A multi-size wafer automatic loading and unloading device

Abstract

The present invention discloses a multi-size wafer automatic loading and unloading device, including a workbench, a loading and unloading track structure and a mounting frame are provided on the workbench, the loading and unloading track structure is located between a wafer loading and loading assembly and a wafer unloading and loading assembly, and a loading and unloading gripper assembly is installed on the mounting frame, the loading and unloading gripper assembly grabs a multi-size wafer loading tray loaded with wafers to be processed in the wafer loading and loading assembly, drives it to move along the loading and unloading track structure to a transfer loading position for loading operation, or grabs a multi-size wafer loading tray loaded with processed wafers at the transfer loading position and moves it to the wafer unloading and loading assembly for unloading operation, and a transfer assembly grabs the multi-size wafer loading tray, drives the multi-size wafer loading tray to transfer between the transfer loading position and the processing positioning assembly. The device can automatically and synchronously load, process and unload wafers of different specifications and sizes, reduces equipment cost and is simple to operate.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to an automatic loading and unloading device for wafers of multiple sizes. Background Art

[0002] Wafers are the basic materials for manufacturing semiconductor chips. Before the wafers are precisely cut and processed, laser polishing is required to improve the surface quality and flatness of the wafers. At present, the automatic loading and unloading systems involved in the wafer manufacturing process on the market are mainly composed of wafer handling robots, wafer loading boxes, etc., or a complete set of EFFM (semiconductor equipment front-end module) system equipment. However, the existing wafer handling robots, wafer loading boxes and EFFM system equipment are all standard purchased parts. The operation of assembling them into wafer processing equipment is relatively cumbersome and complicated. In addition, these automatic loading and unloading systems are also limited by the fixed specifications and sizes of wafer handling robots and wafer loading boxes. They can only automatically load and unload wafers of a single specification and size, and cannot be applied to wafers of different sizes at the same time. Wafers of different sizes need to be equipped with corresponding wafer handling robots and wafer loading systems of different specifications. The prices of wafer handling robots and wafer loading systems themselves are relatively expensive, which is not conducive to batch equipment cost control and batch production. Summary of the invention

[0003] In order to solve the problem that an existing set of equipment cannot be simultaneously suitable for automatic loading and unloading of wafers of different sizes and specifications, the present invention provides an automatic loading and unloading device for multi-size wafers, which realizes automatic and synchronous loading, processing and unloading operations of wafers of different sizes and specifications, reduces equipment costs, is simple to operate, and is suitable for large-scale industrial production.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention provides a multi-size wafer automatic loading and unloading device, which is suitable for ultrafast laser polishing equipment of hard and brittle materials, so that the surface of the material can be polished to nanometer-level precision. The multi-size wafer automatic loading and unloading device comprises a workbench, and the left and right sides of the workbench are respectively provided with a wafer loading and loading assembly and a wafer unloading and loading assembly in which a plurality of multi-size wafer loading trays can be positioned and installed. The multi-size wafer loading trays can carry and install wafers of different sizes;

[0006] The workbench is provided with a loading and unloading track structure and a mounting frame, the loading and unloading track structure is located between the wafer loading and loading assembly and the wafer unloading and loading assembly, and the mounting frame is provided with a loading and unloading gripper assembly, the loading and unloading gripper assembly grabs out a multi-size wafer loading tray loaded with wafers to be processed in the wafer loading and loading assembly, drives the multi-size wafer loading tray to move along the loading and unloading track structure to the transfer loading position for loading operation, or grabs the multi-size wafer loading tray loaded with processed wafers at the transfer loading position and moves it to the wafer unloading and loading assembly for unloading operation;

[0007] A processing positioning component for clamping and positioning a multi-size wafer loading tray is provided on the side of the loading and unloading rail structure, and a transfer component is installed on the mounting frame. The transfer component grabs the multi-size wafer loading tray and drives the multi-size wafer loading tray to transfer its position between the transfer loading site and the processing positioning component.

[0008] Using the above technical solution:

[0009] A multi-size wafer loading tray can be used with wafers of different sizes for load limiting. Since the structure of the multi-size wafer loading tray is fixed, the structures of the loading and unloading gripper components, wafer loading and unloading components, transfer components, etc. used with it are also fixed. There is no need for frequent adjustments based on the size of the wafers, thereby reducing the overall cost of the equipment. During operation, a multi-size wafer loading tray (loaded with wafers to be processed) is equipped inside the wafer loading and unloading assembly. The multi-size wafer loading tray loaded with wafers to be processed in the wafer loading and unloading assembly is grabbed out by the loading and unloading gripper assembly, and the multi-size wafer loading tray is driven to move along the loading and unloading track structure to the transfer loading position for loading operation. At this time, the transfer assembly grabs the multi-size wafer loading tray loaded with wafers to be processed, and drives the multi-size wafer loading tray to be transferred to the processing positioning assembly. The multi-size wafer loading tray is clamped and positioned by the processing positioning assembly to facilitate the subsequent laser polishing of the upper end faces of the wafers to be processed in the multi-size wafer loading tray. During the laser polishing process, the loading operation is performed again by the loading and unloading gripper assembly to grab another multi-size wafer loading tray loaded with wafers to be processed from the wafer loading and unloading assembly and move it along the loading and unloading track structure. The structure moves to the transfer loading position. After the laser polishing process is completed, the transfer component is controlled to work, and the multi-size wafer loading tray loaded with polished wafers at the processing positioning component is swapped with the multi-size wafer loading tray loaded with wafers to be processed at the transfer loading position. At this time, the wafers to be processed located at the processing positioning component are subjected to laser polishing processing. At the same time, the multi-size wafer loading tray loaded with processed wafers at the transfer loading position is grabbed and transferred to the wafer unloading loading component by the loading and unloading gripper component, and then the multi-size wafer loading tray loaded with wafers to be processed is grabbed from the wafer loading and loading component and transferred to the transfer loading position, starting a new round of loading and unloading process. The loading, processing and unloading processes in the present invention are smoother and more coherent, the path design is reasonable, the working efficiency is higher, and the operation is simple, which is suitable for large-scale industrial production.

[0010] Furthermore, the multi-size wafer loading tray includes a loading tray body in a disc shape, a loading cavity is opened on the upper surface of the loading tray body, the loading cavity includes a center limit groove and a plurality of annular step limit grooves, the center limit groove is opened at the center position of the upper surface of the loading tray body, and is adapted to the wafer of the smallest size for load-bearing and limiting, a plurality of annular step limit grooves with diameters gradually increasing from the inside to the outside are arranged concentrically on the outer side of the center limit groove, the upper end surface heights of the plurality of annular step limit grooves gradually increase from the inside to the outside, and the plurality of annular step limit grooves are respectively adapted to and installed with wafers of different sizes for load-bearing and limiting, a lifting groove is opened at the bottom of the loading cavity and runs through it from top to bottom, a lifting rod is movably extended upward from the lifting groove, and the lifting rod lifts the wafer upward from the loading cavity.

[0011] Specifically, according to the conventional size specifications of the wafer (2 inches, 3 inches, 4 inches, 5 inches, 6 inches, and 8 inches), a center limit groove and a plurality of annular step limit grooves of different heights are set accordingly, which can correspond to the load-limiting of wafers of different sizes. For example, when the wafer to be processed is 2 inches, it can be loaded and limited in the center limit groove; when the wafer to be processed is 8 inches, it can be loaded and limited in the outermost annular step limit groove. The annular step limit groove has a certain width, and the outer edge of the lower end face of the wafer contacts the outermost annular step limit groove, thereby realizing the support and loading limit function for the 8-inch wafer, and facilitating the subsequent polishing processing of the upper end face of the wafer and other operations. Since the structure of the multi-size wafer loading tray is fixed, the structures of the loading and unloading gripper assembly, wafer loading and unloading loading assembly, transfer assembly, etc. used therewith are also fixed, and there is no need for frequent adjustments according to the size specifications of the wafer, thereby reducing the overall cost of the equipment. In addition, a lifting groove running through the bottom of the loading chamber is opened from top to bottom. By controlling the lifting rod to move upward through the lifting groove, the lifting rod contacts the lower end surface of the wafer, and the wafer after polishing is lifted upward from the loading chamber, which is convenient for subsequent removal of the wafer, realizing the automatic unloading operation of the wafer, simple operation, and avoiding contact with the polished surface of the wafer.

[0012] Furthermore, one end of the lifting groove is located at the edge of the central limiting groove, and the other end of the lifting groove extends outward to the outermost annular step limiting groove.

[0013] In order to improve the efficiency of the lifting operation, the lifting groove is extended from the central limit groove to the outermost annular step limit groove, and the lifting rod is matched with the size and shape of the lifting groove. By controlling the lifting rod to pass upward from the lifting groove, it is ensured that the top of the lifting rod can contact the bottom surface of various wafers of different sizes loaded in the loading chamber, and various wafers of different sizes can be smoothly lifted upward from the loading chamber. There is no need to set up multiple lifting operation positions at different locations according to the size specifications of the wafers, which simplifies the specific structure and process of the lifting operation and improves the operating efficiency of the lifting operation.

[0014] Furthermore, a plurality of lifting grooves are provided, and a plurality of lifting grooves are radially distributed and extend in the radial direction at the bottom of the loading cavity.

[0015] In order to facilitate the subsequent wafer retrieval operation, preferably, multiple lifting slots are evenly opened, and multiple corresponding lifting rods are passed through the lifting slots. The multiple lifting rods are in contact with the lower end surface (non-processing surface) of the wafer and are evenly distributed, so that the wafer is lifted upward horizontally, which is convenient for the subsequent wafer retrieval operation. In specific applications, only one lifting slot can be set to lift one side of the wafer for subsequent retrieval operations.

[0016] Specifically, a lifting and picking device is also provided for use with a multi-size wafer loading tray. The lifting and picking device includes a lifting rod, a lifting platform and a lifting cylinder. The lifting rod matches the shape and size of the lifting slot. Lifting rods are respectively provided one by one below the lifting slot. The lifting rods are mounted on the lifting platform. The lifting cylinder is connected to the lifting platform driving, which drives the lifting rod to move upward and pass through the corresponding lifting slot to lift the wafer upward from the loading chamber. Due to factors such as cost and convenient storage, the thickness of the multi-size wafer loading tray is relatively thin, and the lifting and retrieving device is relatively large, and it is impossible to install it inside the multi-size wafer loading tray. Therefore, the lifting and retrieving device is set separately. When the lifting operation is required, the multi-size wafer loading tray is transferred to the top of the lifting and retrieving device, and the lifting cylinder drives multiple lifting rods to extend upward from the corresponding lifting slots synchronously. The lifting rods contact the lower end surface (non-processing surface) of the wafer and lift the wafer upward horizontally, which is convenient for subsequent wafer retrieval operations and avoids contact with the polished surface (upper end surface) of the wafer during the wafer retrieval process. The degree of automation is high.

[0017] Furthermore, first protruding structures extending outward are formed on opposite sides of the outer side of the loading tray body, a wafer loading box is installed inside the wafer loading assembly and the wafer unloading assembly, and a plurality of plug-in grooves are formed on the inner wall of the wafer loading box from top to bottom, and the first protruding structure of the multi-size wafer loading tray can be movably plugged into the corresponding plug-in groove.

[0018] Specifically, the wafer loading assembly and the wafer unloading assembly have the same structure, and include an outer shell, an opening is provided on one side of the outer shell facing the loading and unloading track structure, an openable door is provided on the front of the outer shell, a loading box fixing frame is provided inside the outer shell, and multiple groups of plug-in slots are provided on the front and rear sides of the wafer loading box from top to bottom, and the two first protruding structures of the multi-size wafer loading tray can be movably plugged into the corresponding plug-in slots on the front and rear sides, so as to realize the storage of the multi-size wafer loading trays, and the wafer loading box is provided with an opening on one side facing the loading and unloading track structure, so as to facilitate the loading and unloading gripper assembly to grab the multi-size wafer loading tray loaded with the wafers to be processed from the wafer loading box, or to put the multi-size wafer loading tray loaded with the processed wafers into the wafer loading box. In addition, the loading box fixing frame is connected to the vertically arranged screw motor assembly, which controls the wafer loading box to be lifted up or lowered, so as to facilitate the loading or unloading operation.

[0019] Furthermore, when the loading and unloading gripper assembly grabs the multi-size wafer loading tray and moves along the loading and unloading track structure, the two first protruding structures of the multi-size wafer loading tray respectively contact and slide with the two loading and unloading tracks in the loading and unloading track structure.

[0020] Specifically, the loading and unloading rail structure includes two L-shaped loading and unloading rails arranged side by side. When the loading and unloading gripper assembly grabs the multi-size wafer loading tray and moves along the loading and unloading rail structure, the first protruding structures on both sides of the multi-size wafer loading tray respectively contact and slide with the loading and unloading rails to play a supporting and guiding limiting role.

[0021] Furthermore, second protruding structures extending outward are formed on other two opposite sides of the outer side of the loading tray, and the loading and unloading gripper assembly clamps the second protruding structures to grab the multi-size wafer loading tray and move the position.

[0022] The two second protruding structures serve as clamping sites for cooperating with the loading and unloading gripper assembly, making it convenient for the loading and unloading gripper assembly to grasp multi-size wafer loading trays.

[0023] The first protruding structure and the second protruding structure may be the same or different. In a specific embodiment, the first protruding structure and the second protruding structure are both parallel protruding structures, but the protruding portion of the first protruding structure is longer, and the thickness of the first protruding structure is less than the thickness of the multi-size wafer loading tray, so that the first protruding structure has a better contact and matching effect with the plug-in slot on the inner side wall of the wafer loading box.

[0024] Furthermore, the processing positioning component is located directly in front of the transfer loading position of the loading and unloading rail structure, and the transfer component includes a rotating drive component, a first connecting plate, a lifting drive component, a second connecting plate, a suction cup fixing frame and a suction cup. The rotating drive component is installed on the mounting frame, and the driving end of the rotating drive component is installed with a first connecting plate of a U-shaped structure, and the two side arms of the first connecting plate are respectively installed with lifting drive components, and the driving end of the lifting drive component is connected to the suction cup fixing frame through the second connecting plate, and a plurality of suction cups are installed on the lower end surface of the suction cup fixing frame.

[0025] Specifically, the suction cup fixing frame is a cross structure, and the suction cups are installed on the lower end surfaces of the four ends of the suction cup fixing frame. When working, the suction cups are adsorbed on the edge of the upper end surface of the multi-size wafer loading tray through vacuum negative pressure, and the multi-size wafer loading tray is sucked up and then transported to a specific location before being unloaded. The rotary drive component uses a DD motor, and the lifting drive component uses a slide cylinder. The lifting drive component drives the suction cups on the two suction cup fixing frames to move downward and respectively suck the multi-size wafer loading plate loaded with polished wafers at the processing positioning component and the multi-size wafer loading plate loaded with wafers to be processed at the transfer loading site, and then rises through the lifting drive component, and then the rotary drive component is controlled to rotate to drive the two suction cup fixing frames and suction cups connected to it to rotate, and the rotary drive component is controlled to rotate 180 degrees, and then descended through the lifting drive component, and the multi-size wafer loading plate loaded with polished wafers at the processing positioning component and the multi-size wafer loading plate loaded with wafers to be processed at the transfer loading site are interchanged, and then the suction cups are controlled to release the vacuum and move upward, and the multi-size wafer loading plates are respectively unloaded for subsequent operations.

[0026] Furthermore, the loading and unloading gripper assembly includes two pneumatic grippers, an adapter plate assembly, a first linear sliding drive assembly and a second linear sliding drive assembly. The two pneumatic grippers are symmetrically arranged on the left and right and are connected through the adapter plate assembly. The adapter plate assembly is drivingly connected to the first linear sliding drive assembly. The first linear sliding drive assembly drives the pneumatic gripper on the adapter plate assembly to adjust the height position. The driving end of the second linear sliding drive assembly is drivingly connected to the first linear sliding drive assembly. The second linear sliding drive assembly drives the pneumatic gripper on the adapter plate assembly to reciprocate between the wafer loading and unloading assembly, the loading and unloading rail structure, and the wafer unloading and loading assembly.

[0027] Two pneumatic grippers are used to grip wafer trays of various sizes. The pneumatic grippers use compressed air as power and control the in and out of the airflow to enable the grippers to open and close quickly and accurately. When it is necessary to grab the material, the airflow enters the gripper, causing the piston or airbag and other components to move, driving the fingers to close and firmly grasp the material; conversely, when it is necessary to release the material, the airflow is discharged and the fingers open quickly.

[0028] The pneumatic gripper is driven to move left and right by the second linear sliding drive component, and is driven to move up and down by the first linear sliding drive component, and two pneumatic grippers are arranged in opposite directions, which optimizes and shortens the loading and unloading process path, and the loading and unloading process is smoother and more coherent. The first linear sliding drive component and the second linear sliding drive component can select structural components with linear sliding functions in the prior art, specifically, a screw motor structure with a specific stroke can be selected.

[0029] Furthermore, the processing positioning assembly includes two relatively arranged limit plates and a linear drive assembly, and the linear drive assembly drives the two limit plates to move towards or away from each other, and the opposite side of the two limit plates is adapted to the outer side of the multi-size wafer loading plate for load-bearing and limiting.

[0030] Through the cooperation of two limit plates and linear drive components (slide cylinders), multi-size wafer loading trays can be positioned and limited, which facilitates the subsequent laser polishing of the processed wafers loaded in the multi-size wafer loading trays.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] The present invention adopts a multi-size wafer loading tray, which can cooperate with wafers of different sizes and specifications for load limiting. Since the structure of the multi-size wafer loading tray is fixed, the structures of the loading and unloading gripper assembly, wafer loading and unloading assembly, transfer assembly, etc. used with it are also fixed, and there is no need for frequent adjustments according to the size specifications of the wafer, thereby reducing the overall cost of the equipment. During operation, a multi-size wafer loading tray (loaded with wafers to be processed) is installed inside the wafer loading and unloading assembly. The multi-size wafer loading tray loaded with wafers to be processed in the wafer loading and unloading assembly is grabbed out by the loading and unloading gripper assembly, and the multi-size wafer loading tray is driven to move along the loading and unloading track structure to the transfer loading position for loading operation. At this time, the transfer assembly grabs the multi-size wafer loading tray loaded with wafers to be processed, and drives the multi-size wafer loading tray to be transferred to the processing positioning assembly. The multi-size wafer loading tray is clamped and positioned by the processing positioning assembly to facilitate the subsequent laser polishing of the upper end surface of the wafer to be processed in the multi-size wafer loading tray. During the laser polishing process, the loading and unloading gripper assembly is used to perform the loading operation again to transfer another wafer loaded with wafers to be processed. The multi-size wafer loading plate is grabbed from the wafer loading and loading assembly and moved along the loading and unloading track structure to the transfer loading position. After the laser polishing process is completed, the transfer assembly is controlled to work, and the multi-size wafer loading plate loaded with the polished wafer at the processing and positioning assembly is exchanged with the multi-size wafer loading plate loaded with the wafer to be processed at the transfer loading position. At this time, the wafer to be processed located at the processing and positioning assembly is subjected to laser polishing. At the same time, the multi-size wafer loading plate loaded with the processed wafer at the transfer loading position is grabbed and transferred to the wafer unloading loading assembly by the loading and unloading gripper assembly, and then the multi-size wafer loading plate loaded with the wafer to be processed is grabbed from the wafer loading and loading assembly and transferred to the transfer loading position, starting a new round of loading and unloading process. The process of loading, processing, and unloading in the present invention is smoother and more coherent, the path design is reasonable, the work efficiency is higher, and the operation is simple, which is suitable for large-scale industrial production. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] Figure 1 This is a schematic diagram of the front structure of the multi-size wafer automatic loading and unloading device of the present invention;

[0035] Figure 2 It is a schematic diagram of the structure of the back side of the multi-size wafer automatic loading and unloading device in the present invention;

[0036] Figure 3 It is a structural schematic diagram of the cooperation between the loading and unloading gripper assembly and the wafer loading and unloading assembly in the present invention;

[0037] Figure 4 It is a schematic diagram of the structure of the transport component in the present invention;

[0038] Figure 5 It is a structural schematic diagram of the processing and positioning component in the present invention;

[0039] Figure 6 It is a schematic diagram of the structure of a multi-size wafer loading tray in the present invention;

[0040] Figure 7 It is a schematic diagram of the structure at the back side of the multi-size wafer loading tray in the present invention;

[0041] Figure 8 It is a schematic diagram of the structure of the multi-size wafer loading tray and the lifting and taking device in the present invention when used in combination.

[0042] Among them, the specific drawings are marked as:

[0043] Wafer loading and unloading assembly 1, wafer unloading and unloading assembly 2, outer shell 201, door body 202, wafer loading box 203, plug slot 204, screw motor assembly 205, workbench 3, loading and unloading track structure 4, loading and unloading track 401, transfer loading position 402, mounting frame 5, loading and unloading gripper assembly 6, pneumatic gripper 601, adapter plate assembly 602, first linear sliding drive assembly 603, second linear sliding drive assembly 604, transfer assembly 7, rotary drive member 701, first connecting plate 702, lifting drive assembly 703, second connecting plate 704, suction cup fixing frame 705, suction cup 706, processing positioning assembly 8, limiting plate 801, linear drive assembly 802, multi-size wafer loading plate 9, loading plate body 901, loading cavity 902, center limiting groove 903, annular step limiting groove 904, lifting groove 905, first protruding structure 906, second protruding structure 907, lifting rod 10, lifting platform 11, lifting cylinder 12. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] The embodiment of the present invention discloses an automatic loading and unloading device for multi-size wafers, which is suitable for ultrafast laser polishing equipment for hard and brittle materials, so that the surface of the material can be polished to nanometer level precision, such as Figure 1 and Figure 2 As shown, the multi-size wafer automatic loading and unloading device comprises a workbench 3, and the left and right sides of the workbench 3 are respectively provided with a wafer loading and loading assembly 1 and a wafer unloading and loading assembly 2 in which a plurality of multi-size wafer loading trays 9 can be positioned and installed, and the multi-size wafer loading trays 9 can carry and install wafers of different sizes;

[0046] A loading and unloading track structure 4 and a mounting frame 5 are provided on the workbench 3. The loading and unloading track structure 4 is located between the wafer loading and loading assembly 1 and the wafer unloading and loading assembly 2. A loading and unloading gripper assembly 6 is installed on the mounting frame 5. The loading and unloading gripper assembly 6 grabs the multi-size wafer loading tray 9 loaded with wafers to be processed in the wafer loading and loading assembly 1, drives the multi-size wafer loading tray 9 to move along the loading and unloading track structure 4 to the transfer loading position 402 for loading operation, or grabs the multi-size wafer loading tray 9 loaded with processed wafers at the transfer loading position 402 and moves it to the wafer unloading and loading assembly 2 for unloading operation;

[0047] A processing positioning component 8 for clamping and positioning the multi-size wafer loading tray 9 is provided on the side of the loading and unloading rail structure 4, and a transfer component 7 is installed on the mounting frame 5. The transfer component 7 grabs the multi-size wafer loading tray 9 and drives the multi-size wafer loading tray 9 to transfer its position between the transfer loading position 402 and the processing positioning component 8.

[0048] The multi-size wafer loading tray 9 can be used with wafers of different sizes for load limiting. Since the structure of the multi-size wafer loading tray 9 is fixed, the structures of the loading and unloading gripper assembly 6, wafer loading and unloading assembly, transfer assembly 7, etc. used with it are also fixed. There is no need for frequent adjustments based on the size of the wafer, thereby reducing the overall cost of the equipment. During operation, a multi-size wafer loading tray 9 (loaded with wafers to be processed) is equipped inside the wafer loading and unloading assembly 1. The multi-size wafer loading tray 9 loaded with wafers to be processed in the wafer loading and unloading assembly 1 is grabbed out by the loading and unloading gripper assembly 6, and the multi-size wafer loading tray 9 is driven to move along the loading and unloading track structure 4 to the transfer loading position 402 for loading operation. At this time, the transfer assembly 7 grabs the multi-size wafer loading tray 9 loaded with wafers to be processed, and drives the multi-size wafer loading tray 9 to be transferred to the processing positioning assembly 8. The multi-size wafer loading tray 9 is clamped and positioned by the processing positioning assembly 8 to facilitate the subsequent laser polishing of the upper end surface of the wafer to be processed in the multi-size wafer loading tray 9. During the laser polishing process, the loading operation is performed again by the loading and unloading gripper assembly 6 to grab another multi-size wafer loading tray 9 loaded with wafers to be processed from the wafer loading and unloading assembly 1 and move it along the loading and unloading track structure The structure 4 moves to the transfer loading position 402. After the laser polishing process is completed, the transfer component 7 is controlled to work, and the multi-size wafer loading plate 9 loaded with polished wafers at the processing positioning component 8 is swapped with the multi-size wafer loading plate 9 loaded with wafers to be processed at the transfer loading position 402. At this time, the wafers to be processed located at the processing positioning component 8 are subjected to laser polishing processing. At the same time, the multi-size wafer loading plate 9 loaded with processed wafers at the transfer loading position 402 is grabbed and transferred to the wafer unloading loading component 2 through the loading and unloading gripper component 6, and the multi-size wafer loading plate 9 loaded with wafers to be processed is grabbed from the wafer loading and loading component 1 and transferred to the transfer loading position 402, starting a new round of loading and unloading process. The loading, processing and unloading processes in the present invention are smoother and more coherent, the path design is reasonable, the working efficiency is higher, and the operation is simple, which is suitable for large-scale industrial production.

[0049] In a specific embodiment, Figures 6 to 8As shown, the multi-size wafer loading tray 9 includes a loading tray body 901 in the shape of a disc, and a loading cavity 902 is provided on the upper surface of the loading tray body 901. The loading cavity 902 includes a center limit groove 903 and a plurality of annular step limit grooves 904. The center limit groove 903 is provided at the center position of the upper surface of the loading tray body 901, and is adapted to the wafer of the smallest size for load-bearing and limiting. A plurality of annular step limit grooves 904 with gradually increasing diameters from the inside to the outside are arranged cocentrically on the outer side of the center limit groove 903. The upper end surface heights of the plurality of annular step limit grooves 904 gradually increase from the inside to the outside. The plurality of annular step limit grooves 904 are respectively adapted to and installed with wafers of different sizes for load-bearing and limiting. A lifting groove 905 is provided at the bottom of the loading cavity 902, which runs through the loading cavity 902 from top to bottom. A lifting rod 10 is movable upward through the lifting groove 905, and the lifting rod 10 lifts the wafer upward from the loading cavity 902. Specifically, according to the conventional size specifications of the wafer (2 inches, 3 inches, 4 inches, 5 inches, 6 inches, and 8 inches), a center limit groove 903 and a plurality of annular step limit grooves 904 with different heights are set accordingly, which can correspond to the load-limiting of wafers of different sizes. For example, when the wafer to be processed is 2 inches, it can be loaded and limited in the center limit groove 903; when the wafer to be processed is 8 inches, it can be loaded and limited in the outermost annular step limit groove 904. The annular step limit groove 904 has a certain width, and the outer edge of the lower end surface of the wafer contacts the outermost annular step limit groove 904, thereby achieving the support and loading limit function for the 8-inch wafer, and facilitating the subsequent polishing processing of the upper end surface of the wafer. Since the structure of the multi-size wafer loading tray 9 is fixed, the structures of the loading and unloading gripper assembly 6, wafer loading and unloading loading assembly, transfer assembly, etc. used therewith are also fixed, and there is no need for frequent adjustments according to the size specifications of the wafer, thereby reducing the overall cost of the equipment. In addition, a lifting groove 905 running through the loading chamber 902 is provided at the bottom thereof. The lifting rod 10 is controlled to move upward through the lifting groove 905, and the lifting rod 10 contacts the lower end surface of the wafer, thereby lifting the wafer after polishing from the loading chamber 902, making it convenient for the subsequent removal of the wafer, thus realizing the automatic unloading operation of the wafer, which is simple to operate and avoids contacting the polished surface of the wafer.

[0050] One end of the lifting groove 905 is located at the edge of the central limiting groove 903, and the other end of the lifting groove 905 extends outward to the outermost annular step limiting groove 904. In order to improve the efficiency of the lifting operation, the lifting groove 905 is extended outward from the central limiting groove 903 to the outermost annular step limiting groove 904, and the lifting rod 10 is matched with the size and shape of the lifting groove 905. By controlling the lifting rod 10 to pass upward from the lifting groove 905, it is ensured that the top of the lifting rod 10 can contact the bottom surface of the various wafers of different sizes loaded in the loading chamber 902, and the various wafers of different sizes can be smoothly lifted upward from the loading chamber 902. There is no need to set a plurality of lifting operation sites at different locations according to the size specifications of the wafers, which simplifies the specific structure and process of the lifting operation and improves the operation efficiency of the lifting operation.

[0051] Preferably, there are multiple lifting grooves 905, and the bottom of the loading chamber 902 is provided with multiple lifting grooves 905 that are radially distributed and extend in the radial direction. In order to facilitate the subsequent wafer retrieval operation, preferably, multiple lifting grooves 905 are evenly opened, and multiple corresponding lifting rods 10 pass through the lifting grooves 905. Multiple lifting rods 10 are in contact with the lower end surface (non-processing surface) of the wafer and are evenly distributed, so that the wafer is lifted upward horizontally, which is convenient for the subsequent wafer retrieval operation. In specific applications, only one lifting groove 905 can also be set to lift one side of the wafer for subsequent retrieval operations.

[0052] Specifically, a lifting and taking device is additionally provided for use with the multi-size wafer loading tray 9, such as Figure 8 As shown, the lifting and material removal device includes a lifting rod 10, a lifting platform 11 and a lifting cylinder 12. The lifting rod 10 matches the shape and size of the lifting slot 905. Lifting rods 10 are respectively arranged one by one under the lifting slots 905. The lifting rods 10 are installed on the lifting platform 11. The lifting cylinder 12 is driven and connected to the lifting platform 11, which drives the lifting rods 10 to move upward and pass through the corresponding lifting slots 905 to lift the wafer upward from the loading chamber 902. Due to factors such as cost and convenient storage, the multi-size wafer loading tray 9 is relatively thin and the lifting and picking device is relatively large, so it is impossible to install it inside the multi-size wafer loading tray 9. Therefore, the lifting and picking device is separately provided. When lifting operation is required, the multi-size wafer loading tray 9 is transferred to the top of the lifting and picking device, and the lifting cylinder 12 drives multiple lifting rods 10 to extend upward from the corresponding lifting grooves 905 synchronously. The lifting rods 10 contact the lower end surface (non-processed surface) of the wafer and lift the wafer upward horizontally, which is convenient for subsequent wafer picking operations and avoids contact with the polished surface (upper end surface) of the wafer during the wafer removal process. The degree of automation is high.

[0053] like Figure 6As shown, first protruding structures 906 extending outward are formed on opposite sides of the outer side of the loading tray body 901, and a wafer loading box 203 is installed inside the wafer loading assembly 1 and the wafer unloading assembly 2. A plurality of plug-in grooves 204 are formed on the inner wall of the wafer loading box 203 from top to bottom, and the first protruding structure 906 of the multi-size wafer loading tray 9 can be movably plugged into the corresponding plug-in groove 204.

[0054] Specifically, Figure 3 As shown, the wafer loading assembly 1 and the wafer unloading assembly 2 have the same structure, and include an outer shell 201, an opening is provided on one side of the outer shell 201 facing the loading and unloading track structure 4, an openable and closable door body 202 is provided on the front of the outer shell 201, a loading box fixing frame is provided inside the outer shell 201, and a plurality of groups of plug-in slots 204 are provided on the front and rear sides of the wafer loading box 203 from top to bottom, and the two first protruding structures 906 of the multi-size wafer loading tray 9 can be movably plugged into the corresponding plug-in slots 204 on the front and rear sides, thereby realizing the storage of the multi-size wafer loading tray 9, and the wafer loading box 203 is provided with an opening on one side facing the loading and unloading track structure 4, so as to facilitate the loading and unloading gripper assembly 6 to grab the multi-size wafer loading tray 9 loaded with wafers to be processed from the wafer loading box 203, or to put the multi-size wafer loading tray 9 loaded with processed wafers into the wafer loading box 203. In addition, the loading box fixing frame is connected to the vertically arranged lead screw motor assembly 205 for driving and regulating the wafer loading box 203 to be lifted upward or lowered, so as to facilitate the loading or unloading operation.

[0055] like Figure 1 , Figure 2 and Figure 6 As shown, when the loading and unloading gripper assembly 6 grabs the multi-size wafer loading tray 9 and moves along the loading and unloading track structure 4, the two first protruding structures 906 of the multi-size wafer loading tray 9 respectively contact and slide with the two loading and unloading tracks 401 in the loading and unloading track structure 4. Specifically, the loading and unloading track structure 4 includes two loading and unloading tracks 401 arranged side by side in an L-shaped structure. When the loading and unloading gripper assembly 6 grabs the multi-size wafer loading tray 9 and moves along the loading and unloading track structure 4, the first protruding structures 906 on both sides of the multi-size wafer loading tray 9 respectively contact and slide with the loading and unloading tracks 401, playing a supporting and guiding limiting role.

[0056] The other two opposite sides of the outer side of the loading tray body 901 are formed with second protruding structures 907 extending outward, and the loading and unloading gripper assembly 6 clamps the second protruding structures 907 to grab the multi-sized wafer loading tray 9 for position movement. The two second protruding structures 907 serve as clamping sites for cooperating with the loading and unloading gripper assembly 6, making it convenient for the loading and unloading gripper assembly 6 to grab the multi-sized wafer loading tray 9.

[0057] The first protruding structure 906 and the second protruding structure 907 may be the same or different. In a specific embodiment, the first protruding structure 906 and the second protruding structure 907 are both parallel protruding structures, but the protruding portion of the first protruding structure 906 is longer, and the thickness of the first protruding structure 906 is less than the thickness of the multi-size wafer loading tray 9, so that the first protruding structure 906 and the insertion groove 204 on the inner side wall of the wafer loading box 203 have a better contact and matching effect.

[0058] In a specific embodiment, Figure 1 and Figure 4 As shown, the processing positioning component 8 is located directly in front of the transfer loading position 402 of the loading and unloading track structure 4, and the transfer component 7 includes a rotating drive component 701, a first connecting plate 702, a lifting drive component 703, a second connecting plate 704, a suction cup fixing frame 705 and a suction cup 706. The rotating drive component 701 is installed on the installation frame 5, and the driving end of the rotating drive component 701 is installed with a first connecting plate 702 of a U-shaped structure, and the two side arms of the first connecting plate 702 are respectively installed with the lifting drive component 703, and the driving end of the lifting drive component 703 is connected to the suction cup fixing frame 705 through the second connecting plate 704, and a plurality of suction cups 706 are installed on the lower end surface of the suction cup fixing frame 705. Specifically, the suction cup fixing frame 705 is a cross structure, and the suction cup 706 is installed on the lower end surfaces of the four ends of the suction cup fixing frame 705. When working, the suction cup 706 is adsorbed on the edge of the upper end surface of the multi-size wafer loading tray 9 through vacuum negative pressure, and the multi-size wafer loading tray 9 is sucked up and then transported to a specific position before being unloaded. The rotary drive member 701 uses a DD motor, and the lifting drive component 703 uses a slide cylinder. The lifting drive component 703 drives the suction cups 706 on the two suction cup fixing frames 705 to move downward and respectively suck the multi-size wafer loading plate 9 loaded with polished wafers at the processing positioning component 8 and the multi-size wafer loading plate 9 loaded with wafers to be processed at the transfer loading position 402, and then rises through the lifting drive component 703, and then controls the rotary drive member 701 to work and rotate, drives the two suction cup fixing frames 705 and suction cups 706 connected thereto to rotate, controls the rotary drive member 701 to rotate 180 degrees, and then controls the lifting drive component 703 to descend, and interchanges the multi-size wafer loading plate 9 loaded with polished wafers at the processing positioning component 8 with the multi-size wafer loading plate 9 loaded with wafers to be processed at the transfer loading position 402, and then controls the suction cups 706 to release the vacuum and move upward, and respectively removes the multi-size wafer loading plates 9 for subsequent operations.

[0059] In a specific embodiment, Figure 2 and Figure 3As shown, the loading and unloading gripper assembly 6 includes two pneumatic grippers 601, an adapter plate assembly 602, a first linear sliding drive assembly 603 and a second linear sliding drive assembly 604. The two pneumatic grippers 601 are symmetrically arranged on the left and right and are connected through the adapter plate assembly 602. The adapter plate assembly 602 is drivingly connected to the first linear sliding drive assembly 603. The first linear sliding drive assembly 603 drives the pneumatic gripper 601 on the adapter plate assembly 602 to adjust the height position. The driving end of the second linear sliding drive assembly 604 is drivingly connected to the first linear sliding drive assembly 603. The second linear sliding drive assembly 604 drives the pneumatic gripper 601 on the adapter plate assembly 602 to reciprocate between the wafer loading and unloading assembly 1, the loading and unloading rail structure 4, and the wafer unloading and loading assembly 2. Two pneumatic grippers 601 are used to grip the wafer loading tray 9 of multiple sizes. The pneumatic grippers 601 use compressed air as power, and by controlling the in and out of the airflow, the grippers can achieve fast and accurate opening and closing movements. When it is necessary to grab the material, the airflow enters the inside of the gripper, causing the piston or airbag and other components to be displaced, driving the finger part to close and firmly grasp the material; conversely, when it is necessary to release the material, the airflow is discharged and the finger part opens quickly. The pneumatic gripper 601 is driven to move left and right by the second linear sliding drive component 604, and the pneumatic gripper 601 is driven to move up and down by the first linear sliding drive component 603, and two pneumatic grippers 601 are set in back to back, which optimizes and shortens the loading and unloading process path, and the loading and unloading process is smoother and more coherent. The first linear sliding drive component 603 and the second linear sliding drive component 604 can select structural components with linear sliding functions in the prior art, specifically, a screw motor structure with a specific stroke can be selected.

[0060] In a specific embodiment, Figure 5 As shown, the processing positioning assembly 8 includes two relatively arranged limiting plates 801 and a linear drive assembly 802. The linear drive assembly 802 drives the two limiting plates 801 to move in the direction of approaching or moving away from each other. The opposite side of the two limiting plates 801 is adapted to the outer side of the multi-size wafer loading plate 9 for load-bearing and limiting. Through the cooperation of the two limiting plates 801 and the linear drive assembly 802 (sliding cylinder), the multi-size wafer loading plate 9 can be positioned and limited, which facilitates the subsequent laser polishing of the processing wafers loaded in the multi-size wafer loading plate 9.

[0061] The specific working process is as follows:

[0062] (1) Turn on the equipment, open the door bodies 202 on the right wafer loading assembly 1 and the left wafer unloading assembly 2 respectively, install the wafer loading boxes 203 on the corresponding loading box fixing frames respectively, insert multiple multi-sized wafer loading trays 9 loaded with wafers to be processed from top to bottom in the wafer loading box 203 in the wafer loading assembly 1, and the wafer loading box 203 in the wafer unloading assembly 2 is in an empty state. After placing and fixing the wafer loading box 203, close the door body 202, and the screw motor assembly 205 drives the wafer loading box 203 to descend to the working position.

[0063] (2) After the loading and unloading gripper assembly 6 moves toward the wafer loading and unloading assembly 1 and reaches the loading setting position, the pneumatic gripper 601 on the right is started. The pneumatic gripper 601 clamps the left side of the multi-size wafer loading tray 9 in the wafer loading and unloading assembly 1 and moves the multi-size wafer loading tray 9 to the position of the loading and unloading track structure 4. The first protruding structures 906 on the front and rear sides of the multi-size wafer loading tray 9 are respectively in contact and slidably matched with the two loading and unloading tracks 401. The multi-size wafer loading tray 9 moves along the two loading and unloading tracks 401. When the right pneumatic gripper 601 moves to the setting position (transfer loading position 402), the pneumatic gripper 601 on the right releases the air gripper to release the multi-size wafer loading tray 9 containing the wafers to be processed. The suction cup 706 on the suction cup fixing frame 705 in the carrier plate 9 and the transfer component 7 moves downward and is adsorbed on the edge of the upper end surface of the multi-size wafer loading plate 9 through vacuum negative pressure, moves upward and controls the rotating drive member 701 to rotate 180 degrees, then moves downward and unloads the multi-size wafer loading plate 9 and places it in the middle position of the processing positioning component 8, and controls the two limit plates 801 to approach each other and move toward the center position at the same time through the linear drive component 802 to position and limit the multi-size wafer loading plate 9 (with wafers to be processed), and start laser polishing processing. During the polishing process, the pneumatic gripper 601 on the right continues to operate to grab the multi-size wafer loading plate 9 in the wafer loading and loading component 1 and move it to the transfer loading position 402.

[0064] (3) After the polishing process is completed, the two limit plates 801 are controlled to move away from each other by the linear drive component 802, and the suction cups 706 on the two suction cup fixing frames 705 move downward to respectively absorb the multi-size wafer loading plate 9 (loaded with processed wafers) in the processing positioning component 8 and the multi-size wafer loading plate 9 (loaded with wafers to be processed) at the transfer loading position 402. The suction cup fixing frame 705 is moved upward and controlled to rotate 180 degrees, and then the suction cup fixing frame 705 is moved downward to transfer the multi-size wafer loading plate 9 (loaded with wafers to be processed) to the processing positioning component 8, and the multi-size wafer loading plate 9 (loaded with processed wafers) is synchronously transferred to the transfer loading position 402. At the processing positioning component 8, the two limit plates 801 are controlled by the linear drive component 802 to move toward the center position at the same time, so that the multi-size wafer loading plate 9 (loaded with wafers to be processed) is positioned and Limitation, and start laser polishing processing. At the same time, at the transfer loading position 402, the pneumatic gripper 601 on the left grabs the multi-size wafer loading tray 9 (loaded with processed wafers) and moves to the left. The pneumatic gripper 601 on the right has already grabbed a multi-size wafer loading tray 9 in a wafer loading and loading assembly 1 in advance. Therefore, after moving a short distance to the left, the pneumatic gripper 601 on the right deflates and releases the multi-size wafer loading tray 9 (loaded with wafers to be processed), and then continues to move toward the wafer unloading and loading assembly 2. The pneumatic gripper 601 on the left clamps the multi-size wafer loading tray 9 (loaded with processed wafers) and sends it into the wafer unloading and loading assembly 2, and then quickly moves the loading and unloading gripper assembly 6 to the wafer loading and loading assembly 1, grabs the multi-size wafer loading tray 9 (loaded with wafers to be processed) and moves to the left along the loading and unloading track structure 4, starting a new round of loading and unloading process.

[0065] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-size wafer automatic loading and unloading device, characterized in that: It comprises a workbench, wherein the left and right sides of the workbench are respectively provided with a wafer loading assembly and a wafer unloading assembly, wherein a plurality of multi-sized wafer loading trays can be positioned and installed inside, and the multi-sized wafer loading trays can carry and install wafers of different sizes; The workbench is provided with a loading and unloading track structure and a mounting frame, the loading and unloading track structure is located between the wafer loading and loading assembly and the wafer unloading and loading assembly, and the mounting frame is provided with a loading and unloading gripper assembly, the loading and unloading gripper assembly grabs out a multi-size wafer loading tray loaded with wafers to be processed in the wafer loading and loading assembly, drives the multi-size wafer loading tray to move along the loading and unloading track structure to the transfer loading position for loading operation, or grabs the multi-size wafer loading tray loaded with processed wafers at the transfer loading position and moves it to the wafer unloading and loading assembly for unloading operation; A processing positioning assembly for clamping and positioning the multi-sized wafer loading tray is provided beside the loading and unloading track structure, and a transfer assembly is installed on the mounting frame. The transfer assembly grabs the multi-sized wafer loading tray and drives the multi-sized wafer loading tray to transfer positions between the transfer loading position and the processing positioning assembly; The multi-size wafer loading tray includes a disc-shaped loading tray body, a loading cavity is opened on the upper surface of the loading tray body, and the loading cavity includes a center limit groove and a plurality of annular step limit grooves, the center limit groove is opened at the center position of the upper surface of the loading tray body, and is adapted to the wafer of the smallest size for load-bearing and limiting, a plurality of annular step limit grooves with gradually increasing diameters from the inside to the outside are arranged concentrically on the outer side of the center limit groove, the upper end surface heights of the plurality of annular step limit grooves gradually increase from the inside to the outside, and the plurality of annular step limit grooves are respectively adapted to and installed with wafers of different sizes for load-bearing and limiting, a lifting groove is opened at the bottom of the loading cavity and runs through it from top to bottom, a lifting rod is movably extended upward from the lifting groove, and the lifting rod lifts the wafer upward from the loading cavity.

2. The multi-size wafer automatic loading and unloading device according to claim 1 is characterized in that: One end of the lifting groove is located at the edge of the central limiting groove, and the other end of the lifting groove extends outward to the outermost annular step limiting groove.

3. The multi-size wafer automatic loading and unloading device according to claim 2 is characterized in that: There are a plurality of lifting grooves, and a plurality of lifting grooves are radially distributed and extend in the radial direction at the bottom of the loading cavity.

4. The multi-size wafer automatic loading and unloading device according to claim 2 or 3, characterized in that: A first protruding structure extending outward is formed on two opposite sides of the outer side of the loading tray body, a loading box is installed inside the wafer loading assembly and the wafer unloading assembly, and a plurality of plug-in grooves are formed on the inner wall of the loading box from top to bottom, and the first protruding structure of the multi-size wafer loading tray can be movably plugged into the corresponding plug-in groove.

5. The multi-size wafer automatic loading and unloading device according to claim 4, characterized in that: When the loading and unloading gripper assembly grabs the multi-size wafer loading tray and moves along the loading and unloading track structure, the two first protruding structures of the multi-size wafer loading tray are respectively contacted and slidably matched with the two loading and unloading tracks in the loading and unloading track structure.

6. The multi-size wafer automatic loading and unloading device according to claim 4, characterized in that: The other two opposite sides of the outer side of the loading tray are formed with second protruding structures extending outward, and the loading and unloading gripper assembly clamps the second protruding structures to grab the multi-size wafer loading tray for position movement.

7. The multi-size wafer automatic loading and unloading device according to claim 6, characterized in that: The processing positioning component is located directly in front of the transfer loading position of the loading and unloading rail structure, the transfer component includes a rotating drive component, a first connecting plate, a lifting drive component, a second connecting plate, a suction cup fixing frame and a suction cup, the rotating drive component is installed on the mounting frame, the driving end of the rotating drive component is installed with a first connecting plate of a U-shaped structure, the two side arms of the first connecting plate are respectively installed with lifting drive components, the driving end of the lifting drive component is connected to the suction cup fixing frame through the second connecting plate, and a plurality of suction cups are installed on the lower end surface of the suction cup fixing frame.

8. The multi-size wafer automatic loading and unloading device according to claim 1, characterized in that: The loading and unloading gripper assembly includes two pneumatic grippers, an adapter plate assembly, a first linear sliding drive assembly and a second linear sliding drive assembly. The two pneumatic grippers are symmetrically arranged on the left and right and are connected through the adapter plate assembly. The adapter plate assembly is drivingly connected to the first linear sliding drive assembly. The first linear sliding drive assembly drives the pneumatic gripper on the adapter plate assembly to adjust the height position. The driving end of the second linear sliding drive assembly is drivingly connected to the first linear sliding drive assembly. The second linear sliding drive assembly drives the pneumatic gripper on the adapter plate assembly to reciprocate between the wafer loading and unloading assembly, the loading and unloading track structure, and the wafer unloading and loading assembly.

9. The multi-size wafer automatic loading and unloading device according to claim 1, characterized in that: The processing positioning assembly includes two relatively arranged limit plates and a linear drive assembly. The linear drive assembly drives the two limit plates to move toward or away from each other. The opposite side of the two limit plates is adapted to the outer side of the multi-size wafer loading plate for load-bearing and limiting.

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