Immersed self-circulation jet liquid cooling system for blade server

Abstract

The invention discloses an immersed self-circulation jet liquid cooling system for a blade server. According to the immersed self-circulation jet liquid cooling system, refrigerants of high and low heating power devices in the server can be distributed according to needs, the utilization efficiency of the refrigerants is improved, the flow of the refrigerants in the server is reduced, and the power consumption of a pump for driving the refrigerants to flow is reduced. Besides, compared with a traditional immersion liquid cooling technology, a cooling circulation system outside the server is not limited by the electrical performance of a refrigerant, so that the selection range of the refrigerant is expanded, the refrigerant with better heat carrying and exchanging capacity and lower price can be used for replacement, the refrigerant with relatively high price is only limited to be used in the server, and the cost is reduced. Therefore, the use cost of the immersion liquid cooling technology on the server is greatly reduced. The system has great advantages in the aspects of energy efficiency, reliability and cost.

Description

Technical Field

[0001] The invention belongs to the technical field of server immersion liquid cooling, and in particular relates to an immersion self-circulating jet liquid cooling system for a blade server. Background Art

[0002] With the rapid development of server performance, its own heat generation power is also increasing, especially the heat flux density of the internal CPU and GPU is constantly challenging the limits of traditional cooling technology. At present, liquid cooling technology has gradually become the mainstream cooling technology in data centers. Among them, immersion liquid cooling technology refers to immersing the entire server in a coolant with electrical insulation properties, and taking away heat from electronic components through the circulation of the coolant, thereby achieving efficient thermal management of the server.

[0003] However, traditional immersion liquid cooling technology lacks targeted measures for high and low power heat sources in servers, faces disadvantages such as poor heat carrying and heat exchange capacity of the coolant, high price, and large amount of coolant consumption, resulting in high application costs, which seriously limits its widespread application in the industry. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide an immersion self-circulating jet liquid cooling system for blade servers, which can significantly reduce the cost of using server immersion liquid cooling technology by fixed-point cooling of high and low power heat sources in the server and using a refrigerant with better heat carrying and heat exchange capacity and lower price on the outside of the server.

[0005] The purpose of the present invention is achieved through the following technical solutions:

[0006] An immersion self-circulating jet liquid cooling system for a blade server comprises a server, a refrigerant circulation system and a heat exchange device; the server comprises a shell having an inner cavity, the inner cavity being used to fill the refrigerant, and the inner cavity being used to arrange electronic devices; the refrigerant circulation system comprises a micro pump and a plurality of jet injection devices, the outlet of the micro pump being connected to the plurality of jet injection devices respectively through a pipeline, and the outlets of the plurality of jet injection devices are all oriented toward the electronic devices; the heat exchange device comprises a heat exchange fin and a heat exchange copper tube, the heat exchange fin being arranged in the inner cavity, the heat exchange fin dividing the inner cavity into a cooling area and an installation area, the electronic devices being arranged in the installation area, the micro pump and the inlet of the micro pump being arranged in the cooling area, the heat exchange copper tube penetrating the heat exchange fin, and both ends of the heat exchange copper tube being connected to the outside of the server.

[0007] Furthermore, the refrigerant circulation system also includes a plurality of solenoid valves, which respectively correspond to the plurality of jet injection devices. The solenoid valves are arranged at the inlets of the jet injection devices, and the outlets of the micro pumps are connected to the plurality of solenoid valves through pipelines.

[0008] Furthermore, the electronic device includes a chip, a PCB circuit board, a memory, a hard disk, a network card and a power supply. The chip and the memory are multiple, and an array of several chips is arranged in the installation area, and several memories correspond to several chips respectively.

[0009] Furthermore, the jet injection device includes a pressure chamber and a plurality of nozzles, the outlet of the micro pump is connected to the pressure chamber of the injection device through a pipeline, the plurality of nozzles are arranged on the bottom surface of the pressure chamber, the nozzles are connected to the pressure chamber, and the nozzles are facing the chip of the server.

[0010] Furthermore, the plurality of nozzles are evenly distributed on the bottom surface of the pressure chamber, and the downward projection points of the plurality of nozzles of the injection device are evenly distributed on the chip, so that the injection areas of the plurality of nozzles of the injection device can evenly cover the chip surface.

[0011] Furthermore, the outlet of the micro pump is connected to a refrigerant delivery main pipe, and the refrigerant delivery main pipe extends away from the end of the micro pump to one side of several of the chips. The outer peripheral surface of the refrigerant delivery main pipe is connected to several refrigerant branch pipes corresponding to several of the chips, and the refrigerant branch pipes are connected to corresponding jet injection devices.

[0012] Furthermore, the heat exchange fins are in close contact with the inner wall surfaces around the inner cavity of the shell of the server.

[0013] Furthermore, the heat exchange fin is provided with a through hole, and the refrigerant transport main pipe passes through the through hole.

[0014] The present invention has the following beneficial effects:

[0015] The present invention can realize the on-demand distribution of refrigerants for high and low heat-generating power devices (electronic devices) in the server, so as to improve the utilization efficiency of the refrigerant, reduce the refrigerant flow in the server, and reduce the pump power consumption of driving the refrigerant flow. In addition, for the cooling circulation system outside the server, compared with the traditional immersion liquid cooling technology, the present invention will not be limited by the electrical properties of the refrigerant, so the selection range of the refrigerant is expanded, and it can be replaced by a refrigerant with better heat carrying and heat exchange capacity and lower price, while the relatively expensive refrigerant (fluorinated liquid, thermal oil, etc.) is limited to use in the server, thereby greatly reducing the use cost of immersion liquid cooling technology on the server, so the present invention has great advantages in energy efficiency, reliability, and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a schematic diagram of the internal structure of the server (additional cooling system) of the present invention after the cover plate is removed.

[0017] Figure 2 It is a schematic structural diagram of the refrigerant circulation system and heat exchange device of the present invention.

[0018] Figure 3 It is a transport pipeline diagram of the refrigerant circulation system of the present invention.

[0019] Figure 4 The figure is a schematic diagram of heat exchange partitioning of the cooling area and the installation area inside the server of the present invention.

[0020] Figure 5 It is a schematic structural diagram of the heat exchange device in the server of the present invention.

[0021] Figure 6 It is a schematic structural diagram of the jet injection device of the present invention.

[0022] In the figure:

[0023] 1. Server; 11. Chip; 12. PCB circuit board; 13. Memory; 14. Hard disk; 15. Network card; 16. Power supply;

[0024] 2. Refrigerant circulation system; 21. Micro pump; 22. Refrigerant inlet pipe; 23. Refrigerant delivery main pipe; 24. Refrigerant branch pipe; 25. Solenoid valve; 26. Jet injection device; 261. Pressure chamber; 262. Bottom surface of pressure chamber; 263. Nozzle; 264. Side wall surface of pressure chamber.

[0025] 3. heat exchange device; 31. heat exchange fin; 311. through hole; 32. heat exchange copper tube; 321. inlet tube; 322. outlet tube;

[0026] A. Installation area; B. Cooling area. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The terms such as "upper", "inner", "middle", "left", "right" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the present invention. The change or adjustment of their relative relationship shall also be regarded as the scope of the present invention without substantially changing the technical content.

[0028] The immersion type self-circulating jet liquid cooling system of the present invention is mainly used for blade servers 1, and cools the internal heat source of the blade servers 1 in a targeted manner to reduce the amount of refrigerant, thereby reducing the use cost of the immersion liquid cooling technology of the server 1. The following is a detailed introduction to an immersion type self-circulating jet liquid cooling system for blade servers 1 of the present invention.

[0029] An immersion self-circulating jet liquid cooling system for a blade server, such as Figures 1 to 5 As shown, it includes a server 1, a refrigerant circulation system 2, and a heat exchange device 3;

[0030] The server 1 includes a shell, which adopts a closed cavity structure. The shell has an inner cavity, and the inner cavity is used to fill with refrigerant, including but not limited to fluorinated liquid, thermal oil, etc. The refrigerant is used to cool the inner cavity as a whole. The inner cavity is used to set electronic devices, and the electronic devices include chips 11, PCB circuit boards 12, memory 13, hard disk 14, network card 15, power supply 16 and other heating devices. There are multiple chips 11 and memory 13, and several chips 11 are arrayed in the installation area A. Several memories 13 correspond to several chips 11 respectively. Among them, the refrigerant filled in the inner cavity will immerse the electronic devices of the heating devices to cool the heating electronic devices.

[0031] The refrigerant circulation system 2 includes a micro pump 21 and a plurality of jet injection devices 26. The outlets of the micro pump 21 are connected to the plurality of jet injection devices 26 through pipes. The outlets of the plurality of jet injection devices 26 are all directed toward electronic devices, and the plurality of jet injection devices 26 correspond to a plurality of memories 13, respectively, so as to preferentially cool down the chip 11 more quickly and continuously to protect the chip 11.

[0032] The heat exchange device 3 includes a heat exchange fin 31 and a heat exchange copper tube 32. The heat exchange fin 31 is arranged in the inner cavity. The heat exchange fin 31 divides the inner cavity into a cooling area B and an installation area A (such as Figure 4 As shown), the electronic device is arranged in the installation area A, the inlet of the micro pump 21 is connected to the refrigerant inlet pipe 22, the refrigerant inlet pipe 22 extends to the cooling area B, the heat exchange pipe passes through the heat exchange fin 31, both ends of the heat exchange copper tube 32 are connected to the outside of the server 1, one end of the heat exchange copper tube 32 is the inlet pipe 321, and the other end is the outlet pipe 322. The heat exchange copper tube 32 is introduced into the coolant through the external circulation system. Compared with the refrigerant, the coolant has a larger specific heat capacity and thermal conductivity. The coolant can be water, ethylene glycol solution, etc.

[0033] Among them, the cooling area B occupies a smaller space, the installation area A occupies a larger space, and the heat exchange fins 31 are in close contact with the inner wall surfaces around the inner cavity of the server shell. Under the suction action of the micro pump 21, the cooling area B forms a low-pressure area, and its pressure is lower than that of the installation area A. Under the action of the pressure difference, the fluid flows from the installation area A through the gap between the heat exchange fins 31 into the cooling area B. During this period, the heat exchange fins 31 quickly cool down the refrigerant. The electronic device micro pump 21 extracts the cooled refrigerant in the cooling area B, transports it to the installation area A through a pipeline, first uses the jet injection device 26 to specifically cool the high-power chip 11, and then cools other low-power devices.

[0034] In this embodiment, Figures 1 to 3 As shown, in order to facilitate the control of the refrigerant flow rate of the jet injection device 26, the refrigerant circulation system 2 also includes a plurality of solenoid valves 25, the number of which is consistent with the number of the jet injection devices 26, and the plurality of solenoid valves 25 correspond to the plurality of jet injection devices 26, respectively, and the solenoid valves 25 are arranged at the inlet of the jet injection device 26, and the outlet of the micro pump 21 is connected to the plurality of solenoid valves 25 through a pipeline. Thus, the solenoid valve 25 is close to the corresponding chip 11 at the same time, and can automatically adjust the opening of the solenoid valve 25 according to the temperature of the detected chip 11, so as to adjust the refrigerant flow rate from the micro pump 21 to each jet injection device 26, so as to realize the on-demand supply of the refrigerant flow rate of each chip, thereby realizing the effect of real-time monitoring of the temperature of the chip 11.

[0035] In this embodiment, in order to connect the micro pump 21 to a number of solenoid valves 25 through a pipeline, the outlet of the micro pump 21 is connected to a refrigerant delivery pipe 23, and the refrigerant delivery pipe 23 extends away from the end of the micro pump 21 to one side of a number of chips 11. The outer peripheral surface of the refrigerant delivery pipe 23 is connected to a number of refrigerant branch pipes 24 corresponding to the number of chips 11 through pipe joints, and the ends of the refrigerant branch pipes 24 are connected to the corresponding solenoid valves 25.

[0036] In this embodiment, in order to allow the inlet and outlet pipes of the micro pump 21 to extend to the cooling area B and the installation area A respectively, and reduce the interference caused by the contact between the heat exchange fins 31 and the inner wall of the server cavity, the micro pump 21 is arranged in the cooling area B, and the heat exchange fins 31 are provided with through holes 311, through which the refrigerant delivery main pipe 23 of the micro pump 21 passes and extends to the installation area A.

[0037] In this embodiment, Figure 3 and Figure 6As shown, the jet injection device 26 is arranged opposite to the chip 11, and mainly includes a pressure chamber 261 and a plurality of nozzles 263. The pressure chamber 261 is a flat hollow cube structure. The side wall surface 264 of the pressure chamber 261 is connected to the refrigerant branch pipe 24. The bottom surface 262 of the pressure chamber 261 is opposite to the chip 11, and the shape and size of the bottom surface 262 are the same as the top surface of the chip 11, generally a square area with a side length of about 40 mm.

[0038] At the same time, several nozzles 263 are connected to the pressure chamber 261, and the nozzles 263 are all set on a bottom surface 262 of the pressure chamber 261. Multiple nozzles 263 are arranged in a certain rule on the bottom surface of the main body 261, so that the downward projection points of several nozzles 263 of the pressure chamber 261 are uniformly distributed on the chip 11 at the same time, so that the injection areas of several nozzles 263 of the pressure chamber 261 can uniformly cover the surface of the chip 11.

[0039] Among them, the inner diameter of the terminal nozzle of the nozzle 263 is generally 0.5-2.5 mm, and the distance between it and the chip 11 is generally 0.5-6 times the inner diameter of the nozzle 263. The refrigerant sprayed from the nozzle 263 performs forced convection heat exchange on the surface of the chip 11 in the form of jet impact.

[0040] The working principle of the immersion self-circulating jet liquid cooling system of the present invention is as follows: the refrigerant in the cooling zone B (also called the refrigerant gathering zone B) enters the refrigerant delivery main pipe 23 under the action of the micro pump 21, and then is distributed to each refrigerant branch pipe 24, and then flows through the solenoid valve 25 and enters the pressure chamber 262 of the jet injection device 26. Under the pressure of the refrigerant in the pressure chamber 262, the chip 11 is impact-cooled through the nozzle 263. The refrigerant after heat exchange is discharged into the rest of the installation zone A, and continues to cool the remaining heat-generating electronic devices (memory 13, hard disk 14, circuit board, network card 15, capacitor, etc.). After the refrigerant cools and exchanges heat with the electronic devices in the installation zone A, it will flow through the heat exchange device 3 for cooling and cooling, during which the heat is transferred to the coolant in the heat exchange copper tube 32. Finally, the cooled refrigerant is collected in the cooling zone B and recycled. After absorbing the heat, the coolant discharges the heat to the cold source outside the server 1.

[0041] In summary, the present invention can realize the on-demand allocation of refrigerant for high and low heat-generating power electronic devices in the server 1, so as to improve the utilization efficiency of the refrigerant, reduce the refrigerant flow in the server 1, and reduce the pump power consumption of driving the refrigerant flow. In addition, for the cooling circulation system outside the server 1, compared with the traditional immersion liquid cooling technology, the present invention will not be limited by the electrical properties of the refrigerant, so the selection range of the refrigerant is expanded, and it can be replaced by a refrigerant with better heat carrying and heat exchange capacity and lower price, while the relatively expensive refrigerant (fluorinated liquid, thermal oil, etc.) is limited to use in the server 1, thereby greatly reducing the use cost of the immersion liquid cooling technology on the server 1, so the present invention has great advantages in energy efficiency, reliability, and cost.

[0042] The implementation methods of the present invention are not limited to this. According to the above content of the present invention, using common technical knowledge and customary means in the field, without departing from the above basic technical ideas of the present invention, the present invention can also make other various forms of modification, replacement or combination, all of which fall within the scope of protection of the present invention.

Claims

1. An immersion self-circulating jet liquid cooling system for a blade server, characterized in that: include: A server, the server comprising a housing, the housing having an inner cavity, the inner cavity being used to be filled with a refrigerant, and the inner cavity being used to be used to set high-power and low-power electronic devices; A refrigerant circulation system, the refrigerant circulation system comprising a micro pump and a plurality of jet injection devices, the outlet of the micro pump being connected to the plurality of jet injection devices through pipelines, and the outlets of the plurality of jet injection devices are all directed toward high-power electronic devices; A heat exchange device, the heat exchange device comprising heat exchange fins and heat exchange copper tubes, the heat exchange fins being arranged in the inner cavity of the server, the heat exchange fins dividing the inner cavity into a cooling area and an installation area, the electronic components being arranged in the installation area, the micro pump and the inlet of the micro pump being placed in the cooling area, the heat exchange copper tubes penetrating the heat exchange fins, and both ends of the heat exchange copper tubes being connected to the outside of the server.

2. The immersion self-circulating jet liquid cooling system for a blade server according to claim 1, characterized in that: The refrigerant circulation system also includes a plurality of solenoid valves, which correspond to the plurality of jet injection devices respectively. The solenoid valves are arranged at the inlets of the jet injection devices, and the outlets of the micro pumps are connected to the plurality of solenoid valves through pipelines.

3. The immersion self-circulating jet liquid cooling system for a blade server according to claim 2, characterized in that: The electronic device includes a chip, a PCB circuit board, a memory, a hard disk, a network card and a power supply. There are multiple chips and multiple memories. An array of several chips is arranged in the installation area, and several memories correspond to several chips respectively.

4. The immersed self-circulating jet liquid cooling system for a blade server according to claim 3, characterized in that: The jet injection device includes a pressure chamber and a plurality of nozzles. The outlet of the micro pump is connected to the pressure chamber of the injection device through a pipeline. The plurality of nozzles are arranged on the bottom surface of the pressure chamber. The nozzles are connected to the pressure chamber and face the chip of the server.

5. The immersed self-circulating jet liquid cooling system for a blade server according to claim 4, characterized in that: The plurality of nozzles are evenly distributed on the bottom surface of the pressure chamber, and the downward projection points of the plurality of nozzles of the injection device are evenly distributed on the chip, so that the injection areas of the plurality of nozzles of the injection device can evenly cover the chip surface.

6. The immersed self-circulating jet liquid cooling system for a blade server according to claim 3, characterized in that: The outlet of the micro pump is connected to a refrigerant delivery main pipe, which extends away from the end of the micro pump to one side of several of the chips. The outer circumference of the refrigerant delivery main pipe is connected to several refrigerant branch pipes corresponding to several of the chips, and the refrigerant branch pipes are connected to corresponding jet injection devices.

7. The immersed self-circulating jet liquid cooling system for a blade server according to claim 6, characterized in that: The heat exchange fins are in close contact with the inner wall surfaces around the inner cavity of the shell of the server.

8. The immersed self-circulating jet liquid cooling system for a blade server according to claim 7, characterized in that: The heat exchange fin is provided with a through hole, and the refrigerant transport main pipe passes through the through hole.

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