Universal charging tray, chip mounting equipment, control method and device

Abstract

The invention provides a universal charging tray, chip mounting equipment and a control method and device. The invention discloses a universal charging tray which comprises a tray body and a fixing mechanism. The tray body is provided with a fixing groove capable of being matched with the Tray or the wafer at the same time, and the fixing mechanism is used for fixing the Tray or the wafer on the fixing groove; the appearance of the carrying disc body can be matched with the feeding box and the mounting and pressing ring piece assembly of the same chip mounting device at the same time so that the carrying disc body can be contained in the feeding box or the mounting and pressing ring piece assembly. The universal charging tray can be externally compatible with a feeding box and a mounting pressing ring piece assembly on a mounting station, and the universal charging tray solves the compatibility problem caused by different charging tray types corresponding to different to-be-mounted materials; and a hardware foundation is laid for realizing automatic grabbing, automatic resetting and automatic replacement of non-artificial and full-automatic surface-mounted materials.

Description

Technical Field

[0001] The invention relates to a universal material tray, chip placement equipment, a control method and a device, and belongs to the technical field of chip placement machine equipment. Background Art

[0002] When mounting various components, the placement machine usually fixes the same type of components in the same tray. In one placement procedure, the placement machine absorbs the same material from a tray and mounts it on multiple PCB boards in sequence. When mounting the next material, the tray is replaced and the same material is absorbed from the tray again and mounted on multiple PCB boards in sequence until all components are mounted.

[0003] Since only one material tray can be placed at the mounting position of the material tray at a time, the material tray is usually replaced manually when the material is changed, and the type of ejector needle head of the film expansion mechanism corresponding to the material tray is adjusted (if it is a tray, no film expansion is required). Therefore, full automated production has not been achieved when the material tray is replaced. These manual processes will inevitably lead to increased costs and insufficient optimization of production efficiency. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a universal material tray, patch equipment, control method and device that does not require human intervention and is fully automated. According to an embodiment of the present invention, a first solution is provided: a universal material tray, comprising a tray body and a fixing mechanism; The carrier body is provided with a fixing groove which can be adapted to the tray or the wafer at the same time, and the fixing mechanism is used to fix the tray or the wafer on the fixing groove; The outer shape of the carrier body can be adapted to the material supply box and the mounting pressure ring assembly of the same mounting equipment at the same time so that the carrier body can be accommodated on the material supply box or the mounting pressure ring assembly.

[0005] Furthermore, the shape of the carrier body is adapted to the multi-layer slot of the material supply box so that the carrier body can be inserted into or withdrawn from the material supply box; The outer shape of the carrier body is matched with the mounting groove of the lower pressure ring of the mounting pressure ring assembly so that the carrier body can be dropped into or taken out of the lower pressure ring.

[0006] Furthermore, the fixing mechanism includes at least two groups of rotary clamping components, and the rotary clamping components include a driving motor and a rotary pressing plate. The driving motor controls the rotary pressing plate to press the edge of the tray or wafer into the fixing groove of the carrier body.

[0007] Furthermore, the mounting pressure ring includes a lower pressure ring and at least two upper pressure rings, and the upper pressure ring is controlled to be lifted or lowered by a pressure ring control component. In the lifted state, the carrier body can be taken out of the lower pressure ring, and in the lowered state, the pressure ring control component fixes the carrier body in the mounting groove of the lower pressure ring.

[0008] Furthermore, an identifier is provided on the carrier body, and the identifier is used to identify the type and material information of the tray fixed in the fixed slot. The identifier has at least an upper identification surface and a side identification surface. The upper identification surface of the identifier can be identified by the optical identification system of the mounting equipment and the current tray type stored in the identifier can be obtained. The side identification surface of the identifier can be identified by the optical identification system of the mounting equipment and the material information of the current tray stored in the identifier can be obtained.

[0009] Furthermore, the identifier has a plug-in structure adapted to the tray body, and the identifier can be detachably plugged into the identification slot of the tray body through the plug-in structure.

[0010] Furthermore, at least two side identification components that can be identified by an optical identification system of the mounting equipment are arranged on the side identification surface of the identifier, and the type of the material tray and the type of the material plate are identified by identifying the side identification components.

[0011] Furthermore, at least three upper identification components that can be identified by the optical identification system of the mounting equipment are arranged on the upper identification surface of the identifier, and the type information, quantity information and initial orientation information of the material in the tray are identified by identifying the upper identification components.

[0012] According to an embodiment of the present invention, using the universal material tray in the first solution provided by the present invention, a second solution is provided: A patch device comprises any universal material tray as described above.

[0013] According to an embodiment of the present invention, using the universal feed tray in the first embodiment provided by the present invention, a third embodiment is provided: A method for controlling a universal material tray comprises the following steps: Get information about materials to be mounted; According to the information of the material to be mounted, a matching tray body is identified from the material supply box and the tray body is moved to the installation groove of the lower pressure ring of the mounting station, and the upper pressure ring is controlled to fix the tray body; Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on a target position of a target PCB board; Determine whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head according to the tray type. The ejector head called is adapted to the wafer tray of UV film or blue film corresponding to the tray type, and the ejector head is controlled to move and lift the wafer tray to the position to be sucked. Execute the placement program and complete material placement.

[0014] Furthermore, if the film expansion mechanism is not called, the placement program is directly executed and the material placement is completed.

[0015] Furthermore, the called ejector head is adapted to a wafer disk with a UV film or a blue film corresponding to the material disk type, and the step of controlling the ejector head to move and lift the wafer disk to be sucked includes: Obtain a target ejector pin head according to the film type and wafer size of the wafer tray corresponding to the tray type, and install the target ejector pin head and the non-target ejector pin head in different ejector pin grooves of the ejector mounting seat respectively; The ejector mounting seat is moved so that the target ejector head is located at the first target position, and the target ejector head is lifted to the second target position. The target ejector head located at the second target position is higher than the non-target ejector head. The ejector mounting seat is lifted so that the target ejector head moves and lifts the position to be sucked of the wafer disk.

[0016] According to an embodiment of the present invention, using the control method of the universal tray in the third embodiment provided by the present invention, a fourth embodiment is provided: A universal material tray control device, comprising: The mounting target module is used to obtain the information of the materials to be mounted; The tray picking module is used to identify the matching tray body from the material supply box according to the information of the material to be mounted and move the tray body to the installation groove of the lower pressure ring of the mounting station, and control the upper pressure ring to fix the tray body; A program calling module is used to identify the tray type and material information of the tray body and call a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on the target position of the target PCB board; The ejector calling module is used to confirm whether to call the film expansion mechanism according to the material tray type and material information of the material tray body obtained by identification. If the film expansion mechanism is called, the ejector head is called according to the material tray type. The ejector head called is adapted to the UV film or blue film wafer tray corresponding to the material tray type, and the ejector head is controlled to move and lift the wafer tray to the position to be sucked; The placement execution module is used to execute the placement program and complete material placement.

[0017] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps: Get information about materials to be mounted; According to the information of the material to be mounted, a matching tray body is identified from the material supply box and the tray body is moved to the installation groove of the lower pressure ring of the mounting station, and the upper pressure ring is controlled to fix the tray body; Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on a target position of a target PCB board; Determine whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head according to the tray type. The ejector head called is adapted to the wafer tray of UV film or blue film corresponding to the tray type, and the ejector head is controlled to move and lift the wafer tray to the position to be sucked. Execute the placement program and complete material placement.

[0018] A computer-readable storage medium stores a computer program, which, when executed by a processor, causes the processor to perform the following steps: Get information about materials to be mounted; According to the information of the material to be mounted, a matching tray body is identified from the material supply box and the tray body is moved to the installation groove of the lower pressure ring of the mounting station, and the upper pressure ring is controlled to fix the tray body; Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on a target position of a target PCB board; Determine whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head according to the tray type. The ejector head called is adapted to the wafer tray of UV film or blue film corresponding to the tray type, and the ejector head is controlled to move and lift the wafer tray to the position to be sucked. Execute the placement program and complete material placement.

[0019] Compared with the prior art, the technical solution provided by the present application has the following unique beneficial effects: the universal material tray provided by the present solution is externally compatible with the material feeding box and the mounting pressure ring assembly on the mounting station, that is, the universal material tray can be stored in the material feeding box, and can also be moved to the mounting pressure ring assembly on the mounting station to complete subsequent mounting. The universal material tray is internally compatible with various trays or wafer trays, and is particularly compatible with wafers of different sizes, because 6-inch, 8-inch, 12-inch or other sizes of wafers can be fixed on the wafer tray. The universal material tray solves the compatibility problem caused by different types of material trays corresponding to different materials to be mounted, and lays the hardware foundation for the automatic grasping, automatic resetting, and automatic replacement of mounting materials without human intervention and fully automated. The universal material tray has the advantage of being generally compatible with various types of existing common material trays. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] in: Figure 1 It is a schematic diagram of the cooperation between the first universal material tray, the material supply box and the mounting pressure ring assembly in one embodiment; Figure 2 It is a schematic diagram of the cooperation between the second universal material tray, the material supply box and the mounting pressure ring assembly in one embodiment; Figure 3 A schematic diagram of wafer trays of different sizes corresponding to a universal tray in an embodiment; Figure 4 is a schematic diagram of the structure of an identifier in one embodiment; Figure 5 A schematic diagram of the structure of an ejector head and an ejector platform in one embodiment; Figure 6 is a flow chart of a method for controlling a universal material tray in one embodiment; Figure 7 is a structural block diagram of a control device for a universal material tray in one embodiment; Figure 8 FIG. 4 is a structural block diagram of a computer device in one embodiment.

[0022] Reference numerals: 10-carrier body; 11-fixing groove; 12-identification groove; 21-wafer tray; 22-Tray tray; 30-feeding box; 41-upper pressure ring; 411-identification window; 42-lower pressure ring; 421-installation groove; 50-identifier; 51-upper identified surface; 52-upper identification component; 53-plug-in structure; 54-side identified surface; 55-side identification component; 60-ejector head; 61-ejector mounting seat; 62-ejector groove. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application.

[0024] Embodiment 1 This embodiment relates to a universal material tray of a chip mounter. The chip mounter is also called a mounting machine or a surface mount system (Surface Mount System). The chip mounter is the core equipment in the SMT (surface mount technology) production line and is one of the indispensable key equipment in the modern manufacturing field. The structure of the chip mounter includes: a frame, a PCB transmission mechanism, a servo positioning system, an optical recognition system, a chip head, a feeder, a sensor system, an electrical control system and a software control system. Among them, the feeder mainly includes a strip feeder and a disc feeder (tray feeder). This solution mainly involves a disc feeder. The disc feeder mainly includes a wafer tray 21 and a tray tray 22. The structure of the wafer tray 21 includes a supporting iron frame and a wafer chip fixed on the material film. The structure of the tray tray 22 includes a tray body and a material grid for accommodating various components arranged on the tray body. It is usually used for mounting QFP, BGA, etc.

[0025] When mounting various components, the placement machine usually fixes the same type of components in the same tray. In one placement procedure, the placement machine absorbs the same material from a tray and mounts it on multiple PCB boards in sequence. When mounting the next material, the tray is replaced and the same material is absorbed from the tray again and mounted on multiple PCB boards in sequence until all components are mounted.

[0026] Since only one material tray can be placed at the mounting position of the material tray at a time, the material tray is usually replaced manually when the material is replaced, and the type of ejector needle head of the film expansion mechanism corresponding to the material tray is adjusted (if it is Tray tray 22, no film expansion is required). Therefore, fully automated production has not been achieved when the material tray is replaced. These manually involved processes will inevitably lead to increased costs and insufficient optimization of production efficiency.

[0027] In order to solve the above technical problems, the present embodiment provides a universal material tray, including a tray body 10 and a fixing mechanism; The carrier body 10 is provided with a fixing groove 11 which can simultaneously adapt to the tray plate 22 or the wafer plate 21, and the fixing mechanism is used to fix the tray plate 22 or the wafer plate 21 on the fixing groove 11; like Figure 1 , Figure 2 As shown, the outer shape of the carrier body 10 can be adapted to the material supply box 30 and the mounting pressure ring assembly of the same mounting equipment at the same time so that the carrier body 10 can be accommodated on the material supply box 30 or the mounting pressure ring assembly.

[0028] The universal material tray provided in this solution is compatible with the feed box 30 and the mounting pressure ring assembly on the mounting station, that is, the universal material tray can be stored in the feed box 30, and can also be moved to the mounting pressure ring assembly on the mounting station to complete subsequent mounting. The universal material tray is compatible with various trays 22 or wafer trays 21, especially with wafers of different sizes, because the wafer tray 21 can fix 6-inch, 8-inch, 12-inch or other sizes of wafers, such as Figure 3 As shown, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, and lays the hardware foundation for the automatic grasping, automatic resetting, and automatic replacement of non-human-involved, fully automated mounting materials. This universal tray has the advantage of being universally compatible with all kinds of existing common material trays.

[0029] Embodiment 2 This embodiment specifically provides a preferred universal material tray, including a tray body 10 and a fixing mechanism; The carrier body 10 is provided with a fixing groove 11 which can simultaneously adapt to the Tray plate 22 or the wafer plate 21, and the fixing mechanism is used to fix the Tray plate 22 or the wafer plate 21 on the fixing groove 11; the outer shape of the carrier body 10 can simultaneously adapt to the feed box 30 and the mounting pressure ring assembly of the same mounting equipment so that the carrier body 10 can be accommodated on the feed box 30 or the mounting pressure ring assembly.

[0030] The carrier body 10 is larger in size than the traditional tray 22 or wafer tray 21, or maintains the original volume and reduces the size of the tray 22 or wafer tray 21. Since the size of the traditional tray 22 or wafer tray 21 includes the surrounding supporting space, it is sufficient to support the size reduction.

[0031] By providing the carrier body 10 , the tray 22 and the wafer tray 21 can be uniformly loaded through a common device, and can be adapted to new or existing feed boxes 30 and patch equipment at the same time.

[0032] Specifically, the shape of the carrier body 10 is adapted to the multi-layer slots of the feed box 30 so that the carrier body 10 can be inserted into or pulled out of the feed box 30; the shape of the carrier body 10 is adapted to the mounting groove 421 of the lower pressure ring 42 of the mounting pressure ring assembly so that the carrier body 10 can fall into or be taken out of the lower pressure ring 42.

[0033] Specifically, the fixing mechanism includes at least two sets of rotating clamping components, and the rotating clamping components include a driving motor and a rotating pressing plate, and the driving motor controls the rotating pressing plate to press the edge of the tray 22 or the wafer 21 into the fixing groove 11 of the carrier body 10. The existing fixing mechanism usually adopts a clamping pressing plate, and the edge of the wafer 21 is clamped and fixed by a plurality of pressing plate spring structures.

[0034] The core technical problem solved by the universal material tray provided in this solution is to realize the technical difficulty of automatically replacing the disc feeder of the placement machine by transforming the traditional material tray and the material tray identification, movement and fixing methods. Therefore, the new structure of the universal material tray is based on the solution idea of ​​solving the non-manual whole process. Therefore, the fixing mechanism of the carrier body 10 adopts at least 2 groups of rotating clamping components, and the fixing or release of the carrier body 10 is realized by the control of the driving motor.

[0035] Furthermore, since the rotary clamping assembly can control the rotation angle of the rotary pressing plate by driving the motor, the rotary clamping assembly can adjust the clamping degree of the universal material tray, that is, along the rotation direction, the larger the rotation angle, the higher the clamping degree. This rotary clamping method can also be adapted to wafer trays 21 or Tray trays 22 of different thicknesses, that is, the thicker the tray body, the more universal and automatic fixing or releasing of tray bodies of different thicknesses can be achieved by adjusting the rotation angle.

[0036] Specifically, the mounting pressure ring includes a lower pressure ring 42 and at least two upper pressure rings 41. The upper pressure ring 41 is controlled to be lifted or lowered by a pressure ring control component. In the lifted state, the carrier body 10 can be taken out of the lower pressure ring 42. In the lowered state, the pressure ring control component fixes the carrier body 10 in the mounting groove 421 of the lower pressure ring 42.

[0037] Through the above scheme, universal fixing and releasing of various material trays of different thicknesses and types can be achieved, while being compatible with the material feeding box 30 and the mounting pressure ring assembly.

[0038] Embodiment 3 like Figure 3 As shown, in order to adapt to the optical recognition system of the existing placement machine, an identifier 50 is set on the carrier body 10. Since the existing optical recognition system mainly recognizes from top to bottom, the top of the tray body stacked in the supply tray will be blocked and cannot be directly recognized.

[0039] The present embodiment provides an identifier 50 of a tray body 10, and the identifier 50 is used to identify the type and material information of a tray fixed in a fixing slot 11. The identifier 50 has at least an upper identification surface 51 and a side identification surface 54. The upper identification surface 51 of the identifier 50 can be identified by an optical identification system of a mounting device and the current tray type stored in the identifier 50 can be obtained. The side identification surface 54 of the identifier 50 can be identified by an optical identification system of a mounting device and the material information of the current tray stored in the identifier 50 can be obtained. Since there are relatively few types of existing material trays, with no more than 10 commonly used types, a side identification surface 54 can be set on the side of the material tray identifier 50, and a horizontal identification subsystem can be added to the existing optical identification system. The horizontal identification subsystem is only used for identification tasks with identification types not exceeding 10. Therefore, the setting cost of the identification subsystem is very low, and the accuracy can be 100%. The type of material tray is identified by the horizontal identification subsystem, so that the mobile control parameter program and the ejector head 60 adapted to the material tray type can be called in advance to improve the overall rhythm and efficiency of material placement.

[0040] Specifically, an identifier 50 is provided on the carrier body 10, and the identifier 50 is used to identify the type and material information of the material tray fixed in the fixing slot 11. The identifier 50 has at least an upper identification surface 51 and a side identification surface 54. The upper identification surface 51 of the identifier 50 can be identified by the optical identification system of the mounting equipment and the current material tray type stored in the identifier 50 can be obtained. The side identification surface 54 of the identifier 50 can be identified by the optical identification system of the mounting equipment and the material information of the current material tray stored in the identifier 50 can be obtained.

[0041] Specifically, the identifier 50 has a plug-in structure 53 adapted to the tray body 10, and the identifier 50 can be detachably plugged into the identification slot 12 of the tray body through the plug-in structure 53. The side identification surface 54 of the identifier 50 is provided with at least two side identification components 55 that can be identified by the optical identification system of the mounting equipment, and the tray type and the plate type of the tray are identified by identifying the side identification components 55. The upper identification surface of the identifier 50 is provided with at least three upper identification components 52 that can be identified by the optical identification system of the mounting equipment, and the type information, quantity information and initial position information of the material in the tray are identified by identifying the upper identification components 52.

[0042] When changing materials, the identifier 50 can be used to first identify the type of material tray, and call the movement control parameter program adapted to the material tray type in advance to move and fix the carrier body 10, and prepare in advance the ejector head 60 adapted to the material tray on the carrier body 10, which can reduce the calling time of the ejector head 60 and improve the overall rhythm and efficiency of material placement.

[0043] Embodiment 4 This embodiment provides another identifier 50 of the tray body 10. In order to adapt to the optical recognition system of the existing placement machine, the identifier 50 is arranged on the tray body 10. Since the existing optical recognition system mainly recognizes from top to bottom, and the upper part of the tray body stacked in the feeding tray will be blocked and cannot be directly recognized, a retractable identifier 50 can be arranged on the tray body 10. The identifier 50 includes a retractable structure that can be detachably installed in the recognition slot 12 of the tray body. The upper recognition surface of the identifier 50 is provided with a recognizable optical recognition system that can be recognized by the placement equipment. The identifier 50 protrudes from the tray body when on the tray through the retractable structure to facilitate identification by the optical recognition system. However, the identifier 50 protruding from the tray body will cause interference when accommodated in the mounting pressure ring assembly and cannot be fixedly installed. Therefore, in order to solve this technical problem, the tray moving device provided in this embodiment is provided with a material picking mechanism adapted to the identifier 50 of the tray body. When taking the tray body 10 out of the feed box 30, the material picking mechanism applies force from the side of the identifier 50 to press the identifier 50 back to the tray body 10 and fix it in the mounting groove 421 of the lower pressure ring 42 of the mounting pressure ring assembly.

[0044] An identification window 411 matching with the identifier 50 is arranged on the upper pressure ring to avoid interference of the upper pressure ring on the identifier 50 or to provide an observation optical path for the identifier 50 in some special cases.

[0045] The present embodiment also provides an identifier 50 for a tray body 10, the identifier 50 also comprising a third active identification surface, an image recognition camera and a wireless transceiver being arranged on the third active identification surface, the material information on the tray body 10 being identified by the image recognition camera, and the tray type and material information being inferred from the material information and stored in a storage module of the identifier 50, the tray type in the storage module being expressed by a side identification component 55 on a side identification surface 54, and the material information in the storage module being expressed by an upper identification component 52 on an upper identification surface 51.

[0046] Embodiment 5 This embodiment provides a chip mounter, which includes any of the above-mentioned universal trays. The technical problem solved by the tray is that since only one tray can be placed at a mounting position of the tray at a time, the tray is usually replaced manually when the material is replaced, and the type of ejector pin of the film expansion mechanism corresponding to the tray is adjusted (if it is Tray 22, film expansion is not required). Therefore, fully automated production has not been achieved when the tray is replaced, and these manual processes will inevitably lead to increased costs and insufficient optimization of production efficiency.

[0047] The placement machine provided with the universal material tray can be compatible with the feed box 30 and the mounting pressure ring assembly on the mounting station, that is, the universal material tray can be stored in the feed box 30, and can also be moved to the mounting pressure ring assembly on the mounting station to complete subsequent mounting. The universal material tray can be compatible with various trays 22 or wafer trays 21 internally, and can be compatible with wafers of different sizes, because the wafer tray 21 can be fixed with 6-inch, 8-inch, 12-inch or other sizes of wafers, such as Figure 3 As shown, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, and lays the hardware foundation for the automatic grasping, automatic resetting, and automatic replacement of non-human-involved, fully automated mounting materials. This universal tray has the advantage of being universally compatible with all kinds of existing common material trays.

[0048] Embodiment 6 The technical problem solved by this embodiment is that the existing placement machine can only place one material tray at a time on the mounting position of the material tray. Therefore, when changing materials, the material tray is usually replaced manually, and the type of ejector pin head of the film expansion mechanism corresponding to the material tray is adjusted (if it is Tray tray 22, no film expansion is required). Therefore, full automated production has not been achieved when the material tray is replaced. These processes involving manual participation will inevitably lead to increased costs and insufficient optimization of production efficiency.

[0049] In order to solve this technical problem, this embodiment provides a universal material tray control method, such as Figure 6 As shown, the following steps are included: S101: Obtain information of materials to be mounted; S102: Identify a matching tray body from the material supply box 30 according to the information of the material to be mounted and move the tray body to the mounting groove 421 of the lower pressure ring 42 of the mounting station, and control the upper pressure ring 41 to fix the tray body; S103: Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control a placement head to absorb the material on the tray body and place it on a target position of a target PCB board; S104: confirm whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head 60 according to the tray type. The called ejector head 60 is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type, and control the ejector head 60 to move and lift the position of the wafer tray 21 to be sucked; S105: Execute the placement program and complete material placement.

[0050] S106: If the film expansion mechanism is not called, the placement program is directly executed and the material placement is completed.

[0051] The placement machine provided with the universal material tray can be compatible with the feed box 30 and the mounting pressure ring assembly on the mounting station, that is, the universal material tray can be stored in the feed box 30, and can also be moved to the mounting pressure ring assembly on the mounting station to complete subsequent mounting. The universal material tray can be compatible with various trays 22 or wafer trays 21 internally, and can be compatible with wafers of different sizes, because the wafer tray 21 can be fixed with 6-inch, 8-inch, 12-inch or other sizes of wafers, such as Figure 3 As shown, this universal tray solves the compatibility problem caused by different tray types corresponding to different materials to be mounted, and lays the hardware foundation for the automatic grasping, automatic resetting, and automatic replacement of non-human-involved, fully automated mounting materials. This universal tray has the advantage of being universally compatible with all kinds of existing common material trays.

[0052] Embodiment 7 This embodiment provides a preferred universal tray control method, further comprising: The called ejector head 60 is adapted to the wafer tray 21 with UV film or blue film corresponding to the tray type, and the step of controlling the ejector head 60 to move and lift the wafer tray 21 to the position to be sucked includes: The target ejector pin head is obtained according to the film type and wafer size of the wafer tray 21 corresponding to the material tray type, and the target ejector pin head and the non-target ejector pin head are respectively installed in different ejector slots 62 of the ejector pin mounting seat 61; the ejector pin mounting seat 61 is moved so that the target ejector pin head is located at the first target position, and the target ejector pin head is lifted to the second target position. The target ejector pin head located at the second target position is higher than the non-target ejector pin head. The ejector pin mounting seat 61 is lifted so that the target ejector pin head moves and lifts the wafer tray 21 to the position to be sucked.

[0053] like Figure 5 As shown, three ejector slots 62 are provided on the ejector mounting seat 61 for installing three commonly used ejector heads 60. An ejector lifting mechanism is provided at the bottom of each ejector head 60 for controlling the height position of each ejector in the ejector slot 62. The ejector mounting seat 61 is integrally connected to the ejector lateral control mechanism and controls the target ejector head of the ejector mounting seat 61 to be located at a concentric position at the bottom of the wafer disk 21. The ejector lifting mechanism lifts the target ejector head and prevents other ejector heads from affecting the membrane structure.

[0054] Embodiment 8 This embodiment provides a universal material tray control device, such as Figure 7 As shown, including: The mounting target module 100 is used to obtain information of materials to be mounted; The tray picking module 200 is used to identify the matching tray body from the feeding box 30 according to the information of the material to be mounted and move the tray body to the mounting groove 421 of the lower pressure ring plate 42 of the mounting station, and control the upper pressure ring plate 41 to fix the tray body; The program calling module 300 is used to identify the tray type and material information of the tray body and call the placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on the target position of the target PCB board; The ejector calling module 400 is used to confirm whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, the ejector head 60 is called according to the tray type. The ejector head 60 called is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type, and the ejector head 60 is controlled to move and lift the position of the wafer tray 21 to be sucked; The mounting execution module 500 is used to execute the mounting program and complete the material mounting.

[0055] The control device of the universal material tray provided in this solution is externally compatible with the feed box 30 and the mounting pressure ring assembly on the mounting station, that is, the universal material tray can be stored in the feed box 30, and can also be moved to the mounting pressure ring assembly on the mounting station to complete subsequent mounting. The universal material tray is internally compatible with various trays 22 or wafer trays 21, and is particularly compatible with wafers of different sizes, because the wafer tray 21 can fix 6-inch, 8-inch, 12-inch or other sizes of wafers. This universal material tray solves the compatibility problem caused by different types of material trays corresponding to different materials to be mounted, and lays the hardware foundation for the automatic grasping, automatic resetting, and automatic replacement of mounting materials without human intervention and full automation. This universal material tray has the advantage of being generally compatible with various types of existing common material trays.

[0056] Embodiment 9 Figure 8 FIG. 1 shows an internal structure diagram of a computer device in an embodiment. The computer device may be a terminal or a server. Figure 8 As shown, the computer device includes a processor, a memory and a network interface connected via a system bus. The memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program. When the computer program is executed by the processor, the processor can implement a universal tray control method. The memory may also store a computer program. When the computer program is executed by the processor, the processor can implement an age recognition method. Those skilled in the art will understand that Figure 8 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0057] In one embodiment, a computer device is provided, comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps: Get information about materials to be mounted; According to the information of the material to be mounted, a matching tray body is identified from the material supply box 30 and the tray body is moved into the mounting groove 421 of the lower pressure ring 42 of the mounting station, and the upper pressure ring 41 is controlled to fix the tray body; Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on a target position of a target PCB board; Determine whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head 60 according to the tray type. The called ejector head 60 is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type, and control the ejector head 60 to move and lift the position of the wafer tray 21 to be sucked; Execute the placement program and complete material placement.

[0058] In one embodiment, a computer-readable storage medium is provided, storing a computer program, wherein when the computer program is executed by a processor, the processor performs the following steps: Get information about materials to be mounted; According to the information of the material to be mounted, a matching tray body is identified from the material supply box 30 and the tray body is moved into the mounting groove 421 of the lower pressure ring 42 of the mounting station, and the upper pressure ring 41 is controlled to fix the tray body; Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on a target position of a target PCB board; Determine whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head 60 according to the tray type. The called ejector head 60 is adapted to the wafer tray 21 of the UV film or blue film corresponding to the tray type, and control the ejector head 60 to move and lift the position of the wafer tray 21 to be sucked; Execute the placement program and complete material placement.

[0059] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0060] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. The above embodiments only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of this application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of this application, several variations and improvements can be made, which all belong to the scope of protection of this application.

[0061] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly disposed on the other component; when a component is referred to as being "connected to" another component, it may be directly connected to the other component or indirectly connected to the other component. It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0062] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0063] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

Claims

1. A universal tray, characterized in that: It includes a carrier body and a fixing mechanism; The carrier body is provided with a fixing groove which can be adapted to the tray or the wafer at the same time, and the fixing mechanism is used to fix the tray or the wafer on the fixing groove; The outer shape of the carrier body can be adapted to the material supply box and the mounting pressure ring assembly of the same mounting equipment at the same time so that the carrier body can be accommodated on the material supply box or the mounting pressure ring assembly.

2. The universal material tray according to claim 1, characterized in that: The shape of the carrier body is adapted to the multi-layer slot of the feed box so that the carrier body can be inserted into or withdrawn from the feed box; The outer shape of the carrier body is matched with the mounting groove of the lower pressure ring of the mounting pressure ring assembly so that the carrier body can be dropped into or taken out of the lower pressure ring.

3. The universal tray according to claim 1, characterized in that: The fixing mechanism includes at least two groups of rotating pressing components, and the rotating pressing components include a driving motor and a rotating pressing plate. The driving motor controls the rotating pressing plate to press the edge of the tray or the wafer into the fixing groove of the carrier body.

4. The universal material tray according to claim 1, characterized in that: The mounting pressure ring comprises a lower pressure ring and at least two upper pressure rings, and the upper pressure ring is controlled to be lifted or lowered by a pressure ring control component. In the lifted state, the carrier body can be taken out of the lower pressure ring, and in the lowered state, the pressure ring control component fixes the carrier body in the mounting groove of the lower pressure ring.

5. The universal material tray according to claim 1, characterized in that: An identifier is provided on the carrier body, and the identifier is used to identify the type and material information of the tray fixed in the fixed groove. The identifier has at least an upper identification surface and a side identification surface. The upper identification surface of the identifier can be identified by the optical identification system of the mounting equipment and the current tray type stored in the identifier can be obtained. The side identification surface of the identifier can be identified by the optical identification system of the mounting equipment and the material information of the current tray stored in the identifier can be obtained.

6. A patch device, characterized in that: It comprises a universal material tray as described in any one of claims 1 to 5.

7. A method for controlling a universal material tray, characterized in that: The steps include: Get information about materials to be mounted; According to the information of the material to be mounted, a matching tray body is identified from the material supply box and the tray body is moved to the installation groove of the lower pressure ring of the mounting station, and the upper pressure ring is controlled to fix the tray body; Identify the tray type and material information of the tray body and call up a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on a target position of a target PCB board; Determine whether to call the film expansion mechanism according to the tray type and material information of the tray body obtained by identification. If the film expansion mechanism is called, call the ejector head according to the tray type. The ejector head called is adapted to the wafer tray of UV film or blue film corresponding to the tray type, and the ejector head is controlled to move and lift the wafer tray to the position to be sucked. Execute the placement program and complete material placement.

8. The control method of the universal material tray according to claim 7, characterized in that: If the film expansion mechanism is not called, the placement program is directly executed and the material placement is completed.

9. The control method of the universal material tray according to claim 7, characterized in that: The called ejector head is adapted to the wafer tray of UV film or blue film corresponding to the tray type, and the step of controlling the ejector head to move and lift the wafer tray to the position to be sucked includes: Obtain a target ejector pin head according to the film type and wafer size of the wafer tray corresponding to the tray type, and install the target ejector pin head and the non-target ejector pin head in different ejector pin grooves of the ejector mounting seat respectively; The ejector mounting seat is moved so that the target ejector head is located at the first target position, and the target ejector head is lifted to the second target position. The target ejector head located at the second target position is higher than the non-target ejector head. The ejector mounting seat is lifted so that the target ejector head moves and lifts the position to be sucked of the wafer disk.

10. A universal tray control device, characterized in that: include: The mounting target module is used to obtain the information of the materials to be mounted; The tray picking module is used to identify the matching tray body from the material supply box according to the information of the material to be mounted and move the tray body to the installation groove of the lower pressure ring of the mounting station, and control the upper pressure ring to fix the tray body; A program calling module is used to identify the tray type and material information of the tray body and call a placement program, wherein the placement program is used to control the placement head to absorb the material on the tray body and place it on the target position of the target PCB board; The ejector calling module is used to confirm whether to call the film expansion mechanism according to the material tray type and material information of the material tray body obtained by identification. If the film expansion mechanism is called, the ejector head is called according to the material tray type. The ejector head called is adapted to the UV film or blue film wafer tray corresponding to the material tray type, and the ejector head is controlled to move and lift the wafer tray to the position to be sucked; The placement execution module is used to execute the placement program and complete material placement.

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