Electronic device including conductive key button

Abstract

An electronic device according to one embodiment comprises: a housing for providing an internal space; a sensor disposed in the internal space; and a key button electrically connected to the sensor and including an electrode for acquiring biometric information by contact with an external object through the sensor, in which the key button includes a metal layer, a deposited layer including a hole connected to a portion of the metal layer and disposed on the metal layer, and a conductive material disposed on the deposited layer, a conductive material is disposed in the hole and in contact with the metal layer exposed through the hole, and a diameter of a side of the hole oriented on the outer side may be greater than a thickness of the deposited layer.

Description

Technical Field

[0001] An embodiment to be described later relates to an electronic device including a conductive key button. Background Art

[0002] Portable electronic devices such as smart phones, smart watches, or watch phones may include keys exposed to the outside. The key buttons of the electronic device may provide user input. The keys of the electronic device may not only provide user input, but also provide other functions. Summary of the invention

[0003] Technical issues

[0004] The portable electronic device may include key buttons exposed to the outside of the housing. The key buttons exposed to the outside may include an additional color layer for the color and coordination of the housing.

[0005] The key button having the same color as the color of the housing may have a thick color layer. Due to the color layer, it may be difficult to implement the additional function assigned to the key button. A plan is required to implement the additional function.

[0006] The technical problems to be achieved in this document are not limited to the above-mentioned technical problems, and other technical problems not mentioned herein will be clearly understood by ordinary technicians in the field to which the present disclosure belongs from the following description.

[0007] Technical Solutions

[0008] According to an embodiment, an electronic device may include: a shell, including a front surface, a rear surface, and a side surface arranged between the front surface and the rear surface, and providing an internal space surrounded by the front surface, the rear surface and the side surface; a sensor arranged in the internal space; and a key button, including an electrode and at least partially inserted into an opening formed on the side surface, the electrode being electrically connected to the sensor and configured to obtain biometric information through contact with an external object through the sensor, wherein the key button includes a metal layer, a deposition layer and a conductive material, the deposition layer including a hole exposing a portion of the metal layer and being arranged on the metal layer, the conductive material being arranged in the hole and contacting the metal layer exposed through the hole, wherein a diameter of the side of the hole facing outward may be greater than a thickness of the deposition layer.

[0009] According to an embodiment, an electronic device may include: a housing including a front surface, a rear surface that contacts a part of a user's body when the user wears the electronic device, and a side surface arranged between the front surface and the rear surface, and providing an internal space surrounded by the front surface, the rear surface and the side surface; a display arranged on the front surface; a belt that surrounds the part of the user's body and is rotatable relative to the housing when the user wears the electronic device; a sensor arranged in the internal space; at least one key button including a first electrode and at least partially inserted into an opening formed on the side surface, the first electrode being electrically connected to the sensor and configured to obtain biometric information through contact with an external object through the sensor, and a second electrode being arranged on the rear surface, wherein the at least one key button includes a metal layer having a groove, a deposition layer including a hole connected to the groove and arranged on the metal layer, and a conductive material arranged in the groove and the hole and in contact with the metal layer exposed through the groove; and a processor, wherein a diameter of a side of the hole facing outward may be greater than a thickness of the deposition layer, and wherein the processor is configured to obtain data related to the biometric information based on sensing data obtained by the sensor electrically connected to the first electrode and the second electrode.

[0010] Beneficial effects

[0011] The electronic device according to the embodiment may transmit a micro current generated by an external object to electronic components inside the electronic device by including a key button including a conductive material.

[0012] The key button included in the electronic device according to the embodiment may reduce color heterogeneity with a case of the electronic device by including a deposition layer.

[0013] Effects that can be obtained from the present disclosure are not limited to the above-mentioned effects, and any other effects not mentioned herein will be clearly understood by a person of ordinary skill in the art to which the present disclosure pertains from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0015] Figure 2 is a perspective view of a front surface of an electronic device according to an embodiment.

[0016] Figure 3 yes Figure 2 A perspective view of the rear surface of an electronic device in FIG.

[0017] Figure 4 yes Figure 2 An exploded perspective view of an electronic device in FIG.

[0018] Figure 5 An example of an electronic device according to an embodiment is shown.

[0019] Figure 6 is an enlarged top plan view of a zoom-in key button of an electronic device according to an embodiment.

[0020] Figure 7 and Figure 8 is a cross-sectional view of a key button of an electronic device according to an embodiment.

[0021] Fig. 9 is a flow chart showing a deposition and plating process for a key button of an electronic device. DETAILED DESCRIPTION

[0022] Figure 1 is a block diagram illustrating electronic devices in a network environment according to various embodiments.

[0023] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0024] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0025] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0026] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0027] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0028] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0029] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0030] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0031] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0032] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0033] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0034] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0036] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0037] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0040] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0041] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0042] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0043] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0044] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0045] Figure 2 is a perspective view of a front surface of an electronic device according to an embodiment. Figure 3 yes Figure 2 A perspective view of the rear surface of the electronic device in FIG.

[0046] Reference Figure 2 and Figure 3According to an embodiment, the electronic device 200 may include a housing 210 and coupling members 250 and 260, the housing 210 including a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B, the coupling members 250 and 260 being connected to at least a portion of the housing 210 and configured to detachably attach the electronic device 200 to a portion of the user's body (e.g., a wrist, an ankle, etc.). In another embodiment (not shown), the housing may also refer to a portion of the housing 210 that forms a portion of the user's body (e.g., a wrist, an ankle, etc.). Figure 2 The structure of at least a portion of the front surface 210A, the rear surface 210B and the side surface 210C. According to an embodiment, at least a portion of the front surface 210A can be realized by a substantially transparent front plate 201 (e.g., a glass plate or a polymer plate including various coatings). The rear surface 210B can be realized by a substantially opaque rear plate 207. The rear plate 207 can be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of these materials. The side surface 210C can be coupled to the front plate 201 and the rear plate 207, and can be realized by a side frame structure 206 including a metal and / or a polymer. In some embodiments, the rear plate 207 and the side frame structure 206 can be formed integrally and can include the same material (e.g., a metal material such as aluminum). The combining members 250 and 260 can be made of various materials and can be made into various shapes. The coupling members 250 and 260 may be made of woven fabric, leather, rubber, polyurethane, metal, ceramic, or a combination of at least two of these materials.

[0047] According to an embodiment, the electronic device 200 may include a display 220 (see Figure 3 ), audio modules 205 and 208, a sensor module 211, key input devices 202, 203 and 204, and at least one of the connector hole 209. In some embodiments, the electronic device 200 may omit at least one of the components (e.g., the key input devices 202, 203 and 204, the connector hole 209, or the sensor module 211), or may further include another component.

[0048] The display 220 may be exposed, for example, through a large portion of the front plate 201. The shape of the display 220 may correspond to the shape of the front plate 201, such as a circle ( Figure 2 ), an ellipse, or a polygon. Display 220 may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0049] The audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208. In some embodiments, a microphone for obtaining external sound may be provided inside the microphone hole 205, and in some embodiments, a plurality of microphones may be provided to detect the direction of the sound. The speaker hole 208 may be used together with an external speaker and a receiver for a phone call. In some embodiments, the speaker hole 208 and the microphone hole 205 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker hole 208.

[0050] The sensor module 211 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor module 211 may include, for example, a biometric sensor module 211 (e.g., a heart rate monitor (HRM) sensor) disposed on the rear surface 210B of the housing 210. The electronic device 200 may further include at least one sensor module not shown, such as a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared sensor, a biometric sensor, a humidity sensor, and / or an illumination sensor.

[0051] The key input devices 202, 203, and 204 may include a wheel key 202 disposed on the front surface 210A of the housing 210 and rotatable in at least one direction, and / or key buttons 203 and 204 disposed on the side surface 210C of the housing 210. The wheel key may have a shape corresponding to the shape of the front plate 201. In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 202, 203, and 204, and the key input devices 202, 203, and 204 not included may be implemented in other forms, such as soft keys on the display 220.

[0052] The connector hole 209 may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, and may include another connector hole (not shown) capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device. The electronic device 200 may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole 209 and blocks external foreign matter from flowing into the connector hole.

[0053] The coupling members 250 and 260 may be detachably attached to at least a portion of the housing 210 using locking members 251, 261. The coupling members 250 and 260 may include one or more of a fixing member 252, a fixing member fastening hole 253, a belt guide member 254, and a belt fixing ring 255.

[0054] The fixing member 252 may be configured to fix the housing 210 and the combining members 250 and 260 to a part of the user's body (e.g., a wrist, an ankle, etc.). The fixing member fastening hole 253 may correspond to the fixing member 252 to fix the housing 210 and the combining members 250 and 260 to a part of the user's body. The belt guide member 254 may be configured to limit the range of movement of the fixing member 252 when the fixing member 252 is fastened to the fixing member fastening hole 253, so that the combining members 250 and 260 are attached to be in close contact with a part of the user's body. When the fixing member 252 and the fixing member fastening hole 253 are fastened, the belt fixing ring 255 may limit the range of movement of the fixing members 250 and 260.

[0055] Figure 4 yes Figure 2 An exploded perspective view of an electronic device in FIG.

[0056] Reference Figure 4 , the electronic device 200 may include a side frame structure 206, a wheel key 202, a front panel 201, a display 220, a first antenna 450, a second antenna 455, a support member 460 (e.g., a bracket), a battery 470, a printed circuit board 480, a sealing member 490, a rear panel 207, and bonding members 250 and 260. At least one of the components of the electronic device 200 may be connected to Figure 2 or Figure 3 At least one of the components of the electronic device 200 is the same or similar, and its repeated description will be omitted. The support member 460 can be arranged inside the electronic device 200 to be connected to the side frame structure 206, or can be integrated with the side frame structure 206. The support member 460 can be made of, for example, a metal material and / or a non-metallic (e.g., polymer) material. The display 220 can be connected to one surface of the support member 460, and the printed circuit board 480 can be connected to the other surface of the support member 460. The processor, memory and / or interface can be mounted on the printed circuit board 480. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit (GPU), an application processor, a sensor processor, or a communication processor.

[0057] The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0058] The battery 470 is a device for supplying power to at least one component of the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 470 may be disposed on substantially the same plane as, for example, the printed circuit board 480. The battery 470 may be integrally disposed inside the electronic device 200, or may be detachably coupled to the electronic device 200.

[0059] The first antenna 450 may be disposed between the display 220 and the support member 460. The first antenna 450 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The first antenna 450 may, for example, perform short-range communication with an external device, wirelessly send and receive power required for charging, and send short-range communication signals or electromagnetic signals including payment data. In another embodiment, the antenna structure may be formed by at least a portion of the side frame structure 206 and / or a portion of the support member 460, or a combination thereof.

[0060] The second antenna 455 may be disposed between the printed circuit board 480 and the back plate 207. The second antenna 455 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the second antenna 455 may perform short-range communication with an external device, wirelessly send and receive power required for charging, and may send short-range communication signals or electromagnetic signals including payment data. In another embodiment, the antenna structure may be formed by at least a portion of the side frame structure 206 and / or a portion of the back plate 207, or a combination thereof.

[0061] The sealing member 490 may be positioned between the side frame structure 206 and the rear plate 207. The sealing member 490 may be configured to block moisture and foreign matter from flowing into a space surrounded by the side frame structure 206 and the rear plate 207 from the outside.

[0062] Figure 5 An example of an electronic device according to an embodiment is shown.

[0063] Reference Figure 5 , the electronic device 500 (eg, Figure 1 The electronic device 101 and Figure 2 The electronic device 200 in the embodiment may include a housing 510 (eg, Figure 2 210 in the housing), key buttons 503 and 504, a sensor module 540, and a processor 550 (eg, Figure 1 Processor 120 in. Figure 5 The rear surface 510B, the side surface 510C, the side frame structure 506, the rear plate 507 and / or the key buttons 503 and 504 in the embodiment may be respectively Figure 2 , Figure 3 and / or Figure 4 The rear surface 210B, side surface 210C, side frame structure 206, rear panel 207 and / or key buttons 203 and 204 are substantially the same, and thus overlapping descriptions will be omitted.

[0064] According to an embodiment, the housing 510 may include a front surface (eg, Figure 2 The housing 510 may include a front surface 210A, a rear surface 510B, and a side surface 510C disposed between the front surface 210A and the rear surface 510B. The housing 510 may provide an internal space surrounded by the front surface 210A, the rear surface 510B, and the side surface 510C. Internal components of the electronic device 500 may be disposed in the internal space. For example, a printed circuit board (e.g., Figure 4 The printed circuit board 480 in the housing 510 may be disposed in an internal space surrounded by the front surface 210A, the rear surface 510B, and the side surface 510C of the housing 510.

[0065] According to an embodiment, at least one opening 502 may be provided on the side surface 510C of the housing 510. For example, at least one opening 502 may be formed in a side frame structure 506 provided on the side surface 510C of the housing 510. At least one opening 502 may penetrate the side frame structure 506 of the housing 510. For example, at least one opening 502 may extend from an inner space surrounded by the front surface 510A, the rear surface 510B, and the side surface 510C of the housing 510 to an outer surface of the side frame structure 506.

[0066] According to an embodiment, key buttons 503 and 504 may be disposed on a side surface 510C of a housing 510. At least a portion of the key buttons 503 and 504 may be inserted into at least one opening 502 formed on the side surface 510C. For example, a portion of the body of the key buttons 503 and 504 may protrude toward the outside of the electronic device 500 through at least one opening 502 and may be visible from the outside, and the rest of the body of the key buttons 503 and 504 may be disposed in an internal space of the housing 510. According to an embodiment, the key buttons 503 and 504 may move in an internal direction of the electronic device 500 when pressed. For example, the key buttons 503 and 504 may include a first key button 503 and a second key button 504. The first key button 503 may be supported by an internal structure (not shown) of the first opening 502a and / or at least one opening 502 formed in the side frame structure 506. When the first key button 503 is pressed, the first key button 503 may move to the inside of the electronic device 500 and be supported by a support member (eg, Figure 4The second key button 504 may be supported and fixed by the second opening 502b and / or an internal structure (not shown) of at least one opening 502 formed in the side frame structure 506. According to an embodiment, the first key button 503 and / or the second key button 504 moved to the inside may be pressed by an elastic body (not shown) disposed between the key buttons 503 and 504 and the supporting member 460. For example, when the external force pressing the first key button 503 is removed, the first key button 503 may move to the position before the elastic body applies the external force.

[0067] According to an embodiment, at least one electrode 520 may be provided on the electronic device 500. For example, the electrode 520 may be provided on an internal component (eg, Figure 4 On the printed circuit board 480) or on the outer surface of the housing 510.

[0068] According to an embodiment, the first electrode 521 may be provided on at least one of the key buttons 503 and 504, and the second electrode 522 may be provided on the back plate 507. The electrodes 521 and 522 may be configured to obtain information related to an external object by contacting the external object. For example, the first key button 503 may include the first electrode 521. At least a portion of the first key button 503 may be formed by a conductive member. The second electrode 522 may be provided on the back plate 507, and at least a portion of the second electrode 522 may be visually exposed to the outside. The electrodes 521 and 522 may be in contact with a portion of the body of a user of the electronic device 500. For example, in the case of contacting the user of the electronic device 500 by a bonding member (e.g., Figure 2 The electronic device 500 may be contacted while the combining members 250 and 260 in the back plate 507 surround a part of the user's body. The back plate 507 of the electronic device 500 may be in contact with a part of the user's body. For example, the first key button 503 or the first electrode 521 included in the first key button 503 may be in contact with an external object (e.g., a part of the user's body). The second electrode 522 may be in contact with another external object different from the external object (e.g., another part of the user's body). For example, the first key button 503 may be in contact with one of the user's fingers. The second electrode 522 exposed from the back plate 507 may be in contact with a part of the user's wrist. The electrodes 521 and 522 may be configured to transmit an electrical signal corresponding to a biometric signal of the user (e.g., electrocardiogram, body temperature, blood pressure) to an electronic component (e.g., sensor 530) disposed inside the electronic device 500 based on contact with a part of the user's body.

[0069] According to an embodiment, the sensor 530 may be disposed in the inner space of the housing 510 of the electronic device 500. For example, the sensor 530 may be disposed on one surface of the printed circuit board 480 disposed in the inner space of the housing 510.

[0070] According to an embodiment, the sensor 530 may be electrically connected to the electrodes 521 and 522. The sensor 530 may detect or recognize an electrical signal transmitted from an external object (e.g., a user's body or an external electronic device) to the electrodes 521 and 522. For example, the sensor 530 may be a biosensor. The first electrode 521 may be provided on at least one of the key buttons 503 and 504 provided on the side surface 510C of the electronic device 500. The sensor 530 may be electrically connected to the first electrode 521. The second electrode 522 may be provided on the back plate 507 provided on the back surface 510B of the electronic device 500. The sensor 530 may be electrically connected to the second electrode 522. A part of the user's body of the electronic device 500 may contact the first electrode 521 provided on the first key button 503. Another part of the user's body may contact the second electrode 522 provided on the back plate 507. Another part of the user's body of the electronic device 500 may contact the first electrode 521 provided on the key buttons 503 and 504. Information related to the current flowing through the user's body of the electronic device 500 may be transmitted to the sensor 530 through the electrodes 521 and 522. The sensor 530 may detect or recognize the transmitted signal.

[0071] According to an embodiment, the sensor module 540 (e.g., Figure 1 Sensor module 176 or Figure 2 The sensor module 211 in the electronic device 500 may include a first electrode 521, a second electrode 522, and a sensor 530. The sensor module 540 may sense an external environmental state (e.g., a user's physical state) and may generate an electrical signal or data value corresponding to the sensed state. For example, the sensor 530 included in the sensor module 540 of the electronic device 500 may be a biometric sensor. The first electrode 521 may be provided on the first key button 503, and the second electrode 522 may be provided on a back plate 507 provided on a rear surface 510B of the electronic device 500. The sensor 530 may be electrically connected to the first electrode 521 and the second electrode 522. The sensor 530, the first electrode 521, and the second electrode 522 may configure a biometric sensor module (e.g., an HRM sensor). A part of the user's body of the electronic device 500 may generate a micro signal (e.g., a micro current caused by a heartbeat). Since the second electrode 522 is in contact with a part of the user's body, the micro signal may be sensed and transmitted to the sensor 530. The micro signal may be converted into an electrical signal or a data value by the biometric sensor module.

[0072] According to an embodiment, the processor 550 may be disposed inside the housing 510 of the electronic device 500. The processor 550 may be electrically connected to the sensor 530. For example, the processor 550 may be disposed on one surface of the printed circuit board 480 inside the housing 510 in which the sensor 530 is disposed. The processor 550 may receive sensing data sensed by the sensor 530 through a PCB transmission line (e.g., a strip transmission line or a microstrip transmission line) disposed on the printed circuit board 480.

[0073] According to an embodiment, the processor 550 may be a bioprocessor. The processor 120 may be configured to obtain data related to a microcurrent generated by an external object through the sensor 530 based on identifying contact of the external object with each of the first electrode 521 and the second electrode 522. For example, the sensor 530 may be a biometric sensor. The external object may be a part of the body of a user of the electronic device 500. For example, the external object may be a part of a user's finger in contact with the first electrode 521 or a user's wrist in contact with the second electrode 522.

[0074] According to an embodiment, the processor 550 may perform data processing or calculation related to the user's body by receiving the user's biometric information or biometric signal obtained from the sensor module 540 including the sensor 530, the first electrode 521, and the second electrode 522. For example, the processor 550 may control at least one other component of the electronic device 500 connected to the processor 550 (e.g., biometric information software) based on the biometric information or biometric signal provided from the sensor module 540 to display the user's body through the display unit (e.g., Figure 1 The display module 160 and Figure 3 The processor 550 may process commands or data received from the sensor module 540 as at least a part of data processing or calculation, and may provide the result data to the user.

[0075] According to the above-described embodiment, the electronic device 500 may provide body-related information to the user by including the sensor module 540 that senses user-related information or signals and the processor 550 that performs calculations and processes data obtained from the sensor module 540 .

[0076] Figure 6 is an enlarged top plan view of a zoom-in key button of an electronic device according to an embodiment. Figure 7 and Figure 8 is a cross-sectional view of a key button of an electronic device according to an embodiment.

[0077] Reference Figure 6 and Figure 7 , electronic devices (e.g. Figure 1The electronic device 101, Figure 2 The electronic device 200 and Figure 5 The key button 600 (eg, Figure 2 The key buttons 203, 204 and Figure 5 The key buttons 503 , 504 ) may include a metal layer 610 , a deposition layer 620 and a conductive material 630 .

[0078] According to an embodiment, at least a portion of the key button 600 may be exposed to the outside of the electronic device 500. For example, the key button 600 may be inserted into at least one opening (eg, Figure 5 A portion of the key button 600 may be exposed to the outside through the opening 502 of the electronic device 500. The rest of the key button 600 may be disposed inside the electronic device 500. The portion of the key button 600 exposed to the outside of the electronic device 500 may contact a portion of the user's body.

[0079] According to an embodiment, the metal layer 610 may be a base material of the key button 600. The key button 600 including the metal layer 610 may be disposed in the opening 502 of the housing 510. The metal layer 610 may be a sensor (eg, Figure 5 The electrodes of the sensor 530 (e.g., Figure 5 The housing of the electronic device 500 (eg, Figure 2 The housing 210, Figure 5 The housing 510 in the embodiment may include at least one of stainless steel (SUS), aluminum, titanium, zirconium, or alloys thereof. The metal layer 610 may include the same material as the housing 510. For example, the metal layer 610 may include SUS or aluminum.

[0080] According to an embodiment, the metal layer 610 may include a key button 600 connected to an internal component of the electronic device 500 (eg, Figure 4 The metal layer 610 may transmit an electrical signal transmitted from the outside of the key button 600 to the internal components of the electronic device 500 (eg, Figure 5 For example, a portion of the key button 600 may be exposed to the outside of the electronic device 500. Through the metal layer 610 of the key button 600, an electrical signal transmitted from an external object may be transmitted to an electronic component disposed inside the electronic device 500. For example, the metal layer 610 may be electrically connected to an internal component of the electronic device 500 (e.g., Figure 5 The metal layer 610 may transmit an electrical signal transmitted from the outside to the internal components of the electronic device 500.

[0081] According to an embodiment, the deposition layer 620 may be disposed on the metal layer 610. The deposition layer 620 may be disposed on a surface facing the outside of the key button 600. The deposition layer 620 may protect the metal layer 610 by forming a film on the metal layer 610. Due to the grain boundary of the deposition material, one surface of the deposition layer 620 facing the outside of the electronic device 500 may be discontinuous. For example, the deposition layer 620 may be deposited on the metal layer 610 by a physical vapor deposition (PVD) process or a chemical vapor deposition (CVD) process. Due to the thickness of the deposition layer 620 and / or the discontinuous shape of one surface, it may be difficult to transmit an electrical signal from the outside through the key button 600. The deposition layer 620 may be formed by attaching deposition particles to the metal layer 610. For example, the deposition layer 620 may be formed by a PVD process (such as evaporation or sputtering of the deposition material) and / or a CVD process by a chemical reaction of the deposition material. The deposition particles constituting the deposition material may be stacked discontinuously on the metal layer 610 to form particle boundary surfaces, respectively.

[0082] According to an embodiment, the deposition layer 620 may provide various colors to the key button 600. For example, the color of the metal layer 610 may be different from the housing (eg, Figure 2 The housing 210 and Figure 5 The color of the housing 510 in the embodiment of the present invention is different from that of the housing 510 in the embodiment of the present invention. The deposition layer 620 may have the same or similar color as the housing 510. When the deposition layer 620 is disposed on the metal layer 610, the key button 600 may have the same or similar color as the housing 510 to provide a uniform color or metal texture of the electronic device 500. Based on the specified color, the material or thickness of the deposition layer 620 may be defined. The deposition layer 620 thickened to achieve the specified color may have a high resistance. Due to the high resistance of the deposition layer 620, the loss of the electrical signal transmitted to the metal layer 610 through the deposition layer 620 may increase.

[0083] According to an embodiment, the deposition layer 620 may include at least one of titanium, chromium tungsten, silicon, aluminum, gold, copper, silver, and oxides, nitrides, carbides, and carbonitrides thereof. The deposition layer 620 may include at least one of a metal material (e.g., titanium, tungsten, silicon, aluminum, gold, copper, silver), a non-metal material (e.g., nitrogen, oxygen, carbon), and a combination of a metal material and a non-metal material. For example, the combination of a metal material and a non-metal material may include at least one of an oxide of a metal material, a nitride of a metal material, and a carbide of a metal material. Using any one or a combination of two or more of the deposition materials, the deposition layer 620 may achieve various colors. According to an embodiment, the thickness of the deposition layer 620 may be 1 μm or more and 10 μm or less.

[0084] According to an embodiment, the metal layer 610 may include at least one groove 611. At least one groove 611 may be formed on one surface of the metal layer 610 facing the deposition layer 620. The metal layer 610 may be in contact with the conductive material 630 occupying the at least one groove 611. The at least one groove 611 may provide contact between the metal layer 610 and the conductive material 630. The at least one groove 611 may increase the contact area, thereby increasing the conductivity of the metal layer 610. For example, since the portion of the metal layer 610 facing the outside (where the groove 611 is formed) has a curved shape, the contact area with the conductive material 630 may be increased compared to the case of having a planar shape. As the contact area increases, the conductivity of the electrical signal transmitted to the metal layer 610 through the conductive material 630 may increase.

[0085] According to an embodiment, the deposition layer 620 may include at least one hole 621. The at least one hole 621 may penetrate the deposition layer 620. The deposition layer 620 may form a portion of the outer surface of the key button 600. For example, the deposition layer 620 may be disposed on one surface of the metal layer 610 facing the outside of the key button 600. The at least one hole 621 may extend from one surface facing the outside of the deposition layer 620 to one surface of the deposition layer 620 contacting the metal layer 610.

[0086] According to an embodiment, the radius d2 / 2 of the side facing the outside of at least one hole 621 may be greater than or equal to the thickness d1 of the deposition layer 620. For example, a laser may be spot-irradiated on one surface facing the outside of the deposition layer 620 to form a hemispherical hole 621. The radius d2 / 2 of the hemisphere may be the same as the thickness d1 of the deposition layer 620. For example, at least one hole 621 may be formed on one surface facing the outside of the deposition layer 620 by wet etching. The hole 621 may have another shape (e.g., a cylindrical shape or a conical shape) other than the hemispherical shape. On one surface of the deposition layer 620, the remaining area other than the area corresponding to the at least one hole 621 may be masked. At least one hole 621 may be formed on one surface of the deposition layer 620 other than the remaining masked area by wet etching. The diameter d2 of one surface facing the outside of the hole 621 formed by wet etching may be greater than the thickness d1 of the deposition layer 620. For example, the diameter d2 of one surface facing outward of the hole 621 formed by pressing a protrusion having a diameter greater than the thickness d1 of the deposition layer 620 on one surface facing outward may be greater than the thickness d1 of the deposition layer 620 .

[0087] According to an embodiment, each of the at least one hole 621 may have a shape substantially the same or similar to each other. For example, by irradiating a laser onto the deposition layer 620, the deposition layer 620 may include a plurality of holes 621a, 621b, 621c, and 621d. The size and / or depth of the shape of the plurality of holes 621a, 621b, 621c, and 621d may be continuously adjusted according to the pulse duration of the laser. The laser may be spot irradiated. Due to the spot irradiation, one surface facing the outside of each of the plurality of holes 621a, 621b, 621c, and 621d may be a circle with a constant diameter. Since each of the plurality of holes 621a, 621b, 621c, and 621d has substantially the same diameter, each of the plurality of holes 621a, 621b, 621c, and 621d may have substantially the same or similar shape.

[0088] According to an embodiment, each of the at least one hole 621 may be spaced apart at a specified interval. For example, a plurality of holes 621a, 621b, 621c, and 621d may be formed in the deposition layer 620 to have a constant interval, respectively. The interval a1 between the first hole 621a and the second hole 621b arranged in a row in the long side direction of the key button 600 may be constant. The interval a2 between the first hole 621a and the third hole 621c arranged in a row in the short side direction of the key button 600 may be constant. For example, a masking area other than an area corresponding to the plurality of holes 621a, 621b, 621c, and 621d having a specified interval may be provided on one surface facing the outside of the deposition layer 620, and the plurality of holes 621a, 621b, 621c, and 621d may be formed by wet etching. For example, the laser device may irradiate laser light at a specified interval a1 in the long side direction of the key button 600 on the deposition layer 620, and may irradiate laser light at a specified interval a2 in the short side direction of the key button 600. By adjusting the intervals a1 and a2, the number of the at least one hole 621 formed on the deposition layer 620 may be adjusted.

[0089] According to an embodiment, the metal layer 610 may include a groove 611 connected to at least one hole 621 formed in the deposition layer 620. The conductive material 630 may occupy the hole 621 and the groove 611. For example, the deposition layer 620 may be disposed on the metal layer 610, and the laser may be irradiated to the deposition layer 620. The laser may penetrate the deposition layer 620 by point irradiation to form at least one hole 621 in the deposition layer 620, and form a groove 611 connected to the at least one hole 621 on the metal layer 610. The shape of the at least one hole 621 and the at least one groove 611 connected to the hole 621 may be a hemispherical shape. The radius r of the hemisphere may be the same as the radius of the side of the hole 621 facing the outside. When the laser is point irradiated, the diameter 2r of the hemisphere may be reduced. By disposing the small diameter conductive material 630 in the hole 621 and the groove 611, the difference in visibility between the conductive material 630 and the deposition layer 620 may be reduced.

[0090] According to an embodiment, a conductive material 630 may be disposed in at least one hole 621 of the deposition layer 620 and in the groove 611 of the metal layer 610. The conductive material 630 may occupy the hole 621 and the groove 611, and may be in contact with a portion of the metal layer 610. The conductive material 630 may include a second surface 600B continuous with a first surface 600A of the deposition layer 620 exposed to the outside. For example, the deposition layer 620 may include a first surface 600A exposed to the outside. The conductive material 630 may occupy at least one hole 621 formed in the deposition layer 620. The conductive material 630 may be exposed through an externally facing surface of the at least one hole 621. The second surface 600B of the conductive material 630 may correspond to an externally facing surface of the at least one hole 621.

[0091] According to an embodiment, the metal layer 610 may include at least one groove 611 connected to at least one hole 621 formed in the deposition layer 620. The connection shape of the groove 611 and the hole 621 in which the conductive material 630 is disposed may be a hemispherical shape. The distance d3 from the metal layer 610 to the second surface 600B of the conductive material 630 may be the same as the radius d2 / 2 facing the outside of the hole 621. According to an embodiment, in the case where the conductive material 630 is not hemispherical, the distance d3 from the metal layer 610 to the second surface 600B of the conductive material 630 may be shorter than the radius d2 / 2 facing the outside of the hole 621. According to an embodiment, the distance d3 from the metal layer 610 to the second surface 600B exposed to the outside may be greater than the radius d2 / 2 of the side of the hole 621 facing the outside, and may be smaller than the diameter d2 of the one surface.

[0092] According to an embodiment, the second surface 600B of the conductive material 630 and the first surface 600A of the deposition layer 620 may be continuous. The deposition layer 620 and the conductive material 630 exposed through the hole 621 may form a portion of the outer surface of the key button 600. The second surface 600B may be continuous with the first surface 600A of the deposition layer 620. In the case where the user touches the key button 600, the key button 600 providing a continuous outer surface may provide a soft touch feeling to the user of the electronic device 500.

[0093] According to an embodiment, the conductive material 630 may be configured to transmit the microcurrent 650 caused by the contact of the external object 700 to the metal layer 610. For example, the microcurrent 650 caused by the contact with the external object 700 may be transmitted to the metal layer 610 through the conductive material 630 penetrating the deposition layer 620. When the external object 700 (e.g., a user's finger) contacts at least a portion of the second surface 600B of the outer surface of the key button formed by the first surface 600A and the second surface 600B, the microcurrent 650 may be generated. The conductive material 630 may transmit the microcurrent 650 generated by the external object 700 through the second surface 600B to the metal layer 610 in contact with the conductive material 630.

[0094] According to an embodiment, the conductive material 630 may include at least one of a metal, a transparent electrode, and carbon. The conductive material 630 may include one of nickel, a copper-tin alloy, a copper-tin-zinc alloy, chromium, gold, platinum, silver, copper, tin, zinc, rhodium, ruthenium, palladium, or a combination thereof. At least one or a combination of two or more materials that may be included in the conductive material 630 may provide a color that is substantially the same as or similar to the color of the deposition layer 620. The key button 600 having the color provided by the deposition layer 620 may provide a color that is consistent with the housing (e.g., Figure 5 The same or similar color as the color of the housing 510).

[0095] According to an embodiment, the key button 600 may further include an anti-fingerprint layer 640 disposed on an outer surface of the key button 600. For example, the anti-fingerprint layer 640 may be disposed on a continuous surface configured with the first surface 600A and the second surface 600B. The anti-fingerprint layer 640 may reduce traces generated by the external object 700 (e.g., a user's finger) on the continuous surface.

[0096] According to an embodiment, the equivalent resistance between the deposition layer 620 and the conductive material 630 may be 1KΩ or less. A part of the user's body may generate a microcurrent 650 at a level of 40μA to 60μA. Since the equivalent resistance between the deposition layer 620 and the conductive material 630 is 1KΩ or less, the microcurrent 650 generated by the part of the user's body may be transmitted to the internal components (e.g., Figure 4 Sensor 530 in).

[0097] Reference Figure 8 , the key button 600 may include a metal layer 610 , a deposition layer 620 , and a conductive material 630 , and at least one hole 621 included in the deposition layer 620 may contact one surface of the metal layer 610 facing outward.

[0098] and Figure 7 Depending on the conductive material in the deposition layer 620 , a distance d3 (which is the thickness of the conductive material 630 ) from the metal layer 610 to the second surface 600B of the conductive material 630 exposed to the outside may be the same as the thickness d1 of the deposition layer 620 .

[0099] According to an embodiment, the microcurrent 650 generated by an external object may be transmitted to the metal layer 610 through the conductive material 630. The deposition layer 620 may include at least one hole 621, and the conductive material 630 may be disposed in the hole 621 so as to transmit the microcurrent 650 generated by contact with the external object to the metal layer. The conductive material 630 may contact the metal layer 610 through the at least one hole 621. The second surface 600B of the conductive material 630 may be exposed to the first surface 600A of the deposition layer 620 through the hole 621. The distance d3, which is the thickness of the conductive material 630, may be the same as the thickness d1 of the deposition layer 620. According to an embodiment, the shape of at least one hole 621 included in the deposition layer 620 may be a hemispherical shape. The radius r of the hemisphere may be the same as the radius d2 / 2 of the side of the hole 621 facing the outside. For example, the deposition layer 620 may be disposed on the metal layer 610, and the laser may be irradiated from the outside of the deposition layer 620. The laser may be spot irradiated and penetrate the deposition layer 620. The shape of the hole 621 corresponding to the portion of the deposition layer 620 removed by the laser may be a hemispherical shape.

[0100] According to an embodiment, the conductive material 630 may be in contact with the metal layer 610 through at least one hole 621 included in the deposition layer 620. A distance d3 from the metal layer 610 of the conductive material 630 to the second surface 600B exposed to the outside may be the same as a radius d2 / 2 of one side of the hole 621 facing the outside. For example, the conductive material 630 may be in a hemispherical shape corresponding to the hole 621. The diameter 2r of the hemisphere may be the same as the diameter d2 of one surface of the hole 621 facing the outside. In the conductive material 630, a distance d3 from the metal layer 610 in contact with the conductive material 630 to the second surface 600B exposed to the outside may be the same as the radius r of the hemisphere.

[0101] According to an embodiment, Figure 7 and / or Figure 8 The conductive material 630 in the embodiment is described as having a hemispherical shape, but is not limited thereto. For example, at least one hole 621 and / or recess 611 may include a portion of a cylindrical shape having the same diameter extending from the hole 621. The recess 611 forming a conical shape in contact with the hole 621 may include a conical corner shape. For example, the depth of the hole 621 may be less than the radius r of a circle corresponding to the shape of the cross section of the hole 621 or the surface of the hole 621 facing the outside.

[0102] According to an embodiment, the conductive material 630 may be configured to transmit the microcurrent 650 generated by the contact of the external object 700 to the metal layer 610. For example, a portion of the metal layer 610 may be in contact with at least one hole 621 included in the deposition layer 620 disposed on the metal layer 610. The conductive material 630, which is in contact with the metal layer 610 and has a second surface 600B facing the outside, may be disposed in the hole 621. The second surface 600B may correspond to one surface facing the outside of the hole 621. Since one surface facing the outside of the hole 621 and the first surface 600A of the deposition layer 620 are continuous, the first surface 600A and the second surface 600B may constitute a continuous surface. When the external object 700 (e.g., a user's finger) contacts at least a portion of the second surface 600B included in the continuous surface, the microcurrent 650 may be generated. The conductive material 630 may transmit the microcurrent 650 generated by the external object 700 through the second surface 600B to the metal layer 610 in contact with the conductive material 630.

[0103] According to the above-described embodiment, the key button 600 included in the electronic device 500 includes a deposition layer 620 disposed on the metal layer 610, and thus has the same or similar color as the housing 510 of the electronic device 500, thereby providing a uniform color or metal texture of the electronic device 500. The deposition layer 620 may expose the conductive material 630 to the outside by providing at least one hole 621 so that the conductive material 630 may contact the metal layer 610. The conductive material 630 exposed to the outside transmits the electrical signal transmitted by directly contacting the external object 700 to the metal layer 610, thereby reducing the loss of the electrical signal. The at least one hole 621 may include a plurality of holes 621a, 621b, 621c, and 621d spaced apart at specified intervals, thereby reducing the sense of difference from the color of the exposed conductive material 630.

[0104] Fig. 9 is a flow chart showing a deposition and plating process for a key button of an electronic device.

[0105] Reference Fig. 9 , electronic devices (e.g. Figure 1 The electronic device 101 in Figure 2 The electronic device 200, Figure 5 The key button of the electronic device 500 (eg, Figure 2 Key buttons 203 and 204), Figure 5 The key buttons 503, 504 and Figure 6 The deposition and plating process of the key button 600 may include multiple steps.

[0106] According to an embodiment, in step 910, a metal layer (e.g., Figure 7 A deposition layer (eg, Figure 7 The deposition layer 620 in the metal layer 610). The deposition layer 620 may be formed on the metal layer 610 by a deposition process such as a PVD process and / or a CVD process. For example, the metal layer 610 may be disposed in a vacuum chamber together with the deposition material. Particles separated from the deposition material may form the deposition layer 620 on the metal layer 610. For example, the metal layer 610 may be disposed in a vacuum chamber together with the deposition material, and deposition particles generated when the deposition material collides with gas ions (e.g., inert gas ions such as Ar) may form a film on the metal layer 610. The deposition particles constituting the deposition material may be stacked discontinuously on the metal layer 610 to form particle boundary surfaces, respectively.

[0107] According to an embodiment, at step 920, at least one hole (eg, Figure 7Hole 621 in the metal layer 610). The hole 621 may be formed by at least one process of laser irradiation, wet etching or mechanical processing. For example, laser may be spot-irradiated on one surface of the deposition layer 620 facing outward, and at least one hole 621 having a hemispherical shape may be formed in the deposition layer 620. The radius of the hemisphere may be greater than or equal to the thickness of the deposition layer 620. The hemispherical hole 621 may expose a portion of the metal layer 610 to the outside. For example, a masking area other than an area corresponding to one surface facing outward of at least one hole 621 may be provided on one surface of the deposition layer 620 facing outward, and a portion of the deposition layer 620 corresponding to the hole 621 may be removed by an etching solution. For example, the hole 621 may be formed by pressing a protrusion having a diameter corresponding to the diameter of one surface facing outward of the hole 621 on one surface of the deposition layer 620 facing outward.

[0108] According to an embodiment, in step 930, the oxide film formed on the metal layer 610 may be removed. For example, a laser with high-density energy may be irradiated on one surface of the deposition layer 620 facing the outside. The laser may penetrate the deposition layer 620 to heat the metal layer 610. An oxide film may be formed on the surface of the metal layer 610 exposed to heat and the outside according to the laser treatment. For example, since the laser has high-density energy and a portion of the metal layer 610 is exposed to the outside through the hole 621, an oxide film may be formed in a portion of the metal layer 610. The oxide film formed on the metal layer 610 may be removed by adding an acidic solution (e.g., hydrochloric acid) or an alkaline solution (e.g., an aqueous sodium hydroxide solution) to the hole 621.

[0109] According to an embodiment, in step 940, at least one hole 621 formed in the deposition layer 620 may be coated with a conductive material (eg, Figure 7 Conductive material 630 in the metal layer 610). Conductive material 630 may be plated on the surface of the metal layer 610 to fill at least one hole 621 with the conductive material 630. For example, in the plating process, the conductive material 630 may be coated on the portion of the metal layer 610 exposed to the outside through at least one hole 621. The metal layer 610 and the conductive material 630 may be placed in an electrolyte solution. The metal layer 610 may be electrically connected to the cathode. The conductive material 630 may be electrically connected to the anode. By allowing current to flow between the cathode and the anode, the conductive material 630 may be ionized. Since the metal layer 610 having conductivity is exposed through at least one hole 621, the conductive material 630 may be plated into the metal layer 610 exposed by at least one hole 621. The plating thickness of the conductive material 630 may be adjusted by adjusting the intensity of the current and / or the time for the current to flow.

[0110] According to the above-described embodiment, by providing a conductive material in a deposited layer forming the outside of a key button, the key button can be used as an electrode of a sensor inside an electronic device. The conductive material can provide a path through which a microcurrent generated by contact with an external object flows. By providing a conductive material on a deposited layer having a high resistance, the total resistance of the key button can be reduced.

[0111] According to the above-mentioned embodiments, the electronic device (eg, Figure 2 The electronic device 200 in the embodiment may include: a housing (eg, Figure 2 210 in the housing, which includes a front surface (e.g., Figure 2 The front surface 210A in the figure), the rear surface (e.g., Figure 2 The rear surface 210B in the figure) and the side surface disposed between the front surface and the rear surface (eg, Figure 2 210C), and providing an inner space surrounded by a front surface, a rear surface, and a side surface; a sensor (eg, Figure 5 sensor 530 in); and key buttons (e.g., Figure 2 203 and 204), including electrodes (e.g., Figure 5 The first electrode 521 in the side surface is at least partially inserted into the opening formed on the side surface (eg, Figure 5 The electrodes are electrically connected to the sensor and are configured to be electrically connected to the sensor by contact with an external object (e.g., Figure 7 According to an embodiment, the key button may include: a metal layer (e.g., Figure 7 metal layer 610 in the embodiment of the present invention); a deposition layer (e.g., Figure 7 The deposited layer 620 in FIG. 60 includes a hole connected to a portion of the metal layer (eg, Figure 7 and a conductive material (eg, Figure 7 According to one embodiment, the diameter of the side of the hole facing the outside (e.g., Figure 7 d2 in the figure) is greater than the thickness of the deposited layer (e.g., Figure 7 d1 in the figure).

[0112] According to an embodiment, the metal layer may include a groove connected to the hole (eg, Figure 7 The recess 611 in the hole is formed, and the conductive material can occupy the hole and the recess.

[0113] According to an embodiment, the distance from the metal layer to the surface of the conductive material exposed to the outside (eg, Figure 7 d3) in the figure can be equal to the radius of the one side of the hole.

[0114] According to an embodiment, the hole may include a plurality of holes (e.g., Figure 6 The plurality of holes 621a, 621b, 621c and 621d in the embodiment of the present invention are provided, and each of the plurality of holes can be provided at a specified interval (e.g., Figure 6 a1 and a2) in are separated.

[0115] According to an embodiment, the thickness of the deposited layer may be less than or equal to the radius of the one side of the hole.

[0116] According to an embodiment, the surface of the conductive material exposed to the outside (e.g., the second surface 600B) and one surface of the deposited layer (e.g., the first surface 600A) may be continuous, and the conductive material may be configured to transmit a microcurrent (e.g., Figure 7 The micro-current 650) in the tube is transmitted to the metal layer.

[0117] According to an embodiment, the electronic device may further include an anti-fingerprint layer (eg, Figure 7 The anti-fingerprint layer 640 in FIG.

[0118] According to an embodiment, the thickness of the deposited layer may be 1 μm or more and 10 μm or less.

[0119] According to an embodiment, the case may include at least one of stainless steel (SUS), aluminum, titanium, zirconium, or an alloy thereof; and the metal layer may include the same material as the case.

[0120] According to an embodiment, the deposition layer may include at least one of Ti, Cr, W, Si, Al, Cu, Ag, oxide (O), nitride (N), carbide (C), or carbonitride (CN).

[0121] According to an embodiment, the conductive material includes at least one of metal, a transparent electrode or carbon.

[0122] According to an embodiment, the conductive material may include at least one of nickel, a copper-tin alloy, a copper-tin-zinc alloy, chromium, gold, platinum, silver, copper, tin, zinc, rhodium, ruthenium, or palladium.

[0123] According to an embodiment, the equivalent resistance between the deposited layer and the conductive material may be 1 KΩ or less.

[0124] According to an embodiment, the electronic device may include another electrode different from the electrode (eg, Figure 5 522 in the second electrode); and a processor (e.g., Figure 5According to an embodiment, the processor may be configured to obtain data related to a microcurrent generated by an external object based on recognizing contact of the external object with each of the electrode and the other electrode through the sensor.

[0125] According to an embodiment, the sensor may include an ECG sensor or a fingerprint sensor.

[0126] According to an embodiment, an electronic device may include: a housing including a front surface, a rear surface that contacts a part of a user's body when the user wears the electronic device, and a side surface disposed between the front surface and the rear surface, and providing an internal space surrounded by the front surface, the rear surface, and the side surface; a display (e.g., Figure 2 220 in the display); with (e.g., Figure 2 The combination members 250 and 260 in the electronic device are arranged around a part of the user's body when the user wears the electronic device and are rotatable relative to the housing; a sensor arranged in the internal space; at least one key button including a first electrode (e.g., Figure 5 A first electrode 521 in the back surface) and at least partially inserted into an opening formed on the side surface, the first electrode being electrically connected to the sensor and configured to obtain biometric information through the sensor by contact with an external object; and a second electrode (e.g., Figure 5 According to an embodiment, the at least one key button may include: a metal layer having a groove; a deposition layer including a hole connected to the groove and disposed on the metal layer; a conductive material disposed in the groove and the hole and in contact with the metal layer exposed by the groove; and a processor. According to an embodiment, a diameter of a side of the hole facing the outside is greater than a thickness of the deposition layer, and the processor is configured to obtain data related to biometric information based on sensing data obtained by a sensor electrically connected to the first electrode and the second electrode.

[0127] According to an embodiment, a connection shape of the groove and the hole may be a hemispherical shape, and a radius of the hemisphere may be the same as a radius of the one side of the hole.

[0128] According to an embodiment, a distance from the metal layer to the surface of the conductive material exposed to the outside may be shorter than or equal to a radius of the one side of the hole.

[0129] According to an embodiment, the hole may include a plurality of holes, and each of the plurality of holes is spaced apart at a designated interval.

[0130] According to an embodiment, a surface of the conductive material exposed to the outside and the one surface of the deposited layer may be continuous, and the conductive material may be configured to transmit a micro current generated by contact of an external object to the metal layer.

[0131] According to an embodiment, the electronic device may further include an anti-fingerprint layer disposed on an outer surface of the key.

[0132] According to an embodiment, the sensor may include an ECG sensor or a fingerprint sensor.

[0133] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0134] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, and include various changes, equivalents or substitutes of the corresponding embodiments. With respect to the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that, unless otherwise clearly stated in the relevant context, the singular form of the noun corresponding to the project may include one or more things. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in a corresponding phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to as being "coupled to" another element (e.g., a second element), "coupled to" another element, "connected to" another element, or "connected to" another element, with or without the term "operably" or "communicatively", it means that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0135] As used in conjunction with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or its smallest unit or portion. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0136] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in a storage medium and execute the at least one instruction with or without one or more other components. This allows the machine to be operated to perform at least one function according to at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0137] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0138] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device, comprising: a housing including a front surface, a rear surface, and a side surface disposed between the front surface and the rear surface, and providing an inner space surrounded by the front surface, the rear surface, and the side surface; A sensor is disposed in the internal space; as well as a key button including an electrode and at least partially inserted into the opening formed on the side surface, the electrode being electrically connected to the sensor and configured to obtain biometric information through contact with an external object through the sensor; The key buttons include: Metal layer, a deposition layer including a hole connected to a portion of the metal layer and disposed on the metal layer, and a conductive material disposed in the hole and in contact with the metal layer exposed through the hole, The diameter of the side of the hole facing outward is greater than the thickness of the deposited layer.

2. The electronic device according to claim 1, wherein the metal layer includes a groove connected to the hole, and wherein the conductive material occupies the hole and the recess. 3 . The electronic device according to claim 2 , wherein a distance from the groove to a surface of the conductive material exposed to the outside is equal to a radius of the one side of the hole.

4. The electronic device according to claim 1, wherein the hole comprises a plurality of holes, and Each of the plurality of holes is spaced apart at a specified interval. The electronic device according to claim 1 , wherein a thickness of the deposited layer is less than or equal to a radius of the one side of the hole.

6. The electronic device according to claim 1, wherein a surface of the conductive material exposed to the outside and a surface of the deposited layer are continuous, and The conductive material is configured to transmit a microcurrent generated by contact of the external object to the metal layer. 7 . The electronic device according to claim 6 , further comprising an anti-fingerprint layer provided on an outer surface of the key button. 8 . The electronic device according to claim 1 , wherein a thickness of the deposition layer is 1 μm or more and 10 μm or less.

9. The electronic device according to claim 1, wherein the housing comprises at least one of stainless steel (SUS), aluminum, titanium, zirconium or alloys thereof, and The metal layer comprises the same material as that of the housing.

10. The electronic device of claim 1, wherein the deposited layer comprises at least one of Ti, Cr, W, Si, Al, Cu, Ag, oxide (O), nitride (N), carbide (C), or carbonitride (CN).

11. The electronic device of claim 1, wherein the conductive material comprises at least one of metal, a transparent electrode, or carbon.

12. The electronic device of claim 1, wherein the conductive material comprises at least one of nickel, copper-tin alloy, copper-tin-zinc alloy, chromium, gold, platinum, silver, copper, tin, zinc, rhodium, ruthenium, or palladium. 13 . The electronic device according to claim 1 , wherein an equivalent resistance between the deposition layer and the conductive material is 1 KΩ or less.

14. The electronic device according to claim 1, further comprising: another electrode different from the electrode; as well as processor, and The processor is configured to obtain data related to a microcurrent generated by the external object based on identifying contact of the electrode with the external object and contact of the other electrode with the external object through the sensor.

15. The electronic device of claim 1, wherein the sensor comprises an electrocardiogram (ECG) sensor or a fingerprint sensor.

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