Cooling module, electronic system and control method thereof

Abstract

The invention discloses an electronic system which comprises a heat source and a cooling module. The cooling module comprises a liquid cooling assembly, and the liquid cooling assembly comprises a cooling plate and a heat conduction piece. The cold plate is provided with a fluid chamber, a thermal coupling surface and a heat dissipation surface, the fluid chamber is located between the thermal coupling surface and the heat dissipation surface, and the thermal coupling surface is thermally coupled to the heat source. The heat conducting member is thermally coupled to the cold plate, and the heat conducting member extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface. The invention further discloses a control method of the electronic system.

Description

Technical Field

[0001] The invention relates to a cooling module, an electronic system and a control method thereof. Background Art

[0002] Currently, servers use liquid cooling systems to dissipate heat from heat sources (such as CPUs). In a liquid cooling system, a cold plate is thermally coupled to a heat source, and the heat generated by the heat source is conducted to the cold plate. In this way, the coolant flowing through the cold plate can remove the heat, allowing the heat source to operate at an appropriate temperature.

[0003] Generally speaking, a valve is installed on the liquid inlet pipe connected to the cold plate to close the valve when the pipe or cold plate leaks, thereby preventing the coolant from continuing to flow into the leaking pipe and cold plate. However, after the valve is closed, the cold plate's cooling efficiency is greatly reduced due to the lack of coolant injection, and its reduced cooling efficiency is no longer sufficient to meet the cooling requirements of the heat source. Therefore, in such a situation, the temperature of the heat source may rise rapidly and it may be easily damaged. Summary of the invention

[0004] The present invention provides a cooling module, an electronic system and a control method thereof, which can provide a certain level of heat dissipation effect for a heat source even if a cold plate lacks cooling liquid injection when a valve is closed due to leakage.

[0005] An electronic system disclosed in an embodiment of the present invention includes a heat source and a cooling module. The cooling module includes a liquid cooling component, and the liquid cooling component includes a cold plate and a heat conducting component. The cold plate has a fluid chamber, a thermal coupling surface, and a heat dissipation surface, the fluid chamber is located between the thermal coupling surface and the heat dissipation surface, and the thermal coupling surface is thermally coupled to the heat source. The heat conducting component is thermally coupled to the cold plate, and the heat conducting component extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface.

[0006] Another embodiment of the present invention discloses a cooling module suitable for cooling a heat source, comprising a liquid cooling component. The liquid cooling component comprises a cold plate and a heat conductor. The cold plate has a fluid chamber, a thermal coupling surface and a heat dissipation surface, the fluid chamber is located between the thermal coupling surface and the heat dissipation surface, and the thermal coupling surface is used for thermal coupling to the heat source. The heat conductor is thermally coupled to the cold plate, and the heat conductor extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface.

[0007] Yet another embodiment of the present invention discloses a control method for an electronic system, comprising monitoring a liquid leakage detector through a module controller, and when the module controller receives a liquid leakage signal transmitted by the liquid leakage detector, the module controller closes a valve connected to a cold plate and activates an air cooling component to generate an air flow blowing toward a heat sink fin group thermally coupled to the cold plate.

[0008] According to the cooling module, electronic system and control method disclosed in the above embodiments, the heat generated by the heat source can be quickly conducted to the side of the cold plate away from the heat source by the heat conductive member thermally coupled to the cold plate, and the heat conductive member extends from the side of the cold plate adjacent to the heat coupling surface to the other side of the cold plate adjacent to the heat dissipation surface, so that the heat is evenly distributed on the entire cold plate. In this way, even when the valve is closed and the cold plate lacks coolant injection, a certain level of heat dissipation effect can still be provided to the heat source through the composite design of the cold plate and the heat conductive member.

[0009] In addition, when the module controller receives a leakage signal from the leakage detector, the module controller closes the valve connected to the cold plate and starts the air cooling component to generate an air flow configuration blowing toward the heat sink fin group thermally coupled to the cold plate. Even when the valve is closed and the cold plate lacks coolant injection, the heat generated by the heat source can be removed by air cooling, while still providing a certain level of heat dissipation effect for the heat source.

[0010] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic plan view of an electronic system disclosed according to a first embodiment of the present invention.

[0012] Figure 2 for Figure 1 A three-dimensional schematic diagram of a liquid cooling component, an air cooling component, a heat source and a supporting base.

[0013] Figure 3 for Figure 2 Schematic diagram of the exploded view of the liquid cooling component, air cooling component, heat source and support base.

[0014] Figure 4 for Figure 3 A bottom-up perspective schematic diagram of a liquid cooling assembly.

[0015] Figure 5 for Figure 2 A cross-sectional schematic diagram of a liquid cooling assembly, a heat source and a support seat.

[0016] Figure 6 for Figure 1 Block diagram of the electronic system.

[0017] Figure 7 for Figure 1 A flow chart of a control method for an electronic system.

[0018] Figure 8 for Figure 1A schematic plan view of a liquid cooling component in an electronic system leaking liquid.

[0019] Fig. 9 It is a cross-sectional schematic diagram of a liquid cooling assembly, a heat source and a supporting base disclosed according to a second embodiment of the present invention.

[0020]

Explanation of symbols

[0021] 1: Electronic system

[0022] 10: Heat Source

[0023] 20: Cooling module

[0024] 21,21a: Liquid cooling components

[0025] 211: Cold Plate

[0026] 2111: Base

[0027] 21111: Thermal coupling surface

[0028] 2112: Cover

[0029] 21121: Heat dissipation surface

[0030] 2113:Fins

[0031] 2114: Fluid Chamber

[0032] 212,212a: Heat conducting parts

[0033] 2121,2121a:Heat absorption part

[0034] 2122,2122a: Conducting part

[0035] 2123,2123a: Condensation section

[0036] 21211,21231,21211a,21221a: Capillary structure

[0037] 21221,21231a: Groove structure

[0038] 213: Liquid inlet pipe

[0039] 214: Liquid outlet pipe

[0040] 215: Heat sink fin assembly

[0041] 2151:Fin

[0042] 216: Valve

[0043] 22: Air cooling components

[0044] 23: Leakage detector

[0045] 24: Module Controller

[0046] 30: Bearing seat

[0047] 40: Motherboard

[0048] 50: Baseboard Management Controller

[0049] 60: Speed ​​sensor

[0050] G: direction of gravity

[0051] S01~S05: Steps

[0052] L: Coolant DETAILED DESCRIPTION

[0053] See also Figure 1 and Figure 2 , Figure 1 It is a schematic plan view of an electronic system disclosed according to a first embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a liquid cooling component, an air cooling component, a heat source and a supporting base.

[0054] In this embodiment, the electronic system 1 is, for example, a server system. The electronic system 1 includes a heat source 10 and a cooling module 20. In addition, the electronic system 1 may further include a carrier 30, a motherboard 40 and a baseboard management controller 50.

[0055] The heat source 10 is, for example, a chip that generates heat, such as a central processing unit or a graphics processing unit (GPU). The heat source 10 is disposed on a motherboard 40 via a support base 30. The baseboard management controller 50 is disposed on the motherboard 40 and is electrically connected to the heat source 10 via the motherboard 40. The aforementioned electrical connection between the baseboard management controller 50 and the heat source 10 means that a signal can be transmitted between the baseboard management controller 50 and the heat source 10. Similarly, the electrical connection between the two components described later also means that a signal can be transmitted between the two components.

[0056] Next, see Figures 3 to 5 . Figure 3 for Figure 2 Schematic diagram of the liquid cooling components, air cooling components, heat source and load. Figure 4 for Figure 3 A bottom-up perspective schematic diagram of a liquid cooling assembly. Figure 5 for Figure 2 A cross-sectional schematic diagram of a liquid cooling assembly, a heat source and a support seat.

[0057] The cooling module 20 includes a liquid cooling component 21. The liquid cooling component 21 includes a cold plate 211 and a plurality of heat conducting members 212. The cold plate 211 includes a base 2111 and a cover 2112 connected to each other. In addition, the cold plate 211 may also include a plurality of fins 2113. The base 2111 has a thermal coupling surface 21111, and the cover 2112 has a heat dissipation surface 21121. The base 2111 and the cover 2112 together form a fluid chamber 2114, and the fluid chamber 2114 is located between the thermal coupling surface 21111 and the heat dissipation surface 21121. The fluid chamber 2114 is used for a cooling liquid (not shown) to flow through. The fins are located in the fluid chamber 2114, and some of the fins 2113 are connected to the base 2111, while other parts of the fins 2113 are connected to the cover 2112. The thermal coupling surface 21111 of the base 2111 is thermally coupled to the heat source 10 , so that the heat energy generated by the heat source 10 is conducted to the base 2111 , the cover 2112 and the fins 2113 .

[0058] In this way, when the coolant flows through the fluid chamber 2114, it can exchange heat with the base 2111, the cover 2112 and the fins to take away the heat.

[0059] In the present embodiment, the liquid cooling assembly 21 may further include a liquid inlet pipe 213 and a liquid outlet pipe 214. The liquid inlet pipe 213 and the liquid outlet pipe 214 are respectively connected to different locations of the cold plate 211 and flow through the fluid chamber 2114. The liquid inlet pipe 213, the liquid outlet pipe 214, the cold plate 211, a pump (not shown) and a radiator (not shown) may together form a liquid cooling circuit. The pump may provide a driving force for the coolant to flow in the liquid cooling circuit, and allow the coolant to flow through the liquid inlet pipe 213 into the fluid chamber 2114 of the cold plate 211 to perform heat exchange with the base 2111, the cover 2112 and the fins 2113. After the coolant flows out of the fluid chamber 2114 of the cold plate 211, the coolant may flow to the radiator through the liquid outlet pipe 214 to cool down. In this way, the low-temperature coolant can flow back into the fluid chamber 2114 of the cold plate 211 and continue to exchange heat with the base 2111 , the cover 2112 and the fins 2113 .

[0060] These heat-conducting members 212 are, for example, heat pipes, and the thermal conductivity of these heat-conducting members 212 is, for example, but not limited to, greater than the thermal conductivity of the cold plate 211. These heat-conducting members 212 are buried in the base 2111 and the cover 2112 of the cold plate 211. The structures of these heat-conducting members 212 are the same, so only one of the heat-conducting members 212 is described in detail below. The heat-conducting member 212 is, for example, but not limited to, in a U-shape. The heat-conducting member 212 includes a heat-absorbing portion 2121, a conducting portion 2122, and a condensing portion 2123, and the heat-absorbing portion 2121 is connected to the condensing portion 2123 through the conducting portion 2122. The heat-absorbing portion 2121 is arranged on the base 2111, and the heat-absorbing portion 2121 is, for example, exposed on the thermal coupling surface 21111 of the base 2111 and thermally coupled with the heat source 10. The condensing portion 2123 is arranged on the cover 2112, and is exposed from the heat dissipation surface 21121 of the cover 2112. The conducting portion 2122 extends from the base 2111 to the cover 2112. In other words, the heat conducting member 212 extends from one side of the cold plate 211 adjacent to the thermal coupling surface 21111 to the other side of the cold plate 211 adjacent to the heat dissipation surface 21121. This helps to quickly conduct the heat generated by the heat source 10 to the side of the cold plate 211 away from the heat source 10, so that the heat is evenly distributed throughout the cold plate 211.

[0061] In the present embodiment, the heat absorbing portion 2121 and the condensing portion 2123 are, for example, not parallel to a gravity direction G. That is, the heat absorbing portion 2121 and the condensing portion 2123 have a tendency to extend horizontally or transversely. In detail, the heat absorbing portion 2121 and the condensing portion 2123 of the present embodiment are arranged horizontally and perpendicular to the gravity direction G. The interior of the heat absorbing portion 2121 and the condensing portion 2123 are respectively provided with capillary structures 21211 and 21231, and the interior of the conducting portion 2122 is provided with a groove structure 21221. After the working fluid (not shown) inside the heat conducting member 212 absorbs the heat generated by the heat source 10 and vaporizes into gas, it will flow to the condensing portion 2123 through the conducting portion 2122, and condense back into liquid in the condensing portion 2123. The capillary structure 21231 of the condensation portion 2123 , the groove structure 21221 of the conduction portion 2122 , and the capillary structure 21211 of the heat absorption portion 2121 help the working fluid condensed back into liquid to reflux, allowing the working fluid to continue to absorb the heat generated by the heat source 10 in the heat absorption portion 2121 .

[0062] It should be noted that the number of heat conductors 212 is not limited to multiple. In other embodiments, the number of heat conductors may be only one. In addition, the heat conductor 212 is not limited to the type of heat pipe as a whole. In other embodiments, the heat absorption part and the condensation part of the heat conductor may be a vapor chamber, and the conduction part is a heat pipe. Furthermore, the heat absorption part 2121 and the condensation part 2123 of the heat conductor 212 are not limited to being exposed from the thermal coupling surface 21111 and the heat dissipation surface 21121 respectively. In other embodiments, the heat absorption part and the condensation part of the heat conductor may be completely buried in the base and the cover of the cold plate, respectively, without being exposed from the thermal coupling surface and the heat dissipation surface, respectively. In another embodiment, the heat conductor may not be buried in the cold plate, but may be located on the periphery of the cold plate.

[0063] In this embodiment, the liquid cooling assembly 21 further includes a heat dissipation fin group 215, wherein a plurality of fins 2151 of the heat dissipation fin group 215 are parallel to the gravity direction G, and are directly connected and thermally coupled to the heat dissipation surface 21121 of the cover 2112 of the cold plate 211 and the condensation portion 2123 of the heat conductive member 212. In this way, the cover 2112 of the cold plate 211 and the heat conductive member 212 can conduct the heat generated by the heat source 10 to the fins 2151 of the heat dissipation fin group 215.

[0064] It should be noted that the fins 2151 of the heat sink fin group 215 are not limited to being parallel to the gravity direction G, and are not limited to being directly connected to the heat sink surface 21121 of the cover 2112 of the cold plate 211. In other embodiments, the fins of the heat sink fin group may be perpendicular to the gravity direction and not directly connected to the heat sink surface of the cover of the cold plate. In such a configuration, the heat conductor may be L-shaped and extend upward from the bottom of the cold plate through one of the sides of the cold plate and pass through the fins of the heat sink fin group. Alternatively, the heat conductor may be U-shaped and extend upward from the bottom of the cold plate through two opposite sides of the cold plate and pass through the fins of the heat sink fin group.

[0065] Next, see Figure 1 and Figure 6 , Figure 6 for Figure 1 A block diagram of an electronic system 1 is shown.

[0066] In this embodiment, the cooling module 20 may further include an air cooling component 22 . The air cooling component 22 is, for example, a fan component. The air cooling component 22 is disposed beside the heat dissipation fin assembly 215 and is used to generate airflow blowing toward the heat dissipation fin assembly 215 .

[0067] In the present embodiment, the liquid cooling component 21 may further include a valve 216, and the cooling module 20 may further include a leakage detector 23 and a module controller 24. The valve 216 is disposed on the liquid inlet pipe 213 to control whether the coolant can flow into the cold plate 211 through the liquid inlet pipe 213. The leakage detector 23 is, for example, a leakage detection rope, which is disposed around the liquid cooling component 21. For example, the leakage detector 23 surrounds the cold plate 211 and passes through the liquid inlet pipe 213 and the liquid outlet pipe 214. The module controller 24 is electrically connected to the valve 216, the leakage detector 23, the air cooling component 22 and the baseboard management controller 50. The module controller 24 may be a module installed on the mainboard 40 (e.g., a circuit board independent of the mainboard 40) or a circuit or chip integrated on the mainboard 40. Among them, in addition to transmitting signals to the air cooling component 22 (such as Figure 6 ), and can also transmit power to the air cooling component 22 (such as Figure 6 In this embodiment, the electronic system 1 may further include a rotation speed sensor 60. The rotation speed sensor 60 is, for example, electrically connected to the air cooling assembly 22 and the baseboard management controller 50. The rotation speed sensor 60 is used to measure the rotation speed of the air cooling assembly 22.

[0068] Next, the control method of the electronic system 1 will be described below. Figures 6 to 8 . Figure 7 for Figure 1 A flow chart of a control method for an electronic system. Figure 8 for Figure 1 A schematic plan view of a liquid cooling component in an electronic system 1 that is leaking liquid.

[0069] It should be noted that the following description is based on the state that the electronic system 1 is in operation, and the module controller 24 makes the valve 216 open and makes the air cooling component 22 inoperative. In other words, the cooling module 20 mainly dissipates heat from the heat source 10 in liquid cooling mode.

[0070] In the control method, first, as in step S01, the module controller 24 monitors the liquid leakage detector 23 to determine whether the liquid leakage detector 23 detects the occurrence of liquid leakage. When the liquid leakage detector 23 does not detect the occurrence of liquid leakage, the process proceeds to step S02, and the module controller 24 keeps the valve 216 in an open state, and keeps the air cooling component 22 inoperative. For example, if the liquid leakage detector 23 is a liquid leakage detection rope, when there is no liquid leakage in the liquid cooling component 21, the liquid leakage detector 23 will not be wetted by the coolant, and thus the circuit of the liquid leakage detector 23 will not be turned on. At this time, the module controller 24 will not receive the liquid leakage signal sent by the liquid leakage detector 23, and keeps the valve 216 in an open state, and keeps the air cooling component 22 inoperative.

[0071] In this embodiment, the heat conductor 212 is thermally coupled to the cold plate 211, and the heat conductor 212 extends from one side of the cold plate 211 adjacent to the thermal coupling surface 21111 to the other side of the cold plate 211 adjacent to the heat dissipation surface 21121, so that the heat generated by the heat source 10 can be quickly conducted to the side of the cold plate 211 away from the heat source 10, so that the heat is evenly distributed throughout the cold plate 211. In the computer simulation results of whether a simple cold plate is provided with a heat conductor in the liquid cooling mode, compared with the cold plate without a heat conductor, the cold plate 211 of this embodiment provided with a heat conductor 212 can reduce the thermal resistance value from 0.06C / W to 0.032C / W. In this way, the heat exchange efficiency between the cooling liquid flowing through the cold plate 211 and the cold plate 211 can be improved, so that the cooling liquid can take away more heat.

[0072] In step S01, when the liquid leakage detector 23 detects a liquid leakage, the process proceeds to step S03, where the module controller 24 closes the valve 216 and activates the air cooling assembly 22 to generate airflow toward the heat sink fin assembly 215 thermally coupled to the cold plate 211. Figure 8 As shown, when the liquid cooling component 21 leaks, for example, when the cooling liquid L leaks from the damaged part of the liquid inlet pipe 213 or the liquid outlet pipe 214, leaks from the connection between the liquid inlet pipe 213 (or the liquid outlet pipe 214) and the cold plate 211, or leaks from the damaged part of the cold plate 211, the leaked cooling liquid L, for example, wets the leakage detector 23, so that the circuit in the leakage detector 23 is turned on, and a leakage signal (for example, a 3-volt signal) is generated. After the leakage detector 23 transmits the leakage signal to the module controller 24, the module controller 24 closes the valve 216, and, for example, uses a 3-volt enable signal to start the air cooling component 22, so that the cooling module 20 now changes to the air cooling mode to dissipate heat for the heat source 10.

[0073] In this embodiment, the heat conductor 212 can quickly conduct the heat generated by the heat source 10 to the side of the cold plate 211 away from the heat source 10, so that the heat is evenly distributed on the entire cold plate 211. In this way, when the valve 216 connected to the cold plate 211 is closed due to leakage, even if the cold plate 211 lacks the injection of coolant, it can still provide a certain level of heat dissipation effect for the heat source 10.

[0074] In addition, the heat conductive member 212 is thermally coupled to the cold plate 211, and the heat conductive member 212 extends from one side of the cold plate 211 adjacent to the thermal coupling surface 21111 to the other side of the cold plate 211 adjacent to the heat dissipation surface 21121. When the valve 216 connected to the cold plate 211 is closed due to leakage, the heat can be quickly transferred to the heat dissipation fin group 215 thermally coupled to the heat dissipation surface 21121. For example, from the computer simulation results in the air cooling mode, compared with the configuration in which the cold plate is provided with a heat dissipation fin group but no heat conductive member, the configuration in which the cold plate 211 of the present embodiment is provided with the heat conductive member 212 and the heat dissipation fin group 215 can reduce the thermal resistance value from 0.28C / W to 0.13C / W. In this way, the large heat dissipation area of ​​the heat dissipation fin group 215 can be effectively utilized to help dissipate the heat generated by the heat source 10.

[0075] Furthermore, when the module controller 24 receives the leakage signal sent by the leakage detector 23, the module controller 24 closes the valve 216 connected to the cold plate 211 and starts the air cooling component 22 to generate an air flow configuration blowing toward the heat sink fin group 215 thermally coupled to the cold plate 211. The heat conducted to the cold plate 211 and the heat sink fin group 215 can be taken away by forced convection, thereby further improving the heat dissipation effect on the heat source 10.

[0076] On the other hand, since the valve 216 and the air cooling assembly 22 are both controlled by the module controller 24, the module controller 24 can simultaneously close the valve 216 and start the air cooling assembly 22. Therefore, in the case where a leak occurs and the heat source 10 cannot continue to be cooled by water cooling, the heat source 10 can still be immediately cooled by a compromised air cooling method, thereby providing a certain level of cooling effect to the heat source 10. In this way, even if the baseboard management controller 50 that controls various electronic components requires a period of time to process the operation of the heat source 10 (reduce the frequency or shut down), the heat source 10 can still be cooled by air cooling first, thereby preventing the heat source 10 from being damaged due to excessive temperature.

[0077] It should be noted that the air cooling assembly 22 is an optional component. In other embodiments, the cooling module may not have an air cooling assembly. When the valve connected to the cold plate is closed due to leakage, the cooling module can remove the heat by natural convection. In addition, the heat sink fin group 215 is also an optional component. In other embodiments, the liquid cooling assembly may not have a heat sink fin group.

[0078] Next, the control method will be described. After step S03, step S04 is entered, and the rotation speed of the air-cooling component 22 is measured by the rotation speed sensor 60 to sense a rotation speed information. Then, step S05 is entered, and the baseboard management controller 50 reduces the power of the heat source 10 or stops the operation of the heat source 10 according to the rotation speed information. For example, after the air-cooling component 22 starts to operate, the rotation speed sensor 60 will transmit the measured rotation speed information of the air-cooling component 22 to the baseboard management controller 50. Then, the baseboard management controller 50 will compare the rotation speed information with a predetermined threshold. If the rotation speed information is greater than or equal to the predetermined threshold, it means that the air-cooling component 22 is operating normally and can still dissipate heat from the heat source 10 by forced convection, so the baseboard management controller 50 only performs frequency reduction processing on the heat source 10. On the contrary, if the rotation speed information is less than the predetermined threshold, it means that the air cooling component 22 is not operating normally or even malfunctioning. At this time, there is no liquid cooling or air cooling method to dissipate the heat source 10, so the baseboard management controller 50 stops the operation of the heat source 10 to prevent the heat source 10 from being damaged due to over-high temperature.

[0079] It should be noted that the aforementioned steps S04 and S05 are optional steps. In other embodiments, the control method may not include steps S04 and S05.

[0080] Next, see Fig. 9 , Fig. 9 It is a cross-sectional schematic diagram of a liquid cooling assembly, a heat source and a supporting base disclosed according to a second embodiment of the present invention.

[0081] The liquid cooling assembly 21a, heat source 10 and support seat 30 of this embodiment are similar to the liquid cooling assembly 21, heat source 10 and support seat 30 of the previous embodiment. The difference between this embodiment and the previous embodiment mainly lies in the configuration direction of the liquid cooling assembly, heat source and support seat and the structural configuration inside the heat conductor. Therefore, the following mainly describes the differences, and the similarities are not repeated.

[0082] In the present embodiment, the liquid cooling component 21a, the heat source 10 and the supporting base 30 are arranged in an upright manner, and the heat absorbing portion 2121a and the condensing portion 2123a of the heat conducting member 212a of the liquid cooling component 21a are not perpendicular to the gravity direction G, for example. In other words, the heat absorbing portion 2121a and the condensing portion 2123a tend to extend vertically or upward. In detail, the heat absorbing portion 2121a and the condensing portion 2123a of the heat conducting member 212a of the present embodiment extend from the conducting portion 2122a in a direction that is parallel to but opposite to the gravity direction G. The heat absorbing part 2121a and the conducting part 2122a of the heat conducting member 212a are provided with capillary structures 21211a and 21221a, and the capillary force of the capillary structure 21211a of the heat absorbing part 2121a of the heat conducting member 212a is greater than the capillary force of the capillary structure 21221a of the conducting part 2122. A groove structure 21231a is provided inside the condensing part 2123a of the heat conducting member 212a. The groove structure 21231a of the condensing part 2123a of the heat conducting member 212a can help the working fluid (not shown) condensed back into liquid to flow to the conducting part 2122a along the gravity direction G. The capillary structure 21221a of the conducting part 2122a of the heat conducting member 212a can help the working fluid condensed back into liquid to flow to the heat absorbing part 2121a along the horizontal direction (perpendicular to the gravity direction G). The large capillary force provided by the capillary structure 21211a of the heat absorbing portion 2121a of the heat conductive element 212a can help the working fluid condensed back into liquid to flow upward against gravity.

[0083] According to the cooling module, electronic system and control method disclosed in the above embodiments, the heat conductive element is thermally coupled to the cold plate, and the heat conductive element extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface. The heat conductive element can quickly conduct the heat generated by the heat source to the side of the cold plate away from the heat source, so that the heat is evenly distributed throughout the cold plate. In this way, when the valve connected to the cold plate is closed due to leakage, even if the cold plate lacks the injection of coolant, a certain level of heat dissipation effect can still be provided to the heat source through the composite design of the cold plate and the heat conductive element.

[0084] In addition, the heat conducting member is thermally coupled to the cold plate, and the heat conducting member extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface. When the valve connected to the cold plate is closed due to liquid leakage, the heat can be quickly conducted to the heat dissipation fin group thermally coupled to the heat dissipation surface. In this way, the large heat dissipation area of ​​the heat dissipation fin group can be effectively utilized to help dissipate the heat generated by the heat source.

[0085] Furthermore, when the module controller receives a leakage signal from the leakage detector, the module controller closes the valve connected to the cold plate and starts the air cooling component to generate an air flow configuration blowing toward the heat sink fin group thermally coupled to the cold plate. The heat conducted to the cold plate and the heat sink fin group can be removed by forced convection, thereby further improving the heat dissipation effect on the heat source.

[0086] On the other hand, since both the valve and the air cooling component are controlled by the module controller, the module controller can close the valve and start the air cooling component at the same time. Therefore, in the case where a leak occurs and the heat source cannot be cooled by water cooling, the compromise air cooling method can be immediately used to cool the heat source, giving the heat source a certain level of cooling effect. In this way, even if the baseboard management controller that controls various electronic components needs a period of time to deal with the operation of the heat source (reduce the frequency or shut down), the heat source can still be cooled by air cooling first, which can prevent the heat source from being damaged due to excessive temperature.

[0087] In addition, since the heat conductor can quickly conduct the heat generated by the heat source to the side of the cold plate away from the heat source, the heat can be evenly distributed throughout the cold plate. Therefore, in liquid cooling mode, the heat exchange efficiency between the coolant flowing through the cold plate and the cold plate can be improved, allowing the coolant to take away more heat.

Claims

1. An electronic system, characterized in that: Include: a heat source; and A cooling module, comprising: A liquid cooling assembly, comprising: a cold plate having a fluid chamber, a thermal coupling surface and a heat dissipation surface, wherein the fluid chamber is located between the thermal coupling surface and the heat dissipation surface, and the thermal coupling surface is thermally coupled to the heat source; as well as A heat conducting member is thermally coupled to the cold plate, and the heat conducting member extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface.

2. The electronic system according to claim 1, characterized in that: The heat conducting member is embedded in the cold plate.

3. The electronic system according to claim 1, characterized in that: The cold plate includes a base and a cover that are connected to each other, the base and the cover together form the fluid chamber, the thermal coupling surface is located on the base, the heat dissipation surface is located on the cover, the heat conductive component includes a heat absorbing part, a conducting part and a condensing part, the heat absorbing part is connected to the condensing part through the conducting part, the heat absorbing part is arranged on the base, the condensing part is arranged on the cover, and the conducting part extends from the base to the cover.

4. The electronic system according to claim 3, characterized in that: The heat absorption part and the condensation part are not parallel to a gravity direction, a capillary structure is respectively arranged inside the heat absorption part and the condensation part, and a groove structure is arranged inside the conduction part.

5. The electronic system according to claim 3, characterized in that: The heat absorption part and the condensation part are not perpendicular to a gravity direction, and a capillary structure is respectively provided inside the heat absorption part and the conduction part. The capillary force of the capillary structure of the heat absorption part is greater than the capillary force of the capillary structure of the conduction part, and a groove structure is provided inside the condensation part.

6. The electronic system according to claim 1, characterized in that: The liquid cooling assembly further includes a heat dissipation fin group, and the heat dissipation fin group is thermally coupled to the heat dissipation surface of the cold plate.

7. The electronic system according to claim 6, characterized in that: The cooling module further comprises an air cooling component, which is arranged beside the heat dissipation fin group and used for generating an air flow blowing toward the heat dissipation fin group.

8. The electronic system according to claim 7, characterized in that: The cooling module also includes a liquid leakage detector and a module controller. The liquid cooling component also includes a liquid inlet pipe, a valve and a liquid outlet pipe. The liquid inlet pipe and the liquid outlet pipe are respectively connected to different locations of the cold plate. The valve is arranged on the liquid inlet pipe. The liquid leakage detector is arranged around the cold plate. The module controller is electrically connected to the valve, the liquid leakage detector and the air cooling component. The module controller is used to close the valve and start the air cooling component when receiving a liquid leakage signal transmitted by the liquid leakage detector.

9. The electronic system according to claim 8, characterized in that: It also includes a mainboard, a baseboard management controller and a speed sensor. The heat source and the baseboard management controller are arranged on the mainboard. The baseboard management controller is electrically connected to the module controller. The speed sensor is electrically connected to the baseboard management controller and is used to measure the speed of the air cooling component to generate a speed information. After receiving the liquid leakage signal transmitted by the module controller, the baseboard management controller is used to reduce the power of the heat source or stop the operation of the heat source according to the speed information.

10. A cooling module, characterized in that: Suitable for cooling a heat source, comprising: A liquid cooling assembly, comprising: a cold plate having a fluid chamber, a thermal coupling surface and a heat dissipation surface, wherein the fluid chamber is located between the thermal coupling surface and the heat dissipation surface, and the thermal coupling surface is used for thermal coupling to the heat source; as well as A heat conducting member is thermally coupled to the cold plate, and the heat conducting member extends from one side of the cold plate adjacent to the thermal coupling surface to the other side of the cold plate adjacent to the heat dissipation surface.

11. The cooling module according to claim 10, characterized in that: The heat conducting member is embedded in the cold plate.

12. The cooling module according to claim 10, characterized in that: The cold plate includes a base and a cover that are connected to each other, the base and the cover together form the fluid chamber, the thermal coupling surface is located on the base, the heat dissipation surface is located on the cover, the heat conductive component includes a heat absorbing part, a conducting part and a condensing part, the heat absorbing part is connected to the condensing part through the conducting part, the heat absorbing part is arranged on the base, the condensing part is arranged on the cover, and the conducting part extends from the base to the cover.

13. The cooling module according to claim 12, characterized in that: The heat absorption part and the condensation part are not parallel to a gravity direction, a capillary structure is respectively arranged inside the heat absorption part and the condensation part, and a groove structure is arranged inside the conduction part.

14. The cooling module according to claim 12, characterized in that: The heat absorption part and the condensation part are not perpendicular to a gravity direction, and a capillary structure is respectively provided inside the heat absorption part and the conduction part. The capillary force of the capillary structure of the heat absorption part is greater than the capillary force of the capillary structure of the conduction part, and a groove structure is provided inside the condensation part.

15. The cooling module according to claim 10, characterized in that: The liquid cooling assembly further includes a heat dissipation fin group, and the heat dissipation fin group is thermally coupled to the heat dissipation surface of the cold plate.

16. The cooling module according to claim 15, characterized in that: The invention also comprises an air cooling component, which is arranged beside the heat dissipation fin group and used for generating an air flow blowing toward the heat dissipation fin group.

17. The cooling module according to claim 16, characterized in that: It also includes a liquid leakage detector and a module controller. The liquid cooling component also includes a liquid inlet pipe, a valve and a liquid outlet pipe. The liquid inlet pipe and the liquid outlet pipe are respectively connected to different locations of the cold plate. The valve is arranged on the liquid inlet pipe. The liquid leakage detector is arranged around the cold plate. The module controller is electrically connected to the valve, the liquid leakage detector and the air cooling component. The module controller is used to close the valve and start the air cooling component when receiving a liquid leakage signal from the liquid leakage detector.

18. The cooling module according to claim 10, characterized in that: The thermal conductivity of the heat conducting member is greater than the thermal conductivity of the cold plate.

19. A control method for an electronic system, characterized in that: Include: Monitoring a leak detector via a module controller; and When the module controller receives a leakage signal from the leakage detector, the module controller closes a valve connected to a cold plate and starts an air cooling component to generate airflow blowing toward a heat sink fin group thermally coupled to the cold plate.

20. The control method according to claim 19, characterized in that: After the step of closing the valve connected to the cold plate and starting the air cooling component, the method further comprises: Measuring the rotation speed of the air cooling component by a rotation speed sensor to sense rotation speed information; and A baseboard management controller reduces the power of a heat source thermally coupled to the cold plate or stops the operation of the heat source according to the rotation speed information.

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