Detection system with heat conduction interface, electronic component detection equipment and method

Abstract

The invention provides a detection system with a heat conduction interface, electronic component detection equipment and method, a temperature controller is contacted with an electronic component to be detected, and the heat conduction interface is arranged between the temperature controller and the electronic component to be detected; the electronic component to be tested comprises a plurality of temperature sensing units. Then, the temperature controller heats or cools the electronic component to be detected at a specific temperature, and a plurality of temperature sensing units of the electronic component to be detected respectively detect the temperature of the position where the electronic component to be detected is located. Therefore, the contact condition between the temperature controller and the electronic element to be tested and the quality or aging condition of the heat conduction interface can be judged.

Description

Technical Field

[0001] The present invention relates to a detection system with a thermally conductive interface, an electronic component detection device and a method, and in particular to a system, a device and a method for detecting the quality of the thermally conductive interface between the electronic component to be detected and the detection device. Background Art

[0002] Electronic components are tested for function or characteristics before leaving the factory to ensure the quality of the product. However, during the testing process, since electronic components will generate heat, most testing equipment will be equipped with temperature control means for electronic components. For more common electronic component testing equipment with temperature control means, please refer to Figure 1 In order to highlight the importance of the thermal conductive interface, the electronic component C to be tested is presented in a central warping state.

[0003] like Figure 1 As shown, the electronic component C to be tested is accommodated in the wafer seat S, and a pressing mechanism P is used above the wafer seat S to press against the electronic component C to ensure that the electronic component C to be tested can be in complete contact with the probe in the wafer seat S. In addition, the pressing mechanism P is also provided with a temperature control means, which can cool the electronic component C to be tested. However, whether the lower surface of the pressing mechanism P and the upper surface of the electronic component C to be tested are in complete contact is extremely important for heat dissipation efficiency. The place where the two are not in contact often forms high temperature. However, both are hard planes, and it is difficult to avoid the formation of gaps.

[0004] Therefore, a thermal interface material (TIM) is often provided on the lower surface of the pressing mechanism P to fill the gap between the lower surface of the pressing mechanism P and the upper surface of the electronic component C to be tested. However, since the service life of the thermal interface material TIM is limited but difficult to detect, the aging factor of the thermal interface material TIM is often not considered until a large number of chips fail in testing due to high temperature. Therefore, how to monitor the aging degree of the thermal interface material TIM has become a major issue in the industry.

[0005] In addition to the thermal interface material TIM, the quality of the thermal interface between the pressing mechanism P and the electronic component to be tested C also includes the flatness of the contact surface and the horizontality of the placement of the pressing mechanism P, the electronic component to be tested C and the wafer holder S. However, in the prior art, there is still no mechanism to constantly detect the contact status of the three during the online operation of the testing machine. Summary of the invention

[0006] In view of this, the embodiments of the present invention provide a detection system with a thermally conductive interface, an electronic component detection device and a method, which directly use the hardware architecture of the original electronic component detection device without modifying the machine or equipment, and can instantly know the quality and aging status of the thermally conductive interface during the process of detecting the electronic component or before the detection, and can monitor the contact condition of the thermally conductive interface.

[0007] A detection system with a thermally conductive interface according to an embodiment of the present invention can be used to detect at least one electronic component to be tested, and the electronic component to be tested may include multiple temperature sensing units. The detection system may include a test socket, a temperature controller, and a controller. The test socket includes a wafer holder, which is used to accommodate the electronic component to be tested, and the wafer holder may include an electrical contact interface, which is used to electrically contact the electronic component to be tested. The temperature controller is suitable for regulating the temperature of the electronic component to be tested, and a thermally conductive interface is included between the temperature controller and the electronic component to be tested. The controller is electrically connected to the test socket and the temperature controller; wherein the controller controls the temperature controller to heat up or cool down the electronic component to be tested at a specific temperature, and detects the temperature of the position thereof through multiple temperature sensing units.

[0008] An electronic component detection method according to an embodiment of the present invention comprises the following steps: first, a temperature controller contacts the electronic component to be tested; wherein a heat-conducting interface is provided between the temperature controller and the electronic component to be tested; and the electronic component to be tested comprises a plurality of temperature sensing units. Next, the temperature controller heats up or cools down the electronic component to be tested at a specific temperature. Furthermore, the plurality of temperature sensing units of the electronic component to be tested respectively detect the temperature of the position where the electronic component is located.

[0009] An electronic component detection device according to an embodiment of the present invention includes a test seat, a pressure probe, and a controller. The test seat includes a wafer holder, which is used to accommodate the electronic component to be tested; and the wafer holder includes an electrical contact interface, which is used to electrically contact the electronic component to be tested; and the electronic component to be tested includes a plurality of temperature sensing units. The pressure probe includes a temperature controller, and the pressure probe can selectively approach or move away from the test seat. The controller electrically connects the test seat and the pressure probe. When the electronic component to be tested is accommodated in the wafer holder of the test seat, the controller controls the pressure probe to approach the test seat and contact the electronic component to be tested, and a heat-conducting interface is included between the pressure probe and the electronic component to be tested; and the controller controls the temperature controller to heat up or cool down the electronic component to be tested at a specific temperature, and detects the temperature of its position through a plurality of temperature sensing units.

[0010] In summary, according to some embodiments of the detection system with a thermal interface, the electronic component detection device and method, the temperature controller can be used to increase or decrease the temperature of the electronic component to be tested, and the temperature sensing unit of the electronic component to be tested can be used to detect the temperature. In this way, the contact condition between the thermostat and the electronic component to be tested, as well as the quality or aging of the thermal interface, can be determined through the temperature increase or decrease of the electronic component to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a cross-sectional schematic diagram of an existing electronic component testing device with temperature control means.

[0012] Figure 2 It is a cross-sectional schematic diagram of an embodiment of an electronic component detection device of the present invention.

[0013] Figure 3 It is a system architecture diagram of an embodiment of an electronic component detection device of the present invention.

[0014] Figure 4 It is a three-dimensional diagram of an embodiment of an electronic component to be tested according to the present invention.

[0015] Figure 5 4 is a graph showing the relationship between the temperature and leakage current of an electronic component to be tested in one embodiment of the present invention.

[0016] Figure 6 It is a flow chart of an embodiment of the electronic component detection method of the present invention.

[0017] Figure 7 It is a graph showing the relationship between time and temperature of the thermostat and the temperature sensing unit.

[0018] Fig. 8A The diagram is a relationship diagram between the position and temperature of a temperature sensing unit in an electronic component to be tested that exhibits a central warping shape.

[0019] Figure 8B It is a diagram showing the relationship between the position and temperature of the temperature sensing unit in the electronic component to be tested when the test socket is tilted.

[0020] Wherein, the reference numerals are:

[0021] 2: Test socket

[0022] 3: Thermostat

[0023] 4: Controller

[0024] 5: Pressure probe

[0025] 21: Wafer trough

[0026] 31: Thermal interface

[0027] 211: Electrical contact interface

[0028] C: Electronic components to be tested

[0029] Cs: Temperature sensing unit

[0030] P: Pressing mechanism

[0031] S: Wafer holder

[0032] TIM: Thermal Interface Material

[0033] S100, S110, S120, S130: Steps DETAILED DESCRIPTION

[0034] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

[0035] Please also see Figure 2 , Figure 3 ,and Figure 4 , Figure 2 is a cross-sectional schematic diagram of an embodiment of an electronic component detection device of the present invention, Figure 3 is a system architecture diagram of an embodiment of an electronic component detection device of the present invention, Figure 4 1 is a perspective view of an embodiment of an electronic component to be tested of the present invention. As shown in the figure, in one embodiment, the electronic component testing device mainly includes a test seat 2, a pressure probe 5, and a controller 4. The test seat 2 includes a wafer holder 21, which is used to accommodate an electronic component C to be tested, and an electrical contact interface 211 is provided on the bottom surface of the wafer holder 21, such as a probe, which can be used to electrically contact the contacts or solder balls on the bottom surface of the electronic component C to be tested.

[0036] Again, if Figure 4 As shown, the electronic component C to be tested includes a plurality of temperature sensing units Cs, which may be diodes distributed on the surface or inside the electronic component C to be tested, and the number may be as high as dozens or even hundreds. In one embodiment, the temperature sensing unit Cs can mainly obtain the temperature by measuring the leakage current. For further explanation, please refer to Figure 5 , which is a graph showing the relationship between the temperature and leakage current of the electronic component C to be tested in one embodiment of the present invention. Figure 5 It can be seen that when the temperature is higher, the leakage current of the diode will increase, especially after 50°C, the leakage current will increase significantly, and after 75°C, it will show a more rapid upward trend.

[0037] However, in one embodiment of the present invention, this phenomenon is used as a temperature measurement method. That is, the temperature sensing unit Cs can detect the leakage current of the diode and insert it into the relevant operation module, equation or Figure 5 The temperature at the location of each temperature sensing unit Cs is calculated by converting the temperature and leakage current relationship diagram shown in FIG.

[0038] Please also refer to Figure 2 and Figure 3In one embodiment of the present invention, the pressure probe 5 is usually disposed directly above the test seat 2 and can be raised and lowered, so it can be controlled to selectively approach or move away from the test seat 2. A thermal interface 31 is provided on the lower surface of the pressure probe 5, which can be a thermal interface material (TIM), such as an adhesive material or gel-type material including lead-tin solder (PbSn), lead-free solder, silver paste (Ag), gold, tin, gallium, indium, carbon composite material, graphite, carbon nanotubes or other suitable thermal conductive materials, and can be formed on the lower surface of the pressure probe 5 by deposition, lamination, printing, plating or any other suitable technology.

[0039] In addition, a temperature controller 3 may be provided inside the pressure probe 5, which may be a high temperature generator or a low temperature generator, for example, including but not limited to a resistive heat source, a thermoelectric cooling module (TEC), or other devices using a temperature control fluid. In one embodiment, the pressure probe 5 is mainly used to apply force to press down the electronic component C to be tested, so as to ensure that the contact on the lower surface of the electronic component C to be tested can completely electrically contact the electrical contact interface 211 on the bottom surface of the chip container 21, that is, the probe. However, the temperature controller 3 further gives the pressure probe 5 the function of temperature control of the electronic component C to be tested, such as high temperature testing, low temperature testing or heat dissipation of the electronic component C to be tested.

[0040] Furthermore, the controller 4 is electrically connected to the test socket 2 and the pressure probe 5 . The controller 4 can be a dedicated electronic machine, a desktop computer, a notebook computer, a tablet computer, an industrial computer, a server or other computer devices with data processing functions.

[0041] The following describes an electronic component detection method according to an embodiment of the present invention. Figure 2 , Figure 3 and Figure 6 , Figure 6 It is a flow chart of an embodiment of the electronic component detection method of the present invention. After the electronic component C to be tested is placed in the wafer receiving groove 21 of the test seat 2, the controller 4 controls the pressure probe 5 to descend to approach the test seat 2, and applies pressure against the electronic component C to be tested, that is, step S100. The controller 4 starts the temperature controller 3, and heats or cools the electronic component C to be tested at a specific temperature, that is, step S110. In one embodiment, the controller 4 controls the temperature controller 3 to heat the electronic component C to be tested in a transient form. For example, after the temperature controller 3 heats up from room temperature to 70°C within a specific time (several seconds), it immediately stops heating up. In order to improve the detection efficiency, in other embodiments, the temperature controller 3 can also immediately cool down.

[0042] See also Figure 7, which is a time-temperature relationship diagram of the thermostat 3 and the temperature sensing unit Cs. While the thermostat 3 is heating up, the controller 4 records a maximum temperature, a minimum temperature and the time of heating up to the maximum temperature at the location of the temperature sensing unit Cs within the specific time, i.e., step S120; however, the quality or aging of the thermal interface 31 can be known from the above-mentioned measured values.

[0043] Further explanation: Figure 7 The solid line in the middle is the temperature rise and temperature drop curve of the temperature controller 3, and the dotted line is the temperature rise and temperature drop curve detected by the temperature sensing unit Cs. It can be clearly seen from the figure that since the highest and lowest temperatures of the dotted line and the solid line are consistent, and regardless of heating or cooling, the temperature sensing unit Cs and the temperature controller 3 are at the same temperature, the temperature delay detected by the temperature sensing unit Cs is extremely short, so it can be determined that the thermal interface 31 still maintains good thermal conductivity. Finally, the formal test phase of the electronic component C to be tested can be entered, step S130, that is, the controller 4 performs functional testing, performance testing, burn-in testing or other semiconductor testing items on the electronic component C to be tested.

[0044] See also Fig. 8A , which is a relationship diagram between the position and temperature of the temperature sensing unit Cs in the electronic component C to be tested that is centrally warped. In one embodiment, in addition to detecting the quality or aging of the thermal interface 31, the contact condition between the pressure probe 5 and the electronic component C to be tested can also be known through other parameters. Fig. 8A The middle horizontal coordinate can be the position coordinate of each temperature sensing unit Cs in the cross section of the electronic component C to be tested, which can be referred to Figure 4 The ordinate of the AA segment in the figure is the temperature at that position. Fig. 8A It can be seen that the temperature at the center of the electronic component C to be tested is the lowest, which means that the contact condition is the best at this location, while the temperature at the two side ends is the highest, which means that the contact condition is not good at this location. Fig. 8A It can be determined that the center of the electronic component C to be tested is warped. The specific contact condition can be referred to Figure 1 .

[0045] See also Figure 8B , which is a diagram showing the relationship between the position and temperature of the temperature sensing unit Cs in the electronic component C to be tested when the test seat 2 is tilted; Figure 8B It can be seen that the temperature is lowest at the left end of the electronic component C to be tested and increases toward the right end, that is, the contact condition between the pressure probe 5 and the left end of the electronic component C to be tested is the best, and the contact condition is the worst at the right end. However, once this happens, it means that the left side of the test seat 2 is tilted, or the lower surface of the pressure probe 5 is uneven and shrinks upward from the left side to the right side.

[0046] In general, the present invention can realize the characteristic detection of the thermal interface 31 without changing the original hardware configuration of the detection machine. In other words, by measuring the leakage current of the internal diode through the built-in measurement mechanism of the electronic component C to be tested, the temperature can be obtained, and it can be used to judge the quality or aging of the thermal interface 31. Therefore, the machine does not need to be shut down for special detection, and the thermal interface 31 can be tested directly before detecting the electronic component C to be tested. The detection time is very short and does not consume too much waiting time, so the detection efficiency and detection yield can be greatly improved. In addition, the method of the present invention can also be used to know whether the electronic component C to be tested is deformed, or whether the detection machine has errors during installation or after a period of use.

[0047] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims

1. A detection system with a thermally conductive interface, characterized in that: Used to detect at least one electronic component to be tested, the at least one electronic component to be tested includes a plurality of temperature sensing units, and the detection system includes: A test socket, comprising a wafer containing groove, the wafer containing groove is used to contain the at least one electronic component to be tested; the wafer containing groove comprises an electrical contact interface, which is used to electrically contact the at least one electronic component to be tested; a temperature controller, which is suitable for adjusting the temperature of the at least one electronic component to be tested, and the thermal conductive interface is included between the temperature controller and the at least one electronic component to be tested; and a controller electrically connected to the test socket and the temperature controller; The controller controls the temperature controller to increase or decrease the temperature of the at least one electronic component to be tested at a specific temperature, and detects the temperature of the location of the at least one electronic component to be tested through the multiple temperature sensing units.

2. The detection system according to claim 1, characterized in that: The plurality of temperature sensing units are used to respectively detect the leakage currents of the plurality of diodes, and convert and respectively obtain the temperatures of the positions where the plurality of temperature sensing units are located.

3. The detection system according to claim 1, characterized in that: The controller controls the temperature controller to increase the temperature of at least one electronic component to be tested in a transient manner, and the controller records a maximum temperature, a minimum temperature and the time of increasing the temperature to the maximum temperature at the locations of the plurality of temperature sensing units within a specific time.

4. A method for detecting an electronic component, characterized in that: It includes the following steps: (A) a temperature controller contacts at least one electronic component to be tested, and a heat-conducting interface is provided between the temperature controller and the at least one electronic component to be tested; the at least one electronic component to be tested includes a plurality of temperature sensing units; (B) the temperature controller raises or lowers the temperature of the at least one electronic component to be tested at a specific temperature; and (C) The multiple temperature sensing units of the at least one electronic component to be tested respectively detect the temperature of the location where they are located.

5. The electronic component detection method according to claim 4, characterized in that: In the step (C), the plurality of temperature sensing units are used to respectively detect the leakage currents of the plurality of diodes, and convert and respectively calculate the temperatures at the locations where the plurality of temperature sensing units are located.

6. The electronic component detection method according to claim 4, characterized in that: In step (A), a controller controls the temperature controller to contact the at least one electronic component to be tested; in step (B), the controller controls the temperature controller to increase the temperature of the at least one electronic component to be tested in a transient manner; in step (C), the controller records a maximum temperature, a minimum temperature and the time it takes to increase the temperature to the maximum temperature at the locations of the multiple temperature sensing units within a specific time.

7. The electronic component detection method according to claim 6, characterized in that: After the step (C), a step (D) is further included, wherein the controller performs at least one of a functional test and a performance test on the at least one electronic component to be tested.

8. An electronic component testing device, characterized in that: It includes: A test socket, comprising a wafer containing groove, the wafer containing groove is used to contain at least one electronic component to be tested; the wafer containing groove comprises an electrical contact interface, which is used to electrically contact the at least one electronic component to be tested; the at least one electronic component to be tested comprises a plurality of temperature sensing units; a pressure probe, comprising a temperature controller; the pressure probe can selectively move closer to or farther from the test seat; and A controller electrically connected to the test seat and the pressure probe; When the at least one electronic component to be tested is accommodated in the wafer receiving groove of the test seat, the controller controls the pressure probe to approach the test seat and contact the at least one electronic component to be tested, and a thermal conductive interface is included between the pressure probe and the at least one electronic component to be tested; the controller controls the temperature controller to heat up or cool down the at least one electronic component to be tested at a specific temperature, and detects the temperature of the location thereof through the multiple temperature sensing units.

9. The electronic component testing device according to claim 8, characterized in that: The plurality of temperature sensing units are used to respectively detect the leakage currents of the plurality of diodes, and convert and respectively obtain the temperatures of the positions where the plurality of temperature sensing units are located.

10. The electronic component testing device according to claim 8, characterized in that: The controller controls the temperature controller to increase the temperature of at least one electronic component to be tested in a transient manner, and the controller records a maximum temperature, a minimum temperature and the time of increasing the temperature to the maximum temperature at the locations of the plurality of temperature sensing units within a specific time.

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