Solid cooling target device of cyclotron

Through the design of solid cooling target devices in the rotation accelerator, efficient cooling is used to use microstructure structures and shot nozzles, solving the complexity and efficiency of traditional water -cooled systems, and significantly improved the production efficiency of the target production and equipment.

CN119342677AActive Publication Date: 2025-01-21INST OF MODERN PHYSICS CHINESE ACADEMY OF SCI +1
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Patent Information

Application Number
CN202411616340.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2025-01-21
Estimated Expiration
2044-11-13

AI Technical Summary

Technical Problem

Traditional water-cooled systems have complex pipeline design and maintenance difficulties in cyclotrons, risks of extreme temperature and high-pressure environments, insufficient heat conduction efficiency, and complex installation and disassembly processes in the system, which affect the normal operation of the equipment and the accuracy of experiments.

Method used

A solid cooling target device is designed, including solid target bases, target base boards, cooling bases, and shooting spray pipes. Through the design of the microstructure structure and the design of the shot nozzle, it achieves efficient cooling liquid circulation and heat transmission.

Benefits of technology

It significantly increases the target yield, improves production efficiency and product quality, ensures the stability of the target under high-energy particle bombardment, extends the service life, simplifies the installation and disassembly process of the device, and improves maintenance efficiency.

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Abstract

The invention discloses a solid cooling target device of a cyclotron. The solid cooling target device comprises a solid target base; the target substrate is mounted in the solid target base and hermetically separates the upper end and the lower end of the solid target base, the upper surface of the target substrate forms a target material bearing surface, and the lower surface of the target substrate forms a cooling surface; the upper end of the cooling base is in sealed connection with the lower end of the solid target base, and a liquid feeding channel and a liquid returning channel which are communicated with the inner cavity are formed in the cooling base; and the jet flow spraying pipe is installed in the cooling base, the inlet end of the jet flow spraying pipe is communicated with the liquid feeding channel, the outlet end of the jet flow spraying pipe is located below the target substrate, a cooling liquid annular cavity allowing cooling liquid to flow is formed between the jet flow spraying pipe and the cooling base, and the cooling liquid annular cavity is communicated with the liquid returning channel. According to the invention, heat generated during interaction of high-energy particles and a target material can be effectively coped with, efficient cooling of a target piece is realized, the yield of radionuclides is improved, and meanwhile, the safety and stability of equipment operation are ensured.
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Description

Technical Field

[0001] The invention relates to the field of particle accelerator radio frequency superconducting technology, in particular to a solid cooling target device of a cyclotron accelerator. Background Art

[0002] As an important particle accelerator, cyclotron is widely used in many fields such as physics, chemistry, materials science and medicine. In the medical field, cyclotron is mainly used to produce radioactive isotopes, which play a vital role in medical diagnosis and treatment. The solid target in the cyclotron is a key component for producing radionuclides. It produces nuclides used in medical diagnosis and treatment through interaction with high-energy charged particles generated by the accelerator.

[0003] When particles interact with target materials, a large amount of heat is generated. If the heat is not handled promptly and effectively, the target material will overheat or even melt, which will affect the normal operation of the equipment and the accuracy of the experiment. In order to maintain the stability of the target material and extend its service life, the solid target must be cooled. Traditional cooling methods mainly rely on water cooling systems to remove heat through cooling water circulation. However, traditional cooling systems have the following major problems: 1) Complex pipeline design and maintenance: Traditional cooling systems require a complex pipeline network to ensure that the cooling water can cover the entire surface of the target material. This complex design not only increases the construction cost and maintenance difficulty of the system, but is also prone to blockage, leakage and other problems.

[0004] 2) Risks of extreme temperature and high pressure environment: Under the bombardment of high-energy particles, the surface temperature of the target material rises sharply, and the cooling system must work in extreme temperature and high pressure environment. Traditional cooling systems are prone to leakage under these conditions, resulting in reduced cooling efficiency and even possible safety accidents.

[0005] 3) Insufficient heat conduction efficiency: Due to the limited heat conduction efficiency between the solid target and the cooling water, the traditional cooling system is difficult to quickly and effectively transfer the heat on the surface of the target material to the cooling water, resulting in local overheating of the target material, affecting the stability of the nuclear reaction and the yield of radioactive isotopes.

[0006] 4) In traditional cooling systems, the installation and disassembly process is complicated and time-consuming, involving the alignment of multiple precision parts and manual operations, resulting in low work efficiency. The high-intensity and complex operations not only prolong the equipment downtime, but also increase the difficulty and cost of maintenance.

[0007] In addition, operators are exposed to radioactive environments when performing these tasks and face serious health risks, including long-term health problems and psychological stress caused by radiation exposure, which together affect production efficiency and safety. Summary of the invention

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a solid cooling target device for a cyclotron accelerator, which aims to effectively deal with the heat generated when high-energy particles interact with target materials, achieve efficient cooling of the target, increase the yield of radioactive nuclides, and ensure the safety and stability of the equipment operation.

[0009] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a solid cooling target device of a cyclotron accelerator, comprising: a solid target base, which is an annular structure with two open ends, and the upper end of the solid target base forms the incident end of the particle beam; a target substrate, which is installed inside the solid target base and seals and separates the upper and lower ends of the solid target base, the upper surface of the target substrate forms a target material bearing surface, and the lower surface of the target substrate forms a cooling surface; a cooling base, which is a tubular structure with an open upper end and a closed lower end, and the upper end of the cooling base is sealed and connected to the lower end of the solid target base. A liquid supply channel and a liquid return channel connected to the inner cavity are formed on the cooling base; a jet nozzle is installed inside the cooling base, and the inlet end of the jet nozzle is connected to the liquid supply channel, and the outlet end of the jet nozzle is located below the target substrate to spray coolant onto the cooling surface of the target substrate, and a cooling liquid annular cavity for cooling liquid to flow is formed between the jet nozzle and the cooling base, and the cooling liquid annular cavity is connected to the liquid return channel, so that the liquid supply channel, the jet nozzle, the cooling liquid annular cavity and the liquid return channel together form a cooling liquid circulation loop.

[0010] Preferably, a plurality of microchannel structures arranged in parallel and at intervals are provided on the cooling surface of the target substrate.

[0011] Preferably, the target substrate is installed obliquely inside the solid target base to form an inclined surface of 5-30 degrees.

[0012] Preferably, the jet nozzle comprises a jet nozzle, a jet main pipe and a connecting portion which are integrally arranged from top to bottom, an external thread is formed on the connecting portion, an internal thread is formed in the cooling base, and a detachable threaded connection is formed between the connecting portion and the cooling base.

[0013] Preferably, a duckbill-shaped or conical fluid contraction section is formed inside the jet nozzle.

[0014] Preferably, the angle of the fluid contraction section of the jet nozzle is between 10° and 45°.

[0015] Preferably, the lower end of the solid target base is internally recessed outward to form an arc-shaped spoiler area.

[0016] Preferably, the solid target base and the cooling base are fastened together by a flange and a clamp.

[0017] Preferably, a central support sealing ring is provided at the joint between the solid target base and the cooling base.

[0018] The present invention adopts the above technical solution, which has the following advantages: 1. The present invention effectively increases the projected area of ​​the particle beam by designing the angle between the target substrate, the solid target base and the particle beam, and the interaction area between the particles and the target material is also increased, thereby significantly improving the yield of the target material, improving the production efficiency and product quality, and has important practical value and broad application prospects.

[0019] 2. The present invention arranges a microchannel structure on the cooling surface of the target substrate. The design of the microchannel structure significantly increases the contact area between the coolant and the target substrate, so that the heat can be quickly transferred to the coolant, avoiding overheating and melting of the target material, ensuring the stability of the target material under high-energy particle bombardment, and extending the service life of the target material.

[0020] 3. The end of the jet nozzle of the present invention is provided with a duckbill-shaped or conical fluid contraction section, which can efficiently spray the coolant onto the cooling surface of the target substrate, ensure the uniform distribution and efficient flow of the coolant, improve the utilization rate of the coolant, reduce the waste of the coolant, and maximize the cooling efficiency.

[0021] 4. The cooling base and the jet nozzle of the present invention are fixed in a detachable manner. This design simplifies the installation and disassembly process of the device. The operator can quickly replace the nozzle and other components, which greatly improves the maintenance efficiency and operability of the equipment, reduces equipment downtime, and improves overall production efficiency.

[0022] 5. The cooling base of the present invention is connected to the solid target base through flanges and clamps, which can not only ensure the stability and sealing of the overall device, but also reduce the time and manpower required for installation and disassembly, thereby improving work efficiency.

[0023] 6. The flange and clamp connection and the separate jet nozzle design of the present invention make it easy to replace the target. The operator can quickly and remotely complete the installation and removal of the target through the operation of the robotic arm, avoiding the health risks of the operator being exposed to the radiation environment for a long time, reducing radiation exposure, and at the same time speeding up the replacement of the target and improving the operation continuity of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Throughout the accompanying drawings, the same reference numerals are used to represent the same components. In the accompanying drawings: Figure 1 A schematic diagram of the assembly of a solid cooling target device provided by an embodiment of the present invention; Figure 2 An exploded schematic diagram of a solid cooling target device provided by an embodiment of the present invention; Figure 3 A cross-sectional schematic diagram of a solid cooling target device provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of the target substrate cooling surface provided by an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a jet nozzle provided in an embodiment of the present invention.

[0025] The reference numerals in the figures are as follows: 1-solid target base; 2-target substrate; 3-cooling base; 4-liquid supply channel; 5-liquid return channel; 6-jet nozzle; 7-cooling liquid ring cavity; 8-flange and clamp; 9-center bracket sealing ring; 2a-microchannel structure; 6a-jet nozzle; 6b-jet main pipe; 6c-connecting part. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the present invention clearer, the specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0027] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0032] The solid cooling target device of the cyclotron provided by the present invention comprises: a solid target base 1; a target substrate 2, which is installed inside the solid target base 1 and seals and separates the upper and lower ends of the solid target base 1, and the upper surface forms a target material bearing surface, and the lower surface forms a cooling surface; a cooling base 3, the upper end of the cooling base 3 is sealed and connected to the lower end of the solid target base 1, and the cooling base 3 is formed with a liquid supply channel 4 and a liquid return channel 5 connected to the inner cavity; a jet nozzle 6, which is installed inside the cooling base 3, and the inlet end of the jet nozzle 6 is connected to the liquid supply channel 4, the outlet end of the jet nozzle 6 is located below the target substrate 2, and a cooling liquid annular cavity 7 for cooling liquid to flow is formed between the jet nozzle 6 and the cooling base 3, and the cooling liquid annular cavity 7 is connected to the liquid return channel 5. The present invention can effectively deal with the heat generated when high-energy particles interact with target materials, realize efficient cooling of the target, improve the yield of radioactive nuclides, and ensure the safety and stability of equipment operation.

[0033] The solid cooling target device of the cyclotron provided by the embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0034] See also Figures 1 to 3 The present embodiment provides a solid cooling target device for a cyclotron, comprising: a solid target base 1, which is an annular structure with two open ends, and the upper end of the solid target base 1 forms an incident end of a particle beam; a target substrate 2, which is installed inside the solid target base 1 and seals and separates the upper and lower ends of the solid target base 1, the upper surface of the target substrate 2 forms a target material bearing surface, and the lower surface of the target substrate 2 forms a cooling surface; a cooling base 3, which is a tubular structure with an open upper end and a closed lower end, the upper end of the cooling base 3 is sealed and connected to the lower end of the solid target base 1, and a liquid supply channel 4 and a liquid return channel 5 connected to the inner cavity are formed on the cooling base 3; The jet nozzle 6 is installed inside the cooling base 3, and the inlet end of the jet nozzle 6 is connected with the liquid supply channel 4, and the outlet end of the jet nozzle 6 is located below the target substrate 2 to spray the coolant onto the cooling surface of the target substrate 2. A coolant annular cavity 7 for the coolant to flow is formed between the jet nozzle 6 and the cooling base 3, and the coolant annular cavity 7 is connected with the liquid return channel 5, so that the liquid supply channel 4, the jet nozzle 6, the coolant annular cavity 7 and the liquid return channel 5 together form a coolant circulation loop, which not only ensures the efficient circulation of the coolant, but also realizes the effective separation of the liquid supply and the liquid return, thereby avoiding the additional pressure loss caused by the mixed flow.

[0035] In the above embodiments, preferably, please refer to Figure 4 A plurality of parallel and spaced microchannel structures 2a are provided on the cooling surface of the target substrate 2. This design can increase the contact area between the coolant and the target substrate 2, thereby improving the flow efficiency and cooling effect.

[0036] In the above embodiments, preferably, please refer to Figure 3The target substrate 2 is installed obliquely inside the solid target base 1 to form an inclined surface of 5 to 30 degrees. This design can make the target substrate 2 form a certain angle with the incident particle beam, effectively increasing the projection area of ​​the positive direction particle beam on the target substrate 2, thereby significantly improving the yield of radioactive nuclides.

[0037] In the above embodiments, preferably, please refer to Figure 3 , Figure 5 The jet nozzle 6 includes a jet nozzle 6a, a jet main pipe 6b and a connecting portion 6c which are integrally arranged from top to bottom, and an external thread is formed on the connecting portion 6c, and an internal thread is formed in the cooling base 3. A detachable threaded connection is formed between the connecting portion 6c and the cooling base 3. The separate design of the jet nozzle 6 and the cooling base 3 can not only ensure the efficient flow of the coolant, but also optimize the compatibility and replaceability of the cooling target device.

[0038] In the above embodiment, preferably, a duckbill-shaped or conical fluid contraction section is formed inside the jet nozzle 6a, which can not only optimize the flow characteristics of the coolant inside the jet nozzle 6, but also improve the working efficiency of the jet nozzle 6 and the injection performance of the coolant. Furthermore, the angle of the fluid contraction section of the jet nozzle 6a is between 10 and 45 degrees to meet different cooling requirements.

[0039] In the above embodiments, preferably, please refer to Figure 3 The inner wall of the solid target base 1 located below the target substrate 2 is recessed outward to form an arc-shaped turbulence zone. This geometric shape can effectively reduce the turbulence generated by the coolant flowing through this area.

[0040] In the above embodiments, preferably, please refer to Figure 1 , Figure 3 The solid target base 1 and the cooling base 3 are fastened together by a flange and a clamp 8, and a center bracket sealing ring 9 is provided at the joint between the solid target base 1 and the cooling base 3, thereby ensuring the sealing and stability of the overall structural connection, preventing leakage of the coolant, and realizing the rapid disassembly function of the solid target base 1 and the cooling base 3.

[0041] When the solid cooling target device of the cyclotron provided in the above embodiment is used, its working principle is as follows: The cooling liquid (such as water) enters the jet nozzle 6 through the liquid supply channel 4 of the cooling base 3, and the cooling liquid is ejected from the jet nozzle 6a of the jet nozzle 6 and sprayed to the microchannel structure 2a on the cooling surface of the target substrate 2 in a high pressure form; The heat generated by high-energy particles bombarding the target material is transferred to the coolant through the target substrate 2. The microchannel structure 2a design increases the contact area between the coolant and the target substrate 2, ensuring that the heat is quickly taken away, preventing the target material from overheating, and ensuring that the target material is continuously kept within a safe temperature range; The heated coolant flows back through the coolant annular cavity 7 formed between the jet nozzle 6 and the cooling base 3, forming an efficient coolant circulation loop. The design of this reflux path not only improves the cooling efficiency, but also helps to maintain the continuity and uniformity of the coolant flow. Finally, the coolant is discharged from the device through the liquid return channel 5 to facilitate the recovery and recycling of the coolant, further optimizing the efficiency and sustainability of the entire solid cooling target device.

[0042] In addition, the pressure and flow rate of the liquid supply channel 4 can be controlled to adjust the cooling water flow generated by the jet nozzle 6 to achieve precise cooling of the target substrate 2.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A solid cooling target device for a cyclotron, characterized in that: include: The solid target base is a ring-shaped structure with two open ends, and the upper end of the solid target base forms the incident end of the particle beam; A target substrate is installed inside the solid target base and seals and separates the upper and lower ends of the solid target base, wherein the upper surface of the target substrate forms a target material bearing surface, and the lower surface of the target substrate forms a cooling surface; The cooling base is a tubular structure with an open upper end and a closed lower end. The upper end of the cooling base is sealed and connected to the lower end of the solid target base. A liquid supply channel and a liquid return channel communicating with the inner cavity are formed on the cooling base. A jet nozzle is installed inside the cooling base, and the inlet end of the jet nozzle is connected to the liquid supply channel, and the outlet end of the jet nozzle is located below the target substrate to spray the cooling liquid onto the cooling surface of the target substrate. A cooling liquid annular cavity for the flow of cooling liquid is formed between the jet nozzle and the cooling base, and the cooling liquid annular cavity is connected to the liquid return channel, so that the liquid supply channel, the jet nozzle, the cooling liquid annular cavity and the liquid return channel together form a cooling liquid circulation loop.

2. The solid cooling target device according to claim 1, characterized in that: A plurality of micro-channel structures arranged in parallel and at intervals are arranged on the cooling surface of the target substrate.

3. The solid cooling target device according to claim 1, characterized in that: The target substrate is installed obliquely inside the solid target base to form an inclined surface of 5-30 degrees.

4. The solid cooling target device according to claim 1, characterized in that: The jet nozzle comprises a jet nozzle, a jet main pipe and a connecting part which are integrally arranged from top to bottom. The connecting part is formed with an external thread, and the cooling base is formed with an internal thread. A detachable threaded connection is formed between the connecting part and the cooling base.

5. The solid cooling target device according to claim 4, characterized in that: A duckbill-shaped or conical fluid contraction section is formed inside the jet nozzle.

6. The solid cooling target device according to claim 5, characterized in that: The angle of the fluid contraction section of the jet nozzle is between 10 and 45 degrees.

7. The solid cooling target device according to claim 1, characterized in that: The interior of the lower end of the solid target base is concave outward to form an arc-shaped spoiler area.

8. The solid cooling target device according to claim 1, characterized in that: The solid target base and the cooling base are tightly connected via a flange and a clamp.

9. The solid cooling target device according to claim 8, characterized in that: A central support sealing ring is provided at the joint between the solid target base and the cooling base.

Citation Information

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