HRTP-LED packaging structure and technology

Abstract

The invention relates to the technical field of chip packaging, and particularly discloses an HRTP-LED packaging structure and process, and the structure comprises a substrate, the two sides of the substrate are provided with a plurality of through holes, and the inner walls of the through holes are plated with metal layers; the bonding pad is arranged in the substrate and provided with a plurality of interfaces, and each interface is connected with the metal layer in the corresponding through hole; the L-shaped pins are evenly arranged on the two sides of the back face of the substrate, and each L-shaped pin is connected with the metal layer in the corresponding through hole; the cup body is arranged on the front surface of the substrate; according to the invention, the micron-level PCB processing precision is realized, so that the packaging of the LED with a smaller size is supported; the flat foot structure improves the bonding wire fineness and quality stability, enhances the patch thrust and eliminates the problem of yin and yang surfaces; high-density packaging is realized through metalized through hole connection, the efficiency is improved, and the cost is reduced; the wiring principle is optimized, and the signal conduction and light emitting consistency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a HRTP-LED packaging structure and process. Background Art

[0002] The manufacturing process from electronic semiconductor LED bracket to packaging is: stamping - electroplating - injection molding - cutting - die bonding - wire welding - glue dispensing - stripping - spectrometry - taping. The bracket strip (copper / iron) is electroplated after stamping, and then the PPA plastic material is injection molded into a TOP bracket, with J-type pins as the main type.

[0003] The main problem of existing LED packaging is that the pins are easily deformed when subjected to external force during processing, resulting in the J-shaped pin bending process, which will affect the airtightness of the product and further affect the reliability of the final package. Therefore, an HRTP-LED packaging structure and process are proposed. Summary of the invention

[0004] The object of the present invention is to provide a HRTP-LED packaging structure and process to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A HRTP-LED packaging structure, comprising:

[0007] A substrate, wherein a plurality of through holes are formed on both sides of the substrate, and the inner walls of the through holes are plated with a metal layer;

[0008] A pad is arranged inside the substrate and is provided with a plurality of interfaces, each of which is respectively connected to the metal layer in each through hole;

[0009] L-shaped pins are evenly arranged on both sides of the back side of the substrate, and each of the L-shaped pins is respectively connected to the inner metal layer of each through hole;

[0010] The cup body is arranged on the front side of the substrate.

[0011] Preferably, a plurality of embedding grooves are provided on the back side of the substrate, and the embedding grooves are used to fix the L-shaped pins.

[0012] Preferably, a cup body opening is provided through the middle of the cup body.

[0013] Preferably, the substrate and the cup body are both made of BT material.

[0014] Preferably, the number of the through holes, L-shaped pins and interfaces is one of four or six.

[0015] A HRTP-LED packaging process specifically includes the following steps:

[0016] S1, preparation stage: perform circuit processing on the bracket and electroplating on the bracket;

[0017] S2, pressing and forming: pressing operation is performed on BT sheet to form a stable pressing cup structure, opening through holes, and plating a metal layer in the through holes;

[0018] S3, chip packaging: fix the chip on the press-fit cup structure and connect the chip to the pins through the metal layer;

[0019] S4, cutting: perform glue protection on the packaging structure and cut the packaged LED module;

[0020] S5. Pack qualified LED products into tapes.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] This patent supports smaller LED packages by achieving um-level PCB processing accuracy; the flat-foot structure improves the fineness and quality stability of the welding wire, enhances the thrust of the patch and eliminates the problem of the positive and negative sides; the metallized through-hole connection realizes high-density packaging, improves efficiency and reduces costs; the wiring principle is optimized to improve signal conduction and light emission consistency; the straight cup / low-voltage cup design solves the problem of mixed light and color, and provides indoor and outdoor multi-scene application solutions, significantly improving the packaging technology and practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is one of the three-dimensional diagrams of the first embodiment of the present invention;

[0024] Figure 2 It is one of the exploded views of the first embodiment of the present invention;

[0025] Figure 3 This is the second exploded view of the first embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of Embodiment 1 of the present invention;

[0027] Figure 5 It is a schematic diagram of the second embodiment of the present invention;

[0028] In the figure: 1, substrate; 2, through hole; 3, cup body; 4, pad; 5, L-shaped pin; 6, embedded groove; 7, cup body opening. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Embodiment 1:

[0031] See also Figure 1-Figure 4 As shown, a HRTP-LED packaging structure includes:

[0032] A substrate 1, with a plurality of through holes 2 formed on both sides of the substrate 1, and inner walls of the through holes 2 plated with a metal layer;

[0033] The pad 4 is arranged inside the substrate 1 and is provided with a plurality of interfaces, each interface being respectively connected to the metal layer inside each through hole 2;

[0034] L-shaped pins 5 are evenly arranged on both sides of the back side of the substrate 1, and each L-shaped pin 5 is respectively connected to the inner metal layer of each through hole 2;

[0035] The cup body 3 is arranged on the front side of the substrate 1 .

[0036] In one embodiment of the present invention, a plurality of embedding grooves 6 are provided on the back side of the substrate 1 , and the embedding grooves 6 are used to fix the L-shaped pins 5 .

[0037] In one embodiment of the present invention, a cup opening 7 is formed through the middle of the cup body 3 .

[0038] In one embodiment of the present invention, the materials of the substrate 1 and the cup body 3 are both BT materials.

[0039] In one embodiment of the present invention, the number of through holes 2, L-shaped pins 5 and interfaces is six.

[0040] A HRTP-LED packaging process specifically includes the following steps:

[0041] S1, preparation stage: perform circuit processing on the bracket and electroplating on the bracket;

[0042] S2, pressing and forming: pressing the BT sheet to form a stable pressing cup structure, opening a through hole (2), and plating a metal layer in the through hole (2);

[0043] S3, chip packaging: fix the chip on the press-fit cup structure and connect the chip to the pins through the metal layer;

[0044] S4, cutting: perform glue protection on the packaging structure and cut the packaged LED module;

[0045] S5. Pack qualified LED products into tapes.

[0046] Embodiment 2:

[0047] refer to Figure 5 As shown, a HRTP-LED packaging structure includes:

[0048] A substrate 1, with a plurality of through holes 2 formed on both sides of the substrate 1, and inner walls of the through holes 2 plated with a metal layer;

[0049] The pad 4 is arranged inside the substrate 1 and is provided with a plurality of interfaces, each interface being respectively connected to the metal layer inside each through hole 2;

[0050] L-shaped pins 5 are evenly arranged on both sides of the back side of the substrate 1, and each L-shaped pin 5 is respectively connected to the inner metal layer of each through hole 2;

[0051] The cup body 3 is arranged on the front side of the substrate 1 .

[0052] In one embodiment of the present invention, a plurality of embedding grooves 6 are provided on the back side of the substrate 1 , and the embedding grooves 6 are used to fix the L-shaped pins 5 .

[0053] In one embodiment of the present invention, a cup opening 7 is formed through the middle of the cup body 3 .

[0054] In one embodiment of the present invention, the materials of the substrate 1 and the cup body 3 are both BT materials;

[0055] BT sheet, the full name of which is Bismaleimide Triazine resin sheet, is a high-performance thermosetting composite material with excellent heat resistance, mechanical strength, dimensional stability and moisture resistance. It is an ideal material in the field of electronic packaging. The low moisture absorption and low expansion coefficient of BT sheet enable it to maintain stable performance in high humidity and temperature change environments.

[0056] Due to its compact molecular structure and excellent moisture resistance, BT sheet can significantly reduce moisture absorption and release during the packaging process, thereby improving product stability and reliability;

[0057] The high density and low porosity of BT board make its packaging structure more airtight, which can effectively prevent external gas and moisture from invading the interior of the package.

[0058] In one embodiment of the present invention, the number of through holes 2, L-shaped pins 5 and interfaces is four.

[0059] As can be seen from the above, the patented flat-foot structure is more controlled in the LED package wire bonding process, with better quality and higher reliability;

[0060] The connection between the pin and the pad is realized through metallized through-holes, which can achieve a higher density packaging result and improve packaging efficiency;

[0061] The connection path between the pad and the pin is shorter, and the wiring uses the PCB wiring principle, which makes the high-frequency / high-speed signal have lower impedance, less loss, and less interference when it is transmitted in the LED, solving the technical problem of poor airtightness caused by the bending process of the existing bracket structure;

[0062] At the same time, the mounting thrust of the SMD end device is better, and the lamp will not fall off. In addition, the technical problem of the yin and yang surfaces caused by the unevenness caused by the bending of the J-shaped pin is solved;

[0063] The lamp beads are designed with two conventional / built-in IC structures for indoor and outdoor use. The normal structure is used indoors, and the stretching process structure is used outdoors for better air tightness.

[0064] The straight cup / low-pressure cup structure design solves the problem of mixed light and color in the patch module, and the display effect is better.

[0065] The specific steps of setting the through hole 2 are:

[0066] Substrate preparation: Select appropriate substrate material (such as BT board), ensure that the substrate size, thickness and flatness meet the design requirements, clean and pre-treat the substrate to remove surface dirt and oxides, and enhance the adhesion of subsequent processing.

[0067] Through-hole production: Use laser drilling, mechanical drilling or chemical etching to open a number of through-holes 2 on both sides of the substrate 1. The position, size and number of through-holes must be controlled according to design requirements; deburr the through-holes to ensure smooth hole walls and avoid defects in subsequent processing.

[0068] Inner wall cleaning: Thoroughly clean the inner wall of the through hole to remove impurities and residues generated during the processing to ensure that the inner wall is clean and free of dirt.

[0069] Metallization pretreatment: Coating a thin catalyst or seed layer on the inner wall of the through hole so that the subsequent metal plating can adhere firmly.

[0070] Metal plating: metal deposition technology is used to plate a metal layer on the inner wall of the through hole. The selection of the metal layer should meet the requirements of conductivity, corrosion resistance and good bonding with the substrate, and the thickness and uniformity of the plating should be controlled to ensure that the inner wall of the through hole is fully covered and the plating quality is stable.

[0071] Post-plating treatment: remove excess plating solution, smooth the surface of the coating, and improve the hardness and wear resistance of the coating.

[0072] Subsequent processing of substrate: After completing the through-hole metallization, other processing steps are continued on the substrate according to the design requirements, such as circuit processing, electroplating, lamination, die bonding, wire bonding, etc.

[0073] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A HRTP-LED packaging structure, characterized in that: include: A substrate (1), wherein a plurality of through holes (2) are provided on both sides of the substrate (1), and the inner walls of the through holes (2) are plated with a metal layer; A solder pad (4) is arranged inside the substrate (1) and is provided with a plurality of interfaces, each of the interfaces being respectively connected to the metal layer inside each of the through holes (2); L-shaped pins (5) are evenly arranged on both sides of the back side of the substrate (1), and each of the L-shaped pins (5) is respectively connected to the inner metal layer of each through hole (2); The cup body (3) is arranged on the front side of the base plate (1).

2. The HRTP-LED packaging structure according to claim 1, characterized in that: A plurality of embedding grooves (6) are provided on the back side of the base plate (1), and the embedding grooves (6) are used to fix the L-shaped pins (5).

3. The HRTP-LED packaging structure according to claim 1, characterized in that: A cup body opening (7) is provided through the middle of the cup body (3).

4. The HRTP-LED packaging structure according to claim 1, characterized in that: The materials of the substrate (1) and the cup body (3) are both BT materials.

5. The HRTP-LED packaging structure according to claim 1, characterized in that: The number of the through holes (2), the L-shaped pins (5) and the interfaces is one of four and six.

6. A HRTP-LED packaging process, characterized in that: The specific steps include: S1, preparation stage: perform circuit processing on the bracket and electroplating on the bracket; S2, pressing and forming: pressing the BT sheet to form a stable pressing cup structure, opening a through hole (2), and plating a metal layer in the through hole (2); S3, chip packaging: fix the chip on the press-fit cup structure and connect the chip to the pins through the metal layer; S4, cutting: perform glue protection on the packaging structure and cut the packaged LED module; S5. Pack qualified LED products into tapes.

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