Cold plate heat dissipation detection device and cold plate experiment method

Abstract

The invention relates to the technical field of detection devices, in particular to a cold plate heat dissipation detection device and a cold plate experiment method.The cold plate heat dissipation detection device comprises a cold plate body, a tool clamp, a slide glass, a dielectric material, a diamond resistor, a point heat source heating piece, a power source, a liquid cooling source and a temperature acquisition system; the slide glass, the dielectric material and the diamond resistor are combined to form a point heat source heating sheet, a power supply is mounted at a heat source at the upper end of the point heat source heating sheet, and the heat source at the upper end of the point heat source heating sheet is electrically connected with a temperature acquisition system. Whether the heat flow density of the point-shaped heat source meets the test requirement or not is calibrated, on the premise that the actual heat flow density of the point-shaped heat source meets the requirement, the shell liquid temperature rise serves as the main criterion of the heat dissipation performance of the cold plate body, whether the heat dissipation performance of the cold plate body meets the design requirement or not is tested, and the maximum heat dissipation performance of the cold plate body can be tested according to the method.

Description

Technical Field

[0001] The present invention relates to the technical field of detection devices, and in particular to a cold plate heat dissipation detection device and a cold plate test method. Background Art

[0002] The phased array radar baseplate is a typical load-bearing structure cold plate, which provides a mounting base for high-power T / R components while forcing heat dissipation. The high-power components installed on the baseplate present point heat source characteristics. When working, the heat source point emits hundreds of watts of heat power per square centimeter. The cooling medium of the cold plate is also called refrigerant, which is mostly air, water or special coolant. The cold plate is divided into air-cooled type, liquid-cooled type and phase change type according to the refrigerant; it is a hollow sheet or plate-like structure with internal support, and there are inlets and outlets for cooling gas and liquid at both ends of the plate plane.

[0003] Traditional cold plate heat dissipation performance tests mainly focus on the total heat power index under the premise of uniform heating, that is, the cold plate heat dissipation performance is tested with a flat heat source that generates heat evenly. In the past, the total heat power was used as the main index in the tests, and the temperature rise between the cooling medium and the cold plate was generally used as the evaluation index. The heat flux distribution on the test plate surface was uniform and the heat flux density was low, usually 2-5W / cm 2 At the same time, since the cold plate plane is completely covered by the heat source, the uniformity of the cold plate heat sink cannot be considered. This type of test method can no longer fully test the performance of point-like high heat flux density cold plates.

[0004] Therefore, in order to solve the problem that the traditional plane heating method cannot evaluate the heat dissipation performance of the cold plate with high heat flux density and the uniformity of the heat sink, a cold plate heat dissipation detection device and a cold plate experimental method can be designed to measure the maximum heat dissipation performance of the cold plate. Summary of the invention

[0005] In order to overcome the problem that the traditional plane heating method cannot evaluate the heat dissipation performance of the cold plate with high heat flux density and the uniformity of the heat sink.

[0006] The technical scheme of the present invention is: a cold plate heat dissipation detection device, comprising a cold plate body, a fixture, a carrier, a dielectric material, a diamond resistor, a point heat source heating plate, a power supply, a liquid cooling source and a temperature acquisition system; a fixture with inverted F-shaped jaws on both sides is arranged on the outside of the cold plate body, a carrier is installed on the upper end of the front of the cold plate body, a dielectric material is installed on the upper end of the carrier, a diamond resistor is installed on the upper end of the dielectric material, the carrier, the dielectric material and the diamond resistor are combined to form a point heat source heating plate, a power supply is installed at the heat source at the upper end of the point heat source heating plate, a coolant inlet and outlet are arranged at the diagonal top of the back of the cold plate body, a liquid cooling source is connected to the outside of the coolant inlet and outlet through a pipeline, and a temperature acquisition system is electrically connected to the heat source at the upper end of the point heat source heating plate.

[0007] Preferably, the present invention tests the heat dissipation performance of the cold plate body based on the heat flux density index, uses the actual heat brought out by the cooling medium to calibrate whether the heat flux density of the point heat source meets the test requirements, and on the premise that the actual heat flux density of the point heat source meets the requirements, uses the shell liquid temperature rise as the main criterion for the heat dissipation performance of the cold plate body to test whether the heat dissipation performance of the cold plate body meets the design requirements; according to this method, the maximum heat dissipation performance of the cold plate body can also be measured. The heat dissipation performance test of the cold plate body based on the heat flux density index solves the problem that the traditional plane heating method cannot evaluate the point high heat flux density heat dissipation performance of the cold plate body and the uniformity of the heat sink.

[0008] Preferably, a first flow meter, a first temperature sensor and a first pressure gauge are sequentially installed on a pipeline connecting a liquid outlet of the liquid cooling source and a cooling liquid inlet of the cold plate body.

[0009] Preferably, a second pressure gauge and a second temperature sensor are sequentially installed on the pipe connecting the cooling liquid outlet of the cold plate body and the return liquid port of the liquid cooling source (8).

[0010] Preferably, a temperature data acquisition device is provided inside the temperature acquisition system.

[0011] Preferably, the carrier is a 6cm*6cm aluminum diamond composite carrier, which serves as the base of the point heat source heating plate. There are 9 diamond resistors evenly distributed, and the projection size of the diamond resistor is 3mm*4mm. The maximum heating power consumption of each resistor is 300W, so its heat flux density is as high as 2500W / cm 2 , fully meet the heat flux density of not less than 500W / cm 2 In order to meet the test requirements, the dielectric materials are electroplated nickel and gold. In order to make the resistors fit firmly and withstand high-power heating, the resistor junctions on the aluminum surface are layered with nickel and gold, and then the diamond resistors are welded with gold-tin to ensure that the carrier can withstand a temperature difference of 200°C. The electrodes of the diamond resistors are also welded with silver-plated wires welded with gold-tin. The wires are uniformly connected in series and parallel to the terminals at one corner of the base. The terminals are made of 5cm high hexagonal copper columns combined with polyetheretherketone (PEEK) special engineering plastic studs, which enable the carrier to maintain high mechanical strength and excellent electrical properties at a high temperature of 300°C without producing toxic gases.

[0012] As a preference, the cold plate body is equipped with 5 carriers in total, each carrier is equipped with 9 heating plates, the projected size of the heating surface of the heating plate is 3mm*4mm, and the heating power of each heating plate is not less than 60W, so its heat flux density is not less than 500W / cm 2 The total heat generation power of the entire cold plate body is not less than 2700W.

[0013] A cold plate test method of a cold plate heat dissipation detection device, comprising a cold plate heat dissipation detection device as described above, and the steps are as follows;

[0014] Step 1: First, use the fixture to clamp and fix the cold plate body, start the liquid cooling source through the liquid cooling source controller, set the liquid cooling source coolant flow, pressure and outlet temperature according to the design indicators of the cold plate body, use the first temperature sensor to measure and record the coolant supply temperature, and use the first flow meter and the first pressure gauge to synchronously measure and record the coolant flow and pressure. The typical flow rate is 1.5L / min / kW, the outlet temperature of the liquid cooling source coolant is 25°C, and the supply pressure is not more than 0.8MPa;

[0015] Step 2: After the temperature and flow of the liquid cooling source are stable, start the power supply so that the power can supply power to the point heat source heating plate. Under the premise that the coolant density and specific heat capacity are known, the heat dissipation power of the liquid cooling can be calculated through the liquid cooling source flow Q and the inlet and outlet temperature difference of the cold plate body coolant. In the process of gradually increasing the voltage, when the heat dissipation power of the liquid cooling reaches 2700W, the heating plate reaches 500W / cm 2 The heat flux density index is measured by using an infrared imager or a thermocouple to collect the temperature value, and a data acquisition system is used to record the test data at this time, and the power supply voltage, coolant pressure, and flow rate are also recorded;

[0016] Step 3: Continue to increase the power supply voltage to make the shell temperature of the cold plate reach the maximum value of the design index, with a typical value of 85°C. The maximum heat dissipation performance of the cold plate can be obtained. Use the data acquisition system to collect and record the test data at this time, including pressure, flow rate and temperature.

[0017] Step 4: Use the second pressure gauge and the second temperature sensor to measure and record the return pressure and temperature of the coolant. Pay attention to the return temperature of the coolant, which is generally not higher than 75°C, to control the coolant from producing a gas-liquid phase change. The data that need to be collected are: the flow rate Q, temperature t1, and pressure p1 of the cold plate coolant inlet, the temperature t2 and pressure p2 of the cold plate coolant outlet, the resistance R of the hot plate resistor, the voltage U across the resistor, and the lowest temperature T of the carrier. min , maximum temperature T max；

[0018] Δp=p2-p1

[0019] Δt=t2-t1

[0020] ΔT=T max -T min

[0021] Δp is the pressure difference of the coolant flowing through the cold plate body 1, which represents the flow resistance performance of the cold plate body. Δt is the temperature rise of the coolant. ΔT=T max -T min is the shell liquid temperature rise of the cold plate body 1;

[0022] Under the premise that the coolant density ρ and specific heat capacity C are known, the heat dissipation power P of the liquid cooling can be calculated through the flow rate Q and Δt: 1， As follows:

[0023] P1=ρ*C*Q*Δt

[0024] When P1 reaches 2700W (45*60W), it can be determined that the heat flux power density of the point heat source reaches 500W / cm 2 The diamond resistor projection size is 0.12cm 2 At this time, the lowest temperature T of the slide can be measured by thermocouple or thermal imager. min , maximum temperature T max , the calculated shell liquid temperature rise ΔT of the cold plate body 1 directly represents the heat dissipation performance of the cold plate body;

[0025] The resistor terminal voltage U at this time can be calculated using the following formula to obtain the actual heating power P2 of the resistor.

[0026] P2=U 2 / R

[0027] η=P1 / P2

[0028] η is the heat dissipation efficiency of the cold plate;

[0029] ΔT and P1 are the main indicators for evaluating the performance of point-shaped high heat flux cold plates.

[0030] Preferably, the temperature range of the test environment is between 0℃ and 35℃, which needs to be kept constant, and the temperature change must not exceed ±0.5℃. The relative humidity range is between 20% and 80%. The liquid cooling source has the ability to supply liquid at a constant temperature, constant flow and constant pressure to maintain a stable liquid supply state; at the same time, its cooling capacity should be greater than the heating power of the test heat source, and there should be no other heat sources within a radius of 2 meters of the test device that affect the test accuracy.

[0031] As a preference, the cold plate body sample is heated according to the design requirements, and the power error of the power supply does not exceed ±5% of the required value;

[0032] a) Liquid supply requirements:

[0033] 1) Cooling medium: AF65 coolant;

[0034] 2) Coolant low temperature: 25℃±0.5℃;

[0035] 3) Coolant flow rate: ≮3L / min;

[0036] 4) Pressure at outlet: <0.8MPa.

[0037] b) Power supply requirements:

[0038] 1) Heating supply voltage: 0-250V;

[0039] 2) Heating power supply: ≮4kW;

[0040] 3) Control system power supply voltage: 220V;

[0041] Control system power supply: ≮3kW.

[0042] Beneficial effects of the present invention:

[0043] 1. The present invention is based on the heat flux density index of the cold plate body heat dissipation performance test, the actual heat brought out by the cooling medium is used to calibrate whether the heat flux density of the point heat source meets the test requirements, and on the premise that the actual heat flux density of the point heat source meets the requirements, the shell liquid temperature rise is used as the main criterion for the heat dissipation performance of the cold plate body to test whether the heat dissipation performance of the cold plate body 1 meets the design requirements; according to this method, the maximum heat dissipation performance of the cold plate body can also be measured. The heat dissipation performance test of the cold plate body based on the heat flux density index solves the problem that the traditional plane heating method cannot evaluate the point high heat flux density heat dissipation performance of the cold plate body and the uniformity of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 Shown is a schematic diagram of the construction principle of the cold plate heat dissipation detection device of the present invention;

[0045] Figure 2 Shown is a partial three-dimensional structural schematic diagram of a fixture in the cold plate heat dissipation detection device of the present invention;

[0046] Figure 3 What is shown is the distribution diagram of the carrier in the cold plate heat dissipation detection device of the present invention;

[0047] Figure 4 What is shown is the test data acquisition principle diagram of the cold plate heat dissipation detection device of the present invention;

[0048] Figure 5 What is shown is a simulation analysis diagram of the heat dissipation performance of a square cold plate body in the cold plate heat dissipation detection device of the present invention;

[0049] Figure 6 Shown is an infrared image of a performance test of a square cold plate body in the cold plate heat dissipation detection device of the present invention.

[0050] Explanation of the accompanying drawings: 1. Cold plate body; 2. Fixture; 3. Carrier; 4. Dielectric material; 5. Diamond resistor; 6. Point heat source heating plate; 7. Power supply; 8. Liquid cooling source; 9. Temperature acquisition system; 10. First flow meter; 11. First temperature sensor; 12. First pressure gauge; 13. Second pressure gauge; 14. Second temperature sensor; 15. Temperature data acquisition instrument. DETAILED DESCRIPTION

[0051] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0052] See also Figure 1-Figure 6 The present invention provides an embodiment: a cold plate heat dissipation detection device, comprising a cold plate body 1, a fixture 2, a carrier 3, a dielectric material 4, a diamond resistor 5, a point heat source heating plate 6, a power supply 7, a liquid cooling source 8 and a temperature acquisition system 9; a fixture 2 with inverted F-shaped clamps on both sides is provided on the outside of the cold plate body 1, a carrier 3 is installed on the upper end of the front of the cold plate body 1, a dielectric material 4 is installed on the upper end of the carrier 3, a diamond resistor 5 is installed on the upper end of the dielectric material 4, and the carrier 3, the dielectric material 4 and the diamond resistor 5 are combined to form a point heat source The heating plate 6 is provided with a power supply 7 at the upper heat source of the point heat source heating plate 6. The diagonal top of the back of the cold plate body 1 is provided with a coolant inlet and outlet. The outer side of the coolant inlet and outlet is connected to a liquid cooling source 8 through a pipeline. The upper heat source of the point heat source heating plate 6 is electrically connected to a temperature acquisition system 9. The present invention is based on the heat flux density index of the cold plate body 1 heat dissipation performance test, and the actual heat brought out by the cooling medium is used to calibrate whether the heat flux density of the point heat source meets the test requirements. On the premise that the actual heat flux density of the point heat source meets the requirements, the shell liquid temperature rise is used as the heat flux density of the point heat source. The heat dissipation performance of the cold plate body 1 is mainly judged by the heat dissipation performance of the cold plate body 1, and the heat dissipation performance of the cold plate body 1 is tested to see whether it meets the design requirements; the maximum heat dissipation performance of the cold plate body 1 can also be measured according to this method. The heat dissipation performance test of the cold plate body 1 based on the heat flux density index solves the problem that the traditional plane heating method cannot evaluate the point-shaped high heat flux density heat dissipation performance and heat sink uniformity of the cold plate body 1. The first flow meter 10, the first temperature sensor 11 and the first pressure gauge 12 are sequentially installed on the connecting pipe between the liquid outlet of the liquid cooling source 8 and the coolant inlet of the cold plate body 1. The second pressure gauge 13 and the second temperature sensor 14 are sequentially installed on the connecting pipe between the coolant outlet of the cold plate body 1 and the return liquid port of the liquid cooling source 8. A temperature data acquisition instrument 15 is provided inside the temperature acquisition system 9. The carrier 3 is a 6cm*6cm aluminum diamond composite carrier, which serves as the base of the point heat source heating plate 6. There are 9 diamond resistors 5 evenly distributed. The projected size of the diamond resistor 5 is 3mm*4mm. The maximum heat dissipation of each resistor is 300W, so its heat flux density is as high as 2500W / cm 2 , fully meet the heat flux density of not less than 500W / cm 2According to the test requirements, the dielectric material 4 is electroplated nickel and gold. In order to make the resistor fit firmly and withstand high-power heating, the resistor junction points on the aluminum surface are layered with nickel and gold, and then the diamond resistor 5 is welded with gold-tin to ensure that the carrier 3 can withstand a temperature difference of 200°C. The electrodes of the diamond resistor 5 are also welded with silver-plated wires using gold-tin welding. The wires are uniformly connected in series and parallel to the terminal at one corner of the base. The terminal uses a 5cm high hexagonal copper column combined with a polyetheretherketone (PEEK) special engineering plastic stud to keep the carrier 3 at a high temperature of 300°C. High mechanical strength and excellent electrical properties, and no toxic gas is generated. A total of 5 carriers 3 are installed on the cold plate body 1, and each carrier 3 is distributed with 9 heating plates. The projection size of the heating surface of the heating plate is 3mm*4mm, and the heating power of each heating plate is not less than 60W, so its heat flux density is not less than 500W / cm 2 , the total heating power of the entire cold plate body 1 is not less than 2700W.

[0053] A cold plate test method of a cold plate heat dissipation detection device, comprising a cold plate heat dissipation detection device as described above, and the steps are as follows;

[0054] Step 1: First, the cold plate body 1 can be clamped and fixed by using the fixture 2, and the liquid cooling source 8 is started by the liquid cooling source controller. The coolant flow, pressure and outlet temperature of the liquid cooling source 8 are set according to the design indicators of the cold plate body 1. The first temperature sensor 11 can be used to measure and record the supply temperature of the coolant, and the first flow meter 10 and the first pressure gauge 12 can be used to synchronously measure and record the coolant flow and pressure. The typical flow rate is 1.5L / min / kW, the outlet temperature of the coolant of the liquid cooling source 8 is 25°C, and the supply pressure is not more than 0.8MPa;

[0055] Step 2: After the temperature and flow of the liquid cooling source 8 are stable, start the power supply so that the power supply 7 can supply power to the point heat source heating plate 6. Under the premise that the density and specific heat capacity of the coolant are known, the heat dissipation power of the liquid cooling can be calculated through the liquid cooling source flow Q and the temperature difference between the inlet and outlet of the coolant of the cold plate body 1. In the process of gradually increasing the voltage, when the heat dissipation power of the liquid cooling reaches 2700W, the heating plate reaches 500W / cm 2 The heat flux density index is measured by using an infrared imager or a thermocouple to collect the temperature value, and a data acquisition system 9 is used to record the test data at this time, and the power supply 7 voltage, coolant pressure, and flow rate are recorded at the same time;

[0056] Step 3: Continue to increase the voltage of the power supply 7 to make the shell temperature of the cold plate body 1 reach the maximum value of the design index, and its typical value is 85° C., so as to obtain the maximum heat dissipation performance of the cold plate body 1, and use the data acquisition system 9 to collect and record the test data at this time, including pressure, flow rate and temperature;

[0057] Step 4: Use the second pressure gauge 13 and the second temperature sensor 14 to measure and record the return pressure and temperature of the coolant. Pay attention to the return temperature of the coolant, which is generally not higher than 75°C, so as to control the coolant from producing a gas-liquid phase change. The data that need to be collected include: the flow rate Q, temperature t1, and pressure p1 of the cold plate coolant inlet, the temperature t2 and pressure p2 of the cold plate coolant outlet, the resistance R of the hot plate resistor, the voltage U across the resistor, and the lowest temperature T of the carrier. min , maximum temperature T max；

[0058] Δp=p2-p1

[0059] Δt=t2-t1

[0060] ΔT=T max -T min

[0061] Δp is the pressure difference of the coolant flowing through the cold plate body 1, which characterizes the flow resistance performance of the cold plate body 1, Δt is the temperature rise of the coolant, ΔT = T max -T min is the shell liquid temperature rise of the cold plate body 1;

[0062] Under the premise that the coolant density ρ and specific heat capacity C are known, the heat dissipation power P of the liquid cooling can be calculated through the flow rate Q and Δt: 1， As follows:

[0063] P1=ρ*C*Q*Δt

[0064] When P1 reaches 2700W (45*60W), it can be determined that the heat flux power density of the point heat source reaches 500W / cm 2 The index of diamond resistor 5 is 0.12cm 2 At this time, the lowest temperature T of the slide can be measured by thermocouple or thermal imager. min , maximum temperature T max , the calculated shell liquid temperature rise ΔT of the cold plate body 1 directly represents the heat dissipation performance of the cold plate body 1;

[0065] The resistor terminal voltage U at this time can be calculated using the following formula to obtain the actual heating power P2 of the resistor.

[0066] P2=U 2 / R

[0067] η=P1 / P2

[0068] η is the heat dissipation efficiency of the cold plate;

[0069] ΔT and P1 are the main indicators for evaluating the performance of point-shaped high heat flux cold plates.

[0070] Example 1

[0071] With a load area of ​​400cm 2 Take the cold plate body 1 as an example. The cold plate body 1 is made of aviation metal material, with a total heat dissipation capacity of 2700W and a heat flux density of 500W / cm 2 The heat dissipation capacity of the point heat source, the outer dimensions of the cold plate body 1 sample are 20cm*20cm, the plate thickness is 1cm, and the inner cavity height is 0.7cm. The cold plate body 1 is convective heat transfer, and uses No. 65 aviation coolant that complies with the "GJB 6100-2007 Military Aviation Coolant Specification" as the refrigerant. The coolant inlet and outlet are located at the diagonal top of the back of the cold plate body 1.

[0072] The high-power component is installed on the front of the cold plate body 1, and the shell is in full contact with the cold plate body 1; the heat generated by the high-power component when working is absorbed and taken out by the coolant circulating in the cavity of the cold plate body 1 through the shell and the cold plate body 1; the coolant is cooled by the liquid cooling source 8 and driven to circulate. In order to stabilize the heat dissipation, it is required that the coolant has no gas-liquid phase change.

[0073] The test equipment complies with the performance requirements of various test items in GB / T8446.2 and GJB 2882-1997 series standards.

[0074] The accuracy of the instruments and test devices used to control or monitor test parameters must be qualified before the test and comply with the relevant national standards or verification procedures of the metrology department. Their accuracy should not be less than 1 / 3 of the allowable error of the test conditions.

[0075] The carrier sheet 3 is a 6cm*6cm aluminum diamond composite carrier sheet, which serves as the base of the point heat source heating sheet 6. There are 9 diamond resistors 5 evenly distributed. The projected size of the diamond resistor 5 is 3mm*4mm. The maximum heating power consumption of each resistor is 300W, so its heat flux density is as high as 2500W / cm 2 , fully meet the heat flux density of not less than 500W / cm 2 According to the test requirements, the dielectric material 4 is electroplated nickel and gold. In order to make the resistor fit firmly and withstand high-power heating, the resistor junction points on the aluminum surface are layered with nickel and gold, and then the diamond resistor 5 is welded with gold-tin to ensure that the carrier 3 can withstand a temperature difference of 200°C. The electrodes of the diamond resistor 5 are also welded with silver-plated wires using gold-tin. The wires are uniformly connected in series and parallel to the terminal at one corner of the base. The terminal uses a 5cm high hexagonal copper column combined with a polyetheretherketone (PEEK) special engineering plastic stud, so that the carrier 3 maintains high mechanical strength and excellent electrical properties at a high temperature of 300°C, and does not produce toxic gases. If it meets the requirements of "GJB 128B-2021 Test Methods for Discrete Semiconductor Devices", a T-type thermocouple can be embedded in an appropriate position on the carrier.

[0076] The cold plate body 1 is equipped with 5 carriers 3, each carrier 3 is equipped with 9 heating plates, the projected size of the heating surface of the heating plate is 3mm*4mm, and the heating power of each heating plate is not less than 60W, so its heat flux density is not less than 500W / cm 2 , the total heating power of the entire cold plate body 1 is not less than 2700W.

[0077] In order to eliminate or partially eliminate the impact of the previous test on the test sample, if necessary, the test sample needs to be pre-treated by degreasing before the test project begins. Figure 1 After setting up the test device, the test was carried out in a manner of gradually increasing the heating power. The cold plate test method steps are as follows:

[0078] Step 1: First, the cold plate body 1 can be clamped and fixed by using the fixture 2, and the liquid cooling source 8 is started by the liquid cooling source controller. The coolant flow, pressure and outlet temperature of the liquid cooling source 8 are set according to the design indicators of the cold plate body 1. The first temperature sensor 11 can be used to measure and record the supply temperature of the coolant, and the first flow meter 10 and the first pressure gauge 12 can be used to synchronously measure and record the coolant flow and pressure. In this example, it is about 4.05L / min, the outlet temperature of the coolant of the liquid cooling source 8 is 25°C, and the supply pressure is not more than 0.8MPa;

[0079] Step 2: After the temperature and flow of the liquid cooling source 8 are stable, start the power supply so that the power supply 7 can supply power to the point heat source heating plate 6. Under the premise that the density and specific heat capacity of the coolant are known, the heat dissipation power of the liquid cooling can be calculated through the liquid cooling source flow Q and the temperature difference between the inlet and outlet of the coolant of the cold plate body 1. In the process of gradually increasing the voltage, when the heat dissipation power of the liquid cooling reaches 2700W, the heating plate reaches 500W / cm 2 The heat flux density index is measured by using an infrared imager or a thermocouple to collect the temperature value, and a data acquisition system 9 is used to record the test data at this time, and the power supply 7 voltage, coolant pressure, and flow rate are recorded at the same time;

[0080] Step 3: Continue to increase the voltage of the power supply 7 to make the shell temperature of the cold plate body 1 reach the maximum value of the design index, which is a typical value of 85° C., or follow the temperature specified in 3.24 of "GJB 8481-2015 General Specification for Microwave Components", so as to obtain the maximum heat dissipation performance of the cold plate body 1, and use the data acquisition system 9 to collect and record the test data at this time, including pressure, flow rate and temperature;

[0081] Step 4: Use the second pressure gauge 13 and the second temperature sensor 14 to measure and record the return pressure and temperature of the coolant. Pay attention to the return temperature of the coolant, which is generally not higher than 75°C, so as to control the coolant from producing a gas-liquid phase change. The data that need to be collected include: the flow rate Q, temperature t1, and pressure p1 of the cold plate coolant inlet, the temperature t2 and pressure p2 of the cold plate coolant outlet, the resistance R of the hot plate resistor, the voltage U across the resistor, and the lowest temperature T of the carrier. min , maximum temperature T max；

[0082] Δp=p2-p1

[0083] Δt=t2-t1

[0084] ΔT=T max -T min

[0085] Δp is the pressure difference of the coolant flowing through the cold plate body 1, which characterizes the flow resistance performance of the cold plate body 1, Δt is the temperature rise of the coolant, ΔT = T max -T min is the shell liquid temperature rise of the cold plate body 1;

[0086] Under the premise that the coolant density ρ and specific heat capacity C are known, the heat dissipation power P of the liquid cooling can be calculated through the flow rate Q and Δt: 1， As follows:

[0087] P1=ρ*C*Q*Δt

[0088] When P1 reaches 2700W (45*60W), it can be determined that the heat flux power density of the point heat source reaches 500W / cm 2 The index of diamond resistor 5 is 0.12cm 2 At this time, the lowest temperature T of the slide can be measured by thermocouple or thermal imager. min , maximum temperature T max The calculated shell liquid temperature rise ΔT of the cold plate body 1 directly represents the heat dissipation performance of the cold plate body 1. The "GJB 8481-2015 General Specification for Microwave Components" provides a criterion for whether ΔT is qualified. The measured infrared Figure 6 shown.

[0089] The resistor terminal voltage U at this time can be calculated using the following formula to obtain the actual heating power P2 of the resistor.

[0090] P2=U 2 / R

[0091] η=P1 / P2

[0092] η is the heat dissipation efficiency of the cold plate;

[0093] ΔT and P1 are the main indicators for evaluating the performance of point-shaped high heat flux cold plates;

[0094] Among them, for the square cold plate, existing experience and simulation analysis have shown that the high temperature points are distributed at the far end where the coolant is difficult to reach, such as Figure 5 As shown, the test uses 5 point heat source slides and Figure 3 Distributed on the surface of the cold plate body 1.

[0095] The temperature range of the test environment is between 0℃ and 35℃, and a constant temperature must be maintained. The temperature change shall not exceed ±0.5℃. The relative humidity range is between 20% and 80%. The liquid cooling source 8 has the ability to supply liquid at a constant temperature, constant flow and constant pressure to maintain a stable liquid supply state. At the same time, its cooling capacity should be greater than the heating power of the test heat source. There are no other heat sources within a radius of 2 meters of the test device that affect the test accuracy. The test coolant meets the requirements of "GJB 6100-2007 Military Aviation Coolant Specifications" and is within the warranty period.

Claims

1. A cold plate heat dissipation detection device, comprising a cold plate body (1); characterized in that: The invention also comprises a fixture (2), a carrier (3), a dielectric material (4), a diamond resistor (5), a point heat source heating plate (6), a power source (7), a liquid cooling source (8) and a temperature acquisition system (9); a fixture (2) with inverted F-shaped clamps on both sides is arranged outside the cold plate body (1); a carrier (3) is installed at the upper end of the front face of the cold plate body (1); a dielectric material (4) is installed at the upper end of the carrier (3); a diamond resistor (5) is installed at the upper end of the dielectric material (4); the carrier (3), the dielectric material (4) and the diamond resistor (5) are combined to form a point heat source heating plate (6); a power source (7) is installed at the heat source at the upper end of the point heat source heating plate (6); a cooling liquid inlet and outlet are arranged at the diagonal top of the back face of the cold plate body (1); a liquid cooling source (8) is connected to the outer side of the cooling liquid inlet and outlet through a pipeline; and a temperature acquisition system (9) is electrically connected to the heat source at the upper end of the point heat source heating plate (6).

2. The cold plate heat dissipation detection device according to claim 1, characterized in that: A first flow meter (10), a first temperature sensor (11) and a first pressure gauge (12) are sequentially installed on a pipeline connecting a liquid outlet of a liquid cooling source (8) and a cooling liquid inlet of a cold plate body (1).

3. The cold plate heat dissipation detection device according to claim 2, characterized in that: A second pressure gauge (13) and a second temperature sensor (14) are sequentially installed on a pipe connecting the cooling liquid outlet of the cold plate body (1) and the liquid return port of the liquid cooling source (8).

4. The cold plate heat dissipation detection device according to claim 3, characterized in that: A temperature data acquisition device (15) is provided inside the temperature acquisition system (9).

5. The cold plate heat dissipation detection device according to claim 1, characterized in that: The carrier (3) is a 6cm*6cm aluminum diamond composite carrier, which serves as the base of the point heat source heating plate (6). Nine diamond resistors (5) are evenly distributed, and the projected size of the diamond resistors (5) is 3mm*4mm. The maximum heat dissipation of each resistor is 300W, so its heat flux density is as high as 2500W / cm 2 , fully meet the heat flux density of not less than 500W / cm 2 According to the test requirements, the dielectric material (4) is electroplated nickel and gold. In order to make the resistor fit firmly and withstand high-power heating, the resistor joints on the aluminum surface are layered with nickel and gold, and then the diamond resistor (5) is welded with gold-tin to ensure that the carrier (3) can withstand a temperature difference of 200°C. The electrodes of the diamond resistor (5) are also welded with silver-plated wires using gold-tin welding. The wires are uniformly connected in series and in parallel to the terminal at one corner of the base. The terminal uses a 5cm high hexagonal copper column combined with a polyetheretherketone (PEEK) special engineering plastic stud, so that the carrier (3) maintains high mechanical strength and excellent electrical properties at a high temperature of 300°C, and does not produce toxic gases.

6. The cold plate heat dissipation detection device according to claim 1, characterized in that: The cold plate body (1) is equipped with 5 carriers (3) in total, each carrier (3) is equipped with 9 heating plates, the projected size of the heating surface of the heating plate is 3mm*4mm, and the heating power of each heating plate is not less than 60W, so its heat flux density is not less than 500W / cm 2 The total heat generation power of the entire cold plate body (1) is not less than 2700W.

7. A cold plate test method for a cold plate heat dissipation detection device, characterized in that The device comprises a cold plate heat dissipation detection device according to claims 1-6, and the steps are as follows: Step 1: First, the cold plate body (1) can be clamped and fixed using a fixture (2), and the liquid cooling source (8) is started through a liquid cooling source controller. The cooling liquid flow, pressure and outlet temperature of the liquid cooling source (8) are set according to the design indicators of the cold plate body (1). The first temperature sensor (11) can be used to measure and record the supply temperature of the cooling liquid, and the first flow meter (10) and the first pressure gauge (12) can be used to synchronously measure and record the cooling liquid flow and pressure. The typical flow rate is 1.5L / min / kW, the outlet temperature of the cooling liquid of the liquid cooling source (8) is 25°C, and the supply pressure is not greater than 0.8MPa. Step 2: After the temperature and flow of the liquid cooling source (8) are stable, start the power supply so that the power supply (7) can supply power to the point heat source heating plate (6). Under the premise that the density and specific heat capacity of the coolant are known, the heat dissipation power of the liquid cooling can be calculated through the liquid cooling source flow Q and the temperature difference between the inlet and outlet of the coolant of the cold plate body (1). In the process of gradually increasing the voltage, when the heat dissipation power of the liquid cooling reaches 2700W, the heating plate reaches 500W / cm 2 The heat flux density index is measured by using an infrared imager or a thermocouple to collect the temperature value, and a data acquisition system (9) is used to record the test data at this time, and the power supply (7) voltage, coolant pressure, and flow rate are also recorded; Step 3: Continue to increase the voltage of the power supply (7) so that the shell temperature of the cold plate body (1) reaches the maximum value of the design index, which is typically 85° C., so as to obtain the maximum heat dissipation performance of the cold plate body (1). Use the data acquisition system (9) to collect and record the test data at this time, including pressure, flow rate and temperature; Step 4: Use the second pressure gauge (13) and the second temperature sensor (14) to measure and record the return pressure and temperature of the coolant. Pay attention to the return temperature of the coolant, which is generally not higher than 75°C, so as to control the coolant to not produce a gas-liquid phase change. The data to be collected include: the flow rate Q, temperature t1, and pressure p1 of the cold plate coolant inlet, the temperature t2 and pressure p2 of the cold plate coolant outlet, the resistance R of the hot plate resistor, the voltage U across the resistor, and the lowest temperature T of the carrier. min , maximum temperature T max； Δp=p2-p1 Δt=t2-t1 ΔT=T max -T min Δp is the pressure difference of the coolant flowing through the cold plate body (1), which represents the flow resistance performance of the cold plate body (1), Δt is the temperature rise of the coolant, ΔT=T max -T min is the shell liquid temperature rise of the cold plate body (1); Under the premise that the coolant density ρ and specific heat capacity C are known, the heat dissipation power P of the liquid cooling can be calculated through the flow rate Q and Δt: 1， As follows: P1=ρ*C*Q*Δt When P1 reaches 2700W (45*60W), it can be determined that the heat flux power density of the point heat source reaches 500W / cm 2 The diamond resistor (5) has a projection size of 0.12 cm 2 At this time, the lowest temperature T of the slide can be measured by thermocouple or thermal imager. min , maximum temperature T max , the shell liquid temperature rise ΔT of the cold plate body (1) is calculated to directly represent the heat dissipation performance of the cold plate body (1); The resistor terminal voltage U at this time can be calculated using the following formula to obtain the actual heating power P2 of the resistor. P2=U 2 / R η=P1 / P2 η is the heat dissipation efficiency of the cold plate; ΔT and P1 are the main indicators for evaluating the performance of point-shaped high heat flux cold plates.

8. The cold plate test method of the cold plate heat dissipation detection device according to claim 7, characterized in that: The temperature range of the test environment is between 0°C and 35°C, and a constant temperature must be maintained. The temperature change must not exceed ±0.5°C. The relative humidity range is between 20% and 80%. The liquid cooling source (8) has the ability to supply liquid at a constant temperature, constant flow, and constant pressure to maintain a stable liquid supply state; at the same time, its cooling capacity should be greater than the heating power of the test heat source, and there should be no other heat sources within a radius of 2 meters of the test device that affect the test accuracy.

9. The cold plate test method of the cold plate heat dissipation detection device according to claim 7, characterized in that: The cold plate body (1) sample is heated in accordance with the design requirements, and the power error of the power supply does not exceed ±5% of the required value; a) Liquid supply requirements: 1) Cooling medium: AF65 coolant; 2) Coolant low temperature: 25℃±0.5℃; 3) Coolant flow rate: ≮3L / min; 4) Pressure at outlet: <0.8MPa. b) Power supply requirements: 1) Heating supply voltage: 0-250V; 2) Heating power supply: ≮4kW; 3) Control system power supply voltage: 220V; Control system power supply: ≮3kW.

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