Laser processing system and laser processing method

Abstract

In a laser processing system, laser processing is sometimes performed in an automatic operation mode in which a robot and a laser oscillator are automatically operated in accordance with a processing program. In such automatic operation, it is required to ensure work safety. A laser processing system (10) is provided with: a laser processing head (14); a robot (12) that moves the laser processing head (14); a distance measuring sensor (56) that measures the distance between the laser processing head (14) and the workpiece; a control device (18) that controls the laser light emission operation of the laser oscillator (16) and the movement operation of the robot (12); and a mode selection switch (52) that selects an operation mode for laser processing. When the automatic operation mode is selected by the mode selection switch (52) and the distance measured by the distance measurement sensor (56) is within a predetermined range, the control device (18) executes the laser emission operation and the movement operation as the automatic operation mode.

Description

Technical Field

[0001] The present disclosure relates to a laser processing system and a laser processing method. Background Art

[0002] There is known a laser processing system for performing laser processing on a workpiece (for example, Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-167974 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In a laser processing system, laser processing is sometimes performed in an automatic operation mode in which a robot and a laser oscillator are automatically operated according to a processing program. In such an automatic operation, it is required to ensure the safety of the work.

[0008] Means for solving problems

[0009] In one embodiment of the present invention, a laser processing system for laser processing a workpiece includes: a laser processing head that emits laser light generated by a laser oscillator; a robot that moves the laser processing head relative to the workpiece; a distance sensor that measures the distance between the laser processing head and the workpiece; a control device that controls a laser emitting action that causes the laser oscillator to operate to emit laser light from the laser processing head and a moving action that causes the robot to operate to move the laser processing head relative to the workpiece; and a mode selection switch that selects an operating mode of the laser processing.

[0010] When the control device selects an automatic operation mode for automatically executing laser emitting action and moving action according to a processing program as an operation mode through a mode selection switch and the distance measured by the distance measuring sensor is within a predetermined range, the control device executes the laser emitting action and the moving action as the automatic operation mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of a laser processing system according to one embodiment.

[0012] Figure 2 yes Figure 1 Block diagram of the laser processing system shown.

[0013] Figure 3 yes Figure 1 An enlarged view of the laser processing head is shown.

[0014] Figure 4 yes Figure 1 An enlarged view of the mode selector switch is shown.

[0015] Figure 5 It is used to illustrate Figure 2 A diagram showing the functionality of the contact detection device.

[0016] Figure 6 Yes means Figure 2 A flowchart showing an example of the operation flow of the laser processing head shown.

[0017] Figure 7 Yes means Figure 6 A flowchart of an example of the process of step S2 in .

[0018] Figure 8 Yes means Figure 6 A flowchart of an example of the process of step S3 in .

[0019] Fig. 9 Yes means Figure 2 A block diagram of other functions of the laser processing system is shown.

[0020] Fig.10 Yes means Figure 6 A flowchart of another example of the process of step S3 in .

[0021] Fig.11 Yes means Figure 6 A flowchart of another example of the process of step S3 in .

[0022] Fig.12 Yes means Fig. 9 A flowchart of an example of the operation flow of the laser processing system shown.

[0023] Fig.13 It is an enlarged view of a mode selection switch according to another embodiment.

[0024] Fig.14 Yes means Fig.12 A flowchart of an example of the process of step S2 in .

[0025] Fig.15 Yes means Fig.12 A flowchart of an example of the process of step S3 in .

[0026] Fig.16 Yes means Fig.12 A flowchart of an example of the process of step S5 in .

[0027] Fig.17 An example of a mode selection switch image is shown.

[0028] Fig.18 This is a schematic diagram of a laser processing system according to another embodiment.

[0029] Fig.19 yes Fig.18 Block diagram of the laser processing system shown. DETAILED DESCRIPTION

[0030] Hereinafter, embodiments of the present disclosure will be described in detail based on the accompanying drawings. In the various embodiments described below, the same elements are marked with the same reference numerals, and repeated descriptions are omitted. Figure 1 and Figure 2 A laser processing system 10 according to one embodiment will be described. The laser processing system 10 is a system capable of performing laser processing (laser welding, laser cutting, etc.) on a workpiece W in cooperation with an operator.

[0031] Specifically, the laser processing system 10 includes a robot 12, a laser processing head 14, a laser oscillator 16, and a control device 18. The robot 12 moves the laser processing head 14 relative to the workpiece W. In the present embodiment, the robot 12 is a vertical multi-joint robot having a robot base 20, a rotating body 22, a lower arm 24, an upper arm 26, and a wrist 28.

[0032] The robot base 20 is fixed to the floor of the work unit. The rotating body 22 is provided on the robot base 20 so as to be rotatable around a vertical axis. The lower arm 24 is provided on the rotating body 22 so as to be rotatable around a horizontal axis. The upper arm 26 is rotatably provided at the front end of the lower arm 24. The wrist 28 includes: a wrist base 28a provided at the front end of the upper arm 26 so as to be rotatable around two axes orthogonal to each other; and a wrist flange 28b provided on the wrist base 28a so as to be rotatable.

[0033] A plurality of servo motors 30 are provided in each component of the robot 12 (ie, the robot base 20, the rotating body 22, the lower arm 24, the upper arm 26, and the wrist 28). Figure 2 ). These servo motors 30 rotate the movable components of the robot 12 (i.e., the rotating body 22, the lower arm 24, the upper arm 26, the wrist 28, and the wrist flange 28b) around the drive axis according to the command from the control device 18. As a result, the robot 12 moves the laser processing head 14 relative to the workpiece W.

[0034] The laser processing head 14 is detachably mounted on the wrist flange 28b of the robot 12, and emits the laser beam LB generated by the laser oscillator 16. Figure 3As shown, the laser processing head 14 includes a head body 32, a nozzle 34, a loading and unloading tool 36, and a gripping portion 38. The head body 32 is hollow, and contains optical system components such as an optical lens (collimating lens, focusing lens, etc.) and a lens driving unit (for example, a servo motor) that moves the optical lens according to a command from the control device 18.

[0035] The nozzle 34 is hollow and is disposed at the front end of the head body 32. The nozzle 34 has a truncated cone shape whose cross-sectional area decreases from the base end toward the front end, and an emission port 34a is formed at the front end. A hollow chamber is formed inside the head body 32 and the nozzle 34, and an auxiliary gas AG is supplied to the chamber from an auxiliary gas supply device (not shown) disposed outside. The laser light LB generated by the laser oscillator 16 propagates in the chamber and is emitted from the emission port 34a along the optical axis A together with the auxiliary gas AG.

[0036] The loading and unloading tool 36 is provided on the head body 32, and is loaded and unloaded relative to the wrist flange 28b of the robot 12. As an example, the loading and unloading tool 36 may also have a fastener such as a bolt, and is fastened to the wrist flange 28b by the fastener. As another example, the loading and unloading tool 36 may also have an engaging portion that is detachably engaged with an engaged portion formed on the wrist flange 28b, and is loaded and unloaded relative to the wrist flange 28b by engaging the engaged portion with the engaging portion. As another example, the loading and unloading tool 36 may also have an electromagnet, and is fixed to the wrist flange 28b by the electromagnetic force generated by the electromagnet. The laser processing head 14 is detachably mounted on the wrist flange 28b of the robot 12 via the loading and unloading tool 36.

[0037] The grip 38 is integrally provided at the base end of the head body 32 so that the operator can grip it with one hand. In order to make it easier for the operator to grip it with one hand, the grip 38 may also have concave and convex parts corresponding to the fingers of the one hand. The operator can remove the laser processing head 14 from the wrist flange 28b by gripping the grip 38, and can carry the laser processing head 14.

[0038] Reference Figure 1 and Figure 2 The laser oscillator 16 performs laser oscillation internally according to the instruction (laser power instruction, etc.) from the control device 18 to generate laser light LB. The laser oscillator 16 can be any type of laser oscillator such as a fiber laser oscillator, a pulsed laser oscillator, a direct diode laser (DDL), a CO2 laser oscillator, or a solid laser (YAG laser) oscillator. The laser oscillator 16 supplies the generated laser light LB to the laser processing head 14 via the light guide 39. The light guide 39 can be composed of light guide materials such as optical fibers, cavities, crystals, reflectors, or optical lenses.

[0039] The control device 18 controls the laser emitting operation LO for operating the laser oscillator 16 to emit the laser beam LB from the laser processing head 14 and the moving operation MO for operating the robot 12 to move the laser processing head 14 attached to the robot 12 relative to the workpiece W.

[0040] Specifically, if Figure 2 As shown, the control device 18 is a computer having a processor 40, a memory 42, and an I / O interface 44. The processor 40 has a CPU or a GPU, etc., and is communicatively connected to the memory 42 and the I / O interface 44 via a bus 46, communicates with these components, and performs various calculations for executing laser processing described later. The memory 42 has a RAM or a ROM, etc., and temporarily or permanently stores various data used in the calculations performed by the processor 40 and various data generated in the middle of the calculations.

[0041] The I / O interface 44 has, for example, an Ethernet (registered trademark) port, a USB port, an optical fiber connector, or an HDMI (registered trademark) terminal, and communicates data with external devices by wire or wirelessly under the instruction from the processor 40. The robot 12 (specifically, each servo motor 30), the laser processing head 14 (specifically, the lens driving unit), and the laser oscillator 16 are connected to the I / O interface 44 in a communicable manner.

[0042] The control device 18 is further provided with an input device 48 and a display device 50. The input device 48 includes a keyboard, a mouse, a touch panel, etc., and receives data input from an operator. The display device 50 includes a liquid crystal display, an organic EL display, etc., and displays various data.

[0043] The input device 48 and the display device 50 are connected to the I / O interface 44 in a manner that allows for wired or wireless communication. In addition, the input device 48 and the display device 50 may be integrally assembled in the housing of the control device 18, or, for example, may be separately provided from the housing of the control device 18 as a computer (PC, etc.).

[0044] The laser processing system 10 also includes a mode selection switch 52, a force sensor 54 ( Figure 2 ), a distance measuring sensor 56, an input device 58, and a contact detection device 60. The mode selection switch 52 is used to select an operation mode DM of laser processing executed by the control device 18. In the present embodiment, the mode selection switch 52 is provided integrally with the control device 18.

[0045] More specifically, if Figure 4As shown, the mode selection switch 52 is configured to be able to switch the operation mode DM between an automatic operation mode DM1 indicated as "AUTO" and a manual operation mode DM2 indicated as "MANUAL". The automatic operation mode DM1 is an operation mode DM in which the processor 40 of the control device 18 automatically performs the laser emitting operation LO and the moving operation MO according to the processing program PP generated in advance.

[0046] Specifically, upon receiving the automatic operation start command CM1 described later, the processor 40 sequentially generates commands for the laser oscillator 16 according to the processing program PP, operates the laser oscillator 16 according to the commands, and automatically executes the laser emission operation LO in which the laser processing head 14 emits the laser beam LB.

[0047] Together with the laser emission action LO, the processor 40 generates instructions (position instructions, speed instructions, torque instructions, etc.) to the robot 12 (specifically, each servo motor 30) in sequence according to the processing program PP, and moves the robot 12 according to the instructions, automatically executing the moving action MO of moving the laser processing head 14 relative to the workpiece W.

[0048] The processing program PP is generated by an operator and stored in advance in the memory 42. The processing program PP may include a first processing program PP that specifies the operation of the laser oscillator 16. A and a second processing program PP that specifies the motion of the robot 12 B .

[0049] On the other hand, the manual operation mode DM2 is an operation mode DM in which the operator holds the laser processing head 14 by hand to carry it, and causes the control device 18 to manually perform the laser emission action LO, and manually laser processes the workpiece W using the laser LB emitted from the laser processing head 14. In the manual operation mode DM2, the operator manually provides a manual laser emission command CM2 described later to the control device 18, and the processor 40 of the control device 18 executes the laser emission action LO according to the manual laser emission command CM2.

[0050] The operator can switch the operation mode DM between the automatic operation mode DM1 and the manual operation mode DM2 by operating the mode selection switch 52. Figure 4 The state in which the automatic operation mode DM1 (“automatic”) is selected by the mode selection switch 52 is shown.

[0051] When the automatic operation mode DM1 is selected by the mode selection switch 52, the mode selection switch 52 supplies the automatic operation mode transfer command CM3 to the control device 18. On the other hand, when the manual operation mode DM2 is selected by the mode selection switch 52, the mode selection switch 52 supplies the manual operation mode transfer command CM4 to the control device 18. In addition, the automatic operation mode transfer command CM3 and the manual operation mode transfer command CM4 may also be on (ON) / off (OFF) signals (for example, the automatic operation mode transfer command CM3: on signal or "1" signal, the manual operation mode transfer command CM4: off signal or "0" signal).

[0052] Force sensor 54( Figure 2 ) is provided in the robot 12 to detect the external force F applied to the robot 12. As an example, the force sensor 54 is provided in each servo motor 30 of the robot 12 and has a plurality of torque sensors 54A for respectively detecting the torque applied to the output shaft of the servo motor 30.

[0053] As another example, the force sensor 54 has a six-axis force sensor 54B, which is provided in a component of the robot 12 (e.g., the robot base 20 or the wrist 28) and can detect forces in six-axis directions. The processor 40 of the control device 18 can obtain the magnitude and direction of the external force F applied to the robot 12 based on the detection data DF of the force sensor 54, and can determine the part of the robot 12 (e.g., the wrist 28) to which the external force F is applied.

[0054] The distance measuring sensor 56 measures the distance d between the laser processing head 14 (for example, the emission port 34a) and the workpiece W. Specifically, the distance measuring sensor 56 is, for example, a capacitance type, an infrared type, a laser type, or a sound wave type (for example, an ultrasonic type) distance measuring sensor. For example, in the case of the capacitance type, the distance measuring sensor 56 is provided in the head body 32 (or the nozzle 34) to measure the distance to the object located at the position closest to the laser processing head 14.

[0055] On the other hand, in the case of an infrared type, a laser type, or an acoustic wave type, the distance measuring sensor 62 is mounted on the head body 32 (or the nozzle 34) of the laser processing head 14 in such a manner that the measurement direction D for measuring the distance d to the object (in other words, the radiation direction of the infrared ray, the laser, or the acoustic wave) is parallel to the optical axis A. That is, in this case, the distance measuring sensor 56 measures the distance d between the laser processing head 14 (the emission port 34a) and the workpiece W in the direction of the optical axis A.

[0056] The input device 58 receives an input operation of a manual laser emission instruction CM2 for causing the processor 40 of the control device 18 to execute the laser emission operation LO. Specifically, the input device 58 includes a button, a switch, a touch panel, etc., which the operator can input by hand, and is provided on the laser processing head 14 (for example, the head body 32 or the grip 38). When the input device 58 receives the input operation of the operator, it supplies the manual laser emission instruction CM2 to the control device 18. In addition, the manual laser emission instruction CM2 may also be an on signal (or a "1" signal).

[0057] When the processor 40 of the control device 18 receives the manual laser emission instruction CM2 during the execution of the manual operation mode DM2, the laser emission operation LO is executed according to the manual laser emission instruction CM2. In this way, as the manual operation mode DM1, the operator can manually laser process the workpiece W using the laser LB emitted from the emission port 34a of the laser processing head 14 while carrying the laser processing head 14 by hand. In addition, in the present embodiment, the input device 58 is provided adjacent to the grip 38 on the laser processing head 14 so that the operator can perform input operations with one hand holding the grip 38.

[0058] The contact detection device 60 detects whether the laser processing head 14 is in contact or non-contact with the workpiece W. Specifically, the contact detection device 60 includes a conductive cable 60a and a resistance sensor 60b ( Figure 2 , Figure 5 One end of the conductive cable 60a is electrically connected to the head body 32 of the laser processing head 14, and the other end is electrically connected to the workpiece W, thereby electrically connecting the laser processing head 14 and the workpiece W.

[0059] Here, in this embodiment, at least a portion of the head body 32 and the nozzle 34 of the laser processing head 14 are made of a conductive material (for example, metal). In addition, the workpiece W is made of metal (for example, iron or copper). Therefore, assuming that when the tip of the nozzle 34 of the laser processing head 14 contacts the workpiece W, as shown in FIG. Figure 5 As shown, a closed loop 62 is formed by the workpiece W, the head body 32 and the nozzle 34 of the laser machining head 14, and the conductive cable 60a.

[0060] The resistance sensor 60b measures the resistance R of the closed loop 62 by applying a voltage to the closed loop 62. Figure 5 As shown, when the laser processing head 14 is in contact with the workpiece W, the resistance R measured by the resistance sensor 60b is a very small value R0 (R0≈0). On the other hand, when the laser processing head 14 is not in contact with the workpiece W (that is, the front end of the nozzle 34 is separated from the workpiece W), the resistance R measured by the resistance sensor 60b is a very large value R1 (R1≈∞>>R0).

[0061] The contact detection device 60 can detect whether the laser processing head 14 is in contact or out of contact with the workpiece W based on the resistance R measured by the resistance sensor 60b. The resistance sensor 60b provides the control device 18 with measurement data of the measured resistance R or contact determination data indicating whether the laser processing head 14 is in contact or out of contact with the workpiece W as detection data DD.

[0062] The processor 40 of the control device 18 can determine whether the laser processing head 14 is in contact or non-contact with the workpiece W based on the detection data DD of the resistance sensor 60b. In addition, the resistance sensor 60b can also be built into the head body 32. In addition, the force sensor 54, the distance sensor 56, the input device 58 and the contact detection device 60 (resistance sensor 60b) can also be connected to the I / O interface 44 of the control device 18 in a wireless or wired manner.

[0063] Next, refer to Figure 6 The operation of the laser processing system 10 is described below. When the processor 40 of the control device 18 receives an operation start instruction (e.g., a power-on instruction) from an operator, a host controller, or an operation program OP, the processor 40 starts the operation. Figure 6 process.

[0064] In step S1, the processor 40 determines whether the automatic operation mode DM1 is selected by the mode selection switch 52. Specifically, the processor 40 determines whether the automatic operation mode transfer command CM3 or the manual operation mode transfer command CM4 is received from the mode selection switch 52. The processor 40 determines "yes" when the automatic operation mode transfer command CM3 is received, and proceeds to step S2. On the other hand, the processor 40 determines "no" when the manual operation mode transfer command CM4 is received, and proceeds to step S3.

[0065] In step S2, the processor 40 shifts the operation mode DM to the automatic operation mode DM1 and executes the process of the automatic operation mode DM1. After shifting to the automatic operation mode DM1, the processor 40 becomes capable of receiving the automatic operation start command CM1, while rejecting the manual laser emission command CM2 supplied from the input device 58. Figure 7 The flow of the automatic operation mode DM1 in step S2 will be described.

[0066] In step S11 , processor 40 determines whether automatic operation start command CM1 for starting automatic operation in automatic operation mode DM1 has been received. Specifically, processor 40 generates automatic operation start image IM1 (not shown) showing a button image for starting automatic operation, and displays it on display device 50 .

[0067] The operator can input the automatic operation start command CM1 to the processor 40 by clicking the button image displayed on the automatic operation start image IM1 on the image by the input device 48 of the operation control device 18. The processor 40 determines "yes" when receiving the automatic operation start command CM1 and proceeds to step S14. On the other hand, when the determination is "no", the processor 40 proceeds to step S12.

[0068] In step S12, the processor 40 determines whether an action end instruction (e.g., a shutdown instruction) has been received from the operator, the upper controller, or the action program OP. The processor 40 determines "yes" when receiving the action end instruction, and ends the operation. Figure 7 The process of step S2 shown in the figure ends here. Figure 6 On the other hand, when the processor 40 makes a "No" determination, the process proceeds to step S13.

[0069] In step S13, the processor 40 determines whether the automatic operation mode DM1 is still selected by the mode selection switch 52. If the determination is "yes", the processor 40 returns to step S11. On the other hand, if the determination is "no" (that is, the mode selection switch 52 is operated to switch to the manual operation mode DM2), the processor 40 enters step S13. Figure 6 Step S3 in .

[0070] On the other hand, if the determination in step S11 is "yes", in step S14, the processor 40 starts the operation of obtaining the external force F applied to the robot 12 and the operation of obtaining the distance d between the laser processing head 14 and the workpiece W. Specifically, the processor 40 continuously (for example, periodically) obtains the detection data DF from the force sensor 54, and continuously obtains the external force F applied to the robot 12 based on the detection data DF. In addition, the processor 40 continuously (for example, periodically) obtains the distance d between the laser processing head 14 and the workpiece W measured by the distance measuring sensor 56. In this way, the processor 40 monitors the external force F and the distance d after starting step S14.

[0071] In step S15, processor 40 determines whether automatic operation mode DM1 is still selected by mode selection switch 52, similarly to step S13. Processor 40 proceeds to step S16 when the determination is "yes", and proceeds to step S25 when the determination is "no".

[0072] In step S16, the processor 40 determines whether the most recently acquired distance d between the laser processing head 14 and the workpiece W is within a predetermined range RG. For example, the range RG may be determined as d≤d th (For example, th=3[mm]), or can also be determined as [d th1 , d th2 ](For example, d th1 =0.1[mm], d th2 =3[mm]) (i.e., d th1 ≤d≤d th2 ). The processor 40 determines “yes” when the distance d is within the range RG and proceeds to step S17. On the other hand, the processor determines “no” when the distance d is outside the range RG and proceeds to step S23.

[0073] In step S17, the processor 40 starts automatic operation. Specifically, the processor 40 reads out and executes the processing program PP from the memory 42, and sequentially generates instructions for the laser oscillator 16 and instructions for the robot 12 according to the processing program PP. In this way, the processor 40 starts automatic operation of automatically executing the laser emitting operation LO and the moving operation MO according to the processing program PP.

[0074] Thus, in this embodiment, the processor 40 executes the laser emission action LO and the moving action MO as the automatic operation mode DM1 when the conditions are met that the automatic operation mode DM1 is selected by the mode selection switch 52 (judged as "Yes" in step S15) and the distance d measured by the ranging sensor 56 is within the range RG (judged as "Yes" in step S16).

[0075] In step S18, processor 40 determines whether automatic operation mode DM1 is still selected by mode selection switch 52, similarly to step S13. Processor 40 proceeds to step S19 when determining "yes", and proceeds to step S24 when determining "no".

[0076] In step S19, similarly to step S16, the processor 40 determines whether the most recently acquired distance d between the laser machining head 14 and the workpiece W is within the range RG. The processor 40 proceeds to step S20 if the determination is "yes", and proceeds to step S22 if the determination is "no".

[0077] In step S20, the processor 40 determines whether the most recently acquired external force F exceeds a preset threshold value F th1 (F>F th1 ). Processor 40 is in the state where F>F th1 If it is determined to be "yes", the process goes to step S22. On the other hand, if F≤F th1 If the result is "No", the process goes to step S21.

[0078] In addition, the processor 40 may also monitor the external force F1 applied to a specific part (e.g., the upper arm 26 or the wrist 28) of the robot 12 according to the detection data DF of the force sensor 54. In step S20, when the external force F1 exceeds the threshold value F1 th1 (F1>F1 th1 ), it is judged as "yes".

[0079] In step S21, the processor 40 determines whether the automatic operation is completed. For example, the processor 40 can determine whether all the command codes for the laser emitting operation LO and the moving operation MO specified in the processing program PP are executed based on the processing program PP being executed.

[0080] The processor 40 returns to step S12 when it is determined to be "yes", and returns to step S18 when it is determined to be "no". In this way, the processor 40 repeatedly executes the loop of steps S18 to S21, and continues to execute the laser emitting action LO and the moving action MO as the automatic operation mode DM1 until it is determined to be "no" in step S18 or S19 or "yes" in step S20 or S21.

[0081] On the other hand, if it is determined as "No" in step S19 or "Yes" in step S20, in step S22, the processor 40 stops at least one of the laser emission operation LO and the movement operation MO in the automatic operation mode DM1. As an example, the processor 40 stops both the laser emission operation LO and the movement operation MO in step S22.

[0082] Specifically, the processor 40 stops the operation of the servo motors 30 of the robot 12 by stopping the instructions (torque instructions, etc.) to the servo motors 30, thereby stopping the moving action MO. Alternatively, in the case where a braking mechanism is provided for braking the output shaft of each servo motor 30, the processor 40 may also stop the operation of each servo motor 30 by actuating each braking mechanism, thereby stopping the moving action MO.

[0083] In addition, the processor 40 stops the laser emission operation LO by stopping the laser generating operation of the laser oscillator 16. Alternatively, when the laser oscillator 16 is provided with a shutter (not shown) that automatically opens and closes the optical path of the laser LB, the processor 40 may stop the laser emission operation LO by shielding the laser LB with the shutter.

[0084] As another example, the processor 40 may stop the laser emission action LO in step S22 after the judgment is "No" in step S19, and continue the moving action MO on the other hand, or stop both the laser emission action LO and the moving action MO in step S22 after the judgment is "Yes" in step S20.

[0085] Thus, in the present embodiment, the robot 12 is a collaborative robot capable of emergency stopping the moving action MO according to the external force F detected by the force sensor 54. In the case of such a collaborative robot capable of emergency stopping, even if it is determined as "No" in step S19, the safety of the operator can be ensured by simply stopping the laser emission action LO.

[0086] In step S23, the processor 40 generates an alarm signal AL. For example, in step S23 after a "No" determination in step S16 or S19, the processor 40 generates an image or sound alarm signal AL1 such as "The workpiece may not be properly positioned relative to the laser processing head. Please confirm the setting status of the workpiece."

[0087] On the other hand, in step S23 after the judgment of "yes" in step S20, the processor 40 generates a warning signal AL2 of image or sound, such as "The robot may interfere with the environment. Please check the robot's surroundings." The processor 40 may also display the generated warning signal AL1 or AL2 as an image on the display device 50, or output it as a sound from a speaker (not shown) provided in the control device 18. After step S23, the processor 40 returns to step S12.

[0088] On the other hand, if the determination result in step S18 is "No", in step S24, the processor 40 stops at least one of the laser emission operation LO and the movement operation MO in the same manner as in step S22. For example, the processor 40 stops both the laser emission operation LO and the movement operation MO in step S24.

[0089] In step S25, the processor 40 generates a warning signal AL. For example, the processor 40 generates a warning signal AL3 with an image or sound such as "Automatic operation cannot be performed because the operation mode has been changed." The processor 40 may also display the generated warning signal AL3 as an image on the display device 50 or output it as a sound from the speaker. After step S25, the processor 40 enters Figure 6 Step S3 in .

[0090] Refer again Figure 6 In the case where the judgment in step S1 is "No" (or Figure 7In a case where the determination result in step S13 in the process is “NO” or after step S25), the processor 40 shifts the operation mode DM to the manual operation mode DM2 in step S3 and executes the process of the manual operation mode DM2.

[0091] After the transition to the manual operation mode DM2, the processor 40 becomes capable of receiving the manual laser emission command CM2 supplied from the input device 58, while rejecting the automatic operation start command CM1. Figure 8 The flow of the manual operation mode DM2 in step S3 will be described.

[0092] In step S31, the processor 40 starts the operation of detecting contact or non-contact between the laser processing head 14 and the workpiece W by the contact detection device 60. Specifically, the processor 40 causes the resistance sensor 60b to measure the resistance R and starts the operation of continuously (eg, periodically) acquiring the detection data DD from the resistance sensor 60b.

[0093] In step S32, the processor 40 determines whether the manual laser emission instruction CM2 is received from the input device 58. When the processor 40 receives the manual laser emission instruction CM2 from the input device 58, it determines "yes" and proceeds to step S33. On the other hand, when it determines "no", it does not perform the laser emission action LO in the manual operation mode DM2 and proceeds to step S41. It is assumed that the laser emission action LO of step S35 described later is performed at the start time point of this step S32, and when it is determined "no" in this step S32, the processor 40 stops the laser emission action LO.

[0094] In step S33, the processor 40 determines whether the automatic operation mode DM1 is selected by the mode selection switch 52 in the same manner as in the above-mentioned step S1. When the processor 40 determines "yes" (that is, when the mode selection switch 52 is switched to the automatic operation mode DM1), the process proceeds to step S37. On the other hand, when the processor 40 determines "no" (that is, when the manual operation mode DM2 is still selected by the mode selection switch 52), the process proceeds to step S34.

[0095] In step S34, the processor 40 determines whether the laser processing head 14 is in contact with the workpiece W. Specifically, the processor 40 determines whether the contact detection device 60 detects contact or non-contact between the laser processing head 14 and the workpiece W based on the detection data DD most recently acquired from the resistance sensor 60b. When the processor 40 detects that the laser processing head 14 is in contact with the workpiece W, it determines "yes" and proceeds to step S35. On the other hand, when the processor 40 detects that the laser processing head 14 is not in contact with the workpiece W, it determines "no" and proceeds to step S39.

[0096] In step S35, the processor 40 executes the laser emitting operation LO as the manual operation mode DM2 according to the manual laser emitting command CM2 received through the input device 58. Here, in the present embodiment, the processing condition C of the workpiece W in the manual operation mode DM2 is P The output condition C of the laser beam LB emitted in the laser emission operation LO of the manual operation mode DM2 is O The data table DT storing the data in association with each other is stored in advance in the memory 42 .

[0097] Processing conditions C P For example, the material (SUS, aluminum, etc.), thickness [mm], and melting point [°C] of the workpiece W. On the other hand, the output condition C O For example, it includes the laser power [kW], duty cycle [%] and pulse oscillation frequency [Hz] of the laser LB. The data table DT will output the condition C O (laser power, duty cycle, pulse oscillation frequency) and multiple processing conditions C P Each of (material, thickness, melting point) is stored in association with each other.

[0098] The processor 40 pre-sets the output condition C in the manual operation mode DM2 based on the data table DT. O As an example, the operator can manually select the machining condition C corresponding to the workpiece W to be machined from the data table DT. P (e.g. material and thickness) corresponding output conditions C O In this case, the processor 40 may also generate an image of the data table DT and display it on the display device 50 .

[0099] The operator visually recognizes the image of the data table DT and operates the input device 48 of the control device 18 to search and select the processing condition C corresponding to the workpiece W to be processed from the data table DT. P The corresponding output condition C O The processor 40 receives the operator's input through the input device 48 and selects the output condition C from the data table DT. O Set the output conditions in manual operation mode DM2.

[0100] As another example, the operator may operate the input device 48 to input the machining conditions C of the workpiece W to be machined. P In this case, the processor 40 automatically retrieves from the data table DT the processing conditions C input by the operator through the input device 48. P The corresponding output condition C O , the retrieved output condition C OThe output condition C in the manual operation mode DM2 is set. In this way, the processor 40 pre-sets the output condition C in the manual operation mode DM2 based on the data table DT. O .

[0101] In step S35, the processor 40 performs the manual laser emission instruction CM2 according to the preset output condition C O To generate a command for the laser oscillator 16, execute the laser emission action LO, and generate a signal having the output condition C O As a result, the operator can emit the laser beam LB with the desired output condition C from the laser processing head 14 held in one hand. O Laser LB is used to manually laser process the workpiece.

[0102] In step S36, the processor 40 determines whether the operation end instruction has been received in the same manner as in step S12. If the processor 40 determines that the operation end instruction is received, the operation end instruction is terminated. Figure 8 The process of step S3 shown in the figure ends here. Figure 6 On the other hand, when the determination result is "No", the processor 40 returns to step S32.

[0103] Thus, the processor 40 repeatedly executes the loop of steps S32 to S36 until it is determined as "yes" in step S33 or S36 or "no" in step S34, and continues to execute the laser emitting operation LO as the manual operation mode DM2 while the processor 40 determines as "yes" in step S32 (i.e., while receiving the manual laser emitting instruction CM2 from the input device 58). Thus, the operator can manually perform laser processing on the workpiece W using the laser processing head 14 held by hand.

[0104] On the other hand, if the determination in step S33 is "yes", in step S37, the laser emission operation LO in the manual operation mode DM2 is stopped. For example, the processor 40 stops the laser generation operation of the laser oscillator 16 or blocks the laser LB with the shutter, thereby stopping the laser emission operation LO.

[0105] In step S38, the processor 40 generates a warning signal AL. For example, the processor 40 generates a warning signal AL4 with an image or sound such as "manual operation cannot be performed because the operation mode has been changed." The processor 40 may also display the generated warning signal AL4 as an image on the display device 50 or output it as a sound from the speaker. After step S38, the processor 40 enters Figure 6 Step S2 in .

[0106] On the other hand, if the determination in step S34 is "No", in step S39, the processor 40 stops the laser emission operation LO in the manual operation mode DM2 in the same manner as in the above-mentioned step S37. Then, in step S40, the processor 40 generates a warning signal AL. For example, the processor 40 generates a warning signal AL5 of an image or sound such as "The laser processing head may be away from the workpiece. Please make the laser processing head contact the workpiece", and displays it on the display device 50 or outputs it from the speaker. After step S40, the processor 40 returns to step S32.

[0107] On the other hand, if the determination result in step S32 is "No", in step S41, the processor 40 determines whether the automatic operation mode DM1 is selected by the mode selection switch 52 in the same manner as in step S33 described above. If the determination result in step S32 is "Yes", the processor 40 proceeds to step S41. Figure 6 On the other hand, if the determination result is "No", the process proceeds to step S36.

[0108] As described above, in the present embodiment, the control device 18 (specifically, the processor 40) selects the automatic operation mode DM1 (judged as "yes" in step S15 or S18) for automatically executing the laser emission action LO and the moving action MO according to the processing program PP as the operation mode DM through the mode selection switch 52, and when the distance d measured by the ranging sensor 56 is within the predetermined range RG (judged as "yes" in step S16 or S19), the laser emission action LO and the moving action MO are executed as the automatic operation mode DM1.

[0109] That is, in this embodiment, in order for the control device 18 to perform automatic operation of the laser emission action LO and the moving action MO under the automatic operation mode DM1, the operator needs to meet the following two conditions: manually operate the mode selection switch 52 to select the automatic operation mode DM1, and set the workpiece W at an appropriate position relative to the laser processing head 14 at a distance d within the range RG.

[0110] According to this configuration, it is possible to reliably avoid the laser emitting operation LO of the automatic operation mode DM1 being accidentally performed and the laser LB being emitted from the laser processing head 14 in an unintended direction other than the workpiece W (for example, the operator's direction) during the laser emitting operation LO. Therefore, the automatic operation of the laser processing system 10 can be performed safely.

[0111] In addition, in the present embodiment, the input device 58 receives an input operation of a manual laser emission command CM2 for causing the control device 18 to execute the laser emission operation LO. In addition, the contact detection device 60 detects contact or non-contact between the laser processing head 14 and the workpiece W. In addition, the mode selection switch 52 is configured to be able to switch the operation mode DM1 between the automatic operation mode DM1 and the manual operation mode DM2.

[0112] When the manual operation mode DM2 is selected by the mode selection switch 52 and the contact detection device 60 detects contact between the laser machining head 14 and the workpiece W, the control device 18 executes the laser emission action LO as the manual operation mode DM2 according to the manual laser emission command CM2 received through the input device 58 .

[0113] That is, in this embodiment, in order for the control device 18 to execute the laser emitting operation LO in the manual operation mode DM2 , the operator needs to manually operate the mode selection switch 52 to select the manual operation mode DM2 and bring the laser machining head 14 into contact with the workpiece W to meet the following two conditions.

[0114] This configuration can reliably prevent the laser emitting operation LO of the manual operation mode DM2 from being accidentally performed and the laser processing head 14 from emitting laser light LB in a direction other than the workpiece W (eg, toward the operator) during the laser emitting operation LO. Therefore, the operator can safely perform manual laser processing.

[0115] In addition, in this embodiment, the contact detection device 60 has: a conductive cable 60a, which electrically connects the laser processing head 14 and the workpiece W; and a resistance sensor 60b, which measures the resistance R of a closed loop 62 formed by the workpiece W, the laser processing head 14 in contact with the workpiece W, and the conductive cable 60a.

[0116] Thus, the contact detection device 60 is configured to detect contact or non-contact between the laser machining head 14 and the workpiece W based on the resistance R measured by the resistance sensor 60b. According to this configuration, contact or non-contact between the laser machining head 14 and the workpiece W can be detected quickly and reliably with a relatively simple configuration.

[0117] In addition, in the present embodiment, when the control device 18 performs the laser emission action LO in the manual operation mode DM2, the laser emission action LO is stopped when the mode selection switch 52 is operated to make the manual operation mode DM2 non-selected (judged as "yes" in step S33) or the contact detection device 60 detects non-contact (judged as "no" in step S34).

[0118] According to this structure, when the laser emission action LO is performed in the manual operation mode DM2, if the mode selection switch 52 is accidentally switched to other operation modes DM (specifically, automatic operation mode DM1), the laser LB from the laser processing head 14 can be prevented from being emitted in an unintended direction (for example, in the direction of the operator).

[0119] Furthermore, when the laser emitting operation LO is executed in the manual operation mode DM2, the laser machining head 14 is separated from the workpiece W, and the laser LB from the laser machining head 14 can be prevented from being emitted in an unintended direction. Thus, the safety of the operator in the manual operation mode DM1 can be more reliably ensured.

[0120] In addition, in the present embodiment, the laser processing head 14 has a grip 38 that the operator can hold with one hand, and the input device 58 is provided adjacent to the grip 38 on the laser processing head 14 in such a manner that the input operation can be performed with the single hand holding the grip 38. According to this structure, the operator holds the grip 38 with one hand and removes the laser processing head 14 from the robot 12, and operates the input device 58 with the single hand, thereby making it easy to perform the laser emitting action LO in the manual operation mode DM1.

[0121] In addition, in the present embodiment, when the control device 18 receives the automatic operation start command CM1 for starting the automatic operation mode DM1 (determined as "yes" in step S11), the automatic operation mode DM1 is not selected by the mode selection switch 52 (determined as "no" in step S15), or the distance d measured by the distance measuring sensor 56 is outside the range RG (determined as "no" in step S16), at least one (for example, both) of the laser emission action LO and the movement action MO is not started as the automatic operation mode DM1. According to this structure, the safety of the operator when starting the automatic operation can be reliably ensured.

[0122] When receiving the automatic operation start command CM1 , the processor 40 can start the laser emitting operation LO or the moving operation MO as the automatic operation mode DM1 even if the automatic operation mode DM1 is not selected by the mode selection switch 52 or the distance d is outside the range RG.

[0123] Specifically, when the robot 12 is a collaborative robot capable of emergency stop as described above, even if the automatic operation mode DM1 is not selected by the mode selection switch 52, or the distance d is outside the range RG, the operator's safety can be ensured even if the moving action MO is started in the automatic operation mode DM1. Alternatively, assuming that the operator is outside a safety fence (not shown) provided in the work unit so as to surround the range of motion of the robot 12, the operator's safety can be ensured even if the laser emitting action LO is started in the automatic operation mode DM1.

[0124] In addition, in the present embodiment, when the control device 18 performs the laser emitting action LO and the moving action MO as the automatic operation mode DM1, if the mode selection switch 52 is operated to make the automatic operation mode DM1 non-selected (determined as "No" in step S18), or the distance d measured by the distance measuring sensor 56 is outside the range RG (determined as "No" in step S19), at least one of the laser emitting action LO and the moving action MO is stopped (steps S22, S24). According to this structure, the safety of the operator in the automatic operation can be reliably ensured.

[0125] In addition, the input device 58 and the contact detection device 60 may be omitted from the laser processing system 10. In addition, it may be configured so that only the automatic operation mode DM1 is set as the operation mode DM, and the mode selection switch 52 can select the automatic operation mode DM1 and the off mode in which no operation mode DM is selected. In this case, the processor 40 may also execute only the process of the automatic operation mode DM1 in step S2.

[0126] In addition, steps S15 and S16 may be omitted from the process of step S2. Alternatively, steps S18 and S19 may be omitted from the process of step S2. In addition, the contact detection device 60 is not limited to the form having the conductive cable 60a and the resistance sensor 60b, and may have any sensor such as a proximity sensor capable of detecting the contact between the laser processing head 14 and the workpiece W.

[0127] In addition, the processor 40 may also execute the collaborative action program COP during the execution of the manual operation mode DM2, and the collaborative action program COP causes the robot 12 to perform a collaborative action for assisting the operator's manual laser processing. The collaborative action program COP may also be configured, for example, to cause the robot 12 to perform a collaborative action of holding the workpiece W and moving it (for example, rotating it) or loading the workpiece W into a fixture while the operator manually performs the laser processing.

[0128] In this case, a robot hand capable of holding the workpiece W may be mounted on the wrist 28 of the robot 12 in addition to (or in place of) the laser processing head 14. According to this configuration, the operator can cooperate with the robot 12 to efficiently perform manual laser processing.

[0129] Next, refer to Fig. 9 1 to illustrate other functions of the laser processing system 10. In the present embodiment, the control device 18 further includes a timing unit 64. The timing unit 64 is communicatively connected to the processor 40 via the bus 46, and measures the elapsed time t from a certain time point according to an instruction from the processor 40. In addition, the timing unit 64 may also be built into the housing of the control device 18. Alternatively, the timing unit 64 may be externally placed in the housing of the control device 18 as an electronic clock, for example, and connected to the I / O interface 44.

[0130] As Figure 6 Step S3 in Fig. 9 The processor 40 of the control device 18 shown executes Fig.10 In addition, Fig.10 In the process shown, Figure 8 Here, in the present embodiment, the processor 40 pre-sets the waiting time t0 from the time t0 when the contact detection device 60 detects the non-contact between the laser processing head 14 and the workpiece W (that is, the judgment is "No" in step S34) to the time t1 when the laser emitting action LO is stopped in step S39. th1 .

[0131] For example, the operator operates the input device 48 of the control device 18 to input the waiting time t th1 (For example, t th1 =0.3[sec]). The processor 40 converts the input standby time t th1 The processor 40 sets the waiting time t in advance. th1 .

[0132] exist Fig.10 In step S3 shown, if the processor 40 determines "No" in step S34, the processor 40 starts counting the elapsed time t in step S42. Specifically, the processor 40 activates the timing unit 64 to start counting the elapsed time t from the time point t0 when the processor 40 determines "No" in step S34.

[0133] In step S43, the processor 40 determines whether the elapsed time t measured by the timer 64 has reached the preset waiting time t th1 (i.e., t ≥ t th1). The processor 40 performs the following operations at t≥t th1 If the judgment is "yes", the process goes to step S39. On the other hand, when t<t th1 If the judgment is "No", the process goes to step S44.

[0134] In step S44, similarly to the above-mentioned step S34, the processor 40 determines whether the contact detection device 60 detects that the laser processing head 14 is in contact with the workpiece W. If the determination is "yes", the processor 40 returns to step S32, and on the other hand, if the determination is "no" (that is, if the laser processing head 14 and the workpiece W are still not in contact), the processor 40 returns to step S43.

[0135] The technical significance of steps S42 to S44 is described below. According to steps S42 to S44, after executing step S35, the processor 40 continues the laser emission action LO (i.e., continues to judge as "yes" in step S32), and if the judgment in step S34 is "no", after the waiting time t0 from the time point t0 when the judgment in step S34 is "no" has passed, the processor 40 will continue the laser emission action LO (i.e., continues to judge as "yes" in step S32), and continues the laser emission action LO. th1 Before that (ie, before the determination of “YES” in step S43 ), step S39 is not executed (in other words, the laser emitting operation LO is continued).

[0136] Then, the processor 40 waits for a period of time t th1 If the determination result in step S44 is "No" (i.e., during the period t th1 If the laser processing head 14 is continuously detected to be out of contact with the workpiece W within a certain period of time, the laser emitting operation LO is stopped in step S39. th1 If the determination result in step S44 is "YES", the processor 40 does not execute step S39 but continues the laser emitting operation LO.

[0137] As described above, in this embodiment, the control device 18 sets the waiting time t0 from the time point t0 when the contact detection device 60 detects non-contact to the time when the laser emission operation LO is executed in the manual operation mode DM1 until the laser emission operation LO is stopped. th1 Then, the control device 18 waits for a waiting time t to elapse from the time point t0. th1 When the laser emission operation LO in the manual operation mode DM2 is stopped.

[0138] Here, in the manual operation mode DM2 , the operator may perform laser processing using the laser light LB emitted from the laser processing head 14 while moving the laser processing head 14 relative to the workpiece W while bringing the tip of the laser processing head 14 into contact with the workpiece W.

[0139] In this case, for example, the laser processing head 14 can be separated from the workpiece W instantly (for example, 0.1 [sec]) by the concavo-convex portion on the surface of the workpiece W. In this way, even if the laser processing head 14 is separated from the workpiece W instantly, the possibility of the laser light LB from the laser processing head 14 being emitted in the direction of the operator is low, so the safety of the operator can be ensured.

[0140] According to the present embodiment, by setting the waiting time t until the laser emitting operation LO is stopped in step S39, th1 Even if the laser processing head 14 and the workpiece W are separated momentarily as described above, the laser emitting operation LO can be continued. th1 When it is still detected that the laser machining head 14 is out of contact with the workpiece W, the laser emitting operation LO can be stopped by immediately executing step S39. Therefore, according to this embodiment, the laser machining operation in the manual operation mode DM2 can be performed efficiently and the safety of the operator can be reliably ensured.

[0141] Next, refer to Fig.11 ,right Fig. 9 In the present embodiment, the processor 40 performs the other steps of step S3 executed by the control device 18 in addition to the above-mentioned standby time t th1 In addition, a second waiting time t0 from the time point t0 when the determination is "No" in step S34 to the time point when the warning signal AL is generated in step S40 is preset. th2 .

[0142] For example, the operator operates the input device 48 of the control device 18 to set the second waiting time t th2 As the standby time t th1 Long time th2 (t th2 >t th1 ) input (for example, t th2 =0.4[sec]). The processor 40 converts the input second waiting time t th2 Stored in the memory 42, and the standby time t th1 The data are registered together as the standby time setting information.

[0143] Fig.11 The process of step S3 of this embodiment is shown. Fig.11 In the process shown, Fig.10 The same steps in the same process are marked with the same step numbers and repeated descriptions are omitted. Fig.11 In the process, after the processor 40 stops the laser emission action LO in step S39, it also executes steps S45 and S46.

[0144] Specifically, in step S45, the processor 40 determines whether the elapsed time t measured by the timer 64 has reached the preset second waiting time t th2 (i.e., t ≥ t th2 ). The processor 40 performs the following operations at t≥t th2 When it is determined to be "yes", the process goes to step S40. On the other hand, at t th1 ≤t<t th2 If the judgment is "No", the process goes to step S46.

[0145] In step S46, the processor 40 determines whether the contact detection device 60 detects that the laser machining head 14 is in contact with the workpiece W, similarly to step S44. The processor 40 returns to step S32 if the determination is "yes", and returns to step S45 if the determination is "no".

[0146] Thus, in the present embodiment, the processor 40 further performs the following operation after step S39 when the period t′=t th2 -t th1 Prior to this, step S40 is not executed. According to this configuration, the warning signal AL5 can be generated and notified to the operator only when it is detected that the laser machining head 14 is out of contact with the workpiece W for a long period of time. This can avoid frequent transmission of the warning signal AL5.

[0147] Next, refer to Fig.12 To illustrate Fig. 9 1 is another example of the operation flow of the laser processing system 10 shown in FIG. 1 . In this embodiment, the processor 40 executes the direct teaching mode DM3 in addition to the automatic operation mode DM1 and the manual operation mode DM2 described above. The direct teaching mode DM3 is an operation mode DM in which the processor 40 operates the robot 12 according to the external force F applied to the robot 12 by the operator, and executes the laser emission operation LO according to the manual laser emission command CM2 input by the operator through the input device 58.

[0148] like Fig.13 As shown, in the present embodiment, the mode selection switch 52 is configured to be able to switch between the automatic operation mode DM1: "Automatic", the manual operation mode DM2: "Manual", and the direct teaching mode DM3 indicated as "TEACH". When the direct teaching mode DM3 is selected by the mode selection switch 52, the mode selection switch 52 provides the control device 18 with a direct teaching mode transfer instruction CM5.

[0149] Below, refer to Fig.12 The operation flow of the laser processing system 10 of this embodiment is described below. Fig.12 In the process shown, Figure 6 The same steps in the same process are marked with the same step numbers and repeated descriptions are omitted. Fig.12 In the illustrated flow, when a “NO” determination is made in step S1 , the processor 40 determines in step S4 whether the manual operation mode DM2 or the direct teaching mode DM3 is selected by the mode selection switch 52 .

[0150] Specifically, the processor 40 determines "yes" and proceeds to step S3 when receiving the manual operation mode transition command CM4 from the mode selection switch 52. On the other hand, the processor 40 determines "no" and proceeds to step S5 when receiving the direct teaching mode transition command CM5 from the mode selection switch 52.

[0151] Fig.14 express Fig.12 In addition, Fig.14 In the process shown, Figure 7 The same steps in the same process are marked with the same step numbers and repeated descriptions are omitted. Fig.14 In the illustrated flow, when a "NO" determination is made in step S13, in step S26, the processor 40 determines whether the manual operation mode DM2 or the direct teaching mode DM3 is selected by the mode selection switch 52, similarly to the above-described step S4.

[0152] When the manual operation mode DM2 is selected, the processor 40 determines "yes" and enters Fig.12 On the other hand, if the direct teaching mode DM3 is selected, the result is "No", and the process proceeds to step S3. Fig.12 In step S5. And, after step S25, the processor 40 proceeds to step S26.

[0153] Fig.15 express Fig.12 In addition, Fig.15 In the process shown, Fig.11 The same steps in the same process are marked with the same step numbers and repeated descriptions are omitted. Fig.15 In the flow shown, when the determination result is "No" in step S33, in step S47, the processor 40 determines whether the direct teaching mode DM3 is selected (i.e., the direct teaching mode transfer instruction CM5 is received). The processor 40 proceeds to step S48 when the determination result is "Yes", and proceeds to step S34 when the determination result is "No".

[0154] In step S48, the processor 40 stops the laser emitting operation LO in the manual operation mode DM2 in the same manner as in step S37. Then, in step S49, the processor 40 generates the warning signal AL4 in the same manner as in step S38, and then enters the Fig.12 Step S5 in .

[0155] On the other hand, if the determination result in step S41 is "No", in step S50, the processor 40 determines whether the direct teaching mode DM3 is selected in the same manner as in step S47 described above. If the determination result in step S41 is "Yes", the processor 40 proceeds to step S51. Fig.12 On the other hand, if the determination result is "No", the process proceeds to step S36.

[0156] Refer again Fig.12 , in the case where the determination in step S4 is "No" (or Fig.14 If the determination result in step S26 is "No", Fig.15 After step S49 in Fig.15 In a case where it is determined as “YES” in step S50 in the process, the processor 40 shifts the action mode DM to the direct teaching mode DM3 in step S5, and executes the process of the direct teaching mode DM3.

[0157] After the transition to the direct teaching mode DM3, the processor 40 becomes capable of receiving the manual laser emission command CM2 via the input device 58, while rejecting the automatic operation start command CM1. Fig.16 , the process of the direct teaching mode DM3 of step S5 is described. Fig.16 In the process shown, Fig.15 The same steps are marked with the same step numbers and repeated descriptions are omitted.

[0158] In step S51, the processor 40 starts to obtain the action of the external force F applied to the robot 12. Specifically, the processor 40 continuously (e.g., periodically) obtains the detection data DF from the force sensor 54, and based on the detection data DF, continuously obtains the magnitude and direction of the external force F applied to the robot 12 and the part of the robot 12 to which the external force F is applied. Thereafter, the processor 40 executes the above-mentioned step S31.

[0159] After step S31, in step S52, the processor 40 determines whether the magnitude of the most recently acquired external force F exceeds a preset threshold value F. th2 (F>F th2 ). The threshold F th2 It can also be set to be higher than in the above step S20 ( Figure 7 , Fig.14) is the threshold F th1 Small value (F th2 <F th1 ). Processor 40 is in the state where F>F th2 If it is judged as "yes", the process goes to step S53. On the other hand, if F≤F th2 If the result is "No", the process goes to step S32.

[0160] In step S53, the processor 40 causes the robot 12 to operate according to the most recently acquired external force F. Specifically, the processor 40 generates a command (torque command, etc.) for moving the part of the robot 12 (e.g., the wrist 28) to which the most recently acquired external force F is applied in the direction of the external force F, and drives the servo motors 30 of the robot 12 according to the command. As a result, the robot 12 moves the part to which the external force F is applied in the direction of the external force F according to the external force F.

[0161] For example, the operator holds the grip 38 of the laser processing head 14 and applies an external force F to the laser processing head 14 to press it in a desired direction φ. The external force F applied in the direction φ is applied from the laser processing head 14 to the wrist flange 28 b of the robot 12 and is detected by the force sensor 54 .

[0162] In this case, the processor 40 moves the robot 12 according to the external force F detected by the force sensor 54, so that the wrist flange 28b (that is, the laser processing head 14) of the robot 12 moves in the direction φ. In this way, the operator can manually operate the robot 12 and move the laser processing head 14 in the desired direction φ through the movement of the robot 12.

[0163] Furthermore, in step S53, the processor 40 may move the portion of the robot 12 (e.g., the wrist flange 28b) to which the external force F is applied by a predetermined distance δ at a predetermined constant speed V. The speed V and the distance δ may be predetermined by the operator as required values ​​for the direct teaching mode DM3.

[0164] After step S53, the processor 40 executes the above steps S32 and S33. If the determination in step S33 is "No", in step S54, the processor 40 determines whether the manual operation mode DM2 is selected (i.e., the manual operation mode transfer instruction CM4 is received). If the determination in step S54 is "Yes", the processor 40 sequentially executes the above steps S48 and S49 to enter the Fig.12 Step S3 in .

[0165] On the other hand, when the processor 40 determines "No" in step S54, the processor 40 sequentially executes the above-mentioned steps S34 to 36, S42 to S44, S39, S45, S46, and S40. When the processor 40 determines "No" in step S36, when it determines "Yes" in steps S44 or S46, or after executing step S40, the processor 40 returns to step S52.

[0166] On the other hand, if the determination result in step S41 is "No", in step S55, the processor 40 determines whether the manual operation mode DM2 is selected in the same manner as in step S54 described above. If the determination result in step S41 is "Yes", the processor 40 proceeds to step S55. Fig.12 In step S3, on the other hand, if the determination result is "No", the process proceeds to step S36.

[0167] Thus, the processor 40 Fig.16 In the direct teaching mode DM3 of step S5 shown, the robot 12 is moved according to the external force F applied by the operator (step S53), the laser processing head 14 is moved in the direction φ, and the laser emission action LO is performed according to the manual laser emission command CM2 input by the operator through the input device 58 (step S35).

[0168] Thus, the operator can manually operate the robot 12, move the laser processing head 14 in the desired direction φ through the operation of the robot 12, and operate the input device 58 to manually emit the laser LB from the laser processing head 14 to perform laser processing on the workpiece W. At this time, the robot 12 can also move the laser processing head 14 at a constant speed V as described above. According to this structure, the finishing quality of laser processing can be improved.

[0169] In addition, during the laser processing in the direct teaching mode DM3, the laser processing head 14 and the workpiece W are in a standby state for a period of time t th1 When the inner part is out of contact ("YES" in step S43), the laser emitting operation LO can be stopped in step S39. Therefore, the safety of the operator can also be ensured.

[0170] In addition, you can also Fig.16 The process shown omits steps S45 and S46. Fig.10 Alternatively, you can also start from Fig.16 Steps S42 to S46 are omitted in the process shown. Figure 8 The process of is similarly constructed. Fig.16 In the case where steps S42 to S46 are omitted in the flow shown in the figure, the timing unit 64 is omitted. Figure 2 The control device 18 shown is capable of executing Fig.16 process.

[0171] In addition, Fig.16 In the process of step S5 shown in the figure, it is also possible to apply instead of step S34 Fig.14 Step S19 shown in FIG. 1 is omitted, and steps S42 to S44, S45, S46, and S40 are omitted. Fig.16 The process omits step S31. In step S51, the processor 40 and Fig.14 The process of obtaining the external force F and the distance d is similarly started in step S14. Then, when the processor 40 determines "No" in step S54, it executes step S19 to determine whether the distance d is within the range RG. When the processor 40 determines "Yes" when the distance d is within the range RG, it proceeds to step S35.

[0172] On the other hand, when the distance d is outside the range RG, the processor 40 determines "No", executes step S39 to stop the laser emission operation LO, and then executes the above-mentioned step S23 to generate the warning signal AL1. Thereafter, the processor 40 returns to step S52. That is, in this case, when the distance d between the laser processing head 14 and the workpiece W is outside the predetermined range RG during the execution of the laser emission operation LO in the direct teaching mode DM3 (step S35), the processor 40 stops the laser emission operation LO.

[0173] In the above-mentioned step S2 (flow of the automatic operation mode DM1), the processor 40 may also execute the gap control GC for controlling the distance d between the laser processing head 14 and the workpiece W to a predetermined target distance d0 after starting the automatic operation in step S17. The target distance d0 is, for example, a value within the range RG referred to in steps S16 and S19 (for example, d th1 <d0<d th2 ), can be determined by the operator.

[0174] In the gap control GC, the processor 40 performs feedback control on each servo motor 30 of the robot 12 based on the distance d obtained from the distance measuring sensor 56, and adjusts the position of the laser processing head 14 in the direction of the optical axis A through the movement of the robot 12 so that the distance d is consistent with the target distance d0.

[0175] In addition, the processor 40 may also execute the operation program OP. Figure 6 The process, Figure 7 The process of step S2 shown in FIG. Figure 8 , Fig.10 or Fig.11 The operation program OP may be generated in advance by an operator and stored in the memory 42 as a program different from the machining program PP.

[0176] In this case, the processor 40 executes the operation program OP. Figure 7 In the process of step S2, when step S17 is started, the processing program PP is read out from the memory 42 and executed, thereby starting the automatic operation of the laser emitting operation LO and the moving operation MO.

[0177] In addition, a gap control program GP for the gap control GC may be prepared. In this case, the processor 40 executes the gap control program GP in parallel with the machining program PP when starting step S17, and executes the gap control GC in parallel with the automatic operation.

[0178] In addition, the operation program OP may also have a function of causing the processor 40 to execute Figure 6 The first action program OP1 of the process of making the processor 40 execute the step S2, the second action program OP2 of making the processor 40 execute the process of step S2, and the third action program OP3 of making the processor 40 execute the process of step S3.

[0179] Similarly, the processor 40 may also execute the operation program OP. Fig.12 The process, Fig.14 The process of step S2 shown in FIG. Fig.15 The process of step S3 shown in FIG. Fig.16 In this case, the operation program OP may also have a function of causing the processor 40 to execute Fig.12 A first action program OP1 for causing the processor 40 to execute the process of step S2, a second action program OP2 for causing the processor 40 to execute the process of step S2, a third action program OP3 for causing the processor 40 to execute the process of step S3, and a fourth action program OP4 for causing the processor 40 to execute the process of step S5.

[0180] In addition, the input device 58 may not be provided in the laser processing head 14, and for example, it may be configured separately from the laser processing head 14 as a portable button device that the operator can carry, or a foot pedal (or foot switch) that the operator can use his foot to perform input operations. In addition, the distance sensor 56 may not be provided in the laser processing head 14, and for example, it may be provided adjacent to the workpiece W.

[0181] In addition, the laser processing system 10 may further include a second input device that receives an input operation of an auxiliary gas ejection instruction for causing the laser processing head 14 to eject auxiliary gas AG in the manual operation mode DM2 of step S3. When the operator operates the second input device when executing the manual operation mode DM2, the processor 40 operates the auxiliary gas supply device according to the auxiliary gas ejection instruction sent from the second input device to supply auxiliary gas AG to the laser processing head 14. In this case, the second input device may also be provided adjacent to the grip 38 on the laser processing head 14 so that the input operation can be performed using the single hand that grips the grip 38.

[0182] In addition, the mode selection switch 52 is not limited to being provided in the control device 18, and may be provided in any component. For example, the mode selection switch 52 may be provided in the laser processing head 14, or may be configured as a portable switch that is provided separately from the control device 18 and can be carried by an operator. Alternatively, the mode selection switch 52 may be provided in a teaching device (teaching pendant, tablet terminal device, etc.) that is communicatively connected to the control device 18 and is used to teach the robot 12 and the laser oscillator 16 to operate.

[0183] In the above-mentioned embodiment, the mode selection switch 52 is described as a physical switch provided in the control device 18. However, the mode selection switch 52 may be provided in the control device 18 as a software switch (or a virtual switch).

[0184] For example, the processor 40 of the control device 18 generates a mode selection switch image 100 for selecting the operation mode DM, and displays it on the display device 50 . Fig.17 An example of the mode selection switch image 100 is shown. The mode selection switch image 100 is a graphical user interface (GUI) for allowing the operator to select the operation mode DM, and includes an automatic operation button image 102 and a manual operation button image 104 .

[0185] The automatic operation button image 102 indicated as "Automatic" corresponds to the automatic operation mode DM1, and the manual operation button image 104 indicated as "Manual" corresponds to the manual operation mode DM2. The operator can select the automatic operation mode DM1 or the manual operation mode DM2 by operating the input device 48 and clicking the automatic operation button image 102 or the manual operation button image 104 on the image while visually checking the mode selection switch image 100 displayed on the display device 50 of the control device 18.

[0186] When the processor 40 receives an input (i.e., an automatic operation mode shift instruction CM3) from the operator through the input device 48 to select the automatic operation button image 102, the operation mode DM is shifted to the automatic operation mode DM1 (the above-mentioned step S2). On the other hand, when the processor 40 receives an input (i.e., a manual operation mode shift instruction CM4) from the operator through the input device 48 to select the manual operation button image 104, the operation mode DM is shifted to the manual operation mode DM2 (the above-mentioned step S3).

[0187] In this way, the automatic operation button image 102 and the manual operation button image 104 constitute the mode selection switch 52 as software, and the operator can switch the operation mode DM between the automatic operation mode DM1 and the manual operation mode DM2 by operating the mode selection switch 52 on the image.

[0188] In addition, it can be understood that the mode selection switch 52 as software can be configured to select the automatic operation mode DM1, the manual operation mode DM2 or the direct teaching mode DM3. In addition, the mode selection switch 52 as software is not limited to the control device 18, and can also be installed in the above-mentioned teaching device, or any other communication device (PC, tablet terminal) connected to the control device 18 in a communicable manner.

[0189] In the above embodiment, the automatic operation mode DM1, the manual operation mode DM2, and the direct teaching mode DM3 are exemplified as the operation mode DM. However, the operation mode DM is not limited thereto, and may include any other operation mode DM such as the teaching mode DM4 for teaching the robot 12 and the laser oscillator 16 an operation.

[0190] In the above-mentioned embodiment, the control device 18 controls the robot 12 and the laser oscillator 16 . However, the control device 18 may include the first control device 18A that controls the robot 12 and the second control device 18B that controls the laser oscillator 16 . Fig.18 and Fig.19 Indicates this way.

[0191] exist Fig.18 and Fig.19 In the laser processing system 10' shown, the control device 18 includes a first control device 18A for controlling the moving motion MO of the robot 12 and a second control device 18B for controlling the laser emitting motion LO of the laser oscillator 16. The first control device 18A is a computer having a processor 40A, a memory 42A, an I / O interface 44A, and a bus 46A.

[0192] The robot 12 (servo motor 30), the laser processing head 14 (lens driving unit), the input device 48A, the display device 50A, the force sensor 54, the distance sensor 56, the input device 58, and the contact detection device 60 (resistance sensor 60b) are connected to the I / O interface 44A of the first control device 18A in a communicable manner. In addition, the above-mentioned mode selection switch 52 is provided in the first control device 18A.

[0193] The second control device 18B is a computer having a processor 40B, a memory 42B, an I / O interface 44B, and a bus 46B. The input device 48B, the display device 50B, the laser oscillator 16, and the I / O interface 44A of the first control device 18A are connected to the I / O interface 44B of the second control device 18B in a communicable manner.

[0194] In addition, the laser oscillator 16, the second control device 18B, the input device 48B, and the display device 50B may be integrally assembled in a common housing to form a single laser oscillator 72. The processor 40A of the first control device 18A and the processor 40B of the second control device 18B may communicate with each other while executing Figure 6 to Figure 8 , Figure 10 to Figure 12 , Figure 14 to Figure 16 The process shown.

[0195] In addition, the laser processing head 14 may be any type of processing head, such as a laser scanner (or an electric scanner). The laser scanner has a plurality of mirrors that reflect the laser light LB supplied from the laser oscillator 16, a plurality of mirror driving units that drive the plurality of mirrors, and an optical lens that focuses the laser light reflected by the mirrors. The laser scanner can move the irradiation point of the laser light irradiated to the workpiece at high speed on the surface of the workpiece W by changing the orientation of the plurality of mirrors using the mirror driving unit.

[0196] In addition, the robot 12 is not limited to a vertical articulated robot, and may be, for example, a horizontal articulated robot or a parallel linkage robot, and may be configured to have a first ball screw mechanism and a second ball screw mechanism for moving the workpiece W in a horizontal plane, and a third ball screw mechanism for moving the laser processing head 14 in a vertical direction. In addition, the light guide 39 may be omitted from the laser processing system 10 or 10'. In this case, the laser oscillator 16 may also be directly connected to the laser processing head 14. The present disclosure is described above through an embodiment, but the above-mentioned embodiment does not limit the invention described in the scope of the patent protection requested.

[0197] Explanation of symbols

[0198] 10, 10' laser processing system

[0199] 12. Robot

[0200] 14Laser processing head

[0201] 16Laser oscillator

[0202] 18 Control Devices

[0203] 40, 40A, 40B processors

[0204] 48, 48A, 48B, 58 input devices

[0205] 52 mode selector switch

[0206] 54 Force Sensor

[0207] 56 Distance Sensor

[0208] 60 contact detection device.

Claims

1. A laser processing system for laser processing a workpiece, wherein the laser processing system is characterized by comprising: a laser processing head that emits laser light generated by a laser oscillator; a robot that moves the laser processing head relative to the workpiece; a distance measuring sensor for measuring the distance between the laser processing head and the workpiece; a control device that controls a laser emitting operation of operating the laser oscillator to emit laser light from the laser processing head and a moving operation of operating the robot to move the laser processing head relative to the workpiece; and A mode selection switch, which selects the operation mode of the laser processing, The control device selects an automatic operation mode for automatically executing the laser emitting action and the moving action according to the processing program as the operation mode through the mode selection switch, and executes the laser emitting action and the moving action as the automatic operation mode when the distance measured by the ranging sensor is within a predetermined range.

2. The laser processing system according to claim 1, characterized in that: The laser processing system also has: an input device for receiving an input operation of a manual laser emission instruction for causing the control device to execute the laser emission action; and a contact detection device for detecting contact or non-contact between the laser processing head and the workpiece, The mode selection switch is configured to be able to switch the operation mode between the automatic operation mode and a manual operation mode, wherein the manual operation mode is a mode in which the control device performs the laser emission operation according to the manual laser emission instruction. The control device executes the laser emitting operation as the manual operation mode according to the manual laser emitting instruction received through the input device when the manual operation mode is selected by the mode selection switch and the contact detection device detects the contact.

3. The laser processing system according to claim 2, characterized in that: The contact detection device comprises: a conductive cable electrically connecting the laser processing head to the workpiece; and a resistance sensor for measuring the resistance of a closed loop formed by the workpiece, the laser processing head in contact with the workpiece, and the conductive cable, The contact detection device is configured to detect the contact or the non-contact based on the resistance measured by the resistance sensor.

4. The laser processing system according to claim 2 or 3, characterized in that: When the laser emitting operation is performed in the manual operation mode, if the mode selection switch is operated to deselect the manual operation mode or the contact detection device detects the non-contact, the control device stops the laser emitting operation.

5. The laser processing system according to any one of claims 2 to 4, characterized in that: When the laser emitting operation is performed in the manual operation mode, the control device sets a standby time from the time when the contact detection device detects the non-contact to the time when the laser emitting operation is stopped. When the waiting time has elapsed from the time point, the control device stops the laser emitting operation in the manual operation mode.

6. The laser processing system according to any one of claims 2 to 5, characterized in that: The laser processing head has a grip portion that an operator can hold with one hand, The input device is provided on the laser processing head adjacent to the grip portion so as to enable input operation to be performed by the single hand gripping the grip portion.

7. The laser processing system according to any one of claims 1 to 6, characterized in that: When the control device receives an automatic operation start instruction for starting the automatic operation mode, if the automatic operation mode is not selected by the mode selection switch or the distance measured by the ranging sensor is outside the range, at least one of the laser emitting action and the moving action is not started as the automatic operation mode.

8. The laser processing system according to any one of claims 1 to 7, characterized in that: When the laser emitting action and the moving action are performed as the automatic operation mode, when the mode selection switch is operated to make the automatic operation mode non-selected or the distance measured by the ranging sensor is outside the range, the control device stops at least one of the laser emitting action and the moving action.

9. The laser processing system according to any one of claims 1 to 8, characterized in that: When the laser emitting operation and the moving operation are performed as the automatic operation mode, the control device performs gap control for moving the robot based on the distance measured by the distance measuring sensor so that the distance matches a predetermined target distance.

10. A method for laser processing using the laser processing system according to any one of claims 1 to 9, characterized in that: The control device performs the following processing: determining whether the automatic operation mode is selected by the mode selection switch; determining whether the distance measured by the distance measuring sensor is within the range; as well as When the automatic operation mode is selected by the mode selection switch and the distance measured by the distance measuring sensor is within the range, the laser emitting operation and the moving operation are performed as the automatic operation mode.

Images