Solar energy assisted thermoelectric refrigeration high-efficiency air-cooled cold plate

Abstract

The application provides a high-efficiency air-cooled cold plate for solar-assisted thermoelectric refrigeration, wherein solar cell groups are installed on fin end faces, can block most of the heating of solar radiation on the air-cooled cold plate, and directly improve the heat dissipation capacity of the air-cooled cold plate. The solar cell panel supplies power to the thermoelectric refrigeration piece through a storage battery, forms a self-closing loop, and improves the economy of the system. The use of the first-stage thermoelectric refrigeration piece realizes refrigeration at the chip cold plate, breaks through the temperature gradient limitation of the conventional heat dissipation cold plate, and improves the chip use environment temperature to the environment temperature plus the temperature difference of the refrigeration piece, thereby significantly improving the heat dissipation capacity of the air-cooled cold plate. The second-stage cooling assembly can dissipate heat for the solar cell groups through the fin end face cover plate, can ensure that the battery pieces work at a lower working temperature, improves the working efficiency and reliability of the battery pieces, and indirectly assists in dissipating heat for the fins of the air-cooled cold plate through the fin end face cover plate, thereby further improving the heat dissipation efficiency of the air-cooled cold plate.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic equipment, and particularly relates to a high-efficiency air-cooled cold plate with solar energy assisted thermoelectric refrigeration. BACKGROUND

[0002] With the development of information technology, electronic chips are increasingly popular, and the size of the chips is getting smaller and smaller, and the power density is getting higher and higher. Ensuring good heat dissipation of electronic chips is the key to improving system reliability. The technologies commonly used for electronic chip heat dissipation mainly include natural heat dissipation, forced air cooling heat dissipation, liquid cooling heat dissipation, etc. Forced air cooling heat dissipation is widely used in engineering practice because it has strong heat dissipation capacity and simple system structure. Forced air cooling heat dissipation mainly relies on air-cooled cold plates. Heat from the new chip is gradually transferred to the fins through the fins on the metal substrate, and the cold air flowing between the fins is used.

[0003] The temperature of the traditional air-cooled cold plate gradually increases from the cold air between the fins to the heat dissipation fins, the cold plate substrate, and the heat generating chip. In the case of high ambient temperature, the heat dissipation capacity is limited. The main measures to improve the heat dissipation capacity of the cold plate are to increase the fin area and improve the air speed between the fins. The increase of the fin area is mainly realized by increasing the fin height and reducing the fin spacing, which significantly increases the size and weight of the cold plate. Increasing the air speed between the fins requires a fan with sufficient pressure head, which is economically poor and significantly increases the operating noise, resulting in a sharp deterioration of personnel comfort. Therefore, a new way is needed to solve the above problems of the air-cooled cold plate and improve the heat dissipation capacity of the air-cooled cold plate. SUMMARY

[0004] To solve the problems of limited use environment temperature and limited heat dissipation capacity of the existing air-cooled cold plate, the present application provides a high-efficiency air-cooled cold plate with solar energy assisted thermoelectric refrigeration, which has the characteristics of high use environment temperature, high heat dissipation capacity, and good economy.

[0005] The high-efficiency air-cooled cold plate with solar energy assisted thermoelectric refrigeration of the present application is characterized by comprising an air-cooled framework with fins, a fin end face cover plate covered with a solar cell group, a secondary cooling assembly installed on the fin end face cover plate close to the fin side, a primary thermoelectric refrigeration sheet with a heat-conducting gasket pressed on the upper and lower surfaces, and a chip mounting plate.

[0006] The fin end of the air-cooled framework is uniformly provided with threaded holes, which are used to press and fix the fin end face cover plate on the fin end through screws. The secondary cooling assembly is installed on the fin side of the fin end face cover plate, and the solar cell group is fixed on the side away from the fin. The side end surface of the air-cooled framework base plate is provided with a surrounding frame, and the primary thermoelectric refrigeration sheet and the heat-conducting gasket are installed in the surrounding frame. The chip mounting plate is fixed on the air-cooled framework by screws.

[0007] The end face cover plate away from the fin side of the air-cooled framework is provided with a countersunk hole and a wiring groove, the countersunk hole 21 corresponds to the threaded hole on the fin one by one, and is used for fixing the end face cover plate on the fin; the wiring groove is used for wiring inside the solar cell group, and the end face cover plate near the fin side of the air-cooled framework is provided with a threaded hole, which is used for fixing the secondary cooling assembly.

[0008] The solar cell group is composed of two or more cell pieces, and the cell pieces are installed in parallel with each other between the wiring grooves; the solar cell group absorbs solar energy and converts it into electrical energy, which is stored in the storage battery through the wire.

[0009] The secondary cooling assembly is composed of a secondary cold plate, a secondary thermoelectric refrigeration piece, a heat-conducting gasket attached to the upper and lower surfaces of the secondary refrigeration piece and a screw mounting hole; the screw mounting hole is a counterbore, and the secondary refrigeration piece is tightly pressed on the end face cover plate through a countersunk screw.

[0010] The secondary cold plate and the secondary thermoelectric refrigeration piece are weaker than the air-cooled framework and the primary thermoelectric refrigeration piece in size performance; the cold end of the secondary refrigeration piece is close to the end face cover plate, and the hot end is close to the secondary cold plate, which cools the end face cover plate during work, and the heat generated is taken away by the cold air between the fins of the air-cooled framework through the secondary cold plate.

[0011] The primary thermoelectric refrigeration piece is evenly distributed in the surrounding frame, and a gap is left between every two thermoelectric refrigeration pieces for wiring, and the gap between the thermoelectric refrigeration pieces is filled with thermal insulation cotton, so that the cold end of the primary refrigeration piece completely exchanges heat with the chip mounting plate and the chip, and the heat is completely taken away by the fin of the air-cooled framework 1.

[0012] The height of the surrounding frame is determined by the primary thermoelectric refrigeration piece and the heat-conducting gasket, that is, after the primary thermoelectric refrigeration piece and the heat-conducting gasket are tightly pressed by the chip mounting plate, the compression amount of the heat-conducting gasket is ensured to be 20%-30%, and the height of the surrounding frame ensures that it can just contact the chip mounting plate 6.

[0013] The air-cooled framework, the end face cover plate, the solar cell group, the thermoelectric refrigeration piece, the chip mounting plate and the secondary cooling assembly all exist independently, and are connected through screws between the modules; the primary thermoelectric refrigeration piece and the secondary refrigeration piece are connected with the power supply port of the storage battery through wires, and the required power for work is provided by the storage battery.

[0014] The beneficial effects of the present application are

[0015] 1. The solar cell group is installed on the fin end face, which can block most of the solar radiation to heat the air-cooled cold plate, and directly improve the heat dissipation capacity of the air-cooled cold plate.

[0016] 2. The solar cell panel supplies power to the thermoelectric refrigeration piece through the storage battery, forming a self-closing loop, which improves the economy of the system.

[0017] 3. The use of a primary thermoelectric cooling sheet to achieve cooling at the chip cold plate, breaking the temperature gradient limit of conventional heat sink cold plates, and raising the chip operating environment temperature to the ambient temperature + cooling sheet temperature difference, significantly improving the heat dissipation capacity of air-cooled cold plates.

[0018] 4. The secondary cooling assembly can dissipate heat from the solar cell group through the fin end cover, ensure the solar cell group to work at a lower temperature, improve the working efficiency and reliability of the solar cell group, and indirectly assist the heat dissipation of the air-cooled cold plate fins through the fin end cover, further improve the heat dissipation efficiency of the air-cooled cold plate. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structure of the present application is shown in the figure.

[0020] Figure 2 The structure of the present application is shown in the figure. Figure 1

[0021] Figure 3 The cross-sectional view is shown in the figure.

[0022] Figure 4 The structure of the air-cooled skeleton fin is shown in the figure.

[0023] Figure 5 The structure of the air-cooled skeleton base plate is shown in the figure.

[0024] Figure 6 The front structure of the end cover is shown in the figure.

[0025] Figure 7 The installation structure of the end cover and the secondary cooling assembly is shown in the figure.

[0026] Figure 8 The structure of the secondary cooling assembly is shown in the figure.

[0027] 1. The skeleton cold plate, 2. The end cover, 3. The solar cell group, 4. The heat-conducting gasket, 5. The primary thermoelectric cooling sheet, 6. The chip mounting plate, 7. The secondary cooling assembly, 8. The battery, 11. The fin screw hole, 12. The frame, 13. The chip mounting plate fixing hole, 21. The end cover through hole, 22. The end cover wiring slot, 71. The secondary cold plate, 72. The secondary cooling sheet, 73. The heat-conducting gasket, 74. The screw hole. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described below. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application. ​

[0029] This embodiment describes a high-efficiency air-cooled cold plate for solar-assisted thermoelectric cooling, such as... Figures 1-6 As shown, the system includes: an air-cooled frame 1 with a substrate and fins, a fin end cover plate 2 covering a solar cell array 3, a secondary cooling assembly 7 mounted on the fin end cover plate 2 near the fins, a primary thermoelectric cooling chip 5 with thermally conductive pads 4 pressed onto its top and bottom surfaces, and a chip mounting plate 6. The air-cooled frame 1 has evenly distributed threaded holes 11 at the fin ends, and the fin end cover plate 2 is pressed and fixed to the fin ends by screws. The substrate side end face of the air-cooled frame 1 has a frame 12 and screw holes 13, within which the primary thermoelectric cooling chip 5 and thermally conductive pads 4 are installed. The fin end cover plate 2 has countersunk through holes 21 and wiring grooves 22 on the side away from the fins, with the countersunk through holes 21 corresponding one-to-one with the threaded holes 11. The solar cell array 3 is fixed between the wiring grooves 22, and is attached to the fin end cover plate 2 after the end cover plate 2 is fixed to the fins, consisting of two or more solar cells. The solar cells are evenly arranged and connected in parallel on the end cover plate 2, and are connected to each other by wires arranged in the wiring groove 22. The wires are then connected to the power inlet of the battery 8, and the solar cells store the converted electrical energy in the battery 8. The secondary cooling assembly 7 includes a secondary cold plate 71, a secondary thermoelectric cooler 72, thermally conductive pads 73 attached to the upper and lower surfaces of the secondary thermoelectric cooler 72, and screw mounting holes 74. The screw mounting holes 74 are designed as countersunk through holes, and the secondary cooling assembly 7 is fixed to the fin end cover plate 2 by screws, and the installation position is at the fin spacing of the air-cooled frame 1. The cold end of the secondary thermoelectric cooler 72 faces the fin end cover plate 2, and indirectly provides auxiliary heat dissipation to the fins of the air-cooled frame 1 and the solar cells by reducing the temperature of the end cover plate 2. The secondary cold plate 71 has heat dissipation fins and shares the interfin cool air with the fins of the air-cooled frame 1 to achieve cooling of the secondary thermoelectric cooler 72. The hot end of the primary thermoelectric cooling chip 5 contacts the air-cooled frame 1 through a thermally conductive pad 4, and the cold end contacts the chip mounting plate 6 through a thermally conductive pad 4. The primary thermoelectric cooling chips 5 are evenly distributed within the frame 12, with gaps between every two cooling chips for wiring. The gaps between the cooling chips are filled with insulation cotton to ensure that the cold end of the primary thermoelectric cooling chip 5 is completely exchanged with the mounting plate 6, and the heat at the hot end is completely carried away by the fins of the air-cooled frame 1.

[0030] Its working principle is: when using the device to dissipate heat of the chip, the solar cell converts solar energy into electric energy, and the electric energy is used to power the first-stage refrigeration sheet and the second-stage refrigeration sheet; after the first-stage refrigeration sheet is powered, the first-stage refrigeration sheet starts to work and performs refrigeration at the chip mounting plate to provide a constant low-temperature environment for the heat-generating chip to ensure normal work; the heat generated by the hot end of the first-stage refrigeration sheet is transferred to the fins under the framework through the air-cooled cold plate, and the heat is finally taken away by the cold wind between the fins. When the second-stage refrigeration sheet works, refrigeration is performed at the end face cover plate, which provides a low-temperature installation and working environment for the solar cell on one hand, and provides auxiliary heat dissipation for the high-temperature cold plate fins on the other hand, so as to improve the heat dissipation efficiency, and the heat end temperature of the second-stage refrigeration sheet is taken away together by the cold wind between the fins.

[0031] The present application is not limited to the above specific embodiments, and various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made to the above embodiments according to the technical essence of the present application shall be included in the protection scope of the present application.

Claims

1. A high-efficiency air-cooled cold plate for solar-assisted thermoelectric cooling, characterized in that: It includes a finned air-cooled frame, a finned end face cover plate covered with solar cells, a secondary cooling component mounted on the finned end face cover plate near the fin side, a primary thermoelectric cooling chip with thermally conductive pads pressed on the top and bottom surfaces, and a chip mounting plate. The air-cooled frame has threaded holes evenly distributed at the ends of the fins. The threaded holes are used to press and fix the end face cover plate of the fins to the ends of the fins with screws. A secondary cooling component is installed on the end face cover plate near the fins and a solar cell array is fixed on the side away from the fins. A frame is provided on the end face of the substrate of the air-cooled frame. The frame is used to install the primary thermoelectric cooling chip and the thermal pad. The chip mounting plate is fixed on the air-cooled frame with screws. The solar cell array consists of two or more solar cells connected in parallel and installed between wiring channels; the solar cell array absorbs solar energy and converts it into electrical energy, which is then stored in a battery through wires. The air-cooled frame, end cover plate, solar cell array, thermoelectric cooling chip, chip mounting plate, and secondary cooling assembly are all independent, and the modules are connected by screws; the primary thermoelectric cooling chip and the secondary cooling chip are connected to the battery power supply port through wires, and the battery provides the power required for operation; The secondary cooling assembly consists of a secondary cold plate, a secondary thermoelectric cooling element, thermally conductive pads attached to the upper and lower surfaces of the secondary cooling element, and screw mounting holes. The screw mounting holes are countersunk holes, and the secondary cooling element is tightly pressed onto the end cover plate by countersunk screws. The installation position of the secondary cooling assembly is at the fin spacing of the air-cooled frame.

2. The high-efficiency air-cooled cold plate for solar-assisted thermoelectric cooling according to claim 1, characterized in that: The end face cover plate of the fin is provided with countersunk through holes and wiring grooves on the side away from the air-cooled frame fin. The countersunk through holes correspond one-to-one with the threaded holes on the fin and are used to fix the end face cover plate on the fin. The wiring groove is used for wiring inside the solar cell array. At the same time, the end face cover plate is provided with threaded holes on the side closer to the air-cooled frame fin for fixing the secondary cooling module.

3. The high-efficiency air-cooled cold plate for solar-assisted thermoelectric cooling according to claim 1, characterized in that: The secondary cold plate and the secondary thermoelectric cooling chip are both weaker in size and performance than the air-cooled frame and the primary thermoelectric cooling chip. The cold end of the secondary cooling chip is close to the end face cover plate, and the hot end is close to the secondary cold plate. During operation, the end face cover plate is cooled down, and the heat generated is carried away by the cold air between the fins of the air-cooled frame through the secondary cold plate.

4. The high-efficiency air-cooled cold plate for solar-assisted thermoelectric cooling according to claim 1, characterized in that: The primary thermoelectric cooling chips are evenly distributed throughout the frame, with gaps left between every two thermoelectric cooling chips for wiring. The gaps between the thermoelectric cooling chips are filled with insulation cotton to ensure that the cold end of the primary cooling chip exchanges heat with the chip through the chip mounting plate, and the heat is completely carried away by the fins of the air-cooled frame 1.

5. The high-efficiency air-cooled cold plate for solar-assisted thermoelectric cooling according to claim 1, characterized in that: The height of the frame is determined by the primary thermoelectric cooling chip and the thermally conductive pad. That is, after the primary thermoelectric cooling chip and the thermally conductive pad are pressed by the chip mounting plate, the compression of the thermally conductive pad is guaranteed to be 20%-30%, and the height of the frame is guaranteed to be in just contact with the chip mounting plate.

Images