Bending-resistant circuit board structure and manufacturing method thereof

Abstract

The invention provides a bending-resistant circuit board structure and a manufacturing method thereof. The bending-resistant circuit board structure comprises a lower bending part and an upper bending part. The lower bending part comprises a lower insulating layer, a neutral layer, a plurality of hierarchical memory metal wires and a plurality of guide columns. The top surfaces of the guide columns are distributed in a step shape. The upper bending part is arranged on the lower bending part and comprises an upper insulating layer, a circuit layer and a cavity part with a stepped top surface; the upper insulating layer is arranged on the lower bending part and comprises a plurality of through holes, wherein the guide pillars are aligned with the through holes. Wherein the height of the upper bending part is equal to that of the lower bending part. During bending, the guide columns are inserted into the through holes, so that the supporting performance and the reliability are improved. Through the stepped configuration, the bending stress is reduced, and the bending capability is further improved.

Description

Technical Field

[0001] The present disclosure relates to a circuit board structure, and more particularly to a bending-resistant circuit board structure and a manufacturing method thereof. Background Art

[0002] Currently, electronic products with bendable screens have air gaps at the bends to achieve the purpose of repeated bendability. However, the air gaps have no support, so after the bendable screen is bent, the bendable screen in the air gap section is prone to being uneven. The lack of support at the air gap will also affect reliability. Summary of the invention

[0003] Therefore, an object of the present disclosure is to provide a bending-resistant circuit board structure and a manufacturing method thereof, thereby providing support and improving reliability.

[0004] According to the above-mentioned purpose of the present disclosure, a bending-resistant circuit board structure is proposed. The bending-resistant circuit board structure includes a lower bending portion and an upper bending portion. The lower bending portion includes a lower insulating layer, a neutral layer, a plurality of hierarchical memory metal traces and a plurality of guide pillars. The neutral layer is arranged on the top of the lower insulating layer. The plurality of hierarchical memory metal traces are arranged in the lower insulating layer and connected to the neutral layer. The guide pillars are arranged in the neutral layer at intervals, wherein the top surfaces of the plurality of guide pillars are distributed in a hierarchical manner. The upper bending portion is arranged on the lower bending portion and includes an upper insulating layer, a circuit layer and a cavity portion. The upper insulating layer is arranged on the lower bending portion and includes a plurality of through holes, wherein the guide pillars are respectively aligned with the through holes. The circuit layer is arranged on the top of the upper insulating layer and covers the plurality of through holes. The cavity portion is located between the upper insulating layer and the lower insulating layer, and the cavity portion includes a hierarchical top surface, wherein the through holes are located between the circuit layer and the hierarchical top surface. The height of the upper bending portion is equal to the height of the lower bending portion. When the bending-resistant circuit board structure is bent, the plurality of guide pillars are respectively inserted into the plurality of through holes.

[0005] In at least one embodiment of the present invention, the lower bending portion includes a protection layer, which is disposed on the bottom surface of the lower insulating layer and covers a portion of the hierarchical memory metal wiring exposed on the bottom surface of the lower insulating layer.

[0006] In at least one embodiment of the present invention, the bottom surface of the lower insulating layer and the bottom surface of the protective layer form a stepped bottom surface.

[0007] In at least one embodiment of the present invention, an insulating coating is disposed on an outer side surface of each of the guide pillars.

[0008] In at least one embodiment of the present invention, the guide pillar is divided into a central guide pillar and a plurality of side guide pillars. The central guide pillar is located in the middle of the neutral layer. The plurality of side guide pillars surround the central guide pillar and are respectively connected to the hierarchical memory metal wiring. The height of each of the side guide pillars is greater than the height of the central guide pillar, and the height of the side guide pillars increases from the central guide pillar toward the side wall of the upper insulating layer.

[0009] In at least one embodiment of the present invention, the circuit layer includes a plurality of protrusions, the plurality of protrusions are respectively located in the through holes, and an end surface of each of the protrusions faces a corresponding one of the guide pillars.

[0010] In at least one embodiment of the present invention, the guide pillar abuts against and is electrically connected to the protrusion.

[0011] According to the above-mentioned purpose of the present invention, a manufacturing method of a bending-resistant circuit board structure is proposed, comprising providing a lower bending portion and an upper bending portion; and combining the upper bending portion on the lower bending portion, and forming a cavity between the upper bending portion and the lower bending portion, so that a plurality of guide pillars of the lower bending portion are located in the cavity and aligned with a plurality of through holes of the upper bending portion.

[0012] In at least one embodiment of the present invention, the manufacturing method of the lower bending portion includes providing a substrate and etching a memory metal layer of the substrate; forming a photosensitive insulating material layer on the etched memory metal layer; depositing a metal pattern layer on the memory metal layer to form a plurality of hierarchical memory metal traces in the photosensitive insulating material layer; laminating a protective layer on the photosensitive insulating material layer and covering the hierarchical memory metal traces and removing a release film of the substrate; partially removing the protective layer and the photosensitive insulating material layer to form a hierarchical bottom surface; forming a plurality of guide pillars on the etched memory metal layer, wherein the top surfaces of the guide pillars are distributed in a hierarchical manner; and forming a plurality of insulating coatings on the outer side surfaces of the guide pillars.

[0013] In at least one embodiment of the present invention, the manufacturing method of the upper bending portion includes providing a substrate; forming a plurality of protrusions on a metal layer of the substrate; forming a surface treatment layer on each of the protrusions; bonding an insulating material to the metal layer, the protrusions and the surface treatment layer, and removing a release film of the substrate; etching the metal layer to form a circuit layer; and forming a cavity and a plurality of through holes in the insulating material, wherein the surface treatment layer is respectively located in the through holes.

[0014] Based on the above, the bending-resistant circuit board structure of the present invention can reduce bending stress and improve bending ability when bending through the step-shaped memory metal routing, the top surface of the guide pillar distributed in a step-shaped manner, and the cavity with the step-shaped top surface. When bending, the guide pillar is inserted into the through hole, and the bending part of the circuit board is supported to avoid unevenness, thereby achieving the purpose of improving support and reliability and improving the overall structural strength after bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0016] Figure 1 A cross-sectional schematic diagram of a bending-resistant circuit board structure and components according to at least one embodiment of the present invention is shown;

[0017] Figure 2 Draw Figure 1 Schematic diagram of the bending state of the bending-resistant circuit board structure;

[0018] Figure 3A and Figure 3B Draw Figure 1 A cross-sectional schematic diagram of a method for manufacturing a bending-resistant circuit board structure;

[0019] 4A to 4F A cross-sectional schematic diagram showing a method for manufacturing the lower bending portion in FIG. 3 ; and

[0020] FIG. 5A to FIG. 5F FIG. 3 is a cross-sectional schematic diagram showing a method for manufacturing the upper bending portion. DETAILED DESCRIPTION

[0021] The following is a detailed discussion of embodiments of the present invention. However, it is understood that the embodiments provide many applicable concepts that can be implemented in a variety of specific contexts. The embodiments discussed and disclosed are for illustration only and are not intended to limit the scope of the present invention. For example, the description of "a first feature formed on a second feature" includes embodiments in which the first feature is in direct contact with the second feature, and also includes embodiments in which other features are formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact.

[0022] In addition, spatially relative terms, such as "below," "below," "above," "above," etc., are used to simply describe the relationship of an element or feature illustrated in the drawings to other elements or features. These spatially relative terms also cover different orientations of use or operation in addition to the orientation depicted in the drawings. When an element can be oriented in other ways (rotated 90 degrees or in other orientations), the spatially relative descriptions used herein can be interpreted accordingly.

[0023] See also Figure 1, which depicts a cross-sectional schematic diagram of a bending-resistant circuit board structure 100 combined with a component 200 according to at least one embodiment of the present invention. The bending-resistant circuit board structure 100 includes a lower bending portion 110 and an upper bending portion 120. The height H1 of the upper bending portion 120 is equal to the height H2 of the lower bending portion 110. A fixed area is formed in the middle position of the bending-resistant circuit board structure 100, thereby improving the positioning accuracy during bending. Specifically, the position of the neutral layer 112 is located in the middle position of the bending-resistant circuit board structure 100, and the implementation method is to set the thickness of the stacked material so that the thickness (height) of the upper and lower structures is equal, so that the neutral layer 112 is located in a fixed area. Among them, the position of the neutral layer 112 is a key structure for supporting the guide pillar 114, and the network setting of the neutral layer 112 is also the most, in order to reduce the influence of bending on the network signal and the guide pillar 114. Therefore, the setting of the position of the neutral layer 112 can further ensure the bending reliability and electrical quality of the entire stacked structure of the bending-resistant circuit board structure 100 .

[0024] like Figure 1 The component 200 shown can be disposed on the upper bending portion 120 and electrically connected to the upper bending portion 120. When the bending-resistant circuit board structure 100 is flattened, the component 200 and the lower bending portion 110 are not electrically connected.

[0025] Next Read Figure 2 , which shows Figure 1 FIG. 1 is a schematic diagram of a bending state of the bending resistant circuit board structure 100. When the bending resistant circuit board structure 100 is bent, the guide pillar 114 of the lower bending portion 110 is inserted into the through hole 121h of the upper bending portion 120, so that the component 200 is electrically connected to the lower bending portion 110. Therefore, when bending, the function of the component 200 can be triggered.

[0026] Continue reading Figure 1 The lower bending portion 110 includes a lower insulating layer 111, a neutral layer 112, a plurality of hierarchical memory metal traces 113, a plurality of guide pillars 114 and a protective layer 115. The neutral layer 112 is disposed on the top of the lower insulating layer 111. The neutral layer 112 is made of a metal material, and can further be made of a memory metal material.

[0027] Continue reading Figure 1 The hierarchical memory metal wiring 113 is disposed in the lower insulating layer 111, arranged at intervals and connected to the neutral layer 112. The hierarchical memory metal wiring 113 is made of a memory metal material, including but not limited to gold-cadmium (Au-Cd) alloy, silver-cadmium (Ag-Cd) alloy, copper-zinc (Cu-Zn) alloy, and titanium-nickel (TiNi) alloy. The stress during bending can be reduced by the memory property and ductility of the memory metal.

[0028] In one example, the hierarchical memory metal wiring 113 includes at least one hierarchical layer. Furthermore, the bottom surface 113s of the hierarchical memory metal wiring 113 also forms a hierarchical distribution. Specifically, the distance D from the bottom surface 113s of the hierarchical memory metal wiring 113 to the top surface 112s of the neutral layer 112 gradually increases from the middle to the outside. Figure 1 , these step-shaped memory metal traces 113 can be symmetrically arranged with respect to the bending reference axis L of the bendable circuit board structure 100. That is, the step-shaped memory metal traces 113 located on both sides of the bending reference axis L are mirror-symmetrical with respect to the bending reference axis L. Specifically, the distance from the bottom surface 113s of the step-shaped memory metal trace 113 adjacent to the bending reference axis L to the top surface 112s of the neutral layer 112 is smaller than the distance from the bottom surface 113s of the step-shaped memory metal trace 113 away from the bending reference axis L to the top surface 112s of the neutral layer 112.

[0029] Continue reading Figure 1 , these guide pillars 114 are arranged at intervals in the neutral layer 112, wherein the top surfaces 114s of these guide pillars 114 are distributed in a stepped manner. In one example, these guide pillars 114 are divided into a central guide pillar 114a and a plurality of side guide pillars 114b. The central guide pillar 114a is located in the middle section of the neutral layer 112. That is, the central guide pillar 114a is located on the bending reference axis L. These side guide pillars 114b surround the central guide pillar 114a and are respectively connected to the stepped memory metal traces 113. The height H3 of each side guide pillar 114b is greater than the height H3' of the central guide pillar 114a, and the height H3 of the side guide pillar 114b increases from the central guide pillar 114a toward the side wall 121w of the upper insulating layer 121. That is, the height H3' of the central guide pillar 114a is the smallest, and the height H3 of the side guide pillar 114b that is farther away from the central guide pillar 114a is larger.

[0030] In one example, an insulating coating 116 is provided on the outer side of the guide post 114. The insulating coating 116 does not cover the top surface 114s of the guide post 114 facing the through hole 121h. When bent, the insulating coating 116 is located between the guide post 114 and the inner wall of the aligned through hole 121h. The material of the insulating coating 116 can be selected from polytetrafluoroethylene (PTFE). The insulating coating 116 can reduce the friction coefficient and reduce the influence of static electricity.

[0031] Continue reading Figure 1 The protection layer 115 is disposed on the bottom surface of the lower insulating layer 111 and covers a portion of the stepped memory metal wiring 113 exposed on the bottom surface of the lower insulating layer 111. The bottom surface of the lower insulating layer 111 and the bottom surface of the protection layer 115 form a stepped bottom surface BS.

[0032] Continue reading Figure 1, the upper bending portion 120 is disposed on the lower bending portion 110. The upper bending portion 120 includes an upper insulating layer 121, a circuit layer 122 and a cavity 123. The upper insulating layer 121 is disposed on the lower bending portion 110. In one example, the upper insulating layer 121 is a structure of the same material as a whole, and has better structural strength, so that it will not cause delamination and fracture when bent. The upper insulating layer 121 includes a plurality of through holes 121h. Among them, these guide pillars 114 of the lower bending portion 110 are respectively aligned with these through holes 121h. Specifically, the height H3' of the central guide pillar 114a is equal to the height H4' of the aligned through hole 121h, and the height H3 of the side guide pillar 114b is equal to the height H4 of the aligned through hole 121h. Since the height H3' of the central guide pillar 114a is the smallest, and the height H3 of the side guide pillar 114b farther away from the central guide pillar 114a is larger, the heights H4 and H4' of the through hole 121h also change with the heights H3 and H3' of the guide pillar 114. Figure 2 As shown, when bending, the side guide post 114b farthest from the central guide post 114a will deflect and first insert into the through hole 121h it is aligned with, followed by the side guide post 114b between the central guide post 114a and the side guide post 114b farthest from the central guide post 114a inserting into the through hole 121h it is aligned with, and finally the central guide post 114a inserting into the through hole 121h it is aligned with. Since the central guide post 114a is located in the middle section of the neutral layer 112, there is no deformation here. Furthermore, when bending, the guide post 114 is inserted into the through hole 121h, and the guide post 114 can provide support and improve the structural strength.

[0033] Continue reading Figure 1 , the circuit layer 122 includes a plurality of protrusions 124 and a plurality of surface treatment layers 125. These protrusions 124 are respectively located in the through holes 121h. The end surface of each protrusion 124 faces the corresponding guide post 114. That is, the protrusion 124 and the through hole 121h are in a one-to-one correspondence relationship, and the protrusion 124 and the guide post 114 are also in a one-to-one correspondence relationship. The surface treatment layer 125 is arranged on the end surface of the protrusion 124. That is, the surface treatment layer 125 is located between the protrusion 124 and the guide post 114.

[0034] Read also Figure 1 and Figure 2 When the bending-resistant circuit board structure 100 is bent, the guide pillar 114 abuts against the surface treatment layer 125 and is electrically connected to the protrusion 124. The surface treatment layer 125 has the function of reducing resistance and preventing oxidation.

[0035] like Figure 1 As shown, the cavity 123 is located between the upper insulating layer 121 and the lower insulating layer 111. The cavity 123 includes a stepped top surface TS, wherein the through hole 121h is located between the circuit layer 122 and the stepped top surface TS. Figure 2As shown, when the bending-resistant circuit board structure 100 is bent, the upper bending portion 120 and the lower bending portion 110 are bent and deformed, the through hole 121h is filled with the guide column 114, and the cavity 123 is gradually filled with the lower bending portion 110. The space provided by the through hole 121h and the cavity 123 can be used as a stress release area to reduce the stress during bending deformation. Furthermore, the cavity 123 is filled, reducing the air gap AG between the upper bending portion 120 and the lower bending portion 110, so that the contact area between the upper bending portion 120 and the lower bending portion 110 is increased, and the upper bending portion 120 and the lower bending portion 110 are generally an integral structure, thereby improving the overall structural strength after bending.

[0036] See also Figure 3A and Figure 3B , which shows Figure 1 A cross-sectional schematic diagram of a method for manufacturing a bending-resistant circuit board structure 100 is shown in FIG. Figure 3A First, a lower bending portion 110 and an upper bending portion 120 are provided. Figure 3B Then, the upper bending portion 120 is combined with the lower bending portion 110, and a cavity 123 is formed between the upper bending portion 120 and the lower bending portion 110, so that the guide post 114 of the lower bending portion 110 is located in the cavity 123 and aligned with the through hole 121h of the upper bending portion 120. The upper bending portion 120 and the lower bending portion 110 are combined with adhesive A.

[0037] See also 4A to 4F , a cross-sectional schematic diagram of a manufacturing method of the lower bending portion 110 in FIG3 is shown. Figure 4A First, a substrate 300 is provided and the memory metal layer 310 of the substrate 300 is etched to form a neutral layer 112. Figure 4B , forming a photosensitive insulating material layer 400 on the etched memory metal layer 310, and patterning the photosensitive insulating material layer 400. Figure 4C , a metal pattern layer 500 is deposited on the memory metal layer 310 , and metal pattern layers 500 are deposited layer by layer according to requirements to form a hierarchical memory metal wiring 113 .

[0038] Since the hierarchical memory metal wiring 113 formed by stacking deposition is made of the same material, stress can be reduced and bending ability can be improved, and cracks are not easily generated during bending. Figure 4D , the protective layer 115 is laminated on the photosensitive insulating material layer 400 and covers the hierarchical memory metal traces 113 and the release film 320 (such as Figure 4C ). Then Figure 4E , partially remove the protective layer 115 and the photosensitive insulating material layer 400 to form a stepped bottom surface BS. Figure 4FThe guide pillars 114 are formed on the etched memory metal layer 310 by printing or electroplating, wherein the top surfaces 114s of the guide pillars 114 are distributed in a stepped manner. Then, an insulating coating 116 is formed on the outer side surfaces of the guide pillars 114 .

[0039] See also FIG. 5A to FIG. 5F , a cross-sectional schematic diagram of a manufacturing method of the upper bending portion 120 in FIG. 3 is shown. Figure 5A First, a substrate 600 is provided. Then, Figure 5B , by electroplating or printing, a convex portion 124 is formed on the metal layer 610 of the substrate 600. Figure 5C , forming a surface treatment layer 125 on the protrusion 124. Figure 5D , the insulating material 700 is attached to the metal layer 610, the protrusion 124 and the surface treatment layer 125, that is, the insulating material 700 covers the bottom surface of the metal layer 610, the outer side surface of the protrusion 124 and the bottom surface of the surface treatment layer 125. Then, the release film 620 (such as Figure 5C ). Then Figure 5E , etching the metal layer 610 to form the circuit layer 122. Fig. 5F , forming a cavity 123 and a through hole 121h in the insulating material 700, wherein the surface treatment layer 125 is respectively located in the through hole 121h.

[0040] As can be seen from the above-mentioned embodiments, one advantage of the present invention is that the bending-resistant circuit board structure of the present invention can reduce bending stress when bending through the stepped memory metal routing, the top surface of the guide pillars distributed in a stepped manner, and the cavity with the stepped top surface, thereby improving the bending ability. When bending, the guide pillars are inserted into the through holes, and the bending part of the circuit board is supported to avoid unevenness, thereby achieving the purpose of improving support, reliability and improving the overall structural strength after bending. In addition, after the circuit board is bent, the guide pillars are inserted into the through holes to further electrically connect the circuit layer, thereby realizing the electrical functions of the parts connected to the circuit layer, thereby improving practicality.

[0041] Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the appended claims.

[0042]

Explanation of symbols

[0043] 100: Bending resistant circuit board structure

[0044] 110: Lower bending portion

[0045] 111: Lower insulation layer

[0046] 112: Neutral layer

[0047] 112s: Top

[0048] 113: Hierarchical memory metal routing

[0049] 113s: bottom

[0050] 114: Guide column

[0051] 114a: Center guide post

[0052] 114b: Side guide column

[0053] 114s: Top

[0054] 115: Protective layer

[0055] 116: Insulation coating

[0056] 120: Upper bending part

[0057] 121: Upper insulation layer

[0058] 121h:Through hole

[0059] 121w: Sidewall

[0060] 122: Circuit layer

[0061] 123: Cavity

[0062] 124:convex part

[0063] 125: Surface treatment layer

[0064] 200: Parts

[0065] 300:Substrate

[0066] 310: memory metal layer

[0067] 320: Release film

[0068] 400: Photosensitive insulating material layer

[0069] 500:Metal pattern layer

[0070] 600:Substrate

[0071] 610: Metal layer

[0072] 620: Release film

[0073] 700: Insulation material

[0074] A:Viscose

[0075] AG: Air Gap

[0076] BS: Stepped bottom

[0077] H1: Height

[0078] H2: Height

[0079] H3: Height

[0080] H3': Height

[0081] H4: Height

[0082] H4': Height

[0083] L: Bending reference axis

[0084] TS: stepped top surface.

Claims

1. A bending-resistant circuit board structure, characterized in that: The bending-resistant circuit board structure comprises: A lower bending portion, the lower bending portion comprising: Lower insulation layer; A neutral layer, disposed on top of the lower insulating layer; A plurality of hierarchical memory metal wirings are disposed in the lower insulating layer and connected to the neutral layer; and A plurality of guide pillars are spaced apart on the neutral layer, wherein top surfaces of the plurality of guide pillars are distributed in a stepped manner; and The upper bending portion is disposed on the lower bending portion and comprises: an upper insulating layer, disposed on the lower bending portion and comprising a plurality of through holes, wherein the guide pillars are respectively aligned with the through holes; a circuit layer, disposed on top of the upper insulating layer and covering the plurality of through holes; and A cavity portion, located between the upper insulating layer and the lower insulating layer, the cavity portion comprising a stepped top surface, wherein the through hole is located between the circuit layer and the stepped top surface; wherein the height of the upper bending portion is equal to the height of the lower bending portion; When the bending-resistant circuit board structure is bent, the plurality of guide pillars are respectively inserted into the plurality of through holes.

2. The bending-resistant circuit board structure according to claim 1, characterized in that: The lower bending portion includes a protection layer, which is arranged on the bottom surface of the lower insulating layer and covers a portion of the hierarchical memory metal wiring exposed on the bottom surface of the lower insulating layer.

3. The bending-resistant circuit board structure according to claim 2, characterized in that: The bottom surface of the lower insulating layer and the bottom surface of the protective layer form a stepped bottom surface.

4. The bending-resistant circuit board structure according to claim 1, characterized in that: An insulating coating is disposed on the outer side of each of the guide pillars.

5. The bending-resistant circuit board structure according to claim 1, characterized in that: The guide pillars are divided into: a central guide post located at the middle section of the neutral layer; and A plurality of side guide pillars surround the central guide pillar and are respectively connected to the stepped memory metal wirings; The height of each of the side guide pillars is greater than the height of the central guide pillar, and the height of the side guide pillars increases gradually from the central guide pillar toward the side wall of the upper insulating layer.

6. The bending-resistant circuit board structure according to claim 1, characterized in that: The circuit layer comprises: A plurality of protrusions are respectively located in the through holes, and an end surface of each of the protrusions faces a corresponding one of the guide pillars.

7. The bending-resistant circuit board structure according to claim 6, characterized in that: The guide post abuts against and is electrically connected to the protrusion.

8. A method for manufacturing a bending-resistant circuit board structure, characterized in that: The manufacturing method of the bending-resistant circuit board structure comprises: Providing a lower bending portion and an upper bending portion; and The upper bending portion is combined with the lower bending portion to form a cavity between the upper bending portion and the lower bending portion, and a plurality of guide posts of the lower bending portion are located in the cavity and aligned with a plurality of through holes of the upper bending portion.

9. The method for manufacturing a bending-resistant circuit board structure according to claim 8, characterized in that: The manufacturing method of the lower bending portion comprises: Providing a substrate and etching a memory metal layer of the substrate; forming a photosensitive insulating material layer on the etched memory metal layer; Depositing a metal pattern layer on the memory metal layer to form a plurality of hierarchical memory metal traces in the photosensitive insulating material layer; Laminating a protective layer on the photosensitive insulating material layer and covering the hierarchical memory metal wiring and removing a release film of the substrate; Partially removing the protective layer and the photosensitive insulating material layer to form a stepped bottom surface; forming a plurality of guide pillars on the etched memory metal layer, wherein the top surfaces of the guide pillars are distributed in a stepped manner; and A plurality of insulating coatings are formed on the outer side surfaces of the guide pillars.

10. The method for manufacturing a bending-resistant circuit board structure according to claim 8, characterized in that: The manufacturing method of the upper bending portion comprises: providing a substrate; forming a plurality of protrusions on the metal layer of the substrate; forming a surface treatment layer on each of the protrusions; Laminating an insulating material on the metal layer, the protrusion and the surface treatment layer, and removing a release film of the substrate; Etching the metal layer to form a circuit layer; as well as A cavity and a plurality of through holes are formed in the insulating material, wherein the surface treatment layers are respectively located in the through holes.

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