Heat dissipation device for electronic component, electrical converter and vehicle

Abstract

The present disclosure relates to a heat dissipation device for an electronic component, the heat dissipation device comprising: a heat dissipation component arranged on a first side of the electronic component; a pressing member disposed on a second side of the electronic component opposite to the first side; wherein the pressing part comprises a pressing plate and a pressing block, the pressing block penetrates through the pressing plate to make contact with the electronic element, and the pressing plate is connected to the fixing structure so that force facing the heat dissipation part can be applied to the electronic element through the pressing block. The invention further provides an electrical converter comprising the heat dissipation device and a vehicle comprising the electrical converter.

Description

Technical Field

[0001] The present disclosure relates to a heat sink for electronic components, in particular to a heat sink for electronic components of an electric converter equipped in a vehicle, which ensures good thermal contact between the heat sink and the electronic components. Background Art

[0002] The operating temperature of electronic components directly affects their own reliability. For example, in the power conversion circuit of an AC-DC converter or a DC-AC converter or a DC-DC converter, power semiconductor devices play an important role, and their working state directly affects the reliability of the entire device. During use, power semiconductor devices consume part of their energy and convert it into heat, causing the power semiconductor devices to heat up and the junction temperature to rise. When the junction temperature exceeds the safety threshold, the current will increase sharply and even cause the transistor to burn out. Therefore, it is necessary to use a heat sink to quickly release the heat to the surrounding environment to reduce the operating temperature of the electronic components. To ensure the stable operation of the heat sink, it is necessary to maintain good thermal contact between the heat sink and the electronic components. Summary of the invention

[0003] The purpose of the present disclosure is to provide a heat dissipation device for electronic components, which has a simple manufacturing process and saves costs, can protect electronic components from damage, has a simple disassembly process, and can increase electrical insulation.

[0004] At least one embodiment of the present disclosure provides a heat dissipation device for an electronic component, the heat dissipation device comprising: a heat dissipation component, which is arranged on a first side of the electronic component; a pressing component, which is arranged on a second side of the electronic component opposite to the first side; wherein the pressing component comprises a pressing plate and a pressing block, the pressing block contacts the electronic component through the pressing plate, and the pressing plate is connected to a fixed structure so as to apply a force toward the heat dissipation component to the electronic component through the pressing block.

[0005] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the pressure plate has at least one through hole, and the pressure block includes a first component, and the free end of the first component can pass through the through hole and press against the first side of the pressure plate.

[0006] For example, in the heat dissipation device provided by at least one embodiment of the present disclosure, the pressing block further includes a second member, which is configured to have a first end pressed against a second side of the pressing plate opposite to the first side, and a second end capable of pressing against the electronic component.

[0007] For example, in the heat dissipation device provided by at least one embodiment of the present disclosure, the free end of the first component has a head, which is made of a deformable material and has a diameter larger than the through hole, so that the head can be deformed toward the center of the head when passing through the through hole, and after passing through the through hole, it is spread away from the center to press against the first side of the pressure plate.

[0008] For example, in the heat dissipation device provided by at least one embodiment of the present disclosure, the head portion is formed by a plurality of petals, and the plurality of petals are configured to be symmetrical or asymmetrical.

[0009] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the pressure plate is in the shape of a flat plate, and reinforcing ribs are provided on the edges of the pressure plate.

[0010] For example, in the heat dissipation device provided by at least one embodiment of the present disclosure, the pressure plate includes at least one arc-shaped sheet structure, and each sheet structure includes a top and two branches extending from the top.

[0011] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the pressure plate includes a hollow portion arranged around the through hole or the pressure block, and the hollow portion is symmetrically arranged along the through hole or the pressure block.

[0012] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the pressing component includes a plurality of pressing blocks, the plurality of pressing blocks are distributed along a first direction and installed on a pressing plate, the hollow portion is symmetrically arranged with the center line of the pressing plate in the first direction as the axis of symmetry, and is symmetrically arranged with the center line of the pressing plate perpendicular to the first direction as the axis of symmetry.

[0013] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the material of the pressing block includes plastic or rubber.

[0014] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the electronic components are accommodated in the housing and electrically connected to the printed circuit board, and wherein the fixing structure is a part of the heat dissipation component or a part of the housing, and the pressing component is fastened to the fixing structure.

[0015] For example, the heat dissipation device provided by at least one embodiment of the present disclosure further includes an electrical insulation sheet, and the electrical insulation sheet is arranged between the heat dissipation component and the electronic element.

[0016] For example, in the heat dissipation device provided in at least one embodiment of the present disclosure, the electronic component includes a MOSFET.

[0017] Another embodiment of the present disclosure further provides an electrical converter, the electrical converter including an AC-DC converter or a DC-AC converter or a DC-DC converter, the electrical converter including the heat dissipation device provided by at least one embodiment of the present disclosure.

[0018] Yet another embodiment of the present disclosure provides a vehicle, which includes the electric converter provided by at least one embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. The following drawings are not deliberately scaled according to the actual size, and the focus is on illustrating the main purpose of the present disclosure.

[0020] Figure 1 A schematic diagram of the structure of a heat dissipation device for electronic components provided according to at least one embodiment of the present disclosure;

[0021] Figure 2 A schematic diagram of the structure of a pressing component provided according to at least one embodiment of the present disclosure;

[0022] Figure 3 A schematic diagram of the structure of a pressing block provided according to at least one embodiment of the present disclosure;

[0023] Figure 4 A schematic diagram of the structure of another pressing block provided according to at least one embodiment of the present disclosure;

[0024] Figure 5 A schematic diagram of the structure of another pressing block provided according to at least one embodiment of the present disclosure;

[0025] Figure 6 A schematic diagram of the structure of a pressing plate provided according to at least one embodiment of the present disclosure;

[0026] Figure 7 A schematic diagram of the structure of another pressing plate provided according to at least one embodiment of the present disclosure;

[0027] Figure 8 A schematic structural diagram of another pressing plate provided according to at least one embodiment of the present disclosure;

[0028] Fig. 9 A schematic structural diagram of another pressing plate provided according to at least one embodiment of the present disclosure;

[0029] Fig.10 The present invention is a schematic structural diagram of another heat dissipation device for electronic components provided according to at least one embodiment of the present disclosure.

[0030] Throughout the drawings, the same or similar components are indicated by the same reference numerals. DETAILED DESCRIPTION

[0031] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure.

[0032] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by ordinary technicians in the field to which the present disclosure belongs. Similar words such as "one", "an" or "the" used in the patent application specification and claims of the present disclosure do not indicate a quantitative limitation, but rather indicate the presence of at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0033] For the convenience of description, the drawings of the present disclosure simplify or omit components commonly used in the art, such as external connection lines and other components not related to the description of the present disclosure. These omitted or simplified components do not affect the understanding of the content of the present disclosure by those skilled in the art.

[0034] It is known in the prior art to use a pressure plate and bolts to maintain contact between the heat sink and the electronic component. Specifically, the pressure plate is directly stacked on the electronic component and connected to the heat sink at a suitable position, so that the electronic component is pressed against the heat sink through the pressure plate. The most obvious disadvantage of this solution is that the rigid force of the pressure plate is directly applied to the electronic component, which may cause damage to the electronic component with a relatively fragile structure.

[0035] It is also known in the prior art to use a spring to maintain contact between the heat sink and the electronic component. Specifically, the spring is placed above the electronic component and connected to the heat sink at a suitable position, so that the electronic component is pressed against the heat sink. This solution requires a hard spring, which is difficult to process, and if the spring is directly pressed against the electronic component, damage to the electronic component and voltage problems will occur.

[0036] At least one embodiment of the present disclosure provides a heat dissipation device for an electronic component, the heat dissipation device comprising: a heat dissipation component, which is arranged on a first side of the electronic component; a pressing component, which is arranged on a second side of the electronic component opposite to the first side; wherein the pressing component comprises a pressing plate and a pressing block, the pressing block contacts the electronic component through the pressing plate, and the pressing plate is connected to a fixed structure so as to apply a force toward the heat dissipation component to the electronic component through the pressing block.

[0037] The heat dissipation device provided by the present disclosure at least overcomes the above-mentioned defects of the prior art. The manufacturing process of the heat dissipation device is simple and cost-saving, the electronic components can be protected from damage, the disassembly process is simple, and electrical insulation can be increased.

[0038] Figure 1 A heat dissipation device 2 for an electronic component 1 provided according to at least one embodiment of the present disclosure is shown. The electronic component 1 is, for example, a circuit component of an electronic device. In some embodiments, the electronic device is, for example, an on-board AC-DC converter or a DC-AC converter or a DC-DC converter, which are often accompanied by a large amount of heat generated by high current during operation. However, it should be understood that the heat dissipation device 2 according to the present disclosure can also be applied to other industrial fields including consumer electronics, household appliances, engineering machinery, electrical equipment, etc.

[0039] like Figure 1 As shown, the electronic device includes a housing 7 and a printed circuit board (not shown) contained in the housing 7. For the convenience of description, Figure 1 Only a part of the electronic device is shown. At least one electronic component 1 is electrically connected to the printed circuit board, for example via pins. Figure 1 In the figure, the number of electronic components 1 is, for example, 4. It should be noted that the number of electronic components 1 being 4 is only an example, and the present disclosure does not limit the number of electronic components 1. The electronic component 1 is, for example, a power semiconductor device, such as a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), which consumes a portion of its energy during use and converts it into a large amount of heat, causing the electronic component 1 to heat up and the junction temperature to rise. It should be noted that MOSFET is only an example, and the present disclosure does not limit the type of electronic component 1. To this end, at least one electronic component 1 is equipped with a heat dissipation device 2, as described in detail below.

[0040] The heat dissipation device 2 includes a heat dissipation component 20, also called a heat sink, which is arranged on the lower side of the electronic component 1. The heat dissipation component 20 can exchange heat with the electronic component 1 and absorb the heat generated by the electronic component 1 during operation, thereby reducing the temperature of the electronic component 1. In some embodiments, the heat dissipation component 20 is formed as a part of the housing 7, such as Figure 1 In some other embodiments, the heat dissipation component 20 and the housing 7 form separate components.

[0041] like Figure 1 As shown, the heat dissipation device 2 includes a pressing component 30 , which is arranged on the upper side of the electronic component 1 , that is, on the side opposite to the heat dissipation component 20 .

[0042] like Figure 1As shown, the pressing component 30 includes a pressing plate 40 and a pressing block 50, and the number of the pressing blocks 50 is 4 to correspond to the number of the electronic components 1. It should be noted that the present disclosure does not limit the number of pressing blocks 50, and it can be selected according to the heat sink. The pressing block 50 is installed on the pressing plate 40 along a first direction, and the first direction is the direction in which the electronic components 1 are arranged. The pressing block 50 contacts the electronic component 1 through the pressing plate 40, and the pressing plate 40 is connected to the fixed structure to apply a force toward the heat dissipation component 20 to the electronic component 1 through the pressing block 50.

[0043] For example, in some embodiments of the present disclosure, the material of the pressing block 50 includes plastic or rubber.

[0044] Since plastic or rubber materials are elastic, pressing on electronic components can avoid applying rigid forces to the electronic components and thus causing damage to the electronic components. In addition, plastic or rubber materials can increase electrical insulation.

[0045] The above-mentioned plastic or rubber materials are only some examples, and the pressing block 50 can also be made of other materials with good insulation and relatively low hardness, as long as it can avoid applying a rigid force that may cause damage to the electronic component 1, and the present disclosure does not limit this.

[0046] According to the configuration of the present disclosure, it is possible to avoid directly applying a rigid force to the electronic component 1, and prevent the electronic component 1 from being damaged by local concentrated strain. In addition, since the pressing plate 40 is connected to the fixed structure, the pressing block 50 can still apply sufficient elastic force to the electronic component 1 over time, thereby forming a stable and reliable thermal contact between the electronic component 1 and the heat dissipation component 20.

[0047] Moreover, the manufacturing process of the heat dissipation device is simple, and the use of a pressing block made of plastic or rubber material can save costs.

[0048] Figure 2 Shows Figure 1 A schematic structural diagram of the pressing component 30 is shown.

[0049] like Figure 2 As shown, the pressing plate 40 has at least one through hole 401, and the pressing block 50 includes a first member 51, the free end of which can pass through the through hole 401 and press against the first side of the pressing plate 40. The pressing block 50 also includes a second member 52, the second member 52 has a first end 521 pressed against the second side of the pressing plate 40 opposite to the first side, and a second end 522 that can press against the electronic component 1. The specific structure of the pressing block 50 can be seen in Figure 3 .

[0050] like Figure 3As shown, the free end of the first component 51 has a head, which is made of a deformable material and has a diameter larger than the through hole 401, so that the head can gather and deform toward the center of the head when passing through the through hole 401, and after passing through the through hole 401, it is stretched away from the center to press against the first side of the pressure plate 40.

[0051] In order to better install the first member 51 into the pressure plate 40, for example, in some embodiments of the present disclosure, the head is formed by a plurality of petals 511, and the plurality of petals 511 are configured to be symmetrical or asymmetrical. The specific structure can be referred to Figure 4 and Figure 5 .

[0052] like Figure 4 As shown, the head of the free end of the first member 51 has four symmetrical petals 511, as shown in FIG. Figure 5 As best shown, the head of the free end of the first structure 51 has two symmetrical petal portions 511. When the first component 51 is installed in the pressing plate 40, the petal-shaped structure gathers toward the center, so that the first component 51 can be retracted through the through hole 401, so that the first component 51 can be installed in the pressing plate 40 more conveniently.

[0053] It should be noted that Figure 3 to Figure 5 The structures of the pressing blocks 50 shown are merely examples, and the present disclosure does not limit the specific structure of the pressing blocks 50 .

[0054] Back to Figure 2 ,like Figure 2 As shown, the pressing plate 40 is in the shape of a flat plate, and a reinforcing rib is provided at the edge of the pressing plate 40. The reinforcing rib 60 can improve the strength of the pressing plate 40. The two through holes 401 at both ends of the pressing plate 40 closest to the edge and the through hole 401 in the middle are used to install fasteners (such as bolts), and the through holes 401 at other positions of the pressing plate 40 are used to install the pressing block 50.

[0055] Apart from Figure 2 The present disclosure also provides other examples of the structure of the pressing plate 40, for example, see Figure 6 to Figure 9 .

[0056] like Figure 6As shown, the pressing plate 40 includes at least one arc-shaped sheet structure 41, each sheet structure includes a top 411 and two branches 412 extending from the top. By adding an undulating design to the pressing plate 40, the stress distribution of each part of the pressing plate 40 can be uniform. The two through holes 401 closest to the edge at both ends of the pressing plate 40 and the through hole 401 in the middle are used to install fasteners (such as bolts), and the through holes 401 at the rest of the pressing plate 40 are used to install the pressing block 50. The pressing plate 40 includes hollow portions arranged around the through holes 401 or the pressing block 50, and these hollow portions are symmetrically arranged along the through holes 401 or the pressing block 50. These hollow portions are symmetrically arranged with the center line of the first direction of the pressing plate 40 as the symmetry axis (marked as the x-axis), and are symmetrically arranged with the center line of the pressing plate 40 perpendicular to the first direction as the symmetry axis (marked as the y-axis).

[0057] The hollow portion provided on the pressure plate 40 can cause some deformation when the pressure on the electronic component 1 is particularly large, thereby absorbing the excess stress and avoiding damage to the electronic component 1 .

[0058] The hollow portion on the pressing plate 40 can be designed into various shapes, for example, Figure 7 to Figure 9 ,exist Figure 7 to Figure 9 In the figure, the multiple hollow parts on the pressure plate 40 are symmetrical in structure as a whole, and are symmetrically arranged with the center line of the first direction of the pressure plate 40 as the symmetry axis, and are symmetrically arranged with the center line of the pressure plate 40 perpendicular to the first direction as the symmetry axis. The present disclosure does not limit the shape of the hollow parts on the pressure plate 40.

[0059] It should be noted that Figure 6 to Figure 9 The structures of the pressing plate 40 shown are only some examples, and the present disclosure does not limit the structure of the pressing plate 40. Figure 6 The reinforcement structure shown is Figure 7 ~

[0060] Fig. 9 The hollowed-out portions shown are combined to form a new pressure plate 40 .

[0061] For example, in some embodiments of the present disclosure, the pressing plate 40 is made of metal or other materials with reliable performance, such as 301 stainless steel.

[0062] Fig.10 Another heat dissipation device for electronic components provided by at least one embodiment of the present disclosure is shown. Fig.10 and Figure 1 The difference is that a different pressing member 30 is used. Figure 1 Used Figure 2 The pressing member 30 shown in FIG. Fig.10 Used Figure 5 The compact shown and Figure 7The pressing plate shown is combined with a pressing member 30 .

[0063] For example, in some embodiments of the present disclosure, the heat sink 2 may include an electrical insulation sheet 10 disposed between the heat sink component 20 and the electronic component 1, which is used to separate the heat sink component 20 from the electronic component 1. The electrical insulation sheet 10 is made of an insulating material, and preferably may be an electrical insulation material with good thermal conductivity, such as a thermally conductive silicone pad and a thermally conductive filling material, to promote heat exchange between the heat sink component 20 and the electronic component 1.

[0064] Fig.10 Other components of the heat sink shown can be referred to Figure 1 The relevant description will not be repeated here.

[0065] It should be noted that other combinations of different pressing blocks and pressing plates may be used to form different pressing components for heat dissipation devices, and the present disclosure does not limit this.

[0066] In some embodiments, the fixing structure may be part of a printed circuit board.

[0067] In some embodiments, the fixing structure may be a part of the housing 7 of the electronic device, ie, the pressure plate 40 is connected to a part of the housing 7 .

[0068] In some embodiments, the fixing structure may be part of the heat dissipation component 20 , and the heat dissipation component 20 may be connected to the housing 7 of the electronic device, that is, the pressure plate 40 is connected to part of the heat dissipation component 20 and the heat dissipation component 20 is connected to the housing 7 .

[0069] The fixing structure is a part of the housing 7 of the electronic device, or the fixing structure is a part of the heat dissipation component 20 and the heat dissipation component 20 can be connected to the housing 7 of the electronic device. In both configurations, the pressure plate 40 is directly or indirectly fixed to the housing 7 of the electronic device. This is particularly advantageous when the electronic device is a vehicle-mounted electronic device, such as a vehicle-mounted AC-DC converter or a DC-AC converter or a DC-DC converter. The operation of the vehicle is often accompanied by vibrations of the vehicle-mounted electronic device, and this vibration may cause the thermal contact between the electronic component 1 and the heat dissipation component 20 to loosen, thereby weakening the heat dissipation effect. The pressure plate 40 is directly or indirectly fixed to the housing 7 of the electronic device to make the positioning of the pressure plate more secure, thereby resisting the adverse effects of vibration on thermal contact.

[0070] In some embodiments, the pressure plate 40 is fastened to a fixed structure. A substantially permanent connection (e.g., a welded connection, an adhesive, a riveted connection, etc.) or a removable connection using one or more fasteners (e.g., a screw, a bolt, a snap-fit ​​connection, etc.) may be used. Figure 1 and Fig.10As shown, the pressing plate 40 is fixed to the fixing structure by bolts 80, and is fixed by three bolts 80 at both ends and in the middle of the pressing plate 40. The fixing by bolts 80 in the middle of the pressing plate 40 is to increase the pressure on the two pressing blocks 50 in the middle. If there is no bolt 80 in the middle for fixing, the pressure on the two pressing blocks 50 in the middle of the pressing plate is small. The force applied by the pressing block 50 to the electronic component 1 can be adjusted by adjusting the bolts 80.

[0071] At least one embodiment of the present disclosure further provides an electrical converter, the electrical converter including an AC-DC converter or a DC-AC converter or a DC-DC converter, the electrical converter including the heat dissipation device 2 provided by at least one embodiment of the present disclosure.

[0072] For example, in at least one embodiment of the present disclosure, the electrical converter has a housing, and the fixing structure is a part of the housing, or the fixing structure is a part of the heat dissipation component and the heat dissipation component is connected to the housing.

[0073] At least one embodiment of the present disclosure further provides a vehicle, which includes an electrical converter provided by at least one embodiment of the present disclosure. The vehicle may be an electrified vehicle, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), a range extended EV, or a fuel cell vehicle (FCEV). The vehicle may also be a hydrogen energy vehicle.

[0074] Certain features, structures or characteristics in one or more embodiments of the present disclosure may be appropriately combined.

[0075] The above is an explanation of the present disclosure and should not be considered as a limitation thereof. Although several exemplary embodiments of the present disclosure are described, it will be readily appreciated by those skilled in the art that many modifications may be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined in the claims. It should be understood that the above is an explanation of the present disclosure and the present disclosure should not be considered to be limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the present disclosure.

Claims

1. A heat dissipation device (2) for an electronic component (1), characterized in that: The heat dissipation device (2) comprises: A heat dissipation component (20) arranged on a first side of the electronic component (1); A pressing component (30) arranged on a second side of the electronic component (1) opposite to the first side; The pressing component (30) comprises a pressing plate (40) and a pressing block (50), wherein the pressing block (50) contacts the electronic component (1) through the pressing plate (40), and the pressing plate (40) is connected to a fixed structure so as to apply a force toward the heat dissipation component (20) to the electronic component (1) through the pressing block (50).

2. The heat dissipation device (2) according to claim 1, characterized in that: The pressure plate (40) has at least one through hole (401), and the pressure block (50) includes a first component (51), the free end of which can pass through the through hole (401) and press against the first side of the pressure plate (40).

3. The heat dissipation device (2) according to claim 2, characterized in that: The pressing block (50) further comprises a second member (52) configured to have a first end (521) pressed against a second side of the pressing plate (40) opposite to the first side, and a second end (522) capable of pressing against the electronic component (1).

4. The heat dissipation device (2) according to claim 2, characterized in that: The free end of the first member (51) has a head, which is made of a deformable material and has a diameter larger than the through hole (401), so that the head can gather and deform toward the center of the head when passing through the through hole (401), and after passing through the through hole (401), it can be spread away from the center to press against the first side of the pressure plate (40).

5. The heat dissipation device (2) according to claim 4, characterized in that: The head is formed by a plurality of petals (511), and the plurality of petals (511) are configured to be symmetrical or asymmetrical.

6. The heat dissipation device (2) according to claim 1, characterized in that: The pressing plate (40) is in the shape of a flat plate, and a reinforcing rib is provided on the edge of the pressing plate (40).

7. The heat dissipation device (2) according to claim 1, characterized in that: The pressing plate (40) comprises at least one arc-shaped sheet structure (41), and each sheet structure (41) comprises a top (411) and two branch portions (412) extending from the top.

8. The heat dissipation device (2) according to claim 7, characterized in that: The pressing plate (40) comprises a hollow portion arranged around the through hole (401) or the pressing block (50), and the hollow portion is symmetrically arranged along the through hole (401) or the pressing block (50).

9. The heat dissipation device (2) according to claim 8, characterized in that: The pressing component (30) comprises a plurality of pressing blocks (50), wherein the plurality of pressing blocks (50) are distributed along a first direction and mounted on the pressing plate (40), and the hollow portion is symmetrically arranged with the center line of the pressing plate (40) in the first direction as the axis of symmetry, and is symmetrically arranged with the center line of the pressing plate (40) perpendicular to the first direction as the axis of symmetry.

10. The heat dissipation device (2) according to any one of claims 1 to 9, characterized in that: The material of the pressing block (50) includes plastic or rubber.

11. The heat dissipation device (2) according to any one of claims 1 to 9, characterized in that: The electronic component (1) is accommodated in a housing (7) and electrically connected to a printed circuit board, wherein the fixing structure is a part of the heat dissipation component (20) or a part of the housing (7) or a part of the printed circuit board, and the pressing component (30) is fastened to the fixing structure.

12. The heat dissipation device (2) according to any one of claims 1 to 9, characterized in that: The heat dissipation device (2) further comprises an electrical insulation sheet (10), wherein the electrical insulation sheet (10) is arranged between the heat dissipation component (20) and the electronic element (1).

13. The heat dissipation device (2) according to any one of claims 1 to 9, characterized in that: The electronic component (1) comprises a MOSFET.

14. An electrical converter, characterized in that: The electrical converter comprises an AC-DC converter or a DC-AC converter or a DC-DC converter, and the electrical converter comprises a heat dissipation device as claimed in any one of claims 1-13.

15. A vehicle, characterized in that: Comprising an electrical converter as claimed in claim 14.

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