Device for detecting surface flatness of semiconductor by using laser

Abstract

The invention discloses a device for detecting the surface flatness of a semiconductor by using laser, and relates to the technical field of semiconductor detection, the device comprises a base, the upper end of the base is fixedly connected with a mounting seat, the upper surface of the base is provided with a through groove, a laser emitter and a fixed seat, the laser emitter is arranged on the mounting seat, and the fixed seat is fixedly connected with the mounting seat. The fixing base is arranged on the upper surface of the base, and a transmission mechanism is arranged in the fixing base. Through the servo motor, the transmission case, the ball screw and the screw nut, the workbench can be driven to move, so that the semiconductor material above moves along the horizontal axis, the position of the laser emitter is driven to be adjusted in cooperation with the contraction of the hydraulic oil cylinder, and finally emitted laser points traverse the surface of the semiconductor. The flatness state of the semiconductor surface is judged according to the position of the laser point received by the target, the influence of machine body vibration on semiconductor flatness detection is avoided, the detection precision is high, and the working efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor detection, and in particular to a device for detecting the flatness of a semiconductor surface by using laser. Background Art

[0002] Semiconductor is a material with conductivity between conductors and insulators. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. During the production process of semiconductors, the surface flatness has a crucial impact on the performance and reliability of semiconductor devices. The uneven surface will lead to a decrease in lithography accuracy. For multi-layer semiconductor devices, the uneven surface will affect the connection quality between layers. Therefore, after grinding and polishing, it is necessary to quickly and accurately detect whether the surface has reached the expected flatness.

[0003] The task of detecting the flatness of semiconductor surfaces can be effectively completed by laser triangulation based on the principle of geometric optics. However, the existing detection equipment still has some shortcomings. A large amount of manual intervention is required during the detection process, and there are certain errors. It is not convenient to conduct comprehensive detection of semiconductors. When replacing semiconductor materials, it takes a lot of time to position and recalibrate the refraction angle between the laser emitter and the detector, which is not convenient for repeatability comparison between detection results, reducing the overall detection efficiency. In view of this, the present invention proposes a device for detecting the flatness of semiconductor surfaces using laser. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a device for detecting the flatness of a semiconductor surface using laser.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A device for detecting the surface flatness of a semiconductor using laser comprises a base, the upper end of the base is fixedly connected to a mounting seat, and the upper surface of the base is provided with a through groove;

[0007] A laser emitter, wherein the laser emitter is arranged on a mounting seat;

[0008] A fixed seat, the fixed seat is arranged on the upper surface of the base, and a transmission mechanism is arranged inside the fixed seat;

[0009] A driving mechanism, the driving mechanism is arranged at the upper end of the base and located at the end of the fixed seat, the driving mechanism includes a servo motor and a transmission box, and the output shaft of the servo motor extends into the transmission box, and the side of the transmission box away from the servo motor is connected to the transmission mechanism through a transmission rod;

[0010] A limiting mechanism is arranged on one side of the fixing seat, and the limiting mechanism cooperates with the transmission mechanism to be connected to a workbench, and the workbench is arranged above the fixing seat;

[0011] A target for receiving laser light, wherein a refraction mechanism is arranged below the target.

[0012] Preferably, the mounting seat comprises an axle seat, a hydraulic cylinder is fixedly mounted at the axis of the axle seat, a connecting block is fixedly connected to the telescopic end of the hydraulic cylinder, and the connecting block is detachably connected to the laser transmitter through a plurality of sets of bolts;

[0013] The shaft seat is arranged on the top of the support arm, and the shaft seat is rotatably connected to the side wall of the support arm, and the hydraulic cylinder is installed horizontally with the base.

[0014] Preferably, a groove is formed at the upper end of the fixing seat, and the transmission mechanism is arranged in the groove;

[0015] The transmission mechanism comprises a ball screw, a screw nut is sleeved on the ball screw, and an assembly block is fixedly connected to the screw nut.

[0016] Preferably, one end of the ball screw is rotatably connected to the inner wall of the groove formed on the fixed seat, and the other end of the ball screw is fixedly connected to the transmission rod on the transmission box;

[0017] The bottom of the assembly block contacts the inner wall of the groove formed on the fixing seat, the top of the assembly block extends out of the groove, and the top of the assembly block is connected to the lower surface of the workbench.

[0018] Preferably, the limiting mechanism comprises a guide seat, a limiting groove is provided on the top of the guide seat, a slider is provided in the limiting groove, and the width of the slider is equal to the width of the limiting groove;

[0019] The side wall of the guide seat is fixedly connected to the side wall of the fixed seat, and the length of the guide seat is smaller than the length of the fixed seat;

[0020] The top of the sliding block extends above the limiting groove, and the upper end of the sliding block is connected to the lower surface of the workbench.

[0021] Preferably, a plurality of adsorption holes are provided on the upper surface of the workbench, and the plurality of adsorption holes are all connected to the internal chamber of the workbench, and the internal chamber of the workbench is connected to a connecting pipe, and the connecting pipe corresponds to the position of the through groove on the base;

[0022] A receiving strip is embedded on the upper surface of the workbench.

[0023] Preferably, two support rods are fixedly connected to the upper surface of the base, and extension rods are fixedly connected to the tops of the two support rods, respectively, and vertical portions are relatively formed on the side walls of the two extension rods;

[0024] The target is arranged between two extension rods, and the side wall of the target is connected to the vertical part arranged on the extension rods.

[0025] Preferably, the refraction mechanism comprises a prism and a lens, and the lens is arranged below the prism;

[0026] The upper end of the prism is fixedly connected to the bottom of the target through two first connecting rods, and the upper end of the lens is fixedly connected to the bottom of the target through two second connecting rods, and the two second connecting rods are respectively arranged on both sides of the prism.

[0027] Preferably, a coating is provided on the inclined surface of the prism away from the laser emitter;

[0028] The lens is a plano-convex cylindrical mirror, and the convex surface of the lens is arranged at the top. Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. Compared with the prior art, the present invention solves the problem of incomplete detection of the surface flatness of semiconductor materials. The servo motor, transmission box, ball screw and screw nut are arranged to drive the workbench to move, so that the semiconductor material above moves along the horizontal axis, and the contraction of the hydraulic cylinder drives the position adjustment of the laser transmitter, so that the emitted laser point finally traverses the semiconductor surface. The flatness of the semiconductor surface is determined according to the position of the laser point received on the target, avoiding the influence of the machine body vibration on the semiconductor flatness detection, and the detection accuracy is high, which improves the work efficiency.

[0030] 2. Compared with the prior art, the present invention also solves the problem of taking a lot of time to reposition when replacing semiconductor materials. Through the set prism, the light emitted by the laser emitter can be refracted onto the lens below, and finally a straight line is formed under the lens, providing a reference benchmark for the subsequent placement of semiconductor materials, saving time for subsequent laser emitter angle calibration, and facilitating the replacement and detection of semiconductor materials.

[0031] 3. By setting up a receiving bar on the upper surface of the workbench to absorb the laser line refracted by the lens, the length of the placed semiconductor material can be accurately measured, providing a reference for the subsequent movement of the workbench, facilitating repeated detection or detection of multiple semiconductor materials of the same specification, reducing redundancy when moving semiconductors, and improving the efficiency of the laser point traversing the semiconductor surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is an isometric structural schematic diagram of the present invention;

[0033] Figure 2 It is a schematic diagram of the main structure of the present invention;

[0034] Figure 3 It is a structural schematic diagram of the base in the present invention;

[0035] Figure 4 for Figure 3 A schematic diagram of the structure enlargement at the center A;

[0036] Figure 5 It is a structural schematic diagram of the transmission mechanism in the present invention;

[0037] Figure 6 It is a structural schematic diagram of the workbench in the present invention;

[0038] Figure 7 It is a schematic diagram of the structure of the target in the present invention;

[0039] Figure 8 It is a schematic diagram of the explosion structure of the refraction mechanism in the present invention.

[0040] In the figure: 1. base; 11. support arm; 12. through groove; 2. mounting seat; 21. shaft seat; 22. hydraulic cylinder; 23. connecting block; 3. laser transmitter; 4. fixing seat; 41. ball screw; 42. screw nut; 43. assembly block; 5. driving mechanism; 51. servo motor; 52. transmission box; 6. limiting mechanism; 61. guide seat; 62. limiting groove; 63. slider; 7. workbench; 71. adsorption hole; 72. receiving strip; 8. target; 81. support rod; 82. extension rod; 9. refraction mechanism; 91. prism; 92. first connecting rod; 93. lens; 94. second connecting rod. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0042] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0043] Embodiment 1:

[0044] Reference Figure 1 and Figure 2 , a device for detecting the surface flatness of a semiconductor using laser, comprising a base 1, a mounting seat 2 is fixedly connected to the upper end of the base 1, and a through groove 12 is opened on the upper surface of the base 1;

[0045] A laser emitter 3, wherein the laser emitter 3 is arranged on the mounting seat 2;

[0046] A fixed seat 4, which is arranged on the upper surface of the base 1, and a transmission mechanism is arranged inside the fixed seat 4;

[0047] The driving mechanism 5 is arranged at the upper end of the base 1 and at the end of the fixing base 4. The driving mechanism 5 includes a servo motor 51 and a transmission box 52. The output shaft of the servo motor 51 extends into the transmission box 52. The side of the transmission box 52 away from the servo motor 51 is connected to the transmission mechanism through a transmission rod;

[0048] A limiting mechanism 6 is arranged on one side of the fixing seat 4, and the limiting mechanism 6 cooperates with the transmission mechanism to be connected with a workbench 7, and the workbench 7 is arranged above the fixing seat 4;

[0049] A target 8 is used to receive laser light, and a refraction mechanism 9 is arranged below the target 8 .

[0050] During the inspection, the semiconductor material is placed on the workbench 7 and connected to an external suction device through the adsorption hole 71 to generate negative pressure to fix the semiconductor material. The laser emitter 3 is started to emit a light ray to the semiconductor surface, which is reflected by the semiconductor surface and projected onto the target 8. The servo motor 51 and the hydraulic cylinder 22 are moved alternately to move the laser spot on the semiconductor surface. The offset ΔX is obtained according to the height change of the light spot received on the target 8 to determine whether the semiconductor surface is flat. The height of the protrusion or depression on the semiconductor surface can be measured in combination with the angle between the light emitted by the laser emitter 3 and the semiconductor surface.

[0051] Embodiment 2:

[0052] Different from the first embodiment, Figure 3 and Figure 4, this embodiment also has the following further contents: the mounting seat 2 includes an axle seat 21, a hydraulic cylinder 22 is fixedly installed at the axis of the axle seat 21, a connecting block 23 is fixedly connected to the telescopic end of the hydraulic cylinder 22, the connecting block 23 is detachably connected to the laser emitter 3 through multiple sets of bolts, the axle seat 21 is arranged on the top of the support arm 11, and the axle seat 21 is rotatably connected to the side wall of the support arm 11, the hydraulic cylinder 22 and the base 1 are kept horizontally installed, specifically, by rotating between the axle seat 21 and the support arm 11, the inclination angle of the laser emitter 3 at the end of the mounting seat 2 can be adjusted, so that the light emitted by the laser emitter 3 is refracted onto the target 8, and the arranged hydraulic cylinder 22 can drive the laser emitter 3 to move smoothly along the fixed axis, and adjust the position of the light spot irradiated to the surface of the semiconductor material laterally.

[0053] Reference Figure 5 A groove is provided at the upper end of the fixed seat 4, and a transmission mechanism is arranged in the groove, the transmission mechanism includes a ball screw 41, a screw nut 42 is sleeved on the ball screw 41, and a mounting block 43 is fixedly connected to the screw nut 42. One end of the ball screw 41 is rotatably connected to the inner wall of the groove provided on the fixed seat 4, and the other end of the ball screw 41 is fixedly connected to the transmission rod on the transmission box 52. The bottom of the mounting block 43 contacts the inner wall of the groove provided on the fixed seat 4, and the top of the mounting block 43 extends out of the groove, and the top of the mounting block 43 is connected to the lower surface of the workbench 7. It should be noted that after starting the servo motor 51, the servo motor 5 The output shaft of 1 drives the driving wheel inside the transmission box 52 to rotate, and driven wheels are respectively arranged on both sides of the driving wheel, which are connected by belt transmission and finally drive the two ball screws 41 on the other side of the transmission box 52 to rotate synchronously. Since the side wall of the assembly block 43 contacts the inner wall of the groove on the fixing seat 4, the assembly block 43 can limit the rotation of the screw nut 42, so that the screw nut 42 moves along the direction set by the ball screw 41. Furthermore, the assembly blocks 43 on both sides drive the upper workbench 7 to move, so as to adjust the position of the semiconductor material, and cooperate with the laser transmitter 3 to comprehensively detect the semiconductor material.

[0054] Reference Figure 3The limiting mechanism 6 includes a guide seat 61, a limiting groove 62 is provided on the top of the guide seat 61, a slider 63 is provided in the limiting groove 62, and the width of the slider 63 is equal to the width of the limiting groove 62, the side wall of the guide seat 61 is fixedly connected to the side wall of the fixed seat 4, the length of the guide seat 61 is less than the length of the fixed seat 4, the top of the slider 63 extends above the limiting groove 62, and the upper end of the slider 63 is connected to the lower surface of the workbench 7. It should be noted that when the workbench 7 moves, the sliders 63 on both sides are opened on the guide seat 61. The workbench 7 moves synchronously in the limit groove 62, relying on the support between the slider 63 and the inner wall of the limit groove 62, so as to further improve the stability of the movement of the workbench 7 and avoid the reduction of the accuracy of the semiconductor surface flatness measurement due to vibration during the detection process. Furthermore, when replacing the semiconductor, the workbench 7 moves to the end of the base 1, and the slider 63 on one side will move out of the limit groove 62. Under the guidance of the slider 63 on the other side and the assembly block 43, the external slider 63 will re-enter the limit groove 62, and will not hinder the movement of the workbench 7.

[0055] Embodiment three:

[0056] Compared with the first embodiment and the second embodiment, referring to Figure 6 A plurality of adsorption holes 71 are provided on the upper surface of the workbench 7, and the plurality of adsorption holes 71 are communicated with the internal chamber of the workbench 7. A connecting pipe is connected to the internal chamber of the workbench 7, and the connecting pipe corresponds to the position of the through groove 12 on the base 1. It should be noted that the connecting pipe is connected to the base 1 through the through groove 12, and is connected to the external suction equipment through the connecting pipe. When the semiconductor material is fixed, a negative pressure can be formed at the adsorption hole 71, thereby fixing the semiconductor material on the workbench 7. A receiving strip 72 is embedded on the upper surface of the workbench 7. Furthermore, the receiving strip 72 contacts the light emitted by the laser emitter 3 to transmit an electrical signal.

[0057] In addition, two support rods 81 are fixedly connected to the upper surface of the base 1, and extension rods 82 are fixedly connected to the tops of the two support rods 81 respectively. Vertical portions are relatively opened on the side walls of the two extension rods 82, and the target 8 is arranged between the two extension rods 82, and the side walls of the target 8 are connected to the vertical portions arranged on the extension rods 82. Specifically, the target 8 is added above the fixed seat 4 by setting the support rods 81 and the extension rods 82 to allow the workbench 7 to pass from under the target 8.

[0058] Embodiment 4:

[0059] Reference Figure 7 and Figure 8Compared with the first to third embodiments, the refraction mechanism 9 includes a prism 91 and a lens 93, and the lens 93 is arranged below the prism 91, the upper end of the prism 91 is fixedly connected to the bottom of the target 8 through two first connecting rods 92, and the upper end of the lens 93 is fixedly connected to the bottom of the target 8 through two second connecting rods 94, and the two second connecting rods 94 are respectively arranged on both sides of the prism 91, and a coating is arranged on the inclined surface of one side of the prism 91 away from the laser emitter 3, and the lens 93 is a plane convex cylindrical mirror, and the convex surface of the lens 93 is arranged on the top.

[0060] It should be noted that the adjacent side walls of the prism 91 close to the laser emitter 3 have different slopes. Combined with the coating provided on the other side wall, it can refract the light emitted by the laser emitter 3 and finally guide the light vertically downward. In addition, through the refraction effect of the lens 93 provided below, after the light passes through the convex surface of the lens 93, a straight line will be formed at the bottom of the lens 93, thereby providing a reference for the subsequent placement of semiconductor materials.

[0061] Specifically, during the inspection, the assembly block 43 drives the workbench 7 to move to the rightmost side of the base 1 to facilitate the placement of the semiconductor material to be inspected, avoid collision with the laser emitter 3 to cause damage to the equipment, and reduce safety hazards. At this time, the angle and position of the laser emitter 3 are adjusted to allow the light to irradiate the prism 91. After refraction by the prism 91 and the lens 93, a reference line can be formed on the surface of the workbench 7. One side of the semiconductor material is aligned with the reference line and placed. The initial position can be calibrated to provide a reference for subsequent repetitive inspections or placement of semiconductor products of the same specification, reducing the time for repositioning. The servo motor 51 is started to run and finally drive the workbench 7 to move to the left. At the same time, the fixed semiconductor will block the laser line from contacting the receiving strip 72 on the workbench 7. According to the interval at which the receiving strip 72 receives the light signal again, the length of the semiconductor material is measured to provide a reference for the moving stroke of the workbench 7 during inspection, shorten the time for the laser point to traverse the semiconductor surface, and improve the inspection efficiency.

[0062] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A device for detecting the flatness of a semiconductor surface using laser, characterized in that: It comprises a base (1), the upper end of the base (1) is fixedly connected to a mounting seat (2), and the upper surface of the base (1) is provided with a through groove (12); A laser emitter (3), wherein the laser emitter (3) is arranged on a mounting seat (2); A fixed seat (4), the fixed seat (4) being arranged on the upper surface of the base (1), and a transmission mechanism being arranged inside the fixed seat (4); A driving mechanism (5), the driving mechanism (5) being arranged at the upper end of the base (1) and located at the end of the fixing seat (4), the driving mechanism (5) comprising a servo motor (51) and a transmission box (52), and the output shaft of the servo motor (51) extends into the transmission box (52), and the side of the transmission box (52) away from the servo motor (51) is connected to the transmission mechanism via a transmission rod; A limiting mechanism (6) is arranged on one side of the fixed seat (4), the limiting mechanism (6) cooperates with the transmission mechanism to be connected to a workbench (7), and the workbench (7) is arranged above the fixed seat (4); A target (8) for receiving laser light, wherein a refraction mechanism (9) is arranged below the target (8).

2. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The mounting seat (2) comprises an axle seat (21), a hydraulic cylinder (22) is fixedly mounted at the axis of the axle seat (21), a connecting block (23) is fixedly connected to the telescopic end of the hydraulic cylinder (22), and the connecting block (23) is detachably connected to the laser emitter (3) via a plurality of sets of bolts; The shaft seat (21) is arranged on the top of the support arm (11), and the shaft seat (21) is rotatably connected to the side wall of the support arm (11), and the hydraulic cylinder (22) and the base (1) are installed horizontally.

3. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The upper end of the fixing seat (4) is provided with a groove, and the transmission mechanism is arranged in the groove; The transmission mechanism comprises a ball screw (41), a screw nut (42) is sleeved on the ball screw (41), and an assembly block (43) is fixedly connected to the screw nut (42).

4. The device for detecting the surface flatness of a semiconductor using laser according to claim 3, characterized in that: One end of the ball screw (41) is rotatably connected to the inner wall of a groove formed on the fixed seat (4), and the other end of the ball screw (41) is fixedly connected to a transmission rod on a transmission box (52); The bottom of the assembly block (43) contacts the inner wall of a groove formed on the fixing seat (4), the top of the assembly block (43) extends out of the groove, and the top of the assembly block (43) is connected to the lower surface of the workbench (7).

5. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The limiting mechanism (6) comprises a guide seat (61), a limiting groove (62) is provided on the top of the guide seat (61), a sliding block (63) is provided in the limiting groove (62), and the width of the sliding block (63) is equal to the width of the limiting groove (62); The side wall of the guide seat (61) is fixedly connected to the side wall of the fixed seat (4), and the length of the guide seat (61) is smaller than the length of the fixed seat (4); The top of the slider (63) extends to above the limiting groove (62), and the upper end of the slider (63) is connected to the lower surface of the workbench (7).

6. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The upper surface of the workbench (7) is provided with a plurality of adsorption holes (71), and the plurality of adsorption holes (71) are all connected to the internal chamber of the workbench (7); the internal chamber of the workbench (7) is connected to a connecting pipe, and the connecting pipe corresponds to the position of the through groove (12) on the base (1); A receiving strip (72) is embedded on the upper surface of the workbench (7).

7. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: Two support rods (81) are fixedly connected to the upper surface of the base (1), and extension rods (82) are fixedly connected to the tops of the two support rods (81), respectively, and vertical portions are formed on the side walls of the two extension rods (82) facing each other; The target (8) is arranged between two extension rods (82), and the side wall of the target (8) is connected to the vertical part arranged on the extension rod (82).

8. The device for detecting the surface flatness of a semiconductor using laser according to claim 1, characterized in that: The refraction mechanism (9) comprises a prism (91) and a lens (93), and the lens (93) is arranged below the prism (91); The upper end of the prism (91) is fixedly connected to the bottom of the target (8) via two first connecting rods (92), and the upper end of the lens (93) is fixedly connected to the bottom of the target (8) via two second connecting rods (94), and the two second connecting rods (94) are respectively arranged on both sides of the prism (91).

9. The device for detecting the surface flatness of a semiconductor using laser according to claim 8, characterized in that: A coating is provided on the inclined surface of one side of the prism (91) away from the laser emitter (3); The lens (93) is a plano-convex cylindrical mirror, and the convex surface of the lens (93) is arranged at the top.

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