Semiconductor silicon wafer surface polishing machine

Abstract

The present invention relates to the field of semiconductor silicon wafer production technology, specifically to a semiconductor silicon wafer surface polishing machine, wherein the upper end surface of the base is fixedly installed with front-to-back symmetrical vertical slide bars and a support cylinder located between the front-to-back symmetrical vertical slide bars, and the upper end surface of the base is also provided with a transportation mechanism for continuously transporting semiconductor silicon wafers to a polishing space. The semiconductor silicon wafer surface polishing machine, through the coordinated use of the transportation mechanism, the fixing mechanism and the polishing mechanism, adopts an integrated operation model of loading, polishing and unloading to complete continuous multiple polishing of the surface of the semiconductor silicon wafer, realizes continuous transportation and gradually refined polishing operations, ensures that each silicon wafer is processed under the same conditions, thereby improving the surface quality and consistency of the silicon wafer, and improving the smoothness and overall surface quality of the silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor silicon wafer production, in particular to a semiconductor silicon wafer surface polishing machine. Background Art

[0002] Semiconductor silicon wafers are a material made of high-purity single-crystal silicon and are often used as a substrate for manufacturing semiconductor devices. When using semiconductor silicon wafers to produce integrated circuits, it is usually necessary to perform doping, photolithography, metallization and other processes on the front side of the silicon wafer. However, before processing, the surface of the 500-micron-thick semiconductor silicon wafer also needs to be polished to remove tiny defects and unevenness on the surface of the silicon wafer, making its surface smoother and flatter, thereby ensuring the uniformity and precision of subsequent processing.

[0003] At present, there are still the following disadvantages when polishing the surface of semiconductor silicon wafers: 1. During polishing, it is usually necessary to first fix a semiconductor silicon wafer in the corresponding position, and then use polishing heads with gradually increasing mesh numbers to polish the surface of the semiconductor silicon wafer one by one, and after all polishing operations are completed, the semiconductor silicon wafer is taken out before continuing the polishing operation of the next semiconductor silicon wafer. In the above polishing process, it is necessary to continuously switch different polishing heads to perform polishing operations on a single semiconductor silicon wafer, because each switch requires additional time to stop, adjust the equipment and restart polishing, resulting in a decrease in the overall polishing efficiency; 2. Usually only the front side of the semiconductor silicon wafer is polished, and after the front side is polished, burrs are prone to form on the connecting edges of the front and side walls of the semiconductor silicon wafer, and the burrs may interfere with subsequent manufacturing processes, resulting in poor pattern transfer and material deposition, thereby affecting the performance of the final product. Summary of the invention

[0004] In order to solve the above-mentioned technical problems, the present invention provides a semiconductor silicon wafer surface polishing machine, which is achieved by the following specific technical means: a semiconductor silicon wafer surface polishing machine, comprising a base, on the upper end surface of the base are fixedly mounted front and rear symmetrical vertical sliding rods and a supporting tube located between the front and rear symmetrical vertical sliding rods, the upper end surface of the base is also provided with a transport mechanism for continuously transporting the semiconductor silicon wafers to the polishing space, and the front and rear symmetrical vertical sliding rods are jointly provided with a polishing mechanism for cooperating with the transport mechanism to perform gradually refined and continuous polishing on the semiconductor silicon wafers.

[0005] The transport mechanism includes a conveying part arranged on a base and used for feeding and unloading semiconductor silicon wafers. The base is provided with a matching part and a unloading part that cooperate with the conveying part. An intermittent part is arranged in the support cylinder for intermittently transporting semiconductor silicon wafers and providing power for the conveying part.

[0006] The intermittent part is provided with a fixing mechanism for clamping and fixing the semiconductor silicon wafer; the fixing mechanism comprises a clamping part arranged on the intermittent part, and a loading and unloading part for synchronously adjusting the clamping and fixing and releasing of the clamping part is arranged on the base.

[0007] The polishing mechanism comprises a driving part commonly arranged on front and rear symmetrical vertical slide bars, the driving part is provided with an execution part for polishing the semiconductor silicon wafer, and the driving part is also provided with an angle adjustment part for changing the polishing angle to polish the edge of the semiconductor silicon wafer.

[0008] As a preferred technical solution of the present invention, the intermittent part includes a central shaft, a first motor, a groove wheel and a supporting circular plate. The upper end surface of the base is equipped with a central shaft located at the axis of the supporting tube through a bearing, a groove wheel is fixedly mounted on the central shaft, and the upper end surface of the base is fixedly equipped with a first motor. The output end fixed sleeve of the first motor is equipped with a groove wheel lever cooperating with the groove wheel, and a supporting circular plate connected to the supporting tube through a bearing is fixedly mounted on the upper end of the central shaft.

[0009] As a preferred technical solution of the present invention, the conveying part includes a transport platform, an elliptical plate, a driving roller, a transport belt and a stop plate. The upper end surface of the base is fixedly installed with a transport platform that is distributed along the circumference of the supporting circular plate and is symmetrical on the left and right. The symmetrical transport platforms are perpendicular to each other. Symmetrical elliptical plates are fixedly installed on both side ends of the transport platform distributed along the circumference of the supporting circular plate. Symmetrical driving rollers are installed through bearings on the elliptical plates on the same transport platform, and the symmetrically distributed driving rollers are connected by a transport belt. A plurality of stop plates for radially transporting semiconductor silicon wafers along the supporting circular plate are evenly distributed along the contour of the outer ring wall of the transport belt.

[0010] As a preferred technical solution of the present invention, the mating part includes a first rotating shaft and a second rotating shaft, and the upper end surface of the base is rotatably installed with a first rotating shaft corresponding to the transport platform one by one through a bearing seat, the first rotating shaft and the corresponding driving roller close to the center of the supporting circular plate are connected by a first bevel gear group, the upper end surface of the base is rotatably installed with a second rotating shaft close to one of the first rotating shafts through a bearing seat, the second rotating shaft and the corresponding first rotating shaft are connected by a first transmission gear group, and the second rotating shaft and the other first rotating shaft are connected by a first belt transmission.

[0011] As a preferred technical solution of the present invention, the unloading part includes a second motor, an L-shaped support rod and a suction cup. The upper end surface of the base is fixedly installed with the second motor located on the left side of the left transport platform, and the output end of the second motor is fixedly installed with the L-shaped support rod. The horizontal section of the L-shaped support rod is located above the left transport platform, and the suction cup is fixedly installed on the end of the horizontal section of the L-shaped support rod away from its vertical section.

[0012] As a preferred technical solution of the present invention, the clamping part includes an execution groove, a supporting cone, a limiting slide, a screw, a clamping slider and a fourth rotating shaft, the upper end surface of the supporting circular plate is penetrated with a plurality of execution grooves in a circumferential array manner, a supporting cone with an internal cavity is fixedly installed in the execution groove, a plurality of limiting slides are penetrated through the upper end surface of the supporting cone in a circumferential array manner, the limiting slide extends radially along the supporting cone, a screw corresponding to the limiting slide is rotatably installed in the supporting cone through a bearing seat arranged therein, a clamping slider threadedly connected to the corresponding screw is slidably installed in the limiting slide, a fourth rotating shaft is penetrated by a bearing at the center of the supporting cone, a docking block is fixedly installed at the lower end of the fourth rotating shaft, a first transmission bevel gear is fixedly sleeved on the fourth rotating shaft, and a second transmission bevel gear is fixedly sleeved on the ends of the screws in the same supporting cone that are close to each other, and the first transmission bevel gear is meshed with a plurality of second transmission bevel gears at the same time.

[0013] As a preferred technical solution of the present invention, the loading and unloading part includes a first electric push rod, a support plate, a rotating drum, a matching shaft and a third motor. The upper end surface of the base is fixedly installed with the first electric push rod located below the supporting circular plate, the telescopic end of the first electric push rod is fixedly installed with the support plate, and a left-right symmetrical rotating drum is installed through a bearing on the support plate. The rotating drum corresponds to the transport platform one by one. A hexagonal alignment groove that matches the docking block is provided on the upper end surface of the rotating drum, and a matching shaft located between the left-right symmetrical rotating drums is installed through a bearing on the support plate. The matching shaft and the rotating drum on the right are connected to each other through a second transmission gear set, and the matching shaft and the rotating drum on the left are connected to each other through a second belt set. The third motor with an output end fixedly connected to the matching shaft is fixedly installed on the support plate through a motor seat set.

[0014] As a preferred technical solution of the present invention, the driving part includes a supporting plate, a cylinder, a turntable and a fourth motor. The supporting plate is slidably installed on the front and rear symmetrical vertical sliding rods. A cylinder with a telescopic end fixedly connected to the supporting plate is fixedly installed on the vertical sliding rod. A turntable corresponding to the supporting circular table is installed on the supporting plate through a bearing. The turntables are connected by a third belt transmission. A fourth motor is fixedly installed on the supporting plate, and the output end of the fourth motor is connected to one of the turntables by a third transmission gear set.

[0015] As a preferred technical solution of the present invention, the execution part includes a telescopic rod and a polishing plate. The telescopic rod is fixedly installed through the axis of the turntable, and the polishing plate is hinged at the lower end of the telescopic section of the telescopic rod. The polishing numbers of the multiple polishing plates increase successively along the circumference of the supporting plate.

[0016] As a preferred technical solution of the present invention, the angle adjustment part includes a second electric push rod, a lifting circular plate, a matching circular plate and a hinged rod. The second electric push rod is fixedly installed at the center of the upper end surface of the supporting plate. The telescopic end of the second electric push rod is fixedly installed with a lifting circular plate located directly above the supporting plate. A matching circular plate corresponding to the turntable is installed on the lifting circular plate through a bearing. The lower end of the matching circular plate is fixedly connected to the corresponding upper end of the telescopic rod. The lower end surface of the matching circular plate is eccentrically hinged with a hinged rod. The lower end of the hinged rod slides through the turntable and is hinged with a connecting slider. The connecting slider is slidably connected to the upper end surface of the polishing plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. The semiconductor silicon wafer surface polishing machine, through the coordinated use of the transport mechanism, the fixing mechanism and the polishing mechanism, adopts an integrated operation model of loading, polishing and unloading to complete the continuous multiple polishing of the surface of the semiconductor silicon wafer, realizes continuous transportation and gradually refined polishing operations, ensures that each silicon wafer is processed under the same conditions, thereby improving the surface quality and consistency of the silicon wafer, improving the smoothness and overall surface quality of the silicon wafer, integrating each link in the complete polishing operation, reducing conversion time and manual intervention, improving the continuity of the production line, and significantly improving the surface polishing efficiency of semiconductor silicon wafers.

[0018] 2. The semiconductor silicon wafer surface polishing machine continuously transports the semiconductor silicon wafer to the polishing space through the coordinated use of the transport mechanism and the fixing mechanism, and performs gradually refined continuous polishing operations on the semiconductor silicon wafer, thereby reducing the downtime of the equipment and improving the overall production efficiency. At the same time, it reduces the operational errors caused by multiple head changes or multi-step processing, ensuring that the polishing effect of each silicon wafer is more consistent, and through gradually refined polishing, the surface roughness of the silicon wafer can be better controlled, thereby improving the smoothness and surface quality of the silicon wafer.

[0019] 3. The semiconductor silicon wafer surface polishing machine, through the polishing mechanism set up, after polishing the surface of the semiconductor silicon wafer, also performs a gradually refined continuous polishing operation on the edge of the semiconductor silicon wafer by changing the polishing angle, so as to ensure the polishing uniformity of the edge area, effectively remove the burrs and defects on the edge, and improve the overall surface quality of the silicon wafer. In addition, through the appropriate polishing angle, the stress concentration generated in the edge area can be reduced, thereby reducing the risk of cracking or damage of the silicon wafer in subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention when it is working.

[0021] Figure 2 It is a schematic diagram of the local structure of the present invention.

[0022] Figure 3It is a three-dimensional structural schematic diagram of the transportation mechanism of the present invention.

[0023] Figure 4 for Figure 3 Schematic diagram of the enlarged structure at point A in the middle.

[0024] Figure 5 for Figure 3 Schematic diagram of the enlarged structure at point B in the middle.

[0025] Figure 6 It is a partial cross-sectional view of the loading and unloading part of the present invention.

[0026] Figure 7 It is a partial cross-sectional view of the polishing mechanism of the present invention.

[0027] Figure 8 It is a partial cross-sectional view of the angle adjustment portion of the present invention.

[0028] In the figure: 1, base; 2, vertical slide; 3, support cylinder; 4, transportation mechanism; 41, intermittent part; 411, central shaft; 412, first motor; 413, groove wheel; 414, support circular plate; 42, conveying part; 421, transportation platform; 422, elliptical plate; 423, driving roller; 424, transportation belt; 425, abutment plate; 43, matching part; 431, first rotating shaft; 432, second rotating shaft; 44, unloading part; 441, second motor; 442, L-shaped support rod; 443, suction cup; 5, fixing mechanism; 51, clamping part; 511, execution groove; 512, support Supporting circular table; 513, limiting slideway; 514, screw; 515, clamping slider; 516, fourth rotating shaft; 52, loading and unloading part; 521, first electric push rod; 522, supporting plate; 523, rotating drum; 524, matching shaft; 525, third motor; 6, polishing mechanism; 61, driving part; 611, supporting plate; 612, cylinder; 613, turntable; 614, fourth motor; 62, executive part; 621, telescopic rod; 622, polishing plate; 63, angle adjustment part; 631, second electric push rod; 632, lifting circular plate; 633, matching circular plate; 634, hinged rod. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] See also Figure 1A semiconductor silicon wafer surface polishing machine includes a base 1, on the upper end surface of the base 1 are fixedly mounted front and rear symmetrical vertical slide rods 2 and a support tube 3 located between the front and rear symmetrical vertical slide rods 2, the upper end surface of the base 1 is also provided with a transportation mechanism 4 for continuously transporting semiconductor silicon wafers to a polishing space, and the front and rear symmetrical vertical slide rods 2 are jointly provided with a polishing mechanism 6 for cooperating with the transportation mechanism 4 to perform gradually refined and continuous polishing on the semiconductor silicon wafer.

[0031] See also Figure 1 and Figure 2 The transport mechanism 4 includes a conveying portion 42 arranged on the base 1 and used for feeding and unloading semiconductor silicon wafers. The base 1 is provided with a matching portion 43 and a unloading portion 44 that cooperate with the conveying portion 42. The support cylinder 3 is provided with an intermittent portion 41 for intermittently transporting semiconductor silicon wafers and providing power for the conveying portion 42.

[0032] See also Figure 1 and Figure 2 The intermittent portion 41 is provided with a fixing mechanism 5 for clamping and fixing the semiconductor silicon wafer; the fixing mechanism 5 includes a clamping portion 51 arranged on the intermittent portion 41, and the base 1 is provided with a loading and unloading portion 52 for synchronously adjusting the clamping and fixing and releasing of the clamping portion 51.

[0033] See also Figure 1 The polishing mechanism 6 includes a driving part 61 commonly arranged on the front and rear symmetrical vertical slide rods 2, the driving part 61 is provided with an execution part 62 for polishing the semiconductor silicon wafer, and the driving part 61 is also provided with an angle adjustment part 63 for changing the polishing angle to polish the edge of the semiconductor silicon wafer.

[0034] See also Figure 1 and Figure 2 The intermittent part 41 includes a central shaft 411, a first motor 412, a groove wheel 413 and a supporting circular plate 414. The upper end surface of the base 1 is equipped with a central shaft 411 located at the axis of the supporting tube 3 through a bearing, and a groove wheel 413 is fixedly sleeved on the central shaft 411. The upper end surface of the base 1 is fixedly equipped with a first motor 412, and the output end of the first motor 412 is fixedly sleeved with a groove wheel lever cooperating with the groove wheel 413. The upper end of the central shaft 411 is fixedly equipped with a supporting circular plate 414 connected to the supporting tube 3 through a bearing.

[0035] See also Figure 1 , Figure 2 and Figure 3The conveying part 42 includes a conveying platform 421, an elliptical plate 422, a driving roller 423, a conveying belt 424 and a stop plate 425. The upper end surface of the base 1 is fixedly installed with a conveying platform 421 that is distributed circumferentially along the supporting circular plate 414 and is symmetrical on the left and right. The symmetrical conveying platforms 421 are perpendicular to each other. The two side ends of the conveying platform 421 distributed circumferentially along the supporting circular plate 414 are fixedly installed with symmetrical elliptical plates 422. The symmetrically distributed driving rollers 423 are penetrated by the elliptical plates 422 on the same conveying platform 421 through the provided bearings, and the symmetrically distributed driving rollers 423 are connected by the provided conveying belt 424. The outer ring wall of the conveying belt 424 is evenly distributed with a plurality of stop plates 425 for radially transporting semiconductor silicon wafers along the supporting circular plate 414 along its contour.

[0036] See also Figure 1 , Figure 2 and Figure 3 The matching part 43 includes a first rotating shaft 431 and a second rotating shaft 432. The upper end surface of the base 1 is rotatably installed with a first rotating shaft 431 corresponding to the transportation platform 421 through a bearing seat. The first rotating shaft 431 and the corresponding driving roller 423 close to the center of the supporting circular plate 414 are connected by a first bevel gear set. The upper end surface of the base 1 is rotatably installed with a second rotating shaft 432 close to one of the first rotating shafts 431 through a bearing seat. The second rotating shaft 432 and the corresponding first rotating shaft 431 are connected by a first transmission gear set, and the second rotating shaft 432 and the other first rotating shaft 431 are connected by a first belt drive.

[0037] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5The clamping portion 51 includes an execution groove 511, a support truncated plate 512, a limiting slide 513, a screw 514, a clamping slider 515 and a fourth rotating shaft 516. The upper end surface of the support circular plate 414 is provided with a plurality of execution grooves 511 in a circumferential array manner. A support truncated plate 512 with a cavity inside is fixedly installed in the execution groove 511. The upper end surface of the support truncated plate 512 is provided with a plurality of limiting slides 513 in a circumferential array manner. The limiting slides 513 extend radially along the support truncated plate 512. The support truncated plate 512 is rotated by a bearing seat arranged in the support truncated plate 512. Screw rods 514 corresponding to the limiting slideways 513 are installed one by one, and a clamping slider 515 threadedly connected to the corresponding screw rod 514 is slidably installed in the limiting slideway 513. A fourth rotating shaft 516 is installed at the center of the supporting truncated table 512 through a bearing, and a docking block is fixedly installed at the lower end of the fourth rotating shaft 516. A first transmission bevel gear is fixedly sleeved on the fourth rotating shaft 516. The ends of the screw rods 514 in the same supporting truncated table 512 that are close to each other are fixedly sleeved with a second transmission bevel gear, and the first transmission bevel gear is meshed and connected with a plurality of second transmission bevel gears at the same time.

[0038] In specific operation, when it is necessary to polish the semiconductor silicon wafer, the semiconductor silicon wafer to be polished is first placed on the upper end surface of the right conveyor belt 424 by an external manipulator. At this time, the first motor 412 is in an unstarted state, so that the support circular plate 414 with one of the execution grooves 511 corresponds to the conveyor belt 424 on the right side (i.e. the right side) of the front vertical slide bar 2, and at the same time, the execution groove 511 on the other side corresponds to the conveyor belt 424 on the left side (i.e. the left side) of the front vertical slide bar 2 (e.g. Figure 1 as shown).

[0039] Then, the external motor whose output end is fixedly connected to the second rotating shaft 432 is started to rotate the second rotating shaft 432, and the second rotating shaft 432 will make the two first rotating shafts 431 rotate synchronously through the first belt and the first transmission gear group. The first rotating shaft 431 rotates the driving roller 423 through the first bevel gear group, thereby causing the transport belt 424 to rotate. The transport belt 424 on the right side pushes the placed semiconductor silicon wafer into the corresponding execution groove 511 through the abutment plate 425 until the semiconductor silicon wafer is pushed to the upper end surface of the supporting truncated table 512. At this time, the external motor can be stopped to complete the loading operation of the first semiconductor silicon wafer.

[0040] During the rotation of the right conveyor belt 424 , the left conveyor belt 424 moves in a direction away from the corresponding execution groove 511 , so that the polished semiconductor silicon wafers can be discharged outward.

[0041] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The loading and unloading part 52 includes a first electric push rod 521, a support plate 522, a rotating drum 523, a matching shaft 524 and a third motor 525. The first electric push rod 521 located below the supporting circular plate 414 is fixedly installed on the upper end surface of the base 1, and the telescopic end of the first electric push rod 521 is fixedly installed with a support plate 522. A left-right symmetrical rotating drum 523 is installed through a bearing on the support plate 522. The rotating drum 523 corresponds to the transportation platform 421 one by one. A hexagonal alignment groove that matches the docking block is provided on the upper end surface of the rotating drum 523. A matching shaft 524 located between the left-right symmetrical rotating drums 523 is installed through a bearing on the support plate 522. The matching shaft 524 and the right rotating drum 523 are connected by a second transmission gear set, and the matching shaft 524 and the left rotating drum 523 are connected by a second belt drive set. The third motor 525 with an output end fixedly connected to the matching shaft 524 is fixedly installed on the support plate 522 through a motor seat.

[0042] During specific operation, after the loading of the first semiconductor silicon wafer is completed, the first electric push rod 521 is started to make it rise with the support plate 522, and the hexagonal alignment groove on the rotating drum 523 is docked with the corresponding docking block at the lower end of the fourth rotating shaft 516. When the docking block is fully inserted into the hexagonal alignment groove, the first electric push rod 521 is stopped. At this time, the docking block corresponding to the right transport platform 421 and the docking block corresponding to the left transport platform 421 are respectively inserted into the corresponding hexagonal alignment grooves.

[0043] Then, the third motor 525 is started to rotate the matching shaft 524, and the right-side rotating drum 523 is rotated in the opposite direction through the second transmission gear set, thereby driving the fourth rotating shaft 516 on the right side to rotate in the opposite direction. At the same time, the matching shaft 524 will drive the left-side rotating drum 523 to rotate forwardly through the second belt, thereby driving the fourth rotating shaft 516 on the left side to rotate forwardly.

[0044] When the fourth rotating shaft 516 on the right side rotates in the opposite direction, it will drive the plurality of screw rods 514 to rotate synchronously through the cooperation of the first transmission bevel gear and the second transmission bevel gear, so that the clamping sliders 515 on all sides synchronously approach the semiconductor silicon wafer until the clamping sliders 515 on all sides clamp and fix the semiconductor silicon wafer. At this time, the third motor 525 can be stopped. When the fourth rotating shaft 516 on the left side rotates in the forward direction, the clamping sliders 515 on all sides will synchronously move away from the axis of the supporting truncated table 512. If a semiconductor silicon wafer is clamped on the corresponding supporting truncated table 512 at this time, the clamped semiconductor silicon wafer will be released.

[0045] See also Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8The driving part 61 includes a supporting plate 611, a cylinder 612, a turntable 613 and a fourth motor 614. The supporting plate 611 is slidably installed on the front and rear symmetrical vertical sliding rods 2. The cylinder 612 whose telescopic end is fixedly installed on the vertical sliding rod 2 and is fixedly connected to the supporting plate 611. Turntables 613 corresponding to the supporting round tables 512 are installed on the supporting plate 611 through bearings. The turntables 613 are connected by a third belt transmission. A fourth motor 614 is fixedly installed on the supporting plate 611. The output end of the fourth motor 614 is connected to one of the turntables 613 by a third transmission gear set.

[0046] See also Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 The execution part 62 includes a telescopic rod 621 and a polishing plate 622. The telescopic rod 621 is fixedly installed at the axis of the turntable 613, and the polishing plate 622 is hinged at the lower end of the telescopic section of the telescopic rod 621. The polishing number of the multiple polishing plates 622 increases sequentially along the circumference of the supporting plate 611.

[0047] See also Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 The angle adjustment part 63 includes a second electric push rod 631, a lifting circular plate 632, a matching circular plate 633 and a hinged rod 634. The second electric push rod 631 is fixedly installed at the center of the upper end surface of the supporting plate 611. The telescopic end of the second electric push rod 631 is fixedly installed with a lifting circular plate 632 located just above the supporting plate 611. The lifting circular plate 632 is penetrated by a bearing and is penetrated with a matching circular plate 633 corresponding to the turntable 613. The lower end of the matching circular plate 633 is fixedly connected to the corresponding upper end of the telescopic rod 621. The lower end surface of the matching circular plate 633 is eccentrically hinged with a hinged rod 634. The lower end of the hinged rod 634 slides through the turntable 613 and is hinged to a connecting slider. The connecting slider is slidably connected to the upper end surface of the polishing plate 622.

[0048] During specific operation, when it is necessary to polish the semiconductor silicon wafer, start the cylinder 612 to lower it with the supporting plate 611, and at the same time start the fourth motor 614 to rotate one of the turntables 613 through the third transmission gear group, and drive all the turntables 613 to rotate synchronously through the third belt. At this time, the second electric push rod 631 is in an unstarted state, so that the polishing plate 622 is in a horizontal state, and the turntable 613 will drive the matching circular plate 633 to rotate synchronously with the turntable 613 on the lifting circular plate 632 through the telescopic rod 621 and the hinged rod 634. When the polishing plate 622 contacts the upper end surface of the semiconductor silicon wafer, the cylinder 612 can be stopped. At this time, the rotating polishing plate 622 will polish the upper surfaces of multiple semiconductor silicon wafers at the same time.

[0049] After the plane polishing is completed, the fourth motor 614 is first turned off, and the second electric push rod 631 is started to make it rise a certain distance with the lifting circular plate 632. At this time, the matching circular plate 633 will rise with the lifting circular plate 632, and the telescopic rod 621 will compensate for the distance difference between the matching circular plate 633 and the turntable 613, and the matching circular plate 633 will slightly lift one side of the polishing plate 622 through the hinge rod 634. At this time, the fourth motor 614 is started to make the turntable 613 rotate with the sinking side of the polishing plate 622 around the telescopic rod 621 as the center, so as to implement a gradually refined continuous polishing operation on the edge of the semiconductor silicon wafer by changing the polishing angle, so as to ensure the polishing uniformity of the edge area, effectively remove the burrs and defects on the edge, and improve the overall surface quality of the silicon wafer. After completing the edge polishing, the second electric push rod 631 is started in the reverse direction to reset the polishing plate 622.

[0050] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 The unloading part 44 includes a second motor 441, an L-shaped support rod 442 and a suction cup 443. The second motor 441 is fixedly installed on the upper end surface of the base 1 on the left side of the transportation platform 421 on the left side. The L-shaped support rod 442 is fixedly installed on the output end of the second motor 441. The horizontal section of the L-shaped support rod 442 is located above the transportation platform 421 on the left side. The suction cup 443 is fixedly installed on the end of the horizontal section of the L-shaped support rod 442 away from its vertical section.

[0051] During specific operation, after the first semiconductor silicon wafer is clamped and fixed, the first semiconductor silicon wafer is polished by the polishing mechanism 6, and after the first polishing is completed, the first motor 412 is started to rotate the supporting circular plate 414 to a certain angle through the cooperation of the groove wheel lever and the groove wheel 413, and then the next semiconductor silicon wafer can be sent into the next execution groove 511 through the conveying part 42, and then the conductor silicon wafer is polished again by the polishing mechanism 6. At this time, the first semiconductor silicon wafer will undergo a second polishing by the next polishing plate 622 with an increased mesh number, and the second semiconductor silicon wafer will undergo a first polishing, and then the above operation is repeated until the first semiconductor silicon wafer is moved to the position corresponding to the left transport platform 421.

[0052] Then, the second motor 441 is started to move the suction cup 443 to the top of the first semiconductor silicon wafer through the L-shaped support rod 442. At this time, the fixing mechanism 5 has released the fixation of the first semiconductor silicon wafer. Subsequently, the suction cup 443 is adsorbed to the first semiconductor silicon wafer through an external air pump. After the adsorption is completed, the second motor 441 is started in reverse to place the first semiconductor silicon wafer on the conveyor belt 424 on the left, thereby completing the continuous polishing of a semiconductor silicon wafer. Subsequently, the above operation only needs to be repeated to continuously transport the semiconductor silicon wafer to the polishing space, and the polishing mechanism 6 is used to perform gradually refined continuous polishing operations on the semiconductor silicon wafer, thereby reducing the downtime of the equipment and improving the overall production efficiency.

[0053] See also Figure 1 — Figure 8 Working principle: When it is necessary to polish the semiconductor silicon wafer, first place the semiconductor silicon wafer to be polished on the upper end surface of the right conveyor belt 424 through an external manipulator, start the external motor to push the semiconductor silicon wafer into the corresponding execution groove 511 through the conveying part 42, and then start the first electric push rod 521 to clamp and fix the semiconductor silicon wafer through the clamping part 51 and the loading and unloading part 52.

[0054] Then, the surface and edge of the first semiconductor silicon wafer are polished by the polishing mechanism 6, and after the first polishing is completed, it is rotated by a certain angle through the intermittent portion 41, and then the next semiconductor silicon wafer is sent into the next execution groove 511 through the conveying portion 42, and then the conductor silicon wafer is polished again by the polishing mechanism 6. At this time, the first semiconductor silicon wafer will undergo a second polishing, and the second semiconductor silicon wafer will undergo a first polishing, and then the above operation is repeated until the first semiconductor silicon wafer is moved to a position corresponding to the left transport platform 421.

[0055] Then, the first semiconductor silicon wafer is placed on the conveying belt 424 on the left through the cooperation of the unloading part 44 and the conveying part 42, thereby completing the continuous polishing of a semiconductor silicon wafer. Subsequently, the above operation only needs to be repeated to continuously transport the semiconductor silicon wafer to the polishing space, and the semiconductor silicon wafer is subjected to a gradually refined continuous polishing operation through the polishing mechanism 6.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor silicon wafer surface polishing machine, comprising a base (1), characterized in that: The upper end surface of the base (1) is fixedly mounted with front-to-back symmetrical vertical slide bars (2) and a support tube (3) located between the front-to-back symmetrical vertical slide bars (2); the upper end surface of the base (1) is also provided with a transport mechanism (4) for continuously transporting semiconductor silicon wafers to a polishing space; the front-to-back symmetrical vertical slide bars (2) are jointly provided with a polishing mechanism (6) for cooperating with the transport mechanism (4) to continuously polish the semiconductor silicon wafers; The transport mechanism (4) comprises a transport portion (42) arranged on the base (1) and used for feeding and unloading semiconductor silicon wafers, a matching portion (43) and a discharge portion (44) matched with the transport portion (42) are arranged on the base (1), and an intermittent portion (41) for intermittently transporting semiconductor silicon wafers and providing power for the transport portion (42) is arranged in the support cylinder (3); The intermittent portion (41) is provided with a fixing mechanism (5) for clamping and fixing the semiconductor silicon wafer; The fixing mechanism (5) comprises a clamping portion (51) arranged on the intermittent portion (41), and the base (1) is provided with a loading and unloading portion (52) for synchronously adjusting the clamping and fixing and releasing of the clamping portion (51); The polishing mechanism (6) comprises a driving part (61) commonly arranged on the front and rear symmetrical vertical slide bars (2), the driving part (61) being provided with an execution part (62) for polishing the semiconductor silicon wafer, and the driving part (61) being further provided with an angle adjustment part (63) for changing the polishing angle to polish the edge of the semiconductor silicon wafer; The clamping portion (51) comprises a supporting truncated table (512); The driving part (61) comprises a supporting plate (611), a cylinder (612), a turntable (613) and a fourth motor (614); the supporting plate (611) is slidably mounted on the front-rear symmetrical vertical slide bars (2); a cylinder (612) whose telescopic end is fixedly connected to the supporting plate (611) is fixedly mounted on the vertical slide bars (2); a turntable (613) corresponding to the supporting round table (512) is mounted on the supporting plate (611) via a bearing; the turntables (613) are connected to each other via a third belt transmission; a fourth motor (614) is fixedly mounted on the supporting plate (611); an output end of the fourth motor (614) is connected to one of the turntables (613) via a third transmission gear set; The execution part (62) comprises a telescopic rod (621) and a polishing plate (622); the telescopic rod (621) is fixedly installed at the axis of the turntable (613) and penetrates through the turntable; the polishing plate (622) is hingedly connected to the lower end of the telescopic section of the telescopic rod (621); the polishing numbers of the multiple polishing plates (622) increase in sequence along the circumference of the supporting plate (611); The angle adjustment part (63) comprises a second electric push rod (631), a lifting circular plate (632), a matching circular plate (633) and a hinged rod (634). The second electric push rod (631) is fixedly installed at the center of the upper end surface of the support plate (611). The telescopic end of the second electric push rod (631) is fixedly installed with a lifting circular plate (632) located directly above the support plate (611). A matching circular plate (633) corresponding to the turntable (613) is installed on the lifting circular plate (632) through a bearing. The lower end of the matching circular plate (633) is fixedly connected to the upper end of the corresponding telescopic rod (621). The lower end surface of the matching circular plate (633) is eccentrically hinged with a hinged rod (634). The lower end of the hinged rod (634) slides through the turntable (613) and is hinged with a connecting slider. The connecting slider is slidably connected to the upper end surface of the polishing plate (622).

2. A semiconductor silicon wafer surface polishing machine according to claim 1, characterized in that: The intermittent portion (41) comprises a central shaft (411), a first motor (412), a groove wheel (413) and a supporting circular plate (414); the central shaft (411) located at the axis of the supporting tube (3) is mounted on the upper end surface of the base (1) via a bearing; a groove wheel (413) is fixedly sleeved on the central shaft (411); the first motor (412) is fixedly mounted on the upper end surface of the base (1); a groove wheel lever cooperating with the groove wheel (413) is fixedly sleeved on the output end of the first motor (412); and a supporting circular plate (414) connected to the supporting tube (3) via a bearing is fixedly mounted on the upper end of the central shaft (411).

3. A semiconductor silicon wafer surface polishing machine according to claim 2, characterized in that: The conveying part (42) comprises a transport platform (421), an elliptical plate (422), a driving roller (423), a transport belt (424) and a stop plate (425). The upper end surface of the base (1) is fixedly provided with a transport platform (421) which is distributed along the circumference of the supporting circular plate (414) and is symmetrical on the left and right. The symmetrical transport platforms (421) are perpendicular to each other. The two side ends of the transport platform (421) which are distributed along the circumference of the supporting circular plate (414) are fixedly provided with symmetrical elliptical plates (422). The symmetrically distributed driving rollers (423) are installed through bearings between the elliptical plates (422) on the same transport platform (421). The symmetrically distributed driving rollers (423) are connected to each other through a transport belt (424). The outer ring wall of the transport belt (424) is evenly provided with a plurality of stop plates (425) along its contour for radially transporting semiconductor silicon wafers along the supporting circular plate (414).

4. A semiconductor silicon wafer surface polishing machine according to claim 3, characterized in that: The matching portion (43) comprises a first rotating shaft (431) and a second rotating shaft (432); the upper end surface of the base (1) is rotatably mounted with a first rotating shaft (431) corresponding to the transport platform (421) via a bearing seat; the first rotating shaft (431) is connected to a corresponding driving roller (423) close to the center of the supporting circular plate (414) via a first bevel gear set; the upper end surface of the base (1) is rotatably mounted with a second rotating shaft (432) close to one of the first rotating shafts (431) via a bearing seat; the second rotating shaft (432) and the corresponding first rotating shaft (431) are connected via a first transmission gear set; the second rotating shaft (432) and the other first rotating shaft (431) are connected via a first belt drive.

5. A semiconductor silicon wafer surface polishing machine according to claim 3, characterized in that: The unloading portion (44) comprises a second motor (441), an L-shaped support rod (442) and a suction cup (443); the second motor (441) located on the left side of the transport platform (421) on the left side is fixedly mounted on the upper end surface of the base (1); the L-shaped support rod (442) is fixedly mounted on the output end of the second motor (441); the horizontal section of the L-shaped support rod (442) is located above the transport platform (421) on the left side; and the suction cup (443) is fixedly mounted on one end of the horizontal section of the L-shaped support rod (442) away from the vertical section thereof.

6. A semiconductor silicon wafer surface polishing machine according to claim 2, characterized in that: The clamping portion (51) further comprises an execution groove (511), a limiting slideway (513), a screw rod (514), a clamping slider (515) and a fourth rotating shaft (516); the upper end surface of the supporting circular plate (414) is provided with a plurality of execution grooves (511) in a circumferential array manner, a supporting truncated platform (512) with a cavity inside is fixedly installed in the execution groove (511), the upper end surface of the supporting truncated platform (512) is provided with a plurality of limiting slideways (513) in a circumferential array manner, the limiting slideways (513) extend radially along the supporting truncated platform (512), and a bearing seat is arranged in the supporting truncated platform (512). A screw rod (514) corresponding to the limiting slideway (513) is rotatably installed, and a clamping slider (515) threadedly connected to the corresponding screw rod (514) is slidably installed in the limiting slideway (513). A fourth rotating shaft (516) is installed through a bearing at the center of the supporting truncated table (512), and a docking block is fixedly installed at the lower end of the fourth rotating shaft (516). A first transmission bevel gear is fixedly sleeved on the fourth rotating shaft (516), and a second transmission bevel gear is fixedly sleeved on the ends of the screw rods (514) in the same supporting truncated table (512) that are close to each other, and the first transmission bevel gear is meshed with a plurality of second transmission bevel gears at the same time.

7. A semiconductor silicon wafer surface polishing machine according to claim 6, characterized in that: The loading and unloading part (52) comprises a first electric push rod (521), a support plate (522), a rotating drum (523), a matching shaft (524) and a third motor (525); the upper end surface of the base (1) is fixedly mounted with the first electric push rod (521) located below the supporting circular plate (414); the telescopic end of the first electric push rod (521) is fixedly mounted with the support plate (522); a rotating drum (523) is installed on the support plate (522) through a bearing and is symmetrically mounted on the left and right sides; the rotating drum (523) corresponds to the transport platform (421) one by one; the rotating drum (523) is fixedly mounted on the transport platform (421) and the first electric push rod (521) is fixedly mounted on the supporting plate (522) and the third motor (525) is fixedly mounted on the supporting plate (522) and the first electric push rod (521 ... 23) A hexagonal alignment groove that matches the docking block is provided on the upper end surface, and a matching shaft (524) located between the left and right symmetrical rotating drums (523) is installed on the support plate (522) through a bearing, and the matching shaft (524) is connected to the right rotating drum (523) through a second transmission gear set, and the matching shaft (524) is connected to the left rotating drum (523) through a second belt transmission set, and a third motor (525) whose output end is fixedly connected to the matching shaft (524) is fixedly installed on the support plate (522) through a motor seat.

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