Wafer bearing table and chemical mechanical polishing equipment

Abstract

The embodiment of the invention provides a wafer bearing table and chemical mechanical polishing equipment. The wafer bearing platform comprises a platform used for placing a workpiece; the swing shaft is fixedly connected to the platform; the swinging shaft is connected to the supporting mechanism and the base in a swinging mode and is provided with a containing hole, the supporting mechanism is arranged in the containing hole, and when the swinging shaft swings along with the platform, the supporting mechanism can provide axial buffering support for the swinging shaft; and the elastic mechanism is arranged between the platform and the base and is used for deforming when the platform swings so as to adaptively support the platform. In the swinging process of the platform, due to the fact that the supporting mechanism moves in the axial direction of the containing hole all the time, the platform is effectively positioned, deviation of the axis is prevented, and therefore the stability of the platform in the polishing operation is guaranteed.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor processing, and in particular to a wafer carrier and chemical mechanical polishing equipment. Background Art

[0002] Polishing is an important process in semiconductor processing technology. In chemical mechanical polishing, the carrier platform is an important interactive device for the polishing head to pick up and place workpieces (such as wafers). In the process of picking up and placing workpieces, the carrier platform is required to swing adaptively according to the inclination of the polishing head, and the carrier platform cannot rotate around the axis.

[0003] At present, in the process of the polishing head taking and placing the workpiece, when the polishing head is tilted and pressed down, the center of the bearing platform will be offset, and the work will be unreliable. In addition, the bearing platform will rotate around the axis, causing the position of the bearing platform to shift. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a wafer carrier and a chemical mechanical polishing device to at least partially solve the above-mentioned problems.

[0005] According to the first aspect of the embodiment of the present application, a wafer carrier is provided, which includes: a platform for placing a workpiece; a swing shaft fixedly connected to the platform; a supporting mechanism, the swing shaft being swingably connected to the supporting mechanism, and a base having a receiving hole, the supporting mechanism being arranged in the receiving hole, and the supporting mechanism can provide axial buffering support for the swing shaft when the platform swings; an elastic mechanism being arranged between the platform and the base, and being used for deforming when the platform swings so as to adaptively support the platform.

[0006] Furthermore, in the above-mentioned wafer carrier, the supporting mechanism includes: a swing support member, which is movably arranged in the accommodating hole along the axial direction of the accommodating hole, and the swing shaft is swingably connected to the swing support member; an elastic support member, which is arranged in the accommodating hole, and the swing support member is crimped with the elastic support member, and the elastic support member is used to deform when the swing support member moves axially along the accommodating hole, so as to provide buffering support to the swing support member.

[0007] Furthermore, in the above-mentioned wafer carrier, the swing support member includes: a support seat, which is movably arranged in the accommodating hole along the axial direction of the accommodating hole and is crimped with the elastic support member; a support body, which is swingably arranged on the support seat, and the support body is provided with a first mounting hole, and the swing axis is arranged in the first mounting hole.

[0008] Furthermore, in the above-mentioned wafer carrier, the support seat is provided with a second mounting hole having a spherical inner surface; the support body has a spherical outer surface, the support body is arranged in the second mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the support body and the support seat are swingably connected.

[0009] Furthermore, in the above-mentioned wafer supporting platform, the swing support member is an angular bearing; the swing shaft is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is pressed against the elastic support member.

[0010] Furthermore, the wafer support platform further includes: a bearing pressure plate, which is pressed onto the outer ring of the angular bearing and connected to the base.

[0011] Furthermore, in the above-mentioned wafer carrier, the elastic support member includes: a first support, connected to the base and covering the receiving hole of the base; a first elastic member, placed in the receiving hole and connected to the first support, and the swing support member is crimped to the first elastic member.

[0012] Furthermore, in the above-mentioned wafer carrier, at least two columns are formed on the surface of the first support placed in the accommodating hole; there are at least two first elastic members which are mounted on the columns in a one-to-one correspondence; the elastic support member also includes: a pressure plate, the pressure plate is provided with holes corresponding to the positions of each of the columns, the columns are penetrated through the holes to press the pressure plate and the first elastic member together, and the swing support member is pressed together with the pressure plate.

[0013] Furthermore, in the above-mentioned wafer carrier, the accommodating hole is a step hole, and the step hole includes a first accommodating hole close to the platform and a second accommodating hole away from the platform, and the diameter of the first accommodating hole is smaller than the diameter of the second accommodating hole; the swing support member is placed in the first accommodating hole; and the elastic support member is partially placed in the second accommodating hole.

[0014] Furthermore, in the above-mentioned wafer supporting platform, the first elastic member is any one of a spring, a spring sheet, and an elastic column.

[0015] Furthermore, the above-mentioned wafer carrier platform also includes: a limit pin, which is fixedly connected to the base; a swing member, the platform is swingably connected to the swing member, the swing member is provided with a cylindrical hole, the limit pin is partially placed in the cylindrical hole, and the swing member can move along the limit pin when the platform swings.

[0016] Furthermore, in the above-mentioned wafer supporting platform, the swinging member includes: a mounting seat fixedly connected to the platform; and a swinging body, the swinging body being swingably disposed on the mounting seat, and the swinging body is provided with the columnar hole.

[0017] Furthermore, in the above-mentioned wafer carrier, the mounting seat is provided with a third mounting hole having a spherical inner surface; the swing body has a spherical outer surface, the swing body is arranged in the third mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the swing body and the mounting seat are swingably connected.

[0018] Furthermore, in the above-mentioned wafer supporting platform, the swinging member is an angular bearing; the limiting pin is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is fixedly connected to the platform.

[0019] Furthermore, in the above-mentioned wafer supporting platform, the elastic mechanism includes: an annular airbag, which is arranged between the platform and the base; and an inflation joint, which is connected to the annular airbag and is used to fill gas into the annular airbag.

[0020] Furthermore, in the above-mentioned wafer supporting platform, an annular groove is provided on the surface of the base close to the platform, and the annular airbag is partially embedded in the annular groove.

[0021] Furthermore, in the wafer carrier, the base is provided with an air filling hole, the air filling joint is passed through the air filling hole, and one end of the air filling joint is connected to the annular air bag, and the other end extends out of the base for connection with the air filling device. The elastic mechanism also includes: an annular pressure ring connected to the base, the annular pressure ring presses the air filling interface of the annular air bag to the base to form a seal.

[0022] Furthermore, in the above-mentioned wafer supporting platform, the elastic mechanism includes: at least two elastic members, which are placed between the platform and the base and distributed along the circumference with the axis of the platform as the center.

[0023] Furthermore, in the above-mentioned wafer supporting platform, the elastic member is at least one of a spring, an elastic column, and a rubber column.

[0024] According to the second aspect of an embodiment of the present application, a chemical mechanical polishing device is provided, which includes: a polishing disk, a carrying head, a trimming device and a liquid supply device, and also includes a wafer carrying platform as described above, the wafer carrying platform is arranged on one side of the polishing disk, and the carrying head is configured to receive the wafer from the wafer carrying platform or transfer the wafer to the wafer carrying platform.

[0025] In this embodiment, when the platform is subjected to downward pressure, the downward pressure is transmitted to the support mechanism through the swing shaft. As the downward pressure acts, the support mechanism moves downward, thereby compressing the elastic mechanism. When the downward pressure is removed, the elastic mechanism restores the platform to its original position by virtue of its inherent resilience, while the support mechanism moves upward. This process enables the support mechanism to move up and down in the receiving hole of the base, thereby achieving axial buffering, ensuring that the axial position of the platform will not deviate during the process of bearing and releasing downward pressure.

[0026] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0028] Figure 1 This is a schematic diagram of the axial cross-sectional structure of the wafer carrier proposed in an embodiment of the present application; Figure 2 This is another schematic diagram of the axial cross-sectional structure of the wafer carrier provided in the embodiment of the present application; Figure 3 A schematic diagram of the three-dimensional structure of a wafer carrier proposed in an embodiment of the present application; Figure 4 A schematic diagram of a partial three-dimensional structure of a wafer carrier platform proposed in an embodiment of the present application; Figure 5 Another schematic diagram of the three-dimensional structure of the wafer carrier provided in the embodiment of the present application; Figure 6 A schematic diagram of the three-dimensional structure of the elastic mechanism in the wafer carrier provided in the embodiment of the present application; Figure 7 A schematic diagram of a partial three-dimensional structure of a wafer carrier platform proposed in an embodiment of the present application; Figure 8 This is another three-dimensional structural schematic diagram of the wafer carrier proposed in the embodiment of the present application; Reference numerals: Platform 100; fastening screw 110; swing shaft 200; shoulder 210; nut 220; support mechanism 300; swing support member 310; support seat 311; crimping plate 311a; screw 311b; support body 312; elastic support member 320; first support seat 321; column 321a; first elastic member 322; pressure plate 323; base 400; accommodating hole 410; second accommodating hole 411; elastic mechanism 500; annular airbag 510; inflation joint 520; annular pressure ring 530; limit pin 600; swing member 700; mounting seat 710; mounting seat pressure plate 711; swing body 720. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0030] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0031] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In chemical mechanical polishing, the carrier platform is an important interactive device for the polishing head to pick up and place workpieces (such as wafers). In the process of picking up and placing workpieces, the carrier platform is required to swing adaptively according to the inclination of the polishing head, and the carrier platform cannot rotate around the axis. At present, in the process of picking up and placing workpieces by the polishing head, when the polishing head is tilted and pressed down, the center of the carrier platform will be offset, and the operation will be unreliable; in addition, the carrier platform will also cause the rotation of the carrier platform around the axis, causing the position of the carrier platform to shift.

[0035] In view of the above problems, an embodiment of the present application provides a wafer carrier, which can solve the problem of center deviation of the carrier platform.

[0036] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0037] See also Figures 1 to 3 According to one embodiment of the present application, a wafer carrier includes a platform 100 , a swing axis 200 , a supporting mechanism 300 , a base 400 and an elastic mechanism 500 .

[0038] The platform 100 is used to place a workpiece, such as a wafer to be polished, etc. In a specific implementation, the platform 100 may be circular.

[0039] The swing shaft 200 is fixedly connected to the platform 100. When the polishing head applies an inclined downward pressure to the platform 100 to cause the platform 100 to swing, the swing shaft 200 can swing synchronously with the platform 100. In a specific implementation, the platform 100 can be provided with a groove, and the upper end of the swing shaft 200 (relative to the upper end) can be provided with a groove. Figure 1 The platform 100 and the swing shaft 200 may be fixedly connected, for example, by fastening screws 110 (see Figure 2 , 3 ) is connected to the swing shaft 200, or is welded, riveted, etc., or can be a detachable connection, such as a key connection, etc. This embodiment does not limit the specific connection form.

[0040] The swing shaft 200 is swingably connected to the support mechanism 300. When the platform 100 swings, the swing shaft 200 can swing with the platform 100 relative to the support mechanism 300. The base 400 is provided with a receiving hole 410, and the support mechanism 300 is arranged in the receiving hole 410. When the swing shaft 200 swings with the platform 100, the support mechanism 300 can provide axial buffer support for the swing shaft 200, so that the swing shaft 200 can move along the axial direction.

[0041] In this embodiment, the platform 100 is placed above the base 400 (relative to Figure 1 In the state shown in FIG. 1 , the elastic mechanism 500 is disposed between the platform 100 and the base 400 and is used to deform when the platform 100 swings to adaptively support the platform 100. The elastic mechanism 500 will deform accordingly with the swing of the platform 100 and will always be in contact with the lower end surface (relative to the lower end surface) of the platform 100. Figure 1 (as for the state shown) are in contact to support the platform 100.

[0042] In this embodiment, when the platform 100 is subjected to a tilting downward force, the downward force is transmitted to the support mechanism 300 through the swing shaft 200, and the support mechanism 300 can provide axial buffer support for the swing shaft 200. At the same time, the elastic mechanism 500 will deform under the downward force to adaptively support the platform 100. When the downward force is withdrawn, the elastic mechanism 500 relies on the rebound force to restore the platform 100 to its original position. It can be seen that during the swinging process of the platform 100, the support mechanism 300 can provide axial buffer support for the swing shaft 200, thereby ensuring that the axial position of the platform 100 will not be offset in the process of bearing and releasing the downward force.

[0043] It can be seen that in this embodiment, during the swinging process of the platform 100, since the support mechanism 300 can always provide axial buffer support, the support mechanism 300 can always effectively position the platform 100 to prevent the axis from shifting, thereby ensuring the stability and reliability of the platform 100 during the polishing operation.

[0044] In some embodiments, see Figure 1 The support mechanism 300 includes: a swing support member 310 and an elastic support member 320. The swing support member 310 is movably disposed in the receiving hole 410 along the axial direction of the receiving hole 410, and the swing shaft 200 is swingably connected to the swing support member 310. When the platform 100 and the swing shaft 200 swing relative to the swing support member 310, the swing support member 310 is driven to move axially in the receiving hole 410.

[0045] The elastic support member 320 is disposed in the receiving hole 410 and is placed below the swing support member 310 (relative to Figure 1In the state shown in FIG. 4 , the swing support member 310 is pressed against the elastic support member 320 . The elastic support member 320 is used to deform when the swing support member 310 moves axially along the receiving hole 410 , so as to provide buffer support for the swing support member 310 .

[0046] In this embodiment, when the swing support member 310 moves downward, downward pressure is applied to the elastic support member 320 to compress it. This compression can absorb and alleviate the impact load caused by the swing or external load, reducing damage to the swing support member 310. When the swing support member 310 moves upward, the elastic support member 320 will rebound and return to the uncompressed state. This rebound force helps the swing support member 310 return to the initial position and maintain the dynamic balance of the system. Since the elastic support member 320 can provide continuous support and buffering when the swing support member 310 moves up and down, the reliability and durability of the entire support structure are improved, ensuring stable operation even in frequent swings and load changes.

[0047] In some embodiments, the accommodating hole 410 may be a stepped hole, which includes a first accommodating hole (not shown) close to the platform 100 and a second accommodating hole 411 away from the platform 100. The first accommodating hole and the second accommodating hole 411 are both cylindrical holes, and accordingly, the swing shaft 200 is a cylindrical shaft; the diameter of the first accommodating hole is smaller than the diameter of the second accommodating hole 411. The swing support member 310 is placed in the first accommodating hole and can move along the axial direction of the first accommodating hole, and the elastic support member 320 is partially placed in the second accommodating hole 411.

[0048] In some embodiments, see Figure 1 , Figure 2 and Figure 4 The swing support member 310 includes a support seat 311 and a support body 312. The support seat 311 is movably disposed in the receiving hole 410 along the axial direction of the receiving hole 410 and is pressed against the elastic support member 320. The support body 312 is swingably disposed in the support seat 311, and the support body 312 is provided with a first mounting hole, and the swing shaft 200 is disposed in the first mounting hole.

[0049] In a specific implementation, the support body 312 is provided with a first mounting hole along the axial direction, the first mounting hole can be a through hole and is adapted to the swing shaft 200, the swing shaft 200 is passed through the through hole, and a shoulder 210 is formed on the lower end surface of the swing shaft 200 away from the platform 100, and the shoulder 210 and the lower end surface of the support body 312 (relative to Figure 1 and Figure 2The swing shaft 200 is crimped with the elastic support member 320 at the upper end face of the swing shaft 200 close to the platform 100, and the nut 220 is connected to the swing shaft 200 through the external thread. The shoulder 210 limits the swing shaft 200, and the swing shaft 200 is fixed to the support body 312 through the shoulder 210 and the nut 220. The swing shaft 200 can swing relative to the support seat 311 along with the support body 312. The end face of the support seat 311 away from the platform 100 is crimped with the elastic support member 320, and the crimping plate 311a is crimped with the end face of the support seat 311 close to the platform 100, and the crimping plate 311a is connected to the base 400 through the screw 311b.

[0050] In another specific implementation, the swing shaft 200 and the support body 312 can be threadedly connected, that is, an internal thread is formed in the first mounting hole, and an external thread is formed on the swing shaft 200. The swing shaft 200 is fixed in the first mounting hole by threaded connection, and there can also be an interference fit between the swing shaft 200 and the support body 312. Of course, the swing shaft 200 can also be fixedly connected to the support body 312 by welding or the like. This embodiment does not limit the specific connection form.

[0051] The support body 312 is swingably disposed on the support seat 311. In a specific implementation, the support seat 311 is provided with a second mounting hole having a spherical inner surface, the support body 312 has a spherical outer surface, the support body 312 is disposed in the second mounting hole, and the spherical outer surface is adapted to the spherical inner surface so that the support body 312 can swing relative to the support seat 311.

[0052] In some embodiments, the swing support member 310 may be an angular bearing, the swing shaft 200 is disposed on the inner ring of the angular bearing, and the outer ring of the angular bearing is pressed against the elastic support member 320. In specific implementation, the outer ring of the angular bearing may be pressed against the outer ring of the angular bearing through a bearing pressure plate (not shown), and the bearing pressure plate is connected to the base 400 through screws.

[0053] In this embodiment, the cooperation between the inner ring of the angular contact bearing and the swing shaft 200 can ensure the precise positioning of the axis, prevent deviation during the swinging process, and thus ensure the swinging accuracy of the platform 100.

[0054] In some embodiments, see Figures 1 to 6 The elastic support member 320 includes: a first support 321 and a first elastic member 322. The first support 321 is connected to the lower end surface of the base 400 (relative to Figure 1 The first elastic member 322 is placed in the accommodating hole 410 and connected to the first support 321 , and the swing support member 310 is pressed against the first elastic member 322 .

[0055] In a specific implementation, the accommodating hole 410 is a through hole penetrating the base 400, and the first support 321 covers the accommodating hole 410. The first elastic member 322 can be an elastic element such as rubber, spring, spring, elastic column, airbag, etc. There can be at least two first elastic members 322, and they are evenly distributed along the circumference with the axis of the swing shaft 200 as the center. The first elastic member 322 can also be an annular body, which can be coaxially arranged with the swing shaft 200.

[0056] In some embodiments, see Figures 1 to 6 , the first elastic member 322 is a spring, and the elastic support member 320 further includes: a pressing plate 323. The surface of the first support 321 placed in the accommodating hole 410 is formed with at least two columns 321a, and the first elastic member 322 is at least two and is sleeved on the columns 321a in a one-to-one correspondence. The pressing plate 323 is provided with holes corresponding to the positions of the columns 321a, and the columns 321a are penetrated through the holes, so that the pressing plate 323 is pressed against the first elastic member 322, and the swing support member 310 is pressed against the pressing plate 323. When the swing support member 310 moves in the axial direction, the first elastic member 322 is compressed by the pressing plate 323, so that the first elastic member 322 absorbs and alleviates the displacement.

[0057] In this embodiment, when the support seat 311 is subjected to downward pressure, the first elastic member 322 is compressed by the pressure plate 323, so that the support seat 311 moves up and down in the receiving hole 410 of the base 400, achieving axial buffering and keeping the axial position of the platform 100 from shifting.

[0058] In some embodiments, the platform 100 is a circular table, the swing shaft 200 is a cylindrical shaft, the base 400 is a cylinder, and the swing shaft 200, the platform 100, the base 400 and the accommodating hole 410 are coaxially arranged, which makes it easier to align and install the components during assembly and maintenance, reducing assembly errors. In addition, during the swinging process, the rotation center of the platform 100 is easier to keep consistent with the axis of the swing shaft 200, thereby reducing eccentric vibration and improving the stability and reliability of the entire structure.

[0059] The supporting platform in the related technology also rotates around the axis when the polishing head presses down to pick up the workpiece. When the polishing machine applies an inclined downward pressure to it, the supporting platform rotates around the axis and the position shifts, which in turn affects the polishing machine's picking up of the workpiece.

[0060] Based on this, see Figure 1 and Figure 7In some embodiments, the platform 100 may further include: a limit pin 600 and a swinging member 700. The limit pin 600 is fixedly connected to the base 400; the platform 100 is swingably connected to the swinging member 700, and the swinging member 700 is provided with a columnar hole, and the limit pin 600 is partially placed in the columnar hole. When the platform 100 swings, the swinging member 700 can move up and down along the limit pin 600 (relative to the Figure 1 as shown).

[0061] In a specific implementation, the top of the limit pin 600 may be a spherical surface or a conical surface to reduce friction and wear when the swing member 700 moves up and down; when the swing member 700 swings, the cylindrical hole and the limit pin 600 will not produce too large a gap, thereby maintaining the stability of the platform 100. Specifically, the cylindrical hole of the swing member 700 can be matched with the diameter of the limit pin 600 to prevent the swing member 700 from shaking when it moves up and down.

[0062] In this embodiment, when the platform 100 swings relative to the swing member 700, the swing member 700 moves up and down relative to the limit pin 600, and the limit pin 600 limits the swing member 700 and the platform 100. The interaction between the limit pin 600 and the swing member 700 effectively limits the rotational movement of the platform 100, ensuring that the platform 100 will not generate unnecessary rotation around its center during the swinging process. In addition, the cooperation between the limit pin 600 and the swing member 700 also reduces the radial deviation of the platform 100 during the swinging process, ensuring that the platform 100 always maintains its preset motion trajectory during the swinging process, and ensuring the position stability of the platform 100 during the process of picking up and placing the workpiece by the polishing machine.

[0063] In some embodiments, see Figure 1 The swing member 700 may include: a mounting seat 710 and a swing body 720. The mounting seat 710 is fixedly connected to the platform 100, and the swing body 720 is swingably disposed on the mounting seat 710, and the swing body 720 is provided with a columnar hole.

[0064] In a specific implementation, a stepped hole is opened on the surface of the platform 100 close to the base 400, and the mounting seat 710 is clamped in the stepped hole. The mounting seat pressure plate 711 is pressed on the mounting seat 710 and connected to the platform 100, and the mounting seat 710 is limited by the mounting seat pressure plate 711. Figure 1 The upper end as shown in the figure is placed in the step hole, and a gap is left between the platform 100 to avoid friction with the limit pin 600 when the platform 100 swings.

[0065] In a specific implementation, the mounting seat 710 is provided with a third mounting hole having a spherical or arc-shaped inner surface, the swing body 720 has a spherical or arc-shaped outer surface, the swing body 720 is arranged in the third mounting hole, and the outer surface is adapted to the spherical inner surface so that the swing body 720 and the mounting seat 710 are swingably connected.

[0066] In some embodiments, the swing member 700 is an angular bearing, the limiting pin 600 is disposed on the inner ring of the angular bearing, and the outer ring of the angular bearing is fixedly connected to the platform 100. Specifically, the outer ring of the angular bearing can be fixed to the platform 100 by pressing the bearing pressure plate with the outer ring of the angular bearing, and the bearing pressure plate limits the angular bearing.

[0067] In this embodiment, the angular bearing is a standardized mechanical component that is easy to maintain and replace. In addition, the interaction between the inner ring of the angular bearing and the swing member 700 effectively limits the rotational movement of the platform 100, ensuring that the platform 100 will not produce unnecessary rotation around its center during the swinging process. At the same time, the platform 100 will not produce radial deviation, thereby maintaining the stability of the platform 100.

[0068] In some embodiments, see Figure 1 , Figure 2 , Figures 6 to 8 The elastic mechanism 500 may include: an annular airbag 510 and an inflating connector 520. The annular airbag 510 is disposed between the platform 100 and the base 400; the inflating connector 520 is connected to the annular airbag 510 and is used to inflate the annular airbag 510 with gas.

[0069] In this embodiment, the platform 100 is supported by the annular airbag 510 . The annular airbag 510 can evenly distribute the weight of the platform 100 and provide stable support for the platform 100 .

[0070] In this embodiment, an annular airbag 510 is provided under the platform 100. When the annular airbag 510 is inflated, the platform 100 remains horizontal without pressure; when the polishing head is pressed down with a certain deviation angle, the platform 100 tilts accordingly, and the annular airbag 510 can be compressed without affecting the swing of the platform 100, thereby ensuring that the platform 100 and the polishing head fit together.

[0071] In specific implementation, the annular airbag 510 can be arranged near the edge of the platform 100 and the base 400. The annular airbag 510 can be made of elastic material, such as wear-resistant, pressure-resistant, and tensile-resistant rubber material, which can withstand mechanical stress and temperature changes during operation, or can be made of non-elastic material, such as polytetrafluoroethylene. The inflation joint 520 can be a quick-connect joint to facilitate the operator to quickly inflate and deflate. The inflation joint 520 should have good sealing performance to prevent gas leakage.

[0072] In this embodiment, when the platform 100 swings, the annular airbag 510 can be deformed with the swing of the platform 100. This deformation can not only absorb and disperse the impact and vibration caused by the swing of the platform 100, thereby reducing damage to the platform 100, but also provide a soft support to ensure the stability of the platform 100 during the swing process. In addition, due to the deformation ability of the annular airbag 510, the annular airbag 510 can adapt to the posture adjustment requirements of the platform 100 in different working environments, increasing the flexibility and adaptability of the system. At the same time, it also has good energy absorption characteristics, which can play a protective role when the platform 100 is accidentally collided, thereby improving the safety performance of the overall equipment.

[0073] Continue to see Figure 1 and Figure 2 In some embodiments, an annular groove (not shown) is provided on the surface of the base 400 close to the platform 100 , and the annular airbag 510 is partially embedded in the annular groove to better fix and position the annular airbag 510 .

[0074] See also Figure 8 In some embodiments, the elastic mechanism 500 further includes: an annular pressure ring 530. The base 400 is provided with an inflation hole, and the inflation connector 520 is provided through the inflation hole. One end of the inflation connector 520 is connected to the annular airbag 510, and the other end of the inflation connector 520 extends out of the base 400 for connection with the inflation device. The annular pressure ring 530 is connected to the base 400, and the annular pressure ring 530 presses the inflation interface of the annular airbag 510 to the base 400 to form a seal.

[0075] In specific implementation, the annular pressure ring 530 can be set inside the annular airbag 510, or it can be set outside the annular airbag 510. The annular pressure ring 530 can be locked on the base 400 by screws, and the opening below the annular airbag 510 is pressed against the base 400 to form a seal.

[0076] In this embodiment, the inflation connector 520 is connected to the annular airbag 510 and inflated therein. After inflation, the annular airbag 510 swells, pushing the platform 100 to be horizontal, and can be compressed by the platform 100 in any direction to achieve cushioning.

[0077] In other embodiments, the elastic mechanism 500 includes: at least two elastic members (not shown in the figure), which are placed between the platform 100 and the base 400 and distributed in a circle with the axis of the platform 100 as the center.

[0078] In specific implementation, the elastic member can be any one of a spring, an elastic column, a rubber column, and an air bag, or a combination of two or more. The elastic member can be evenly distributed along the circumference of the platform 100 with the axis of the platform 100 as the center.

[0079] In this embodiment, when the platform 100 swings, the elastic parts placed at the inclined downward position of the platform 100 are compressed, and the elastic parts placed at other positions of the platform 100 are stretched, so as to always provide buffering support to the platform 100 during the swinging process of the platform 100 and absorb the swinging energy and impact.

[0080] In this embodiment, when the platform 100 swings and tilts in a certain direction, the elastic members located at the tilted downward position will be compressed, and these elastic members effectively absorb part of the energy and impact generated by the platform 100 during the swinging process through their internal deformation ability. At the same time, the elastic members located at other positions of the platform 100 are stretched due to the tilting of the platform 100, and these elastic members provide additional supporting force through stretching, ensuring that the platform 100 can obtain a uniform and stable buffering effect during the entire swinging process.

[0081] It can be seen that the platform 100 of the embodiment of the present application is always buffered and supported by the elastic parts during the swinging process, which effectively absorbs and disperses the swinging energy and impact, thereby improving the dynamic performance and working efficiency of the entire system.

[0082] It can be seen that in the present application, when the platform 100 swings, the platform 100 and the swing shaft 200 swing integrally relative to the support mechanism 300, and at the same time, the support mechanism 300 moves up and down in the accommodating hole 410 of the base 400 to limit the axis of the platform 100; at the same time, the swing member 700 also swings synchronously with the platform 100, and the swing member 700 moves up and down relative to the limit pin 600; since the limit pin 600 is fixed to the base 400, the swing member 700 can only move up and down relative to the limit pin 600, that is, it moves axially along the platform 100, and the swing member 700 cannot move radially or circumferentially along the platform 100, so the platform 100 cannot rotate, thereby avoiding the platform 100 from rotating around the center of the circle during the swinging process.

[0083] The embodiment of the present application also provides a chemical mechanical polishing device, which may include: a polishing disc, a carrier head, a trimming device, a liquid supply device, and any of the above-mentioned wafer carriers, the wafer carrier is arranged on one side of the polishing disc, and the carrier head is configured to receive a wafer from the wafer carrier or transfer the wafer to the wafer carrier. Specifically, a polishing pad may be arranged on the upper surface of the polishing disc, and the polishing pad rotates together with the polishing disc; a horizontally movable carrier head is arranged above the polishing pad, and the bottom of the carrier head attracts the wafer to be polished; the liquid supply device may be arranged above the polishing pad to spread the polishing liquid on the surface of the polishing pad; the trimming device swings around a fixed point, and the trimming head arranged thereon rotates itself and applies a downward load to trim the surface of the polishing pad. The wafer carrier can be horizontally adjacent to one side of the polishing disc, and the carrier head can transfer the wafer in the wafer carrier to the top of the polishing pad, or the carrier head places the wafer that has been polished in the wafer carrier, waiting for a wafer turnover device such as a robot or other turnover device to transfer the wafer that has been polished to the next process.

[0084] Among them, the specific implementation process of the wafer carrier can refer to the above description, and this embodiment will not be repeated here.

[0085] Since the wafer carrier has the above-mentioned effects, the chemical mechanical polishing equipment having the wafer carrier also has corresponding technical effects.

[0086] In summary, the embodiment of the present application maintains the platform 100 level through the elastic mechanism 500, which can be compressed and buffered when swung downward; the overall downward pressure buffering of the platform 100 is achieved through the support mechanism 300 to ensure that the axial position of the platform 100 is not offset; and the platform 100 is prevented from rotating around the axis through the limitation of the limit pin 600 and the swing member 700.

[0087] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A wafer carrier, characterized in that: include: A platform for placing workpieces; A swing shaft, fixedly connected to the platform; A support mechanism, wherein the swing shaft is swingably connected to the support mechanism, The base is provided with a receiving hole, the supporting mechanism is arranged in the receiving hole, and the supporting mechanism can provide axial buffer support for the swing shaft when the swing shaft swings along with the platform; The elastic mechanism is arranged between the platform and the base, and is used for deforming when the platform swings so as to adaptively support the platform.

2. The wafer carrier according to claim 1, characterized in that: The supporting mechanism comprises: A swing support member is movably disposed in the accommodating hole along the axial direction of the accommodating hole, and the swing shaft is swingably connected to the swing support member; An elastic support member is arranged in the accommodating hole, the swing support member is pressed against the elastic support member, and the elastic support member is used to deform when the swing support member moves axially along the accommodating hole to provide buffer support for the swing support member.

3. The wafer carrier according to claim 2, characterized in that: The swing support member comprises: A support seat, movably disposed in the accommodating hole along the axial direction of the accommodating hole, and pressed against the elastic supporting member; The support body is swingably arranged on the support seat, the support body is provided with a first mounting hole, and the swing shaft is arranged in the first mounting hole.

4. The wafer carrier according to claim 3, characterized in that: The support seat is provided with a second mounting hole having a spherical inner surface; The support body has a spherical outer surface, and the support body is arranged in the second mounting hole. Moreover, the spherical outer surface is matched with the spherical inner surface so that the support body and the support seat are swingably connected.

5. The wafer carrier according to claim 2, characterized in that: The swing support member is an angular bearing; The swing shaft is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is pressed against the elastic support member.

6. The wafer carrier according to claim 5, characterized in that: Also includes: A bearing pressure plate is pressed onto the outer ring of the angular bearing and connected to the base.

7. The wafer carrier according to claim 2, characterized in that: The elastic support member comprises: A first support, connected to the base and covering the receiving hole of the base; The first elastic member is placed in the accommodating hole and connected to the first support, and the swing support member is pressed against the first elastic member.

8. The wafer carrier according to claim 7, characterized in that: The surface of the first support placed in the receiving hole is formed with at least two columns; There are at least two first elastic members, which are sleeved on the pillars in a one-to-one correspondence; The elastic support member also includes: a pressing plate, the pressing plate is provided with holes corresponding to the positions of the columns, the columns are penetrated through the holes so that the pressing plate is pressed against the first elastic member, and the swing support member is pressed against the pressing plate.

9. The wafer carrier according to claim 2, characterized in that: The accommodating hole is a stepped hole, and the stepped hole includes a first accommodating hole close to the platform and a second accommodating hole away from the platform, and the diameter of the first accommodating hole is smaller than the diameter of the second accommodating hole; The swing support member is placed in the first accommodating hole; The elastic support member is partially disposed in the second accommodating hole.

10. The wafer carrier according to claim 7, characterized in that: The first elastic member is any one of a spring, a spring sheet, and an elastic column.

11. The wafer carrier according to any one of claims 1 to 10, characterized in that: Also includes: A limit pin, fixedly connected to the base; The platform is swingably connected to the swing member, the swing member is provided with a columnar hole, the limit pin is partially placed in the columnar hole, and the swing member can move along the limit pin when the platform swings.

12. The wafer carrier according to claim 11, characterized in that: The swinging member comprises: A mounting seat, fixedly connected to the platform; The swinging body is swingably arranged on the mounting seat, and the swinging body is provided with the columnar hole.

13. The wafer carrier according to claim 12, characterized in that: The mounting seat is provided with a third mounting hole having a spherical inner surface; The swing body has a spherical outer surface, and the swing body is arranged in the third mounting hole. Moreover, the spherical outer surface is matched with the spherical inner surface, so that the swing body and the mounting seat are swingably connected.

14. The wafer carrier according to claim 11, characterized in that: The swinging member is an angular bearing; The limiting pin is arranged on the inner ring of the angular bearing, and the outer ring of the angular bearing is fixedly connected to the platform.

15. The wafer carrier according to any one of claims 1 to 10, characterized in that: The elastic mechanism comprises: An annular airbag is arranged between the platform and the base; An inflation connector is connected to the annular airbag and is used to inflate gas into the annular airbag.

16. The wafer carrier according to claim 15, characterized in that: An annular groove is formed on the surface of the base close to the platform, and the annular airbag is partially embedded in the annular groove.

17. The wafer carrier according to claim 15, characterized in that: The base is provided with an inflation hole, the inflation connector is provided through the inflation hole, and one end of the inflation connector is connected to the annular airbag, and the other end extends out of the base for connecting to the inflation device; The elastic mechanism further comprises: an annular pressing ring connected to the base, wherein the annular pressing ring presses the inflation interface of the annular airbag to the base to form a seal.

18. The wafer carrier according to any one of claims 1 to 10, characterized in that: The elastic mechanism comprises: At least two elastic members are disposed between the platform and the base and are distributed along a circumference with the axis of the platform as the center.

19. The wafer carrier according to claim 18, characterized in that: The elastic member is at least one of a spring, an elastic column and a rubber column.

20. A chemical mechanical polishing device, characterized in that: include: The polishing disk, the carrying head, the dressing device and the liquid supply device also include a wafer carrying table as described in any one of claims 1 to 19, wherein the wafer carrying table is arranged on one side of the polishing disk, and the carrying head is configured to receive the wafer from the wafer carrying table or transfer the wafer to the wafer carrying table.

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