Silicon optical module with data center compatible with single-mode and multi-mode wiring scenes and manufacturing method of silicon optical module

Abstract

The invention relates to a silicon optical module with a data center compatible with a single-mode and multi-mode wiring scene and a manufacturing method of the silicon optical module. The silicon optical module comprises a circuit board and a single-mode and multi-mode transmitting and receiving assembly in coupling connection with the circuit board, and the single-mode and multi-mode transmitting and receiving assembly comprises a single-mode transmitting end and a multi-mode receiving end; the single-mode transmitting end comprises a single-mode guide pin frame, a single-mode insertion core, an optical fiber V-groove cover plate and a single-mode optical fiber, one end of the single-mode optical fiber is connected with the single-mode insertion core, the other end of the single-mode optical fiber is connected with the optical fiber V-groove cover plate, the multimode receiving end comprises a lens structure and a multimode optical fiber, one end of the multimode optical fiber is connected with the single-mode insertion core, and the other end of the multimode optical fiber is connected with the lens structure. The silicon optical module can simultaneously work in a single-mode wiring scene and a multi-mode wiring scene of a data center, and is high in assembly efficiency.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center and a manufacturing method thereof. Background Art

[0002] Data centers serve as transit stations for traffic exchange, and the amount of data exchange within them accounts for more than 70% of the total global data communication volume. Servers, switches, routers, and other network devices frequently exchange and communicate data. Therefore, data centers have an urgent need for high-speed communication technologies. Figure 1 The figure shows the cabling architecture of a data center with a leaf-spine structure; after the spine switch 101 and the leaf switch 102 are inserted with an optical module, they are interconnected through the optical fiber cabling 104, and the server 103 is connected to the optical module optical port of the leaf switch 102 through the optical module and optical fiber for data transmission and data exchange. For AI artificial intelligence parallel computing applications, the transmission of 400G signals requires the use of parallel eight-channel optical fibers for four-channel signal transmission and four-channel signal reception.

[0003] Since large AI models require a large number of optical modules for infrastructure construction, the fiber optic wiring in the AI ​​computer room is very cumbersome and the operation and maintenance costs are high. Generally speaking, for single-wavelength 100Gbps optical signal transmission, if the transmission distance between the spine switch 101 and the leaf switch 102 exceeds 100 meters, the fiber optic wiring 104 needs to use single-mode fiber; and multi-mode fiber is used for wiring scenarios less than 100 meters. Once the fiber optic wiring construction is completed, it is very labor-intensive to change the wiring architecture.

[0004] For 400G / 800G AI supercomputing applications, multimode optical modules based on VCSEL laser technology are generally used in multimode fiber wiring scenarios, and single-mode optical modules based on EML / silicon photonic technology are generally used in single-mode fiber wiring scenarios. Generally speaking, the two modules cannot transmit and communicate with each other in the two scenarios.

[0005] Silicon photonics technology uses silicon and silicon-based substrate materials (such as SiGe / Si, SOI, etc.) as optical media, and manufactures corresponding photonic devices and optoelectronic devices (including silicon-based light-emitting devices, modulators, detectors, optical waveguide devices, etc.) through complementary metal oxide semiconductor (CMOS) compatible integrated circuit processes, and uses these devices to emit, transmit, detect and process photons to achieve its practical application in the fields of optical communication, optical sensing, optical computing, etc. Ordinary optical modules are devices that realize photoelectric conversion, and their functions need to modulate and receive optical signals. Ordinary optical modules need to be packaged with electrical chips, optical chips, lenses, alignment components, optical fiber end faces and other devices in manufacturing, and finally achieve a high degree of integration of modulators, receivers and passive optical devices. Each device is mainly integrated through packaging technology. The silicon photonics technology used by silicon photonic modules uses CMOS technology to develop and integrate optical devices. The integration of silicon photonic module chips based on CMOS manufacturing technology is its biggest feature, and it is also the biggest difference between it and ordinary optical modules. Silicon photonic module chips use silicon wafer technology to prepare key components such as modulators and receivers on a silicon substrate using etching processes and epitaxial growth processes to achieve high integration of modulators, receivers and passive optical devices.

[0006] With the continuous iteration and improvement of silicon photonics wafer fab technology, the proportion of silicon photonics modules in single-mode optical modules has gradually increased. Silicon photonics chips are packaged into pluggable modules for mass production. Silicon photonics modulation technology was first introduced to compete with EML technology in single-wavelength 100Gbps direct modulation single-mode optical fiber communications.

[0007] At present, a considerable number of manufacturers have adopted silicon photonic solutions and shipped in batches for the two single-mode optical modules 400G DR4 and 800G DR8 used in AI computer rooms, while multi-mode wiring scenarios use 400G SR8 and 800G SR8 with VCSEL technology. Due to the different wiring application scenarios, the many advantages of silicon photonics are difficult to be reflected in multi-mode wiring scenario applications.

[0008] For optical modules that are compatible with both single-mode and multi-mode wiring scenarios, using silicon photonics technology in multi-mode fiber wiring scenarios is also a new direction of current industry research. Summary of the invention

[0009] The technical problem to be solved by the present invention is to provide a silicon optical module and a manufacturing method thereof that is compatible with single-mode and multi-mode wiring scenarios and has low transmission loss and high assembly efficiency for a data center.

[0010] In the first aspect, the technical solution adopted by the present invention is a silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center, comprising a circuit board and a single-mode and multi-mode transceiver assembly coupled to the circuit board, the single-mode and multi-mode transceiver assembly comprising a single-mode transmitting end and a multi-mode receiving end, the single-mode transmitting end comprising a single-mode pin guide frame, a single-mode ferrule connected to the single-mode pin guide frame, an optical fiber V-groove cover plate, and a single-mode optical fiber connected to the single-mode ferrule at one end and the optical fiber V-groove cover plate at the other end, the multi-mode receiving end comprising a lens structure and a multi-mode optical fiber connected to the single-mode ferrule at one end and the lens structure at the other end, the circuit board comprising an optical transmitter and an optical receiver arranged on the circuit board, the optical transmitter being used to convert an electrical signal into an optical signal, the optical receiver being used to convert an optical signal into an electrical signal, the optical fiber V-groove cover plate comprising a polished end face, the polished end face being coupled to the optical transmitter, the lens structure comprising an optical fiber card slot connected to the multi-mode optical fiber and a lens assembly located in the optical fiber card slot, the lens assembly being coupled to the optical receiver.

[0011] The beneficial effects of the present invention are as follows: a silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center is adopted, the transmitting end of the silicon photonic module is designed as a transmitting end for single-mode optical fiber transmission, and the receiving end is designed as a receiving end for multi-mode optical fiber transmission, and can work simultaneously in single-mode wiring scenarios and multi-mode wiring scenarios in a data center; the multi-mode receiving end can receive single-mode light or multi-mode light, and the optical receiving end of the silicon photonic module is designed as a receiving end for multi-mode optical fiber transmission. When single-mode light / multi-mode light enters the multi-mode optical fiber transmission in the multi-mode receiving end, its transmission loss will be greatly reduced; and in the silicon photonic module, the single-mode transmitting end uses an optical transmitter to directly couple with the polished end face of the optical fiber V-groove cover plate, eliminating a series of prism couplings in the prior art, thereby greatly improving its assembly efficiency and reducing costs.

[0012] Preferably, the optical fiber slot includes a light receiving port, the lens assembly includes a reflector located on the same optical axis as the light receiving port and a converging spherical surface for receiving light reflected by the reflector, the converging spherical surface is coupled to the optical receiver, and with this structure, single-mode light / multi-mode light is incident on the reflector through the light receiving port, is reflected by the reflector and enters the converging spherical surface, and is then converged by the converging spherical surface to the optical receiver for signal conversion. This structure can be used to receive optical signals in single-mode optical fiber wiring / multi-mode optical fiber wiring with low loss, and has a simple structure, high assembly efficiency, and low cost.

[0013] Preferably, the circuit board also includes a DSP chip arranged on the circuit board, the optical transmitter includes a silicon photonic driver chip connected to the DSP chip, a silicon photonic chip connected to the silicon photonic driver chip, and a laser connected to the silicon photonic chip, the silicon photonic chip is coupled and connected to the polished end face of the optical fiber V-groove cover plate, the DSP chip is used to process the external input electrical signal and transmit it to the silicon photonic driver chip, the silicon photonic driver chip is used to amplify the received electrical signal and transmit it to the silicon photonic chip, the laser is used to output light and couple the light into the silicon photonic chip for optical waveguide, and the silicon photonic chip is used to convert the electrical signal into an optical signal; using this structure, the electrical signal output by the switch is input to the single-mode transmitting end of the silicon photonic module, converted into a single-mode optical signal by the single-mode transmitting end and output, the structure is simple, and realizes the output of the electrical signal converted into a single-mode optical signal; the silicon photonic chip on the circuit board is directly coupled with the polished end face of the optical fiber V-groove cover plate in the single-mode transmitting end, thereby eliminating a series of prism couplings in the prior art, greatly improving its assembly efficiency and reducing costs.

[0014] Preferably, the optical receiver includes a photoelectric detection chip coupled to the converging spherical surface, and the multi-mode receiving end also includes an optical fiber bracket for supporting the multi-mode optical fiber. The photoelectric detection chip is used to convert the received optical signal into an electrical signal and transmit the electrical signal to the DSP chip. With this structure, the optical signal is converted into an electrical signal and output, thereby reducing the loss of single-mode optical transmission. The structure is simple, the assembly efficiency is high, and the cost is low.

[0015] Preferably, the lens assembly is made of PEI material; with this structure, the lens assembly made of PEI material is a high-performance plastic lens assembly, which reduces the cost while ensuring the performance.

[0016] In a second aspect, the technical solution adopted by the present invention is a method for manufacturing a silicon optical module compatible with single-mode and multi-mode wiring scenarios in a data center, the method comprising the following steps: S1, bonding one end of the single-mode optical fiber to the optical fiber V-groove cover plate by adhesive, and polishing the end surface of the optical fiber V-groove cover plate to form a polished end surface, so as to obtain a single-mode optical fiber FA assembly with a pigtail; S2. Cut the end face of one end of the bare core of the multimode optical fiber by laser and then bond it to the optical fiber slot of the lens structure by adhesive to obtain a multimode optical fiber Lens assembly with pigtail. A reflector and a converging spherical surface are arranged in the optical fiber slot. The reflector is used to receive and reflect the light emitted by the multimode optical fiber, and the converging spherical surface is used to converge the light reflected by the reflector; S3, inserting a single-mode low-loss needle guide frame into one side of the single-mode ferrule, and assembling the single-mode optical fiber FA assembly with pigtails and the pigtails of the multi-mode optical fiber Lens assembly with pigtails into the other side of the single-mode ferrule; S4, take the circuit board, and mount the DSP chip, silicon photonic driver chip, silicon photonic chip, laser, photoelectric detection chip and optical fiber bracket on the circuit board with silver glue; S5. Perform gold wire bonding on the DSP chip, silicon photonic driver chip, silicon photonic chip, laser and photoelectric detection chip on the circuit board; S6, using a power meter to power the circuit board, and making the circuit board communicate with the computer through IIC; S7, coupling the emitted light of the laser to the silicon photonic chip for optical waveguiding; S8, coupling and aligning the polished end surface of the optical fiber V-groove cover plate with the silicon photonic chip on the circuit board, and bonding the optical fiber V-groove cover plate to the circuit board using glue; S9, coupling and aligning the converging spherical surface in the lens structure with the center of the photosensitive surface of the photoelectric detection chip, and bonding the lens structure to the circuit board using glue.

[0017] The method for manufacturing a silicon photonic module that is compatible with single-mode and multi-mode wiring scenarios in a data center has high assembly efficiency and low cost. The silicon photonic module manufactured by this method can work in both single-mode and multi-mode wiring scenarios in a data center.

[0018] Preferably, the reflection angle of the reflector is set to 42.5 degrees; setting the reflection angle of the reflector to 42.5 degrees can be used to combat return loss.

[0019] Preferably, the polishing angle of the polished end face of the optical fiber V-groove cover plate is 0 degrees, with a tolerance of ±0.2 degrees; this structure is adopted to improve coupling performance.

[0020] Preferably, the cutting angle of the end face laser cutting of one end of the bare core of the multimode optical fiber is 8 degrees, with a tolerance of ±0.3 degrees. This structure is used to reduce reflection of the optical path.

[0021] Preferably, in step S3, the single-mode ferrule is polished at an angle of 8 degrees, which can help reduce reflection. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of a data center cabling architecture of a leaf-spine structure in the background technology of the present invention; Figure 2 This is a schematic diagram of the structure of a 400G silicon photonic module in the present invention; Figure 3It is a structural schematic diagram of the single-mode and multi-mode transceiver components in the present invention; Figure 4 is a schematic structural diagram of the lens structure in the present invention; Figure 5 This is a schematic diagram of the structure of the 800G silicon photonic module of the present invention; Figure 6 A schematic diagram of applying the silicon photonic module of the present invention to transmission in single-mode and multi-mode wiring scenarios; As shown in the figure: 101, spine switch; 102, leaf switch; 103, server; 104, fiber optic wiring; 201, multimode optical fiber; 202, lens structure; 2021, reflector; 2022, converging sphere; 2023, fiber optic card slot; 3, single-mode and multi-mode transceiver components; 301, single-mode ferrule; 302, single-mode guide pin holder; 303, single-mode optical fiber; 304, optical fiber V-groove cover; 3041, polished end face; 401, circuit board; 4011, package gold finger; 4012, DSP chip; 402, optical transmitter; 4021, silicon photonic driver chip; 4022, silicon photonic chip; 4023, laser; 403, optical receiver; 4031, photoelectric detection chip; 404, optical fiber bracket; 405, MPO adapter; 501, 800G silicon photonic module circuit board; 5011, 800G silicon photonic module DSP chip. DETAILED DESCRIPTION

[0023] The invention will be further described below with reference to the accompanying drawings and in combination with specific implementations, so that those skilled in the art can implement the invention with reference to the description. The protection scope of the invention is not limited to the specific implementations.

[0024] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0025] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0026] In the description of the embodiments of the present application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] The present invention relates to a silicon optical module compatible with single-mode and multi-mode wiring scenarios in a data center, such as Figure 2 The structure diagram of the silicon photonic module of 400G is shown, including a circuit board 401 and a single-mode multi-mode transceiver assembly 3 coupled to the circuit board 401, the single-mode multi-mode transceiver assembly 3 includes a single-mode transmitting end and a multi-mode receiving end, the single-mode transmitting end includes a single-mode guide pin frame 302, a single-mode ferrule 301 connected to the single-mode guide pin frame 302, an optical fiber V-groove cover plate 304, and a single-mode optical fiber 303 connected to the single-mode ferrule 301 at one end and the optical fiber V-groove cover plate 304 at the other end, the multi-mode receiving end includes a lens structure 202 and a multi-mode optical fiber 201 connected to the single-mode ferrule 301 at one end and the lens structure 202 at the other end, the circuit The circuit board 401 is a circuit board of a 400G silicon photonic module, which includes an optical transmitter 402 and an optical receiver 403 arranged on the circuit board 401. The optical transmitter 402 is used to convert a received external electrical signal into an optical signal, and the optical receiver 403 is used to convert an optical signal into an electrical signal. The optical fiber V-groove cover plate 304 includes a polished end face 3041, and the polished end face 3041 is coupled to the optical transmitter 402. The lens structure 202 includes an optical fiber card slot 2023 connected to the multi-mode optical fiber 201 and a lens assembly located in the optical fiber card slot 2023, and the lens assembly is coupled to the optical receiver 403.

[0028] like Figure 4As shown, the optical fiber slot 2023 includes an optical receiving port, the lens assembly includes a reflector 2021 located on the same optical axis as the optical receiving port and a converging spherical surface 2022 for receiving the light reflected by the reflector 2021, and the converging spherical surface 2022 is coupled and connected to the optical receiver 403. With this structure, single-mode light / multi-mode light is incident on the reflector 2021 through the optical receiving port, and enters the converging spherical surface 2022 after being reflected by the reflector 2021, and then converged by the converging spherical surface 2022 to the optical receiver 403 for signal conversion. This structure can be used to receive optical signals in single-mode optical fiber wiring / multi-mode optical fiber wiring with low loss, and has a simple structure, high assembly efficiency and low cost. In a specific embodiment, the multi-mode optical fiber 201 is selected as OM5 multi-mode optical fiber, with a core diameter of 50μm and a cladding diameter of 125μm. The reflection angle of the reflection surface of the reflector 2021 is 42.5 degrees, which is used to resist return loss. The polishing angle of the polished end face of the optical fiber V-groove cover plate 304 is 0 degrees, with a tolerance of ±0.2 degrees; the single-mode optical fiber 303 uses the bending-resistant G657B3 optical fiber. The optical fiber V-groove cover plate 304 is bonded with hard glue, and the optical fiber protection at the stripping point is soft glue.

[0029] like Figure 4 As shown, the optical receiver 403 includes a photoelectric detection chip 4031 coupled to the converging sphere 2022, and the multi-mode receiving end also includes an optical fiber bracket 404 for supporting the multi-mode optical fiber 201. The photoelectric detection chip 4031 is used to convert the received optical signal into an electrical signal and transmit the electrical signal to the DSP chip 4012; the function of the optical fiber bracket 404 is to prevent the multi-mode optical fiber from touching the gold wire and affecting the normal operation of the module.

[0030] In a specific embodiment, the PD of the photodetection chip 4031 is a PD of the InGaAs material system, with a photosensitive surface of 16 microns, a central wavelength of 1310 nm, a photoelectric bandwidth of 28 GHz, and a dark current of less than 50 nA; the photodetection chip 4031 specifically adopts a PIN-TIA chip, and the coupling responsivity of the PIN-TIA chip is greater than 0.6 A / W to obtain better sensitivity and bit error rate performance.

[0031] Figure 4In the embodiment, the optical signal with a wavelength of 1310nm emitted by the multimode optical fiber 201 is input into the optical fiber slot 2023, and the optical fiber end face of the multimode optical fiber 201 outputs divergent light, which is reflected by the reflective surface of the reflector 2021, and then converges to the surface of the photodetector through the convergent spherical surface 2022. Among them, the lens assembly in the optical fiber slot 2023 includes two optical surfaces, one is the reflective surface of the reflector 2021, and the other is the convergent spherical surface 2022, forming a reflection + convergence optical path, which plays a role in coupling the light in the multimode optical fiber 201 into the photodetector. Among them, the lens assembly is made of PEI material, and the lens assembly of PEI material is a high-performance plastic lens assembly, which reduces the cost while ensuring the performance; the present invention applies the receiving end optical path structure based on the PEI plastic lens assembly to the receiving end of the silicon optical module to form a multimode receiving end, so that the single-mode optical fiber light can enter the multi-mode optical fiber or the multi-mode optical fiber light can enter the multi-mode optical fiber, and the loss is extremely low. The structure can be used to receive the optical signal in the single-mode optical fiber wiring / multi-mode optical fiber wiring with low loss.

[0032] like Figure 2 As shown, the circuit board 401 also includes a DSP chip 4012 arranged on the circuit board 401, the optical transmitter 402 includes a silicon photonic driver chip 4021 connected to the DSP chip 4012, a silicon photonic chip 4022 connected to the silicon photonic driver chip 4021, and a laser 4023 connected to the silicon photonic chip 4022, the silicon photonic chip 4022 is coupled and connected to the polished end face 3041 of the optical fiber V-groove cover plate 304, the DSP chip 4012 is used to process the external input electrical signal and transmit it to the silicon photonic driver chip 4021, and the silicon photonic driver chip 4021 is used to amplify the received electrical signal and transmit it to the silicon photonic driver chip 4021. Optical chip 4022, the laser 4023 is used to output light and couple the light into the silicon photonic chip 4022 for optical waveguide, and the silicon photonic chip 4022 is used to convert electrical signals into optical signals; using this structure, the electrical signal output by the switch is input into the single-mode transmitting end of the silicon photonic module, and is converted into a single-mode optical signal by the single-mode transmitting end and output. The structure is simple and realizes the output of converting electrical signals into single-mode optical signals; the silicon photonic chip 4022 on the circuit board 401 is directly coupled with the polished end face 3041 of the optical fiber V-groove cover plate 304 in the single-mode transmitting end, eliminating a series of prism couplings in the prior art, greatly improving assembly efficiency and reducing costs. In a specific embodiment, the output amplitude of the silicon photonic driver chip 4021 is 3Vpp to obtain a better module extinction ratio, the light output of the silicon photonic light source optical path is greater than +17dBm, and the output power of the optical signal from the adapter is greater than 0dBm.

[0033] In the present invention, the working principle of the single-mode transmitting end of the 400G silicon photonic module is as follows: the external electrical signal is input from the switch side to the packaging gold finger 4011 of the circuit board 401 of the silicon photonic module, and then enters the DSP chip 4012. After the DSP chip 4012 performs retiming and other processing on the electrical signal, the signal is output to the silicon photonic driver chip 4021. The silicon photonic driver chip 4021 amplifies the signal of the DSP chip 4012 and loads it on the silicon photonic chip 4022. The laser 4023 is responsible for inputting continuous light into the silicon photonic chip 4022. The silicon photonic chip 4022 is responsible for converting the loaded electrical signal into an optical signal and coupling it into the single-mode optical fiber 303 in the optical fiber V-groove cover plate 304. The optical signal is then output from the adapter.

[0034] In the present invention, the working principle of the multi-mode receiving end of the 400G silicon photonic module is as follows: the optical signal received from the adapter is coupled into the photoelectric detection chip 4031 through the multi-mode optical fiber 201 and the PEI plastic lens assembly. The photoelectric detection chip 4031 is responsible for converting the optical signal into an electrical signal and amplifying it. The amplified signal is processed by the DSP chip 4012 and then output from the package gold finger 4011 to the switch.

[0035] The present invention relates to a method for manufacturing a silicon optical module compatible with single-mode and multi-mode wiring scenarios in a data center, the method comprising the following steps: S1, bonding one end of the single-mode optical fiber 303 to the optical fiber V-groove cover plate 304 by adhesive, and polishing the end surface of the optical fiber V-groove cover plate 304 to form a polished end surface 3041, thereby obtaining a single-mode optical fiber FA assembly with a pigtail; S2. After laser cutting the end face of one end of the bare core of the multimode optical fiber 201, the end is bonded to the optical fiber slot 2023 of the lens structure 202 by adhesive to obtain a multimode optical fiber Lens assembly with a pigtail, wherein a lens assembly is arranged in the optical fiber slot 2023, and the lens assembly includes a reflector 2021 and a converging spherical surface 2022, wherein the reflective surface of the reflector 2021 and the light outlet of the multimode optical fiber 201 are located on the same horizontal optical axis, and the reflective surface of the reflector 2021 and the converging spherical surface 2022 are located on the same vertical optical axis; the reflector 2021 is used to receive and reflect the light emitted by the multimode optical fiber 201, and the converging spherical surface 2022 is used to converge the light reflected by the reflector 2021; S3, insert the single-mode needle guide frame 302 into one side of the single-mode ferrule 301, and assemble the single-mode optical fiber FA assembly with pigtails and the pigtails of the multi-mode optical fiber Lens assembly with pigtails into the other side of the single-mode ferrule 301; S4, take the circuit board 401, and mount the DSP chip 4012, the silicon photonic driver chip 4021, the silicon photonic chip 4022, the laser 4023, the photoelectric detection chip 4031 and the optical fiber bracket 404 on the circuit board 401 with silver glue; in a specific embodiment, high thermal conductivity silver glue is used for mounting, and the thermal conductivity is 4W / (m·K); S5. Perform gold wire bonding on the DSP chip 4012, silicon photonic driver chip 4021, silicon photonic chip 4022, laser 4023 and photoelectric detection chip 4031 on the circuit board 401. In a specific embodiment, the length of the high-frequency gold wire of the silicon photonic driver chip 4021 and the silicon photonic chip 4022 needs to be shortened, generally controlled to 150 microns. S6, using a power meter to power the circuit board 401, and performing IIC communication between the circuit board 401 and the computer; S7, coupling the emitted light of the laser 4023 to the silicon photonic chip 4022 for optical waveguide; in a specific embodiment, a double-lens optical path coupling is adopted, and the coupling loss is less than 1.5 dB; S8, align the polished end surface of the optical fiber V-groove cover plate 304 with the silicon photonic chip 4022 on the circuit board 401, and glue the optical fiber V-groove cover plate 304 to the circuit board 401; in a specific embodiment, the light output coupling threshold of the silicon photonic chip 4022 is greater than +2dbm, and UV glue is used for pre-fixation, and the structure is reinforced with glue; S9, coupling and aligning the converging spherical surface 2022 in the lens structure 202 with the center of the photosensitive surface of the photodetection chip 4031, and bonding the lens structure 202 to the circuit board 401 with glue; in a specific embodiment, the light output coupling threshold of the converging spherical surface 2022 is greater than 0.6A / W, and UV glue is used for pre-fixation, and black glue is used for reinforcement to improve the bonding reliability; S10, finished product testing; test the emitted optical power and the electro-optical responsivity of the receiving end, confirm that the coupling value meets the design, and record the coupling value.

[0036] like Figure 6 As shown, a transmission schematic diagram of the silicon photonic module designed by the present invention is described in two wiring scenarios of single mode and multimode.

[0037] Figure 6(a) is a schematic diagram of the transmission between 800G silicon photonic modules and 400G silicon photonic modules in a multimode optical fiber wiring scenario. There are two sets of optical transmitters 402 and optical receivers 403 on the 800G silicon photonic module circuit board 501, which are interconnected with the optical transmitters 402 and optical receivers 403 in the circuit boards 401 of the two 400G silicon photonic modules through multimode optical fiber wiring. The optical signal emitted from the optical transmitter 402 of the 800G silicon photonic module enters the single-mode optical fiber 303 inside the silicon photonic module, then enters the multimode optical fiber in the multimode optical fiber wiring (single-mode into multi-mode, low transmission loss), and then enters the multimode optical fiber 201 inside the 400G silicon photonic module on the opposite side (multi-mode into multi-mode, low connector loss), and then enters the optical receiver 403 of the 400G silicon photonic module on the opposite side, realizing low-loss interconnection under multimode optical fiber wiring.

[0038] Figure 6 (b) is a schematic diagram of the transmission between 800G silicon photonic modules and 400G silicon photonic modules in the single-mode fiber wiring scenario. There are two sets of optical transmitters 402 and optical receivers 403 on the 800G silicon photonic module circuit board 501, which are interconnected with the optical transmitters 402 and optical receivers 403 in the circuit boards 401 of the two 400G silicon photonic modules through single-mode fiber wiring. The optical signal emitted from the optical transmitter 402 of the 800G silicon photonic module on this side enters the single-mode fiber 303 inside the 800G silicon photonic module, then enters the single-mode fiber in the single-mode fiber wiring (single-mode into single-mode, low connector loss), and then enters the multi-mode fiber 201 inside the 400G silicon photonic module on the other side (single-mode into multi-mode, low connector loss), and then enters the optical receiver 403 of the 400G silicon photonic module, realizing low-loss interconnection under single-mode fiber wiring.

Claims

1. The silicon optical module for data center is compatible with single and multi-mode wiring scenarios, characterized by: The invention comprises a circuit board (401) and a single-mode multimode transceiver assembly (3) coupled to the circuit board (401), wherein the single-mode multimode transceiver assembly (3) comprises a single-mode transmitting end and a multimode receiving end, wherein the single-mode transmitting end comprises a single-mode needle guide frame (302), a single-mode ferrule (301) connected to the single-mode needle guide frame (302), an optical fiber V-groove cover plate (304), and a single-mode optical fiber (303) having one end connected to the single-mode ferrule (301) and the other end connected to the optical fiber V-groove cover plate (304), wherein the multimode receiving end comprises a lens structure (202) and a multimode optical fiber (201) having one end connected to the single-mode ferrule (301) and the other end connected to the lens structure (202), wherein the The circuit board (401) comprises an optical transmitter (402) and an optical receiver (403) arranged on the circuit board (401); the optical transmitter (402) is used to convert an electrical signal into an optical signal; the optical receiver (403) is used to convert an optical signal into an electrical signal; the optical fiber V-groove cover plate (304) comprises a polished end surface (3041); the polished end surface (3041) is coupled to the optical transmitter (402); the lens structure (202) comprises an optical fiber card slot (2023) connected to the multimode optical fiber (201) and a lens assembly located in the optical fiber card slot (2023); the lens assembly is coupled to the optical receiver (403).

2. The silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 1, characterized in that: The optical fiber card slot (2023) comprises a light receiving port, and the lens assembly comprises a reflector (2021) located on the same optical axis as the light receiving port and a converging spherical surface (2022) for receiving light reflected by the reflector (2021), wherein the converging spherical surface (2022) is coupled to the optical receiver (403).

3. The silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 2 is characterized in that: The circuit board (401) further comprises a DSP chip (4012) arranged on the circuit board (401); the optical transmitter (402) comprises a silicon photonic driver chip (4021) connected to the DSP chip (4012), a silicon photonic chip (4022) connected to the silicon photonic driver chip (4021), and a laser (4023) connected to the silicon photonic chip (4022); the silicon photonic chip (4022) is coupled and connected to the polished end face of the optical fiber V-groove cover plate (304); the DSP chip (4012) is used to process an external input electrical signal and transmit it to the silicon photonic driver chip (4021); the silicon photonic driver chip (4021) is used to amplify the received electrical signal and transmit it to the silicon photonic chip (4022); the laser (4023) is used to output light and couple the light into the silicon photonic chip (4022) for optical waveguide; and the silicon photonic chip (4022) is used to convert the electrical signal into an optical signal.

4. The silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 3 is characterized in that: The multimode receiving end further comprises an optical fiber support (404) for supporting the multimode optical fiber (201), and the optical receiver (403) comprises a photoelectric detection chip (4031) coupled to the converging spherical surface (2022), and the photoelectric detection chip (4031) is used to convert the received optical signal into an electrical signal and transmit the electrical signal to the DSP chip (4012).

5. The silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 2, characterized in that: The lens assembly is made of PEI material.

6. The method for manufacturing a silicon photonic module for data center compatible with single-mode and multi-mode wiring scenarios according to any one of claims 1 to 5, characterized in that: The method comprises the following steps: S1, bonding one end of the single-mode optical fiber (303) to the optical fiber V-groove cover plate (304) by adhesive, and polishing the end surface of the optical fiber V-groove cover plate (304) to form a polished end surface (3041), thereby obtaining a single-mode optical fiber FA assembly with a pigtail; S2, cutting the end face of one end of the bare core of the multimode optical fiber (201) by laser, and bonding the end face to the optical fiber slot (2023) of the lens structure (202) by adhesive, so as to obtain a multimode optical fiber Lens assembly with a pigtail, wherein a reflector (2021) and a converging spherical surface (2022) are arranged in the optical fiber slot (2023), the reflector (2021) is used to receive and reflect the light emitted by the multimode optical fiber (201), and the converging spherical surface (2022) is used to converge the light reflected by the reflector (2021); S3, inserting a single-mode low-loss needle guide frame into one side of the single-mode ferrule (301), and assembling the single-mode optical fiber FA assembly with pigtails and the pigtails of the multi-mode optical fiber Lens assembly with pigtails into the other side of the single-mode ferrule (301); S4, taking the circuit board (401), mounting the DSP chip (4012), the silicon photonic driver chip (4021), the silicon photonic chip (4022), the laser (4023), the photoelectric detection chip (4031) and the optical fiber bracket (404) on the circuit board (401) using silver glue; S5, performing gold wire bonding on the DSP chip (4012), the silicon photonic driver chip (4021), the silicon photonic chip (4022), the laser (4023), and the photoelectric detection chip (4031) on the circuit board (401); S6, using a power meter to supply power to the circuit board (401), and establishing IIC communication between the circuit board (401) and the computer; S7, coupling the emitted light of the laser (4023) to the silicon photonic chip (4022) for optical waveguiding; S8, coupling and aligning the polished end surface of the optical fiber V-groove cover plate (304) with the silicon photonic chip (4022) on the circuit board (401), and bonding the optical fiber V-groove cover plate (304) to the circuit board (401) using glue; S9, coupling and aligning the converging spherical surface (2022) in the lens structure (202) with the center of the photosensitive surface of the photodetection chip (4031), and bonding the lens structure (202) to the circuit board (401) using glue.

7. The method for manufacturing a silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 6, characterized in that: The reflection angle of the reflector (2021) is set to 42.5 degrees.

8. The method for manufacturing a silicon optical module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 6, characterized in that: The polishing angle of the polished end surface of the optical fiber V-groove cover plate (304) is 0 degrees, with a tolerance of ±0.2 degrees.

9. The method for manufacturing a silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 6, characterized in that: The cutting angle of the end face laser cutting of one end of the bare core of the multimode optical fiber (201) is 8 degrees, with a tolerance of ±0.3 degrees.

10. The method for manufacturing a silicon photonic module compatible with single-mode and multi-mode wiring scenarios in a data center according to claim 6, characterized in that: In step S3, the single-mode ferrule (301) is polished at an angle of 8 degrees.

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