Ice micro-needle manufacturing device based on semiconductor refrigeration sheet

Abstract

The application discloses a kind of ice microneedle manufacturing devices based on semiconductor refrigeration sheet, belong to ice microneedle technical field, ice microneedle manufacturing device is sequentially arranged in the thermoelectric refrigeration module above microneedle mould, copper sheet radiator and water-cooling heat sink module, the lower portion of water-cooling heat sink module is equipped with water tank, the copper sheet radiator is inserted into the inside of the water tank, and it extends towards the top of the water tank, the semiconductor refrigeration sheet of the thermoelectric refrigeration module is directly connected with the copper sheet radiator.The application uses the above-mentioned ice microneedle manufacturing device based on semiconductor refrigeration sheet, overcomes the difficulty of preparing ice microneedle under harsh conditions, can more conveniently and effectively prepare ice microneedle, and has considerable application prospect.

Description

Technical Field

[0001] This invention relates to the field of ice microneedle technology, and in particular to an ice microneedle manufacturing apparatus based on a semiconductor cooling chip. Background Technology

[0002] Microneedle patches, as a novel nanoscale medical device, offer advantages such as being painless, minimally invasive, and highly effective. They can enhance the skin's permeability to drugs, especially large molecule drugs, and also enable controlled drug release. Microneedle patches consist of multiple tiny needles distributed on a substrate, with the length of the microneedles typically ranging from 25 to 2000 μm.

[0003] Microneedles enable painless drug delivery through minimally invasive procedures, reducing tissue damage, allowing for precise targeted drug delivery, and reducing drug dosage. As a novel alternative drug delivery method, microneedles have broad prospects in the medical field. Microneedles can be classified into solid microneedles, coated microneedles, hollow microneedles, soluble microneedles, and hydrogel microneedles. Common solid microneedles include metal microneedles and cryo-microneedles; however, traditional cryo-microneedles require harsh conditions such as -80°C freezers or liquid nitrogen for preparation, making them difficult to handle. Summary of the Invention

[0004] The purpose of this invention is to provide an ice microneedle manufacturing device based on a semiconductor refrigeration chip, which overcomes the difficulty of preparing ice microneedles under harsh conditions, and can conveniently and efficiently prepare ice microneedles, with considerable application prospects.

[0005] To achieve the above objectives, the present invention provides an ice microneedle manufacturing apparatus based on a semiconductor refrigeration chip, comprising a thermoelectric refrigeration module, a copper heat sink, and a water-cooling heat dissipation module arranged sequentially above a microneedle mold. A water tank is provided below the water-cooling heat dissipation module, and the copper heat sink extends into the water tank and extends toward the top of the water tank. The semiconductor refrigeration chip of the thermoelectric refrigeration module is directly connected to the copper heat sink.

[0006] Preferably, the water-cooled heat dissipation module further includes a water pump and a water-cooling plate, wherein the water pump is electrically connected to a first DC power supply.

[0007] Preferably, the water tank, the water pump, and the water-cooled plate are all connected by water pipes, and the pipes inside the water-cooled plate have a serpentine structure with interfaces at both ends for connection to the water pipes.

[0008] Preferably, the water tank has an opening at the top and a side plate located below the water pump or the water-cooling plate. The side plate is connected to the water pump or the water-cooling plate via an embedded fixing bracket.

[0009] Preferably, the fixed supports are respectively arranged on both sides above the side plate.

[0010] Preferably, the copper sheet radiator is in the shape of a sheet, and a uniformly distributed rack structure is arranged above the sheet.

[0011] Preferably, the semiconductor refrigeration sheet is electrically connected with the second direct current power supply.

[0012] Preferably, a heat-conducting copper sheet is arranged below the semiconductor refrigeration sheet, and the heat-conducting copper sheet and the outer side of the semiconductor refrigeration sheet are both covered by heat-conducting silicone grease.

[0013] Preferably, the thermoelectric refrigeration module further comprises a heat-conducting copper rod, the heat-conducting copper rod is connected with the heat-conducting copper sheet after penetrating through the heat-conducting silicone grease, and the heat-conducting copper rod is connected with the microneedle mold.

[0014] Preferably, the water tank and the heat-conducting copper sheet are both connected with a temperature tester, and the temperature tester is used to detect the temperature of water in the water tank and the temperature of the surface of the heat-conducting copper sheet.

[0015] Therefore, the ice microneedle manufacturing device based on the semiconductor refrigeration sheet has the following technical effects:

[0016] (1) The semiconductor refrigeration sheet is used for heat transfer, and the preparation of ice microneedles can be completed without harsh conditions such as-80℃ refrigerators or liquid nitrogen, which provides a more convenient preparation channel and preparation device for most people who need to use ice microneedles, and ensures safety, convenience and green environmental protection;

[0017] (2) Compared with fan cooling, the water-cooled heat dissipation module reduces the temperature of the equipment through water flow circulation, avoids local overheating, ensures that the temperature of each part of the equipment is more uniform, and provides a larger heat exchange area, further improving the heat dissipation efficiency;

[0018] (3) The heat-conducting silicone grease is coated between the contact surfaces of the copper sheet radiator and the semiconductor refrigeration sheet, between the semiconductor refrigeration sheet and the heat-conducting copper sheet, and between the contact surfaces of the heat-conducting copper sheet and the heat-conducting copper rod, the heat-conducting silicone grease acts as a heat transfer medium, and can prevent moisture, dust, corrosion and shock.

[0019] The technical solutions of the present application will be further described in detail below with the aid of drawings and examples. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a device schematic diagram of an ice microneedle manufacturing device based on a semiconductor refrigeration sheet according to an embodiment of the present application;

[0021] Figure 2 is a water-cooled heat dissipation module schematic diagram of an ice microneedle manufacturing device based on a semiconductor refrigeration sheet according to an embodiment of the present application;

[0022] Figure 3 is a copper sheet radiator and thermoelectric refrigeration module schematic diagram of a semiconductor refrigeration sheet-based ice microneedle manufacturing device embodiment of the present application.

[0023] Reference signs

[0024] 1, microneedle mold; 2, heat-conducting copper bar; 3, heat-conducting copper sheet; 4, heat-conducting silicone grease; 5, semiconductor refrigeration sheet; 6, copper sheet radiator; 7, water tank; 8, water pipe; 9, water pump; 10, water-cooled plate; 11, fixed support; 12, temperature tester; 13, first DC power supply; 14, second DC power supply. DETAILED DESCRIPTION

[0025] The technical solutions of the present application are further described below through the accompanying drawings and embodiments.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the present application shall be understood as the usual meanings understood by those skilled in the art to which the present application belongs. The terms "first", "second", and similar words used in the present application do not represent any order, number, or importance, but are only used to distinguish different components. The terms "include" or "contain" and similar words mean that the elements or objects appearing before the words cover the elements or objects listed after the words and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "up", "down", "left", "right", and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships may also change accordingly.

[0027] Example 1

[0028] As shown in Figure 1 , a semiconductor refrigeration sheet-based ice microneedle manufacturing device is provided with a thermoelectric refrigeration module, a copper sheet radiator 6, and a water-cooled heat dissipation module in sequence above a microneedle mold 1. After the device is started, the thermoelectric refrigeration module generates low temperature through the Peltier effect and conducts the low temperature to the microneedle mold 1, so that the liquid in the mold freezes into ice microneedles. The heat generated by the thermoelectric refrigeration module during the refrigeration process is absorbed by the copper sheet radiator 6 and transferred to the water-cooled heat dissipation module. The water-cooled heat dissipation module ensures a continuous heat dissipation effect through water flow circulation.

[0029] As shown in Figure 2As shown, the lower part of the water-cooled heat dissipation module is provided with a water tank 7, and the material for assembling the water tank 7 is an acrylic plate. The acrylic plate has excellent transparent insulation performance, light weight, half lighter than ordinary glass, and small load bearing. At the same time, it is not easy to produce moss under the direct contact with water working condition, and it is convenient to observe the water flow rate from the outside and has good heat dissipation effect. The copper sheet radiator 6 extends into the water tank 7 and extends towards the top of the water tank 7. The copper sheet radiator 6 is in the form of a sheet, and a uniformly distributed rack structure is provided on the top of the copper sheet radiator 6, which ensures that the water flow can almost completely pass through the cooling fins, so that the cooling effect is more remarkable.

[0030] The water-cooled heat dissipation module further comprises a water pump 9 and a water-cooled plate 10. The flow rate of the water pump 9 is 2L / min, which belongs to a small water pump 9. The water pump 9 is electrically connected with the first direct current power supply 13, and is used to drive the water pump 9 to pump water out of the water tank 7, so as to more effectively ensure that the water in the water tank 7 is always in a flowing state, thereby reducing the temperature around the copper sheet radiator 6 and better ensuring the heat dissipation effect. The water-cooled plate 10 is a common heat dissipation device, which has higher heat dissipation efficiency and lower noise level compared with the traditional air-cooled radiator. The water-cooled plate 10 is made of heat-conducting material, including copper or aluminum, which can quickly transfer heat from the device to the water flow, keeping the operating temperature of the device within a lower range. The pipes inside the water-cooled plate 10 are in a serpentine structure, which increases the flow path and residence time of water in the water-cooled plate 10, thereby improving the heat dissipation efficiency. The water-cooled plate 10 is provided with an interface connected with the water pipe 8 at both ends. The water tank 7, the water pump 9 and the water-cooled plate 10 are connected through the water pipe 8, forming a closed water circulation system, which ensures uniform distribution of water temperature inside the device.

[0031] The water tank 7 is provided with an opening at the top, which is used to maintain the balance of atmospheric pressure inside the water tank 7, and also facilitates subsequent measurement of water temperature. The water tank 7 is further provided with a side plate below the water pump 9 or the water-cooled plate 10. The side plate is connected with the water pump 9 or the water-cooled plate 10 through the embedded fixed support 11, which strengthens the cooperation between the support and the side plate, so that the side plate will not shake due to the vibration of the water pump 9. The fixed support 11 is arranged on both sides of the top of the side plate, and has a triangular structure, which has the functions of stability, non-shaking and better support.

[0032] As shown in the drawings, Figure 3As shown, the semiconductor refrigeration sheet 5 of the thermoelectric refrigeration module is directly connected with the copper sheet radiator 6, so that the heat generated by the semiconductor refrigeration sheet 5 is transmitted through the copper sheet radiator 6, so that the temperature difference that can be generated by the semiconductor refrigeration sheet 5 is larger, and therefore the temperature of the ice microneedle prepared is lower and the effect is better. Since the semiconductor refrigeration sheet 5 does not require any refrigerant, it can work continuously, has no pollution source and no rotating parts, and will not produce a rotary effect. At the same time, the semiconductor refrigeration sheet 5 is a current conversion type sheet, and the semiconductor refrigeration sheet 5 is electrically connected with the second direct current power supply 14, and through the control of input current, high-precision temperature control can be realized, and in addition to temperature detection and control means, remote control, program control and computer control can be realized, which is convenient for forming an automatic control system. In addition, the thermal inertia of the semiconductor refrigeration sheet 5 is very small, and the refrigeration and heating time is very fast. In the case that the heat is well dissipated at the hot end and the cold end is empty, the power is turned on for less than one minute, and the refrigeration sheet can reach the maximum temperature difference.

[0033] The lower side of the semiconductor refrigeration sheet 5 is provided with a heat-conducting copper sheet 3, and the heat-conducting silicone grease 4 is a high-thermal-conductivity insulating organic silicone material that almost never solidifies and can maintain the grease state during use for a long time at a temperature of-50°C to 230°C. The outer side of the heat-conducting copper sheet 3 and the semiconductor refrigeration sheet 5 is covered by the heat-conducting silicone grease 4, which can ensure that most of the heat on the semiconductor refrigeration sheet 5 is transmitted to the heat-conducting copper sheet 3.

[0034] The ice microneedle manufacturing device further comprises a heat-conducting copper rod 2, which is connected with the heat-conducting copper sheet 3 after penetrating the heat-conducting silicone grease 4, so that the heat transmitted from the semiconductor refrigeration sheet 5 to the heat-conducting copper sheet 3 can be further transmitted to the copper rod. The heat-conducting copper rod 2 is connected with the microneedle mold 1, so that the heat is finally transmitted to the solution in the microneedle mold 1, and the microneedle mold 1 provides an environment required for preparing ice microneedles.

[0035] The water tank 7 and the heat-conducting copper sheet 3 are connected with the temperature tester 12, and the temperature tester 12 is used to detect the temperature of the water in the water tank 7 and the temperature of the surface of the heat-conducting copper sheet 3.

[0036] Working principle: first, after the water tank 7 is assembled, the water pump 9 and the water cooling plate 10 are fixed on the fixed support 11 above the water tank 7, the water pipe 8 between the water tank 7, the water pump 9 and the water cooling plate 10 is connected, and then the triangular fixed support 11 of the side plate is fixed, so as to fix the whole water tank 7. Secondly, the thermal conductive silicone grease 4 is smeared on the contact surface of the semiconductor refrigeration sheet 5 and the copper sheet radiator 6, and when pasting, the semiconductor refrigeration sheet 5 is rotated clockwise for several turns, and then counterclockwise for several turns, so as to ensure the uniformity of the thermal conductive silicone grease 4 on the contact surface and the good contact of the copper sheet radiator 6 and the semiconductor refrigeration sheet 5. A thick layer of thermal conductive silicone grease 4 is also smeared around the thermal conductive copper sheet 3, leaving a corresponding size of the cross-sectional area of the thermal conductive copper bar 2 in the middle, and then a thin layer of thermal conductive silicone grease 4 is smeared. Then, the water pump 9 is connected to the first direct current power supply 13, the voltage is adjusted to 12V, and the current is adjusted to 3.6A, the semiconductor refrigeration sheet 5 is connected to the second direct current power supply 14, the voltage is adjusted to 12V, and the current is adjusted to 5A. Finally, the prepared solution is contacted with the thermal conductive copper sheet 3 by the thermal conductive copper bar 2, and the switches of the first direct current power supply 13 and the second direct current power supply 14 are pressed, and ice microneedles can be prepared in about 15 min. The prepared ice microneedles are observed under a microscope, and it can be found that the ice microneedles are all melted in about 3 min, which can be better applied in the fields of future medical treatment or beauty and the like.

[0037] Therefore, the ice microneedle manufacturing device based on the semiconductor refrigeration sheet can overcome the difficulty of preparing ice microneedles under harsh conditions, and can more conveniently and effectively prepare ice microneedles, which has considerable application prospect.

[0038] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application but not to limit them, although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present application.

Claims

1. A semiconductor refrigeration sheet-based ice microneedle manufacturing device, characterized by: A thermoelectric refrigeration module, a copper sheet radiator and a water-cooled heat dissipation module are sequentially arranged above the microneedle mold, a water tank is arranged below the water-cooled heat dissipation module, the copper sheet radiator extends into the water tank and extends towards the top of the water tank, and the semiconductor refrigeration sheet of the thermoelectric refrigeration module is directly connected with the copper sheet radiator; The water-cooled heat dissipation module further comprises a water pump and a water-cooled plate, and the water pump is electrically connected with the first direct current power supply; The water tank, the water pump and the water-cooled plate are connected through water pipes, the pipeline in the water-cooled plate is in a serpentine structure, and both ends of the pipeline are provided with interfaces connected with the water pipes; The copper sheet radiator is in a sheet shape, and a uniformly distributed rack structure is arranged above the copper sheet radiator; A heat-conducting copper sheet is arranged below the semiconductor refrigeration sheet, and the heat-conducting copper sheet and the semiconductor refrigeration sheet are both coated with heat-conducting silicone grease. 2.The semiconductor refrigeration sheet-based ice micro-needle manufacturing device according to claim 1, wherein: The water tank is provided with an opening at the top, and a side plate is arranged below the water pump or the water-cooled plate, and the side plate is connected with the water pump or the water-cooled plate through an embedded fixing support. 3.The semiconductor refrigeration sheet-based ice micro-needle manufacturing device according to claim 2, characterized in that: The fixing support is arranged on both sides of the side plate. 4.The semiconductor refrigeration sheet-based ice micro-needle manufacturing device according to claim 1, wherein: The semiconductor refrigeration sheet is electrically connected with a second direct current power supply.

5. The semiconductor refrigeration sheet-based ice microneedle manufacturing device according to claim 1, characterized by: The thermoelectric refrigeration module further comprises a heat-conducting copper rod, the heat-conducting copper rod is connected with the heat-conducting copper sheet after penetrating through the heat-conducting silicone grease, and the heat-conducting copper rod is connected with the microneedle mold.

6. The semiconductor refrigeration sheet-based ice microneedle manufacturing device according to claim 1, characterized by: The water tank and the heat-conducting copper sheet are connected with a temperature tester, and the temperature tester is used for detecting the water temperature in the water tank and the temperature on the surface of the heat-conducting copper sheet.

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