Fixing clamp for packaging deep-cavity semiconductor structure

Abstract

The invention is mainly used for a back-end packaging process of a semiconductor chip, and relates to a fixing clamp for packaging a deep-cavity semiconductor structure, which comprises a first clamping arm, a second clamping arm and an elastic piece, the elastic piece is arranged between the first clamping arm and the second clamping arm and provides clamping force for mutual clamping of the end parts of the first clamping arm and the second clamping arm, and the elastic piece is used for clamping the end parts of the first clamping arm and the second clamping arm. A clamping part is arranged at the end part of the first clamping arm, the clamping part is bent from the first clamping arm to the second clamping arm, the clamping part comprises a bent section and a fixed section, and the bent section is connected with the fixed section. Therefore, the chip cover plate can be conveniently fixed in the sealing and welding process of the semiconductor chip, and meanwhile, the chip with a deep cavity structure can be conveniently fixed.

Description

Technical Field

[0001] The present invention relates to semiconductor packaging technology, and is mainly applied to the back-end packaging link of semiconductor packaging process, especially to fixing tools used in the sealing or capping process of semiconductor packaging process with deep cavity structure. Background Art

[0002] Gold-tin soldering or gold-tin capping technology is usually used in the back-end packaging link of the semiconductor packaging process, especially in the sealing or capping (lid attach) process. It is mainly used to ensure the airtightness and stability of the chip after packaging, prevent external moisture or other contaminants from entering the package body, and protect the function and performance of the chip.

[0003] In the general gold-tin sealing process, the gravity block is designed to apply pressure according to the chip shape, and the cover is used to lock it around. At the same time, sufficient pressure needs to be applied above the cover to avoid defects such as solder voids or solder overflow at the welding interface. However, as the solder piece melts, the screws fixing the cover will become loose, causing uneven force, thus affecting the flow of solder, resulting in problems such as voids or solder overflow on the welding surface. In addition, since the gravity block and the jig for placing the chip need to be formulated according to the size of the chip, chips of different sizes require corresponding jigs and gravity blocks, which is costly.

[0004] Furthermore, in semiconductor products with deep cavity structures, since the semiconductor chip is located lower than the nearby structure surface, it is not easy to fix it during the sealing process, and it is also easy to cause defects in the welding interface.

[0005] Therefore, in order to solve the above-mentioned problems, a simple and convenient technical solution is needed. Summary of the invention

[0006] In order to solve the above problems, the present invention proposes a fixing clamp for deep cavity semiconductor structure packaging, comprising a first clamping arm, a second clamping arm and an elastic member, wherein the elastic member is arranged between the first clamping arm and the second clamping arm to provide a clamping force for the ends of the first clamping arm and the second clamping arm to clamp each other; a clamping portion is arranged at the end of the first clamping arm, and the clamping portion is bent from the first clamping arm toward the second clamping arm, and the clamping portion includes a bending section and a fixing section, and the bending section is connected to the fixing section.

[0007] Furthermore, the fixed section is a U-shaped structure.

[0008] Furthermore, a flexible pad is provided at the inflection point of the U-shaped structure of the fixed section.

[0009] Furthermore, a force-applying portion is disposed at the other end of the first clamping arm and the second clamping arm, and after force is applied to the force-applying portion, the clamping portion of the first clamping arm is separated from the second clamping arm.

[0010] Furthermore, the elastic member is a torsion spring.

[0011] Furthermore, a connecting portion is provided between the first clamping arm and the clamping portion.

[0012] Furthermore, the elastic member is detachably connected to the first clamping arm or the second clamping arm.

[0013] Furthermore, the fixing section is an arc-shaped fixing head.

[0014] Furthermore, fixing ears are provided at the positions where the first clamping arm and the second clamping arm are provided with the elastic member, and the fixing ears are used to fix the elastic member.

[0015] Furthermore, the bending section and the first clamping arm have an included angle, and the included angle is between 90 degrees and 150 degrees.

[0016] The beneficial effects of the present invention are:

[0017] 1. Use a fixing clip to replace the pressing block and screw pressing. There is no need to customize complex jigs and fixtures according to the chip size. The fixing clip can make the chip cover have a constant clamping force.

[0018] 2. A bending section is provided at the clamping part, which is suitable for chips with deep cavity structure.

[0019] 3. The elastic parts are detachably connected, and elastic parts with different elastic forces can be replaced according to the clamping force. It is also convenient to replace aging or elastic fatigue elastic parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 The figure is a schematic structural diagram of a fixing clip for deep cavity semiconductor packaging according to the present invention.

[0022] Figure 2 This is a schematic diagram of an implementation state of the first clamping arm of the present invention.

[0023] Figure 3 This is a schematic diagram of another implementation state of the first clamping arm of the present invention.

[0024] Reference numerals

[0025] 1 First clamping arm

[0026] 11 Clamping part

[0027] 111 Bending section

[0028] 112 Fixed segment

[0029] 12 Force application part

[0030] 13. Connection

[0031] 2 Second clamping arm

[0032] 3 Elastic parts

[0033] 31 Fixed ears DETAILED DESCRIPTION

[0034] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0035] In the following description, please refer to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical composition, structure, electrical and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0036] Although the terms first, second, etc. are used to describe various elements or parameters in this article in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one or parameter part from another or parameter. For example, the first end can be referred to as the second end, and similarly, the second end can be referred to as the first end, without departing from the scope of the various described embodiments. The first end and the second end are both describing one end, but unless the context clearly indicates otherwise, they are not the same end.

[0037] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include the plurality forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0038] Please refer to Figure 1 The present invention proposes a fixing clamp for deep cavity semiconductor structure packaging, including a first clamping arm 1, a second clamping arm 2 and an elastic member 3. In this embodiment, the elastic member 3 is a torsion spring, and the elastic member 3 is arranged between the first clamping arm 1 and the second clamping arm 2. The first clamping arm 1 and the second clamping arm 2 are also provided with fixing ears 31 at the position where the elastic member 3 is installed, which is convenient for fixing the elastic member, so that the elastic member can provide a clamping force for the ends of the first clamping arm 1 and the second clamping arm 2 to clamp each other.

[0039] A clamping portion 11 is provided at the end of the first clamping arm 1, and the clamping portion 11 is bent from the first clamping arm 1 toward the second clamping arm 2, so that an angle is formed between the clamping portion 11 and the first clamping arm 1. In this embodiment, the angle is between 90 degrees and 150 degrees. More specifically, the angle can be 100 degrees, 120 degrees or 150 degrees. The clamping portion 11 includes a bending section 111 and a fixing section 112. The bending section 111 is connected to the fixing section 112. Through the bending section 111 of the clamping portion 11, the fixing section 11 can be extended into the position of the chip cover plate in the deep cavity semiconductor structure, and the chip housing and the chip cover plate are pressurized and fixed by the first clamping arm 1 and the second clamping arm 2. In addition, the length of the bending section 111 can be designed according to the depth of the semiconductor chip in the structure.

[0040] Furthermore, in one embodiment, the fixing section 112 is a U-shaped structure, and in another embodiment, the fixing section can be an arc-shaped fixing head (see Figure 2 ), the fixing section 112 is mainly used to press the chip cover plate, so that the chip cover plate can have a fixed pressing force. In addition, a flexible pad (not shown in the figure) can be arranged at the inflection point of the U-shaped structure or the position where the end point of the arc-shaped fixing head contacts the chip cover plate to prevent the fixing section from crushing the surface of the chip cover plate.

[0041] It can be understood that the fixing clamp of the present invention is provided with force-applying parts 12 and 22 at the other end of the first clamping arm 1 and the second clamping arm 2. After the force-applying parts 12 and 22 are applied, the clamping part 11 of the first clamping arm 1 is separated from the second clamping arm 2. When the force-applying parts 12 and 22 are eliminated, the clamping force provided by the elastic member 3 enables the ends of the first clamping arm 1 and the second clamping arm 2 to clamp the chip. The elastic member 3 is detachably connected to the first clamping arm 1 or the second clamping arm 2. When the clamping force needs to be adjusted, the elastic member 3 can be directly replaced to adjust the clamping force of the first clamping arm 1 and the second clamping arm 2, and it can be applied to the packaging process of different chips. In addition, there is also a connecting part 13 between the first clamping arm 1 and the clamping part 11. Through the connecting part 13, the width of the first clamping arm 1 and the width of the clamping part 11 can be different, thereby being applicable to chips of different sizes.

[0042] The present invention uses a fixing clamp to replace the traditional pressing block and screw pressing. There is no need to customize complex jigs and fixtures according to the chip size. The fixing clamp can make the chip cover have a constant clamping force, which can reduce the cost of making the jig, and is convenient for operators to operate, greatly shortening the time for fixing the chip. At the same time, because the fixing clamp in the present invention is provided with a bending section bent toward the second clamping arm at the clamping part, the fixing section can extend into the deep cavity structure, which is more suitable for chips with deep cavity structures. The elastic member is a detachable connection, and elastic members with different elastic forces can be replaced according to the size of the clamping force. At the same time, it is also convenient to replace the elastic member that is aged or elastically fatigued.

[0043] In the present invention, unless otherwise clearly stipulated and limited, for example, it can be a fixed connection, a detachable connection, or an integrated one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0044] The above are preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A fixing clip for deep cavity semiconductor structure packaging, comprising a first clamping arm, a second clamping arm and an elastic member, characterized in that: The elastic member is disposed between the first clamping arm and the second clamping arm, and provides a clamping force for the ends of the first clamping arm and the second clamping arm to clamp each other; A clamping portion is disposed at the end of the first clamping arm. The clamping portion is bent from the first clamping arm toward the second clamping arm. The clamping portion includes a bending section and a fixing section. The bending section is connected to the fixing section.

2. A fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: The fixing section is a U-shaped structure.

3. The fixing clip for deep cavity semiconductor structure packaging according to claim 2, characterized in that: A flexible pad is provided at the inflection point of the U-shaped structure of the fixing section.

4. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: A force-applying portion is disposed at the other end of the first clamping arm and the second clamping arm. After force is applied to the force-applying portion, the clamping portion of the first clamping arm is separated from the second clamping arm.

5. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: The elastic member is a torsion spring.

6. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: A connecting portion is provided between the first clamping arm and the clamping portion.

7. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: The elastic member is detachably connected to the first clamping arm or the second clamping arm.

8. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: The fixing section is an arc-shaped or spherical fixing head.

9. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: Fixing ears are provided at positions where the first clamping arm and the second clamping arm are mounted with the elastic member, and the fixing ears are used to fix the elastic member.

10. The fixing clip for deep cavity semiconductor structure packaging according to claim 1, characterized in that: The bending section and the first clamping arm have an included angle, and the included angle is between 90 degrees and 150 degrees.

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