A control method, system and storage medium for electrical circuit auxiliary design

Abstract

The present invention relates to the field of electrical engineering technology, and specifically to a control method, system and storage medium for auxiliary design of electrical circuits, the method comprising the following steps: according to the application environment of the electrical circuit, collecting thermal management and signal integrity requirements, setting basic performance parameters of the electrical circuit, identifying the operating temperature range, heat dissipation speed and signal transmission rate, and generating a list of circuit requirement parameters. The present invention, through parametric design technology, not only allows flexible definition of the three-dimensional spatial geometry of the electrical circuit, but also can finely adjust the surface parameters through real-time measurement values, optimize the efficiency of heat dissipation and signal transmission paths, this optimization process effectively avoids electromagnetic interference problems, improves overall stability and energy efficiency, and further verifies the effectiveness and working stability of the design through comprehensive performance testing of circuit board prototypes, ensuring high-performance and high-reliability circuit design output.

Description

Technical Field

[0001] The present invention relates to the field of electrical engineering technology, and in particular to a control method, system and storage medium for auxiliary design of electrical circuits. Background Art

[0002] The field of electrical engineering technology covers a wide range of electrical equipment design, development, testing, and monitoring, including power generation, transmission, and distribution technologies, as well as the design and application of motors, transformers, and circuits. The field uses modern computing techniques, such as computer-aided design (CAD) systems, to improve the accuracy and efficiency of designs, reduce errors, and optimize system performance. Electrical engineering also focuses on the integration of electronic devices and the automation of power systems, increasingly relying on intelligent algorithms to enhance operational stability and energy efficiency.

[0003] Among them, the control method used for electrical circuit auxiliary design refers to the process of assisting electrical engineers in designing and verifying circuit designs through computer systems, relying on software tools to simulate the behavior of electrical components and circuits and verify whether the circuit functions meet the predetermined specifications. The main uses include simplifying the circuit design process, improving design quality, reducing human errors, and accelerating the process from concept to actual production. It has important applications in electrical equipment manufacturing, consumer electronics, automotive electronics, and fields that require precise circuit design.

[0004] In actual operation, existing technologies are limited by insufficient consideration of thermal management and signal integrity, resulting in unstable performance or failure of electrical equipment when operating under high load or extreme environments. Inflexible design tools and methods limit the optimization of circuit geometry and spatial layout, making it difficult for circuit design to effectively deal with complex electromagnetic interference and heat dissipation issues while maintaining design simplicity. The testing and verification processes in existing technologies are not comprehensive enough to fully simulate circuit behavior under all operating conditions. This limitation results in the failure to fully verify circuit boards before mass production, increasing the risk and cost of products after they are launched. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a control method, system and storage medium for auxiliary design of electrical circuits.

[0006] In order to achieve the above object, the present invention adopts the following technical solution, and the method comprises the following steps:

[0007] S1: According to the application environment of the electrical circuit, collect thermal management and signal integrity requirements, set the basic performance parameters of the electrical circuit, identify the operating temperature range, heat dissipation speed and signal transmission rate, and generate a list of circuit requirement parameters;

[0008] S2: Based on the circuit requirement parameter list, using parametric design technology, defining the three-dimensional spatial geometry of the electrical circuit, and constructing an initialization geometric model by selecting matching surface types and sizes;

[0009] S3: According to the dimensions and design requirements of the initialized geometric model, the curvature and torsion are measured to optimize the efficiency of heat dissipation and signal transmission paths, and the surface parameters are adjusted using real-time measurement values ​​to obtain an optimized surface model;

[0010] S4: using the optimized surface model to control the auxiliary design of the electrical circuit, optimize the spatial position of the circuit components, adjust the length and position of the wiring to avoid electromagnetic interference, and obtain the circuit layout plan through the on-site layout analysis of the optimal position of the components and wiring;

[0011] S5: Produce a circuit board prototype according to the circuit layout scheme, perform performance testing, including thermal performance and signal integrity testing, verify the real-time performance and working stability of the design based on the test data, and obtain control effect test results.

[0012] As a further solution of the present invention, the circuit requirement parameter list includes operating temperature range, heat dissipation speed, and signal transmission rate; the initialized geometric model includes the selected surface type, size, and corresponding geometric parameters; the optimized surface model includes adjusted curvature, torsion, optimized heat dissipation path, and signal transmission path efficiency optimization information; the circuit layout plan includes the spatial layout, routing length, and position configuration of circuit elements; the control effect test results include thermal performance test data, signal integrity test data, real-time performance of the design, and working stability verification.

[0013] As a further solution of the present invention, according to the application environment of the electrical circuit, the thermal management and signal integrity requirements are collected, the basic performance parameters of the electrical circuit are set, the operating temperature range, the heat dissipation speed and the signal transmission rate are identified, and the steps of generating a circuit requirement parameter list are specifically as follows:

[0014] S101: Evaluate the working conditions, including temperature, humidity and electromagnetic interference, according to the application environment of the electrical circuit, determine the basic requirements of the working temperature range, heat dissipation speed and signal transmission rate, and generate an environmental parameter list;

[0015] S102: Based on the environmental parameter list, design experiments and simulation tests, quantify the operating temperature range and heat dissipation speed, perform field tests and simulations, measure key parameters, including temperature extremes and heat dissipation efficiency, and obtain performance test data;

[0016] S103: Using the performance test data, evaluating the signal transmission rate, combining the thermal management data, using circuit simulation software to adjust the circuit design, optimizing the signal integrity and heat dissipation characteristics, checking the electrical circuit matching design requirements, and obtaining a circuit requirement parameter list.

[0017] As a further solution of the present invention, based on the circuit requirement parameter list, the three-dimensional spatial geometry of the electrical circuit is defined by using parametric design technology, and the steps of constructing the initialization geometric model by selecting matching surface types and sizes are specifically as follows:

[0018] S201: using the circuit requirement parameter list, selecting parametric design software, importing circuit performance parameters, including size restrictions, component layout and heat dissipation requirements, and obtaining an initialized geometric sketch;

[0019] S202: selecting a surface type including a plane, an arc and a free-form surface according to the space and functional requirements of the circuit component through the initialized geometric sketch, calculating the spatial configuration of the circuit board component, and obtaining an optimal surface configuration scheme;

[0020] The formula for calculating the spatial configuration of the circuit board assembly is: ;

[0021] Where S represents the selected surface configuration score, Represents the maximum length required for the component, Represents the maximum width required by the component. Represents the reserved height of the circuit board. Represents the real-time height of the component. is the degree of high matching between the component and the circuit board, is the weight coefficient for surface type selection;

[0022] S203: According to the optimal surface configuration scheme, the connection points, the wire paths and the heat dissipation structure are adjusted to optimize the assembly efficiency and the heat dissipation performance, and an initialization geometric model is constructed.

[0023] As a further solution of the present invention, according to the dimensions and design requirements of the initialized geometric model, the curvature and torsion are measured, the efficiency of the heat dissipation and signal transmission path is optimized, and the surface parameters are adjusted using the real-time measurement values ​​to obtain the optimized surface model. Specifically, the steps are as follows:

[0024] S301: Based on the initialized geometric model, record the initial values ​​of curvature and torsion, analyze the influence of the initial values ​​on heat dissipation efficiency and signal transmission path, calculate the surface performance index value, and generate the surface performance analysis result;

[0025] S302: using the surface performance analysis result, adjusting the geometric parameters of the key surfaces, optimizing the heat dissipation and signal transmission efficiency of the circuit by modifying the curvature and torsion, and performing multiple iteration tests to match the expected performance to obtain an adjusted geometric model;

[0026] S303: Using the adjusted geometric model, verify the effect of the surface parameters, check the influence and effect of the adjustment on the overall performance of the model, including heat dissipation and signal integrity, and obtain an optimized surface model.

[0027] As a further solution of the present invention, the formula for calculating the surface performance index value is:

[0028] ;

[0029] Where P is the performance index value, Represents the weight parameter between curvature and heat dissipation efficiency, Represents the measured value of curvature, reflecting the curvature of the geometric model. Represents the adjustment coefficient of the torsion rate on signal transmission, represents the absolute value of the torsion rate, Represents the area on the surface.

[0030] As a further solution of the present invention, the optimized surface model is used to control the auxiliary design of the electrical circuit, optimize the spatial position of the circuit components, adjust the length and position of the routing to avoid electromagnetic interference, and obtain the circuit layout solution through the optimal position of the actual layout analysis components and routing. Specifically, the steps are as follows:

[0031] S401: spatially positioning circuit components through the optimized surface model, arranging component positions according to the spatial characteristics and heat dissipation requirements of the optimized surface model, performing routing design, and generating a draft of component initialization layout;

[0032] S402: Initializing a layout draft using the components, adjusting the routing length and path to avoid the influence of electromagnetic interference, and performing simulation to verify signal integrity to obtain an adjusted routing configuration;

[0033] S403: Using the adjusted routing configuration, perform field layout analysis, use space simulation and electrical performance testing to verify the layout effects of components and routing, iteratively optimize the layout, and form a circuit layout solution.

[0034] As a further solution of the present invention, a circuit board prototype is manufactured according to the circuit layout scheme, and performance tests are performed, including thermal performance and signal integrity tests. According to the test data, the real-time performance and working stability of the design are verified, and the steps of obtaining the control effect test results are specifically as follows:

[0035] S501: manufacturing a circuit board prototype through the circuit layout scheme, and checking the consistency between the prototype and the design through a standardized circuit board manufacturing process to obtain a circuit board prototype;

[0036] S502: Performing performance testing on the circuit board prototype, including thermal performance testing and signal integrity testing, using a thermal imager and a signal analyzer to measure key parameters, evaluate heat dissipation efficiency and signal transmission speed, and obtain performance test data;

[0037] S503: Using the performance test data, verify the design and function of the circuit board prototype, adjust parameters to optimize work efficiency and stability, verify the matching degree between the circuit board prototype and the design specifications and performance requirements, and obtain control effect test results.

[0038] A control system for electrical circuit auxiliary design is used to execute a control method for electrical circuit auxiliary design, the system comprising:

[0039] The demand analysis module measures the operating temperature range, heat dissipation speed and signal transmission rate according to the application environment of the electrical circuit to obtain a list of demand parameters;

[0040] The geometric modeling module selects matching surface types and sizes based on the required parameter list, establishes three-dimensional spatial geometric shapes, and constructs an initial geometric model;

[0041] The path optimization module measures the dimensions of the initialized geometric model, calculates the curvature and torsion, adjusts the surface parameters, optimizes the efficiency of the heat dissipation and signal transmission paths, and obtains an optimized surface model;

[0042] The circuit layout adjustment module uses the optimized surface model to analyze the electromagnetic interference of components and routing, optimize the spatial position of circuit components and routing length, and generate a circuit layout solution;

[0043] The prototype testing module manufactures a circuit board prototype according to the circuit layout scheme, performs thermal performance and signal integrity tests, and obtains performance test data;

[0044] The performance verification module evaluates the effectiveness and working stability of the design based on the performance test data, verifies the matching degree between the circuit board prototype and the design specifications and performance requirements, and obtains the control effect test results.

[0045] A storage medium stores a computer program, which, when executed by a processor, implements the steps of a control method for auxiliary design of electrical circuits as described above.

[0046] Compared with the prior art, the advantages and positive effects of the present invention are:

[0047] In the present invention, by collecting the thermal management and signal integrity requirements of the electrical circuit and setting basic performance parameters such as operating temperature range, heat dissipation speed and signal transmission rate, the circuit requirements can be accurately defined for specific applications. The reliability and efficiency of the design are significantly improved to ensure that the circuit design meets precise operating standards and performance requirements. The use of parametric design technology not only allows the three-dimensional spatial geometry of the electrical circuit to be flexibly defined, but also allows the surface parameters to be finely adjusted through real-time measurement values ​​to optimize the efficiency of heat dissipation and signal transmission paths. This optimization process effectively avoids electromagnetic interference problems and improves overall stability and energy efficiency. Through comprehensive performance testing of the circuit board prototype, the effectiveness and working stability of the design are further verified to ensure high-performance and high-reliability circuit design output. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is a schematic diagram of the workflow of the present invention;

[0049] Figure 2 This is a detailed flow chart of S1 of the present invention;

[0050] Figure 3 This is a detailed flow chart of S2 of the present invention;

[0051] Figure 4 This is a detailed flow chart of S3 of the present invention;

[0052] Figure 5 This is a detailed flow chart of S4 of the present invention;

[0053] Figure 6 This is a detailed flow chart of S5 of the present invention;

[0054] Figure 7 It is a system block diagram of the present invention. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0056] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0057] Embodiment 1

[0058] See also Figure 1 The present invention provides a technical solution, a control method for auxiliary design of electrical circuits, the method comprising the following steps:

[0059] S1: According to the application environment of the electrical circuit, collect thermal management and signal integrity requirements, set the basic performance parameters of the electrical circuit, identify the operating temperature range, heat dissipation speed and signal transmission rate, and generate a list of circuit requirement parameters;

[0060] S2: Based on the circuit requirement parameter list, use parametric design technology to define the three-dimensional spatial geometry of the electrical circuit, and construct an initial geometric model by selecting matching surface types and sizes;

[0061] S3: According to the dimensions of the initialized geometric model and design requirements, the curvature and torsion are measured to optimize the efficiency of heat dissipation and signal transmission paths. The surface parameters are adjusted using real-time measurement values ​​to obtain the optimized surface model.

[0062] S4: Use the optimized surface model to control the auxiliary design of the electrical circuit, optimize the spatial position of circuit components, adjust the length and position of the routing to avoid electromagnetic interference, and obtain the circuit layout plan through field layout analysis of the optimal position of components and routing;

[0063] S5: Make a circuit board prototype according to the circuit layout plan, perform performance testing, including thermal performance and signal integrity testing, verify the real-time performance and working stability of the design based on the test data, and obtain the control effect test results.

[0064] The circuit requirement parameter list includes operating temperature range, heat dissipation speed, and signal transmission rate. The initialized geometric model includes the selected surface type, size, and corresponding geometric parameters. The optimized surface model includes adjusted curvature, torsion, optimized heat dissipation path, and signal transmission path efficiency optimization information. The circuit layout plan includes the spatial layout of circuit elements, routing length, and position configuration. The control effect test results include thermal performance test data, signal integrity test data, real-time performance of the design, and working stability verification.

[0065] See also Figure 2 ,According to the application environment of the electrical circuit, collect the thermal management and signal integrity requirements, set the basic performance parameters of the electrical circuit, identify the operating temperature range, heat dissipation speed and signal transmission rate, and generate the circuit requirement parameter list in the following steps:

[0066] S101: According to the application environment of the electrical circuit, the working conditions are evaluated, including temperature, humidity and electromagnetic interference, and the basic requirements of the working temperature range, heat dissipation speed and signal transmission rate are determined. The execution process of generating the environmental parameter list is as follows;

[0067] According to the application environment assessment of the electrical circuit, in the process of designing experiments and simulation tests, it is necessary to determine the basic parameters of the environment in which the electrical circuit is located, such as the specific values ​​of temperature, humidity and electromagnetic interference. For this purpose, environmental sensors are used to collect real-time data, and the sensitivity and sampling frequency of the sensors are adjusted according to the data evaluation results to ensure the accuracy and representativeness of the data. Through the detailed collection of environmental parameters, the circuit behavior under various extreme conditions is simulated. After analyzing the data, the basic requirements of circuit design are formulated, such as the operating temperature range and heat dissipation speed. The circuit layout and component selection are further optimized based on the basic requirements to adapt to the environmental conditions in actual applications, and a list of circuit requirement parameters is obtained.

[0068] S102: Based on the environmental parameter list, design experiments and simulation tests, quantify the operating temperature range and heat dissipation speed, perform field tests and simulations, measure key parameters, including temperature extremes and heat dissipation efficiency, and obtain the performance test data. The execution process is as follows;

[0069] Perform field tests and simulations to measure key parameters, according to the formula:

[0070] ;

[0071] Calculate the heat dissipation efficiency, where Q represents the heat dissipation, represents input power;

[0072] Consider the experimental setting, the circuit is at nominal power =100W operation, the measured heat dissipation is Q=70W, and the heat dissipation efficiency is calculated by the formula:

[0073] ;

[0074] This calculation reflects the heat dissipation performance of the circuit in actual operation, which is consistent with the heat dissipation efficiency data obtained in the simulation test, indicating that the circuit design meets the heat dissipation requirements.

[0075] S103: Using performance test data, evaluating signal transmission rate, combining thermal management data, using circuit simulation software to adjust circuit design, optimizing signal integrity and heat dissipation characteristics, checking electrical circuit matching design requirements, and obtaining a circuit requirement parameter list, the execution process is as follows;

[0076] In the process of using performance test data to evaluate the signal transmission rate, it is necessary to perform multiple rounds of signal integrity tests through circuit simulation software based on the actual measured temperature extremes and heat dissipation efficiency data, analyze each round of test data, and adjust the signal path and buffer design in the circuit design to ensure stable signal transmission under various operating temperatures. The heat dissipation structure is further optimized based on the heat dissipation data, such as increasing the surface area of ​​the heat sink and improving the layout of the fan. Continuous simulation tests are used to compare the data differences before and after the improvement to verify the improvement of the heat dissipation characteristics and the optimization of signal integrity. This ensures that the electrical circuit matches the design requirements, and records the parameters that need to be improved. This provides a scientific basis for product production and implementation, and a list of circuit requirement parameters is obtained.

[0077] See also Figure 3 Based on the circuit requirement parameter list, parametric design technology is used to define the three-dimensional spatial geometry of the electrical circuit. By selecting the matching surface type and size, the steps to construct the initialization geometric model are as follows:

[0078] S201: Using the circuit requirement parameter list, select parametric design software, import circuit performance parameters, including size constraints, component layout, and heat dissipation requirements, and obtain the execution process of the initialization geometry sketch as follows;

[0079] The circuit performance parameters, including size restrictions, component layout and heat dissipation requirements, are imported into the design software. The parameters are derived from the previous environmental testing and simulation data analysis. Through the software's automated tools, the relative positions and preset spaces of the components are displayed in detail, ensuring the initial feasibility and layout rationality of the circuit design, and further providing accurate basic drawings for detailed design and actual manufacturing, providing intuitive visual references for subsequent design optimization and component configuration, and obtaining an initial geometric sketch.

[0080] S202: By initializing the geometric sketch, according to the space and functional requirements of the circuit components, the surface type is selected, including plane, arc and free surface, and the spatial configuration of the circuit board components is calculated to obtain the execution process of the optimal surface configuration solution as follows;

[0081] The formula for calculating the spatial configuration of circuit board components is:

[0082] ;

[0083] Where S represents the selected surface configuration score, Represents the maximum length required for the component, Represents the maximum width required by the component. Represents the reserved height of the circuit board. Represents the real-time height of the component. is the degree of high matching between the component and the circuit board, is the weight coefficient for surface type selection;

[0084] Parameter meaning and setting value:

[0085] The maximum length required for the component. The data is obtained through the design specification. The set value is 50mm, which reflects the maximum length that the component needs to occupy on the circuit board.

[0086] The maximum width required by the component is also obtained through the design specification. The set value is 30mm, reflecting the maximum width that the component needs to occupy on the circuit board;

[0087] The height reserved for the circuit board is obtained through the actual circuit board design and the set value is 10mm;

[0088] is the actual height of the component, obtained by measuring the actual component, and the set value is 8mm;

[0089] is the weight coefficient of the surface type, which is set to 0.5. This value depends on the impact of the surface type on the function and installation of the component.

[0090] Substitute the parameters into the formula for calculation:

[0091] ;

[0092] The result 1061.52 indicates that the selected surface configuration is highly adaptable and satisfies the functional requirements. The high score indicates that the selected surface is very suitable for the space requirements of the component and can be effectively installed on the circuit board while meeting the functional and space requirements.

[0093] S203: According to the optimal surface configuration scheme, the connection points, wire paths and heat dissipation structures are adjusted to optimize the assembly efficiency and heat dissipation performance, and the execution process of constructing the initialization geometric model is as follows;

[0094] Analyze the component layout in the initialized geometry model, adjust the heat dissipation structure according to the thermal characteristics of the components and the operating requirements of the circuit, such as increasing the heat dissipation channel and optimizing the fan position to improve the heat dissipation efficiency, and optimize the layout of the wire path and connection points to ensure the functionality and long-term reliability of the circuit. Through adjustment, not only the electrical performance requirements of the circuit are met, but also the assembly efficiency is improved, allowing the model to demonstrate superior performance in the actual assembly process, identify the circuit design that is optimized in both heat dissipation and assembly efficiency, and build the initialized geometry model.

[0095] See also Figure 4 According to the dimensions and design requirements of the initialized geometric model, the curvature and torsion are measured to optimize the efficiency of heat dissipation and signal transmission paths. The surface parameters are adjusted using real-time measurement values ​​to obtain the optimized surface model. The specific steps are as follows:

[0096] S301: Based on the initialized geometric model, the initial values ​​of curvature and torsion are recorded, the influence of the initial values ​​on the heat dissipation efficiency and the signal transmission path is analyzed, the surface performance index value is calculated, and the execution process of generating the surface performance analysis result is as follows;

[0097] The formula for calculating the surface performance index value is:

[0098] ;

[0099] Where P is the performance index value, Represents the weight parameter between curvature and heat dissipation efficiency, Represents the measured value of curvature, reflecting the curvature of the geometric model. Represents the adjustment coefficient of the torsion rate on signal transmission, represents the absolute value of the torsion rate, Represents the area on the surface.

[0100] Parameter meaning and setting value:

[0101] is the weight parameter between curvature and heat dissipation efficiency, which is set to 50. This value reflects the influence of curvature on heat dissipation performance. A high weight means that the sensitivity of curvature change to heat dissipation performance is enhanced;

[0102] is the measured value of curvature, set to ,This data is acquired on the actual surface geometry by high-precision laser equipment;

[0103] is the adjustment coefficient of the torsion rate on signal transmission, which is set to 100, indicating that the torsion rate change has a greater impact on the signal path;

[0104] is the absolute value of the torsion rate, set to 0.02 rad / m, obtained through physical torsion testing;

[0105] is the area on the surface, set to 2.5m 2 , calculated using the analytical tools of 3D modeling software;

[0106] Substitute the parameters into the formula for calculation:

[0107] ;

[0108] Result 4.47 shows the calculated value of the surface performance index, which reflects the surface performance predicted by analysis under given curvature and torsion conditions. The high and low values ​​of this value are compared with the performance requirements in actual applications, helping decision makers understand the performance of materials under specific design conditions and optimize the design parameters.

[0109] S302: Using the surface performance analysis results, adjust the geometric parameters of the key surfaces, optimize the heat dissipation and signal transmission efficiency of the circuit by modifying the curvature and torsion, and perform multiple iteration tests to match the expected performance. The execution process of the adjusted geometric model is as follows;

[0110] Based on the initial analysis data of curvature and torsion, the design software is used to precisely modify the parameters, such as reducing the curvature and increasing the torsion, to optimize the heat dissipation channel and signal transmission line of the circuit board. The modified circuit behavior is simulated by software tools, and the performance data of different iterations are compared to ensure that each adjustment moves towards the expected performance target. After multiple iterative tests, better heat dissipation and signal transmission efficiency can be shown in actual applications, and the adjusted geometric model is obtained.

[0111] S303: Using the adjusted geometric model, verify the effect of the surface parameters, check the influence and effect of the adjustment on the overall performance of the model, including heat dissipation and signal integrity, and obtain the execution process of the optimized surface model as follows;

[0112] Through actual physical tests and advanced simulation tools, the overall performance of the model after changing the curvature and torsion is verified, focusing on the evaluation of heat dissipation and signal integrity, comparing the performance improvements of different iterative versions, and recording the effect of each adjustment to ensure that the design requirements are met. The electrical performance of the model and its stability in the actual environment are confirmed through testing, demonstrating significant performance improvements, providing a reliable reference for future product iterations and technology upgrades, and obtaining an optimized surface model.

[0113] See also Figure 5, use the optimized surface model to control the auxiliary design of the electrical circuit, optimize the spatial position of the circuit components, adjust the length and position of the routing to avoid electromagnetic interference, analyze the optimal position of the components and routing through the actual layout, and obtain the circuit layout plan in the following steps:

[0114] S401: The circuit components are spatially positioned through the optimized surface model, and the component positions are arranged according to the spatial characteristics and heat dissipation requirements of the optimized surface model, and the routing design is performed to generate the component initialization layout draft. The execution process is as follows;

[0115] According to the spatial characteristics and heat dissipation requirements of the optimized surface model, advanced CAD tools are used to arrange the component positions, and the routing is specially designed to reduce any interference and optimize the connection efficiency. The physical position of each component on the circuit board and the predetermined routing path are reflected, ensuring the initial feasibility and functionality of the design, providing a solid foundation for further detailed design and optimization, and showing in detail the relative position and connection method of each component, providing an intuitive reference for subsequent routing design and heat dissipation solution optimization, and generating a draft of the component initialization layout.

[0116] S402: Using the component initialization layout draft, adjusting the routing length and path to avoid the influence of electromagnetic interference, and performing simulation to verify the signal integrity, the execution process of the adjusted routing configuration is as follows;

[0117] Adjust the trace length and path to avoid electromagnetic interference, according to the formula:

[0118] ;

[0119] Calculate the total trace length, where , , Represents the starting point coordinates, , , represents the end point coordinates, and n represents the route the number of

[0120] Set up a simple circuit board with three main traces, with coordinates from (0,0,0) to (3,4,0), (3,4,0) to (6,0,0) and (6,0,0) to (10,0,0);

[0121] Using the distance formula in 3D space, the length of the first line is 5, the second is 5, and the third is 4, so the total trace length is:

[0122] ;

[0123] This calculation process demonstrates how to calculate the routing length based on the actual coordinate value, ensuring that electromagnetic interference is minimized while ensuring the optimization of the routing path.

[0124] S403: Using the adjusted routing configuration, conducting field layout analysis, using space simulation and electrical performance testing to verify the layout effects of components and routing, iteratively optimizing the layout, and forming the execution flow of the circuit layout solution is as follows;

[0125] Analyze the interaction between routing configuration and spatial layout, and use spatial simulation and electrical performance testing to verify the actual effects of components and routing layout, which includes routing length, path selection and implementation of electromagnetic interference minimization strategy. Perform performance evaluation on components through electrical performance testing to ensure that all components work according to predetermined parameters. Field layout analysis not only considers electromagnetic compatibility, but also evaluates the thermal performance of components to ensure the stability and reliability of the circuit under actual operating conditions, reflecting in-depth technical analysis and precise engineering implementation to form a circuit layout plan.

[0126] See also Figure 6 , according to the circuit layout plan, make a circuit board prototype, perform performance testing, including thermal performance and signal integrity testing, and verify the real-time performance and working stability of the design based on the test data. The specific steps to obtain the control effect test results are as follows:

[0127] S501: A circuit board prototype is manufactured through a circuit layout plan, and a standardized circuit board manufacturing process is used to check the consistency between the prototype and the design. The execution process of obtaining the circuit board prototype is as follows;

[0128] The manufacture of circuit board prototypes is carried out according to the standardized circuit board production process, ensuring that each production step meets the design specifications to ensure the consistency of the prototype. This involves every link from the selection of raw materials to assembly, which must be carried out strictly in accordance with the design documents, including printing, etching, drilling, welding and other key steps. The consistency between the prototype and the design is checked through a series of physical and chemical tests, including dimensional accuracy tests, electrical connectivity tests, etc., to ensure that the prototype board meets the design requirements in all aspects. The process requires not only precise process operations, but also an efficient quality control system to monitor each step to ensure the quality and performance of the product and obtain a circuit board prototype.

[0129] S502: Perform performance testing on the circuit board prototype, including thermal performance testing and signal integrity testing. Use a thermal imager and a signal analyzer to measure key parameters, evaluate heat dissipation efficiency and signal transmission speed, and the execution process for obtaining performance test data is as follows;

[0130] Use a thermal imager and a signal analyzer to measure key parameters according to the formula:

[0131] ;

[0132] Calculating cooling efficiency , where m represents mass and c represents specific heat capacity. Represents temperature change;

[0133] Assume that the mass of a component in the circuit board during operation is 0.02 kg, the specific heat capacity is 900 J / kg·K, and the temperature difference before and after operation is 10 K. According to the formula, the thermal energy change of the component during this process is:

[0134] ;

[0135] This calculation demonstrates how to evaluate the heat dissipation efficiency of a circuit board through measured temperature changes, which is an important basis for determining whether the thermal management system in a circuit design is effective.

[0136] S503: Using the performance test data, verify the design and function of the circuit board prototype, adjust the parameters to optimize the work efficiency and stability, verify the matching degree between the circuit board prototype and the design specifications and performance requirements, and obtain the control effect test results. The execution process is as follows;

[0137] The collection of performance test data is completed through advanced test equipment and precise measurement technology, including real-time monitoring of parameters such as voltage, current, and temperature. The process of adjusting parameters is a dynamic debugging activity, which aims to achieve the optimal performance indicators by modifying specific elements in the circuit design. This process requires multiple iterative tests to find the best setting value to ensure that the circuit board prototype can achieve the expected control effect in actual application and obtain the control effect test results.

[0138] See also Figure 7 A control system for electrical circuit auxiliary design is used to execute a control method for electrical circuit auxiliary design, the system comprising:

[0139] The demand analysis module measures the operating temperature range, heat dissipation speed and signal transmission rate according to the application environment of the electrical circuit to obtain a list of demand parameters;

[0140] The geometric modeling module selects the matching surface type and size based on the required parameter list, establishes the three-dimensional space geometry, and constructs the initial geometric model;

[0141] The path optimization module measures the dimensions of the initialized geometric model, calculates the curvature and torsion, adjusts the surface parameters, optimizes the efficiency of the heat dissipation and signal transmission path, and obtains an optimized surface model;

[0142] The circuit layout adjustment module uses an optimized surface model to analyze the electromagnetic interference of components and traces, optimize the spatial position of circuit components and trace length, and generate a circuit layout plan;

[0143] The prototype test module makes a circuit board prototype according to the circuit layout plan, performs thermal performance and signal integrity tests, and obtains performance test data;

[0144] The performance verification module evaluates the design's effectiveness and working stability based on the performance test data, verifies the degree of match between the circuit board prototype and the design specifications and performance requirements, and obtains control effect test results.

[0145] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in other forms. Any technician familiar with the profession may use the technical contents disclosed above to change or modify them into equivalent embodiments with equivalent changes and apply them to other fields. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A control method for auxiliary design of electrical circuits, characterized in that: The method comprises the following steps: According to the application environment of the electrical circuit, collect thermal management and signal integrity requirements, set the basic performance parameters of the electrical circuit, identify the operating temperature range, heat dissipation speed and signal transmission rate, and generate a list of circuit requirement parameters; Based on the circuit requirement parameter list, the three-dimensional spatial geometry of the electrical circuit is defined by using parametric design technology, and an initialization geometric model is constructed by selecting matching surface types and sizes; According to the dimensions and design requirements of the initialized geometric model, the curvature and torsion are measured to optimize the efficiency of heat dissipation and signal transmission paths, and the surface parameters are adjusted using real-time measurement values ​​to obtain an optimized surface model; Using the optimized surface model, controlling the auxiliary design of the electrical circuit, optimizing the spatial position of the circuit components, adjusting the length and position of the wiring to avoid electromagnetic interference, and obtaining the circuit layout plan through on-site layout analysis of the optimal position of the components and wiring; Produce a circuit board prototype according to the circuit layout scheme, perform performance testing, including thermal performance and signal integrity testing, verify the real-time performance and working stability of the design based on the test data, and obtain control effect test results; According to the dimensions and design requirements of the initialized geometric model, the curvature and torsion are measured, the efficiency of heat dissipation and signal transmission paths are optimized, and the surface parameters are adjusted using real-time measurement values ​​to obtain the optimized surface model. Specifically, the steps are as follows: Based on the initialized geometric model, the initial values ​​of curvature and torsion are recorded, the influence of the initial values ​​on the heat dissipation efficiency and the signal transmission path is analyzed, the surface performance index value is calculated, and the surface performance analysis result is generated; Using the surface performance analysis results, the geometric parameters of key surfaces are adjusted, the heat dissipation and signal transmission efficiency of the circuit are optimized by modifying the curvature and torsion, and multiple iteration tests are performed to match the expected performance to obtain an adjusted geometric model; The adjusted geometric model is used to verify the effect of the surface parameters, check the influence and effect of the adjustment on the overall performance of the model, including heat dissipation and signal integrity, and obtain an optimized surface model.

2. A control method for electrical circuit auxiliary design according to claim 1, characterized in that: The circuit requirement parameter list includes operating temperature range, heat dissipation speed, and signal transmission rate. The initialized geometric model includes the selected surface type, size, and corresponding geometric parameters. The optimized surface model includes adjusted curvature, torsion, optimized heat dissipation path, and signal transmission path efficiency optimization information. The circuit layout plan includes the spatial layout, routing length, and position configuration of circuit elements. The control effect test results include thermal performance test data, signal integrity test data, real-time performance of the design, and working stability verification.

3. A control method for auxiliary design of electrical circuits according to claim 1, characterized in that: According to the application environment of the electrical circuit, collect thermal management and signal integrity requirements, set the basic performance parameters of the electrical circuit, identify the operating temperature range, heat dissipation speed and signal transmission rate, and generate the circuit requirement parameter list in the following steps: According to the application environment of the electrical circuit, evaluate the working conditions, including temperature, humidity and electromagnetic interference, determine the basic requirements of the working temperature range, heat dissipation speed and signal transmission rate, and generate a list of environmental parameters; Based on the environmental parameter list, design experiments and simulation tests to quantify the operating temperature range and heat dissipation speed, perform field tests and simulations, measure key parameters, including temperature extremes and heat dissipation efficiency, and obtain performance test data; The performance test data is used to evaluate the signal transmission rate, and combined with the thermal management data, the circuit design is adjusted using circuit simulation software to optimize the signal integrity and heat dissipation characteristics, and the electrical circuit matching design requirements are checked to obtain a list of circuit requirement parameters.

4. A control method for electrical circuit auxiliary design according to claim 1, characterized in that: Based on the circuit requirement parameter list, the three-dimensional spatial geometry of the electrical circuit is defined by using parametric design technology, and the steps of constructing the initialization geometric model by selecting matching surface types and sizes are as follows: Using the circuit requirement parameter list, select parametric design software, import circuit performance parameters, including size constraints, component layout, and heat dissipation requirements, and obtain an initialization geometry sketch; By using the initialized geometric sketch, according to the space and functional requirements of the circuit component, the surface type is selected, including a plane, an arc and a free-form surface, the spatial configuration of the circuit board component is calculated, and the optimal surface configuration scheme is obtained; The formula for calculating the spatial configuration of the circuit board assembly is: ； Where S represents the selected surface configuration score, Represents the maximum length required for the component, Represents the maximum width required by the component. Represents the reserved height of the circuit board. Represents the real-time height of the component. is the degree of high matching between the component and the circuit board, is the weight coefficient for surface type selection; According to the optimal surface configuration scheme, the connection points, wire paths and heat dissipation structures are adjusted to optimize assembly efficiency and heat dissipation performance, and an initialization geometric model is constructed.

5. The control method for auxiliary design of electrical circuits according to claim 1, characterized in that: The formula for calculating the surface performance index value is: ； Where P is the performance index value, Represents the weight parameter between curvature and heat dissipation efficiency, Represents the measured value of curvature, reflecting the curvature of the geometric model. Represents the adjustment coefficient of the torsion rate on signal transmission, represents the absolute value of the torsion rate, Represents the area on the surface.

6. A control method for auxiliary design of electrical circuits according to claim 1, characterized in that: The optimized surface model is used to control the auxiliary design of the electrical circuit, optimize the spatial position of the circuit components, adjust the length and position of the routing to avoid electromagnetic interference, and analyze the optimal position of the components and routing through the actual layout to obtain the circuit layout solution. Specifically, the steps are as follows: The optimized surface model is used to spatially locate the circuit components, and the component positions are arranged according to the spatial characteristics and heat dissipation requirements of the optimized surface model, and the wiring design is performed to generate a draft of the component initialization layout; Initializing a layout draft using the components, adjusting the routing length and path to avoid the influence of electromagnetic interference, and performing simulation to verify the signal integrity to obtain the adjusted routing configuration; The adjusted routing configuration is used to perform field layout analysis, and spatial simulation and electrical performance testing are used to verify the layout effects of components and routing. The layout is iteratively optimized to form a circuit layout solution.

7. A control method for auxiliary design of electrical circuits according to claim 1, characterized in that: The steps of making a circuit board prototype according to the circuit layout scheme, performing performance tests, including thermal performance and signal integrity tests, and verifying the real-time performance and working stability of the design based on the test data to obtain the control effect test results are as follows: A circuit board prototype is manufactured by using the circuit layout scheme, and a standardized circuit board manufacturing process is used to check the consistency between the prototype and the design to obtain a circuit board prototype; Performing performance tests on the circuit board prototype, including thermal performance tests and signal integrity tests, using a thermal imager and a signal analyzer to measure key parameters, evaluate heat dissipation efficiency and signal transmission speed, and obtain performance test data; The performance test data is used to verify the design and function of the circuit board prototype, adjust parameters to optimize work efficiency and stability, verify the degree of match between the circuit board prototype and the design specifications and performance requirements, and obtain control effect test results.

8. A control system for auxiliary design of electrical circuits, characterized in that: The control system for electrical circuit auxiliary design is used to execute the control method for electrical circuit auxiliary design according to any one of claims 1 to 7, and the system comprises: The demand analysis module measures the operating temperature range, heat dissipation speed and signal transmission rate according to the application environment of the electrical circuit to obtain a list of demand parameters; The geometric modeling module selects matching surface types and sizes based on the required parameter list, establishes three-dimensional spatial geometric shapes, and constructs an initial geometric model; The path optimization module measures the dimensions of the initialized geometric model, calculates the curvature and torsion, adjusts the surface parameters, optimizes the efficiency of the heat dissipation and signal transmission paths, and obtains an optimized surface model; The circuit layout adjustment module uses the optimized surface model to analyze the electromagnetic interference of components and routing, optimize the spatial position of circuit components and routing length, and generate a circuit layout solution; The prototype testing module manufactures a circuit board prototype according to the circuit layout scheme, performs thermal performance and signal integrity tests, and obtains performance test data; The performance verification module evaluates the effectiveness and working stability of the design based on the performance test data, verifies the matching degree between the circuit board prototype and the design specifications and performance requirements, and obtains the control effect test results.

9. A storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of a control method for auxiliary design of electrical circuits as described in any one of claims 1 to 7 are implemented.

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