High-precision double-side polishing equipment for processing of hard and brittle materials

CN118744385BActive Publication Date: 2026-08-28苏州博宏源设备股份有限公司
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Patent Information

Application Number
CN202411043422.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-07-31
Publication Date
2026-08-28
Estimated Expiration
2044-07-31

AI Technical Summary

Technical Problem

[0002]近年来随着非金属、非导电材料以及半导体等硬脆性材料的普及应用，例如玻璃、各种石材、宝石、硅晶体等，因具有较高的硬度、脆性、耐磨性、抗蚀性以及抗氧化性的独特性质，这些特殊材料的应用越来越广泛，在硬脆材料加工过程中需要对其进行抛光，然而现有技术中的硬脆材料抛光过程中对于规则形状的材料不能同时进行双面抛光，影响硬脆材料的加工效率，且硬脆材料在抛光时由于稳定性不高，从而导致硬脆材料的抛光精度不高，影响其加工质量，对于规格不同的硬脆材料，单一的抛光机难以进行全面的抛光工作，且现有抛光机难以做到精确的定点抛光工作，工作效率较低

Benefits of technology

[0044]本发明中，通过上下两个抛光装置的设置，对长条形等规整的硬脆材料进行有效快速的双面抛光；通过移动调节装置对金刚石砂带进行移动，对于不同尺寸的硬脆材料进行定点抛光；通过定位框架的设置，对抛光装置中金刚石砂带与硬脆材料的接触面进行调节，进行更精准的抛光工作；通过缓冲固定组件的设置，在抛光过程中对硬脆材料进行固定缓冲，有效避免抛光装置对材料造成损坏，影响加工质量；通过输送定位装置的设置，对不同尺寸的硬脆材料进行输送上料抛光后输出下料，有助于提高抛光效率。

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Abstract

The application discloses a kind of high-precision double-sided polishing equipment for hard and brittle material processing, and relates to the technical field of hard and brittle material polishing, comprising: fixed frame body;Lifting device is symmetrically distributed with two groups, respectively fixed on fixed frame body, and each group lifting device is symmetrically distributed with two;Positioning frame, corresponding to each group lifting device, both sides are fixedly connected with the same group lifting device;Polishing device, adjustable setting is in positioning frame;Mobile adjusting device, between polishing device, and side with positioning frame fixed connection;Conveying fixing device, symmetrically distributed with two groups, respectively fixed on the both sides of fixed frame body, and located between two groups lifting device.The application sets up two polishing devices, effectively and quickly double-sided polishing work is carried out to hard and brittle material, and through the adjustment of polishing surface or movement, accurate point polishing is carried out, and hard and brittle material is fixed and buffered, which helps to improve polishing efficiency.
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Citation Information

Patent Citations

  • High-precision double-sided polishing device for hard and brittle materials

    CN115805493A

  • Polishing device for hardware wrench machining

    CN218534046U

  • Floor surface polishing machine

    CN221290756U