Circuit forming method and system based on laser processing substrate surface

Abstract

The invention provides a circuit forming method and system based on a laser processing substrate surface, and belongs to the technical field of circuit board production, and the method comprises the steps: cleaning the substrate surface to be subjected to circuit forming, and carrying out the drying treatment of the substrate; acquiring a circuit pattern, and scanning and processing the surface of the substrate by using a laser beam according to the circuit pattern; covering the deposition solution containing metal ions on the surface of the substrate scanned by the laser beam; laser is focused on the joint of the deposition solution and the surface of the substrate, and the metal ions in the deposition solution are deposited on the surface of the substrate by controlling the focus of the laser to move, so that a circuit pattern is formed. According to the method, the surface of the substrate is scanned through laser, and a large number of tiny holes and grooves are created in the surface of the substrate, so that the binding force of a conductive material and the substrate can be remarkably enhanced, the risk of stripping and falling of the conductive material is reduced, and the durability and reliability of a circuit board are improved; heat can be dispersed, stress concentration can be relieved, the influence of heat accumulation on the performance of the circuit board is reduced, and the mechanical stability of the coating is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a circuit forming method and system based on laser processing of a substrate surface. Background Art

[0002] In the field of modern electronic manufacturing, copper is widely used in the manufacture of key components such as circuit boards due to its excellent electrical and thermal conductivity. Ceramics, glass and certain polymer materials are widely used as high-performance circuit board substrate materials due to their excellent mechanical properties and electrical insulation properties. However, with the continuous advancement of technology and the increasing miniaturization of microelectronic devices, the interface problems between substrates and copper lines have gradually become prominent. Due to the differences in the physical and chemical properties of substrate materials and copper lines, the adhesion between them is often weak, and may even lead to interlayer separation or shedding during subsequent processing or use, which not only affects the overall performance of the circuit board, but also greatly reduces its service life. This problem is particularly evident in the manufacture of complex circuits and microelectronic components.

[0003] To solve this problem, traditional processing methods attempt to enhance the bonding between the substrate and the copper circuit by improving the process parameters of the substrate surface treatment or using chemical methods to treat the substrate surface. However, these methods often have limitations. Changing the process parameters may leave residual stress, posing a potential threat to the long-term stability of the circuit board. In addition, some chemical treatment methods may also cause interface contamination, further reducing the bonding quality between the substrate and the copper circuit.

[0004] Therefore, how to perform substrate surface treatment and improve the performance and reliability of copper circuits has become a key issue that needs to be solved urgently. Summary of the invention

[0005] In order to overcome the problems existing in the related art, one of the purposes of the present invention is to provide a circuit forming method based on laser processing of the substrate surface. This method creates a large number of tiny pores and grooves on the substrate surface by laser scanning the substrate surface. These structures can significantly enhance the bonding force between the conductive material and the substrate, reduce the risk of peeling and falling off of the conductive material, and improve the durability and reliability of the circuit board. Moreover, the structure obtained by laser scanning the substrate surface can disperse heat and relieve stress concentration, reduce the impact of heat accumulation on the performance of the circuit board, and improve the mechanical stability of the coating.

[0006] A circuit forming method based on laser processing of a substrate surface, comprising:

[0007] Clean the surface of the substrate to be formed into circuits and dry the substrate;

[0008] Obtaining a circuit pattern, and scanning and processing the substrate surface using a laser beam according to the circuit pattern;

[0009] Covering a deposition solution containing metal ions on the surface of the substrate scanned by the laser beam;

[0010] The laser is focused on the junction of the deposition solution and the substrate surface. By controlling the movement of the laser focus, the metal ions in the deposition solution are deposited on the substrate surface to form a circuit pattern.

[0011] In a preferred technical solution of the present invention, the cleaning of the surface of the substrate to be formed into circuits and drying of the substrate comprises:

[0012] The substrate was initially cleaned with deionized water and ethanol;

[0013] Performing ultrasonic secondary cleaning on the substrate that has been initially cleaned;

[0014] Blow dry the secondary cleaned substrate with nitrogen or air dry it in a clean environment to ensure that there is no water mark or impurities on the surface.

[0015] In a preferred technical solution of the present invention, the process of scanning the substrate surface with a laser beam according to the circuit pattern includes:

[0016] Fixing the substrate on the motion platform of the laser processing system;

[0017] Acquiring characteristics of the line pattern;

[0018] Adjust the parameters of the laser beam according to the characteristics of the circuit pattern;

[0019] The laser head is moved by adjusting the parameters of the laser beam to scan the substrate surface.

[0020] In a preferred technical solution of the present invention, the laser beam is a composite laser beam;

[0021] Among them, the composite laser beam includes two or more combinations of nanosecond laser, picosecond laser and femtosecond laser; the laser wavelength includes ultraviolet, green light and infrared; the laser power is 1W-100W; the repetition frequency is 1kHz-2000kHz; and in the process of composite, the energy of each laser single pulse is 2uJ-20uJ, and the number of scans is 1-5 times.

[0022] In a preferred technical solution of the present invention, the preparation process of the deposition solution containing metal ions is as follows:

[0023] Dissolve copper salt in deionized water to obtain a preliminary solution;

[0024] The preliminary solution was stirred using a magnetic stirrer to ensure that the solution was uniform and free of precipitation, thereby obtaining a deposition solution having copper ions.

[0025] In a preferred technical solution of the present invention,

[0026] The deposition solution containing copper ions comprises a copper ion complex solution, a copper ion salt solution, an alkaline solution, and a reducing agent.

[0027] In a preferred technical solution of the present invention, the step of applying a deposition solution containing metal ions to the surface of the substrate scanned by the laser beam comprises:

[0028] The substrate has an upper surface and a lower surface;

[0029] When the substrate is a non-transparent material, the deposition solution is coated on the upper surface of the substrate;

[0030] When the substrate is a transparent material, the deposition solution is coated on the upper surface or the lower surface of the substrate.

[0031] In a preferred technical solution of the present invention, the step of applying a deposition solution containing metal ions to the surface of the substrate scanned by the laser beam comprises:

[0032] Drop a drop of the deposition solution on the surface of the substrate or immerse the substrate in the deposition solution.

[0033] In a preferred technical solution of the present invention, the process of scanning the substrate surface with a laser beam according to the circuit pattern includes:

[0034] After laser scanning, a porous structure is formed on the substrate surface;

[0035] The diameter of the pores of the porous structure is 1 μm-20 μm, and the depth of the pores of the porous structure is 5 μm-25 μm.

[0036] The second object of the present invention is to provide a circuit forming system, the system is used to implement the circuit forming method based on laser processing of the substrate surface as described above;

[0037] The system comprises:

[0038] A main machine, wherein a workbench is arranged on the main machine, a bearing structure is arranged on the workbench, a mounting groove is arranged on the bearing structure, a pressing structure is arranged on one side of the mounting groove, the pressing structure comprises a cylinder and a pressing block, the cylinder is arranged on one side of the mounting groove, the pressing block is arranged on the piston rod of the cylinder, and the cylinder drives the pressing block to rise and fall above the mounting groove;

[0039] The host is also provided with a laser head, a driving system and a solution supply system. The laser head is arranged above the mounting groove. The driving system drives the laser head to move. The solution supply system includes a liquid storage tank, a pressure pump and a liquid outlet head. The liquid outlet head is arranged on one side of the laser head. The liquid outlet head is connected to the liquid storage tank through a liquid supply pipe. The pressure pump is arranged on the liquid supply pipe.

[0040] The beneficial effects of the present invention are:

[0041] The present invention provides a circuit forming method based on laser processing of substrate surface, which includes cleaning the substrate surface to be circuit-formed and drying the substrate; obtaining a circuit pattern, and scanning and processing the substrate surface with a laser beam according to the circuit pattern; applying a deposition solution containing metal ions to the substrate surface scanned by the laser beam; focusing the laser on the junction of the deposition solution and the substrate surface, and controlling the movement of the laser focus to deposit the metal ions in the deposition solution on the substrate surface to form a circuit pattern. The method processes the substrate surface by laser scanning, and creates a large number of tiny pores and grooves on the substrate surface. These structures can significantly enhance the bonding force between the conductive material and the substrate, reduce the risk of peeling and falling off of the conductive material, and improve the durability and reliability of the circuit board. The substrate surface structure formed by laser scanning not only enhances the bonding force, but also effectively disperses heat and relieves stress concentration. This design helps to reduce the adverse effects of heat accumulation on the performance of the circuit board and improve the mechanical stability of the coating. Therefore, the circuit board prepared using this method can maintain more stable performance under high load and high temperature environments.

[0042] The present application also provides a circuit forming system for implementing the above-mentioned circuit forming method based on laser processing of the substrate surface. During the production process, the system can form a high-precision circuit pattern on the substrate surface by accurately controlling the movement of the laser focus. This processing not only ensures the performance of the circuit board, but also makes the circuit board design more flexible and diversified, meeting the needs of complex electronic equipment for high-precision circuit boards, and the resulting circuit board is reliable and durable, and has high time-market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a flow chart of a circuit forming method based on laser processing of a substrate surface provided by the present invention;

[0044] Figure 2 It is a schematic diagram of a circuit forming system based on laser processing of a substrate surface provided by the present invention;

[0045] Figure 3 This is a schematic diagram of the porous structure on the substrate surface obtained by laser beam scanning in Example 3 of the present invention. Figure 1 ;

[0046] Figure 4 This is a schematic diagram of the porous structure on the substrate surface obtained by laser beam scanning in Example 3 of the present invention. Figure 2 ;

[0047] Figure 5This is a schematic diagram of the porous structure on the substrate surface obtained by laser beam scanning in Example 5 of the present invention. Figure 1 ;

[0048] Figure 6 This is a schematic diagram of the porous structure on the substrate surface obtained by laser beam scanning in Example 5 of the present invention. Figure 2 ;

[0049] Figure 7 This is a schematic diagram of the porous structure on the substrate surface obtained by laser beam scanning in Example 5 of the present invention. Figure 3 .

[0050] Reference numerals:

[0051] 1. Workbench; 2. Bearing structure; 21. Mounting groove; 3. Clamping structure; 31. Cylinder; 32. Pressing block; 4. Laser head; 5. Driving system; 6. Solution supply system; 61. Liquid outlet head; 62. Liquid supply pipe; 63. Pressure pump; 64. Liquid storage tank. DETAILED DESCRIPTION

[0052] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0053] In the field of modern electronic manufacturing, copper is widely used in the manufacture of key components such as circuit boards due to its excellent electrical and thermal conductivity. Ceramics, glass and certain polymer materials are widely used as high-performance circuit board substrate materials due to their excellent mechanical properties and electrical insulation properties. However, with the continuous advancement of technology and the increasing miniaturization of microelectronic devices, the interface problems between substrates and copper lines have gradually become prominent. Due to the differences in the physical and chemical properties of substrate materials and copper lines, the adhesion between them is often weak, and may even lead to interlayer separation or shedding during subsequent processing or use, which not only affects the overall performance of the circuit board, but also greatly reduces its service life. This problem is particularly evident in the manufacture of complex circuits and microelectronic components.

[0054] To solve this problem, traditional processing methods attempt to enhance the bonding between the substrate and the copper circuit by improving the process parameters of the substrate surface treatment or using chemical methods to treat the substrate surface. However, these methods often have limitations. Changing the process parameters may leave residual stress, posing a potential threat to the long-term stability of the circuit board. In addition, some chemical treatment methods may also cause interface contamination, further reducing the bonding quality between the substrate and the copper circuit.

[0055] Based on this, the present application provides a circuit forming method based on laser processing of the substrate surface.

[0056] Example 1

[0057] like Figure 1 As shown, this embodiment provides a circuit forming method based on laser processing of a substrate surface, comprising:

[0058] S100, cleaning the surface of the substrate to be formed into a circuit, and drying the substrate;

[0059] Specifically, the cleaning of the surface of the substrate to be formed into circuits and drying of the substrate includes:

[0060] First, the substrate is preliminarily cleaned with ionized water and ethanol to remove oil and impurities on the substrate surface;

[0061] Performing ultrasonic secondary cleaning on the substrate that has been initially cleaned;

[0062] Blow dry the secondary cleaned substrate with nitrogen or air dry it in a clean environment to ensure that there is no water mark or impurities on the surface.

[0063] Ultrasonic cleaning uses the impact force generated by the bursting of tiny bubbles produced by high-frequency vibration to remove stubborn stains and tiny particles on the substrate surface and in the micropores. This step can further improve the cleanliness of the substrate and ensure that there are no residual impurities on the substrate surface. After cleaning, the substrate is blown dry with nitrogen or air-dried in a clean environment. Using nitrogen to blow dry can quickly and effectively remove moisture from the substrate surface while avoiding the introduction of new impurities. If it is dried in a clean environment, it can also ensure that the substrate is naturally dried in a dust-free environment to avoid the adhesion of impurities such as dust.

[0064] S200, obtaining a circuit pattern, and scanning and processing the surface of the substrate using a laser beam according to the circuit pattern; after the laser scanning and processing, a porous structure is formed on the surface of the substrate;

[0065] The diameter of the pores of the porous structure is 1 μm-20 μm, and the depth of the pores of the porous structure is 5 μm-25 μm.

[0066] Specifically, the scanning process of the substrate surface by using a laser beam according to the circuit pattern includes:

[0067] Fixing the substrate on the motion platform of the laser processing system;

[0068] Obtain the characteristics of the circuit pattern; after obtaining the circuit pattern to be processed, analyze its characteristics in detail. Factors such as the line width, spacing, and complexity in the pattern will affect the subsequent laser processing parameters.

[0069] According to the characteristics of the circuit pattern, the parameters of the laser beam are adjusted; the laser beam is a composite laser beam, for example, the present application can use a combination of nanosecond laser and femtosecond laser, and the laser wavelength is ultraviolet and green light. According to the fineness of the circuit pattern and the material properties, the repetition frequency is adjusted to 1000kHz. At the same time, in order to ensure the processing effect and efficiency, the single pulse energy of each laser is set to 10uJ, and the number of scans is 3 times.

[0070] The laser head 4 is controlled to move by using the adjusted laser beam parameters to scan the substrate surface.

[0071] More specifically, the laser beam is a composite laser beam; wherein the composite laser beam includes a combination of two or more of nanosecond laser, picosecond laser and femtosecond laser; the laser wavelength includes ultraviolet, green light and infrared; the laser power is 1W-100W; the repetition frequency is 1kHz-2000kHz; and in the composite process, the energy of each laser single pulse is 2uJ-20uJ, and the number of scans is 1-5 times.

[0072] In practical applications, a micro-nano porous structure can be induced on the substrate surface by scanning and processing the substrate surface using a variety of different laser beams according to the characteristics of the circuit pattern to be formed. The pore size and pore density can be controlled by adjusting the parameters of the laser beam.

[0073] S300, applying a deposition solution containing metal ions to the surface of the substrate scanned by the laser beam;

[0074] S400, focusing the laser on the junction of the deposition solution and the substrate surface, and controlling the movement of the laser focus to deposit the metal ions in the deposition solution on the substrate surface to form a circuit pattern. By focusing the laser beam to irradiate the deposition solution containing metal ions, the metal ions are reduced and deposited in a specific area, thereby forming a high-precision metal pattern.

[0075] The porous structure formed by laser scanning processing can promote the uniform adsorption and diffusion of copper ions in the deposition solution, and cooperate with the induction of laser to make copper deposited evenly on the surface to form a circuit pattern. The resistance of the circuit pattern obtained in this way is stable, thereby improving the conductivity.

[0076] The above-mentioned circuit forming method based on laser processing of the substrate surface, this method processes the substrate surface by laser scanning, and creates a large number of tiny pores and grooves on the substrate surface. These structures can significantly enhance the bonding force between the conductive material and the substrate, reduce the risk of peeling and falling off of the conductive material, and improve the durability and reliability of the circuit board. The substrate surface structure formed by laser scanning not only enhances the bonding force, but also effectively disperses heat and relieves stress concentration. This design helps to reduce the adverse effects of heat accumulation on the performance of the circuit board and improves the mechanical stability of the coating. Therefore, the circuit board prepared using this method can maintain more stable performance under high load and high temperature environments.

[0077] Furthermore, the present application also provides a method for preparing a deposition solution. Specifically, the preparation process of the deposition solution containing metal ions is as follows:

[0078] Dissolve copper salt in deionized water to obtain a preliminary solution; deionized water ensures the water quality is pure to eliminate the influence of impurities on the subsequent deposition results. Then add an appropriate amount of copper salt, such as copper sulfate, copper chloride, etc. to the deionized water. Note that it should be added slowly and stirred while adding to prevent the copper salt from forming too high a concentration locally.

[0079] The preliminary solution is stirred with a magnetic stirrer to ensure that the solution is uniform and free of precipitation, and a deposition solution with copper ions is obtained. Magnetic stirring ensures that the copper salt is completely dissolved in deionized water and forms a uniform solution. The stirring speed and time need to be adjusted according to the actual situation to ensure the uniformity and stability of the solution.

[0080] Furthermore, the deposition solution containing copper ions includes a copper ion complexing solution, a copper ion salt solution, an alkaline solution, and a reducing agent. In practical applications, an appropriate amount of a copper ion complexing agent, an alkaline solution, and a reducing agent can be added to the solution to adjust parameters such as the pH value and ion concentration of the solution to meet specific deposition requirements.

[0081] Preferably, the deposition solution can be filtered to remove possible impurities and insolubles. The filtered deposition solution should be stored in a sealed container to avoid reaction with oxygen or other chemicals in the air.

[0082] In a more specific embodiment, the step of applying a deposition solution containing metal ions to the surface of the substrate scanned by the laser beam comprises:

[0083] The substrate has an upper surface and a lower surface;

[0084] When the substrate is a non-transparent material, the deposition solution is coated on the upper surface of the substrate;

[0085] When the substrate is a transparent material, the deposition solution is coated on the upper surface or the lower surface of the substrate.

[0086] The circuit forming method claimed in the present application is applicable to both substrates made of non-transparent materials and substrates made of transparent materials, and has a wide range of applications.

[0087] Specifically, when the substrate is an opaque material such as ceramic, the upper surface is selected. When the substrate is a transparent material such as glass, since the transparent material is light-transmitting, the laser can pass through the material, so the upper surface or lower surface can be selected for circuit forming according to needs.

[0088] In another embodiment, the step of applying a deposition solution containing metal ions to the surface of the substrate scanned by the laser beam comprises:

[0089] Drop a drop of the deposition solution on the surface of the substrate or immerse the substrate in the deposition solution.

[0090] The embodiment of immersing the substrate in the deposition solution is applicable to substrates of transparent materials, and the substrate covered with the mask is immersed in the metal liquid. In a more preferred embodiment, when the substrate is immersed in the metal liquid, the maximum distance between the liquid surface and the substrate surface is less than 2 mm, in order to ensure that the laser can effectively deposit the metal ions of the metal droplets on the substrate.

[0091] Example 2

[0092] like Figure 2 As shown, this embodiment provides a circuit forming system, and the system is used to implement the circuit forming method based on laser processing of the substrate surface as described above;

[0093] The system comprises:

[0094] A main machine, wherein a workbench 1 is arranged on the main machine, a bearing structure 2 is arranged on the workbench 1, a mounting groove 21 is arranged on the bearing structure 2, and a clamping structure 3 is arranged on one side of the mounting groove 21. The bearing structure 2 is used to fix the substrate to be processed, and the clamping structure 3 includes a cylinder 31 and a clamping block 32, wherein the cylinder 31 is arranged on one side of the mounting groove 21, and the clamping block 32 is arranged on the piston rod of the cylinder 31, and the cylinder 31 drives the clamping block 32 to rise and fall above the mounting groove 21; the clamping structure 3 is composed of the cylinder 31 and the clamping block 32, and when the cylinder 31 is started, the clamping block 32 can be driven to move up and down above the mounting groove 21, and when the clamping block 32 descends, the substrate can be stably fixed in the mounting groove 21; when the clamping block 32 descends, it is convenient for the staff to take out the substrate in the mounting groove 21.

[0095] The host is also provided with a laser head 4, a drive system 5 and a solution supply system 6. The laser head 4 is arranged above the mounting groove 21. The drive system 5 drives the laser head 4 to move, and the position of the laser head 4 can be fine-tuned by the drive system 5. The drive system 5 can control the movement of the laser head 4 with high precision to ensure that the laser beam can accurately scan according to the predetermined line pattern. In addition, the line forming system of the present application is also equipped with a solution supply system 6 including a liquid storage tank 64, a pressure pump 63 and a liquid outlet head 61. A special deposition solution is stored in the liquid storage tank 64, and the solution can be transported to the liquid outlet head 61 through a liquid supply pipe 62. The liquid outlet head 61 is cleverly arranged on one side of the laser head 4 so that the deposition solution can be quickly sprayed onto the surface of the substrate during laser processing. The pressure pump 63 is installed on the liquid supply pipe 62 to control the flow and pressure of the solution to ensure that the solution can be sprayed evenly and stably to the specified position.

[0096] The circuit forming system provided by the present application for implementing the above-mentioned circuit forming method based on laser processing of the substrate surface can accurately control the movement of the laser focus through the driving system 5 during the production process to form a high-precision circuit pattern on the substrate surface. This processing not only ensures the performance of the circuit board, but also makes the circuit board design more flexible and diversified, meeting the needs of complex electronic equipment for high-precision circuit boards, and the resulting circuit board is reliable and durable, and has high time and market competitiveness.

[0097] Example 3

[0098] like Figure 3-Figure 5 As shown, this embodiment takes a 1mm thick zirconia ceramic plate as a substrate and a deposition solution of 5-30g / L of copper chloride as an example to describe in detail the circuit forming method based on laser processing of the substrate surface of the present application. The details are as follows:

[0099] The circuit board substrate is made of 1mm thick zirconium oxide ceramic plate with a thermal conductivity of 2.2-3W·(mK) -1 , size is 40mm×40mm×1mm, and the deposition solution is copper chloride with a concentration of 5g-30g / L.

[0100] In this embodiment, the laser beam for scanning the surface of the substrate includes: an infrared femtosecond laser with a wavelength of 1064λ / nm, an average power ≥50W, a pulse width ≤700fs, a repetition frequency of 10-2000kHz, and a spot diameter of 30um; an infrared picosecond laser with a wavelength of 1064λ / nm, an average power ≥50W, a pulse width ≤10ps, a repetition frequency of 10-200kHz, and a spot diameter of 30um.

[0101] The laser for inducing metal ion deposition of the deposition solution is: green light picosecond wavelength 532λ / nm, average power ≥45W, pulse width ≤100ps, repetition frequency 1000-2000kHz.

[0102] The specific molding process is as follows:

[0103] 1. Prepare a copper chloride solution with a concentration of 5-30g / L;

[0104] 2. Place the zirconia ceramic plate in ethanol for ultrasonic cleaning for 15 minutes. After cleaning, dry it in a drying oven for 15 minutes to ensure that there are no pollutants on the surface.

[0105] 3. Fix the zirconia ceramic substrate on the motion platform of the laser processing system;

[0106] 4. According to the circuit pattern to be formed, first use an infrared femtosecond laser to scan the surface of the substrate, where the single pulse energy is 0-15uJ, the repetition frequency is 20-1500kHz, and the scanning number is 1 time. Then use an infrared picosecond laser to scan the surface of the substrate, where the single pulse energy is 0-20uJ, the repetition frequency is 10-150kHz, and the scanning number is 1 time. The porous structure can be observed by SEM, and holes with a diameter of about 1-20 microns are generated;

[0107] 5. Covering the deposition solution containing metal ions on the surface of the substrate;

[0108] 6. Focus the green picosecond laser on the contact interface between the surface to be processed and the droplet. By controlling the position of the laser focus, the redox reaction of the deposition solution droplet occurs at the interface where the laser is focused. The scanning speed is 0.1-1mm / s, and the single pulse energy is 0.05-15uJ. The required copper circuits can be deposited inside and on the surface of the porous structure on the surface of the sample to be processed.

[0109] The copper wire of this circuit forming method is more uniform, the adhesion of the copper plating is improved by 20%-100%, and the holes and cracks are reduced by 20%-45%.

[0110] Example 4

[0111] This embodiment takes a 1mm thick borosilicate glass plate as a substrate and a deposition solution of 2-25g / L copper sulfate as an example to describe in detail the circuit forming method based on laser processing of the substrate surface of the present application. The details are as follows:

[0112] The circuit board substrate uses a 1mm thick borosilicate glass plate with a thermal conductivity of 1-1.5W·(mK) -1, silicon content>80%, size 40mm×40mm×1mm, deposition solution system is 2-25g / L copper sulfate. The laser beams used to scan the substrate surface include: infrared femtosecond laser wavelength 1064λ / nm, average power ≥50W, pulse width ≤700fs, repetition frequency 10-2000kHz, spot diameter 30um; infrared picosecond laser wavelength 1064λ / nm, average power ≥50W, pulse width ≤10ps, repetition frequency 10-200kHz.

[0113] The laser for inducing the metal ion deposition of the deposition solution is: a 355nm ultraviolet nanosecond laser with a maximum power of 30W, a repetition frequency of 300kHz, a pulse width of 40ns, and a laser processing machine with a spot diameter of 50μm for deposition solution-induced copper plating circuits.

[0114] The specific molding process is as follows:

[0115] 1. Prepare a copper sulfate solution with a concentration of 2-25g / L;

[0116] 2. Place the borosilicate glass plate in ethanol and ultrasonically clean it for 15 minutes. After cleaning, dry it in a drying oven for 15 minutes to ensure that there are no pollutants on the surface.

[0117] 3. Fix the borosilicate glass substrate on the motion platform of the laser processing system;

[0118] 4. According to the preset pattern, first use an infrared femtosecond laser to scan the upper surface of the substrate, where the single pulse energy is 0-10uJ, the repetition frequency is 50-1000kHz, and the scanning number is 1 time. Then use an infrared picosecond laser to scan the upper surface of the substrate, where the single pulse energy is 0-15uJ, the repetition frequency is 10-200kHz, and the scanning number is 1 time, to generate holes with a diameter of about micrometers;

[0119] 5. Apply the chemical deposition solution to the metal ion solution on the surface of the substrate;

[0120] 6. Focus the 355nm ultraviolet nanosecond laser on the contact interface between the surface to be processed and the droplet. By controlling the position of the laser focus, the redox reaction of the deposited solution droplet occurs at the laser focused interface. The scanning speed is 0.1-4mm / s, and the single pulse energy is 0-30uJ. The required copper circuit can be deposited inside and on the surface of the porous structure on the surface of the sample to be processed. The copper wire is more uniform, the adhesion of the copper plating is increased by 15%-90%, and the holes and cracks are reduced by 15-45%.

[0121] Example 5

[0122] like Figure 6-Figure 7As shown, this embodiment takes a 1mm thick borosilicate glass plate as a substrate and a deposition solution of 2-25g / L of copper chloride as an example to describe in detail the circuit forming method based on laser processing of the substrate surface of the present application. In this embodiment, the laser beam used is different from the laser beam of Example 4. Specifically as follows:

[0123] The circuit board substrate uses a 1mm thick borosilicate glass plate with a thermal conductivity of 1-1.5W·(mK) -1 , silicon content>80%, size 40mm×40mm×1mm, deposition solution system is 2-25g / L copper sulfate, infrared femtosecond laser wavelength 1064λ / nm, average power ≥50W, pulse width ≤700fs, repetition frequency 10-2000kHz, spot diameter 30um and infrared picosecond laser wavelength 1064λ / nm, average power ≥50W, pulse width ≤10ps, repetition frequency 10-200kHz, spot diameter 30um laser machine tool for substrate surface treatment. 355nm ultraviolet nanosecond laser, maximum power 30W, repetition frequency 300kHz, pulse width 40ns, spot diameter 50μm laser processing machine tool for deposition solution induced copper plating circuit.

[0124] The specific molding process is as follows:

[0125] 1. Prepare a copper sulfate solution with a concentration of 2-25g / L;

[0126] 2. Place the borosilicate glass plate in ethanol and ultrasonically clean it for 15 minutes. After cleaning, dry it in a drying oven for 15 minutes to ensure that there are no pollutants on the surface.

[0127] 3. Fix the borosilicate glass substrate on the motion platform of the laser processing system;

[0128] 4. According to the preset pattern, first use an infrared femtosecond laser to scan the lower surface of the substrate, where the single pulse energy is 0-15uJ, the repetition frequency is 50-1000kHz, and the scanning number is 1 time. Then use an infrared picosecond laser to scan the lower surface of the substrate, where the power is 0-20uJ, the repetition frequency is 10-200kHz, and the scanning number is 1 time. The porous structure can be observed by SEM, and periodic holes with a diameter of about 1-5 microns are generated;

[0129] 5. Apply the chemical deposition solution to the metal ion solution on the surface of the substrate;

[0130] 6. Focus the 355nm ultraviolet nanosecond laser on the contact interface between the surface to be processed and the droplet. By controlling the position of the laser focus, the redox reaction of the deposited solution droplet occurs at the laser focused interface. The scanning speed is 1-5mm / s, and the single pulse energy is 0-25uJ. The required copper circuit can be deposited inside and on the surface of the porous structure on the surface of the sample to be processed. The copper wire is more uniform, the adhesion of the copper plating is increased by 30%-120%, and the holes and cracks are reduced by 20-50%.

[0131] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0132] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit forming method based on laser processing of substrate surface, characterized in that: include: Clean the surface of the substrate to be formed into circuits and dry the substrate; Obtaining a circuit pattern, and scanning and processing the substrate surface using a laser beam according to the circuit pattern; Covering a deposition solution containing metal ions on the surface of the substrate scanned by the laser beam; The laser is focused on the junction of the deposition solution and the substrate surface. By controlling the movement of the laser focus, the metal ions in the deposition solution are deposited on the substrate surface to form a circuit pattern.

2. The circuit forming method based on laser processing of substrate surface according to claim 1, characterized in that: The cleaning of the surface of the substrate to be formed into circuits and drying of the substrate comprises: The substrate was initially cleaned with deionized water and ethanol; Performing ultrasonic secondary cleaning on the substrate that has been initially cleaned; Blow dry the secondary cleaned substrate with nitrogen or air dry it in a clean environment to ensure that there is no water mark or impurities on the surface.

3. The circuit forming method based on laser processing of substrate surface according to claim 1, characterized in that: The method of scanning the substrate surface with a laser beam according to the circuit pattern comprises: Fixing the substrate on the motion platform of the laser processing system; Acquiring characteristics of the line pattern; Adjust the parameters of the laser beam according to the characteristics of the circuit pattern; The laser head is moved by adjusting the parameters of the laser beam to scan the substrate surface.

4. The circuit forming method based on laser processing of substrate surface according to claim 3, characterized in that: The laser beam is a composite laser beam; Among them, the composite laser beam includes two or more combinations of nanosecond laser, picosecond laser and femtosecond laser; the laser wavelength includes ultraviolet, green light and infrared; the laser power is 1W-100W; the repetition frequency is 1kHz-2000kHz; and in the process of composite, the energy of each laser single pulse is 2uJ-20uJ, and the number of scans is 1-5 times.

5. The circuit forming method based on laser processing of substrate surface according to any one of claims 1 to 4, characterized in that: The preparation process of the deposition solution containing metal ions is as follows: Dissolve copper salt in deionized water to obtain a preliminary solution; The preliminary solution was stirred using a magnetic stirrer to ensure that the solution was uniform and free of precipitation, thereby obtaining a deposition solution having copper ions.

6. The circuit forming method based on laser processing of substrate surface according to claim 5, characterized in that: The deposition solution containing copper ions comprises a copper ion complex solution, a copper ion salt solution, an alkaline solution, and a reducing agent.

7. The circuit forming method based on laser processing of substrate surface according to any one of claims 1 to 4, characterized in that: The method of coating the deposition solution containing metal ions on the surface of the substrate scanned by the laser beam comprises: The substrate has an upper surface and a lower surface; When the substrate is a non-transparent material, the deposition solution is coated on the upper surface of the substrate; When the substrate is a transparent material, the deposition solution is coated on the upper surface or the lower surface of the substrate.

8. The circuit forming method based on laser processing of substrate surface according to claim 1, characterized in that: The method of coating the deposition solution containing metal ions on the surface of the substrate scanned by the laser beam comprises: Drop a drop of the deposition solution on the surface of the substrate or immerse the substrate in the deposition solution.

9. The circuit forming method based on laser processing of substrate surface according to claim 1, characterized in that: The method of scanning the substrate surface with a laser beam according to the circuit pattern comprises: After laser scanning, a porous structure is formed on the substrate surface; The diameter of the pores of the porous structure is 1 μm-20 μm, and the depth of the pores of the porous structure is 5 μm-25 μm.

10. A line forming system, characterized in that: The system is used to implement the circuit forming method based on laser processing of the substrate surface as described in any one of claims 1 to 9; The system comprises: A main machine, wherein a workbench (1) is arranged on the main machine, a bearing structure (2) is arranged on the workbench (1), a mounting groove (21) is arranged on the bearing structure (2), a clamping structure (3) is arranged on one side of the mounting groove (21), the clamping structure (3) comprises a cylinder (31) and a clamping block (32), the cylinder (31) is arranged on one side of the mounting groove (21), the clamping block (32) is arranged on a piston rod of the cylinder (31), and the cylinder (31) drives the clamping block (32) to rise and fall above the mounting groove (21); The host is also provided with a laser head (4), a drive system (5) and a solution supply system (6); the laser head (4) is arranged above the mounting groove (21); the drive system (5) drives the laser head (4) to move; the solution supply system (6) comprises a liquid storage tank (64), a pressure pump (63) and a liquid outlet head (61); the liquid outlet head (61) is arranged on one side of the laser head (4); the liquid outlet head (61) is connected to the liquid storage tank (64) through a liquid supply pipe (62); and the pressure pump (63) is arranged on the liquid supply pipe (62).

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