A kind of nano silver paste IGBT processing is enclosed with device

Abstract

The application discloses a kind of nano silver paste IGBT processing with packaging device, including outer bearing platform, telescopic rod, L type fixed plate and packaging base, the upper end top of the outer bearing platform is welded with fixed platform, and the inner wall of the side of fixed platform is provided with pre-opening, the inner wall side of the outer bearing platform is distributed with inner bearing platform, and the outer bearing platform of the inner bearing platform is distributed in split, the upper end bolt of the fixed platform is fastened with telescopic cylinder, and the upper end outer wall of telescopic cylinder is provided with slide rail.The nano silver paste IGBT processing with packaging device uses, the paste box is stored as to the redundant nano silver paste, simultaneously, the bearing platform and the outer bearing platform are designed in split, the connecting mode is simple in operation, convenient to use, the telescopic rod is used as telescopic component, drives lower pressure head to carry out telescopic operation, lower pressure head presses L type fixed plate synchronous down pressure operation, so that a plurality of limit head synchronous down pressure, satisfy the semiconductor device plate body to be packaged with multiple point synchronous down pressure operation.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of nano-silver paste IGBT processing equipment, in particular to a packaging device for nano-silver paste IGBT processing. BACKGROUND

[0002] An insulated gate bipolar transistor (IGBT) combines the advantages of power transistors and power field effect transistors, has good characteristics, and is widely applied, and the IGBT is a natural evolution of a vertical power MOSFET for strong current, high voltage application and fast terminal equipment, and the IGBT needs to be packaged by a packaging device in a production process.

[0003] The application provides an IGBT module packaging device (CN221596397U), which comprises a packaging main body, an electric push rod is arranged at the top of the packaging main body, a pressing plate is arranged on the telescopic shaft of the electric push rod and is placed in the packaging main body, a positioning seat is arranged on the lower side of the inner wall of the packaging main body and is placed below the pressing plate, a positioning groove for placing an IGBT module box body is formed in the top of the positioning seat, a stop rod is arranged at the corner of the top of the positioning seat, a limiting screw rod is arranged at the position corresponding to the stop rod at the bottom of the pressing plate, an avoiding groove for avoiding the limiting screw rod is formed in the top of the packaging main body, the limiting screw rod comprises a threaded column which is arranged through the bottom of the pressing plate and is placed above the stop rod, a force applying disc is arranged at the top of the threaded column, and a limiting disc is arranged at the bottom of the threaded column, the device has a reasonable structure, high packaging quality and high packaging efficiency. However, in use, the excessive nano-silver paste will overflow along the packaging gap, and the nano-silver paste needs to be collected and stored by a collecting component or manually, which is inconvenient for users to use, and the IGBT module is usually pressed by single-point positioning, so that the IGBT module cannot be completely packaged, and the yield cannot be guaranteed.

[0004] Therefore, the application provides the packaging device for nano-silver paste IGBT processing. SUMMARY

[0005] The application aims to provide the packaging device for nano-silver paste IGBT processing to solve the problems in the background art.

[0006] In order to achieve the above object, the application provides the following technical scheme: a packaging device for nanometer silver paste IGBT processing, comprising an outer support table, a telescopic rod, an L-shaped fixing plate and a packaging base, a fixed table is welded on the upper end top of the outer support table, a pre-hole is formed in the inner wall of one side of the fixed table, an inner support table is distributed on the inner wall side of the outer support table, and the inner support table is distributed in a split manner on the outer support table, a telescopic cylinder is fastened on the upper end of the fixed table by bolts, a sliding rail is formed in the outer wall of the upper end of the telescopic cylinder, a sliding block is slidingly connected to the upper end of the sliding rail, a connecting head is arranged on one end of the sliding block, the telescopic cylinder, the sliding block, the sliding rail and the connecting head form a pneumatic telescopic structure, a clamp for clamping a semiconductor device plate body is fastened on one end of the connecting head away from the sliding block by bolts, L-shaped fixing plates are slidingly connected to the front end of both sides of the clamp, cross beams are fastened on the upper end middle portions of both sides of the L-shaped fixing plates by bolts, and a plurality of limiting heads are arranged on the inner wall side of the L-shaped fixing plates.

[0007] Preferably, a paste storage box for storing the leaked nanometer silver paste is arranged on the upper end top of the inner support table, and a connecting plate is bolted at the connection between the paste storage box and the inner support table.

[0008] Preferably, a telescopic rod is fastened on one side of the outer support table along the pre-hole, a limiting seat is arranged on the connection between the telescopic rod and the outer support table, and a pressing head is fixedly connected to the upper end of the telescopic rod along the pre-hole.

[0009] Preferably, one end of the L-shaped fixing plate is in contact with the pressing head, and the recessed side of the L-shaped fixing plate is connected to the pressing head.

[0010] Preferably, the limiting heads are in contact with the upper surface of the semiconductor device plate body, and flexible protective soft pad sleeves are interference-connected to the bottoms of the limiting heads.

[0011] Preferably, a sliding groove is formed in one side of the L-shaped fixing plate close to the connecting head, and a return spring is fixedly connected to the middle portion of the L-shaped fixing plate along the sliding groove.

[0012] Preferably, a connecting block is fixedly connected to the lower end of the return spring, the connecting block and the sliding groove are in sliding connection, and the connecting block and the connecting head are in fixed connection.

[0013] Preferably, a butt joint groove is formed at the connection between the connecting block and the return spring, and the inner wall of the bottom of the connecting block and the return spring are in fixed pin connection.

[0014] Preferably, a packaging base for packaging the semiconductor device plate body is arranged in the middle portion of the fixed table, and a plurality of paste leakage holes are formed in the inner wall of the packaging base.

[0015] Preferably, the operation method is as follows: the IGBT semiconductor device plate body to be processed is clamped by the clamp 34, at this time, the sliding block 31 is driven to slide along the upper end of the slide rail 32 through the telescopic cylinder 3, when the semiconductor device plate body to be packaged moves to the packaging base 6, only the telescopic rod 4 needs to be controlled to press down, the lower pressing head 42 is driven to move downward, the L-shaped fixed plate 5 is pressed by the lower pressing head 42 to perform synchronous pressing operation, so that the plurality of limiting heads 52 are synchronously pressed down, when the excess nano-silver paste flows to the four around along the packaging gap during the packaging process of the semiconductor device plate body, the excess nano-silver paste falls into the paste storage box 21 from the paste leakage hole 61, then when the lower pressing head 42 is separated, the connecting block 56 is fixedly connected with the connecting head 33, the L-shaped fixed plate 5 is reset to rise along the connecting block 56 through the reset spring 55, at the same time, the connecting block 56 is slidingly connected with the L-shaped fixed plate 5 through the sliding groove 54, the sliding groove 54 plays a certain limiting protection function, and ensures that the L-shaped fixed plate 5 is in a vertical state during the resetting process, finally, when the user needs to take the nano-silver paste in the paste storage box 21 in time, only the inner bearing platform 2 needs to be separated from the outer bearing platform 1.

[0016] Compared with the prior art, the packaging device for nano-silver paste IGBT processing has the beneficial effects that: the paste storage box is used for storing excess nano-silver paste, the inner bearing platform and the outer bearing platform are designed in a split type, the connecting mode is simple to operate and convenient to use, the telescopic rod is used as a telescopic component to drive the lower pressing head to perform telescopic operation, the L-shaped fixed plate is pressed by the lower pressing head to perform synchronous pressing operation, so that the plurality of limiting heads are synchronously pressed down, and the semiconductor device plate body to be packaged is subjected to multi-point synchronous pressing operation, the structure is simple to operate and sensitive in action, and meets the needs of semiconductor device plate body packaging operation.

[0017] The two L-shaped fixed plates are fixedly connected through a pair of cross beams to guarantee the function of multi-point synchronous pressing operation of the semiconductor device plate body, and the sliding groove plays a certain limiting protection function to ensure that the L-shaped fixed plate is in a vertical state during the resetting process, and guarantee the stability of the whole action structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a three-dimensional structure schematic view of the application;

[0019] Figure 2 It is a connecting structure schematic view of the outer bearing platform and the inner bearing platform of the application;

[0020] Figure 3 It is an L-shaped fixed plate structure schematic view of the application;

[0021] Figure 4 It is a split type structure schematic view between the L-shaped fixed plate and the telescopic rod of the application;

[0022] Figure 5 For the invention Figure 1 A local amplification structure diagram is shown.

[0023] In the figure: 1, outer support platform; 11, fixed platform; 12, pre-pore; 2, inner support platform; 21, paste storage box; 22, connecting plate; 3, telescopic cylinder; 31, sliding block; 32, sliding rail; 33, connecting head; 34, clamp; 4, telescopic rod; 41, limiting seat; 42, lower pressing head; 5, L-shaped fixed plate; 51, crossbeam; 52, limiting head; 53, soft pad sleeve; 54, sliding groove; 55, return spring; 56, connecting block; 57, butt joint groove; 6, packaging base; 61, paste leakage hole. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0025] Embodiment 1

[0026] Please refer to Figures 1-5 , the present application provides a kind of technical scheme: a kind of nano silver paste IGBT processing is packaged with device, including outer support platform 1, telescopic rod 4, L-shaped fixed plate 5 and packaging base 6, the upper end top of outer support platform 1 is welded with fixed platform 11, and pre-pore 12 is arranged in the inner wall of one side of fixed platform 11, the inner wall side of outer support platform 1 is distributed with inner support platform 2, and the outer support platform 1 of inner support platform 2 is distributed in a split manner, the upper end of fixed platform 11 is bolted with telescopic cylinder 3, and the upper end outer wall of telescopic cylinder 3 is provided with sliding rail 32, the upper end of sliding rail 32 is slidably connected with sliding block 31, and the one end of sliding block 31 is provided with connecting head 33, telescopic cylinder 3, sliding block 31, sliding rail 32 and connecting head 33 form pneumatic telescopic structure, and the one end of connecting head 33 away from sliding block 31 is bolted with clamp 34 for clamping semiconductor device plate body, the front end of both sides of clamp 34 is slidably connected with L-shaped fixed plate 5, the upper end of both sides of L-shaped fixed plate 5 is bolted with crossbeam 51, and the inner wall side of L-shaped fixed plate 5 is provided with a plurality of limiting heads 52, the upper end top of inner support platform 2 is provided with paste storage box 21 for storing nano silver paste leakage, and the connecting plate 22 is bolted at the connection between paste storage box 21 and inner support platform 2, the paste storage box 21 is used for storing excess nano silver paste, and the inner support platform 2 and the outer support platform 1 are designed in a split manner, when the user needs to take the nano silver paste in the paste storage box 21 in time, the inner support platform 2 can be separated from the outer support platform 1, and the connection mode is simple and convenient to use.

[0027] Embodiment 2

[0028] Referring to Figures 1-5 The application provides a technical scheme: a kind of nanometer silver paste IGBT processing with packaging device, outer bearing platform 1 is bolted with telescopic rod 4 along the side of pre-opening 12, and telescopic rod 4 and the connecting place of outer bearing platform 1 is erected with limit seat 41, telescopic rod 4 is fixedly connected with lower head 42 along the upper end of pre-opening 12, this telescopic rod 4 as telescopic component, drive lower head 42 to carry out telescopic operation, when the semiconductor device board of being encapsulated moves to packaging base 6, just need to control telescopic rod 4 to press down, drive lower head 42 to move downwards, its lower head 42 press L type fixed plate 5 synchronous pressing operation, so that a plurality of limit head 52 synchronous pressing, satisfy the semiconductor device board of being encapsulated carries out the demand of multiple-point synchronous pressing operation, this kind of structure operation is simple, action is sensitive, satisfy the demand of semiconductor device board packaging operation, the side upper end of L type fixed plate 5 is contacted with lower head 42, and the recessed side of L type fixed plate 5 is connected with lower head 42, limit head 52 is contacted with the upper surface four around semiconductor device board, and the bottom of limit head 52 is connected with the soft pad cover 53 of flexible protection with interference, this soft pad cover 53 as flexible protection, be made of flexible material, play certain flexible protection function, reduce the possibility of hard injury of semiconductor device board in the process of encapsulation.

[0029] Embodiment 3

[0030] Referring to Figures 1-5The application provides a technical scheme: a packaging device for nanometer silver paste IGBT processing, a sliding groove 54 is formed in one side of an L-shaped fixing plate 5 close to a connecting head 33, a reset spring 55 is fixedly connected to the middle part of the sliding groove 54, a connecting block 56 is fixedly connected to the lower end of the reset spring 55, the connecting block 56 and the sliding groove 54 are in sliding connection, the connecting block 56 and the connecting head 33 are in fixed connection, a butt joint groove 57 is formed in the connecting position of the connecting block 56 and the reset spring 55, and the bottom inner wall of the connecting block 56 and the reset spring 55 are in fixed pin connection, the two L-shaped fixing plates 5 are fixedly connected through a pair of cross beams 51, when one side of the L-shaped fixing plate 5 is moved downward by the lower pressing head 42, the other side of the L-shaped fixing plate 5 is synchronously moved downward, the function of multi-point synchronous downward pressing operation of the semiconductor device plate body is guaranteed, when the lower pressing head 42 is separated, the L-shaped fixing plate 5 is reset and rises along the connecting block 56 through the reset spring 55, the connecting block 56 and the L-shaped fixing plate 5 are in sliding connection through the sliding groove 54, the sliding groove 54 plays a certain limiting protection function, ensures that the L-shaped fixing plate 5 is in a vertical state during the resetting process, and guarantees the stability of the whole action structure, a packaging base 6 for packaging the semiconductor device plate body is arranged on the middle part of the fixing table 11, a plurality of paste leakage holes 61 are formed in the inner wall of the packaging base 6, and the paste leakage holes 61 and the paste storage box 21 are in communication, when the semiconductor device plate body is being packaged, the excess nanometer silver paste flows around along the packaging gap, and falls into the paste storage box 21 from the paste leakage holes 61, so that the user can conveniently store and collect the excess nanometer silver paste.

[0031] Working principle: for the nanometer silver paste IGBT packaging device, first, the IGBT semiconductor device plate body to be processed is clamped through the clamp 34, at this time, the sliding block 31 is driven to slide along the upper end of the sliding rail 32 through the telescopic cylinder 3, when the semiconductor device plate body to be packaged moves to the packaging base 6, the telescopic rod 4 is controlled to press downward, the lower pressing head 42 is driven to move downward, the lower pressing head 42 presses the L-shaped fixing plate 5 to synchronously press, a plurality of limiting heads 52 are synchronously pressed, when the semiconductor device plate body is being packaged, the excess nanometer silver paste flows around along the packaging gap, and falls into the paste storage box 21 from the paste leakage holes 61, then when the lower pressing head 42 is separated, the L-shaped fixing plate 5 is reset and rises along the connecting block 56 through the reset spring 55, the connecting block 56 and the L-shaped fixing plate 5 are in sliding connection through the sliding groove 54, the sliding groove 54 plays a certain limiting protection function, ensures that the L-shaped fixing plate 5 is in a vertical state during the resetting process, finally, when the user needs to take the nanometer silver paste in the paste storage box 21 in time, the inner supporting table 2 can be separated from the outer supporting table 1.

Claims

1. A kind of nanometer silver paste IGBT processing encapsulation device, including outer bearing platform (1), telescopic rod (4), L-shaped fixed plate (5) and encapsulation base (6), it is characterized by: The upper end of the outer support platform (1) is welded with a fixed platform (11), and a pre-hole (12) is arranged on the inner wall of one side of the fixed platform (11). The inner wall of the outer support platform (1) is provided with an inner support platform (2), and the outer support platform (1) of the inner support platform (2) is distributed in a split mode. The upper end of the fixed platform (11) is bolted with a telescopic cylinder (3), and the outer wall of the upper end of the telescopic cylinder (3) is provided with a sliding rail (32). The upper end of the sliding rail (32) is slidingly connected with a sliding block (31), and one end of the sliding block (31) is provided with a connecting head (33). The telescopic cylinder (3), the sliding block (31), the sliding rail (32) and the connecting head (33) form a pneumatic telescopic structure, and one end of the connecting head (33) away from the sliding block (31) is bolted with a clamp (34) for clamping a semiconductor device plate. The front end of the clamp (34) is slidingly connected with L-shaped fixed plates (5) on both sides. The upper end of the L-shaped fixed plate (5) is bolted with a cross beam (51) in the middle. The inner wall of the L-shaped fixed plate (5) is provided with a plurality of limiting heads (52). The upper end of the inner support platform (2) is provided with a paste storage box (21) for storing leaked nano silver paste.

2. The silver nano-paste encapsulation device for IGBT processing according to claim 1, characterized in that: The connecting plate (22) is bolted at the connection between the paste storage box (21) and the inner support platform (2).

3. The silver nano-paste encapsulation device for IGBT processing according to claim 2, characterized in that: The outer support platform (1) is bolted with a telescopic rod (4) at one side of the pre-hole (12), and the telescopic rod (4) is provided with a limiting seat (41) at the connection with the outer support platform (1). The telescopic rod (4) is fixedly connected with a pressing head (42) at the upper end of the pre-hole (12).

4. The silver nano-paste encapsulation device for IGBT processing according to claim 3, characterized in that: The upper end of one side of the L-shaped fixed plate (5) is in contact with the pressing head (42), and the recessed side of the L-shaped fixed plate (5) is connected with the pressing head (42).

5. The silver nano-paste encapsulation device for IGBT processing according to claim 4, characterized in that: The limiting head (52) is in contact with the upper surface of the semiconductor device plate, and the bottom of the limiting head (52) is connected with a flexible protective soft pad sleeve (53).

6. The silver nano-paste encapsulation device for IGBT processing according to claim 5, characterized in that: The L-shaped fixed plate (5) is provided with a sliding groove (54) on one side close to the connecting head (33), and the L-shaped fixed plate (5) is fixedly connected with a return spring (55) in the middle of the sliding groove (54).

7. The silver nano-paste encapsulation device for IGBT processing according to claim 6, characterized in that: The lower end of the return spring (55) is fixedly connected with a connecting block (56), and the connecting block (56) and the sliding groove (54) are slidingly connected. The connecting block (56) and the connecting head (33) are fixedly connected. 8.The encapsulation device for nano-silver paste IGBT processing of claim 7, wherein: The connecting block (56) and the return spring (55) are connected with an abutting groove (57), and the bottom inner wall of the connecting block (56) and the return spring (55) are fixedly connected. 9.The encapsulation device for nano-silver paste IGBT processing of claim 8, wherein: The fixed platform (11) is provided with a packaging base (6) for packaging a semiconductor device plate in the middle, and a plurality of paste leakage holes (61) are arranged on the inner wall of the packaging base (6). 10.The encapsulation device for nano-silver paste IGBT processing of claim 9, wherein: The operation method is as follows: the IGBT semiconductor device plate body to be processed is clamped through the clamp (34), at this time, the telescopic cylinder (3) drives the sliding block (31) to slide along the upper end of the slide rail (32), when the semiconductor device plate body to be packaged moves to the packaging base (6), the telescopic rod (4) is only needed to be controlled to press down, the lower pressing head (42) is driven to move downwards, the lower pressing head (42) presses the L-shaped fixed plate (5) to synchronously press down, a plurality of limiting heads (52) are synchronously pressed down, when the semiconductor device plate body is in the packaging process, the excess nano silver paste flows to the four around along the packaging gap, falls into the paste storage box (21) from the paste leakage hole (61), then when the lower pressing head (42) is separated, the connecting block (56) and the connecting head (33) are fixedly connected, the L-shaped fixed plate (5) is reset and rises along the connecting block (56) through the reset spring (55), meanwhile, the connecting block (56) and the L-shaped fixed plate (5) are slidingly connected through the sliding groove (54), the sliding groove (54) plays a certain limiting protection function, ensures that the L-shaped fixed plate (5) is in a vertical state during the resetting process, finally, when the user needs to take the nano silver paste in the paste storage box (21) in time, the inner bearing platform (2) can be separated from the outer bearing platform (1).

Images