Special detection equipment for semiconductor material

Abstract

The invention relates to the field of semiconductor material detection, in particular to special semiconductor material detection equipment which comprises a fixing frame, an electric guide rail, a moving block and a camera. The fixing frame is fixedly connected with a semicircular electric guide rail; the electric guide rail is slidably connected with a moving block; the moving block is fixedly connected with a camera; the device further comprises a bearing disc and the like. The fixing frame is rotationally connected with a bearing disc. The semiconductor device is fixed through the adhesive tape, it is avoided that when the bearing disc rotates through the driver, the semiconductor device shakes, and observation and detection of the camera are affected, meanwhile, fixing operation is achieved by using the clamp or forming the containing groove separately, and detection blind areas can be avoided through the adhesive tape; according to the device, the semiconductor devices of different sizes can be fixed, after detection is completed, the semiconductor device is directly taken down from the adhesive tape through a worker or an external feeding and discharging mechanical clamping hand, another semiconductor device is bonded to the adhesive tape, and the semiconductor device is convenient to disassemble and fix.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor material detection, and in particular to a special detection device for semiconductor materials. Background Art

[0002] After semiconductors are packaged to form electronic products, semiconductor packaging inspection equipment is currently required to perform appearance inspection on semiconductor components to eliminate defects. For example, Chinese patent: CN118258817A discloses a semiconductor material packaging inspection device, which combines a camera assembly and a rotating table to achieve rapid inspection of the upper and lower surfaces of semiconductor devices without flipping the device, thereby greatly improving the inspection efficiency. In addition, by generating a planar rotation of the semiconductor device, multiple sides can be continuously inspected one by one without repeated clamping or secondary inspection, further improving the comprehensiveness and efficiency of the inspection.

[0003] However, the semiconductor device is placed on a rotating table and lacks fixation. As the rotating table generates mechanical vibrations when rotating through the transmission structure, the semiconductor device will shake on the rotating table, reducing the detection accuracy. If the semiconductor device is fixed by a clamp, the camera will be blocked, forming a large blind spot for the camera's observation, which brings inconvenience to the detection. Alternatively, the semiconductor device can be fixed by opening a placement slot on the rotating table. However, due to the different sizes of different semiconductor devices, the fixed placement slots opened on the rotating table cannot adapt to semiconductor devices of different sizes, which has great limitations. Summary of the invention

[0004] In order to overcome the problem that semiconductor devices are placed on a rotating table and lack fixation, the semiconductor devices will shake on the rotating table due to mechanical vibration generated when the rotating table is rotated through a transmission structure, thereby reducing the detection accuracy. If the semiconductor devices are fixed by a clamp, the camera will be blocked, resulting in a large blind spot for the camera's observation. The present invention provides a special detection device for semiconductor materials.

[0005] The technical solution is: a special detection equipment for semiconductor materials, including a fixed frame, an electric guide rail, a moving block and a camera; the fixed frame is fixedly connected to a semicircular electric guide rail; the electric guide rail is slidably connected to the moving block; the moving block is fixedly connected to the camera; it also includes a support tray, a driver, and a tape; the fixed frame is rotatably connected to the support tray, and the support tray is located on the inner side of the electric guide rail, and the support tray is made of a high-transmittance material; the fixed frame is connected to a driver for driving the support tray to rotate horizontally, the driver consists of a motor, a gear and a gear ring, and the fixed frame is fixedly connected to the motor; the output shaft of the motor is fixedly connected to a gear; the support tray is fixedly connected to the gear ring, and the gear ring is meshed with the gear; the support tray is detachably connected to a number of tapes for fixing semiconductor devices, and the adhesive surface of the tape faces upward, and the tape is made of a transparent thin material.

[0006] Furthermore, it also includes a round rod and a motor; the supporting tray is provided with two rectangular grooves; the supporting tray is rotatably connected to the two round rods, and the tape passes through the rectangular grooves and is connected to the round rods, and a sufficient amount of tape is rolled up on one of the round rods; the supporting tray is fixedly connected to two motors, and the output shafts of the motors are fixedly connected to the corresponding round rods.

[0007] Furthermore, it also includes spring rods and pulleys; the supporting tray is fixedly connected to a plurality of spring rods; the telescopic end of each spring rod is fixedly connected to a pulley, and the pulley is located in the rectangular groove and contacts the tape.

[0008] Furthermore, it also includes a rectangular plate; the supporting tray is fixedly connected with a plurality of rectangular plates, and the rectangular plates are located at the edge of the rectangular groove, and the adhesive tape is located between adjacent rectangular plates.

[0009] Furthermore, it also includes a temperature detection component; the temperature detection component includes an electric push rod I, an electric heating plate, an electric push rod II, an electric push rod III, and a support rod; the fixed frame is connected to the electric push rod I; the telescopic end of the electric push rod I is fixedly connected to the electric heating plate for temperature detection of semiconductor devices; the fixed frame is fixedly connected to the electric push rod II, and the telescopic end of the electric push rod II is fixedly connected to the electric push rod I through a connecting block; the supporting tray is fixedly connected to the electric push rod III; the telescopic end of the electric push rod III is fixedly connected to the support rod, and the support rod is in contact with the tape.

[0010] Furthermore, the support rod is made of rubber.

[0011] Furthermore, the support rod is smoothly arranged.

[0012] Furthermore, it also includes a protective ring; the moving block is fixedly connected with the protective ring, and the protective ring is slidably connected to the electric guide rail.

[0013] Furthermore, it also includes fill lights; a plurality of fill lights are fixedly connected to the protective ring, and the fill lights are directly opposite to the position of the camera.

[0014] Furthermore, a sponge ring is provided on the outer side of the protective ring.

[0015] The beneficial effects are as follows: the present invention fixes the semiconductor device by means of tape, so as to prevent the semiconductor device from shaking when the supporting tray is rotated by the driver, thereby affecting the observation and detection of the camera. At the same time, the fixing operation is realized by using a clamp or opening a placement groove. The tape can avoid causing a detection blind spot, and semiconductor devices of different sizes can be fixed. After the detection is completed, the semiconductor device can be directly removed from the tape by a staff member or an external loading and unloading mechanical clamp, and another semiconductor device can be bonded to the tape, so as to facilitate the disassembly and fixation of the semiconductor device.

[0016] The present invention controls two motors to start, and the output shafts of the two motors drive the round rods to rotate back and forth, so that the round rods reciprocate and unreel the tape, and the tape drives the semiconductor device to move back and forth, and the semiconductor device collides with the rectangular plate, and then the damage of the semiconductor device is detected by a camera to detect the impact resistance of the semiconductor device.

[0017] The present invention protects the lubricating oil dripping on the electric guide rail through a protective ring to prevent the dripping lubricating oil from directly falling onto the supporting tray and affecting the detection. When the camera observes the semiconductor device, the fill light is used to always fill light in the direction facing the camera, thereby improving the lighting environment of the camera facing the semiconductor device side and improving the detection effect of the camera on the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure disclosed by the semiconductor material special detection device of the present invention;

[0019] Figure 2 A schematic diagram of the combined structure of a tray and an adhesive tape disclosed in the semiconductor material special detection equipment of the present invention;

[0020] Figure 3 It is a schematic diagram of the combined structure of a tray, a tape, a motor, and a rectangular plate disclosed in the semiconductor material special detection equipment of the present invention, wherein the tray is processed in cross section;

[0021] Figure 4 A schematic diagram of the combined structure of the fixing frame, the supporting tray, the adhesive tape, the round rod, the motor, the electric push rod III, and the supporting rod disclosed in the semiconductor material special detection equipment of the present invention;

[0022] Figure 5 A schematic diagram of the combined structure of a tray, a tape, a spring rod, a pulley, and a support rod disclosed in the semiconductor material special detection equipment of the present invention;

[0023] Figure 6 The present invention is a schematic diagram of the combined structure of a fixing frame, a supporting tray, an adhesive tape, an electric push rod I, an electric heating plate, and an electric push rod II disclosed in the special detection equipment for semiconductor materials.

[0024] Parts names and serial numbers in the figure: 1-fixed frame, 2-electric guide rail, 3-moving block, 4-camera, 5-semiconductor device, 101-support tray, 102-driver, 103-tape, 104-round rod, 105-motor, 106-spring rod, 107-pulley, 108-rectangular plate, 201-electric push rod I, 202-electric heating plate, 203-electric push rod II, 207-electric push rod III, 208-support rod, 301-protective ring, 302-fill light, 1001-rectangular groove, 1031-bending part. DETAILED DESCRIPTION

[0025] The technical solution of the present invention is further described below in conjunction with the accompanying drawings.

[0026] Example 1

[0027] A special testing equipment for semiconductor materials, such as Figure 1-Figure 5 As shown, it includes a fixed frame 1, an electric guide rail 2, a moving block 3 and a camera 4; the fixed frame 1 is fixedly connected to the semicircular electric guide rail 2; the electric guide rail 2 is slidably connected to the moving block 3; the moving block 3 is fixedly connected to the camera 4;

[0028] It also includes a support tray 101, a driver 102, and a tape 103; the fixed frame 1 is rotatably connected to the support tray 101, and the support tray 101 is located on the inner side of the electric guide rail 2, and the support tray 101 is made of a material with high light transmittance; the fixed frame 1 is connected to the driver 102, the driver 102 is composed of a motor, a gear and a gear ring, and the fixed frame 1 is fixedly connected to the motor; the output shaft of the motor is fixedly connected to the gear; the support tray 101 is fixedly connected to the gear ring, and the gear ring is meshed with the gear; the support tray 101 is detachably connected to two tapes 103, and the adhesive surface of the tapes 103 faces upward, and the tapes 103 are made of a transparent thin material.

[0029] It also includes a round rod 104 and a motor 105; the tray 101 is provided with two rectangular grooves 1001; the tray 101 is rotatably connected to the two round rods 104, and the tape 103 passes through the rectangular grooves 1001 and is connected to the round rods 104, and a sufficient amount of tape 103 is rolled up on one of the round rods 104; the tray 101 is fixedly connected to the two motors 105, and the output shafts of the motors 105 are fixedly connected to the corresponding round rods 104.

[0030] It also includes a spring rod 106 and a pulley 107; the support tray 101 is fixedly connected to four spring rods 106; the telescopic end of each spring rod 106 is fixedly connected to a pulley 107, and the pulley 107 is located in the rectangular groove 1001, and the pulley 107 is in contact with the tape 103.

[0031] The tray 101 is also provided with a rectangular plate 108 . The two rectangular plates 108 are fixedly connected to the tray 101 . The rectangular plates 108 are located at the edge of the rectangular groove 1001 . The adhesive tape 103 is located between adjacent rectangular plates 108 .

[0032] When in use, the two tapes 103 are fixed on the tray 101, with the adhesive side of the tapes 103 facing upward, and then the pins of the semiconductor device 5 to be tested are bonded to the upper side of the two tapes 103. Figure 2As shown, the camera 4 then observes and inspects the appearance of the semiconductor device 5, and controls the electric guide rail 2 to make the moving block 3 drive the camera 4 to rotate, so that the camera 4 can observe the upper and lower sides of the semiconductor device 5. Since the tray 101 is made of a highly light-transmitting material, when the camera 4 rotates to the lower side of the tray 101, the camera 4 can observe the semiconductor device 5 through the tray 101.

[0033] During the observation and detection process, the control driver 102 starts the motor, and the output shaft of the motor drives the gear to rotate. The gear drives the gear ring to rotate through meshing, and the gear ring drives the tray 101 to rotate. Then the tray 101 drives the tape 103 and the semiconductor device 5 to rotate horizontally, changing the observation angle of the camera 4 to the semiconductor device 5, so that the camera 4 can continuously detect multiple sides of the semiconductor device 5 one by one. When the tray 101 drives the tape 103 and the semiconductor device 5 to rotate horizontally, since the tape 103 is a transparent thin material, the tape 103 will not interfere with the observation of the camera 4. Therefore, the camera 4 can see through The semiconductor device 5 is observed by the tape 103 and fixed by the tape 103 to prevent the semiconductor device 5 from shaking when the tray 101 is rotated by the driver 102, which affects the observation and detection of the camera 4. At the same time, the fixing operation is achieved by using a clamp or opening a placement groove. The tape 103 can avoid causing a detection blind spot and can fix semiconductor devices 5 of different sizes. After the detection is completed, the semiconductor device 5 is directly removed from the tape 103 by the staff or an external loading and unloading mechanical clamp, and another semiconductor device 5 is bonded to the tape 103, which is convenient for the removal and fixation of the semiconductor device 5.

[0034] Since the adhesive side of the tape 103 faces upward, dust and impurities in the air will adhere to the upper side of the tape 103, and the dust and impurities will block the light, thereby affecting the camera 4 from observing and detecting the pins of the semiconductor device 5. Therefore, after detecting a semiconductor device 5, the two motors 105 are controlled to start, and the corresponding round rods 104 are driven to rotate by the output shafts of the motors 105, so that one round rod 104 reels the old tape 103, and the other round rod 104 unwinds the new tape 103, and then the new tape 103 is pulled out to the tray 101, and the tape 103 on the tray 101 is quickly replaced to improve the detection efficiency.

[0035] Since the adhesive tape 103 and the tray 101 are only in contact, when the toothed ring drives the tray 101 to rotate, the mechanical vibration generated makes the slender adhesive tape 103 easy to shake, and the semiconductor device 5 is easy to fall off the adhesive tape 103, thereby reducing the fixing effect of the semiconductor device 5. Therefore, a spring rod 106 and a pulley 107 are provided at the bent portion 1031 of the adhesive tape 103. The spring rod 106 is in a compressed state to push the pulley 107 toward the adhesive tape 103, so that the adhesive tape 103 is in a taut state under the action of the pulley 107 and the spring rod 106, thereby improving the fixing effect of the adhesive tape 103 on the semiconductor device 5.

[0036] During the production and transportation process of the semiconductor devices 5, the semiconductor devices 5 may collide with each other. Therefore, it is necessary to simulate the impact during the transportation process to detect the impact resistance of the semiconductor devices 5 after packaging. Therefore, the two motors 105 are controlled to start, and the output shafts of the two motors 105 drive the round rod 104 to reciprocate, and then the round rod 104 reciprocates to rewind and unwind the tape 103, and then the tape 103 drives the semiconductor device 5 to reciprocate, and the semiconductor device 5 collides with the rectangular plate 108, and then the camera 4 detects the impact of the semiconductor device 5. The damage condition is used to detect the impact resistance of the semiconductor device 5, and the direction of the semiconductor device 5 can be manually changed so that the other two sides of the semiconductor device 5 are facing the rectangular plate 108, and the other two sides of the semiconductor device 5 are impact tested. In addition, the speed of the motor 105 can be adjusted to adjust the rotation speed of the round rod 104, thereby adjusting the impact force between the semiconductor device 5 and the rectangular plate 108, thereby improving the comprehensiveness of the detection. During the impact process, if the semiconductor device 5 falls off the tape 103, the semiconductor device 5 can be manually re-pasted to the tape 103.

[0037] Example 2

[0038] On the basis of Example 1, Figure 2-Figure 6 As shown, a temperature detection component is also included; the temperature detection component includes an electric push rod Ⅰ201, an electric heating plate 202, an electric push rod Ⅱ203, an electric push rod Ⅲ207, and a support rod 208; the fixed frame 1 is connected to the electric push rod Ⅰ201; the telescopic end of the electric push rod Ⅰ201 is fixedly connected to the electric heating plate 202; the fixed frame 1 is bolted to the electric push rod Ⅱ203, and the telescopic end of the electric push rod Ⅱ203 is fixedly connected to the electric push rod Ⅰ201 through a connecting block; the support tray 101 is fixedly connected to the electric push rod Ⅲ207; the telescopic end of the electric push rod Ⅲ207 is fixedly connected to the support rod 208, and the support rod 208 is in contact with the tape 103.

[0039] The support rod 208 is made of rubber material, and the adhesive tape 103 is supported by the support rod 208 to prevent the adhesive tape 103 from directly contacting the edges of the rectangular groove 1001 during movement and causing wear.

[0040] The support rod 208 is smoothly configured to reduce the friction between the support rod 208 and the adhesive tape 103 , thereby preventing the support rod 208 from affecting the movement of the adhesive tape 103 .

[0041] The semiconductor device 5 is in contact with other electronic components during actual operation, so the semiconductor device 5 will generate heat over the working time. At the same time, the electronic components in contact with the semiconductor device 5 will also generate heat due to operation, resulting in the semiconductor device 5 being often in a high temperature environment. In order to detect the working condition of the semiconductor device 5 in a high temperature environment, it is also necessary to detect the heat resistance of the semiconductor device 5. Therefore, the driver 102 is first controlled to drive the support tray 101 and the semiconductor device 5 to rotate to the position as shown in FIG. Figure 2 In the direction shown, since the semiconductor device 5 is small in size, and thus the distance between the lower side of the semiconductor device 5 and the tray 101 is small, firstly, the two electric push rods III 207 are controlled to respectively drive the corresponding support rods 208 to move upwards, and at the same time, the motor 105 is controlled to start, and the round rod 104 is driven to rotate through the output shaft of the motor 105, and then the round rod 104 unwinds the tape 103, and then the two support rods 208 drive the tape 103 and the semiconductor device 5 to move upwards, increasing the distance between the semiconductor device 5 and the tray 101, and then, the electric push rod I 201 is controlled to drive the electric heating plate 202 to move toward the side close to the semiconductor device 5, so that the electric heating plate 202 is first close to the lower side of the semiconductor device 5, and then the electric heating plate 202 heats the lower side of the semiconductor device 5, and at this time, the camera 4 observes and detects the upper side of the heated semiconductor device 5;

[0042] Subsequently, the electric push rod Ⅰ201 is controlled to drive the electric heating plate 202 to move to the side away from the semiconductor device 5, so that the electric heating plate 202 is away from the semiconductor device 5. Then, the electric push rod Ⅱ203 is controlled to drive the electric push rod Ⅰ201 and the electric heating plate 202 to move upward. Subsequently, the electric push rod Ⅰ201 is controlled to drive the electric heating plate 202 to move to the side close to the semiconductor device 5, so that the electric heating plate 202 is close to the upper side of the semiconductor device 5, and then the electric heating plate 202 heats the upper side of the semiconductor device 5. Then, the electric guide rail 2 is controlled to make the moving block 3 drive the camera 4 to rotate to the bottom of the supporting tray 101, and then the camera 4 observes and detects the lower side of the heated semiconductor device 5, and the electric heating plate 202 is respectively close to the upper and lower sides of the semiconductor device 5, thereby simulating the scene when the semiconductor device 5 is in contact with other heating electronic components in the actual working environment, thereby improving the detection accuracy.

[0043] Example 3

[0044] On the basis of Example 1 and Example 2, Figure 1As shown, a protective ring 301 is also included; the moving block 3 is fixedly connected with the protective ring 301, and the protective ring 301 is slidably connected with the electric guide rail 2.

[0045] It also includes fill lights 302 ; a plurality of fill lights 302 are fixedly connected to the protective ring 301 , and the fill lights 302 are directly opposite to the position of the camera 4 .

[0046] A sponge ring is provided on the outside of the protective ring 301 to absorb the lubricating oil dripping onto the protective ring 301, so as to prevent the lubricating oil from dripping onto the protective ring 301 and directly falling to the ground, causing waste.

[0047] Since the electric guide rail 2 needs to make the moving block 3 drive the camera 4 to rotate frequently during the observation and detection process, it is necessary to add lubricating oil to the electric guide rail 2 to reduce the friction between the electric guide rail 2 and the moving block 3 and increase the service life of the electric guide rail 2. The lubricating oil on the electric guide rail 2 will drip downward onto the supporting tray 101 under the action of gravity, causing inconvenience to the observation and detection by the camera 4. Therefore, the protective ring 301 is used to protect the lubricating oil dripping on the electric guide rail 2 to prevent the dripping lubricating oil from falling directly onto the supporting tray 101 and affecting the detection.

[0048] When the camera 4 observes the semiconductor device 5 , the fill light 302 is used to always fill light in the direction facing the camera 4 , thereby improving the lighting environment of the camera 4 facing the semiconductor device 5 and improving the detection effect of the camera 4 on the semiconductor device 5 .

[0049] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A semiconductor material special detection device, comprising a fixed frame (1), an electric guide rail (2), a moving block (3) and a camera (4); the fixed frame (1) is fixedly connected to a semicircular electric guide rail (2); the electric guide rail (2) is slidably connected to the moving block (3); the moving block (3) is fixedly connected to the camera (4); the characteristics are: The invention also comprises a support tray (101), a driver (102), and an adhesive tape (103); the fixed frame (1) is rotatably connected to the support tray (101), the support tray (101) is located inside the electric guide rail (2), and the support tray (101) is made of a material with high light transmittance; the fixed frame (1) is connected to a driver (102) for driving the support tray (101) to rotate horizontally, the driver (102) is composed of a motor, a gear and a gear ring, and the fixed frame (1) is fixedly connected to the motor; the output shaft of the motor is fixedly connected to the gear; the support tray (101) is fixedly connected to the gear ring, and the gear ring is meshed with the gear; the support tray (101) is detachably connected to a plurality of adhesive tapes (103) for fixing the semiconductor device (5), the adhesive surface of the adhesive tapes (103) faces upward, and the adhesive tapes (103) are made of a transparent thin material.

2. A semiconductor material special detection equipment according to claim 1, characterized in that: The invention also comprises a round rod (104) and a motor (105); the tray (101) is provided with two rectangular grooves (1001); the tray (101) is rotatably connected to the two round rods (104), and the adhesive tape (103) passes through the rectangular grooves (1001) and is connected to the round rods (104), and a sufficient amount of adhesive tape (103) is rolled up on one of the round rods (104); the tray (101) is fixedly connected to the two motors (105), and the output shafts of the motors (105) are fixedly connected to the corresponding round rods (104).

3. A semiconductor material special detection equipment according to claim 2, characterized in that: It also includes a spring rod (106) and a pulley (107); the supporting tray (101) is fixedly connected to a plurality of spring rods (106); the telescopic end of each spring rod (106) is fixedly connected to a pulley (107), and the pulley (107) is located in the rectangular groove (1001), and the pulley (107) is in contact with the adhesive tape (103).

4. A semiconductor material special detection equipment according to claim 3, characterized in that: It also includes a rectangular plate (108); a plurality of rectangular plates (108) are fixedly connected to the supporting tray (101), and the rectangular plates (108) are located at the edge of the rectangular groove (1001), and the adhesive tape (103) is located between adjacent rectangular plates (108).

5. The semiconductor material special detection equipment according to claim 1, characterized in that: The invention also comprises a temperature detection component; the temperature detection component comprises an electric push rod I (201), an electric heating plate (202), an electric push rod II (203), an electric push rod III (207), and a support rod (208); the fixed frame (1) is connected with the electric push rod I (201); the telescopic end of the electric push rod I (201) is fixedly connected with the electric heating plate (202) for performing temperature detection on the semiconductor device (5); the fixed frame (1) is fixedly connected with the electric push rod II (203), and the telescopic end of the electric push rod II (203) is fixedly connected with the electric push rod I (201) through a connecting block; the supporting tray (101) is fixedly connected with the electric push rod III (207); the telescopic end of the electric push rod III (207) is fixedly connected with the support rod (208), and the support rod (208) is in contact with the adhesive tape (103).

6. A semiconductor material special detection equipment according to claim 5, characterized in that: The support rod (208) is made of rubber.

7. A semiconductor material special detection equipment according to claim 6, characterized in that: The support rod (208) is smoothly arranged.

8. The semiconductor material special detection equipment according to claim 1, characterized in that: It also includes a protection ring (301); the moving block (3) is fixedly connected with the protection ring (301), and the protection ring (301) is slidably connected to the electric guide rail (2).

9. A semiconductor material special detection device according to claim 8, characterized in that: It also includes fill-in lights (302); a plurality of fill-in lights (302) are fixedly connected to the protective ring (301), and the fill-in lights (302) are directly opposite to the position of the camera (4).

10. The semiconductor material special detection equipment according to claim 9, characterized in that: A sponge ring is arranged on the outer side of the protection ring (301).

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