Control method for light of curing lamp

Abstract

The invention relates to the technical field of curing lamp light control, and discloses a curing lamp light control method, which comprises the following steps: executing an adhesive curing time recording experiment, and recording the curing time when an adhesive is irradiated by a curing lamp at different curing distances; when the curing lamp irradiates the to-be-cured chip, executing a judgment region judgment strategy, and obtaining a judgment region; executing a centralized curing prediction strategy, using a curing lamp to irradiate two side edges of the judgment area at the same time, recording the curing completion duration of the adhesive on the two side edges, and recording the duration as a first curing duration; executing a dispersion curing prediction strategy, sequentially irradiating two side edges of the judgment area by using a curing lamp, and recording the total time length of curing completion of the adhesive on the two side edges as a second curing time length; the first curing duration is compared with the second curing duration, the curing strategy corresponding to the minimum curing duration is selected, the judgment area is cured, the curing time is saved, and the curing efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of curing lamp light control, and in particular to a curing lamp light control method. Background Art

[0002] The technology of curing chip pins with adhesive and then curing them with a curing lamp is mainly used in the field of electronic packaging and assembly. In the production process, adhesives are usually used for bonding to ensure a good connection between the chip pins and the circuit board. The adhesive is usually a photosensitive or heat-sensitive material. After being applied to the surface of the chip pins, it is irradiated with a curing lamp, using ultraviolet rays or other light sources of a specific spectrum to cross-link and cure the adhesive, thereby improving the bonding strength and reliability. The advantage of the curing process is that the curing lamp can quickly and evenly activate the adhesive, so that it can reach the required curing strength in a short time, avoiding the long waiting time in the traditional thermal curing process. This method has the advantages of fast curing speed, controllable process and low heat load on the chip itself. It is widely used in the manufacture of precision electronic components such as semiconductors and sensors.

[0003] In the existing chip production process, when space is limited, a point light curing lamp is often used to irradiate the glue layer of the pins, especially in chips with multiple pins and tiny sizes, to avoid waste and cross-curing. However, when the distance between the two chips is sufficient to use a point light curing lamp to cure the two chips at the same time, and the curing time is less than curing the two chips in two times, if the two chips are cured in two times, it will waste time and increase the moving path of the curing lamp, thereby reducing efficiency.

[0004] Therefore, this solution proposes a control method for curing lamp light, and seeks a method for saving time and reducing path balance when there is only one point light source curing lamp to cure the glue layer of the pin. Summary of the invention

[0005] The present invention provides a method for controlling light of a curing lamp, which is used to facilitate solving the problems mentioned in the above background technology.

[0006] The present invention provides the following technical solution: a method for controlling the light of a curing lamp, comprising: The thickness of the adhesive applied on the circuit board is recorded as the coating thickness; The distance from the adhesive when the curing light is irradiated to the adhesive is recorded as the curing distance, where the curing distance is in the interval of [minimum curing distance, maximum curing distance]; The time from the start of curing the adhesive to the completion of curing by the curing light is recorded as the curing time; Get all coating thicknesses; Adhesive for each coating thickness; Perform an adhesive curing time recording experiment to record the curing time of the adhesive when the curing lamp is used to irradiate the adhesive at different curing distances; Obtain the curing time of adhesives of all coating thicknesses at different curing distances to obtain a thickness-distance-time model; The chip where the pins coated with adhesive are located on the circuit board is recorded as a chip to be cured, the shape of the chip to be cured mapped on the circuit board is a rectangle, and the rectangle is recorded as a target rectangle; The adhesive coating thickness is the same at all pins on a chip to be cured; The light spot formed on the circuit board when the curing light irradiates the circuit board is recorded as a curing light spot, wherein the shape of the curing light spot is rectangular, and the area of ​​the curing light spot increases with the increase of the curing distance; When the curing lamp irradiates the chip to be cured at the highest curing distance, the judgment area judgment strategy is executed to determine whether the curing light spot contains two sides of the target rectangle at the same time and the two sides are parallel to each other; If the sides of two target rectangles are included at the same time, the area between the two target rectangle sides is recorded as the determination area, and the shape of the determination area is a rectangle; Get all the judgment areas on the circuit board; For any judgment area; Execute the centralized curing prediction strategy, use the curing light to illuminate the two sides of the determination area at the same time, and record the time it takes for the adhesive on the two sides to be cured, which is recorded as the first curing time; Execute the distributed curing prediction strategy, use the curing light to illuminate the two sides of the determination area in turn, and record the total time for the adhesive curing on the two sides to complete, which is recorded as the second curing time; The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured.

[0007] Optionally, the performing of the adhesive curing time recording experiment, recording the curing time when the adhesive is irradiated with a curing lamp at different curing distances, includes: Obtaining a minimum curing distance, where the minimum curing distance is the minimum curing distance when curing the adhesive; Obtaining a maximum curing distance, wherein the maximum curing distance is a maximum curing distance when curing the adhesive; Setting a test distance interval, wherein the test distance interval is an increase in the curing distance; Calculate (highest curing distance - lowest curing distance) / test distance interval + 1, and record the result as the test quantity a; Calculate the minimum curing distance + test distance interval, and record the result as the first curing distance; Calculate the minimum curing distance + test distance interval × 2, and record the result as the second curing distance... Calculate the minimum curing distance + test distance interval × (a-1), and record the result as the maximum curing distance; Use the curing lamp to cure the adhesive at the lowest curing distance, the first curing distance, and the highest curing distance in sequence, and record the curing time of the adhesive at each curing distance.

[0008] Optionally, when the curing lamp irradiates the chip to be cured at the highest curing distance, executing the determination area determination strategy to determine whether the curing light spot simultaneously contains two sides of the target rectangle and the two sides are parallel to each other includes: Get all target rectangles; Select each target rectangle in turn, and record the selected target rectangle as the execution rectangle; Any side of the execution rectangle is recorded as the execution side; The determination area determination strategy is executed on the execution side, specifically: Draw a line segment that coincides with the execution side, recorded as the coincident line segment; Obtain the length of the curing spot corresponding to the highest curing distance, and record it as the first length; The coincident line segments are gradually moved away from the execution side edge to the execution rectangle in a direction perpendicular to the execution side edge on the plane where the circuit board is located, and the maximum distance away is a first length; When the coincident line segment moves away from the execution rectangle, the target rectangle where the side of the target rectangle that coincides with the coincident line segment is located is recorded as the determination rectangle; For any judgment rectangle; Get the side that coincides with the coincident line segment for the first time, and record it as the determined side; Obtain a line segment on the determined side that coincides with the coincident line segment, and record it as the second coincident line segment; Projecting the second coincident line segment onto the execution side edge in a direction perpendicular to the execution side edge, and recording the line segment on the execution side edge where the second coincident line segment is projected as the first coincident line segment; Draw two parallel line segments, which are called the first parallel line segment and the second parallel line segment; Connect the two endpoints of the first coincident line segment and the second coincident line segment with the first parallel line segment; Connect the two endpoints of the first coincident line segment and the second coincident line segment with a second parallel line segment; A rectangular area formed by the first parallel line segment, the second parallel line segment, the first coincident line segment, and the second coincident line segment is recorded as a determination area.

[0009] Optionally, the centralized curing prediction strategy is executed to simultaneously illuminate two sides of the determination area with a curing light, including: Measure the length of the first parallel line segment in the determination area and record it as the second length; Recording the curing light spot whose length is equal to the second length as the first test light spot; On the circuit board, any direction parallel to the first coincident line segment is recorded as a curing direction; Using the first test light spot to divide the determination area into a plurality of rectangles along the curing direction, and recording the divided rectangles as positioning rectangles; Get the number of positioning rectangles, recorded as the first number.

[0010] Optionally, the centralized curing prediction strategy is executed to simultaneously illuminate two sides of the determination area with a curing light, including: Obtain the chip corresponding to the first coincident line segment in the determination area, recorded as the first chip; Obtain the chip corresponding to the second coincident line segment in the determination area, recorded as the second chip; Measuring the coating thickness of the adhesive at the pins on the first chip, recorded as a first thickness; measuring the coating thickness of the adhesive at the pins on the second chip, and recording it as the second thickness; Obtaining a curing distance at which a curing lamp irradiates a circuit board to form a first test light spot, recorded as a first test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the first test distance is obtained, which is recorded as the first time; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the first test distance is obtained, which is recorded as the second time; Compare the size relationship between the first duration and the second duration; If the first duration ≧ the second duration; The first curing time is equal to the first time × the first quantity; If the first duration < the second duration; The first curing time is equal to the second time×the first quantity.

[0011] Optionally, the step of executing the decentralized curing prediction strategy and sequentially irradiating two sides of the determination area with a curing light includes: Obtaining a width of the adhesive surrounding the first chip mapped on the circuit board, recorded as a first width; Obtaining a width of the adhesive surrounding the second chip mapped on the circuit board, recorded as a second width; Calculate the second length - the first width - the second width, and record the result as the third width; Set the number of partitions b for executing the decentralized solidification prediction strategy; Divide the third width into the divided number of width intervals; The first width, the first width + the width interval, ... the first width + the width interval × b are selected in sequence as the third length, and a curing experiment is performed on the first coincident line segment, specifically: Recording the curing light spot whose length is equal to the third length as the second test light spot; Obtaining a value of the width of the second test light spot, recorded as the first division length; Divide the first coincident line segment by a first division length to obtain a plurality of first test line segments; Obtain the number of the first test line segments, recorded as the second number; Obtaining a curing distance at which the curing lamp irradiates the circuit board to form a second test light spot, recorded as a second test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the second test distance is obtained, which is recorded as the third time; Calculate the third time duration × the second quantity, and use the result as the total time duration for curing the adhesive on the first coincident line segment, recorded as the first dispersion time duration; Obtain a first dispersed duration of each third length, compare all first dispersed durations, obtain a minimum first dispersed duration, and record it as a first target duration.

[0012] Optionally, the step of executing the decentralized curing prediction strategy and sequentially irradiating two sides of the determination area with a curing light includes: The second width, the second width + the width interval, ... the second width + the width interval × b are selected in sequence as the fourth length, and a curing experiment is performed on the second coincident line segment, specifically: Recording the curing light spot whose length is equal to the fourth length as the third test light spot; Obtaining a value of the width of the third test light spot, recorded as the second division length; Divide the second coincident line segment by a second division length to obtain a plurality of second test line segments; Obtain the number of the second test line segments, recorded as the third number; Obtain a curing distance at which the curing lamp irradiates the circuit board to form a third test light spot, recorded as a third test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the third test distance is obtained, which is recorded as the fourth time; Calculate the fourth time duration × the third quantity, and use the result as the total time duration for curing the adhesive on the second coincident line segment, recorded as the second dispersion time duration; Obtain a second dispersed duration of each fourth length, compare all the second dispersed durations, obtain a minimum second dispersed duration, and record it as a second target duration; The first target duration and the second target duration are obtained, and the sum is calculated and used as the second solidification duration.

[0013] Optionally, comparing the first curing time with the second curing time, selecting a curing strategy corresponding to the minimum curing time, and curing the determined area includes: When the first curing time is ≦ the second curing time; Obtaining a first test light spot corresponding to a first curing time; When the curing light illuminates the determination area, the curing light spot of the curing light is adjusted to be the first test light spot, and the first test light spot is aligned with each positioning rectangle in turn; Wherein, when the first duration ≧ the second duration, the first duration is illuminated in each positioning rectangle; When the first duration is less than the second duration, the second duration is illuminated in each positioning rectangle.

[0014] Optionally, comparing the first curing time with the second curing time, selecting a curing strategy corresponding to the minimum curing time, and curing the determined area includes: When the first curing time> the second curing time; When the curing light illuminates the pins on the first coincident line segment of the determination area; Obtaining a second test light spot corresponding to a second curing time; Obtain all first test line segments on the first coincident line segment; Adjusting the curing light spot of the curing lamp to be a second test light spot, aligning the width of the formed second test light spot to each first test line segment in turn, and irradiating each first test line segment for a third time; When the curing light illuminates the pins on the second coincident line segment of the determination area; Obtaining a third test light spot corresponding to the second curing time; Obtain all second test line segments on the second coincident line segment; The curing light spot of the curing lamp is adjusted to be a third test light spot, the width of the formed third test light spot is aligned with each second test line segment in turn, and each second test line segment is irradiated for a fourth time period.

[0015] The present invention has the following beneficial effects: 1. The control method for the light of a curing lamp ensures that the curing effect of the curing lamp is within the required curing effect by setting the minimum curing distance and the maximum curing distance while allowing the curing distance to change within a range. Each curing distance corresponds to a curing light spot, thereby obtaining a plurality of curing light spots of different lengths and widths, so as to facilitate finding a curing light spot with the shortest curing determination area time among the plurality of curing light spots, thereby determining the most efficient way to use a point light source curing lamp to cure the adhesive, thereby improving production efficiency.

[0016] 2. The control method for curing lamp light obtains a thickness-distance-time model by performing an adhesive curing time recording experiment, and establishes a corresponding relationship between thickness and distance as dual variables and time as a dependent variable, so as to facilitate the subsequent acquisition of curing time when the coating thickness and curing distance are known; through the size relationship of the curing time, the most time-saving curing method is determined to improve the curing efficiency; the existence of the thickness-distance-time model provides quantitative support for decision-making, making the decision more convincing.

[0017] 3. The control method for the light of a curing lamp sets a test distance interval as the increase in the curing distance each time, thereby obtaining multiple curing distances. The multiple curing distances are used as experimental conditions for performing an adhesive curing time recording experiment. Multiple curing times can be obtained for an adhesive with a coating thickness. When the test distance interval is large, the curing distance for performing the recording experiment is reduced, saving measurement time; when the test distance interval is small, the curing distance for performing the recording experiment is increased. The more the amount of recorded time data, the more refined the overall thickness distance time model is, providing an accurate data source for operators who need a refined model and improving production efficiency.

[0018] 4. The control method for the curing lamp light determines whether there are two target rectangles on the circuit board that can be cured at the same time and correspond to the chips to be cured by executing the judgment area judgment strategy. Specifically, when the curing distance is set to the highest curing distance to irradiate the circuit board, the curing spot is the largest and the area that can be covered is the largest. If the curing spot can simultaneously contain the parallel sides of the two target rectangles, it is determined that the two target rectangles can be cured at the same time. Since the chip is exposed to the curing light, the program will be erased. Ultraviolet light will destroy the internal charge distribution, causing the stored charge to be released, the data to be cleared, and the deletion effect will occur. Therefore, in order to avoid irradiating the chip surface during the irradiation process, when selecting the side of the judgment rectangle, the side that overlaps with the overlapped line segment for the first time is selected to avoid the curing light irradiating the chip surface, reduce the risk of hidden dangers in the curing process, and improve the product qualification rate.

[0019] 5. The control method for the light of the curing lamp, when executing the centralized curing strategy, uses the curing lamp to irradiate the adhesive on the first coincident line segment and the second coincident line segment at the same time, and should try to avoid irradiating the chip surface, so the length of the curing light spot is equal to the second length, the first test light spot is determined according to the second length, and the first test light spot is used to divide the judgment area into a plurality of positioning rectangles along the curing direction. The number of positioning rectangles is the number of times the judgment area needs to be irradiated. Since two thicknesses of adhesive are irradiated at the same time, the adhesive with the longest curing time must be used as the standard, and the relationship between the first time length and the second time length is compared. The longest time length is used as the time length of a single curing, and the total time length of the centralized curing is the time length of the unit curing multiplied by the number of curing times. Compared with dispersed curing, centralized curing can reduce the time of secondary curing. If the time of centralized curing is less than that of dispersed curing, then the effect of saving time and labor is achieved, and production efficiency is improved.

[0020] 6. The control method for the curing lamp light, when dispersing and curing the circuit board, since the adhesive has a width, and when curing one chip, the curing light should be prevented from irradiating the adhesive on other chips. Since there is a gap between the adhesives on adjacent chips, the length of the gap can be used to adjust the length of the curing spot. When the curing spot is larger, the fewer the number of curing times, the longer the time required for a single curing. When the curing spot is smaller, the more the number of curing times, the shorter the time required for a single curing. However, the total curing time is the number of curing times the time for a single curing. Therefore, in the total curing time of multiple curing spots, the shortest curing time is selected, which has the highest efficiency, as the total curing time for dispersing curing, and the second curing time is obtained. The curing spot with adjustable size is obtained by the test model, and the curing spot with the shortest curing time is selected in each curing spot tested, thereby reducing the curing time and improving production efficiency.

[0021] 7. In the control method for the light of a curing lamp, when the first curing time is less than or equal to the second curing time, the first test light spot corresponding to the first curing time is the same size as the positioning rectangle that divides the judgment area, the first test light spot is aligned with the positioning rectangle, and the adhesive on both sides of the judgment area can be cured. The curing time of the thickest adhesive is selected as the single curing time in the single curing time, ensuring that the adhesive on both sides of the judgment area can be cured in one curing, which not only reduces the curing time but also avoids passing through the judgment area twice, thereby improving production efficiency.

[0022] 8. The control method for the curing lamp light, when the first curing time is greater than or equal to the second curing time, the second test light spot is used to irradiate the adhesive on the first coincident line segment during dispersed curing, and the third test light spot is used to irradiate the adhesive on the second coincident line segment. In order to avoid irradiating the chip, the width of the second test light spot is aligned with the first test line segment, and the width of the third test light spot is aligned with the second test line segment, and then the required curing time is irradiated respectively to achieve the purpose of dispersed curing. The effect of dispersed curing is strong adjustability, flexible control, and convenient curing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the determination area of ​​the present invention.

[0024] Figure 2 It is a schematic diagram of the positioning rectangle during centralized solidification of the present invention.

[0025] Figure 3 It is a schematic diagram of the first test line segment during dispersion and curing of the present invention.

[0026] Figure 4 It is a schematic diagram of the second test line segment during dispersion curing of the present invention. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Embodiment 1, a method for controlling light of a curing lamp, comprising: The thickness of the adhesive applied on the circuit board is recorded as the coating thickness; The distance from the adhesive when the curing light is irradiated to the adhesive is recorded as the curing distance, where the curing distance is in the interval of [minimum curing distance, maximum curing distance]; By setting the minimum curing distance and the maximum curing distance, the curing effect of the curing lamp is guaranteed to be within the required curing effect while allowing the curing distance to change within the range. Each curing distance corresponds to a curing light spot, thereby obtaining multiple curing light spots of different lengths and widths. This facilitates finding a curing light spot with the shortest curing judgment area time among multiple curing light spots, thereby determining the most efficient way to use a point light source curing lamp to cure the adhesive, thereby improving production efficiency.

[0029] The time from the start of curing the adhesive to the completion of curing by the curing light is recorded as the curing time; Get all coating thicknesses; Adhesive for each coating thickness; Perform an adhesive curing time recording experiment to record the curing time of the adhesive when the curing lamp is used to irradiate the adhesive at different curing distances; Obtain the curing time of adhesives of all coating thicknesses at different curing distances to obtain a thickness-distance-time model; By performing an adhesive curing time recording experiment, a thickness-distance-time model was obtained, and a corresponding relationship between thickness and distance as dual variables and time as the dependent variable was established, which facilitates the subsequent acquisition of curing time when the coating thickness and curing distance are known; through the size relationship of the curing time, the most time-saving curing method is determined to improve the efficiency of curing; the existence of the thickness-distance-time model provides quantitative support for decision-making, making the decision more convincing.

[0030] The chip where the pins coated with adhesive are located on the circuit board is recorded as a chip to be cured, the shape of the chip to be cured mapped on the circuit board is a rectangle, and the rectangle is recorded as a target rectangle; The adhesive coating thickness is the same at all pins on a chip to be cured; The light spot formed on the circuit board when the curing light irradiates the circuit board is recorded as a curing light spot, wherein the shape of the curing light spot is rectangular, and the area of ​​the curing light spot increases with the increase of the curing distance; When the curing lamp irradiates the chip to be cured at the highest curing distance, the judgment area judgment strategy is executed to determine whether the curing light spot contains two sides of the target rectangle at the same time and the two sides are parallel to each other; If the sides of two target rectangles are included at the same time, the area between the two target rectangle sides is recorded as the determination area, and the shape of the determination area is a rectangle; Get all the judgment areas on the circuit board; For any judgment area; Execute the centralized curing prediction strategy, use the curing light to illuminate the two sides of the determination area at the same time, and record the time it takes for the adhesive on the two sides to be cured, which is recorded as the first curing time; Execute the distributed curing prediction strategy, use the curing light to illuminate the two sides of the determination area in turn, and record the total time for the adhesive curing on the two sides to complete, which is recorded as the second curing time; The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured.

[0031] The performing of the adhesive curing time recording experiment, recording the curing time of the adhesive when the curing lamp is used to irradiate the adhesive at different curing distances, includes: Obtaining a minimum curing distance, where the minimum curing distance is the minimum curing distance when curing the adhesive; Obtaining a maximum curing distance, wherein the maximum curing distance is a maximum curing distance when curing the adhesive; Setting a test distance interval, wherein the test distance interval is an increase in the curing distance; Calculate (highest curing distance - lowest curing distance) / test distance interval + 1, and record the result as the test quantity a; Calculate the minimum curing distance + test distance interval, and record the result as the first curing distance; Calculate the minimum curing distance + test distance interval × 2, and record the result as the second curing distance... Calculate the minimum curing distance + test distance interval × (a-1), and record the result as the maximum curing distance; Use the curing lamp to cure the adhesive at the lowest curing distance, the first curing distance, and the highest curing distance in sequence, and record the curing time of the adhesive at each curing distance.

[0032] By setting the test distance interval as the increase in the curing distance each time, multiple curing distances are obtained. Using multiple curing distances as experimental conditions for performing adhesive curing time recording experiments, multiple curing times can be obtained for an adhesive with a coating thickness. When the test distance interval is large, the curing distance for performing the recording experiment is reduced, saving measurement time; when the test distance interval is small, the curing distance for performing the recording experiment increases, the more time data is recorded, the more refined the overall thickness distance time model is, providing an accurate data source for operators who need a refined model, and improving production efficiency.

[0033] When the curing lamp irradiates the chip to be cured at the highest curing distance, a determination area determination strategy is executed to determine whether the curing light spot contains two sides of the target rectangle at the same time and the two sides are parallel to each other, including: Get all target rectangles; Select each target rectangle in turn, and record the selected target rectangle as the execution rectangle; Any side of the execution rectangle is recorded as the execution side; The determination area determination strategy is executed on the execution side, specifically: Draw a line segment that coincides with the execution side, recorded as the coincident line segment; Obtain the length of the curing spot corresponding to the highest curing distance, and record it as the first length; The coincident line segments are gradually moved away from the execution side edge to the execution rectangle in a direction perpendicular to the execution side edge on the plane where the circuit board is located, and the maximum distance away is a first length; When the coincident line segment moves away from the execution rectangle, the target rectangle where the side of the target rectangle that coincides with the coincident line segment is located is recorded as the determination rectangle; For any judgment rectangle; Get the side that coincides with the coincident line segment for the first time, and record it as the determined side; Obtain a line segment on the determined side that coincides with the coincident line segment, and record it as the second coincident line segment; Projecting the second coincident line segment onto the execution side edge in a direction perpendicular to the execution side edge, and recording the line segment on the execution side edge where the second coincident line segment is projected as the first coincident line segment; Draw two parallel line segments, which are called the first parallel line segment and the second parallel line segment; Connect the two endpoints of the first coincident line segment and the second coincident line segment with the first parallel line segment; Connect the two endpoints of the first coincident line segment and the second coincident line segment with a second parallel line segment; A rectangular area formed by the first parallel line segment, the second parallel line segment, the first coincident line segment, and the second coincident line segment is recorded as a determination area.

[0034] In this embodiment, refer to Figure 1 There is a determination area between the execution rectangle and the determination rectangle, and the determination area includes the execution rectangle and the pins on the determination rectangle, and adhesive is coated on the pins.

[0035] By executing the judgment area judgment strategy, it is determined whether there are two target rectangles on the circuit board that can be cured at the same time and correspond to the chips to be cured. Specifically, when the curing distance is set to the highest curing distance to irradiate the circuit board, the curing spot is the largest and the area that can be covered is the largest. If the curing spot can simultaneously contain the parallel sides of the two target rectangles, it is determined that the two target rectangles can be cured at the same time. Since the chip is exposed to the curing light, the program will be erased. Ultraviolet light will destroy the internal charge distribution, causing the stored charge to be released, the data to be cleared, and the deletion effect will occur. Therefore, in order to avoid irradiating the chip surface during the irradiation process, when selecting the side of the judgment rectangle, the side that overlaps with the coincident line segment for the first time is selected to avoid the curing light irradiating the chip surface, reduce the risk of hidden dangers in the curing process, and improve the product qualification rate.

[0036] The centralized curing prediction strategy is executed to simultaneously illuminate two sides of the determination area with a curing light, including: Measure the length of the first parallel line segment in the determination area and record it as the second length; Recording the curing light spot whose length is equal to the second length as the first test light spot; On the circuit board, any direction parallel to the first coincident line segment is recorded as a curing direction; Using the first test light spot to divide the determination area into a plurality of rectangles along the curing direction, and recording the divided rectangles as positioning rectangles; Get the number of positioning rectangles, recorded as the first number.

[0037] The centralized curing prediction strategy is executed to simultaneously illuminate two sides of the determination area with a curing light, including: Obtain the chip corresponding to the first coincident line segment in the determination area, recorded as the first chip; Obtain the chip corresponding to the second coincident line segment in the determination area, recorded as the second chip; Measuring the coating thickness of the adhesive at the pins on the first chip, recorded as a first thickness; measuring the coating thickness of the adhesive at the pins on the second chip, and recording it as the second thickness; Obtaining a curing distance at which a curing lamp irradiates a circuit board to form a first test light spot, recorded as a first test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the first test distance is obtained, which is recorded as the first time; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the first test distance is obtained, which is recorded as the second time; Compare the size relationship between the first duration and the second duration; If the first duration ≧ the second duration; The first curing time is equal to the first time × the first quantity; If the first duration < the second duration; The first curing time is equal to the second time×the first quantity.

[0038] When the centralized curing strategy is executed, the curing light is used to irradiate the adhesive on the first and second overlapping line segments at the same time, and the irradiation to the chip surface should be avoided as much as possible. Therefore, the length of the curing spot is equal to the second length. The first test spot is determined according to the second length. The first test spot is used to divide the judgment area into multiple positioning rectangles along the curing direction. The number of positioning rectangles is the number of times the judgment area needs to be irradiated. Since two thicknesses of adhesive are irradiated at the same time, the adhesive with the longest curing time must be used as the standard. The relationship between the first and second time lengths is compared, and the longest time length is used as the time length of a single curing. The total time length of centralized curing is the time length of the unit curing multiplied by the number of curing times. Compared with dispersed curing, centralized curing can reduce the time of secondary curing. If the time of centralized curing is less than that of dispersed curing, then the effect of saving time and labor is achieved, and production efficiency is improved.

[0039] The method of executing the dispersed curing prediction strategy and sequentially irradiating two sides of the determination area with a curing light includes: Obtaining a width of the adhesive surrounding the first chip mapped on the circuit board, recorded as a first width; Obtaining a width of the adhesive surrounding the second chip mapped on the circuit board, recorded as a second width; Calculate the second length - the first width - the second width, and record the result as the third width; Set the number of partitions b for executing the decentralized solidification prediction strategy; Divide the third width into the divided number of width intervals; The first width, the first width + the width interval, ... the first width + the width interval × b are selected in sequence as the third length, and a curing experiment is performed on the first coincident line segment, specifically: Recording the curing light spot whose length is equal to the third length as the second test light spot; Obtaining a value of the width of the second test light spot, recorded as the first division length; Divide the first coincident line segment by a first division length to obtain a plurality of first test line segments; Obtain the number of the first test line segments, recorded as the second number; Obtaining a curing distance at which the curing lamp irradiates the circuit board to form a second test light spot, recorded as a second test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the second test distance is obtained, which is recorded as the third time; Calculate the third time duration × the second quantity, and use the result as the total time duration for curing the adhesive on the first coincident line segment, recorded as the first dispersion time duration; Obtain a first dispersed duration of each third length, compare all first dispersed durations, obtain a minimum first dispersed duration, and record it as a first target duration.

[0040] The method of executing the dispersed curing prediction strategy and sequentially irradiating two sides of the determination area with a curing light includes: The second width, the second width + the width interval, ... the second width + the width interval × b are selected in sequence as the fourth length, and a curing experiment is performed on the second coincident line segment, specifically: Recording the curing light spot whose length is equal to the fourth length as the third test light spot; Obtaining a value of the width of the third test light spot, recorded as the second division length; Divide the second coincident line segment by a second division length to obtain a plurality of second test line segments; Obtain the number of the second test line segments, recorded as the third number; Obtain a curing distance at which the curing lamp irradiates the circuit board to form a third test light spot, recorded as a third test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the third test distance is obtained, which is recorded as the fourth time; Calculate the fourth time duration × the third quantity, and use the result as the total time duration for curing the adhesive on the second coincident line segment, recorded as the second dispersion time duration; Obtain a second dispersed duration of each fourth length, compare all the second dispersed durations, obtain a minimum second dispersed duration, and record it as a second target duration; The first target duration and the second target duration are obtained, and the sum is calculated and used as the second solidification duration.

[0041] When dispersing and curing the circuit board, since the adhesive has a width, and curing light should be prevented from irradiating the adhesive on other chips while curing one chip, there is a gap between the adhesives on adjacent chips, so the length of the gap can be used to adjust the length of the curing spot. When the curing spot is larger, the fewer times of curing, the longer the time required for a single curing. When the curing spot is smaller, the more times of curing, the shorter the time required for a single curing. However, the total curing time is the number of curing times multiplied by the time of a single curing. Therefore, in the total curing time of multiple curing spots, the shortest curing time is selected, which has the highest efficiency, as the total curing time of dispersing curing, and the second curing time is obtained. The test model is used to obtain a curing spot of adjustable size, and the curing spot with the shortest curing time is selected in each curing spot tested, thereby reducing the curing time and improving production efficiency.

[0042] The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured, including: When the first curing time is ≦ the second curing time; Obtaining a first test light spot corresponding to a first curing time; When the curing light illuminates the determination area, the curing light spot of the curing light is adjusted to be the first test light spot, and the first test light spot is aligned with each positioning rectangle in turn; Wherein, when the first duration ≧ the second duration, the first duration is illuminated in each positioning rectangle; When the first duration is less than the second duration, the second duration is illuminated in each positioning rectangle.

[0043] In this embodiment, refer to Figure 2 , align the positioning rectangles with the first test light spot in sequence, and solidify each positioning rectangle for the first duration or the second duration, where the solidification duration is based on the maximum duration of the first duration and the second duration.

[0044] When the first curing time is less than or equal to the second curing time, the first test light spot corresponding to the first curing time is the same size as the positioning rectangle that divides the judgment area equally, the first test light spot is aligned with the positioning rectangle, so that the adhesives on both sides of the judgment area can be cured. The curing time of the thickest adhesive is selected as the single curing time in the single curing time to ensure that the adhesives on both sides of the judgment area can be cured at the same time in one curing, which not only reduces the curing time but also avoids passing through the judgment area twice, thereby improving production efficiency.

[0045] The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured, including: When the first curing time> the second curing time; When the curing light illuminates the pins on the first coincident line segment of the determination area; Obtaining a second test light spot corresponding to a second curing time; Obtain all first test line segments on the first coincident line segment; In this embodiment, refer to Figure 3 , the width of the second test light spot is equal to the first test line segment, the width of the second test light spot is aligned with the first test line segment, and 5 rectangles are obtained. The 5 rectangles are irradiated with the third test light spot in turn, and the irradiation time is equal to the third time length.

[0046] Adjusting the curing light spot of the curing lamp to be a second test light spot, aligning the width of the formed second test light spot to each first test line segment in turn, and irradiating each first test line segment for a third time; When the curing light illuminates the pins on the second coincident line segment of the determination area; Obtaining a third test light spot corresponding to the second curing time; Obtain all second test line segments on the second coincident line segment; The curing light spot of the curing lamp is adjusted to be a third test light spot, the width of the formed third test light spot is aligned with each second test line segment in turn, and each second test line segment is irradiated for a fourth time period.

[0047] In this embodiment, refer to Figure 4 , the width of the third test light spot is equal to the second test line segment, the width of the third test light spot is aligned with the second test line segment, and 6 rectangles are obtained. The 6 rectangles are irradiated with the third test light spot in turn, and the duration of a single irradiation is equal to the fourth duration.

[0048] When the first curing time is greater than or equal to the second curing time, during dispersed curing, the second test light spot is used to irradiate the adhesive on the first coincident line segment, and the third test light spot is used to irradiate the adhesive on the second coincident line segment. In order to avoid irradiating the chip, the width of the second test light spot should be aligned with the first test line segment, and the width of the third test light spot should be aligned with the second test line segment, and then the required curing time is irradiated respectively to achieve the purpose of dispersed curing. The effect of dispersed curing is strong adjustability, flexible control, and convenient curing.

[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0050] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for controlling the light of a curing lamp, characterized in that: include: The thickness of the adhesive applied on the circuit board is recorded as the coating thickness; The distance from the adhesive when the curing light is irradiated to the adhesive is recorded as the curing distance, where the curing distance is in the interval of [minimum curing distance, maximum curing distance]; The time from the start of curing the adhesive to the completion of curing by the curing light is recorded as the curing time; Get all coating thicknesses; Adhesive for each coating thickness; Perform an adhesive curing time recording experiment to record the curing time of the adhesive when the curing lamp is used to irradiate the adhesive at different curing distances; Obtain the curing time of adhesives of all coating thicknesses at different curing distances to obtain a thickness-distance-time model; The chip where the pins coated with adhesive are located on the circuit board is recorded as a chip to be cured, the shape of the chip to be cured mapped on the circuit board is a rectangle, and the rectangle is recorded as a target rectangle; The adhesive coating thickness is the same at all pins on a chip to be cured; The light spot formed on the circuit board when the curing light irradiates the circuit board is recorded as a curing light spot, wherein the shape of the curing light spot is rectangular, and the area of ​​the curing light spot increases with the increase of the curing distance; When the curing lamp irradiates the chip to be cured at the highest curing distance, the judgment area judgment strategy is executed to determine whether the curing light spot contains two sides of the target rectangle at the same time and the two sides are parallel to each other; If the sides of two target rectangles are included at the same time, the area between the two target rectangle sides is recorded as the determination area, and the shape of the determination area is a rectangle; Get all the judgment areas on the circuit board; For any judgment area; Execute the centralized curing prediction strategy, use the curing light to illuminate the two sides of the determination area at the same time, and record the time it takes for the adhesive on the two sides to be cured, which is recorded as the first curing time; Execute the distributed curing prediction strategy, use the curing light to illuminate the two sides of the determination area in turn, and record the total time for the adhesive curing on the two sides to complete, which is recorded as the second curing time; The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured.

2. The method for controlling the light of a curing lamp according to claim 1, characterized in that: The performing of the adhesive curing time recording experiment, recording the curing time of the adhesive when the curing lamp is used to irradiate the adhesive at different curing distances, includes: Obtaining a minimum curing distance, where the minimum curing distance is the minimum curing distance when curing the adhesive; Obtaining a maximum curing distance, wherein the maximum curing distance is a maximum curing distance when curing the adhesive; Setting a test distance interval, wherein the test distance interval is an increase in the curing distance; Calculate (highest curing distance - lowest curing distance) / test distance interval + 1, and record the result as the test quantity a; Calculate the minimum curing distance + test distance interval, and record the result as the first curing distance; Calculate the minimum curing distance + test distance interval × 2, and record the result as the second curing distance... Calculate the minimum curing distance + test distance interval × (a-1), and record the result as the maximum curing distance; Use the curing lamp to cure the adhesive at the lowest curing distance, the first curing distance, and the highest curing distance in sequence, and record the curing time of the adhesive at each curing distance.

3. The method for controlling the light of a curing lamp according to claim 1, characterized in that: When the curing lamp irradiates the chip to be cured at the highest curing distance, a determination area determination strategy is executed to determine whether the curing light spot contains two sides of the target rectangle at the same time and the two sides are parallel to each other, including: Get all target rectangles; Select each target rectangle in turn, and record the selected target rectangle as the execution rectangle; Any side of the execution rectangle is recorded as the execution side; The determination area determination strategy is executed on the execution side, specifically: Draw a line segment that coincides with the execution side, recorded as the coincident line segment; Obtain the length of the curing spot corresponding to the highest curing distance, and record it as the first length; The coincident line segments are gradually moved away from the execution side edge to the execution rectangle in a direction perpendicular to the execution side edge on the plane where the circuit board is located, and the maximum distance away is a first length; When the coincident line segment moves away from the execution rectangle, the target rectangle where the side of the target rectangle that coincides with the coincident line segment is located is recorded as the determination rectangle; For any judgment rectangle; Get the side that coincides with the coincident line segment for the first time, and record it as the determined side; Obtain a line segment on the determined side that coincides with the coincident line segment, and record it as the second coincident line segment; Projecting the second coincident line segment onto the execution side edge in a direction perpendicular to the execution side edge, and recording the line segment on the execution side edge where the second coincident line segment is projected as the first coincident line segment; Draw two parallel line segments, which are called the first parallel line segment and the second parallel line segment; Connect the two endpoints of the first coincident line segment and the second coincident line segment with the first parallel line segment; Connect the two endpoints of the first coincident line segment and the second coincident line segment with a second parallel line segment; A rectangular area formed by the first parallel line segment, the second parallel line segment, the first coincident line segment, and the second coincident line segment is recorded as a determination area.

4. The method for controlling the light of a curing lamp according to claim 3, characterized in that: The centralized curing prediction strategy is executed to simultaneously illuminate two sides of the determination area with a curing light, including: Measure the length of the first parallel line segment in the determination area and record it as the second length; Recording the curing light spot whose length is equal to the second length as the first test light spot; On the circuit board, any direction parallel to the first coincident line segment is recorded as a curing direction; Using the first test light spot to divide the determination area into a plurality of rectangles along the curing direction, and recording the divided rectangles as positioning rectangles; Get the number of positioning rectangles, recorded as the first number.

5. The method for controlling the light of a curing lamp according to claim 4, characterized in that: The centralized curing prediction strategy is executed to simultaneously illuminate two sides of the determination area with a curing light, including: Obtain the chip corresponding to the first coincident line segment in the determination area, recorded as the first chip; Obtain the chip corresponding to the second coincident line segment in the determination area, recorded as the second chip; Measuring the coating thickness of the adhesive at the pins on the first chip, recorded as a first thickness; measuring the coating thickness of the adhesive at the pins on the second chip, and recording it as the second thickness; Obtaining a curing distance at which a curing lamp irradiates a circuit board to form a first test light spot, recorded as a first test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the first test distance is obtained, which is recorded as the first time; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the first test distance is obtained, which is recorded as the second time; Compare the size relationship between the first duration and the second duration; If the first duration ≧ the second duration; The first curing time is equal to the first time × the first quantity; If the first duration < the second duration; The first curing time is equal to the second time×the first quantity.

6. The method for controlling the light of a curing lamp according to claim 4, characterized in that: The method of executing the dispersed curing prediction strategy and sequentially irradiating two sides of the determination area with a curing light includes: Obtaining a width of the adhesive surrounding the first chip mapped on the circuit board, recorded as a first width; Obtaining a width of the adhesive surrounding the second chip mapped on the circuit board, recorded as a second width; Calculate the second length - the first width - the second width, and record the result as the third width; Set the number of partitions b for executing the decentralized solidification prediction strategy; Divide the third width into the divided number of width intervals; The first width, the first width + the width interval, ... the first width + the width interval × b are selected in sequence as the third length, and a curing experiment is performed on the first coincident line segment, specifically: Recording the curing light spot whose length is equal to the third length as the second test light spot; Obtaining a value of the width of the second test light spot, recorded as the first division length; Divide the first coincident line segment by a first division length to obtain a plurality of first test line segments; Obtain the number of the first test line segments, recorded as the second number; Obtaining a curing distance at which the curing lamp irradiates the circuit board to form a second test light spot, recorded as a second test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the first thickness and the curing distance is equal to the second test distance is obtained, which is recorded as the third time; Calculate the third time duration × the second quantity, and use the result as the total time duration for curing the adhesive on the first coincident line segment, recorded as the first dispersion time duration; Obtain a first dispersed duration of each third length, compare all first dispersed durations, obtain a minimum first dispersed duration, and record it as a first target duration.

7. The method for controlling the light of a curing lamp according to claim 6, characterized in that: The method of executing the dispersed curing prediction strategy and sequentially irradiating two sides of the determination area with a curing light includes: The second width, the second width + the width interval, ... the second width + the width interval × b are selected in sequence as the fourth length, and a curing experiment is performed on the second coincident line segment, specifically: Recording the curing light spot whose length is equal to the fourth length as the third test light spot; Obtaining a value of the width of the third test light spot, recorded as the second division length; Divide the second coincident line segment by a second division length to obtain a plurality of second test line segments; Obtain the number of the second test line segments, recorded as the third number; Obtain a curing distance at which the curing lamp irradiates the circuit board to form a third test light spot, recorded as a third test distance; According to the thickness-distance-time model, the curing time when the coating thickness is equal to the second thickness and the curing distance is equal to the third test distance is obtained, which is recorded as the fourth time; Calculate the fourth time duration × the third quantity, and use the result as the total time duration for curing the adhesive on the second coincident line segment, recorded as the second dispersion time duration; Obtain a second dispersed duration of each fourth length, compare all the second dispersed durations, obtain a minimum second dispersed duration, and record it as a second target duration; The first target duration and the second target duration are obtained, and the sum is calculated and used as the second solidification duration.

8. The method for controlling the light of a curing lamp according to claim 6, characterized in that: The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured, including: When the first curing time is ≦ the second curing time; Obtaining a first test light spot corresponding to a first curing time; When the curing light illuminates the determination area, the curing light spot of the curing light is adjusted to be the first test light spot, and the first test light spot is aligned with each positioning rectangle in turn; Wherein, when the first duration ≧ the second duration, the first duration is illuminated in each positioning rectangle; When the first duration is less than the second duration, the second duration is illuminated in each positioning rectangle.

9. The method for controlling the light of a curing lamp according to claim 8, characterized in that: The first curing time is compared with the second curing time, a curing strategy corresponding to the minimum curing time is selected, and the determined area is cured, including: When the first curing time> the second curing time; When the curing light illuminates the pins on the first coincident line segment of the determination area; Obtaining a second test light spot corresponding to a second curing time; Obtain all first test line segments on the first coincident line segment; Adjusting the curing light spot of the curing lamp to be a second test light spot, aligning the width of the formed second test light spot to each first test line segment in turn, and irradiating each first test line segment for a third time; When the curing light illuminates the pins on the second coincident line segment of the determination area; Obtaining a third test light spot corresponding to the second curing time; Obtain all second test line segments on the second coincident line segment; The curing light spot of the curing lamp is adjusted to be a third test light spot, the width of the formed third test light spot is aligned with each second test line segment in turn, and each second test line segment is irradiated for a fourth time period.

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