Semiconductor refrigeration equipment and control method

Abstract

The invention provides semiconductor refrigeration equipment and a control method. When the semiconductor refrigeration part is powered on, the hot end generates heat, the heat conduction shell is tightly attached to the hot end of the semiconductor refrigeration part, a refrigerant in the heat conduction shell absorbs the heat of the hot end and then is heated to be in a gas state, then the refrigerant flows out of the refrigerant outlet, and gas-liquid two-phase backflow is formed after heat dissipation and cooling are conducted through the heat pipe radiator. The liquid state is further increased after throttling of the throttling device, then the liquid state returns to the heat conduction refrigerant channel in the heat conduction shell, a certain resistance difference is formed between a refrigerant inlet and a refrigerant outlet of the heat conduction refrigerant channel due to the arrangement of the throttling device, and the liquid state refrigerant in the heat conduction refrigerant channel expands in the process of being heated into the gas state; and the gaseous refrigerant is driven to flow out from the refrigerant outlet, so that the heat dissipation circulation of the refrigerant is completed, and a heat pipe effect is formed. The heat at the hot end of the semiconductor refrigeration piece can be taken away rapidly through the separated heat pipe effect, heat concentration is avoided, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor refrigeration technology, and in particular to a semiconductor refrigeration device and a control method. Background Art

[0002] In the field of refrigeration technology, semiconductor refrigeration refrigerators have attracted much attention and are widely used due to their simple structure, no mechanical moving parts, and quiet operation.

[0003] In the related art, heat dissipation of a semiconductor refrigeration chip is generally achieved by attaching a heat pipe to the hot end of the semiconductor refrigeration chip. This method is limited by the size of the semiconductor refrigeration chip, such as an area of ​​only 40x40mm, which results in a very limited number of heat pipes that can be arranged on it. This patent can only arrange 5 narrow heat pipe strips, which ultimately makes it difficult to significantly improve the heat dissipation effect and cannot meet the requirements for fast and effective heat dissipation in scenarios with higher cooling needs. Summary of the invention

[0004] In view of this, in order to solve the technical problem in the prior art that the heat dissipation effect is limited due to the size of the semiconductor refrigeration chip, the present disclosure provides a semiconductor refrigeration device and a control method.

[0005] According to a first aspect of an embodiment of the present disclosure, a semiconductor refrigeration device is provided, the semiconductor refrigeration device comprising a semiconductor refrigeration element, a heat pipe radiator, a first heat-conducting element and a throttling device, wherein the first heat-conducting element comprises a heat-conducting housing and a heat-conducting refrigerant channel located inside the heat-conducting housing;

[0006] Among them, the heat-conducting shell is arranged closely to the hot end of the semiconductor refrigeration component, the refrigerant inlet of the heat-conducting refrigerant channel is connected with the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected with the refrigerant inlet of the heat pipe radiator, so as to dissipate the heat absorbed by the first heat-conducting component from the semiconductor refrigeration component through the heat pipe radiator.

[0007] In an alternative embodiment,

[0008] The semiconductor refrigeration device comprises a heating device and a sealing plate, wherein the heating device comprises a heating chamber for placing a heated object;

[0009] The heating device and the sealing plate are both located above the heat pipe radiator, and the sealing plate is fixedly connected to the side plate of the heat pipe radiator, so that the sealing plate, the heat pipe radiator and the heating device form an open heat dissipation airflow channel.

[0010] In an alternative embodiment,

[0011] The heating device includes a heating plate and a heating compensator, the heating plate constitutes a side plate of the heating chamber facing the sealing plate, so that the heating plate, the sealing plate and the heat pipe radiator constitute the heat dissipation airflow channel, and the heating compensator is located on the side of the heating plate facing the sealing plate, and is used to heat the heating plate.

[0012] In an alternative embodiment,

[0013] The interval between the heating plate and the sealing plate is greater than or equal to 6 mm and less than or equal to 15 mm, so that when the heat of the heat pipe radiator is dissipated toward the opening of the heat dissipation airflow channel, a chimney effect is formed in the heat dissipation airflow channel.

[0014] In an alternative embodiment,

[0015] The heating device comprises a temperature detector and a controller, wherein the temperature detector is arranged on the heating plate and is used to detect the temperature of the heating plate;

[0016] The controller is electrically connected to the temperature detector and the heating compensator, respectively, and is configured to control the operation of the heating compensator based on the temperature detected by the temperature detector.

[0017] In an alternative embodiment,

[0018] The heating device comprises a placement detector for a heated object, and the placement detector is configured to generate a signal indicating that the heated object is placed in the heating cavity after the heated object is placed in the heating cavity.

[0019] In an alternative embodiment,

[0020] The placement detector includes a photoelectric sensing switch and / or a photoelectric sensor.

[0021] In an alternative embodiment,

[0022] The heating chamber is constructed in a flat rectangular shape and is used for heating the facial mask.

[0023] In an alternative embodiment,

[0024] The semiconductor refrigeration device includes a cooling member and a cooling plate. The cooling plate is used to cool the compartment of the semiconductor refrigeration device. The cooling member is located between the cooling plate and the semiconductor refrigeration member, and one side of the cooling member is closely attached to the cooling plate, while the other side of the cooling member is closely attached to the semiconductor refrigeration member.

[0025] In an alternative embodiment,

[0026] The semiconductor refrigeration device comprises a heat-insulating layer, the heat-insulating layer is located on a first side of the cooling plate, the first side is a side of the cooling plate away from the compartment of the semiconductor refrigeration device, and the cooling member is located in the heat-insulating layer.

[0027] In an alternative embodiment,

[0028] The semiconductor refrigeration device includes a rear baffle and a fan. The rear baffle and the cooling plate are spaced apart to form a cooling airflow channel. The cooling airflow channel is connected to the compartment of the semiconductor refrigeration device, and the fan is located in the cooling airflow channel to drive the flow of gas in the cooling airflow channel.

[0029] In an alternative embodiment,

[0030] A drainage hole and a water receiving box are provided at the bottom of the cooling air flow channel, and the drainage hole is used to discharge condensed water generated in the cooling air flow channel to the water receiving box.

[0031] In an alternative embodiment,

[0032] The semiconductor refrigeration device comprises a second heat-conducting member, one end of the second heat-conducting member is connected to the first heat-conducting member, and the other end of the second heat-conducting member is connected to the water receiving box;

[0033] The second heat conducting member absorbs heat from the first heat conducting member to evaporate condensed water in the water receiving box.

[0034] In an alternative embodiment,

[0035] Water-absorbing cotton is arranged in the water receiving box, and the water-absorbing cotton is arranged at the position of the drainage hole.

[0036] According to a second aspect of an embodiment of the present disclosure, a control method is provided, which is applied to the semiconductor refrigeration device as described in any one of the first aspects. When the semiconductor refrigeration device includes a heating device, the control method includes:

[0037] After detecting that the heated object is placed in the heating chamber of the heating device, obtaining the ambient temperature of the environment in which the semiconductor refrigeration device is located;

[0038] If the ambient temperature is greater than the set ambient temperature, the heating compensator of the heating device is controlled to be in a closed state, and the heat dissipation air flow channel of the semiconductor refrigeration device is used to heat the heated object.

[0039] In an alternative embodiment,

[0040] The control method comprises:

[0041] If the ambient temperature is less than or equal to the set ambient temperature, the heating compensator is controlled to be in an open state, and the initial heating time of the heating compensator of the heating device is determined based on the ambient temperature; wherein the higher the ambient temperature, the shorter the initial heating time;

[0042] After the heating compensator completes the heating for the initial heating time, the operation of the heating compensator is controlled based on the temperature of the heating plate of the heating device.

[0043] In an alternative embodiment,

[0044] The step of controlling the operation of the heating compensator based on the temperature of the heating plate of the heating device comprises:

[0045] If the temperature of the heating plate is less than or equal to a first temperature threshold, the heating compensator is controlled to continue heating until the temperature of the heating plate is greater than or equal to a second temperature threshold; wherein the second temperature threshold is greater than or equal to the first temperature threshold.

[0046] In an alternative embodiment,

[0047] The step of controlling the operation of the heating compensator based on the temperature of the heating plate of the heating device comprises:

[0048] If the temperature of the heating plate is greater than a first temperature threshold, the heating compensator is controlled to stop heating.

[0049] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: in the present disclosure, the semiconductor refrigeration element in the semiconductor refrigeration equipment is separated from the heat pipe radiator, and a first heat conductive element and a throttling device are newly added, the heat conductive shell of the first heat conductive element is arranged in close contact with the hot end of the semiconductor refrigeration element, the refrigerant inlet of the heat conductive refrigerant channel in the heat conductive shell is connected to the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat conductive refrigerant channel is connected to the refrigerant inlet of the heat pipe radiator. That is to say, in the present disclosure, when the semiconductor refrigeration element is powered, the hot end generates heat. Since the heat-conducting shell is in close contact with the hot end of the semiconductor refrigeration element, the refrigerant inside it absorbs the heat of the hot end and is heated to become gaseous, and then flows out from the refrigerant outlet, and dissipates heat through the heat pipe radiator. After cooling, a gas-liquid two-phase reflux is formed. After throttling by the throttling device, the liquid further increases and then returns to the heat-conducting refrigerant channel in the heat-conducting shell. The throttling device is set to form a certain resistance difference between the refrigerant inlet and the refrigerant outlet of the heat-conducting refrigerant channel. When the liquid refrigerant in the heat-conducting refrigerant channel is heated to a gaseous state, it expands and drives the gaseous refrigerant to flow out from the refrigerant outlet, completing the heat dissipation cycle of the refrigerant and forming a heat pipe effect. The separated heat pipe effect can quickly take away the heat from the hot end of the semiconductor refrigeration element, avoid heat concentration, and improve the heat dissipation effect.

[0050] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0052] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0053] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0054] Figure 1 It is a schematic side cross-sectional view of a semiconductor refrigeration device according to an exemplary embodiment.

[0055] Figure 2 It is a schematic diagram of the back side of a semiconductor refrigeration device according to an exemplary embodiment.

[0056] Figure 3 It is a partial structural schematic diagram of a semiconductor refrigeration device according to an exemplary embodiment.

[0057] Figure 4 is a schematic diagram of an internal channel of a first heat conducting member according to an exemplary embodiment.

[0058] Figure 5 is a schematic diagram of a heating device according to an exemplary embodiment.

[0059] Figure 6 is another schematic diagram of a heating device according to an exemplary embodiment.

[0060] Figure 7 It is a partial schematic diagram of a side cross-section of a semiconductor refrigeration device according to an exemplary embodiment.

[0061] Reference numerals:

[0062] 1. Semiconductor refrigeration element; 2. Heat pipe radiator; 21. Side plate; 3. First heat-conducting element; 31. Heat-conducting shell; 4. Throttling device; 5. Heating device; 51. Insertion port; 52. Heating plate; 53. Heating compensator; 54. Temperature detector; 55. Placement detector; 6. Sealing plate; 7. Cooling element; 8. Cooling plate; 9. Insulation layer; 10. Back baffle; 11. Fan; 12. Drain hole; 13. Water collection box; 14. Water-absorbing cotton; 15. Second heat-conducting element;

[0063] 101, first pipeline; 102, second pipeline;

[0064] 201, heat transfer refrigerant channel; 202, heat dissipation air flow channel; 203, cooling air flow channel. DETAILED DESCRIPTION

[0065] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0066] The disclosure below provides many different embodiments or examples to implement different schemes of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0067] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0068] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0069] The following will describe the implementation methods of the present application with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be understood that the preferred embodiments are only for illustrating the present application, not for limiting the scope of protection of the present application.

[0070] In order to solve the technical problem in the prior art that the heat dissipation effect is limited due to the size of the semiconductor refrigeration chip, the present disclosure provides a semiconductor refrigeration device and a control method.

[0071] Among them, in the present disclosure, the semiconductor refrigeration element in the semiconductor refrigeration equipment is separated from the heat pipe radiator, and a first heat-conducting element and a throttling device are newly added. The heat-conducting shell of the first heat-conducting element is arranged closely to the hot end of the semiconductor refrigeration element, and the refrigerant inlet of the heat-conducting refrigerant channel in the heat-conducting shell is connected to the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected to the refrigerant inlet of the heat pipe radiator. That is to say, in the present disclosure, when the semiconductor refrigeration element is powered, the hot end generates heat. Since the heat-conducting shell is in close contact with the hot end of the semiconductor refrigeration element, the refrigerant inside it absorbs the heat of the hot end and is heated to become gaseous, and then flows out from the refrigerant outlet, and dissipates heat through the heat pipe radiator. After cooling, a gas-liquid two-phase reflux is formed. After throttling by the throttling device, the liquid further increases and then returns to the heat-conducting refrigerant channel in the heat-conducting shell. The throttling device is set to form a certain resistance difference between the refrigerant inlet and the refrigerant outlet of the heat-conducting refrigerant channel. When the liquid refrigerant in the heat-conducting refrigerant channel is heated to a gaseous state, it expands and drives the gaseous refrigerant to flow out from the refrigerant outlet, completing the heat dissipation cycle of the refrigerant and forming a heat pipe effect. The separated heat pipe effect can quickly take away the heat from the hot end of the semiconductor refrigeration element, avoid heat concentration, and improve the heat dissipation effect.

[0072] In an exemplary embodiment, a semiconductor refrigeration device is provided, which may be, for example, a semiconductor refrigerator, a semiconductor freezer, or other devices utilizing semiconductor refrigeration, without limitation.

[0073] Among them, reference Figures 1 to 4 As shown, the semiconductor refrigeration device includes a semiconductor refrigeration element 1, a heat pipe radiator 2, a first heat conducting element 3 and a throttling device 4. The semiconductor refrigeration element 1 can be, for example, a refrigeration sheet or a refrigeration block, or can be set to other shapes according to actual needs, which is not limited. The semiconductor refrigeration element 1 can be made of high-quality semiconductor materials, such as bismuth telluride (Bi2Te 3 ) and its alloys. This material has good thermoelectric properties and can produce a significant temperature difference effect when powered on, thereby achieving a refrigeration function. It should be noted that the refrigeration sheet may include two opposite sides, namely the hot end and the cold end. The hot end will generate a lot of heat when powered on, and it is necessary to dissipate the heat in a timely and effective manner to ensure the refrigeration effect of the cold end.

[0074] The throttling device 4 may be, for example, a capillary tube, an electronic expansion valve, or other devices that can be used for throttling, without limitation. The first heat-conducting member 3 may be, for example, a heat-conducting aluminum box, or other heat-conducting members that meet the requirements, without limitation.

[0075] The first heat-conducting member 3 includes a heat-conducting housing 31 and a heat-conducting refrigerant channel 201 located inside the heat-conducting housing 31. The heat-conducting housing 31 is arranged in close contact with the hot end of the semiconductor refrigeration member 1, and is used to absorb the heat of the hot end of the semiconductor refrigeration member 1. The refrigerant inlet of the heat-conducting refrigerant channel 201 is connected to the refrigerant outlet of the heat pipe radiator 2 through the throttling device 4, and the refrigerant outlet of the heat-conducting refrigerant channel 201 is connected to the refrigerant inlet of the heat pipe radiator 2, so that the heat absorbed by the first heat-conducting member 3 from the semiconductor refrigeration member 1 is dissipated through the heat pipe radiator 2.

[0076] The heat-conducting shell 31 of the first heat-conducting member 3 can be made of aluminum alloy, which has the characteristics of light weight and good thermal conductivity. The thickness of the heat-conducting shell 31 can be 3 mm, and it fits tightly with the hot end of the semiconductor refrigeration member 1. The fitting surface is finely processed, and the surface roughness can reach Ra0.8μm to ensure a good heat conduction effect. Thermal conductive silicone grease can also be applied between the heat-conducting shell 31 and the hot end of the semiconductor refrigeration member 1 to further reduce thermal resistance and improve heat transfer efficiency.

[0077] The heat-conducting refrigerant channel 201 is located inside the heat-conducting housing 31, and can be designed as a serpentine pipe, and the inner diameter of the pipe can be 4 mm. The refrigerant inlet and the refrigerant outlet can be located on the same side of the heat-conducting housing 31, or on different sides of the heat-conducting housing 31, which is not limited.

[0078] When the semiconductor refrigeration element 1 is powered on, the cold end starts to cool and the hot end generates heat. Since the heat-conducting housing 31 is in close contact with the hot end of the semiconductor refrigeration element 1, the heat is quickly transferred to the heat-conducting housing 31. The liquid refrigerant in the heat-conducting refrigerant channel 201 in the heat-conducting housing 31 absorbs heat and begins to vaporize, turning into a gaseous refrigerant. Under the action of the pressure difference, the gaseous refrigerant flows out from the refrigerant outlet and enters the heat pipe radiator 2.

[0079] Among them, in the heat pipe radiator 2, the gaseous refrigerant can enter through the evaporation section of the heat pipe, and under the action of the working fluid inside the heat pipe, the heat can be quickly transferred to the condensation section. In the condensation section, the gaseous refrigerant releases heat and liquefies to form a gas-liquid two-phase refrigerant. After the gas-liquid two-phase refrigerant flows out from the refrigerant outlet of the heat pipe radiator 2, it passes through the throttling device 4. The throttling device 4 throttles and reduces the pressure of the refrigerant, so that the liquid refrigerant further increases, and at the same time forms a certain resistance difference, driving the refrigerant to continue to circulate. The refrigerant after throttling returns to the heat-conducting refrigerant channel 201 in the heat-conducting shell 31 to start the next round of heat absorption and transfer cycle. Through this separated heat pipe effect, the heat at the hot end of the semiconductor refrigeration component 1 can be quickly taken away, avoiding the concentration of heat, effectively improving the heat dissipation effect, and thus ensuring the refrigeration efficiency of the cold end.

[0080] It should be noted that the heat-conducting refrigerant channel 201 can be set as a one-way channel. When the liquid refrigerant in the heat-conducting refrigerant channel 201 is heated into a gaseous state, it expands, which can better drive the gaseous refrigerant to flow out from the refrigerant outlet, complete the heat dissipation cycle of the refrigerant, and form a heat pipe effect. Figure 2 and Figure 4 The direction of the arrow near the pipe in the figure is the direction of refrigerant flow.

[0081] In some embodiments, the semiconductor refrigeration device may include a first pipeline 101 and a second pipeline 102, wherein the first pipeline 101 is used to connect the refrigerant outlet of the heat-conducting refrigerant channel 201 with the refrigerant inlet of the heat pipe radiator 2, and the second pipeline 102 is used to connect the refrigerant inlet of the heat-conducting refrigerant channel 201 with the refrigerant outlet of the heat pipe radiator 2. The first pipeline 101 may include a thicker pipeline, such as a diameter of D7. The second pipeline 102 may include a capillary as a throttling device 4 for throttling, so that a certain resistance difference is formed between the refrigerant inlet and the refrigerant outlet of the heat-conducting refrigerant channel 201. The heat pipe radiator 2 may be a tube-fin heat exchanger, which may be filled with a low-pressure refrigerant, such as R600a. When the semiconductor cooling plate is powered, the hot end generates heat. Since the heat-conducting shell 31 (for example, the hot end aluminum box) is in close contact with the hot end of the semiconductor cooling plate, the internal refrigerant is heated and turned into gas, flows out from the refrigerant outlet, moves upward to the tube-fin heat exchanger, and forms a gas-liquid two-phase reflux after being cooled. After capillary throttling, the liquid further increases and returns to the heat-conducting refrigerant channel 201 in the hot end aluminum box. The hot end aluminum box is provided with a one-way channel, which expands during the process of the liquid refrigerant in the hot end aluminum box being heated to gas, and drives the gaseous refrigerant to flow out of the outlet pipe. This forms a cycle and forms a heat pipe effect. However, it should be noted that the amount of refrigerant should not be too small, otherwise it will cause the heat pipe effect to be unstable and liquid reflux may not be formed. The amount of refrigerant in this embodiment can be between 25g and 45g.

[0082] In this embodiment, through the unique combination design of the first heat conductor 3, the heat pipe radiator 2 and the throttling device 4, an efficient separated heat pipe effect is formed, which can quickly and effectively dissipate the heat at the hot end of the semiconductor refrigeration component 1, effectively reduce the hot end temperature, and improve the refrigeration efficiency.

[0083] In addition, due to the improved stability of the refrigeration system, more precise temperature control can be achieved, which is of great significance for the storage of temperature-sensitive items such as medicines and biological products, and can better ensure the quality and performance of the items.

[0084] In addition, the structure design of the entire semiconductor refrigeration device is compact, and the connections between the components are tight and reasonable. For example, the connection between the first heat conductor 3 and the semiconductor refrigeration component 1 and the heat pipe radiator 2 can adopt an interface with good sealing performance to reduce the risk of refrigerant leakage. At the same time, since there are no complex moving parts, the failure rate of the equipment is reduced, the reliability and service life of the equipment are improved, the maintenance and repair costs of the equipment are reduced, and the user experience is improved.

[0085] In an exemplary embodiment, a semiconductor refrigeration device and a control method thereof are provided. Figures 1 to 6 As shown, the semiconductor refrigeration device may include a heating device 5 and a sealing plate 6. The heating device 5 includes a heating chamber for placing a heated object. The heating device 5 may also include an insertion port 51 for the heated object, and the heated object may be inserted into the heating chamber through the insertion port 51. The heated object may be, for example, a mask, a glove, or other items, which are not limited to this. For example, the heating chamber is constructed in a flat rectangular shape and is used to heat a mask.

[0086] Among them, the heating device 5 and the sealing plate 6 are both located above the heat pipe radiator 2, and the sealing plate 6 can be, for example, an aluminum plate, which can be recorded as a rear aluminum plate. The sealing plate 6 is fixedly connected to the side plate 21 of the heat pipe radiator 2, so that the sealing plate 6, the heat pipe radiator 2 and the heating device 5 form an open heat dissipation airflow channel 202. For example, the sealing plate 6 can be made of an aluminum plate with a thickness of 4 mm, which is fixedly connected to the side plate 21 of the heat pipe radiator 2 by rivets to form a stable structural frame. When the heat pipe radiator 2 dissipates the heat from the hot end of the semiconductor refrigeration component 1 upward, a chimney effect is formed through the above-mentioned heat dissipation airflow channel 202. The flow direction in the heat dissipation airflow channel 202 can be referred to. Figure 2 As shown by the arrow above the heat pipe radiator 2.

[0087] Among them, in the above-mentioned heat dissipation airflow channel 202, the interval a between the sealing plate 6 and the heating device 5 can be greater than or equal to 6mm and less than or equal to 15mm, for example, 6mm. Since the heat dissipation airflow channel 202 is relatively narrow, a slightly flowing fluid channel effect can be generated to enhance heat dissipation (when there is no fan 11, when the heat dissipation temperature of the heat pipe radiator 2 reaches 54°C, a flow rate of about 0.4m / s can be generated). In this embodiment, the hot air passing through the above-mentioned channel can be dispersed upward on the one hand, and can heat the heated object in the heating chamber on the other hand.

[0088] The heating device 5 may include a heating plate 52 and a heating compensator 53. The heating plate 52 is, for example, an aluminum plate, which may be referred to as an inner aluminum plate. The heating plate 52 constitutes a side plate of the heating chamber facing the sealing plate 6, so that the heating plate 52, the sealing plate 6 and the heat pipe radiator 2 constitute a heat dissipation airflow channel 202, and the heating compensator 53 is located on the side of the heating plate 52 facing the sealing plate 6, and is used to heat the heating plate 52.

[0089] In this embodiment, the heat dissipation airflow channel 202 can be used to heat the heated object in the heating chamber, and the heating compensator 53 can also be used to heat the heated object in the heating chamber through the heating plate 52, and there is no limitation on this. Among them, when it is necessary to heat the heated object, if it is detected that the ambient temperature of the environment where the semiconductor refrigeration device is located is greater than the set ambient temperature, it means that the ambient temperature is high enough, and the heat dissipation temperature of the heat pipe radiator 2 may be relatively high. The heating compensator 53 of the heating device 5 can be controlled to be in a closed state. At this time, only the heat dissipation airflow channel 202 is used to heat the heated object. That is, the heat dissipation of the heat pipe radiator 2 is used to heat the heated object.

[0090] It should be noted that the above-mentioned set ambient temperature can be set according to actual conditions, and its specific value may not be limited. The semiconductor refrigeration device may be provided with a temperature sensor for detecting the ambient temperature, and the ambient temperature is detected by the above-mentioned temperature sensor. Of course, the semiconductor refrigeration device may also be connected to the ambient temperature detection device in the environment, so as to obtain the ambient temperature through the ambient temperature detection device, and this is not limited.

[0091] Among them, when the ambient temperature is less than or equal to the set ambient temperature, the heating compensator 53 can be controlled to be in an open state. In this case, the heating compensator 53 and the heat pipe radiator 2 jointly heat the heated object to shorten the heating time. For example, by heating the mask together with the heating compensator 53 and the heat pipe radiator 2, the mask can be heated to >30°C within 3 minutes. In addition, in addition to inserting the mask into the heating chamber, the mask can also be inserted into the heat dissipation airflow channel 202, so that two masks can be heated at the same time. It should be noted that when the ambient temperature is relatively low, such as an ambient temperature of 16°C, the heat dissipation temperature of the heat pipe radiator 2 may be relatively low, for example, only 35°C. At this time, the heat dissipation airflow channel 202 has a relatively poor effect on heating the mask. Since the heating plate 52 and the heating compensator 53 are provided, the heating amount can be supplemented by the heating compensator 53, thereby achieving a better heating effect in a shorter time.

[0092] The heating compensator 53 may be an electric heating wire, which is made of nickel-chromium alloy and has a power of 600 W. The heating wires are evenly distributed on the side of the heating plate 52 facing the sealing plate 6 and fit closely with the heating plate 52 to ensure that heat can be evenly transferred to the heating plate 52, thereby efficiently heating the items in the heating chamber.

[0093] Among them, the interval between the heating plate 52 and the sealing plate 6 can be greater than or equal to 6 mm and less than or equal to 15 mm, for example 6 mm, thereby forming a narrower heat dissipation airflow channel 202, so that when the heat of the heat pipe radiator 2 is dissipated to the opening of the heat dissipation airflow channel 202, a chimney effect is formed in the heat dissipation airflow channel 202.

[0094] The heating device 5 may include a temperature detector 54 and a controller (not shown in the figure), wherein the temperature detector 54 is disposed on the heating plate 52 and is used to detect the temperature of the heating plate 52. The controller is electrically connected to the temperature detector 54 and the heating compensator 53, respectively, and the controller may be configured to control the operation of the heating compensator 53 based on the temperature detected by the temperature detector 54. That is, in this embodiment, the controller may obtain the temperature of the heating plate 52 from the temperature detector 54 (e.g., a temperature sensing package), and then control the operation of the heating compensator 53 based on the obtained temperature.

[0095] In this embodiment, the semiconductor refrigeration device may include a temperature sensor (not shown) for detecting the ambient temperature, and the temperature sensor may be electrically connected to the controller. When the object to be heated is placed in the heating chamber, the controller may obtain the ambient temperature of the environment in which the semiconductor refrigeration device is located through the temperature sensor, and then determine the difference between the ambient temperature and the set ambient temperature.

[0096] If the ambient temperature is greater than the set ambient temperature, the heating compensator 53 of the heating device 5 is controlled to be in a closed state. In this case, the semiconductor refrigeration equipment uses the heat dissipation airflow channel 202 to heat the heated object, that is, uses the heat dissipation of the heat pipe radiator 2 to heat the heated object.

[0097] If the ambient temperature is less than or equal to the set ambient temperature, it means that the environment is low and the object to be heated cannot be heated well by heat dissipation of the heat pipe radiator 2 alone. In this case, the heating compensator 53 can be controlled to be in an open state, and the heating compensator 53 and the heat pipe radiator 2 are used together to heat the object to be heated. In addition, the controller can determine the initial heating time of the heating compensator 53 of the heating device 5 based on the acquired ambient temperature.

[0098] The higher the ambient temperature, the shorter the initial heating time. For example, when the ambient temperature T≤16°C, the initial heating time of the heating compensator 53 can be set to 6 minutes. When 16°C<T≤25°C, the initial heating time can be set to 3 minutes. When the ambient temperature T>25°C, the initial heating time can be set to 2 minutes.

[0099] When the heating compensator 53 is in the on state, the controller can obtain the temperature of the heating plate 52 from the temperature detector 54. After the heating compensator 53 completes the heating for the initial heating time, the controller can control the operation of the heating compensator 53 based on the temperature of the heating plate 52 (i.e., the temperature obtained from the temperature detector 54) to better achieve heating of the heated object.

[0100] If the temperature of the heating plate 52 is greater than the first temperature threshold, it means that the temperature of the heating plate 52 is too high, and the heating compensator 53 can be controlled to stop heating to prevent the heated object from being overheated. If the temperature of the heating plate 52 is less than or equal to the first temperature threshold, it means that the temperature of the heated object is still low and further heating is still required, and the heating compensator 53 can be controlled to continue heating until the temperature of the heating plate 52 is greater than or equal to the second temperature threshold. The second temperature threshold is greater than or equal to the first temperature threshold.

[0101] It should be noted that the first temperature threshold and the second temperature threshold can be set according to actual needs, and their specific values ​​are not limited.

[0102] In some embodiments, the first temperature threshold may be 35°C, the second temperature threshold may be 45°C, and the heated object may be a facial mask. In this embodiment, after the heating compensator 53 completes the initial heating time, if the temperature of the heating plate 52 is still lower than 35°C, it means that the temperature of the facial mask is still low, and the actual heating temperature of the facial mask may be only 25°C. In this case, the heating time of the heating compensator 53 may be extended, such as the extended heating setting time (for example, 8 minutes or 10 minutes, the specific data is not limited). After completing the heating for the set time, the temperature of the heating plate 52 may continue to be judged. If the temperature of the heating plate 52 is still lower than 35°C, the set time may continue to be extended. During the extended heating process, if the temperature of the heating plate 52 exceeds 45°C, the heating is immediately exited, i.e., the heating compensator 53 is turned off.

[0103] It should be noted that in this embodiment, when the ambient temperature is high, the heating compensator 53 is generally not needed, and the object to be heated can be directly heated by the heat dissipation of the heat pipe radiator 2. However, when the original temperature of the object to be heated is low, for example, the object to be heated is stored in a semiconductor refrigeration device, and the temperature of the object to be heated has been cooled to 2°C to 4°C when it is taken out, the short-term heating effect is insufficient, and the heating compensator 53 needs to be used.

[0104] In addition, in this embodiment, the heating device 5 may include a placement detector 55 for the heated object. The placement detector 55 is configured to generate a signal indicating that the heated object is placed in the heating cavity after the heated object is placed in the heating cavity.

[0105] Among them, the detector 55 is arranged to include a photoelectric induction switch and / or a photoelectric sensor. The principle of the photoelectric induction switch is: the photoelectric switch is provided with a concave slot with a small light-emitting window and a light-receiving window. When a shield is inserted into the concave slot, different relative photocurrents and corresponding conversion voltages can be obtained. The photoelectric induction switch can know that a shield is inserted through the change of voltage, thereby accurately identifying it. Then a signal is sent to the heating compensator 53. Only when the heating compensator 53 receives the above signal, the controller can control the power on or off. In addition, the above signal can also be sent to the controller, and after receiving the above signal, the controller can control the operation of the heating compensator 53.

[0106] For example, if a photoelectric induction switch is used for detection, such as a reflective photoelectric induction switch, its transmitting end continuously emits light. When the heated object has not entered the heating chamber, the receiving end can receive the reflected light. At this time, the device is in a standby detection state. Once the heated object is inserted into the heating chamber, the light is blocked, the receiving end cannot receive the light, and the photoelectric switch immediately outputs a signal change, which serves as a signal indicating that the heated object is placed in the heating chamber.

[0107] For another example, if a photoelectric sensor is used for detection, such as a beam photoelectric sensor, there is light transmission between the transmitting end and the receiving end. When the object to be heated enters the heating chamber and blocks the light, the photoelectric sensor generates a signal change, which serves as a signal indicating that the object to be heated is placed in the heating chamber.

[0108] In this embodiment, the controller can obtain the ambient temperature of the environment in which the semiconductor refrigeration device is located only after detecting that the object to be heated is placed in the heating chamber of the heating device 5, and then perform subsequent heating control to improve the reliability of the heating control.

[0109] This embodiment realizes the integration of cooling, heating and efficient heat dissipation functions by organically combining the heating device 5, the semiconductor refrigeration element 1 and the heat pipe radiator 2. One device can meet the needs of various scenarios, reducing the purchase cost and occupied space of the device.

[0110] In addition, the intelligent heating compensator 53 control strategy based on the ambient temperature and the temperature of the heating plate 52 in this embodiment can accurately adjust the heating power and time according to different environmental conditions and the heating requirements of the heated object. While ensuring that the heated object quickly reaches a suitable temperature, it avoids energy waste and damage to items caused by overheating. Moreover, the unique heat dissipation airflow channel 202 design of the semiconductor refrigeration equipment and the efficient heat dissipation performance of the heat pipe radiator 2 can better ensure the stable operation of the equipment. For example, the temperature of the hot end of the semiconductor refrigeration component 1 can be effectively controlled at a low level to ensure the refrigeration effect of the cold end; and the temperature in the heating device 5 will not be too high, avoiding safety hazards and improving heating efficiency. In other words, whether it is cooling or heating, the semiconductor refrigeration equipment can achieve relatively accurate temperature control, which can well meet the refrigeration and heating requirements.

[0111] In an exemplary embodiment, a semiconductor refrigeration device and a control method thereof are provided. Figures 1 to 7 As shown, the semiconductor refrigeration device may include a cooling member 7 (e.g., a cooling aluminum block) and a cooling plate 8 (e.g., an aluminum plate). The cooling member 7 is located between the cooling plate 8 and the semiconductor refrigeration member 1, and one side of the cooling member 7 is closely attached to the cooling plate 8, and the other side of the cooling member 7 is closely attached to the semiconductor refrigeration member 1. The cooling plate 8 is used to cool the compartment of the semiconductor refrigeration device.

[0112] The semiconductor refrigeration device includes a heat-insulating layer 9, which is located on the first side of the cooling plate 8, the first side being the side of the cooling plate 8 away from the chamber of the semiconductor refrigeration device, and the cooling member 7 is located in the heat-insulating layer 9. The heat-insulating layer 9 is made of polyurethane foam material, and its thermal conductivity is as low as 0.02W / (m·K), and has good thermal insulation performance. The heat-insulating layer 9 is located on the side of the cooling plate 8 away from the chamber of the semiconductor refrigeration device, and wraps the cooling member 7 therein, which can effectively reduce the loss of cold to the outside, improve the refrigeration efficiency of the device, and reduce energy consumption.

[0113] The semiconductor refrigeration device includes a rear baffle 10 and a fan 11, and the rear baffle 10 is spaced apart from the cooling plate 8 to form a cooling airflow channel 203. There may be a gap between the four sides of the rear baffle and the chamber wall of the semiconductor refrigeration device, so that the cooling airflow channel 203 is connected to the chamber of the semiconductor refrigeration device, and the fan 11 is located in the cooling airflow channel 203 to drive the flow of gas in the cooling airflow channel 203, so as to evenly cool the chamber of the semiconductor refrigeration device. It should be noted that the fan 11 can be fixed to the rear baffle 10 through a bracket, and can also be fixed to other structures of the semiconductor refrigeration device, which is not limited to this. Figure 1 The arrow direction is the gas flow direction.

[0114] A drainage hole 12 and a water receiving box 13 are provided at the bottom of the cooling air flow channel 203. The drainage hole 12 is used to discharge the condensation water generated in the cooling air flow channel 203 to the water receiving box 13 to avoid the accumulation of the condensation water.

[0115] The semiconductor refrigeration device includes a second heat conducting member 15, one end of which is connected to the first heat conducting member 3, and the other end of which is connected to the water receiving box 13. The second heat conducting member 15 absorbs heat from the first heat conducting member 3 to evaporate the condensed water in the water receiving box 13.

[0116] Among them, the water receiving box 13 is provided with absorbent cotton 14, which is arranged at the position of the drain hole 12 to better absorb the condensation water formed in the cooling air flow channel 203. For example, the absorbent cotton 14 is made of polyester fiber and has good water absorption. The absorbent cotton 14 is arranged at the position of the drain hole 12, one end of which is in contact with the drain hole 12, and the other end is immersed in a small amount of water in the water receiving box 13 to better absorb the condensation water formed in the cooling air flow channel 203. When condensation water flows out of the drain hole 12, the absorbent cotton 14 can quickly absorb it and diffuse it into the water receiving box 13, preventing the condensation water from accumulating near the drain hole 12 and blocking the drain hole 12.

[0117] It should be noted that when the semiconductor refrigeration equipment leaks cold or the door of the compartment is opened for a long time, condensation water may be generated, and the condensation water can flow along the cooling plate 8 to the bottom of the cooling air flow channel 203 and gather. The bottom is provided with a drainage hole 12 to drain the condensation water well. Moreover, since the drainage hole 12 is provided with a water-absorbing cotton 14, the moisture-absorbing cotton can well guide the water into the water receiving box 13, and then the condensation water is evaporated by the heat absorbed from the first heat conducting member 3 by the second heat conducting member 15. The second heat conducting member 15 can be, for example, a heat dissipation aluminum plate, and the first heat conducting member 3 can be, for example, a hot end aluminum box. The heat dissipation aluminum plate and the hot end aluminum box are connected, and under the action of heat conduction (about 45°C to 55°C), the condensation water in the water receiving box 13 can be well evaporated.

[0118] When the semiconductor refrigeration device includes two or more compartments, the cooling plate 8 is provided with a folded edge between adjacent compartments to form a complete cooling plate 8. Condensation water can flow along the cooling plate 8 along the folded edge. Such a design can make the cooling plate 8 better cover each compartment, ensure uniform distribution of cooling capacity, and at the same time, condensation water can flow along the folded edge along the cooling plate 8 to the bottom of the cooling air flow channel 203.

[0119] In this embodiment, the semiconductor refrigeration device can achieve efficient cooling and uniform temperature distribution through the synergistic effect of the cooling member 7, the cooling plate 8 and the fan 11. In different application scenarios, such as commercial refrigerated display cabinets or multi-purpose fresh-keeping boxes, the temperature difference of each part of the room can be controlled within a small range, ensuring the quality consistency of the refrigerated items.

[0120] In addition, the combined design of the drainage hole 12, the absorbent cotton 14, the water receiving box 13 and the second heat conducting member 15 effectively solves the problem of handling condensation water during the use of the semiconductor refrigeration equipment. In a high humidity environment or when the door is opened frequently, the condensation water can be discharged and evaporated in time, avoiding the accumulation of water and the formation of a humid environment inside the equipment. This not only protects the electrical components and structural components of the equipment from water damage, but also reduces the possibility of bacterial and mold growth, improves the sanitation safety and reliability of the equipment, and extends the service life of the equipment.

[0121] Moreover, the use of the thermal insulation layer 9 significantly reduces the loss of cold and reduces the energy consumption of the semiconductor refrigeration equipment. In the long-term operation process, a large amount of power consumption can be saved, which meets the requirements of modern energy conservation and environmental protection.

[0122] The professionals should also be further aware that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented with electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0123] It should be noted that the phrases "one implementation", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0124] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more limiting values, the elements defined by the sentence "comprise a..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0125] The above embodiments are only preferred embodiments for fully illustrating the present application, and the protection scope of the present application is not limited thereto. Any equivalent substitution or change made by a person skilled in the art based on the present application is within the protection scope of the present application.

Claims

1. A semiconductor refrigeration device, characterized in that: The semiconductor refrigeration device comprises a semiconductor refrigeration element, a heat pipe radiator, a first heat-conducting element and a throttling device, wherein the first heat-conducting element comprises a heat-conducting shell and a heat-conducting refrigerant channel located inside the heat-conducting shell; Among them, the heat-conducting shell is arranged closely to the hot end of the semiconductor refrigeration component, the refrigerant inlet of the heat-conducting refrigerant channel is connected with the refrigerant outlet of the heat pipe radiator through the throttling device, and the refrigerant outlet of the heat-conducting refrigerant channel is connected with the refrigerant inlet of the heat pipe radiator, so as to dissipate the heat absorbed by the first heat-conducting component from the semiconductor refrigeration component through the heat pipe radiator.

2. The semiconductor refrigeration device according to claim 1, characterized in that: The semiconductor refrigeration device comprises a heating device and a sealing plate, wherein the heating device comprises a heating chamber for placing a heated object; The heating device and the sealing plate are both located above the heat pipe radiator, and the sealing plate is fixedly connected to the side plate of the heat pipe radiator, so that the sealing plate, the heat pipe radiator and the heating device form an open heat dissipation airflow channel.

3. The semiconductor refrigeration device according to claim 2, characterized in that: The heating device includes a heating plate and a heating compensator, the heating plate constitutes a side plate of the heating chamber facing the sealing plate, so that the heating plate, the sealing plate and the heat pipe radiator constitute the heat dissipation airflow channel, and the heating compensator is located on the side of the heating plate facing the sealing plate, and is used to heat the heating plate.

4. The semiconductor refrigeration device according to claim 3, characterized in that: The interval between the heating plate and the sealing plate is greater than or equal to 6 mm and less than or equal to 15 mm, so that when the heat of the heat pipe radiator is dissipated toward the opening of the heat dissipation airflow channel, a chimney effect is formed in the heat dissipation airflow channel.

5. The semiconductor refrigeration device according to claim 3, characterized in that: The heating device comprises a temperature detector and a controller, wherein the temperature detector is arranged on the heating plate and is used to detect the temperature of the heating plate; The controller is electrically connected to the temperature detector and the heating compensator, respectively, and is configured to control the operation of the heating compensator based on the temperature detected by the temperature detector.

6. The semiconductor refrigeration device according to claim 2, characterized in that: The heating device comprises a placement detector for a heated object, and the placement detector is configured to generate a signal indicating that the heated object is placed in the heating cavity after the heated object is placed in the heating cavity.

7. The semiconductor refrigeration device according to claim 6, characterized in that: The placement detector includes a photoelectric sensing switch and / or a photoelectric sensor.

8. The semiconductor refrigeration device according to claim 2, characterized in that: The heating chamber is constructed in a flat rectangular shape and is used for heating the facial mask.

9. The semiconductor refrigeration device according to any one of claims 1 to 8, characterized in that: The semiconductor refrigeration device includes a cooling member and a cooling plate. The cooling plate is used to cool the compartment of the semiconductor refrigeration device. The cooling member is located between the cooling plate and the semiconductor refrigeration member, and one side of the cooling member is closely attached to the cooling plate, while the other side of the cooling member is closely attached to the semiconductor refrigeration member.

10. The semiconductor refrigeration device according to claim 9, characterized in that: The semiconductor refrigeration device comprises a heat-insulating layer, the heat-insulating layer is located on a first side of the cooling plate, the first side is a side of the cooling plate away from the compartment of the semiconductor refrigeration device, and the cooling member is located in the heat-insulating layer.

11. The semiconductor refrigeration device according to claim 9, characterized in that: The semiconductor refrigeration device includes a rear baffle and a fan. The rear baffle and the cooling plate are spaced apart to form a cooling airflow channel. The cooling airflow channel is connected to the compartment of the semiconductor refrigeration device, and the fan is located in the cooling airflow channel to drive the flow of gas in the cooling airflow channel.

12. The semiconductor refrigeration device according to claim 9, characterized in that: A drainage hole and a water receiving box are provided at the bottom of the cooling air flow channel, and the drainage hole is used to discharge condensed water generated in the cooling air flow channel to the water receiving box.

13. The semiconductor refrigeration device according to claim 12, characterized in that: The semiconductor refrigeration device comprises a second heat-conducting member, one end of the second heat-conducting member is connected to the first heat-conducting member, and the other end of the second heat-conducting member is connected to the water receiving box; The second heat conducting member absorbs heat from the first heat conducting member to evaporate condensed water in the water receiving box.

14. The semiconductor refrigeration device according to claim 13, characterized in that: Water-absorbing cotton is arranged in the water receiving box, and the water-absorbing cotton is arranged at the position of the drainage hole.

15. A control method, characterized in that: Applied to the semiconductor refrigeration device according to any one of claims 1 to 14, when the semiconductor refrigeration device includes a heating device, the control method includes: After detecting that the heated object is placed in the heating chamber of the heating device, obtaining the ambient temperature of the environment in which the semiconductor refrigeration device is located; If the ambient temperature is greater than the set ambient temperature, the heating compensator of the heating device is controlled to be in a closed state, and the heat dissipation air flow channel of the semiconductor refrigeration device is used to heat the heated object.

16. The control method according to claim 15, characterized in that: The control method comprises: If the ambient temperature is less than or equal to the set ambient temperature, the heating compensator is controlled to be in an open state, and the initial heating time of the heating compensator of the heating device is determined based on the ambient temperature; wherein the higher the ambient temperature, the shorter the initial heating time; After the heating compensator completes the heating for the initial heating time, the operation of the heating compensator is controlled based on the temperature of the heating plate of the heating device.

17. The control method according to claim 16, characterized in that: The step of controlling the operation of the heating compensator based on the temperature of the heating plate of the heating device comprises: If the temperature of the heating plate is less than or equal to a first temperature threshold, the heating compensator is controlled to continue heating until the temperature of the heating plate is greater than or equal to a second temperature threshold; wherein the second temperature threshold is greater than or equal to the first temperature threshold.

18. The control method according to claim 16, characterized in that: The step of controlling the operation of the heating compensator based on the temperature of the heating plate of the heating device comprises: If the temperature of the heating plate is greater than a first temperature threshold, the heating compensator is controlled to stop heating.

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