the fmu file is deployed to the slave computer using third-party laboratory management software on the host PC. After successful deployment, standard electrical signals are generated and input and output through the NI hardware board.

[0033] Standard electrical signals include but are not limited to: 0-20mA current signal, 4-20mA current signal, 0-10V voltage signal, -10V-+10V voltage signal, 0-5V voltage signal, 1-5V voltage signal;

[0034] The control system based on the actual PLC uses direct I / O connection and hard wiring to connect to the NI hardware board to collect the standard electrical signals output by the NI hardware board. At the same time, by setting the input parameter values ​​on the human-machine interface of the control system host computer, various commands and parameters are output to the simulation model.

[0035] The simulation model, packaged as an fmu file, is deployed to the NI simulator using third-party laboratory management software on the host PC. At the same time, the third-party laboratory management software is used on the host PC to monitor the running status of the dynamic simulation model. On the Veristand workspace interface, the control variable Model Command is used to control the start, pause, and stop of the simulation model.

[0036] In a control system based on an actual PLC, the human-machine interface runs on another upper workstation / PC. Through the human-machine interface on the other upper computer, commands are sent to control the simulation model, and various process parameters of the simulation model are monitored at the same time. The actual PLC collects standard electrical signals, and the control program written based on the actual PLC has the same hardware addresses of the input and output variables as those in the control program of the control system under the real field signal environment, simulating the real field signal environment to the greatest extent.

[0037] The semi-hardware dynamic simulation platform for cryogenic system thermal loads and its data interaction method in an embodiment of the present invention include a simulation model of the cryogenic system thermal load, a control system model of the cryogenic system thermal load, and a method for data interaction between the simulation model and the control system model. This semi-hardware dynamic simulation platform for cryogenic system thermal loads can provide advance understanding of the thermodynamic properties of the cryogenic system thermal load, simulate the dynamic thermal load of the cryogenic system thermal load, perform control program pre-verification, debug the main control logic of the cryogenic system thermal load, and perform performance estimation of the cryogenic system thermal load under different operating modes. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0039] Figure 1 A schematic flow chart of a semi-hardware dynamic simulation platform for thermal loads of a cryogenic system in one embodiment;

[0040] Figure 2 It is a technical architecture diagram of a semi-hardware dynamic simulation platform for thermal loads of a cryogenic system applicable to one embodiment;

[0041] Figure 3 is a block diagram of a cryogenic system heat load suitable for one embodiment;

[0042] Figure 4 This is a technical architecture diagram of a semi-hardware dynamic simulation platform for low-temperature system thermal loads in a first embodiment;

[0043] Figure 5 It is a flow chart of a semi-hardware dynamic simulation platform for thermal load of a cryogenic system according to a second embodiment;

[0044] Figure 6 This is a technical architecture diagram of a semi-hardware dynamic simulation platform for low-temperature system thermal loads in the second embodiment. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0046] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0047] The present invention discloses a semi-hardware dynamic simulation platform for the thermal load of a cryogenic system and a data interaction method thereof, including a simulation model of the thermal load of a cryogenic system, a control system model of the thermal load of a cryogenic system, and a method for data interaction between the simulation model and the control system model. The semi-hardware dynamic simulation platform for the thermal load of a cryogenic system can understand the thermodynamic properties of the thermal load of a cryogenic system in advance, simulate the dynamic thermal load of the thermal load of a cryogenic system, perform control program pre-verification, debug the main control logic of the thermal load of a cryogenic system, and perform performance estimation under different working modes of the thermal load of a cryogenic system. It provides a reference basis for the actual operation and adjustment of the thermal load of a cryogenic system, and provides training for operators. This semi-hardware dynamic simulation platform uses actual PLC hardware, and can simulate the real on-site signal environment of the thermal load of a cryogenic system to the greatest extent.

[0048] The present invention adopts the following specific technical solutions:

[0049] A low-temperature system heat load. The present invention is applicable to the following low-temperature system heat loads, which are respectively described with examples.

[0050] 1. User heat load of small helium refrigerator

[0051] like Figure 3 The figure shows the user heat load of a small helium refrigerator. The cooling capacity required by users is primarily in the liquid helium temperature range, which is relatively small. Placing a heater model at the end of the refrigerator can simulate the low-temperature system heat load.

[0052] In this case, different heating modes of the heater can be simulated, such as ramp increase, step increase, sine wave, cosine wave, or step pulse increase or decrease of the heating power. You can also write source code in a programming language according to the actual situation of the user's load, encapsulate the heater model into a custom load model, and then perform dynamic simulation.

[0053] Set the boundary conditions of high-pressure inflow and low-pressure return flow to perform dynamic simulation of the low-temperature system heat load. Debug the dynamic heat load of the low-temperature system heat load.

[0054] 2. Thermal load of cryogenic systems such as superconducting cavities, superconducting magnets, superconducting solenoids, couplers, etc.

[0055] For cryogenic system thermal loads such as superconducting cavities, superconducting magnets, superconducting solenoids, and couplers, there are no readily available component models in the Cryolib library of the dynamic simulation software EcosimPro. Therefore, user-defined model development is required. After model development, model validity verification is performed.

[0056] After the component model is developed, dynamic simulation is performed based on different working modes, such as pre-cooling conditions, operating conditions, quench conditions and other non-steady-state conditions.

[0057] 3. Thermal loads of low temperature systems such as cold screens and current leads

[0058] The cold screen serves as the heat load of the low-temperature system, including the liquid nitrogen cold screen and other temperature zone cold screens. In the low-temperature component library Cryolib of the dynamic simulation software EcosimPro, an electric heater model can be selected to simulate the dynamic heat load of the cold screen.

[0059] The current lead acts as a heat load in the cryogenic system. There are no ready-made component models available in the Cryolib library of the dynamic simulation software EcosimPro, requiring user-defined development. After developing the model, the model's validity must be verified.

[0060] After the component model is developed, dynamic simulation is performed based on different working modes, such as pre-cooling conditions, operating conditions, quench conditions and other non-steady-state conditions.

[0061] A dynamic simulation model of the heat load of a cryogenic system is based on the dynamic simulation software EcosimPro. First, a simulation model of the heat load of a cryogenic system is established and compiled.

[0062] When building a simulation model for the cryogenic system's thermal load, component models for the system's thermal load must be developed as needed. For example, models for the superconducting cavity, superconducting magnet, superconducting solenoid, coupler, and other cryogenic system thermal loads, as well as current leads, require user-defined development.

[0063] Dynamic simulation of the cryogenic system's thermal load can simulate dynamic thermal loads under different operating modes and variable operating conditions, reducing thermal shock to the refrigerator and providing critical guidance for the design of the refrigerator and the cryogenic distribution system. In order to accurately simulate the working conditions of the cryogenic system's thermal load under actual operating conditions, dynamic simulation of the cryogenic system's thermal load requires separate and simultaneous loading of the loads in each temperature zone to ensure the versatility of the cryogenic system's thermal load simulation model. Optionally, when establishing a simulation model of the cryogenic system's thermal load, the internal variables simulation time and error message are encapsulated into usable components. The internal variable simulation time is encapsulated into a simulation time component. The internal variable error message error is encapsulated into an error message component. The simulation time component outputs the system's simulation time value, with a variable type of real and analog output. The error message component outputs the system's error message value, with a variable type of real and analog output.

[0064] The simulation time and error message components do not need to be connected to the main circuit of the cryogenic system heat load simulation model. Simply place the simulation time and error message components on the same screen as the main circuit model of the cryogenic system heat load simulation model. Once compiled, the program will run smoothly.

[0065] After the simulation model is compiled and partitions are generated, the partitions are successfully validated. A special experiment is created, in which EL language code is written. The experiment is compiled and run. Based on this EL experiment code, a deck is generated. First, the input and output variables are defined. Input variables are the variables to be controlled by the third-party software, while output variables are the various process values ​​calculated by the simulation model.

[0066] For the simulation of low-temperature system heat loads, the input variables are: the start signal for each heat load, the heating power of each heat load, the PID control of each heat load, the high-pressure side inlet temperature, the high-pressure side inlet pressure, and the high-pressure side inlet flow rate (two out of the three), the low-pressure side return temperature, the low-pressure side return pressure, and the low-pressure side return flow rate (two out of the three), the heat load regulating valve signal, and the heat load on / off valve signal.

[0067] Output variables include: simulation time, error message (optional, if the system has one), temperature before and after each heat load, pressure before and after each heat load, flow rate before and after each heat load, heating power of each heat load, opening of the heat load control valve, inlet and outlet temperature of the control valve, inlet and outlet pressure of the control valve, inlet and outlet flow rate of the control valve, opening of the heat load on-off valve, inlet and outlet temperature of the on-off valve, inlet and outlet pressure of the on-off valve, inlet and outlet flow rate of the on-off valve, etc.

[0068] Optionally, the time variable output by the simulation time component and the error variable output by the error information component are defined as output variables.

[0069] One implementation method, see Figure 1 、 Figure 2 、 Figure 4 ,The data interaction method of the semi-hardware dynamic simulation platform for low-temperature system thermal load includes:

[0070] Using the Deck platform, encapsulate the simulation model into an FMU file and select an FMU file type that can interact with third-party software. The generated FMU file can be deployed by third-party software and exchange data with other third-party software.

[0071] After the simulation model is packaged into an FMU file, it is placed into the NI simulator. The generated FMU file is deployed using third-party lab management software such as Veristand. Once deployed successfully, standard electrical signals are generated for input and output via the NI hardware board.

[0072] Standard electrical signals include but are not limited to: 0-20mA current signal, 4-20mA current signal, 0-10V voltage signal, -10V-+10V voltage signal, 0-5V voltage signal, and 1-5V voltage signal.

[0073] The control system based on the actual PLC uses direct I / O connections and hardwiring to connect to the NI hardware board to collect the standard electrical signals output by the NI hardware board. At the same time, various commands and parameters can be output to the simulation model by setting the input parameter values ​​on the human-machine interface of the control system's host computer. In other words, the control system based on the actual PLC collects standard electrical signals and uses the NI simulator as an intermediary to exchange data with the simulation model.

[0074] The NI simulator runs the Windows operating system, and simulation models packaged as FMU files run on the NI simulator. Third-party lab management software, such as Veristand, is used on the NI simulator to monitor the running status of the dynamic simulation model. For example, the control variable Model Command can be used in the Veristand workspace to control the start, pause, and stop of the simulation model.

[0075] In a control system based on an actual PLC, the human-machine interface runs on a host workstation / PC. Through this interface, commands can be sent to control the simulation model while simultaneously monitoring its various process parameters. The actual PLC collects standard electrical signals. Control programs written based on the actual PLC ensure that the hardware addresses of the input and output variables are identical to those in the control program for the control system under a real-world signal environment, maximizing the simulation of a real-world signal environment.

[0076] The second implementation method, see Figure 5 、 Figure 6 ,The data interaction method of the semi-hardware dynamic simulation platform of the low-temperature system thermal load includes.

[0077] Using the Deck platform, the simulation model is packaged into an FMU file that can be run under the Linux operating system. The FMU file type that can interact with third-party software is selected. The generated FMU file can be deployed by third-party software and exchange data with other third-party software.

[0078] After the simulation model is packaged into an FMU file that can run under the Linux operating system, it is deployed from the host PC (Windows) to the NI simulator (Linux) using third-party laboratory management software such as Veristand. After successful deployment, standard electrical signals are generated for input and output via NI hardware boards. Linux systems offer better real-time performance than Windows systems, so running the simulation model on the NI simulator (Linux) offers improved real-time performance, making data exchange between the simulation model and the control system faster and smoother.

[0079] Standard electrical signals include but are not limited to: 0-20mA current signal, 4-20mA current signal, 0-10V voltage signal, -10V-+10V voltage signal, 0-5V voltage signal, and 1-5V voltage signal.

[0080] The control system based on the actual PLC uses direct I / O connections and hardwiring to connect to the NI hardware board to collect the standard electrical signals output by the NI hardware board. At the same time, various commands and parameters can be output to the simulation model by setting the input parameter values ​​on the human-machine interface of the control system's host computer. In other words, the control system based on the actual PLC collects standard electrical signals and uses the NI simulator as an intermediary to exchange data with the simulation model.

[0081] The NI simulator runs the Linux operating system. Simulation models, packaged as FMU files, are deployed to the NI simulator (Linux operating system) on a host PC (Windows operating system) using third-party laboratory management software such as Veristand. Furthermore, third-party laboratory management software such as Veristand is used on the host PC (Windows operating system) to monitor the running status of the dynamic simulation model. For example, the control variable Model Command can be used in the Veristand workspace interface to control the start, pause, and stop of the simulation model.

[0082] Based on a control system based on an actual PLC, the human-machine interface runs on a separate host workstation / PC. Through this interface, commands can be sent to control the simulation model while simultaneously monitoring its various process parameters. The actual PLC collects standard electrical signals. The control program written based on the actual PLC can match the hardware addresses of the input and output variables in the control program under a real-world signal environment, maximizing the simulation of a real-world signal environment.

[0083] In the second implementation mode, the Linux operating system is run on the NI simulator, which has better real-time performance.

[0084] The present invention encapsulates a dynamic simulation model of a cryogenic system's thermal load and establishes data exchange between the model and a PLC-based control system model. This allows for dynamic simulation of the cryogenic system's thermal load, pre-verification and debugging of the control system, debugging of the main control logic, performance estimation under different operating modes, and dynamic thermal load simulation of the cryogenic system without actually building the system. This system provides a reference for actual operational adjustments of the cryogenic system's thermal load and facilitates operator training.

[0085] Hardware-in-the-loop (HIL) simulation replaces the actual controlled object or other system components with a simulation model running on a computer. The control unit or other components of the system are then connected to the simulation model to form a system, allowing the control unit's functionality to be tested. HIL simulation can reduce system development costs and shorten development cycles. Therefore, HIL is increasingly being used in various development scenarios and holds broad development prospects.

[0086] Using hardware-in-the-loop (HIL) simulation technology, a semi-hardware dynamic simulation platform for cryogenic system thermal loads was established. This platform, based on an actual PLC control system, collects standard electrical signals and interacts with the simulation model. The PLC hardware and NI boards in this semi-hardware dynamic simulation platform utilize hardwired I / O for direct connection, ensuring reliable and fast signal transmission. This advanced approach utilizes hardware-in-the-loop (HIL) technology and an actual PLC for multi-platform, multi-hardware co-simulation. The actual PLC collects standard electrical signals, simulating a real-world signal environment.

[0087] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0088] In the above embodiments of the present invention, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the system embodiments described above are only exemplary. For example, the division of units can be a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0090] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple units. Some or all of the units may be selected to achieve the purpose of the present embodiment according to actual needs.

[0091] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0092] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk, etc. Various media that can store program codes.

[0093] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A semi-hardware dynamic simulation platform for low temperature system thermal load, characterized in that: Including simulation model and control system model; among which: The simulation model is used to understand the thermodynamic performance of the cryogenic system heat load in advance, simulate the dynamic heat load of the cryogenic system heat load, and perform control program pre-verification; The control system model is the main body of the control logic; The semi-hardware dynamic simulation platform is used to debug the main control logic of the low-temperature system heat load and to perform performance estimation under different working modes of the low-temperature system heat load.

2. The semi-hardware dynamic simulation platform for low temperature system heat load according to claim 1 is characterized in that: The semi-hardware dynamic simulation platform is also used to provide a reference for the actual operation adjustment of the low-temperature system heat load and to train operators.

3. The semi-hardware dynamic simulation platform for low temperature system heat load according to claim 1 is characterized in that: When establishing a simulation model of the thermal load of a cryogenic system, a component model of the thermal load of the cryogenic system is developed as needed; and a current lead model is developed by a user according to user needs.

4. The semi-hardware dynamic simulation platform for low temperature system heat load according to claim 1 is characterized in that: Based on the dynamic simulation software EcosimPro, a simulation model of the thermal load of the low-temperature system is established and compiled.

5. The semi-hardware dynamic simulation platform for low temperature system heat load according to claim 1, characterized in that: When establishing the simulation model of the low temperature system heat load, the internal variables simulation time time and error information error are respectively encapsulated into available components; The internal variable simulation time time is encapsulated into a simulation time component; the internal variable error information error is encapsulated into an error information component; the simulation time component outputs the simulation time value of the system, the variable type is real, and the analog output; the error information component outputs the error information value of the system, the variable type is real, and the analog output.

6. The semi-hardware dynamic simulation platform for thermal load of cryogenic system according to claim 5, characterized in that: The simulation time component and the error information component are placed in the same screen as the main loop model of the low temperature system heat load simulation model.

7. The semi-hardware dynamic simulation platform for thermal load of cryogenic system according to claim 5, characterized in that: After the simulation model is compiled, a partition is generated. After the partition is successfully validated, a special experiment needs to be established and the EL language code needs to be written in the experiment. Compile and run the experiment.

8. The semi-hardware dynamic simulation platform for thermal load of cryogenic system according to claim 7, characterized in that: Generate a deck platform based on ELexperiment code: First, define input and output variables. Input variables are variables controlled by third-party software, and output variables are various process values ​​calculated by the simulation model; among them: The input variables are: the start signal of each heat load, the heating power of each heat load, the PID automatic start of each heat load, the high-pressure side inflow temperature, the high-pressure side inflow pressure, the high-pressure side inflow flow rate, the low-pressure side return flow temperature, the low-pressure side return flow pressure, the low-pressure side return flow rate, the heat load regulating valve signal, the heat load switch valve signal; the high-pressure side inflow temperature, the high-pressure side inflow pressure, the high-pressure side inflow flow rate are two out of three, the low-pressure side return flow temperature, the low-pressure side return flow pressure, the low-pressure side return flow rate are two out of three; The output variables are: simulation time time, error information error, temperature before and after each heat load, pressure before and after each heat load, flow rate before and after each heat load, heating power of each heat load, opening of heat load regulating valve, inlet and outlet temperature of regulating valve, inlet and outlet pressure of regulating valve, inlet and outlet flow rate of regulating valve, opening of heat load switch valve, inlet and outlet temperature of switch valve, inlet and outlet pressure of switch valve, inlet and outlet flow rate of switch valve; among them, error information error is an optional variable and is optional when it exists.

9. A data interaction method using the semi-hardware dynamic simulation platform of the low temperature system heat load according to claim 1, characterized in that: include: Using the deck platform, encapsulate the simulation model into an fmu file and select the fmu file type that interacts with third-party software; After the simulation model is packaged into an fmu file, it is placed in the NI simulator. The generated fmu file is deployed using third-party laboratory management software. After successful deployment, a standard electrical signal is generated and input and output through the NI hardware board. The standard electrical signals include but are not limited to: 0-20mA current signal, 4-20mA current signal, 0-10V voltage signal, -10V-+10V voltage signal, 0-5V voltage signal, 1-5V voltage signal; Based on the actual PLC control system, the I / O is directly connected and hard-wired to the NI hardware board to collect the standard electrical signals output by the NI hardware board. At the same time, various commands and parameters are output to the simulation model by setting the values ​​of the input parameters on the human-machine interface of the control system host computer; The simulation model packaged into fmu file runs on the NI simulator, and the third-party laboratory management software is used on the NI simulator to monitor the running status of the dynamic simulation model; on the workspace interface of Veristand, the control variable Model Command is used to control the start, pause and stop of the simulation model; Based on the actual PLC control system, the human-machine interface runs on the upper workstation / PC. Through the human-machine interface on the upper computer, commands are sent to control the simulation model, and various process parameters of the simulation model are monitored at the same time; The actual PLC collects standard electrical signals. Based on the control program written based on the actual PLC, the hardware addresses of the input and output variables are the same as the hardware addresses of the input and output variables in the control program of the control system under the real field signal environment, simulating the real field signal environment to the greatest extent.

10. A data interaction method using the semi-hardware dynamic simulation platform of the low temperature system heat load according to claim 1, characterized in that: include: Using the deck platform, the simulation model is packaged into an fmu file that runs under the Linux operating system, and the fmu file type that interacts with third-party software is selected; After the simulation model is packaged into an fmu file running under the Linux operating system, the fmu file is deployed to the lower computer using a third-party laboratory management software in the upper PC. After successful deployment, a standard electrical signal is generated and input and output are performed through the NI hardware board. Standard electrical signals include but are not limited to: 0-20mA current signal, 4-20mA current signal, 0-10V voltage signal, -10V-+10V voltage signal, 0-5V voltage signal, 1-5V voltage signal; Based on the actual PLC control system, the I / O is directly connected and hard-wired to the NI hardware board to collect the standard electrical signals output by the NI hardware board. At the same time, various commands and parameters are output to the simulation model by setting the values ​​of the input parameters on the human-machine interface of the control system host computer; The simulation model packaged into fmu file is deployed to the NI simulator using third-party laboratory management software on the host PC. At the same time, the third-party laboratory management software is used on the host PC to monitor the running status of the dynamic simulation model. On the workspace interface of Veristand, the control variable Model Command is used to control the start, pause and stop of the simulation model. Based on the actual PLC control system, the human-machine interface runs on another upper workstation / PC. Through the human-machine interface on another upper computer, commands are sent to control the simulation model, and various process parameters of the simulation model are monitored at the same time; The actual PLC collects standard electrical signals. Based on the control program written based on the actual PLC, the hardware addresses of the input and output variables are the same as the hardware addresses of the input and output variables in the control program of the control system under the real field signal environment, simulating the real field signal environment to the greatest extent.

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