A preparation process of solder mask plugging ink for printed circuit board via holes

Abstract

The present invention relates to a preparation process of solder mask plugging ink for printed circuit board vias, and also relates to the technical field of printed circuit board preparation; it is also completed in cooperation with a preparation device for solder mask plugging ink for printed circuit board vias. The preparation device includes two supporting seats that are symmetrically distributed up and down and are used to support the printed circuit board. The present invention can solve the following problems existing in the prior art: First, the prior art can only perform solder mask plugging operations on a single printed circuit board and cannot perform solder mask plugging operations on printed circuit boards of different batches. Second, the sequential curing of the plugging ink of the printed circuit board in the prior art results in a long overall curing time, so its processing efficiency is low. Third, the clamping device in the prior art clamps the printed circuit board only by means of unilateral limiting. When an external force squeezes the printed circuit board, it is easy to cause the printed circuit board to shift, and even more seriously, it may cause it to break.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board preparation, and particularly relates to a process for preparing solder mask plugging ink for vias of printed circuit boards. Background Art

[0002] The process for preparing solder mask plugging ink for vias of printed circuit boards (PCBs) is a technology specifically used in the PCB production process. Its purpose is to fill the vias with solder mask ink to prevent solder from seeping into the holes during the soldering process, thereby protecting the electrical conductivity and mechanical strength of the circuit board.

[0003] For example, Chinese Patent with publication number CN116390359A discloses a process for preparing solder mask plugging ink for vias of printed circuit boards, which is completed by cooperating with a coating device. The coating device includes a support frame, a moving mechanism and a plugging mechanism. In the designed plugging mechanism, during the process of the two feeding pumps moving towards each other and cooperating with the feeding pipes, feeding treatment can be carried out on both sides of the via synchronously, so that plugging treatment can be carried out on both sides of the via simultaneously, reducing the time for separately performing solder mask plugging on both sides of the printed circuit board and improving the efficiency of solder mask plugging of the printed circuit board; the cleaning round rod and the cleaning sponge can clean the via, and then the surface of the cleaned via is smoother and neater, increasing the adhesion between the via and the subsequent solder mask plugging ink.

[0004] However, the above process for preparing solder mask plugging ink for vias of printed circuit boards still has some deficiencies in the actual use process:

[0005] 1. First, the plugging mechanism designed in the above prior art can perform feeding treatment on both sides of the via synchronously through the cooperation of two feeding pumps and feeding pipes, reducing the time for separately performing solder mask plugging on both sides of the printed circuit board. However, it can only perform solder mask plugging operations on single holes on the printed circuit board. With the development of printed circuit board technology, the shapes of existing printed circuit boards are different, and the positions of vias on the upper printed circuit board are also different. Therefore, the efficiency of performing solder mask plugging operations on single holes of the printed circuit board is very low, and the existing technology can only perform solder mask plugging operations on a single printed circuit board, resulting in a certain degree of singularity and being unable to perform solder mask plugging operations on different batches of printed circuit boards.

[0006] 2. Secondly, in the prior art, the curing time of the solder mask ink ranges from a few minutes to dozens of minutes; in order to obtain the best curing effect, it is recommended to follow the guidance and recommended parameters provided by the ink manufacturer, and often a multi-layer heating process needs to be adopted, so the curing time of the solder mask ink will be longer. If solder mask plugging operations and heating and film-forming operations of the solder mask ink are carried out on the vias of the printed circuit board one by one, the efficiency is very low, and ultimately there will be a shortage of supply of printed circuit boards.

[0007] 3. Then in the prior art, when clamping a printed circuit board, the clamping device in the prior art only clamps the printed circuit board in a single-sided limiting manner. When an external force squeezes the printed circuit board, it is easy to cause the printed circuit board to shift, and even more seriously, cause it to break.

[0008] Therefore, under the viewpoints stated above, there is still room for improvement in the existing process for preparing solder mask plugging ink for the via holes of printed circuit boards. Summary of the Invention

[0009] In order to solve the above problems, the present invention provides a process for preparing solder mask plugging ink for the via holes of printed circuit boards.

[0010] A process for preparing solder mask plugging ink for the via holes of printed circuit boards includes the following steps:

[0011] S1. Preparation operation: Prepare the solder mask plugging ink pre-prepared for plugging the via holes of the printed circuit board, and check whether the entire device is operating normally;

[0012] S2. Transportation of printed circuit board: Batch transport the printed circuit board to be processed so that it sequentially enters the designated area to be processed for processing;

[0013] S3. Solder mask plugging of printed circuit board: Simultaneously fill the pre-prepared solder mask plugging ink into several via holes on the printed circuit board and around several via holes of the printed circuit board, and make it cover all the via holes of the printed circuit board;

[0014] S4. Heating and curing to form a film: Simultaneously heat-treat several via holes on the printed circuit board to cure the solder mask plugging ink filled in several via holes on the printed circuit board into a film;

[0015] S5. Batch operation: Since the positions and sizes of several via holes at the upper end of printed circuit boards of different models are inconsistent, quickly replace the solder mask plugging ink filling device corresponding to the via holes of the printed circuit board to achieve solder mask plugging of the via holes of printed circuit boards of different models.

[0016] In addition, it is completed in cooperation with a device for preparing solder mask plugging ink for the via holes of printed circuit boards. The preparation device includes two supporting seats that are symmetrically distributed up and down and are used to support the printed circuit board. A conveyor for transporting the printed circuit board is arranged on the supporting seat. Adjusters for adjusting the distance between the two are arranged on both sides of the supporting seat. And the supporting seat is arranged on the support frame through the adjuster, and the support frame is arranged on the ground.

[0017] On both sides of the supporting seat on the support frame, there are plug hole parts for synchronously performing solder mask plug hole operations on the via holes on the printed circuit board, and a curing part for curing the ink used for solder mask plug hole is arranged on the plug hole parts.

[0018] Preferably, the plug hole part includes an ink storage plate distributed parallel to the printed circuit board to be processed and an ink jet pipe integrally connected to the ink storage plate. The ink storage plates are symmetrically arranged on the support frame, and the ink jet pipes on the two ink storage plates are distributed oppositely.

[0019] An injector for jetting ink is also arranged on the support frame. A connecting pipe is installed on the injector, and one end of the connecting pipe far away from the injector is movably installed at the ink filling port on the back side of the ink storage plate by means of threaded connection.

[0020] Preferably, the curing part includes a heating plate slidably installed on the ink storage plate and a heat conduction cover arranged on the heating plate for heat conduction. The heating plate is slidably installed on the ink jet pipe of the ink storage plate. The heat conduction cover is arranged at one end of the heating plate far away from the ink storage plate, and the heat conduction cover and the heating plate are arranged through the ink jet pipe.

[0021] A power connection wire harness connected to an external power supply is installed on the heating plate by means of plugging.

[0022] Preferably, a replacement component for quickly replacing printed circuit boards of different models is arranged on the back side of the ink storage plate. The replacement component includes a fixed block, a clamping block, a partition board, a clamping spring, a clamping cone block and a traction rope.

[0023] The clamping block is installed on the back side of the ink storage plate. The fixed block is slidably inserted into the side of the clamping block far away from the ink storage plate. The fixed block is of a hollow structure. The partition board is arranged in the middle of the inner side of the fixed block. The clamping springs are symmetrically arranged at both ends of the partition board and extend towards the outside of the fixed block. The clamping cone block is arranged on the side of the clamping spring far away from the partition board, and the clamping cone block slidably penetrates through the fixed block and extends towards the outside of the fixed block, and the inclined surface of the clamping cone block is distributed towards the direction of the clamping block. A square groove for the clamping cone block to slide is opened on the fixed block. Both ends of the traction rope are respectively connected to the sides of the two clamping cone blocks close to the clamping spring, and the middle part of the traction rope slides through the middle part of the clamping spring and penetrates through the fixed block and is arranged on the upper side of the fixed block. A traction groove for the traction rope to slide is opened on the fixed block.

[0024] Preferably, a synchronization unit for synchronously regulating the synchronous processing of both sides of the printed circuit board by the two plug hole parts is also arranged on the support frame. The synchronization unit includes a T-shaped block, a bidirectional screw rod, a slider, a unidirectional air cylinder and a synchronization motor.

[0025] The T-shaped block is slidably installed in the length direction of the support frame. The bidirectional screw is rotatably installed on the T-shaped block. The sliders are symmetrically arranged on the bidirectional screw and slidably arranged on the T-shaped block. The unidirectional cylinder is installed on the slider, and the output end of the unidirectional cylinder faces upward. The output end of the unidirectional cylinder is connected to the fixed block. The synchronous motor is installed on the bidirectional screw.

[0026] Preferably, the regulator includes two sets of adjusting columns and adjusting threaded rods that are vertically upward and arranged on both sides of the upper end of the support frame along the length direction of the support frame. Execution blocks are installed at both ends of the supporting seat. The execution blocks slidably penetrate through the adjusting columns, and the supporting seat is connected to the adjusting threaded rod in a threaded connection manner. The adjusting threaded rod is of a bidirectional threaded structure.

[0027] Preferably, an opening and closing component for opening and closing the solder resist plug hole ink is further provided in the ink jet tube of the ink storage plate. The opening and closing component includes an induction sheet, an induction spring, a linkage rope, and an opening and closing sheet.

[0028] The induction sheet is slidably arranged on the inner wall of the ink jet tube. The induction spring is arranged between the induction sheet and the ink jet tube through a protection tube. The linkage rope is installed at one end of the induction sheet away from the ink outlet of the ink jet tube. The end of the linkage rope away from the induction sheet slidably penetrates through the ink jet tube and is arranged on the opening and closing sheet. The opening and closing sheet is symmetrically hinged at the ink outlet of the ink jet tube through a torsion spring.

[0029] Preferably, the conveyor includes conveyor rollers, conveyor springs, a conveyor belt, clamping rollers, clamping springs, and a conveyor motor. The conveyor rollers are rotatably installed on both sides of the supporting seat in the length direction through the conveyor springs. The conveyor belt is sleeved on the two conveyor rollers. The clamping springs are arranged at equal intervals along the length direction of the supporting seat inside the supporting seat. The clamping rollers are arranged on the clamping springs through auxiliary frames, and the clamping rollers abut against the conveyor belt. The conveyor motor is arranged on one of the conveyor rollers.

[0030] Preferably, a heat insulation layer is provided on the surfaces of the ink jet tube and the opening and closing sheet.

[0031] Preferably, a plurality of friction rollers are arranged at equal intervals inside the supporting seat.

[0032] In summary, the present application includes at least one of the following beneficial technical effects:

[0033] First, the plug hole part in the present invention can simultaneously block a plurality of via holes on an entire printed circuit board, which greatly reduces the time for blocking processing of the printed circuit board, improves the processing efficiency, and the heating plate can also simultaneously heat and cure the via holes on the printed circuit board, avoiding the problem of poor efficiency caused by processing the via holes on the printed circuit board one by one.

[0034] II. The regulator in the present invention is mainly used to adjust the distance between two supporting seats. By adjusting the distance between the two supporting seats, it can effectively clamp and convey printed circuit boards of different sizes. At the same time, the two supporting seats limit the two ends of the printed circuit board, which can avoid the displacement and breakage of the printed circuit board during processing.

[0035] III. The conveyor in the present invention is arranged on the regulator. The conveyor can effectively ensure the movement of the printed circuit board between the supporting seats, avoid the complex operations of manual loading and unloading of the printed circuit board, and greatly improve the processing efficiency of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention will be further described below in conjunction with the drawings and embodiments.

[0037] Figure 1 is a schematic diagram of the main structure of the present invention.

[0038] Figure 2 is a schematic diagram of the structure of the regulator of the present invention.

[0039] Figure 3 is a schematic diagram of the structure between the conveyor and the regulator of the present invention.

[0040] Figure 4 is an exploded view of the structure of the conveyor of the present invention.

[0041] Figure 5 is a schematic diagram of the structure between the plug hole part and the curing part of the present invention.

[0042] Figure 6 is a schematic diagram of the structure among the plug hole part, the curing part and the synchronization unit of the present invention.

[0043] Figure 7 is a schematic diagram of the structure of the plug hole part of the present invention.

[0044] Figure 8 is the present invention Figure 7 partial enlarged view at B.

[0045] Figure 9 is a schematic diagram of the structure of the replacement component of the present invention from the first perspective.

[0046] Figure 10 is a schematic diagram of the structure of the replacement component of the present invention from the second perspective.

[0047] Figure 11 is a flowchart of the process for preparing the solder resist plug hole ink for the via holes of the printed circuit board of the present invention.

[0048] In the figure, A is a printed circuit board; 1 is a support base; 2 is a conveyor; 3 is a regulator; 4 is a support frame; 5 is a plug hole part; 6 is a curing part; 50 is an ink storage plate; 51 is an inkjet tube; 52 is an injector; 53 is a connecting pipe; 54 is an ink filling port; 60 is a heating plate; 61 is a conduction cover; 62 is a current-carrying wire harness; 7 is a replacement component; 70 is a fixing block; 71 is a clamping block; 72 is a partition; 73 is a clamping spring; 74 is a clamping cone block; 75 is a towing rope; 8 is a synchronization unit; 80 is a T-shaped block; 81 is a bidirectional screw; 82 is a unidirectional air cylinder; 83 is a slider; 84 is a synchronization motor; 30 is an adjusting column; 31 is an adjusting threaded rod; 32 is an execution block; 55 is an opening and closing component; 550 is an induction sheet; 551 is an induction spring; 552 is a linkage rope; 553 is an opening and closing sheet; 20 is a conveying roller; 21 is a conveying spring; 22 is a conveyor belt; 23 is a clamping roller; 24 is a clamping spring; 25 is a conveying motor; 26 is a friction roller. Detailed implementation mode

[0049] The following is a detailed description of the embodiments of the present invention in conjunction with the attached Figures 1 - 11 The embodiments of the present invention will be described in detail, but the present invention can be implemented in many different ways defined and covered by the claims.

[0050] The embodiment of the present application discloses a process for preparing solder mask plug hole ink for the via holes of a printed circuit board. It should be noted that this process for preparing solder mask plug hole ink for the via holes of a printed circuit board is mainly applied in the process of solder masking the via holes of the printed circuit board A. In terms of technical effects, the shapes of the existing printed circuit boards A are all different, and the positions of the via holes on the upper printed circuit board A are also different. Therefore, the operation efficiency of single-hole solder masking and plugging the via holes of the printed circuit board A is very low. Moreover, the existing technology can only perform solder masking and plugging operations on a single printed circuit board A, resulting in a certain degree of singularity and being unable to perform solder masking and plugging operations on different batches of printed circuit boards A.

[0051] Secondly, in the existing technology, the curing time of the solder mask ink ranges from several minutes to dozens of minutes. To obtain the best curing effect, it is recommended to follow the guidance and recommended parameters provided by the ink manufacturer. Often, a multi-layer heating process needs to be adopted, which will result in a longer curing time of the solder mask ink. If the solder masking and plugging operations of the via holes of the printed circuit board A and the heating and film-forming operations of the solder mask ink are carried out one by one, the efficiency is very low, and ultimately, there will be a shortage of supply for the printed circuit board A.

[0052] Embodiment 1:

[0053] Refer to Figure 1As shown in the figure, this embodiment is completed in cooperation with a solder mask plugging ink preparation device for printed circuit board vias. The preparation device includes two supporting seats 1 that are symmetrically distributed up and down and are used to support the printed circuit board A. A conveyor 2 for transporting the printed circuit board A is arranged on the supporting seat 1. Regulators 3 for adjusting the distance between the two are arranged on both sides of the supporting seat 1, and the supporting seat 1 is arranged on the support frame 4 through the regulator 3. The support frame 4 is arranged on the ground.

[0054] It should be noted that the regulator 3 is a schematic structural diagram for adjusting the distance between the two supporting seats 1 in the present invention. By adjusting the distance between the two supporting seats 1, it is possible to effectively clamp and transport printed circuit boards A of different sizes. At the same time, the two ends of the printed circuit board A are limited by the two supporting seats 1, which can avoid the displacement and breakage of the printed circuit board A during the processing of the printed circuit board A.

[0055] The conveyor 2 is arranged on the regulator 3. The conveyor 2 can effectively ensure the movement of the printed circuit board A between the supporting seats 1, avoiding the complex operations of manually loading and unloading the printed circuit board A, and greatly improving the processing efficiency of the printed circuit board A.

[0056] On the support frame 4 and on both sides of the supporting seat 1, there is a plugging part 5 for simultaneously performing solder mask plugging operations on the vias on the printed circuit board A. A curing part 6 for curing the ink used for solder mask plugging is arranged on the plugging part 5.

[0057] After the printed circuit board A is arranged on the conveyor 2 and the supporting seat 1, the plugging part 5 blocks the vias on the printed circuit board A, and at the same time, the curing part 6 heats and cures the blocked vias, including the sealing performance of the via blockage.

[0058] The plugging part 5 in the present invention can simultaneously perform blocking operations on several vias on an entire printed circuit board A, which greatly reduces the blocking processing time of the printed circuit board A and improves its processing efficiency. Moreover, the heating plate 60 can also simultaneously heat and cure the vias on the printed circuit board A, avoiding the problem of poor efficiency caused by processing the vias on the printed circuit board A one by one.

[0059] Refer to Figure 2 As shown in the figure, that is, the schematic structural diagram of the position adjustment of the supporting seat 1 in this embodiment; the regulator 3 includes two groups of adjusting columns 30 that are vertically upward and are arranged at the upper ends of both sides of the support frame 4 along the length direction of the support frame 4 and adjusting threaded rods 31. The supporting seat 1 slidably passes through the adjusting columns 30, and the supporting seat 1 is connected to the adjusting threaded rod 31 in a threaded connection manner. The adjusting threaded rod 31 is a double-threaded structure.

[0060] First, two supporting seats 1 are distributed vertically, and the distance between the two supporting seats 1 is relatively large. When the printed circuit board A needs to be processed, the printed circuit board A is placed on one of the supporting seats 1. Then, the adjusting screw rod 31 is rotated. The adjusting screw rod 31 drives the two supporting seats 1 to approach each other until the two supporting seats 1 abut against the upper and lower ends of the printed circuit board A, but the printed circuit board A will not be clamped so tightly that it cannot move along the supporting seat 1, enabling the printed circuit board A to slide along the length direction of the supporting seat 1 driven by the conveyor 2.

[0061] When the next batch of printed circuit boards A to be processed needs to be processed, the adjusting screw rod 31 is rotated in the reverse direction. At this time, the two supporting seats 1 are separated, and the next batch of printed circuit boards A to be processed can be placed on the supporting seats 1. As the adjusting screw rod 31 is rotated, the two supporting seats 1 limit and clamp the two sides of the printed circuit board A.

[0062] Refer to Figure 3 and Figure 4 As shown, it is a schematic structural diagram of the conveyor 2 in this embodiment; the conveyor 2 includes conveyor rollers 20, conveyor springs 21, conveyor belts 22, clamping rollers 23, clamping springs 24, and a conveyor motor 25; the conveyor rollers 20 are rotatably installed on both sides in the length direction of the supporting seat 1 through the conveyor springs 21, the conveyor belts 22 are sleeved on the two conveyor rollers 20, the clamping springs 24 are arranged at equal intervals along the length direction of the supporting seat 1 on the inner side of the supporting seat 1, the clamping rollers 23 are arranged on the clamping springs 24 through auxiliary frames, and the clamping rollers 23 abut against the conveyor belts 22. The conveyor motor 25 is arranged on one of the conveyor rollers 20, and the conveyor belts 22 can be driven to rotate through the conveyor motor 25. The conveyor belts 22 drive the printed circuit board A to move along the length direction of the supporting seat 1 through friction.

[0063] In the initial state, the printed circuit board A is inserted and installed on the supporting seat 1 from one side of the supporting seat 1. Subsequently, after the printed circuit board A is processed, the printed circuit board A is removed from the supporting seat 1 from the other side of the supporting seat 1 to realize the unloading of the printed circuit board A.

[0064] Furthermore, in order to improve the installation stability between the printed circuit board A and the supporting seat 1, the present invention also proposes the clamping rollers 23 and the clamping springs 24. After the printed circuit board A is installed on the supporting seat 1, the clamping rollers 23, through the elastic force of the clamping springs 24, make the conveyor belts 22 abut against the surface of the printed circuit board A. At this time, when the conveyor belts 22 rotate, it can ensure that the printed circuit board A moves along the supporting seat 1. This can not only realize the rapid loading and unloading of the printed circuit board A, reduce the complexity of the loading and unloading of the printed circuit board A, but also ensure the stability of the printed circuit board A, avoiding the printed circuit board A from breaking due to the extrusion of horizontal lateral external forces after the ink jet pipe 51 contacts its surface.

[0065] Refer to Figure 4 As shown, further, a number of friction rollers 26 are rotatably arranged at equal intervals on the supporting seat 1 and are closely arranged.

[0066] The friction rollers 26 can reduce the frictional force between the bottom of the printed circuit board A and the bottom of the supporting seat 1, avoiding wear on the bottom of the printed circuit board A during movement.

[0067] Refer to Figure 5 and Figure 6 As shown, that is, the structural schematic diagram between the ink storage plate 50 and the ink jet pipe 51 in this embodiment; specifically, the plugging portion 5 includes an ink storage plate 50 distributed in parallel with the printed circuit board A to be processed and an ink jet pipe 51 integrally connected to the ink storage plate 50. The ink storage plates 50 are symmetrically arranged on the support frame 4, and the ink jet pipes 51 on the two ink storage plates 50 are oppositely distributed.

[0068] A jetter 52 for jetting ink is further arranged on the support frame 4. A connecting pipe 53 is installed on the jetter 52, and one end of the connecting pipe 53 away from the jetter 52 is movably installed at the ink filling port 54 on the back side of the ink storage plate 50 by means of threaded connection.

[0069] It should be noted that a certain amount of plugging ink is pre-filled in the jetter 52.

[0070] After the printed circuit board A is installed on the supporting seat 1, the printed circuit board A is vertically distributed. At this time, the plugging portion 5 for processing the printed circuit board A is located on both sides of the printed circuit board A, and the distance between the plugging portions 5 on both sides and the printed circuit board A is the same. The purpose is to ensure that the via holes on both sides of the printed circuit board A can be processed simultaneously, improve the integrity of the solder mask plugging ink for the via holes, and avoid gaps or holes in the middle of the blocking ink, resulting in poor sealing of the via holes.

[0071] During the specific implementation process, the two ink storage plates 50 are driven by the synchronization unit 8 to approach the printed circuit board A, so that the ink jet pipes 51 on the ink storage plates 50 abut against the via holes on the printed circuit board A. Subsequently, the plugging ink enters the ink storage plate 50 along the ink jet pipes 51, filling the ink storage plate 50 with plugging ink. Finally, the ink enters the via holes on the printed circuit board A along the ink jet pipes 51 simultaneously until the plugging ink fills the via holes on the printed circuit board A completely.

[0072] Refer to Figure 5 , Figure 6 and Figure 7As shown, it is a schematic structural diagram of heating and curing the plugging ink in the via hole in this embodiment; specifically, the curing member 6 includes a heating plate 60 slidably installed on the ink storage plate 50 and a conduction cover 61 provided on the heating plate 60 for heat conduction. The heating plate 60 is slidably installed on the inkjet tube 51 of the ink storage plate 50. The conduction cover 61 is provided at one end of the heating plate 60 away from the ink storage plate 50, and the conduction cover 61 and the heating plate 60 are inserted through the inkjet tube 51.

[0073] A power connection wire harness 62 connected to an external power supply is installed on the heating plate 60 by means of plugging.

[0074] It should be noted that the conduction cover 61 is installed on the heating plate 60. After the heating plate 60 is heated, the conduction cover 61 can quickly transfer heat to the area of the via hole of the printed circuit board A to ensure that the plugging ink in the via hole can be quickly cured.

[0075] And the heating plate 60 is connected to the power connection wire harness 62 by means of plugging. Therefore, the heating plate 60 and the power connection wire harness 62 can be quickly separated and connected.

[0076] Refer to Figure 9 and Figure 10 As shown, it is a schematic structural diagram of quickly replacing the ink storage plate 50 in this embodiment; specifically, a replacement component 7 for quickly replacing different models of printed circuit boards A is provided on the back side of the ink storage plate 50. The replacement component 7 includes a fixed block 70, a clamping block 71, a partition 72, a clamping spring 73, a clamping cone 74, and a traction rope 75. The clamping block 71 is installed on the back side of the ink storage plate 50. The fixed block 70 is slidably inserted into the side of the clamping block 71 away from the ink storage plate 50. The fixed block 70 is of a hollow structure. The partition 72 is provided in the middle of the inner side of the fixed block 70. The clamping springs 73 are symmetrically provided at both ends of the partition 72 and extend outward from the fixed block 70. The clamping cone 74 is provided on the side of the clamping spring 73 away from the partition 72, and the clamping cone 74 slidably passes through the fixed block 70 and extends outward from the fixed block 70. The inclined surface of the clamping cone 74 is distributed in the direction of the clamping block 71. A square groove for the clamping cone 74 to slide is provided on the fixed block 70. Both ends of the traction rope 75 are respectively connected to the sides of the two clamping cones 74 close to the clamping spring 73, and the middle of the traction rope 75 slides through the middle of the clamping spring 73 and passes through the fixed block 70 and is provided on the upper side of the fixed block 70. A traction groove for the traction rope 75 to slide is provided on the fixed block 70.

[0077] It should be noted that in the present invention, the ink storage plate 50 and the inkjet tube 51 are connected by means of threaded connection. Therefore, the ink storage plate 50 and the inkjet tube 51 can be quickly disassembled and installed.

[0078] It should be noted that in the present invention, a variety of different ink storage plates 50 are designed as molds, which can block the via holes at the upper ends of printed circuit boards A of different models.

[0079] In the present invention, the heating plate 60 and the power supply wire harness 62 are connected by plugging, so the heating plate 60 and the power supply wire harness 62 can also be quickly disassembled and installed.

[0080] The heating plate 60 is slidably installed on the inkjet tube 51 of the ink storage plate 50, so the heating plate 60 and the ink storage plate 50 can be replaced integrally.

[0081] When the present invention finishes processing the first batch of printed circuit boards A and needs to process the second batch of printed circuit boards A, if the sizes of the second batch of printed circuit boards A are different from those of the first batch of printed circuit boards A, by replacing the corresponding ink storage plate 50 and heating plate 60, the via holes at different positions on the printed circuit boards A in different batches can be blocked.

[0082] During the specific implementation process, the operator aligns the clamping block 71 on the back side of the corresponding ink storage plate 50 with the fixed block 70, and then the fixed block 70 is plugged and installed into the clamping groove on the ink storage plate 50. At this time, a quick clamping is achieved between the ink storage plate 50 and the fixed block 70, ensuring the connection between the ink storage plate 50 and the fixed block 70. When it is necessary to replace different ink storage plates 50, pull the traction rope 75, and the traction rope 75 drives the clamping cone block 74 to hide inside the fixed block 70, so that the clamping cone block 74 is separated from the clamping block 71. At this time, the ink storage plate 50 can be separated from the fixed block 70, and then a different ink storage plate 50 can be replaced and the new ink storage plate 50 can be connected to the fixed block 70.

[0083] Looking back Figure 6 As shown, which is the structural schematic diagram of the synchronization unit 8 in this embodiment; specifically, a synchronization unit 8 for synchronously regulating the two plug hole parts 5 to process the two side surfaces of the printed circuit board A synchronously is further provided on the support frame 4. A synchronization unit 8 for synchronously regulating the two plug hole parts 5 to process the two side surfaces of the printed circuit board synchronously is further provided on the support frame 4. The synchronization unit 8 includes a T-shaped block 80, a bidirectional screw 81, a slider 83, a unidirectional air cylinder 82, and a synchronization motor 84.

[0084] The T-shaped block 80 is slidably installed in the length direction of the support frame 4, the bidirectional screw 81 is rotatably installed on the T-shaped block 80, the sliders 83 are symmetrically arranged on the bidirectional screw 81 and are slidably arranged on the T-shaped block 80. The unidirectional air cylinder 82 is installed on the slider 83, and the output end of the unidirectional air cylinder 82 faces upward. The output end of the unidirectional air cylinder 82 is connected to the fixed block 70, and the synchronization motor 84 is installed on the bidirectional screw 81.

[0085] A mover for controlling the movement of the T-shaped block 80 is provided on the support frame 4.

[0086] The main function of the synchronization unit 8 is to ensure that the two ink storage plates 50 can move synchronously, realize the synchronous processing of the via holes of the printed circuit board A, and ensure the stability of the blockage of the via holes.

[0087] First, the mover can drive the ink storage plate 50 to move along the length direction of the support frame 4. Then, the synchronous motor 84 drives the bidirectional screw 81 to rotate. The slider 83 on the bidirectional screw 81 can move relatively, so as to realize the synchronous relative movement of the two ink storage plates 50. The unidirectional cylinder 82 can drive the fixed block 70 and the ink storage plate 50 arranged at its upper end to move up and down.

[0088] Embodiment 2:

[0089] Referring to Figure 8 As shown, on the basis of Embodiment 1, in order to further ensure the stability of the curing of the plugging ink and the subsequent continuous blocking of the via holes of the printed circuit board A, the present invention proposes an opening and closing component 55. Through the opening and closing component 55, while the heating plate 60 locally heats the via holes of the printed circuit board A, it can avoid heating the inkjet tube 51 channel by heat, resulting in the curing of the plugging ink inside the inkjet tube 51 and affecting the subsequent processing of the printed circuit board A.

[0090] Specifically, an opening and closing component 55 for opening and closing the solder resist plugging ink is further arranged in the inkjet tube 51 of the ink storage plate 50. The opening and closing component 55 includes an induction sheet 550, an induction spring 551, a linkage rope 552, and an opening and closing piece 553.

[0091] The induction sheet 550 is slidably arranged on the inner wall of the inkjet tube 51. The induction spring 551 is arranged between the induction sheet 550 and the inkjet tube 51 through a protection tube. The linkage rope 552 is installed at one end of the induction sheet 550 away from the ink outlet of the inkjet tube 51. The end of the linkage rope 552 away from the induction sheet 550 slidably passes through the inkjet tube 51 and is arranged on the opening and closing piece 553. The opening and closing piece 553 is symmetrically hinged at the ink outlet of the inkjet tube 51 through a torsion spring.

[0092] In the initial state, the induction spring 551 has a certain elastic force on the induction sheet 550, making the induction sheet 550 close to the induction spring 551. However, the induction sheet 550 can slide in the inkjet tube 51. And in the initial state, the opening and closing piece 553 is in a closed state, and the two opening and closing pieces 553 block the ink outlet of the inkjet tube 51.

[0093] When the ejector 52 ejects the plug hole ink outward, the plug hole ink has a certain pressure. When the plug hole ink passes through the ink jet tube 51, the plug hole ink will squeeze the sensing piece 550, causing the linkage rope 552 on the sensing piece 550 to pull the opening and closing piece 553, so that the opening and closing piece 553 opens. At this time, the plug hole ink can be ejected outward along the ink jet tube 51, and the plug hole ink is filled into the via holes on the printed circuit board A.

[0094] Refer to Figure 11 As shown, it is the process for preparing the solder resist plug hole ink for the via holes of the printed circuit board in the present invention, including the following steps:

[0095] S1. Preparation operation: Prepare the solder resist plug hole ink for plugging the via holes of the printed circuit board A in advance, and check whether the entire equipment is operating normally.

[0096] S2. Transportation of the printed circuit board A: Place the printed circuit board A to be processed on the supporting seat 1 in sequence, then move the two supporting seats 1 relative to each other until the two supporting seats 1 limit both sides of the printed circuit board A, and then batch-transport the printed circuit board A on the supporting seat 1 through the conveyor 2, so that it enters the designated area to be processed in sequence for processing.

[0097] S3. Solder resist plug hole of the printed circuit board A: After the printed circuit board A is clamped and limited between the two supporting seats 1, the ink storage plate 50 moves relatively until the ink jet tube 51 on the ink storage plate 50 abuts against the via holes on the printed circuit board A. Subsequently, the pre-prepared solder resist plug hole ink is ejected through the ink jet tube 51, so that it is filled into several via holes on the printed circuit board A and around several via holes of the printed circuit board A, and all the via holes of the printed circuit board A are covered.

[0098] S4. Heating and curing to form a film: Start the heating plate 60. The heating plate 60 guides the heat to the periphery of several via holes of the printed circuit board A through the conduction cover 61, and simultaneously heats several via holes on the printed circuit board A through the heating plate 60, so that the solder resist plug hole ink filled in several via holes on the printed circuit board A is cured to form a film.

[0099] S5. Batch operation: For printed circuit boards A of different models, the positions and sizes of several via holes at the upper end are inconsistent. Therefore, the solder resist plug hole ink filling device corresponding to the via holes of the printed circuit board A can be quickly replaced to realize the solder resist plug hole of the via holes of printed circuit boards A of different models.

[0100] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention, and any reference signs in the claims should not be regarded as limiting the claims involved.

[0101] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A preparation process of solder mask plugging ink for printed circuit board via holes, characterized in that: It includes the following steps: S1. Preparation operation: Prepare the solder mask plugging ink for plugging the via holes of the printed circuit board in advance, and check whether the entire equipment is operating normally; S2. Transportation of printed circuit board: Transport the printed circuit boards to be processed in batches so that they enter the designated area to be processed in sequence for processing; S3. Solder mask plugging of printed circuit board: Simultaneously fill the pre-prepared solder mask plugging ink into several via holes on the printed circuit board and around several via holes of the printed circuit board, and make it cover all the via holes of the printed circuit board; S4. Heating and curing into film: Simultaneously heat-treat several via holes on the printed circuit board to cure the solder mask plugging ink filled in several via holes on the printed circuit board into a film; S5. Batch operation: Since the positions and sizes of several via holes at the upper end of printed circuit boards of different models are inconsistent, quickly replace the solder mask plugging ink filling device corresponding to the via holes of the printed circuit board to achieve solder mask plugging of the via holes of printed circuit boards of different models; It is completed in cooperation with a preparation device for solder mask plugging ink for via holes of a printed circuit board. The preparation device includes two supporting seats (1) that are symmetrically distributed up and down and are used to support the printed circuit board. A conveyor (2) for transporting the printed circuit board is arranged on the supporting seat (1). A regulator (3) for adjusting the distance between the two is arranged on both sides of the supporting seat (1), and the supporting seat (1) is arranged on a support frame (4) through the regulator (3). The support frame (4) is arranged on the ground; On the support frame (4) and on both sides of the supporting seat (1), there is a plugging part (5) for simultaneously performing solder mask plugging operations on the via holes of the printed circuit board. A curing part (6) for curing the ink used for solder mask plugging is arranged on the plugging part (5).

2. The preparation process of the solder mask plugging ink for the vias of a printed circuit board according to claim 1, wherein: The plugging part (5) includes an ink storage plate (50) that is parallel to the printed circuit board to be processed and an ink jet tube (51) that is integrally connected to the ink storage plate (50). The ink storage plates (50) are symmetrically arranged on the support frame (4), and the ink jet tubes (51) on the two ink storage plates (50) are distributed oppositely; An injector (52) for jetting ink is also arranged on the support frame (4). A connecting pipe (53) is installed on the injector (52). The end of the connecting pipe (53) far from the injector (52) is movably installed at the ink filling port (54) on the back side of the ink storage plate (50) by means of threaded connection.

3. The process for preparing solder mask plugging ink for printed circuit board via holes according to claim 1, characterized in that: The curing part (6) includes a heating plate (60) slidably installed on the ink storage plate (50) and a heat conduction cover (61) arranged on the heating plate (60) for heat conduction. The heating plate (60) is slidably installed on the ink jet tube (51) of the ink storage plate (50). The heat conduction cover (61) is arranged at the end of the heating plate (60) far from the ink storage plate (50), and the heat conduction cover (61) and the heating plate (60) are arranged through the ink jet tube (51); A power connection wire bundle (62) connected to an external power supply is installed on the heating plate (60) by means of plugging.

4. The process for preparing solder mask plugging ink for printed circuit board via holes according to claim 2, characterized in that: A replacement component (7) for quickly replacing printed circuit boards of different models is provided on the back side of the ink storage plate (50). The replacement component (7) includes a fixing block (70), a clamping block (71), a partition plate (72), a clamping spring (73), a clamping cone block (74), and a traction rope (75). The clamping block (71) is installed on the back side of the ink storage plate (50). The fixing block (70) is slidably inserted into the side of the clamping block (71) away from the ink storage plate (50). The fixing block (70) has a hollow structure. The partition plate (72) is provided in the middle of the inner side of the fixing block (70). The clamping springs (73) are symmetrically provided at both ends of the partition plate (72) and extend towards the outside of the fixing block (70). The clamping cone block (74) is provided on the side of the clamping spring (73) away from the partition plate (72), and the clamping cone block (74) slidably passes through the fixing block (70) and extends towards the outside of the fixing block (70). The inclined surface of the clamping cone block (74) is distributed towards the clamping block (71). A square groove for the clamping cone block (74) to slide is formed on the fixing block (70). Both ends of the traction rope (75) are respectively connected to the sides of the two clamping cone blocks (74) close to the clamping spring (73), and the middle of the traction rope (75) slides through the middle of the clamping spring (73) and passes through the fixing block (70) and is arranged on the upper side of the fixing block (70). A traction groove for the traction rope (75) to slide is formed on the fixing block (70).

5. The solder mask plugging ink preparation process for printed circuit board via holes according to claim 1, characterized in that: A synchronization unit (8) for synchronously regulating the two plug hole parts (5) to process both sides of the printed circuit board is further provided on the support frame (4). The synchronization unit (8) includes a T-shaped block (80), a bidirectional screw (81), a slider (83), a unidirectional air cylinder (82), and a synchronization motor (84). The T-shaped block (80) is slidably installed in the length direction of the support frame (4). The bidirectional screw (81) is rotatably installed on the T-shaped block (80). The sliders (83) are symmetrically provided on the bidirectional screw (81) and are slidably arranged on the T-shaped block (80). The unidirectional air cylinder (82) is installed on the slider (83), and the output end of the unidirectional air cylinder (82) faces upwards. The output end of the unidirectional air cylinder (82) is connected to the fixing block (70). The synchronization motor (84) is installed on the bidirectional screw (81).

6. The solder mask plugging ink preparation process for the via holes of a printed circuit board according to claim 1, characterized in that: The regulator (3) includes two sets of adjusting columns (30) and adjusting threaded rods (31) that are vertically upward and arranged on both sides of the support frame (4) along the length direction of the support frame (4) at the upper end of the support frame (4). Execution blocks (32) are installed at both ends of the support seat (1). The execution blocks (32) slidably pass through the adjusting columns (30), and the support seat (1) is connected to the adjusting threaded rod (31) in a threaded connection manner. The adjusting threaded rod (31) has a bidirectional threaded structure.

7. The solder mask plugging ink preparation process for the via holes of a printed circuit board according to claim 2, wherein: An opening and closing component (55) for opening and closing the solder resist plug hole ink is further arranged in the ink jet tube (51) of the ink storage plate (50). The opening and closing component (55) includes an induction sheet (550), an induction spring (551), a linkage rope (552) and an opening and closing sheet (553). The induction sheet (550) is slidably arranged on the inner wall of the ink jet tube (51). The induction spring (551) is arranged between the induction sheet (550) and the ink jet tube (51) through a protection tube. The linkage rope (552) is installed at one end of the induction sheet (550) far away from the ink outlet of the ink jet tube (51). One end of the linkage rope (552) far away from the induction sheet (550) slidably penetrates through the ink jet tube (51) and is arranged on the opening and closing sheet (553). The opening and closing sheet (553) is symmetrically hinged to the ink outlet of the ink jet tube (51) through a torsion spring.

8. The process for preparing solder mask plugging ink for printed circuit board via holes according to claim 1, characterized in that: The conveyor (2) includes a conveyor roller (20), a conveyor spring (21), a conveyor belt (22), a clamping roller (23), a clamping spring (24) and a conveyor motor (25). The conveyor roller (20) is rotatably installed on both sides in the length direction of the support seat (1) through the conveyor spring (21). The conveyor belt (22) is sleeved on the two conveyor rollers (20). The clamping springs (24) are arranged at equal intervals along the length direction of the support seat (1) on the inner side of the support seat (1). The clamping roller (23) is arranged on the clamping spring (24) through an auxiliary frame, and the clamping roller (23) abuts against the conveyor belt (22). The conveyor motor (25) is arranged on one of the conveyor rollers (20).

9. The preparation process of the solder mask plugging ink for the via holes of a printed circuit board according to claim 7, characterized in that: Heat insulation layers are arranged on the surfaces of the ink jet tube (51) and the opening and closing sheet (553).

10. The process for preparing solder mask plugging ink for printed circuit board via holes according to claim 1, characterized in that: A plurality of friction rollers (26) are arranged at equal intervals on the inner side of the support seat (1).

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